JP2021152572A - Drawing device, data processing device, drawing method and drawing data generation method - Google Patents

Abstract

To provide a technique capable of reducing a computation resource or a computation time necessary to correct drawing data corresponding to the deformation of a substrate.SOLUTION: A data processing device: generates first division data showing each drawing content of a plurality of first mesh regions obtained by dividing an initial drawing region expressed by initial drawing data by an initial mesh width to synthesize the drawing content of each first mesh region according to a position of each first mesh region rearranged on the basis of a position of the alignment mark of a first substrate and generate first drawing data; and generates second division data showing each drawing content of a plurality of second mesh regions obtained by dividing a first drawing region expressed by the first drawing data by a mesh width larger than the initial mesh width to synthesize the drawing content of each second mesh region according to a position of each second mesh region rearranged on the basis of a position of the alignment mark of a second substrate and generate second drawing data showing a second drawing region including a predetermined pattern.SELECTED DRAWING: Figure 1

Description

The present invention relates to a technique for forming an image on a substrate based on drawing data, and more particularly to a technique for correcting drawing data according to the shape of the substrate.

A direct drawing device for drawing a circuit pattern by scanning a target surface of a substrate such as a printed circuit board, a semiconductor substrate, or a liquid crystal substrate with a laser beam or the like is known. The drawing of the circuit pattern by the direct drawing device is performed according to the drawing data converted from the design data of the circuit pattern. The drawing data is data having a description format that can be processed by the direct drawing device.

The substrate itself has warpage and distortion, and may be slightly deformed due to the processing in the previous process. On the other hand, the design data is usually created without considering the deformation of the substrate. Therefore, when the circuit pattern is drawn using the converted drawing data as it is, the yield may decrease. Therefore, in drawing by the direct drawing device, the shape of the substrate may be measured in advance, and the drawing data may be corrected based on the obtained measurement result.

For example, in Patent Document 1, the drawing area of the substrate is virtually divided into a plurality of mesh areas, and divided drawing data representing the drawing contents of each mesh area after the division is generated. At the time of drawing, the position of the mesh region is rearranged based on the position of the alignment mark provided on the substrate to be drawn. Then, the corrected drawing data is generated by synthesizing the drawing contents corresponding to each mesh area after the rearrangement.

JP-A-2010-204421

However, in the case of the prior art, drawing data is generated by rearranging the mesh region based on the position of the alignment mark for each substrate. Since the size of the mesh region is constant regardless of the degree of deformation of the substrate, the same degree of calculation processing is required each time to generate drawing data. Therefore, a lot of calculation resources or calculation time are required for the correction processing of the drawing data according to the deformation of the substrate.

An object of the present invention is to provide a technique for reducing computational resources or computational time required for correction processing of drawing data according to deformation of a substrate.

In order to solve the above problems, the first aspect is a drawing device that draws a predetermined pattern on a substrate. The drawing device includes a stage for mounting a substrate having a plurality of alignment marks, an imaging unit for imaging the alignment marks of the substrate mounted on the stage, and a data processing unit for generating drawing data. An irradiation unit that irradiates the substrate mounted on the stage with light based on the drawing data is provided. The data processing unit is a plurality of data acquisition processes obtained by acquiring initial drawing data representing an initial drawing area including a predetermined pattern, and dividing the initial drawing area by an initial mesh width based on the initial drawing data. The alignment of the first substrate is based on the first division process for generating the first division data representing each drawing content of the first mesh region of the above and the captured image obtained by the imaging unit imaging the first substrate. The first mark position specifying process for specifying the mark position, the first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and the first rearrangement process. A first drawing area including a predetermined pattern is expressed by synthesizing the drawing contents of each of the first mesh areas represented by the first divided data according to the position of each of the first mesh areas rearranged by the process. 1 Execute the first synthesis process for generating drawing data. Further, the data processing unit represents each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area with a mesh width larger than the initial mesh width based on the first drawing data. Second mark position identification that specifies the position of the alignment mark on the second substrate based on the second division process that generates the second division data and the captured image obtained by the imaging unit imaging the second substrate. Each of the second meshes rearranged by the process, the second rearrangement process of rearranging each of the second mesh regions based on the position of the alignment mark on the second substrate, and the second rearrangement process. The second composition process of synthesizing the drawing contents of each of the second mesh areas according to the position of the area and generating the second drawing data representing the second drawing area including the predetermined pattern is executed.

The second aspect is the drawing device of the first aspect, and in the second division processing, the data processing unit divides the first drawing area into a plurality of pre-mesh widths different from each other. Each front mesh width includes a process of generating pre-divided data representing each drawing content of the second mesh region, and in the second rearrangement process, the data processing unit causes the alignment of the second substrate. The process includes selecting one pre-divided data from the plurality of pre-divided data based on the position of the mark, and rearranging each of the second mesh regions represented by the selected pre-divided data.

The third aspect is the drawing apparatus of the first aspect or the second aspect, and in the second rearrangement processing, the data processing unit has each of the alignments that the second substrate has with respect to the first substrate. The process of determining the mesh width based on the deformation between the marks is included.

The fourth aspect is the drawing apparatus of the third aspect, and in the second rearrangement process, the data processing unit determines the mesh width based on the deformation between the two adjacent alignment marks. including.

The fifth aspect is the drawing apparatus of the third aspect or the fourth aspect, and in the second rearrangement processing, the data processing unit is based on the deformation between the two alignment marks located at the corners. Includes processing to determine the mesh width.

A sixth aspect is a data processing device that generates drawing data used in a drawing device that draws a predetermined pattern on a substrate. The data processing device includes a processor and a memory that is electrically connected to the processor. The processor has a data acquisition process for acquiring initial drawing data representing an initial drawing area including a predetermined pattern, and a plurality of thirths obtained by dividing the initial drawing area by an initial mesh width based on the initial drawing data. The position of the alignment mark on the first substrate is specified based on the first division process for generating the first division data representing each drawing content of one mesh region and the captured image obtained by imaging the first substrate. It was rearranged by the first mark position specifying process, the first rearrangement process of rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and the first rearrangement process. The drawing contents of each of the first mesh areas represented by the first divided data are combined according to the position of each of the first mesh areas, and the first drawing data representing the first drawing area including a predetermined pattern is generated. Execute the first synthesis process. Further, the processor represents each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area with a mesh width larger than the initial mesh width based on the first drawing data. The second division process for generating the two division data, the second mark position identification process for specifying the position of the alignment mark on the second substrate based on the captured image obtained by imaging the second substrate, and the second mark position identification process. Based on the position of the alignment mark on the two substrates, the second rearrangement process for rearranging each of the second mesh regions and the position of each of the second mesh regions rearranged by the second rearrangement process are aligned with each other. Then, the drawing contents of each of the second mesh areas are combined, and the second composition process of generating the second drawing data representing the second drawing area including the predetermined pattern is executed.

A seventh aspect is a drawing method for drawing a predetermined pattern on a substrate. The drawing method includes a data acquisition process for acquiring initial drawing data representing an initial drawing area including a predetermined pattern, and a plurality of first drawing methods obtained by dividing the initial drawing area by an initial mesh width based on the initial drawing data. The position of the alignment mark on the first substrate is specified based on the first division process for generating the first division data representing each drawing content of the 1 mesh region and the captured image obtained by imaging the first substrate. 1 mark position identification process, a first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and each rearranged by the first rearrangement process. The first drawing data representing the first drawing area including a predetermined pattern is generated by synthesizing the drawing contents of each of the first mesh areas represented by the first divided data according to the position of the first mesh area. 1 Compositing process and a first drawing process for drawing on the first substrate based on the first drawing data are included. Further, the drawing method represents each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area into a mesh width larger than the initial mesh width based on the first drawing data. The second division process for generating the two division data, the second mark position identification process for specifying the position of the alignment mark on the second substrate based on the captured image obtained by imaging the second substrate, and the second mark position identification process. Based on the position of the alignment mark on the substrate, the second rearrangement process for rearranging each of the second mesh regions and the position of each of the second mesh regions rearranged by the second rearrangement process are matched. , The second composition process that synthesizes the drawing contents of each of the second mesh regions and generates the second drawing data representing the second drawing region including the predetermined pattern, and the second substrate based on the second drawing data. Includes a second drawing process for drawing.

The eighth aspect is a drawing data generation method for generating drawing data used in a drawing apparatus that draws a predetermined pattern on a substrate. A plurality of drawing data generation methods are obtained by a data acquisition process for acquiring initial drawing data representing an initial drawing area including a predetermined pattern and dividing the initial drawing area by an initial mesh width based on the initial drawing data. The position of the alignment mark on the first substrate is specified based on the first division process for generating the first division data representing each drawing content of the first mesh region and the captured image obtained by imaging the first substrate. The first mark position identification process is performed, the first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and the first rearrangement process for rearranging the data. The drawing contents of each of the first mesh areas represented by the first divided data are combined according to the position of each of the first mesh areas, and the first drawing data representing the first drawing area including a predetermined pattern is generated. The first synthetic process to be performed is included. Further, in the drawing data generation method, each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area into a mesh width larger than the initial mesh width based on the first drawing data is obtained. The second division process for generating the second division data to be represented, the second mark position identification process for specifying the position of the alignment mark on the second substrate based on the captured image obtained by imaging the second substrate, and the above-mentioned Based on the position of the alignment mark on the second substrate, the second rearrangement process for rearranging each of the second mesh regions and the position of each of the second mesh regions rearranged by the second rearrangement process are performed. In addition, it includes a second compositing process that synthesizes the drawing contents of each of the second mesh regions and generates second drawing data representing the second drawing region including a predetermined pattern.

According to the drawing apparatus of the first aspect, the second mesh area rearranged to generate the second drawing data is larger than the first mesh area rearranged to generate the first drawing data. Therefore, it is possible to reduce the calculation resources or the calculation time required for the process of rearranging each second mesh area and the process of synthesizing the drawing contents of each second mesh area.

According to the drawing apparatus of the second aspect, by generating a plurality of pre-divided data by dividing by a plurality of pre-mesh widths, the calculation resource or the calculation time is higher than that in the case of generating the divided data for each substrate. Can be reduced.

According to the drawing apparatus of the third aspect, the first drawing data can be effectively corrected based on the deformation between the alignment marks on the second substrate.

According to the drawing apparatus of the fourth aspect, the first drawing data can be effectively corrected based on the deformation between two adjacent alignment marks on the second substrate.

According to the drawing apparatus of the fifth aspect, the first drawing data can be effectively corrected based on the deformation between the two alignment marks located at the corners of the second substrate.

It is a figure which shows the schematic structure of the drawing system which concerns on embodiment with the flow of data. It is a figure which shows the schematic structure of the drawing system which concerns on embodiment. It is a figure for demonstrating the relationship between the exposure resolution in an exposure apparatus, and the drawn figure. It is a figure which shows the flow of the preparatory processing which a data processing apparatus executes. It is a conceptual diagram for demonstrating the process executed by the 1st division part. It is a figure which conceptually shows how the drawing area is divided into a plurality of first mesh areas. It is a figure which shows the flow of the process executed by the drawing apparatus which concerns on embodiment. It is a figure which shows the flow of the process executed by the drawing apparatus which concerns on embodiment. It is a figure which shows the arrangement of a plurality of alignment mark Ma in an ideal state assumed at the time of circuit pattern design. It is a figure which shows the arrangement of the alignment mark in the 1st substrate which has a deformation. It is a figure which shows each 1st mesh area which was rearranged according to the description content of the rearranged data. It is a figure which shows the 1st drawing area defined by the drawing data generated by a synthesis part. It is a figure which conceptually shows the state that the 1st drawing area was divided by the pre-mesh width which is larger than the initial mesh width. It is a figure for demonstrating the flow of finding the 2nd mesh width based on the deformation between two adjacent points. It is a figure for demonstrating the flow of obtaining the 2nd mesh width based on the whole deformation of a substrate.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the components described in this embodiment are merely examples, and the scope of the present invention is not limited to them. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for easy understanding.

<Embodiment>
FIG. 1 is a diagram showing a schematic configuration of a drawing system 100 according to an embodiment together with a data flow. FIG. 2 is a diagram showing a schematic configuration of a drawing system 100 according to an embodiment. The drawing system 100 includes a drawing device 1 and a pattern design device 4. The drawing device 1 is a direct drawing device that draws an exposed image, which is a circuit pattern, on the target surface of the substrate 9 by scanning the target surface 9a of the substrate 9 with a laser beam LB for exposure.

The drawing device 1 includes a data processing device 2 (data processing unit) that generates drawing data DD, and an exposure device 3 that draws (exposes) based on the drawing data DD. The data processing device 2 and the exposure device 3 are not necessarily provided integrally, and may be physically separated from each other as long as data can be exchanged between them.

As shown in FIG. 2, the data processing device 2 includes a processor 201, a ROM 202, a RAM 203, and a storage unit 204, which are electrically connected to each other by a bus line BS1. Processor 201 includes a CPU, GPU, and the like. The RAM 203 is a storage medium capable of reading and writing information, and specifically, an SDRAM. The storage unit 204 is a non-transient recording medium capable of reading and writing information, and includes an HDD (hard disk drive) or an SSD (solid state drive). The storage unit 204 stores the program P.

The processor 201 uses the RAM 203 as a work area to execute the program P stored in the storage unit 204. As a result, the data processing device 2 generates the drawing data DD.

The input unit 205 and the display unit 206 are electrically connected to the bus line BS1. The input unit 205 is composed of, for example, a keyboard, a mouse, or the like, and receives inputs such as commands and parameters. The display unit 206 is composed of, for example, a liquid crystal display or the like, and displays various information such as processing results and messages. Further, a reading device 207 that reads recorded contents from a portable recording medium RM (optical disk, magnetic disk, semiconductor memory, etc.) is connected to the bus line BS1. The program P may be read from the recording medium RM by the reading device 207 and stored in the storage unit 204. Further, the program P may be stored in the storage unit 204 via the network.

The exposure device 3 and the pattern design device 4 are connected to the bus line BS1. The data processing device 2 generates drawing data DD used in the exposure device 3 based on the pattern data DP created by the pattern design device 4. The pattern data DP is the design data of the circuit pattern. The pattern data DP is usually described as vector data such as polygons. The exposure apparatus 3 performs exposure based on the drawing data DD described as raster data. Therefore, the data processing device 2 converts the pattern data DP into raster data. As will be described later, the drawing apparatus 1 generates drawing data DD corrected according to the deformation of the substrate 9 to be drawn. Therefore, the exposure apparatus 3 can satisfactorily draw the circuit pattern based on the corrected drawing data DD even on the deformed substrate 9.

The exposure apparatus 3 draws a plurality of substrates 9 one by one. Therefore, the data processing device 2 generates drawing data DD corresponding to each deformation of the plurality of substrates 9 processed by the exposure device 3. The first substrate 9 to be drawn by the exposure apparatus 3 is referred to as a substrate 91. Further, the second and subsequent substrates 9 that are drawn after the substrate 91 in the exposure apparatus 3 are referred to as the substrate 92. As the drawing data DD for drawing the substrate 91 and the substrate 92, the data processing device 2 generates the drawing data DD1 and the second drawing data DD2.

As shown in FIG. 1, the data processing device 2 includes a conversion unit 21, a first division unit 22, a rearrangement unit 23, a synthesis unit 24, and a second division unit 25. The conversion unit 21, the first division unit 22, the rearrangement unit 23, the synthesis unit 24, and the second division unit 25 are functions realized by software when the processor 201 executes the program P. Each processing unit may be realized by hardware by a dedicated circuit such as an ASIC (Integrated Circuit for Specific Applications). Further, as shown in FIG. 1, pattern data DP, initial drawing data DD0, division condition data DC, initial division data D20, mark imaging data DM, rearrangement data DS (relocation data DS1, DS2), drawing data DD (drawing data). The DD1, DD2), and the pre-divided data set D21 are data appropriately stored in the RAM 203 or the storage unit 204.

The conversion unit 21 acquires the pattern data DP from the pattern design device 4 and converts the pattern data DP into the initial drawing data DD0. The initial drawing data DD0 is raster format data that can be processed by the exposure apparatus 3. The first division unit 22 generates the initial division data D20 based on the initial drawing data DD0 and the division condition data DC.

The rearrangement unit 23 generates the rearrangement data DS based on the mark imaging data DM. The mark imaging data DM represents an imaging image obtained by imaging the alignment mark Ma provided on the substrate 9 mounted on the stage 32 by the imaging unit 34 of the exposure apparatus 3. The imaging unit 34 acquires the mark imaging data DM1 that images the alignment mark Ma of the substrate 91 and the mark imaging data DM2 that images the alignment mark Ma of the substrate 92. The rearrangement unit 23 generates the rearrangement data DS1 based on the mark imaging data DM1. Further, the rearrangement unit 23 generates the rearrangement data DS2 based on the mark imaging data DM1 and DM2.

The synthesis unit 24 generates drawing data DD1 based on the initial division data D20 and the rearrangement data DS1. The second division unit 25 generates the pre-division data set D21 based on the drawing data DD1. Further, the synthesis unit 24 generates drawing data DD2 based on the rearranged data DS2 and the pre-divided data set D21.

The details of the processing performed by the conversion unit 21, the first division unit 22, the rearrangement unit 23, the synthesis unit 24, and the second division unit 25 in the data processing device 2 will be described later.

The exposure apparatus 3 draws on the substrate 9 according to the drawing data DD given by the data processing apparatus 2. As shown in FIG. 1, the exposure apparatus 3 is mounted on the drawing controller 31 that controls the operation of each unit, the stage 32 for mounting the substrate 9, the irradiation unit 33 that emits the laser beam LB, and the stage 32. It includes an imaging unit 34 that images the target surface 9a of the placed substrate 9. The type of the laser beam LB is appropriately determined according to the photosensitive material applied to the target surface 9a of the substrate 9.

In the exposure apparatus 3, at least one of the stage 32 and the irradiation unit 33 can move in the main scanning direction and the sub-scanning direction, which are horizontal biaxial directions orthogonal to each other. Therefore, the exposure apparatus 3 can irradiate the laser beam LB from the irradiation unit 33 while relatively moving the stage 32 and the irradiation unit 33 in the main scanning direction while the substrate 9 is placed on the stage 32. .. The stage 32 may be rotatable in the horizontal plane, and the irradiation unit 33 may be movable in the vertical direction.

The irradiation unit 33 includes a light source (not shown) that emits laser light, and a modulation unit 33a such as a DMD (digital mirror device) that modulates the laser light emitted from the light source. The drawing controller 31 irradiates the substrate 9 on the stage 32 with the laser beam LB modulated by the modulation unit 33a. More specifically, the drawing controller 31 sets on / off irradiation of the laser beam LB for each modulation unit of the modulation unit 33a according to the description content of the drawing data DD that defines the presence or absence of exposure for each pixel position. Then, the drawing controller 31 emits the laser beam LB from the irradiation unit 33 according to the on / off setting while the irradiation unit 33 moves relative to the stage 32 in the main scanning direction, so that the substrate 9 on the stage 32 Is irradiated with the laser beam LB modulated based on the drawing data DD.

When the drawing controller 31 scans to one end of the drawing area in the main scanning direction, the drawing controller 31 moves the stage 32 in the sub-scanning direction by a predetermined distance. Then, the drawing controller 31 scans toward the other end of the drawing area in the main scanning direction. As described above, the drawing controller 31 alternately repeats scanning in the main scanning direction and movement of the stage 32 in the sub-scanning direction a predetermined number of times, so that the target surface 9a of the substrate 9 is based on the drawing data DD. Form an exposed image.

The imaging unit 34 images a plurality of alignment marks Ma included in the substrate 9 mounted on the stage 32. The captured image of the alignment mark Ma is provided to the rearrangement unit 23 of the data processing device 2 as the mark imaging data DM.

The alignment mark Ma is provided on the target surface 9a of the substrate 9. The alignment mark Ma may be provided by mechanical processing such as a through hole, or may be patterned by a printing process, a photolithography process, or the like.

<Basic concept of correction processing>
Next, the correction process performed when the data processing device 2 generates the drawing data DD will be described. Generally, the pattern data DP is created assuming a substrate 9 having an ideal shape with no deformation and a flat surface to be drawn. However, the actual substrate 9 may be deformed such as warpage, distortion, and distortion due to the processing in the previous step. Therefore, it is difficult to obtain a desired circuit pattern even if the circuit pattern is drawn on the substrate 9 with the pattern data DP as it is. Therefore, the data processing device 2 converts the position (coordinates) of the circuit pattern described in the pattern data DP so that the circuit pattern corresponding to the shape of the substrate 9 is formed. The correction process performed when the drawing data DD is generated is simply a coordinate conversion process. As described below, the data processing device 2 performs the correction process in consideration of the exposure resolution of the exposure device 3.

FIG. 3 is a diagram for explaining the relationship between the exposure resolution in the exposure apparatus 3 and the drawn figure. Note that FIG. 3 illustrates an X-axis corresponding to the main scanning direction and a Y-axis corresponding to the sub-scanning direction.

In the exposure apparatus 3, exposure is performed by moving the stage 32 in the main scanning direction and the sub-scanning direction with respect to the irradiation unit 33. Therefore, with respect to the side inclined at the inclination angle α1 with respect to the X direction as shown in the figure F1 shown in FIG. 3A, in the drawing data DD, as shown in FIG. 3B, the stepped figure F2 It is described by being approximated to. At this time, the step of the stepped figure F2 corresponds to the exposure resolution in the sub-scanning direction in the exposure apparatus 3. Hereinafter, the exposure resolution in the sub-scanning direction is defined as “δ”. As shown in FIG. 3B, the stepped figure F2 is drawn stepwise from (1) to (8) by scanning in the main scanning direction a plurality of times.

In the correction process for generating the drawing data DD including the figure F1, it is not necessary to generate the coordinate values that faithfully represent the figure F1, and the coordinate values that directly represent the stepped figure F2 may be generated. ..

FIG. 3C shows a state in which the figure F3 having an inclination angle α2 smaller than the inclination angle α1 of the figure F1 is approximated by the stepped figure F4 with the exposure resolution δ. The step width (the length of each step in the main scanning direction) in the step-shaped figure F2 is w1, and the step width of the step-shaped figure F4 is w2. Then, w2> w1.

FIG. 3 (d) shows how the figure F3 is approximated by the exposure resolution δ, similarly to FIG. 3 (c). However, in FIG. 3D, the step width w3 of the stepped figure F5 that approximates the figure F3 is set to w3 = 2 · w1. In this case, although the accuracy of approximation is inferior to that of FIG. 3C, if δ is sufficiently small, the accuracy is practically sufficient.

Assuming that the inclination of the figure F1 is the maximum inclination allowed for the circuit pattern (maximum deformation error with respect to the main scanning direction), the circuit pattern having a smaller inclination than the figure F1 has a step that is an integral multiple of δ and an integer of w1. It can be approximated by a stepped figure having double the step width. The same argument also holds for the sub-scanning direction (however, the exposure resolution in this case is defined by the size of the modulation unit of the modulation unit 33a). Therefore, when the correction process (coordinate conversion process) in consideration of the deformation of the substrate 9 is performed, the circuit pattern after the conversion has the width determined based on the exposure resolution in the sub-scanning direction as the unit for the sub-scanning in the main scanning direction. The direction is drawn in units of a width determined based on the exposure resolution in the main scanning direction.

From the above, the data processing device 2 divides the entire circuit pattern (drawing target image) represented by the initial drawing data DD0, which is raster data obtained from the pattern data DP, into a plurality of mesh regions in advance. The mesh region has a rectangular shape, and the vertical and horizontal lengths are determined according to the exposure resolution and the degree of deformation of the allowable pattern. Then, the data processing device 2 acquires the drawing data DD by performing coordinate conversion for each mesh region. These series of processes correspond to correction processes.

<Operation of data processing device>
Next, the process executed by the data processing device 2 will be described in detail. The data processing device 2 executes the preparatory process before actually executing the drawing on the substrate 9. The result of the preparatory process is used in drawing the circuit pattern on the substrate 9. The preparatory process will be described with reference to FIG.

<Preparation process>
FIG. 4 is a diagram showing a flow of preparatory processing executed by the data processing device 2. First, the conversion unit 21 acquires the pattern data DP in the vector format from the pattern design device 4 (FIG. 4: step S1). The conversion unit 21 converts the acquired pattern data DP into raster format initial drawing data DD0 (FIG. 4: step S2). Hereinafter, the circuit pattern represented by the pattern data DP is drawn inside the rectangular drawing area set for the target surface 9a of the substrate 9 in the exposure apparatus 3. As shown in FIG. 1, the initial drawing data DD0 generated by the conversion unit 21 is passed to the first division unit 22.

The first division unit 22 obtains the initial mesh width of the mesh region for generating the initial division data D20 from the initial drawing data DD0 according to the description contents of the division condition data DC (step S3). The division condition data DC includes information for specifying the maximum degree of deformation allowed in the circuit pattern during the correction process and exposure resolutions in the main scanning direction and the sub-scanning direction in the exposure apparatus 3 as data elements.

FIG. 5 is a conceptual diagram for explaining the process executed by the first division unit 22. FIG. 5 illustrates an X-axis corresponding to the main scanning direction and a Y-axis corresponding to the sub-scanning direction. In FIG. 5, the rectangle consisting of the vertices A, B, C, and D shown by the solid line represents the initial drawing area RA0 of the circuit pattern in the pattern data DP or the initial drawing data DD0. Let the coordinates of vertex A be (X1, Y1), the coordinates of vertex B be (X2, Y1), the coordinates of vertex C be (X2, Y2), and the coordinates of vertex D be (X1, Y2). Further, assuming that X2-X1 = Lx and Y2-Y1 = Ly, Lx and Ly represent the size of the initial drawing region RA0 in the main scanning direction and the sub-scanning direction.

It consists of four rectangles Sq1 to Sq4 (respectively, vertices A1 to A4, B1 to B4, C1 to C4, and D1 to D4) centered on the vertices A, B, C, and D of the initial drawing area RA0 shown by the broken line. (Rectangle) indicates the range of error allowed for each vertex during the correction process. The error range corresponds to the maximum error range allowed for the building blocks of the circuit pattern.

Here, it is assumed that the dimensions of all the rectangles Sq1 to Sq4 are p · Lx in the X-axis direction and q · Ly in the Y-axis direction (where 0 <p, q << 1). Then, the line segment connecting the arbitrary point in the rectangle Sq1 and the arbitrary point in the rectangle Sq2 expresses the deformed state that the side AB can take in response to the deformation of the substrate 9. At this time, the deformation in which the side AB becomes the line segment A3B1 (or the line segment A2B4) is the deformation that gives the side AB the maximum allowable inclination. The inclination angle α of the side A3B1 with respect to the line segment AB is the maximum inclination angle allowed for the side AB. The inclination angle α satisfies the following equation.

tan α = qLy / (X2-X1-pLx) = qLy / (1-p) Lx ≒ qLy / Lx ・ ・ ・ Equation (1)

The above argument holds true for the side CD parallel to the side AB. That is, the side CD is also allowed to be deformed up to the line segment C4D2 (or the line segment C1D3) having the inclination angle α. That is, with respect to the main scanning direction, deformation from a state parallel to the main scanning direction to an inclination angle α is allowed. Incidentally, in FIG. 5, the line segment C3D1 is shown as an example of the deformation of the side CD, but since the inclination angle α'due to the deformation from the side CD to the line segment C3D1 is smaller than the inclination angle α, the deformation is , It is not considered in the calculation of the initial mesh width of the mesh area.

Here, assuming that the exposure resolution in the sub-scanning direction is δy, the initial mesh width wx of the mesh region in the main scanning direction can be obtained by the following equation.

wx = δy / tan α = δyLx / qLy ・ ・ ・ Equation (2)

Similar to the tilt angle α for the main scan direction, the maximum tilt angle β allowed for the deformation of the side BC and the side DA in the sub scan direction satisfies the following equation.

tanβ = pLx / (Y2-Y1-qLy) = pLx / (1-q) Ly ≒ pLx / Ly ・ ・ ・ Equation (3)

Assuming that the exposure resolution in the main scanning direction is δx, the initial mesh width wy of the mesh region in the sub scanning direction can be obtained by the following equation.

wy = δx / tanβ = δxLy / pLx ・ ・ ・ Equation (4)

The exposure resolutions δx, δy and the error ranges of the vertices A, B, C, and D of the exposure apparatus 3 are given in advance as the division condition data DC. Further, Lx and Ly are known values specified from the initial drawing data DD0, and may be given as data elements of the division condition data DC, for example. In any case, these are all known values. Based on these values, the first division unit 22 obtains the initial mesh widths wx and wy of the mesh region according to the arithmetic expressions shown in the equations (3) and (4).

For example, the size of the drawing area is Lx = Ly = 500 mm, the exposure resolution is δx = δy = 1 μm, and the permissible error range of each vertex of the drawing area is pLx = qLy = 500 μm (that is, the permissible error range is 0 of the size of the drawing area). .1%). Then, wx and wy become about 1 μm.

Even when the error ranges of the vertices A, B, C, and D are different, the initial mesh widths wx and wy can be obtained in the same way. Assuming that the sets of error ranges of the vertices A, B, C, and D in the X-axis direction and the Y-axis direction are (2axLx, 2ayLy), (2bxLx, 2byLy), (2cxLx, 2cyLy), and (2dxLx, 2dyLy), respectively. The initial mesh widths wx and wy of the first mesh region RE1 are as follows, respectively.

wx ≒ Min {δyLx / (ay + by) Ly, δyLx / (cy + dy) Ly} ・ ・ ・ Equation (5)
wy ≒ Min {δxLy / (bx + cx) Lx, δxLy / (dx + ax) Lx} ・ ・ ・ Equation (6)

Returning to FIG. 4, in step S3, the first division portion 22 obtains the initial mesh widths wx and wy of the mesh region. Then, the first division unit 22 virtually divides the drawing area including the circuit pattern expressed by the initial drawing data DD0 into a plurality of areas (step S4). Then, the first division unit 22 generates initial division data D20 representing each drawing content of the plurality of first mesh regions RE1 obtained by the division from the initial drawing data DD0 (step S5) (see FIG. 1).

FIG. 6 is a diagram conceptually showing how the drawing area is divided into a plurality of first mesh areas RE1. First, each area in which the initial drawing area RA0 is divided by the initial mesh widths wx and wy is designated as the basic area RC1. Then, a region in which an additional region RC2 having a width corresponding to the exposure resolutions δx and δy in the main scanning direction and the sub-scanning direction is added around the basic region RC1 is defined as one first mesh region RE1. In FIG. 6, each rectangular region divided by a broken line is a basic region RC1, a frame-shaped region located around the basic region RC1 is an additional region RC2, and each rectangular region partitioned by a solid line. Is the first mesh region RE1. As shown in FIG. 6, adjacent first mesh regions RE1 overlap each other. The reason why the adjacent first mesh regions RE1 are overlapped is to avoid a gap between the adjacent first mesh regions RE1 when the first mesh region RE1 is moved according to the deformation of the substrate 9. be.

The first division unit 22 uses the coordinates of the reference position Ms of each first mesh area RE1 as data elements for specifying each first mesh area RE1, information on the drawing contents, and sizes in the main scanning direction and the sub-scanning direction. mx and my are described in the initial division data D20. The reference position Ms can be arbitrarily set, but for example, as shown in FIG. 6, the center (center of gravity) of the first mesh region RE1 may be set as the reference position Ms. Further, since mx = wx + 2δx and my = wy + 2δy, the first division unit 22 describes the initial mesh widths wx, wy and the exposure resolution δx, δy in the initial division data D20 instead of mx, my. You may. When the first division unit 22 generates the initial division data D20, the data processing device 2 ends the preparation process.

<Flow of drawing process>
7 and 8 are diagrams showing a flow of processing executed by the drawing apparatus 1 according to the embodiment. After the preparatory processing, the drawing apparatus 1 sequentially executes the drawing processing of the plurality of substrates 9. First, as shown in FIG. 7, the substrate 91 is carried onto the stage 32 of the exposure apparatus 3 (FIG. 7: step S11). The substrate 91 may be carried in manually or by a transfer device (not shown). When the substrate 91 is placed on the stage 32, the imaging unit 34 images the alignment mark Ma provided on the target surface 9a of the substrate 91 (FIG. 7: step S12). The imaging region of the imaging unit 34 may have a size that includes the entire substrate 9, or may have a size that includes only one or a plurality of alignment marks Ma. In the latter case, all the alignment marks Ma may be imaged by moving the stage 32 in the horizontal biaxial direction. The captured image obtained by the imaging unit 34 is given to the rearrangement unit 23 through the drawing controller 31 as mark imaging data DM1 (see FIG. 1).

FIG. 9 is a diagram showing the arrangement of a plurality of alignment marks Ma in an ideal state assumed at the time of circuit pattern design. As shown in FIG. 9, a plurality of alignment marks Ma are arranged at equal intervals in the horizontal biaxial direction. In addition, FIG. 9 also shows the arrangement of the reference position Ms in the first mesh region RE1 for reference. When the alignment marks Ma are arranged at equal intervals (in the ideal state), the reference positions Ms of the first mesh region RE1 are also arranged at equal intervals. The solid line and the broken line shown in FIG. 9 are for the purpose of assisting the understanding of the figure, and are not observed on the substrate 9.

When the actual substrate 9 is not deformed, the alignment marks Ma are located at equal intervals as shown in FIG. On the other hand, when the substrate 9 is deformed, the position of the alignment mark Ma deviates from the ideal position. The degree of deformation may vary depending on the substrate 9. In order to form a desired pattern for each substrate 9 in the exposure apparatus 3, the position of the alignment mark Ma as a deformation index of the substrate 9 is specified by actual measurement for each substrate 9.

Returning to FIG. 7, the rearrangement unit 23 specifies the coordinates of each alignment mark Ma provided on the substrate 91 based on the mark imaging data DM1, and stores the specified coordinates as the first mark coordinate information in the storage unit 204. save. (Fig. 7: Step S13). The coordinates may be specified by known image processing such as binarization processing or pattern recognition for the captured image.

FIG. 10 is a diagram showing the arrangement of the alignment mark Ma on the first substrate 91 having deformation. In FIG. 10, each alignment mark Ma in the ideal arrangement shown in FIG. 9 is indicated by a broken line + mark. The rearrangement unit 23 rearranges each first mesh region RE1 according to the deformation of the substrate 91 based on the coordinates of each of the specified alignment mark Ma (FIG. 7: step S14). Specifically, the rearrangement unit 23 specifies the coordinates after the rearrangement of the reference position Ms of each first mesh region RE1 based on the position coordinates of the alignment mark Ma around each first mesh region RE1. .. That is, the rearrangement unit 23 relocates the first mesh region RE1 (see FIG. 6), which is arranged in an orderly manner in an ideal state, according to the shape of the substrate 91, and the position of each first mesh region RE1. To identify.

For example, the coordinates of the reference positions Ms1, Ms2, Ms3, and Ms4 shown in FIG. 10 after rearrangement are specified based on the coordinates of the alignment marks Ma1, Ma2, Ma3, and Ma4 (or a part thereof) located around the reference positions Ms1, Ms2, Ms3, and Ms4. Will be done. In FIG. 10, the reference position Ms in which the coordinates after the rearrangement are specified is illustrated. A known coordinate conversion method can be used to specify the coordinates of the reference position Ms. As an example, paying attention to the triangle consisting of the alignment marks Ma1, Ma2, and Ma4, a matrix representing the affine transformation from the triangle in the case of the ideal arrangement shown in FIG. 9 to the triangle based on the actual arrangement shown in FIG. 10 is obtained. Be done. Then, it is preferable that the coordinate transformation of the reference position Ms is performed using the obtained matrix.

The rearrangement unit 23 obtains the coordinates of the reference position Ms of each of the first mesh regions RE1 after the rearrangement, and generates the rearrangement data DS1 representing the coordinates of each of the first mesh regions RE1 after the rearrangement (see FIG. 1). ).

When the rearrangement unit 23 generates the rearrangement data DS1, the synthesis unit 24 generates the drawing data DD1 based on the initial division data D20 and the rearrangement data DS1 (FIG. 7: step S15). Specifically, the synthesizing unit 24 shifts the position of each first mesh region RE1 from the ideal position to the position described in the rearranged data DS1. Then, the synthesizing unit 24 synthesizes the drawing contents of each shifted first mesh area RE1 and generates one drawing data DD expressing the drawing contents for the entire drawing area. The shift of the first mesh region RE1 is realized by moving the coordinates of the pixels constituting each first mesh region RE1 according to the coordinate movement (translational movement) of the reference position Ms.

FIG. 11 is a diagram showing each of the first mesh regions RE1 rearranged according to the description contents of the rearranged data DS1. As shown in FIG. 11, there are places where the drawing contents overlap between the adjacent first mesh regions RE1. The drawing contents of the overlapping portions are appropriately adjusted by a predetermined logical operation such as multiplying the two.

FIG. 12 is a diagram showing a first drawing area RA1 defined by the drawing data DD1 generated by the synthesis unit 24. For reference, FIG. 12 also shows the alignment mark Ma whose position has been measured. Although not shown in FIG. 11, in reality, a circuit pattern based on the content described in the initial division data D20 is arranged in the drawing area RA2.

The data processing device 2 transmits the drawing data DD1 generated by the synthesis unit 24 to the drawing controller 31. The drawing controller 31 draws a circuit pattern on the target surface 9a of the substrate 91 by controlling the modulation unit 33a based on the drawing data DD1 (FIG. 7: step S16). The drawing data DD1 is data obtained by correcting the initial drawing data DD0 according to the deformation of the substrate 91 based on the arrangement of the alignment mark Ma. Therefore, the exposure apparatus 3 can accurately draw a desired circuit pattern on the substrate 91 by performing exposure based on the drawing data DD1.

When the drawing process of the substrate 91 is completed, the next substrate 92 is drawn. Here, when the substrate 92 belongs to the same lot as the substrate 91, the difference between the deformation of the substrate 91 and the deformation of the substrate 92 is often small. When there is no difference in deformation between the substrates 91 and 92, the drawing data DD2 for the substrate 92 can be the same as the drawing data DD1 for the substrate 91. Further, even if there is a slight difference in the deformation between the substrates 91 and 92, the drawing data DD1 may be corrected with a mesh width larger than the initial mesh widths wx and wy. From this point of view, as will be described later, the data processing device 2 performs a correction process for generating the drawing data DD2 by correcting the drawing data DD1 according to the deformation of the substrate 92.

In the data processing device 2, in order to efficiently perform the correction process, the first drawing area RA1 represented by the drawing data DD1 is virtually divided in advance by a plurality of pre-mesh widths larger than the initial mesh widths wx and wy. (Fig. 7: Step S17). The size of each pre-mesh width may be, for example, an integral multiple (2 times, 3 times, 4 times, etc.) of the initial mesh widths wx, wy, but this is not essential. The second division unit 25 generates pre-division data that describes the drawing contents of each mesh area obtained by the division for each pre-mesh width. As a result, the second division unit 25 generates a pre-division data set D21 which is a set of a plurality of division data (FIG. 7: step S18).

FIG. 13 is a diagram conceptually showing how the first drawing area RA1 is divided by a pre-mesh width larger than the initial mesh widths wx and wy. The example shown in FIG. 13 is an example in which the second division portion 25 divides the first drawing area RA1 by the pre-mesh widths 2wx and 2wy which are twice as large as the initial mesh widths wx and wy. Similar to the first division portion 22, the second division portion 25 has each region partitioned by the pre-mesh widths 2wx and 2wy as a basic region. Then, a region in which an additional region having a predetermined width is added around the basic region is designated as one second mesh region RE2. As a result, the adjacent second mesh regions RE2 overlap each other. When the second mesh area RE2 is set, the second division unit 25 specifies the drawing content of each second mesh area RE2 based on the drawing data DD1, and pre-divides the drawing content of each second mesh area RE2. Generate data. The second division unit 25 also acquires the pre-division data for the other pre-mesh widths in the same manner as the method described with reference to FIG.

When the drawing process of the substrate 91 is completed, the substrate 91 is carried out from the exposure apparatus 3, and the next substrate 92 is carried into the exposure apparatus 3 (FIG. 8: step S20). Then, the imaging unit 34 acquires the mark imaging data DM2 by imaging the alignment mark Ma on the substrate 92 (FIG. 8: step S21). The rearrangement unit 23 specifies the coordinates of the alignment mark Ma on the substrate 92 based on the mark imaging data DM2, and stores the specified coordinates as the second mark position information in the storage unit 204 (FIG. 8: step S22). ..

Further, the rearrangement unit 23 determines the second mesh width based on the first mark coordinate information stored in the storage unit 204 and the second mark position information (step S23). The second mesh width is a mesh width required for correcting the relative deformation of the substrate 92 with respect to the substrate 91 (hereinafter, simply referred to as the deformation of the substrate 92) in the drawing data DD1. Hereinafter, the process of obtaining the second mesh width will be described with reference to FIGS. 14 and 15.

<Calculation of the second mesh width based on the deformation between two adjacent points>
FIG. 14 is a diagram for explaining a flow of obtaining a second mesh width based on a deformation between two adjacent points. First, the rearrangement unit 23 obtains the deformation of the substrate 92 from the positional relationship between the two alignment marks Ma adjacent to each other in the main scanning direction or the sub-scanning direction. For example, as shown in FIG. 14, attention is paid to two alignment marks Ma11 and Ma12 adjacent to each other in the main scanning direction. Assuming that the vector between the alignment marks Ma11 and Ma12 obtained from the first mark coordinate information is a and the vector between the alignment marks Ma11 and Ma12 obtained from the second mark coordinate information is b, the deformation between the alignment marks Ma11 and Ma12 is a vector. It is obtained as the difference (Δx1, Δy1) (that is, the magnitude of ba) of each component in the main scanning direction and the sub-scanning direction of a and b. Consider the mesh widths wx1 and wy1 required to correct the deformation between the two points of the alignment marks Ma11 and Ma12 on the substrate 92.

Here, the mesh widths wx1 and wy1 for correcting the deformation amount (Δx1, Δy1) between the alignment marks Ma11 and Ma12 possessed by the substrate 92 will be examined. First, when the main scanning direction is examined, the maximum distance at which the divided mesh region can be moved in order to maintain the drawing accuracy is the exposure resolution δx. Therefore, the minimum number of divisions between the alignment marks Ma11 and Ma12 is a value obtained by dividing the deformation amount Δx1 by the exposure resolution δx. The sub-scanning direction is a value obtained by dividing the deformation amount Δy1 by the exposure resolution δy. Assuming that the distance between the alignment marks Ma11 and Ma12 on the substrate 92 is L11, the mesh widths wx1 and wy1 required to correct the deformation between the alignment marks Ma11 and Ma12 on the substrate 92 are obtained by the following equations.

wx1 = L11 / (ΔX1 / δx) ・ ・ ・ Equation (7)
wy1 = L11 / (ΔY1 / δy) ・ ・ ・ Equation (8)

The rearrangement unit 23 obtains the mesh widths wx1 and wy1 required for correcting the deformation between the two adjacent alignment marks Ma in the same manner as described above. Then, the minimum mesh widths wx1m and wy1m, which are the smallest of all the obtained mesh widths wx1 and wy1, are stored in the storage unit 204 as the first candidate for the second mesh width.

<Calculation of the second mesh width based on the deformation of the entire substrate 92>
FIG. 15 is a diagram for explaining a flow of obtaining a second mesh width based on the overall deformation of the substrate 92. The overall deformation is selected, for example, as shown in FIG. 15, the distance between two points selected from the four alignment marks Ma21, Ma22, Ma23, and Ma24 at the corners of all the alignment marks Ma. The mesh widths wx2 and wy2 are obtained based on the deformation of the substrate 92 between the two points. At least one or more alignment marks Ma are located between each of the alignment marks Ma21, Ma22, Ma23, and Ma24.

For example, the mesh widths wx2 and wy2 with respect to the alignment marks Ma21 and Ma22 on the substrate 92 are as follows, assuming that the distance between the alignment marks Ma21 and 22 is L21 and the deformation amount between the alignment marks Ma21 and Ma22 on the substrate 92 is Δx2 and Δy2. It is calculated by the formula.

wx2 = L21 / (Δx2 / δx) ・ ・ ・ Equation (9)
wy2 = L21 / (Δy2 / δy) ・ ・ ・ Equation (10)

The rearrangement unit 23 also obtains the mesh widths wx2 and wy2 between the other two alignment marks Ma in the same manner. The rearrangement unit 23 stores the minimum mesh widths wx2m and wy2m, which are the smallest of all the mesh widths wx2 and wy2, in the storage unit 204 as candidates for the second mesh width.

The rearrangement unit 23 selects the smaller of the minimum mesh widths wx1m and wx2m obtained in the main scanning direction as the second mesh width wx2. Further, the rearrangement unit 23 selects the smaller of the minimum mesh widths wy1m and wy2m obtained in the sub-scanning direction as the second mesh width wy2.

Returning to FIG. 8, when the rearrangement unit 23 determines the second mesh widths wy2 and wy2 in step S23, the rearrangement unit 23 determines whether or not the second mesh widths wy2 and wy2 are smaller than the minimum pre-mesh width. (FIG. 8: Step S231). When the second mesh widths wx2 and wy2 are smaller than the minimum pre-mesh width (NO in step S231), it is difficult to correct the drawing data DD1 according to the deformation of the substrate 92 by using the pre-divided data set D21. .. Therefore, by returning to step S14, the data processing device 2 uses the initial division data D20 to generate drawing data DD2 for the substrate 92.

When the second mesh widths wx2 and wy2 are larger than the minimum pre-mesh width (YES in step S231), the rearrangement unit 23 determines whether or not the second mesh widths wx2 and wy2 are larger than the maximum pre-mesh width. (Fig. 8: Step S24). When the second mesh widths wx2 and wy2 are larger than the maximum pre-mesh width (YES in step S24), the data processing device 2 transmits the drawing data DD1 to the drawing controller 31 as it is. As a result, the drawing controller 31 draws the substrate 92 using the drawing data DD1 (FIG. 8: step S25).

When it is determined that the second mesh width wx2 and wy2 are the same as the maximum pre-mesh width or smaller than the maximum pre-mesh width (NO in step S24), the rearrangement unit 23 is used from the pre-divided data set D21. The pre-divided data to be used is determined (FIG. 8: step S26). Specifically, the rearrangement unit 23 selects the pre-divided data generated with the maximum pre-mesh width among the pre-mesh widths smaller than the second mesh width in the pre-divided data set D21. In this way, by selecting the pre-divided data having the largest possible pre-mesh width, the process of rearranging the second mesh area RE2 (step S27), which will be described later, and the drawing contents of each second mesh area RE2 are combined. The amount of calculation required for the process (step S28) can be reduced.

The rearrangement unit 23 uses the selected pre-division data and describes it in the pre-division data according to the deformation of the substrate 92 with respect to the substrate 91, which is specified based on the first mark coordinate information and the second mark coordinate information. Each of the second mesh regions RE2 that has been created is rearranged (step S27). The rearrangement process by the rearrangement unit 23 is performed in the same manner as in step S14 shown in FIG. The rearrangement unit 23 generates the rearrangement data DS2 representing the position of each mesh region after the rearrangement (see FIG. 1).

When the rearrangement unit 23 generates the rearrangement data DS2, the synthesis unit 24 generates the drawing data DD2 based on the pre-division data and the rearrangement data DS2 (FIG. 8: step S28). The pre-divided data is data selected by the rearrangement unit 23 from the pre-divided data set D21 in step S26. The process of generating the drawing data DD2 by the synthesizing unit 24 is performed in the same manner as in step S15 shown in FIG.

The data processing device 2 transmits the drawing data DD2 generated by the synthesis unit 24 to the drawing controller 31. The drawing controller 31 draws a circuit pattern on the target surface 9a of the substrate 92 by controlling the modulation unit 33a based on the drawing data DD2 (FIG. 8: step S29).

Subsequently, the data processing device 2 determines whether or not the drawing process is completed (step S30). When the substrate 9 to be drawn exists, the data processing device 2 returns to step S20 and repeats the processes after step S20. As a result, the drawing process for the next substrate 9 is executed.

As described above, in the drawing apparatus 1, the drawing data DD2 for the second and subsequent substrates 9 is generated by correcting the drawing data DD1 for the first substrate 9. When the deformation of the second and subsequent boards 9 with respect to the first board 9 is small, the amount of correction for the drawing data DD1 is small, so that the calculation resource or calculation time required to generate the drawing data DD2 can be reduced.

The second mesh region RE2 rearranged in step S27 is larger in size than the first mesh region RE1 rearranged in step S14. Therefore, the number of the second mesh region RE2 is smaller than the number of the first mesh region RE1. Therefore, the computational resources or calculation time required for the rearrangement process in step S27 and the process of synthesizing the drawing contents in step S28 can be reduced series.

Further, in the drawing apparatus 1, the pre-division data set D21 is generated by preliminarily dividing the first drawing area RA1 represented by the drawing data DD1 by the pre-mesh widths of different sizes. Therefore, the calculation resource or the calculation time can be reduced as compared with the case where the divided data is generated for each substrate 9.

Although the present invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention. The configurations described in the above embodiments and the modifications can be appropriately combined or omitted as long as they do not conflict with each other.

1 Drawing device 2 Data processing device 201 Processor 203 RAM
204 Storage unit 21 Conversion unit 22 1st division unit 23 Relocation unit 24 Synthesis unit 25 2nd division unit 3 Exposure device 31 Drawing controller 32 Stage 33 Irradiation unit 34 Imaging unit 9,91,92 Board D20 Initial division data D21 Pre-division Data set DD0 Initial drawing data DD1, DD2 Drawing data DM1, DM2 Mark imaging data DP pattern data DS1, DS2 Relocation data Ma Alignment mark RA0 Initial drawing area RA1 First drawing area RA2 Drawing area RE1 First mesh area RE2 Second mesh region

Claims (8)

A drawing device that draws a predetermined pattern on a substrate.
A stage for mounting a substrate with multiple alignment marks,
An imaging unit that images the alignment mark of the substrate mounted on the stage, and an imaging unit.
A data processing unit that generates drawing data and
An irradiation unit that irradiates the substrate placed on the stage with light based on the drawing data.
With
The data processing unit
Data acquisition processing to acquire initial drawing data representing the initial drawing area including a predetermined pattern, and
Based on the initial drawing data, the first division process for generating the first division data representing the drawing contents of the plurality of first mesh areas obtained by dividing the initial drawing area by the initial mesh width, and the first division processing.
The first mark position specifying process for specifying the position of the alignment mark on the first substrate based on the captured image obtained by the imaging unit imaging the first substrate.
A first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and
The drawing contents of each of the first mesh regions represented by the first division data are combined according to the position of each of the first mesh regions rearranged by the first rearrangement processing, and the first drawing including a predetermined pattern is performed. The first compositing process that generates the first drawing data that expresses the area, and
Based on the first drawing data, second division data representing each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area with a mesh width larger than the initial mesh width is generated. Second division processing and
The second mark position specifying process for specifying the position of the alignment mark on the second substrate based on the captured image obtained by the imaging unit imaging the second substrate.
A second rearrangement process for rearranging each of the second mesh regions based on the position of the alignment mark on the second substrate, and
Second drawing data representing a second drawing area including a predetermined pattern by synthesizing the drawing contents of each of the second mesh areas according to the position of each of the second mesh areas rearranged by the second relocation process. The second synthesis process to generate
A drawing device that runs. The drawing apparatus according to claim 1.
In the second division process, the data processing unit divides the first drawing area into a plurality of pre-mesh widths different from each other, so that each of the plurality of second mesh areas is divided for each pre-mesh width. Includes processing to generate pre-divided data that represents the drawing content
In the second rearrangement process, the data processing unit selects one pre-divided data from the plurality of pre-divided data based on the position of the alignment mark on the second substrate, and before the selection. Article A drawing device including a process of rearranging each of the second mesh regions represented by the pre-divided data. The drawing apparatus according to claim 1 or 2.
The second rearrangement process includes a process in which the data processing unit determines the mesh width based on the deformation between the alignment marks that the second substrate has with respect to the first substrate. Device. The drawing apparatus according to claim 3.
The second rearrangement process is a drawing apparatus including a process in which the data processing unit determines the mesh width based on a deformation between two adjacent alignment marks. The drawing apparatus according to claim 3 or 4.
The second rearrangement process is a drawing apparatus including a process in which the data processing unit determines the mesh width based on the deformation between the two alignment marks located at the corners. A data processing device that generates drawing data used in a drawing device that draws a predetermined pattern on a substrate.
With the processor
A memory that is electrically connected to the processor
With
The processor
Data acquisition processing to acquire initial drawing data representing the initial drawing area including a predetermined pattern, and
Based on the initial drawing data, the first division process for generating the first division data representing the drawing contents of the plurality of first mesh areas obtained by dividing the initial drawing area by the initial mesh width, and the first division processing.
The first mark position specifying process for specifying the position of the alignment mark on the first substrate based on the captured image obtained by imaging the first substrate, and
A first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and
The drawing contents of each of the first mesh regions represented by the first division data are combined according to the position of each of the first mesh regions rearranged by the first rearrangement processing, and the first drawing including a predetermined pattern is performed. The first compositing process that generates the first drawing data that expresses the area, and
Based on the first drawing data, second division data representing each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area with a mesh width larger than the initial mesh width is generated. Second division processing and
Based on the captured image obtained by imaging the second substrate, the second mark position specifying process for specifying the position of the alignment mark on the second substrate and the second mark position specifying process.
A second rearrangement process for rearranging each of the second mesh regions based on the position of the alignment mark on the second substrate, and
Second drawing data representing a second drawing area including a predetermined pattern by synthesizing the drawing contents of each of the second mesh areas according to the position of each of the second mesh areas rearranged by the second relocation process. The second synthesis process to generate
A data processing device that runs. It is a drawing method that draws a predetermined pattern on the board.
Data acquisition processing to acquire initial drawing data representing the initial drawing area including a predetermined pattern, and
Based on the initial drawing data, the first division process for generating the first division data representing the drawing contents of the plurality of first mesh areas obtained by dividing the initial drawing area by the initial mesh width, and the first division processing.
The first mark position specifying process for specifying the position of the alignment mark on the first substrate based on the captured image obtained by imaging the first substrate, and
A first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and
The drawing contents of each of the first mesh regions represented by the first division data are combined according to the position of each of the first mesh regions rearranged by the first rearrangement processing, and the first drawing including a predetermined pattern is performed. The first compositing process that generates the first drawing data that expresses the area, and
A first drawing process for drawing on the first substrate based on the first drawing data, and
Based on the first drawing data, second division data representing each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area with a mesh width larger than the initial mesh width is generated. Second division processing and
Based on the captured image obtained by imaging the second substrate, the second mark position specifying process for specifying the position of the alignment mark on the second substrate and the second mark position specifying process.
A second rearrangement process for rearranging each of the second mesh regions based on the position of the alignment mark on the second substrate, and
Second drawing data representing a second drawing area including a predetermined pattern by synthesizing the drawing contents of each of the second mesh areas according to the position of each of the second mesh areas rearranged by the second relocation process. The second synthesis process to generate
A second drawing process for drawing on the second substrate based on the second drawing data,
How to draw, including. A drawing data generation method for generating drawing data used in a drawing apparatus that draws a predetermined pattern on a substrate.
Data acquisition processing to acquire initial drawing data representing the initial drawing area including a predetermined pattern, and
Based on the initial drawing data, the first division process for generating the first division data representing the drawing contents of the plurality of first mesh areas obtained by dividing the initial drawing area by the initial mesh width, and the first division processing.
The first mark position specifying process for specifying the position of the alignment mark on the first substrate based on the captured image obtained by imaging the first substrate, and
A first rearrangement process for rearranging each of the first mesh regions based on the position of the alignment mark on the first substrate, and
The drawing contents of each of the first mesh regions represented by the first division data are combined according to the position of each of the first mesh regions rearranged by the first rearrangement processing, and the first drawing including a predetermined pattern is performed. The first compositing process that generates the first drawing data that expresses the area, and
Based on the first drawing data, second division data representing each drawing content of a plurality of second mesh areas obtained by dividing the first drawing area with a mesh width larger than the initial mesh width is generated. Second division processing and
Based on the captured image obtained by imaging the second substrate, the second mark position specifying process for specifying the position of the alignment mark on the second substrate and the second mark position specifying process.
A second rearrangement process for rearranging each of the second mesh regions based on the position of the alignment mark on the second substrate, and
Second drawing data representing a second drawing area including a predetermined pattern by synthesizing the drawing contents of each of the second mesh areas according to the position of each of the second mesh areas rearranged by the second relocation process. The second synthesis process to generate
Drawing data generation method including.

Images