JP2021146525A - Liquid discharge head and method for manufacturing the same - Google Patents

Liquid discharge head and method for manufacturing the same Download PDF

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JP2021146525A
JP2021146525A JP2020045741A JP2020045741A JP2021146525A JP 2021146525 A JP2021146525 A JP 2021146525A JP 2020045741 A JP2020045741 A JP 2020045741A JP 2020045741 A JP2020045741 A JP 2020045741A JP 2021146525 A JP2021146525 A JP 2021146525A
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element substrate
support member
discharge head
liquid discharge
groove
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徹 神田
Toru Kanda
徹 神田
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Canon Inc
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Canon Inc
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Abstract

To provide a liquid discharge head that can readily perform coating with a resin agent with respect to a marginal part of an opposed surface to a support member of an element substrate, and to provide a method for manufacturing a liquid discharge head.SOLUTION: In a liquid discharge head, a resin agent is provided in a clearance between a marginal part of an element substrate and a support member so as to coat the marginal part of the element substrate, a groove extending in a direction inclined to a direction in which the marginal part of the element substrate extends is provided at a lateral surface of the support member, and the resin agent is provided so as to be connected to the clearance from an inside of the groove.SELECTED DRAWING: Figure 3

Description

本発明は、液体を吐出する液体吐出ヘッドおよびその製造方法に関する。 The present invention relates to a liquid discharge head that discharges a liquid and a method for manufacturing the same.

液体を吐出する液体吐出ヘッドとして、液体を吐出するためのエネルギーを液体に付与する記録素子を備えた記録素子基板(素子基板)と、これを支持する支持部材と、記録素子基板と電気接続される電気配線を備えた配線基板と、を有する構成が知られている。 As a liquid discharge head for discharging a liquid, a recording element substrate (element substrate) provided with a recording element that applies energy for discharging the liquid to the liquid, a support member that supports the recording element substrate, and a recording element substrate are electrically connected to each other. There is known a configuration having a wiring board provided with electrical wiring.

特許文献1には、記録素子基板の端部が支持部材からはみ出すように、記録素子基板と支持部材とを接合する構成が開示されている。このような構成は、支持部材によって阻害されることなく複数の記録素子基板の端部同士を近接させて配備することができるため、特にフルライン型ヘッドのような長尺の液体吐出ヘッドに好適である。また、このような記録素子基板の端部が支持部材からはみ出すような構成では、記録素子基板の支持部材と対向する対向面の端部も支持部材よりはみ出し、その対向面の縁部が支持部材に接合されずに外部に露出するような場合がある。 Patent Document 1 discloses a configuration in which the recording element substrate and the support member are joined so that the end portion of the recording element substrate protrudes from the support member. Such a configuration is particularly suitable for a long liquid discharge head such as a full-line type head because the ends of a plurality of recording element substrates can be arranged close to each other without being hindered by the support member. Is. Further, in such a configuration in which the end portion of the recording element substrate protrudes from the support member, the end portion of the facing surface facing the support member of the recording element substrate also protrudes from the support member, and the edge portion of the facing surface protrudes from the support member. It may be exposed to the outside without being joined to.

特開2017−205903号公報JP-A-2017-205903

上記のように素子基板の支持部材との対向面の縁部が外部に露出している場合には、その部分に液体(インク)が付着して素子基板の対向面側の各種構成材料が膨潤して変形したり、溶出したりする恐れがある。そのため、この素子基板の縁部をインクなどの液体に対して十分な耐性を有する樹脂剤で被覆することが好ましく、また、簡便な方法で樹脂剤による被覆を行うことが好ましい。 When the edge of the surface facing the support member of the element substrate is exposed to the outside as described above, the liquid (ink) adheres to the portion and various constituent materials on the surface facing the element substrate swell. There is a risk of deformation or elution. Therefore, it is preferable to coat the edge of the device substrate with a resin agent having sufficient resistance to a liquid such as ink, and it is preferable to coat the element substrate with the resin agent by a simple method.

そこで、本発明は、素子基板の支持部材との対向面の縁部に対する樹脂剤による被覆を簡便に行うことが可能な液体吐出ヘッドおよび液体吐出ヘッドの製造方法を提供することを目的とする。 Therefore, an object of the present invention is to provide a liquid discharge head and a method for manufacturing a liquid discharge head, which can easily cover the edge of the surface of the element substrate facing the support member with a resin agent.

上記課題を解決するために本発明の液体吐出ヘッドは、液体を吐出するためのエネルギーを液体に付与する素子を備えた素子基板と、接着剤を介して前記素子基板が接合された支持部材と、を有する液体吐出ヘッドにおいて、前記素子基板の前記支持部材と対向する面の縁部は、前記接着剤を介して前記支持部材と接合されておらず、前記素子基板の前記縁部と前記支持部材との間の隙間には、前記素子基板の前記縁部を被覆するように樹脂剤が設けられており、前記支持部材の側面には、前記素子基板の前記縁部の延在する方向に対して傾斜する方向に延びる溝が設けられており、前記樹脂剤は、前記溝の内部から前記隙間に繋がるように設けられていることを特徴とする。 In order to solve the above problems, the liquid discharge head of the present invention includes an element substrate provided with an element that applies energy for discharging the liquid to the liquid, and a support member to which the element substrate is bonded via an adhesive. In the liquid discharge head having, the edge portion of the surface of the element substrate facing the support member is not joined to the support member via the adhesive, and the edge portion of the element substrate and the support are provided. A resin agent is provided in the gap between the members so as to cover the edge portion of the element substrate, and the side surface of the support member is oriented in the extending direction of the edge portion of the element substrate. A groove extending in an inclined direction is provided, and the resin agent is provided so as to connect from the inside of the groove to the gap.

本発明によると、素子基板の支持部材との対向面の縁部に対する樹脂剤による被覆を簡便に行うことが可能な液体吐出ヘッドおよび液体吐出ヘッドの製造方法を提供することができる。 According to the present invention, it is possible to provide a liquid discharge head and a method for manufacturing a liquid discharge head, which can easily cover the edge of the surface of the element substrate facing the support member with a resin agent.

本実施形態のインクジェット記録ヘッドを示す上面図および側面図Top view and side view showing the inkjet recording head of this embodiment 本実施形態のインクジェット記録ヘッドを示す断面図Sectional drawing which shows the inkjet recording head of this embodiment 支持部材の溝に塗布した封止剤が流れる様子を示す図The figure which shows the state which the sealant applied to the groove of a support member flows. 本実施形態の変形例を示す図The figure which shows the modification of this embodiment 封止剤を塗布する姿勢を説明するための図Diagram for explaining the posture of applying the sealant

本発明を適用可能な実施の形態について図面を用い説明する。 Embodiments to which the present invention can be applied will be described with reference to the drawings.

図1は、本実施形態の液体吐出ヘッドとしてのインクジェット記録ヘッド1を示す図であり、図1(a)はその上面図、図1(b)はその側面図である。図2は図1(a)のA−A断面図であり、図2(a)は後述する封止剤8を塗布する前の状態を示し、図2(b)は封止剤8を塗布した後の状態を示す。 1A and 1B are views showing an inkjet recording head 1 as a liquid discharge head of the present embodiment, FIG. 1A is a top view thereof, and FIG. 1B is a side view thereof. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 (a), FIG. 2 (a) shows a state before the sealant 8 described later is applied, and FIG. 2 (b) shows the state before the sealant 8 is applied. The state after the above is shown.

インクジェット記録ヘッド1は、インクを吐出する吐出口やインクを吐出するためのエネルギーをインクに付与するための記録素子を備えた記録素子基板2と、これを支持する第1の支持部材3と、第1の支持部材3を支持する第2の支持部材4と、を有している。さらに、インクジェット記録ヘッド1は、電気配線を備えた配線基板5を有しており、記録素子基板2の表面側の両縁部にそれぞれ設けられたパッド部と配線基板5の電気配線とがワイヤーやフライングリードで電気接続されている。このパッド部、電気配線、ワイヤーを含む電気接続部をインクから保護するために、電気接続部は封止剤6で被覆されている。なお、電気接続部を封止する封止剤として2種の封止剤を用い、ワイヤーやフライングリードの下側に粘度の低い封止剤を設け、その上側に粘度の高い封止剤を設けてもよい。 The inkjet recording head 1 includes a recording element substrate 2 provided with a discharge port for ejecting ink and a recording element for imparting energy for ejecting ink to ink, a first support member 3 for supporting the recording element substrate 2, and a first support member 3 for supporting the recording element substrate 2. It has a second support member 4 that supports the first support member 3. Further, the inkjet recording head 1 has a wiring board 5 provided with electrical wiring, and a pad portion provided on both edge portions on the surface side of the recording element substrate 2 and an electrical wiring of the wiring board 5 are wired. And are electrically connected by flying leads. In order to protect the electric connection part including the pad part, the electric wiring, and the wire from ink, the electric connection part is coated with the sealant 6. Two types of sealants are used to seal the electrical connection, a low-viscosity sealant is provided on the lower side of the wire or flying lead, and a high-viscosity sealant is provided on the upper side. You may.

記録素子基板2は、シリコン基板の表面側に記録素子や保護膜などを有しており、その裏面側(第1の支持部材3と対向する対向面の側)にシリコン基板に設けられたインク流路を保護するための樹脂膜9を有している。樹脂膜9は、記録素子基板2の対向面側の少なくとも一部を被覆するように設けられている。記録素子基板2に設けられた樹脂膜9と第1の支持部材3とが接着剤10を介して接合されている。 The recording element substrate 2 has a recording element, a protective film, and the like on the front surface side of the silicon substrate, and ink provided on the silicon substrate on the back surface side (the side facing the first support member 3). It has a resin film 9 for protecting the flow path. The resin film 9 is provided so as to cover at least a part of the recording element substrate 2 on the facing surface side. The resin film 9 provided on the recording element substrate 2 and the first support member 3 are joined via an adhesive 10.

ここで、図2に示すように、記録素子基板2はその端部が第1の支持部材3よりせり出す状態で第1の支持部材3に接合されている。このような構成は、第1の支持部材3によって阻害されることなく複数の記録素子基板2の端部同士を近接させて配備することができるため、長尺の液体吐出ヘッドに好適である。図1(a)に示すインクジェット記録ヘッド1を記録素子の配列方向に複数配列させることで、フルライン型ヘッドなどの長尺のヘッドを構成することができる。 Here, as shown in FIG. 2, the recording element substrate 2 is joined to the first support member 3 with its end portion protruding from the first support member 3. Such a configuration is suitable for a long liquid discharge head because the ends of the plurality of recording element substrates 2 can be arranged close to each other without being hindered by the first support member 3. By arranging a plurality of inkjet recording heads 1 shown in FIG. 1A in the arrangement direction of the recording elements, a long head such as a full-line type head can be configured.

しかし、図2(a)に示すように、上記のような構成では、記録素子基板2の第1の支持部材3との対向面の縁部2a(点線で囲む部分)は、第1の支持部材3と接合されていないため、記録素子基板2の樹脂膜9の一部が外部に露出した状態となる。この露出する樹脂膜9にインクが付着すると樹脂膜9が膨潤して変形したり溶出したりして、インク漏れが生じる恐れがある。そこで、図2(b)に示すように、本実施形態では、この樹脂膜9の第1の支持部材3に接合されていない部分を、インク等の液体に対する腐食耐性のある封止剤8(樹脂剤)で被覆する。これにより、記録素子基板2の支持部材3との対向面の縁部2aへのインクの付着を抑制することができる。 However, as shown in FIG. 2A, in the above configuration, the edge portion 2a (the portion surrounded by the dotted line) of the surface of the recording element substrate 2 facing the first support member 3 is the first support. Since it is not joined to the member 3, a part of the resin film 9 of the recording element substrate 2 is exposed to the outside. When ink adheres to the exposed resin film 9, the resin film 9 may swell and be deformed or eluted, resulting in ink leakage. Therefore, as shown in FIG. 2B, in the present embodiment, the portion of the resin film 9 that is not bonded to the first support member 3 is bonded to the sealant 8 (which is resistant to corrosion against liquids such as ink). Cover with resin agent). As a result, it is possible to suppress the adhesion of ink to the edge portion 2a of the surface of the recording element substrate 2 facing the support member 3.

なお、図2に示すように、隙間11が外側(記録素子基板2と第1の支持部材3との接合部から離れる方向)へ向かって広がったような形状であることが好ましい。これにより、記録素子基板2の縁部2aと第1の支持部材3との間の隙間11に封止剤8が入り込みやすくなり、記録素子基板2の縁部2aの露出部分に対する封止剤8による良好な被覆が可能となるためである。このような形状は、例えば、第1の支持部材3の記録素子基板2と対向する面を構成する稜線の少なくとも一部をC面取り加工することで形成することができる。 As shown in FIG. 2, it is preferable that the gap 11 has a shape that widens toward the outside (direction away from the joint portion between the recording element substrate 2 and the first support member 3). As a result, the sealing agent 8 easily enters the gap 11 between the edge portion 2a of the recording element substrate 2 and the first support member 3, and the sealing agent 8 for the exposed portion of the edge portion 2a of the recording element substrate 2. This is because good coating is possible. Such a shape can be formed, for example, by C chamfering at least a part of the ridge line forming the surface of the first support member 3 facing the recording element substrate 2.

なお、封止剤8としては、液状のエポキシ樹脂、アクリル樹脂、エポキシアクリレート樹脂、イミド樹脂、アミド樹脂等を用いることが好ましい。また、この封止剤8は、記録素子基板2と第1の支持部材3との接合面を表面張力によって流動することで樹脂膜9の露出部分を被覆できるように、低粘度であることが望ましい。具体的には、封止剤8の粘度は、0.1〜100Pa・s程度が好ましく、1〜80Pa・s程度がより好ましい。また、封止剤8としては樹脂膜9よりも液体に対する腐食耐性が高い材料を用いることが好ましい。また、コストの観点から、記録素子基板2と配線基板5との電気接続部を封止する封止剤と共通の材料を用いることが好ましい。特に、電気接続部に2種の封止剤を用いる構成では、ワイヤー等の下側に設ける封止剤は粘度の低いものを用いるため、これと封止剤8とを共通の材料とすることが好ましい。 As the sealing agent 8, it is preferable to use a liquid epoxy resin, acrylic resin, epoxy acrylate resin, imide resin, amide resin or the like. Further, the sealant 8 has a low viscosity so that the exposed portion of the resin film 9 can be covered by flowing the joint surface between the recording element substrate 2 and the first support member 3 by surface tension. desirable. Specifically, the viscosity of the sealant 8 is preferably about 0.1 to 100 Pa · s, more preferably about 1 to 80 Pa · s. Further, as the sealing agent 8, it is preferable to use a material having higher corrosion resistance to liquid than the resin film 9. Further, from the viewpoint of cost, it is preferable to use a material common to the sealing agent that seals the electrical connection portion between the recording element substrate 2 and the wiring substrate 5. In particular, in a configuration in which two types of sealants are used for the electrical connection portion, since the sealant provided on the lower side of the wire or the like has a low viscosity, this and the sealant 8 should be used as a common material. Is preferable.

次に、封止剤8の塗布方法について説明する。記録素子基板2の露出する縁部2aを封止剤8で被覆するために、記録素子基板2の縁部2aと第1の支持部材3との間の隙間全域に封止剤8を塗布する方法が考えられる。しかし、このような微細な隙間部分に対してその全域にわたって封止剤8を直接塗布することは困難であり、高精細な塗布を実現するための装置が必要となるため、コストが高くなる懸念がある。 Next, a method of applying the sealant 8 will be described. In order to cover the exposed edge 2a of the recording element substrate 2 with the sealing agent 8, the sealing agent 8 is applied to the entire gap between the edge 2a of the recording element substrate 2 and the first support member 3. A method is conceivable. However, it is difficult to directly apply the sealant 8 to such a fine gap portion over the entire area, and a device for realizing high-definition coating is required, so that there is a concern that the cost will increase. There is.

また、隙間部分に対して封止剤8の必要量を数箇所に分けて点塗布する方法も考えられる。この方法では、封止剤8が表面張力によって隙間部分を流動し、複数箇所に分けられて塗布された封止剤8同士が流れて互いに合流して、記録素子基板2の縁部2aが封止剤8で被覆される。しかし、点塗布された封止剤8が隙間に対して左右方向のどちらに流動するかは不確定である。封止剤8が、隣接する一方側の箇所に塗布された封止剤8と先に接触すると、接触した側の方へ流れやすくなり、他方側へは流れにくくなる。そして、その封止剤8が隣接する他方側の箇所に塗布された封止剤8と繋がらずに、記録素子基板2の縁部2aにおいて封止剤8で被覆されずに露出した部分が残る恐れがある。そのため、露出部の有無を確認したり、露出部に対して封止剤8を別途塗布したりするなど、製造工程の負荷が増大する可能性がある。一方で、このような露出部の発生を防止するために封止剤8の量を増やすと、封止剤8がはみ出してしまい、記録素子基板2の不要な部分にも封止剤8が付着する恐れがある。 Further, it is also conceivable to apply the required amount of the sealing agent 8 to the gap portion by dividing it into several places and applying it in dots. In this method, the sealing agent 8 flows through the gap portion due to surface tension, and the sealing agents 8 which are divided and applied to a plurality of places flow and merge with each other, and the edge portion 2a of the recording element substrate 2 is sealed. It is coated with a stop agent 8. However, it is uncertain whether the point-coated sealant 8 flows in the left-right direction with respect to the gap. When the sealant 8 first comes into contact with the sealant 8 applied to the adjacent one-sided portion, it becomes easier to flow toward the contacted side and less likely to flow to the other side. Then, the sealing agent 8 is not connected to the sealing agent 8 applied to the adjacent other side portion, and an exposed portion remains without being covered with the sealing agent 8 at the edge portion 2a of the recording element substrate 2. There is a fear. Therefore, there is a possibility that the load on the manufacturing process may increase, such as checking the presence or absence of the exposed portion or separately applying the sealing agent 8 to the exposed portion. On the other hand, if the amount of the sealant 8 is increased in order to prevent the occurrence of such an exposed portion, the sealant 8 protrudes and the sealant 8 adheres to an unnecessary portion of the recording element substrate 2. There is a risk of doing.

そこで、本実施形態では、第1の支持部材3の側面に溝7を設けており、この溝7を利用して記録素子基板2の縁部2aを封止剤8で被覆する。図3は、図1(b)の領域Bの拡大図であり、図3(a)は溝7に封止剤8を塗布する前の状態を示し、図3(b)〜(d)は溝7に塗布した封止剤8が隙間11へ流れる様子を示す図である。 Therefore, in the present embodiment, a groove 7 is provided on the side surface of the first support member 3, and the edge 2a of the recording element substrate 2 is covered with the sealing agent 8 by using the groove 7. FIG. 3 is an enlarged view of the region B of FIG. 1 (b), FIG. 3 (a) shows a state before the sealant 8 is applied to the groove 7, and FIGS. 3 (b) to 3 (d) are shown. It is a figure which shows the state that the sealing agent 8 applied to a groove 7 flows into a gap 11.

溝7は、記録素子基板2の縁部2aの延在する方向(図3(a)の矢印C方向)に対して傾斜する方向に延びている。この溝7の内部に封止剤8を塗布すると(図3(b))、封止剤8は溝7の傾斜方向に沿って流れ、さらに溝7から記録素子基板2の縁部2aと第1の支持部材3との間の隙間11へ到達する。隙間11に到達した封止剤8は、その表面張力により隙間11内に留まって隙間11を流れる(図3(c))。この際、封止剤8は、溝7と隙間11とがなす角度(溝7と縁部2aとがなす角度)が鋭角である方向へは流れにくく、鈍角である方向へ流れやすくなる。そのため、隙間11に到達した後は、封止剤8は図3(c)の右側の方向へ流れやすくなる。そして、隙間11が封止剤8によって埋まり、上述した樹脂膜9を含む記録素子基板2の縁部2aが封止剤8によって被覆された状態となる。この状態では、溝7の一部に封止剤8が若干残るため、溝7の内部の封止剤8と隙間11に設けられた封止剤8とが繋がっている(図3(d))。 The groove 7 extends in a direction inclined with respect to the extending direction of the edge portion 2a of the recording element substrate 2 (direction of arrow C in FIG. 3A). When the sealing agent 8 is applied to the inside of the groove 7 (FIG. 3B), the sealing agent 8 flows along the inclination direction of the groove 7, and further, from the groove 7, the edge 2a of the recording element substrate 2 and the second It reaches the gap 11 between the support member 3 of 1 and the support member 3. The sealant 8 that has reached the gap 11 stays in the gap 11 due to its surface tension and flows through the gap 11 (FIG. 3 (c)). At this time, the sealing agent 8 is difficult to flow in the direction in which the angle formed by the groove 7 and the gap 11 (the angle formed by the groove 7 and the edge portion 2a) is an acute angle, and easily flows in the direction in which the angle is obtuse. Therefore, after reaching the gap 11, the sealing agent 8 tends to flow in the right direction of FIG. 3C. Then, the gap 11 is filled with the sealing agent 8, and the edge portion 2a of the recording element substrate 2 including the resin film 9 described above is covered with the sealing agent 8. In this state, since a small amount of the sealant 8 remains in a part of the groove 7, the sealant 8 inside the groove 7 and the sealant 8 provided in the gap 11 are connected (FIG. 3 (d)). ).

このように、記録素子基板2の縁部2aに対して傾斜する溝7を設け、この溝7から封止剤8を流すことで、溝7の傾斜を利用して所定の方向へ封止剤8を流すことができる。これにより、記録素子基板2の縁部2aと第1の支持部材3との間の隙間11を封止剤8が流れやすくなり、記録素子基板2の縁部2aを封止剤8で容易に被覆することができる。 In this way, by providing a groove 7 that is inclined with respect to the edge portion 2a of the recording element substrate 2 and flowing the sealing agent 8 through the groove 7, the sealing agent is directed in a predetermined direction by utilizing the inclination of the groove 7. 8 can be flowed. As a result, the sealant 8 can easily flow through the gap 11 between the edge portion 2a of the recording element substrate 2 and the first support member 3, and the edge portion 2a of the recording element substrate 2 can be easily formed by the sealant 8. Can be covered.

また、本実施形態のように、複数の溝7の傾斜の向きを揃えることで、溝7から隙間11に到達した封止剤8が一定の方向へ流れやすくなる。本実施形態では、一例として、幅1mm、ピッチ4mmで5本の溝7を傾斜角Dが45°程度となるように設けている。ここで、傾斜角とは、記録素子基板2の縁部2aの延在方向と溝7の延在方向とがなす角度のうちの鋭角の角度のことをいう。ここで、上述した鈍角側へ封止剤8が流れやすい現象を利用するためには、縁部2aの延在方向に対する溝7の傾斜角Dが70°以下であることが好ましい。また、溝7に封止剤8が溜まらずに溝7から隙間11へ向かって封止剤8を流れやすくするためには、傾斜角Dが20°以上であることが好ましい。なお、溝7の本数や幅、傾斜角などは本実施形態の構成に限定されず、封止剤8の塗布が必要な箇所の寸法や隙間の体積などに合わせて適宜溝7を設ければよい。 Further, by aligning the inclination directions of the plurality of grooves 7 as in the present embodiment, the sealing agent 8 that has reached the gap 11 from the grooves 7 can easily flow in a certain direction. In the present embodiment, as an example, five grooves 7 having a width of 1 mm and a pitch of 4 mm are provided so that the inclination angle D is about 45 °. Here, the inclination angle refers to an acute angle among the angles formed by the extending direction of the edge portion 2a of the recording element substrate 2 and the extending direction of the groove 7. Here, in order to utilize the above-mentioned phenomenon that the sealing agent 8 easily flows to the obtuse angle side, it is preferable that the inclination angle D of the groove 7 with respect to the extending direction of the edge portion 2a is 70 ° or less. Further, in order to facilitate the flow of the sealant 8 from the groove 7 toward the gap 11 without accumulating the sealant 8 in the groove 7, the inclination angle D is preferably 20 ° or more. The number, width, inclination angle, etc. of the grooves 7 are not limited to the configuration of the present embodiment, and the grooves 7 may be provided as appropriate according to the dimensions of the portion where the sealant 8 needs to be applied, the volume of the gap, and the like. good.

なお、本実施形態のように複数の溝7を設ける構成は、隣接する封止剤8同士が繋がりやすくなるため、記録素子基板2の縁部2aと第1の支持部材3との間の隙間11の全域にわたってより容易に封止剤8が流れやすくなるため、好ましい。また、塗布された封止剤8が泡を抱き込みにくくするために、溝7をR形状とすることが好ましい。 In the configuration in which the plurality of grooves 7 are provided as in the present embodiment, the adjacent sealing agents 8 can be easily connected to each other, so that the gap between the edge portion 2a of the recording element substrate 2 and the first support member 3 is provided. This is preferable because the sealing agent 8 can easily flow over the entire area of 11. Further, in order to make it difficult for the applied sealing agent 8 to embrace bubbles, it is preferable that the groove 7 has an R shape.

図4に本実施形態の変形例を示す。図4はインクジェット記録ヘッド1の側面図を示しており、図1(b)に対応する図である。図4(a)は、溝7の傾斜の向きや角度が溝7の位置によって異なっている。具体的には、複数の溝7が記録素子基板2の縁部2aの延在方向における中央部に向かって傾くように溝7を設けている。このような構成は、中央部において封止剤8によって被覆されない部分が発生しやすい場合に有利である。図4(b)は、溝7の幅が隙間11に向かって細くなるような形状となっており、このような形状により、封止剤8を溝7から隙間11へ流れやすくすることができる。 FIG. 4 shows a modified example of this embodiment. FIG. 4 shows a side view of the inkjet recording head 1, and is a view corresponding to FIG. 1 (b). In FIG. 4A, the direction and angle of inclination of the groove 7 differ depending on the position of the groove 7. Specifically, the grooves 7 are provided so that the plurality of grooves 7 are inclined toward the central portion in the extending direction of the edge portion 2a of the recording element substrate 2. Such a configuration is advantageous when a portion not covered by the sealant 8 is likely to occur in the central portion. FIG. 4B has a shape in which the width of the groove 7 narrows toward the gap 11, and such a shape makes it easier for the sealant 8 to flow from the groove 7 to the gap 11. ..

また、溝7から隙間11へと封止剤8が流れやすくなるように、記録素子基板2と第1の支持部材3とが接合されたワークを記録素子基板2の表面(第1の支持部材との対向面の裏面)が下側を向いた姿勢で、溝7に封止剤8を塗布することが好ましい。また、溝7に対してニードル12から封止剤8を塗布しやすいように、記録素子基板2の表面が水平状態から傾いた姿勢で封止剤8を塗布することが好ましい(図5)。そのため、記録素子基板2の表面が30°以上60°以下で傾いた姿勢として、溝7に封止剤8を塗布することがより好ましく、その表面が45°程度傾いた姿勢で塗布することがさらに好ましい。 Further, the work in which the recording element substrate 2 and the first support member 3 are joined is placed on the surface of the recording element substrate 2 (first support member) so that the sealant 8 can easily flow from the groove 7 to the gap 11. It is preferable to apply the sealant 8 to the groove 7 in a posture in which the back surface of the surface facing the surface of the groove 7 faces downward. Further, it is preferable to apply the sealant 8 to the groove 7 in a posture in which the surface of the recording element substrate 2 is tilted from the horizontal state so that the sealant 8 can be easily applied from the needle 12 (FIG. 5). Therefore, it is more preferable to apply the sealant 8 to the groove 7 in a posture in which the surface of the recording element substrate 2 is tilted at 30 ° or more and 60 ° or less, and it is possible to apply the sealing agent 8 in a posture in which the surface is tilted by about 45 °. More preferred.

なお、封止剤8を塗布した後には熱処理によって封止剤8を硬化する。この硬化工程では、記録素子基板2の表面が下側を向いた状態(水平状態)とすることが好ましい。傾いた姿勢のまま熱硬化を行うと、重力で下方向に封止剤8が流動して、封止剤8で所望の領域を被覆できなかったり、不要な箇所に封止剤8が付着したりする恐れがあるためである。 After applying the sealant 8, the sealant 8 is cured by heat treatment. In this curing step, it is preferable that the surface of the recording element substrate 2 faces downward (horizontal state). If thermosetting is performed in an inclined posture, the sealing agent 8 flows downward due to gravity, and the sealing agent 8 cannot cover the desired region, or the sealing agent 8 adheres to unnecessary parts. This is because there is a risk of it.

1 インクジェット記録ヘッド
2 記録素子基板
3 第1の支持部材
7 溝
8 封止剤
9 樹脂膜
10 接着剤
1 Inkjet recording head 2 Recording element substrate 3 First support member 7 Groove 8 Encapsulant 9 Resin film 10 Adhesive

Claims (9)

液体を吐出するためのエネルギーを液体に付与する素子を備えた素子基板と、
接着剤を介して前記素子基板が接合された支持部材と、
を有する液体吐出ヘッドにおいて、
前記素子基板の前記支持部材と対向する面の縁部は、前記接着剤を介して前記支持部材と接合されておらず、前記素子基板の前記縁部と前記支持部材との間の隙間には、前記素子基板の前記縁部を被覆するように樹脂剤が設けられており、
前記支持部材の側面には、前記素子基板の前記縁部の延在する方向に対して傾斜する方向に延びる溝が設けられており、
前記樹脂剤は、前記溝の内部から前記隙間に繋がるように設けられていることを特徴とする液体吐出ヘッド。
An element substrate provided with an element that imparts energy for discharging the liquid to the liquid, and
With the support member to which the element substrate is bonded via an adhesive,
In the liquid discharge head having
The edge of the surface of the element substrate facing the support member is not joined to the support member via the adhesive, and in the gap between the edge portion of the element substrate and the support member. , A resin agent is provided so as to cover the edge portion of the element substrate.
A groove extending in a direction inclined with respect to the extending direction of the edge portion of the element substrate is provided on the side surface of the support member.
A liquid discharge head characterized in that the resin agent is provided so as to be connected to the gap from the inside of the groove.
前記支持部材の前記側面には、複数の前記溝が設けられている、請求項1に記載の液体吐出ヘッド。 The liquid discharge head according to claim 1, wherein a plurality of the grooves are provided on the side surface of the support member. 前記複数の溝は互いに傾斜する向きが揃っている、請求項2に記載の液体吐出ヘッド。 The liquid discharge head according to claim 2, wherein the plurality of grooves are oriented so as to incline with each other. 前記縁部の延在する方向に対する前記溝の傾斜角が70°以下である、請求項1乃至請求項3のいずれか一項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 3, wherein the inclination angle of the groove with respect to the extending direction of the edge portion is 70 ° or less. 前記縁部の延在する方向に対する前記溝の傾斜角が20°以上である、請求項1乃至請求項4のいずれか一項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 4, wherein the inclination angle of the groove with respect to the extending direction of the edge portion is 20 ° or more. 前記素子基板は、前記支持部材と対向する面に樹脂膜を備えており、
前記樹脂剤は、前記素子基板の前記縁部に位置する前記樹脂膜を被覆している、請求項1乃至請求項5のいずれか一項に記載の液体吐出ヘッド。
The element substrate is provided with a resin film on a surface facing the support member.
The liquid discharge head according to any one of claims 1 to 5, wherein the resin agent covers the resin film located at the edge portion of the element substrate.
前記隙間は、前記素子基板と前記支持部材との接合部から離れる方向へ向かって広がっている、請求項1乃至請求項6のいずれか一項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 6, wherein the gap widens toward a direction away from the joint portion between the element substrate and the support member. 液体を吐出するためのエネルギーを液体に付与する素子を備えた素子基板と、
接着剤を介して前記素子基板が接合された支持部材と、
を有する液体吐出ヘッドの製造方法において、
前記素子基板の前記支持部材と対向する面の縁部は、前記接着剤を介して前記支持部材と接合されておらず、
前記支持部材の側面には、前記素子基板の前記縁部の延在する方向に対して傾斜する方向に延びる溝が設けられており、
前記溝に樹脂剤を塗布し、前記溝から前記素子基板の前記縁部と前記支持部材の間の隙間に前記樹脂剤を流すことを特徴とする液体吐出ヘッドの製造方法。
An element substrate provided with an element that imparts energy for discharging the liquid to the liquid, and
With the support member to which the element substrate is bonded via an adhesive,
In the method of manufacturing a liquid discharge head having
The edge of the surface of the element substrate facing the support member is not joined to the support member via the adhesive.
A groove extending in a direction inclined with respect to the extending direction of the edge portion of the element substrate is provided on the side surface of the support member.
A method for manufacturing a liquid discharge head, which comprises applying a resin agent to the groove and flowing the resin agent from the groove into a gap between the edge portion of the element substrate and the support member.
前記素子基板の前記支持部材と対向する面の裏面が下側を向いて傾いた状態で、前記溝に前記樹脂剤を塗布する、請求項8に記載の液体吐出ヘッドの製造方法。 The method for manufacturing a liquid discharge head according to claim 8, wherein the resin agent is applied to the groove in a state where the back surface of the element substrate facing the support member is tilted downward.
JP2020045741A 2020-03-16 2020-03-16 Liquid discharge head and method for manufacturing the same Pending JP2021146525A (en)

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