JP2022019337A - Liquid ejection head, and method for manufacturing the same - Google Patents

Abstract

To provide a liquid ejection head in which occurrence of holding of air when applying a sealing agent is suppressed.SOLUTION: A method for manufacturing a liquid ejection head having: an element substrate 10 equipped with an ejection element for ejecting liquid; an electric wiring substrate 20 equipped with a terminal which is electrically connected with the element substrate in the vicinity of an end part; a support member 30 equipped with a support face which supports the electric wiring substrate via an adhesive agent. In a process of laminating the electric wiring substrate and the support face, the electric wiring substrate and the support member are relatively moved in a direction where a protruded amount becomes smaller than an amount at which an end part 23 of the electric wiring substrate is protruded from an edge part 31a of the support face.SELECTED DRAWING: Figure 6

Description

The present invention relates to a liquid discharge head that discharges a liquid and a method for manufacturing the same.

In Patent Document 1, regarding the liquid discharge head, when the electric wiring board is arranged on the support member via the adhesive, the end portion of the electric wiring board is provided so that the adhesive does not crawl on the upper surface of the electric wiring board. A configuration is disclosed in which an electrical wiring board is arranged so as to be overhanging. Further, it is disclosed that after that, wire bonding using a wire is performed for the electric connection between the element substrate and the electric wiring board, and the periphery of the electric connection portion including the wire is covered with a sealing agent.

Japanese Unexamined Patent Publication No. 2012-16864

However, as shown in FIG. 10, if the end portion 23 of the electrical wiring board 20 overhangs the edge portion 31a of the support member 30, the following problems arise when the sealing agent 51 is subsequently applied. That is, it becomes difficult for the sealant 51 to wrap around under the overhanging portion of the end portion 23 of the electrical wiring board 20, and the sealant 51 may hold air (air bubbles) inside. Furthermore, when this air moves to the vicinity of the electrical connection, dew condensation may occur inside the air due to changes in the environment in which the liquid discharge head is used, which may cause corrosion of the electrical connection. It may impair proper electrical connectivity.

Therefore, an object of the present invention is to suppress the occurrence of air holding when applying the sealant.

The method for manufacturing a liquid discharge head of the present invention is via an element substrate provided with a discharge element for discharging liquid, an electrical wiring substrate provided with terminals electrically connected to the element substrate in the vicinity of the end portion, and an adhesive. In a method of manufacturing a liquid discharge head having a support member having a support surface for supporting the electric wiring board, the end portion of the electric wiring board protrudes with respect to an edge portion of the support surface. The step of superimposing the electric wiring board and the support surface via the adhesive, and the element board arranged on the side of the support surface and the terminal of the electric wiring board are electrically connected to each other to form an electric connection portion. The end portion of the electrical wiring board is covered in the stacking step after the stacking step and before the covering step. It is characterized by having a step of relatively moving the electric wiring substrate and the support member in a direction in which the amount of protrusion is smaller than the amount of protrusion of the support surface with respect to the edge portion.

According to the present invention, it is possible to suppress the occurrence of air holding when applying the sealant.

It is a figure which shows the liquid discharge unit before the sealant is applied in 1st Embodiment. It is a figure which shows by separating the liquid discharge unit in 1st Embodiment. It is a figure which shows the liquid discharge unit coated with the sealant in 1st Embodiment. It is a figure which shows the liquid discharge unit before the wire bonding is performed in 1st Embodiment. It is a figure which shows the finger for mounting the electric wiring board in 1st Embodiment. FIG. 5 is a sectional view taken along the line AA for explaining the manufacturing process in the first embodiment. It is a flowchart for demonstrating the manufacturing process in 1st Embodiment. FIG. 5 is a sectional view taken along the line AA for explaining the manufacturing process in the first embodiment. It is a flowchart for demonstrating the manufacturing process in 2nd Embodiment. It is a figure for demonstrating a problem. FIG. 5 is a sectional view taken along the line AA showing a modified example of the first embodiment. FIG. 3 is a cross-sectional view taken along the line AA in the first embodiment. It is a top view for demonstrating the manufacturing process in 3rd Embodiment. It is a flowchart for demonstrating the manufacturing process in 3rd Embodiment. FIG. 5 is a sectional view taken along the line AA for explaining the manufacturing process in the fourth embodiment. It is a figure which shows the liquid discharge head.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment)
1 to 4 are views showing a liquid discharge unit as a part of the liquid discharge head 1 (FIG. 16) of the first embodiment to which the present invention can be applied. The liquid discharge head 1 shown in FIG. 16 is a line-type head in which a plurality of liquid discharge units 102 are arranged side by side on a long support member, but the present invention is not limited thereto. In addition to the liquid discharge unit 102, the liquid discharge head 1 has an electrical connection component for transmitting an electric signal to the liquid discharge unit 102, a liquid supply component for supplying liquid to the liquid discharge unit 102, and the like, but the illustration is not shown. Omit.

FIG. 1 is a schematic perspective view of the liquid discharge unit 101 in a state before the sealant 52 (FIG. 3) is applied. The liquid discharge unit 101 mainly has an element substrate 10, an electric wiring board 20, and a support member 30. FIG. 2 shows each member of the element substrate 10, the electric wiring board 20, and the support member 30 separately. FIG. 3 is a schematic perspective view of the liquid discharge unit 102 showing a state in which the electrical connection portion between the element substrate 10 and the electrical wiring board 20 is covered with the sealant 52. FIG. 4 is a top view of the liquid discharge unit 100 in a state before electrical connection between the element substrate 10 and the electrical wiring board 20. Hereinafter, each configuration will be described in detail.

First, the element substrate 10 will be described.

The element substrate 10 includes a silicon substrate having a thickness of 0.6 mm to 0.8 mm, an electric heat converter (not shown) as a plurality of ejection elements arranged on one side of the silicon substrate, and an electric heat converter and electrical. Includes electrical wiring (not shown) connected to. Hereinafter, the surface of the silicon substrate on which the electric heat converter is arranged is also referred to as a “front surface”.

The electric wiring supplies electric power to the electric heat converter, and the electric heat converter applies electric power to the liquid such as ink by using the electric power applied from the electric wiring to discharge the liquid. The electrical wiring is formed on a silicon substrate using, for example, film forming technology. Further, the element substrate 10 is for supplying liquid to a plurality of discharge ports 12 corresponding to the above-mentioned electric heat converter, a plurality of liquid flow paths communicating with the discharge ports 12, and the plurality of liquid flow paths. Includes a liquid supply path. The liquid supply path is formed by a hole penetrating between the front surface of the silicon substrate and the back surface on the opposite side of the front surface. The plurality of discharge ports 12 and the plurality of liquid channels are formed on a silicon substrate by photolithography technology.

Electrode terminals 11 connected to electrical wiring provided on the element substrate 10 are arranged side by side along the X direction on one side of the front surface of the element substrate 10. The electrode terminal 11 is preferably gold-plated from the viewpoint of flatness, resistance during electric signal transmission, and the like. Wire bonding is performed on these electrode terminals 11 to connect them to the electrical wiring board 20. The electrical connection between the electrode terminal 11 and the electrical wiring board 20 is not limited to wire bonding.

Next, the electric wiring board 20 will be described.

The electric wiring board 20 is a flexible substrate having a thickness of 0.1 mm to 0.2 mm, which is formed by sandwiching a conductive copper foil printed wiring between two thin and soft insulating polyimide films and laminating them.

Of the two polyimide films to be bonded, one polyimide film is made smaller than the other polyimide film and bonded, so that both ends of the copper foil printed wiring in the Y direction are exposed. There is. A plurality of copper foil printed wirings are arranged side by side along the X direction, and both exposed ends of the copper foil printed wiring form electrode terminals 21 and 22, respectively (FIG. 2). The electrode terminal 21 is arranged in the vicinity of the end portion 23 of the electrical wiring board 20 on the element board 01 side. Hereinafter, the surface on which the electrode terminals 21 are arranged is also referred to as a “top surface” of the electrical wiring board 20. The electrode terminal 21 is connected to the electrode terminal 11 of the element substrate 10 via a wire, and the electrode terminal 22 is connected to an external device (not shown) for transmitting an electric signal.

Next, the support member 30 will be described.

The support member 30 is a component provided with a flow path structure that serves as a base for joining the element substrates 10 and a path for supplying the discharged liquid from the liquid supply component to the element substrate 10. In the support member 30, the element substrate 10 and the electrical wiring substrate 20 are fixed to the support surface 30a using an adhesive 33.

The support member 30 is not particularly limited in shape and material as long as it has a size that allows the element substrate 10 and the electric wiring board 20 to be mounted, and can be widely selected from resins, ceramics, metals, and the like. In the present embodiment, since the element substrate 10 and the electric wiring board 20 are fixed on the support member 30 by using a thermosetting adhesive, it is preferable to use an alumina plate having excellent heat resistance.

In order to prevent the adhesive 33 from creeping up on the electrode terminal 21 on the upper surface of the electric wiring board 20 when the support member 30 and the electric wiring board 20 are joined to the support member 30 via the adhesive 33. The groove 31 is formed. The adhesive 33 crawls by stacking the electric wiring board 20 and the support member 30 via the adhesive 33 so that the end portion 23 of the electric wiring board 20 provided with the electrode terminals 21 projects over the groove 31. The risk of rising and adhering to the electrode terminal 21 can be reduced. As for the shape of the groove 31, for example, it is desirable that the width in the X direction is equal to or larger than the width of the electric wiring board 20, the width in the Y direction is about 0.5 mm, and the groove depth in the Z direction is about 0.4 mm. The width of X and Y may be larger than this, but it is preferably set to the above-mentioned level because the area of the wire bonding and the electrical connection portion described later may increase and the size may increase.

The configuration for suppressing the creeping up of the adhesive 33 is not limited to the configuration in which the groove 31 is provided in the support member 30, and the end of the electric wiring board 20 with respect to the edge portion 31a of the support surface 30a coated with the adhesive 33. The electrical wiring board 20 and the support member 30 may be overlapped with each other so that the portion 23 projects. For example, as shown in FIG. 11, the support surface 30a that supports the electric wiring board 20 may form a step that is higher than the other surface.

Next, the finger 60 will be described with reference to FIG.

The finger 60 is used when the electrical wiring board 20 is attracted (grasped) and placed on the support member 30. The suction surface 61 of the finger 60 is a surface for sucking the element substrate 10, and a plurality of suction holes 62 for sucking the element substrate 10 are formed on the suction surface 61, and the suction surface is sucked from the suction holes 62. The electrical wiring board 20 is attracted to and gripped by 61.

The fingers 60 have a Z-axis (not shown) for pressing the electrical wiring board 20, and an X-axis, a Y-axis, and a θ-axis (not shown) for moving the XY position of the electrical wiring board 20 to an appropriate position. Includes a movable axis. When the adhesive 33 uses a thermosetting adhesive, the adhesive 33 may be cured by providing the finger 60 with a heat source.

Next, among the steps of manufacturing the liquid discharge head unit, a step of joining the electric wiring substrate 20 and the support member 30 via the adhesive 33 will be described. FIG. 6 is a diagram for explaining the joining between the electric wiring board 20 and the support member 30 in the cross section of the line AA shown in FIG. FIG. 7 is a flowchart for explaining a process of joining the electric wiring board 20 and the support member 30.

First, as shown in FIG. 6A, the adhesive 33 is applied to the support surface 30a of the support member 30 to which the element substrate 10 is previously fixed via the adhesive 32. At this time, it is preferable to apply the adhesive 33 so that the adhesive 33 is provided at a position overlapping with the electrode terminal 21 of the electric wiring board 20. If the adhesive 33 is not provided directly below (lower side) of the electrode terminal 21, a space is created between the electrode terminal 21 of the electrical wiring board 20 and the support member 30. If wire bonding for connecting the element substrate 10 and the electrical wiring board 20 is performed later in this state, the ultrasonic energy may be dispersed in the space and the wire bonding may be affected. By providing the adhesive 33 on the lower side of the electrode terminal 21 as described above, wire bonding can be performed satisfactorily. In the present embodiment, the adhesive 33 is applied to the vicinity of the edge portion 31a of the support surface 30a as shown in FIG. 6A.

Next, the operation of placing the electric wiring board 20 gripped by the finger 60 on the support member 30 is started on the support member 30 to which the adhesive 33 for fixing the electric wiring board 20 is applied. First, in step S101, the electrical wiring board 20 is moved to a predetermined position in the XY directions. At this time, the end portion 23 of the electric wiring board 20 is moved to a position so as to project (project) from the edge portion 31a of the support surface 30a of the support member 30 in the Y direction. As a result, when the electric wiring board 20 is pressed against the support member 30, the adhesive 33 can be prevented from creeping up to the electrode terminals 21 of the electric wiring board 20. For example, in the present embodiment, the target position of XY of the electric wiring board 20 is set to the center position of the width in the Y direction and the width in the X direction of the groove 31, respectively (FIG. 6A). Further, the target position in step S101 is a position in consideration of a predetermined amount of movement of S104 in the Y direction, which is performed later.

After that, in step S102, the Z axis of the finger 60 is lowered to bring the electric wiring board 20 and the support member 30 into contact with each other via the adhesive 33, and in step S103, the electric wiring board 20 is pressed against the support member 30 by the finger 60. (FIG. 6 (b)). Since the adhesive 33 is applied to the vicinity of the edge portion 31a of the support surface 30a as described above, the pressed adhesive 33 covers at least a part of the edge portion 31a.

Next, in a state where the electric wiring board 20 is being held and pressed by the finger 60, the Y axis of the finger 60 is moved in a direction away from the element substrate 10 in step S104, and the electric wiring board 20 is moved along the Y direction. Move it (Fig. 6 (c)). This movement reduces the amount of protrusion of the electrical wiring board 20 overhanging the groove 31 in the Y direction. By reducing the amount of overhanging of the electric wiring board 20 in the Y direction, it is possible to prevent the sealant 51 to be applied later from becoming difficult to wrap around due to the overhanging of the electric wiring board 20.

At this time, the electric wiring board 20 and the support member 30 may be relatively moved so that the amount of protrusion in the Y direction with respect to the groove 31 of the end portion 23 of the electric wiring board 20 is small. Further, the electric wiring board 20 and the support member 30 may be relatively moved so that the distance between the end portion 23 of the electric wiring board 20 and the element board 10 facing the end portion 23 is widened. For example, the Y-axis of the movable stage (not shown) holding the support member 30 may be moved. Alternatively, instead of moving by the finger 60, the electric wiring board 20 may be gripped and moved by a clamp 70 or the like of another mechanism of FIG.

Further, since the amount of protrusion of the electric wiring board 20 in the Y direction may be reduced, the relative position between the end portion 23 of the electric wiring board 20 and the edge portion 31a of the groove 31 with respect to the Y direction after movement is particularly limited. It's not a thing. For example, the end portion 23 of the electrical wiring board 20 may be in a state of protruding toward the element substrate 10 from the edge portion 31a of the groove 31 after the movement. In order to further reduce the possibility that the wraparound of the sealant 51 is hindered by the overhanging of the electric wiring board 20, the end portion 23 of the electric wiring board 20 overhangs the edge portion 31a of the groove 31 after the movement. It is preferable that there is no state (FIGS. 6 (c) and 6 (e)). Further, when the distance between the electrode terminal 11 of the element substrate 10 and the electrode terminal 21 of the electric wiring board 20 becomes large, the length of the wire 40 and the amount of the sealing agent required increase. Considering this, it is more preferable that the end portion 23 of the electric wiring board 20 and the edge portion 31a of the groove 31 are aligned in the Y direction (FIG. 6 (c)). After the movement is completed, the adhesive 33 is cured by, for example, thermosetting to fix the electric wiring board 20 and the support member 30.

After that, the suction of the finger 60 is stopped in step S105, and the Z-axis of the finger is raised in step S106 to separate the finger 60 and the electrical wiring board 20 (FIG. 6 (d)). This completes the operation of placing and fixing the electrical wiring board 20 on the support member 30.

Next, from the electrical connection step between the element substrate 10 and the electrical wiring board 20, the step of applying the sealant to the periphery including the electrical connection portion will be described. FIG. 8 is a diagram for explaining from the electrical connection step to the sealant coating step in the cross section taken along the line AA shown in FIG.

With the element substrate 10 and the electrical wiring substrate 20 arranged with respect to the support member 30, the electrode terminals 11 of the element substrate 10 and the electrode terminals 21 of the electrical wiring substrate 20 are electrically connected by wire bonding with wires. An electrical connection is formed (FIG. 8 (a)). Here, the electrical connection portion includes the electrode terminal 11 of the element substrate 10, the electrode terminal 21 of the electrical wiring board 20, and the wire 40 connecting these.

In FIG. 1, 14 wires 40 are illustrated for convenience. Actually, depending on the size of the element substrate 10, about 50 to 200 wires 40 are arranged at intervals of about 50 μm to 200 μm, and the electrode terminal 11 of the element substrate 10 and the electrode terminal 21 of the electric wiring board 20 are connected. is doing.

The material of the wire is not particularly limited, such as gold, silver, copper, and aluminum, but it is preferable to use a gold wire because of its corrosion resistance and resistance during electric signal transmission. The wire diameter is also not particularly limited, but a general bonding wire having a diameter of 20 to 35 μm on the market can be used.

Next, the space below the wire 40 is filled with the first sealant 51. As the first encapsulant 51, it is preferable to use a curable liquid resin, and examples thereof include an epoxy resin, an acrylic resin, an epoxy acrylate resin, an imide resin, and an amide resin. Examples of the curing method include a wide range of curing methods such as two-component mixed curing in which a curing agent is mixed, thermal curing by heating, and UV curing by ultraviolet irradiation. Further, in order to fill the space under the wire 40, it is preferable to select a liquid resin having a viscosity of 10 to 100 Pa · s. This is because when the viscosity is 100 Pa · s or less, the sealing agent 51 easily flows into the space below the wire and fills the space easily. Further, when the viscosity is 10 Pa · s or more, when the sealant 51 is later coated with the second sealant 52, the weight of the second sealant 52 causes the first sealant 51 to change. This is because the risk of being swept away can be suppressed. For filling the space under the wire 40 using the first sealant 51, it is easy to apply by the dispense method.

Specifically, the coating position is determined on the upper portion of the wire 40a at the end, and the dispenser is scanned in the Y direction at the end opposite to the wire to apply the first sealant 51. Then, as shown in FIG. 8B, the encapsulant 51 gradually advances under the wire through each component constituting the space such as the support member 30, the element substrate 10, the electric wiring board 20, and the wire 40. Finally, the filling of the lower space of the wire 40 is completed. When the first sealant 51 is filled, the air originally existing in the space is pushed out and escapes from the gap between the adjacent wires 40. In step S104 described above, the amount of the electrical wiring board 20 overhanging the groove 31 is reduced, or the sealant 51 fills the space for the structure that does not overhang, so that the sealant is applied when the sealant is applied. It is possible to suppress the occurrence of air holding.

Next, the second sealant 52 is applied and coated on the upper part of the wire 40 (FIG. 8 (c)). The second sealant 52 covers the upper part of the wire 40 to insulate and protect it, and like the first sealant 51, a liquid epoxy resin, acrylic resin, epoxy acrylate resin, imide resin, etc. An amide resin or the like can be used. The viscosity of the second sealant 52 is preferably 100 to 500 Pa · s. This is because if the viscosity is within this range, when the upper side of the wire 40 is scanned and applied, the viscosity can be kept in place without flowing down.

(Second embodiment)
In the first embodiment, the electric wiring board 20 is pressed against the support member 30 once, but in the present embodiment, the electric wiring board 20 is pressed a plurality of times. The same points as in the first embodiment will be omitted.

FIG. 9 is a flowchart for explaining a process of joining the electric wiring board 20 and the support member 30 in the present embodiment. In step S201, when the electric wiring board 20 of FIG. 6B described above is pressed against the support member 30, the first pressing is performed with a lower load (first load) than originally required, and in step S104, electricity is applied. The wiring board 20 and the support member 30 are relatively moved along the Y direction. As a result, the electric wiring board 20 is moved in a state where the frictional resistance is low, so that the electric wiring board 20 can be moved with high movement followability. Then, in step S202, the second pressing is performed by the finger 60 with a second load (a load having a predetermined required pressure) which is a load larger than the load in the first pressing. Then, after step S105, the same procedure as that of the first embodiment is advanced and ended.

(Third embodiment)
In this embodiment, the method of moving the electrical wiring board 20 in step S104 is different from the above-described embodiment. The same points as in the first embodiment will be omitted.

13 (a) is a top view of the liquid discharge unit before electrical connection between the element substrate 10 and the electrical wiring board 20, and FIGS. 13 (b) to 13 (e) are FIGS. 13 (a). It is an enlarged view of the area B shown in. FIG. 14 is a flowchart for explaining a process of joining the electric wiring board 20 and the support member 30 in the present embodiment.

In step S301, the position of the electrical wiring board 20 is detected by the alignment camera 80 (FIG. 5). The electrical wiring board 20 may be displaced by XY due to the influence of pressing or the like, or may be displaced due to a change in the Z finger Z position due to the assembly accuracy of the mechanical configuration (FIG. 13 (b)). At that time, in step S302, the amount of deviation from the original target position is calculated, and the position is corrected. In step S303, it is determined whether the θ deviation amount is within the predetermined standard range, and if the θ deviation amount is equal to or more than the standard, the θ movement of the electrical wiring board 20 is repeated in step S304 until the standard is reached (FIG. 13). (C)). Similarly, the X deviation amount is determined in step S305, corrected in step S306, and if the X deviation amount is equal to or greater than the standard, the movement of the electrical wiring board 20 is repeated until the standard is reached (FIG. 13 (d)). .. Finally, the electric wiring board 20 is moved in the Y direction in step S104 by combining the correction of the amount of deviation in the Y direction in step S302 and the amount of reducing the amount of protrusion of the electric wiring board 20 to the groove 31 (FIG. 13 (e)). Then, after step S105, the same procedure as that of the first embodiment is advanced and ended.

As a result, it is possible to correct the positional deviation due to pressing and the change in the Z position of the finger 60, so that the electrical wiring board 20 can be arranged with high accuracy.

(Fourth Embodiment)
In this embodiment, the method of pressing and moving the electric wiring board 20 is different from the above-described embodiment. The same points as in the first embodiment will be omitted.

FIG. 15 is a diagram for explaining the joining of the electric wiring board 20 and the support member 30 in the present embodiment in the cross section taken along the line AA shown in FIG. Before pressing the electric wiring board 20, a finger 60 having a θ axis that can rotate θ in the YZ direction is rotated by θ so that the electrode terminal 21 side of the electric wiring board 20 is lowered (FIG. 15A). In this state, as shown in S101 to S103 of FIG. 7, the electric wiring board 20 is XY-moved to the target position and pressed against the support member 30 (FIG. 15 (b)). After that, the finger 60 is rotated by θ in the YZ direction starting from the tangent line between the electric wiring board 20 and the edge portion 31a of the support surface of the support member 30 while being pressed, and the support member 30 and the electric wiring board 20 are subjected to θ rotation. Rotate until the top surfaces are parallel (FIG. 15 (c)). After that, the electric wiring board 20 and the support member 30 are relatively moved along the Y direction in the same manner as in the first embodiment. As a result, the amount of the adhesive 33 protruding into the groove 31 can be reduced as compared with the first embodiment as compared with the above-described embodiment.

1 Liquid discharge head 10 Element board 11 Electrode terminal 20 Electrical wiring board 21 Electrode terminal 23 End of electrical wiring board 30 Support member 31a Edge of support surface 33 Adhesive 51 Sealant 102 Liquid discharge unit

Claims (7)

An element substrate provided with a discharge element for discharging liquid, an electric wiring board having a terminal electrically connected to the element substrate in the vicinity of an end portion, and a support surface for supporting the electric wiring board via an adhesive. In a method of manufacturing a liquid discharge head having a support member and the like.
A step of superimposing the electric wiring board and the support surface via the adhesive so that the end portion of the electric wiring board projects with respect to the edge portion of the support surface.
A step of electrically connecting the element board arranged on the support surface side and the terminal of the electric wiring board to form an electric connection portion.
The process of covering the electrical connection with a sealant and
Have,
After the stacking step and before the covering step, the protruding amount is smaller than the amount at which the end portion of the electrical wiring board protrudes from the edge portion of the support surface in the stacking step. A method for manufacturing a liquid discharge head, which comprises a step of relatively moving the electric wiring board and the support member in a direction. The method for manufacturing a liquid discharge head according to claim 1, wherein the step of relatively moving the electric wiring board and the support member in a pressed state is performed. In the relative movement step, the electric wiring board and the support member are pressed by the first load, and the electric wiring board is pressed against the support member.
The method for manufacturing a liquid discharge head according to claim 2, wherein after the step of relative movement, the electric wiring board and the support member are pressed with a second load larger than the first load. The method for manufacturing a liquid discharge head according to any one of claims 1 to 3, wherein the step of relative movement is performed before the step of forming the electrical connection portion. The element substrate is arranged so as to face the end portion of the electric wiring board in the protruding direction of the end portion of the electric wiring board.
The method for manufacturing a liquid discharge head according to any one of claims 1 to 4, wherein in the step of relative movement, the distance between the end portion of the electric wiring board and the element board is widened. In the relative movement step, the end portion of the electric wiring board and the edge portion of the support surface are aligned with each other in the protruding direction, or the edge portion of the support surface is the edge portion of the electric wiring board. The method for manufacturing a liquid discharge head according to any one of claims 1 to 5, wherein the liquid discharge head is relatively moved so as to project from the end portion. An element substrate provided with a discharge element for discharging liquid, an electric wiring board provided with terminals electrically connected to the element substrate in the vicinity of the end on the side of the element substrate, and the electrical wiring via an adhesive. In a liquid discharge head having a support member having a support surface for supporting the substrate, and a sealant covering an electrical connection portion to which the terminal of the element substrate and the terminal of the electrical wiring board are electrically connected.
The edge portion of the support surface projects toward the element substrate with respect to the end portion of the electrical wiring board.
A liquid discharge head, characterized in that at least a part of the edge portion of the support surface is covered with the adhesive.

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