JP2021142214A5 - - Google Patents
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- Publication number
- JP2021142214A5 JP2021142214A5 JP2020044026A JP2020044026A JP2021142214A5 JP 2021142214 A5 JP2021142214 A5 JP 2021142214A5 JP 2020044026 A JP2020044026 A JP 2020044026A JP 2020044026 A JP2020044026 A JP 2020044026A JP 2021142214 A5 JP2021142214 A5 JP 2021142214A5
- Authority
- JP
- Japan
- Prior art keywords
- special
- electronic components
- board
- control board
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020044026A JP7423000B2 (ja) | 2020-03-13 | 2020-03-13 | 遊技機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020044026A JP7423000B2 (ja) | 2020-03-13 | 2020-03-13 | 遊技機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021142214A JP2021142214A (ja) | 2021-09-24 |
| JP2021142214A5 true JP2021142214A5 (enExample) | 2023-08-28 |
| JP7423000B2 JP7423000B2 (ja) | 2024-01-29 |
Family
ID=77765377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020044026A Active JP7423000B2 (ja) | 2020-03-13 | 2020-03-13 | 遊技機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7423000B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7580711B2 (ja) * | 2020-06-24 | 2024-11-12 | 株式会社大一商会 | 遊技機 |
| JP7580712B2 (ja) * | 2020-06-24 | 2024-11-12 | 株式会社大一商会 | 遊技機 |
| JP7580710B2 (ja) * | 2020-06-24 | 2024-11-12 | 株式会社大一商会 | 遊技機 |
| JP7580709B2 (ja) * | 2020-06-24 | 2024-11-12 | 株式会社大一商会 | 遊技機 |
| JP7624647B2 (ja) * | 2020-06-24 | 2025-01-31 | 株式会社大一商会 | 遊技機 |
| JP7725012B2 (ja) * | 2020-06-24 | 2025-08-19 | 株式会社大一商会 | 遊技機 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167947A (ja) * | 1997-08-20 | 1999-03-09 | Sony Corp | ハイブリッド集積回路装置の表面実装方法及びハイブリッド集積回路装置及びハイブリッド集積回路装置の実装体 |
| JP2002159706A (ja) | 2000-11-28 | 2002-06-04 | Aruze Corp | 遊技機のメモリボード |
| JP2003198161A (ja) | 2001-12-26 | 2003-07-11 | Mitsubishi Electric Corp | クリップ型リード、及び、当該クリップ型リードにより半導体装置又は副基板を実装した主基板 |
| JP2019088674A (ja) | 2017-11-16 | 2019-06-13 | 株式会社大一商会 | 遊技機 |
| JP7213034B2 (ja) | 2018-08-14 | 2023-01-26 | 株式会社平和 | 遊技機 |
-
2020
- 2020-03-13 JP JP2020044026A patent/JP7423000B2/ja active Active
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