JP2021141647A - Power conversion device - Google Patents

Abstract

To provide a power conversion device capable of suppressing an increase in temperature of a control circuit board with heat of a semiconductor module against a problem that a communication hole is formed so that the entire semiconductor module is exposed with respect to the control circuit board, thus there is a possibility that the heat of the semiconductor module is transmitted to the control circuit board via air convecting in a case, for example, when the flow rate of cooling water flowing through a cooler is reduced to be insufficient to cool the semiconductor module.SOLUTION: A power conversion device according to the present disclosure includes a shielding plate which is disposed between a main body part and a circuit board, and in which a hole portion through which a terminal passes is formed. When a direction in which the terminal passes through the hole portion is defined as a Z direction, at least a part of the main body part exists within a range to which the shielding plate is projected in the Z direction. Accordingly, an amount of convecting air that reaches the circuit board through the hole portion after being heated by the main body part can be made small, and a temperature increase in the circuit board can be inhibited.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a power conversion device that performs power conversion.

As a power conversion device that performs power conversion of a hybrid car or an electric vehicle, there is one shown in Patent Document 1. The power conversion device of Patent Document 1 includes a semiconductor module having a built-in switching element, a cooler for cooling the semiconductor module, a control circuit board for controlling the operation of the switching element, and a case for accommodating these. ing. Further, the power conversion device includes a partition portion for dividing the space inside the case into a first space in which a control circuit board is arranged and a second space in which a semiconductor module is arranged. The semiconductor module has a control terminal, and the control terminal is connected to a control circuit board. The partition portion has a communication hole for connecting the control terminal to the control circuit board.

Japanese Unexamined Patent Publication No. 2015-70682

The communication holes are formed so that the entire semiconductor module is exposed to the control circuit board. Therefore, for example, if the flow rate of the cooling water flowing through the cooler decreases and the semiconductor module is insufficiently cooled, the heat of the semiconductor module may be transferred to the control circuit board via the air convected in the case. be.

The present disclosure has been made based on this circumstance, and an object of the present invention is to provide a power conversion device capable of suppressing an increase in the temperature of a control circuit board due to heat of a semiconductor module. ..

The first aspect of the present disclosure for achieving that purpose is:
A plurality of semiconductor modules (10) having a main body portion (13) in which the switching element (11) is resin-sealed, and terminals (12) connected to the switching element,
A cooler (20) having a laminated portion (22) that is alternately laminated with a plurality of semiconductor modules and cooling the semiconductor module, and a cooler (20).
A circuit board (30) that is connected to a switching element by a terminal and controls the operation of the switching element.
A shielding plate (40) arranged between the main body and the circuit board and formed with a hole (43) for passing terminals.
A case (50) for accommodating a semiconductor module, a cooler, a shielding plate, and a substrate is provided.
Assuming that the direction in which the terminals pass through the holes is the Z direction, this is a power conversion device in which at least a part of the main body is present in the range where the shielding plate is projected in the Z direction.

In the present disclosure, the main body portion exists not only in the projection range of the hole portion but also in the projection range of the shielding plate. This means that, contrary to the present disclosure, the opening area of the hole portion is smaller than that in the case where the projection range of the hole portion includes the entire main body portion. Therefore, the amount of convection that the air heated in the main body reaches the substrate through the hole can be reduced. Therefore, it is possible to prevent the temperature of the substrate from rising due to the heat of the semiconductor module.

It is sectional drawing which shows typically the positional relationship of the component parts of the power conversion apparatus in 1st Embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. It is sectional drawing which shows typically the positional relationship of the component parts of the power conversion apparatus in 2nd Embodiment. It is a VV cross-sectional view of FIG. It is sectional drawing which shows typically the positional relationship of the component part of the power conversion apparatus in 3rd Embodiment. FIG. 6 is a cross-sectional view taken along the line VII-VII of FIG. It is sectional drawing which shows typically the positional relationship of the component parts of the power conversion apparatus in another embodiment.

Hereinafter, a plurality of embodiments of the present disclosure will be described with reference to the drawings. In addition, duplicate description may be omitted by assigning the same reference numerals to the corresponding components in each embodiment. When only a part of the configuration is described in each embodiment, the configuration of the other embodiment described above can be applied to the other parts of the configuration. Further, not only the combination of the configurations specified in the description of each embodiment, but also the configurations of a plurality of embodiments can be partially combined even if the combination is not specified. Further, an unspecified combination of the configurations described in the plurality of embodiments and modifications is also disclosed by the following description.

(First Embodiment)
The power conversion device 1 will be described with reference to FIGS. 1 to 3. The power conversion device 1 is a device mounted on a vehicle such as a hybrid vehicle or an electric vehicle, and converts a direct current of a direct current power source outside the power conversion device 1 into an alternating current and supplies the direct current to a traveling motor. be. The power conversion device 1 generates a drive current (U-phase, V-phase, W-phase) that energizes a three-phase AC motor (not shown) as a traveling motor.

As shown in FIG. 1, the power conversion device 1 includes a laminate 2, a circuit board 30, a shielding plate 40, an auxiliary component 60, and a case 50 for accommodating these.

The laminated body 2 is configured by alternately laminating a plurality of semiconductor modules 10 and a cooler 20.

As shown in FIG. 2, the semiconductor module 10 has a main body 13 in which the switching element 11 is resin-sealed, and a terminal 12 in which the switching element 11 is connected to the switching element 11.

The main body 13 is formed in a plate shape, and is formed by molding the first switching element 11a and the second switching element 11b as the switching element 11 with a resin. Examples of the first switching element 11a and the second switching element 11b include an insulated gate bipolar transistor (IGBT), a MOS field effect transistor (MOSFET), and the like.

In the following, the direction perpendicular to the circuit board 30 is defined as the Z direction.

The terminal 12 is made of metal. The terminal 12 extends from the main body 13 toward the circuit board 30 in the Z direction, and the tip thereof is inserted and mounted on the circuit board 30. The switching element 11 and the circuit board 30 are electrically connected via the terminal 12. In the present embodiment, the terminal 12 is formed in a rod shape that is straight in the Z direction.

As shown in FIG. 3, the cooler 20 exchanges heat with a heat exchange unit 21 that exchanges heat with the semiconductor module 10 by flowing a refrigerant inside, and an inflow port 24 for allowing the refrigerant to flow into the heat exchange unit 21. It has an outflow port 25 for letting out the refrigerant from the unit 21.

In the present embodiment, the heat exchange unit 21 is composed of a plurality of laminated portions 22 and a connecting pipe 23 for connecting the plurality of laminated portions 22 to each other, and has a refrigerant flow path through which the refrigerant flows. ing.

In the following, the direction in which the main body portion 13 and the laminated portion 22 are laminated is defined as the X direction, and the direction perpendicular to the X direction and the Z direction is defined as the Y direction.

The laminated portion 22 and the main body portion 13 are alternately arranged and laminated. As a result, the two laminated portions 22 are adjacent to one main body portion 13, and the main body portion 13 can be cooled from two directions. In order to improve the cooling of the main body 13 by the heat exchange section 21, it is preferable that the heat exchange section 21 is made of a material having high thermal conductivity in the present embodiment. Specifically, it is desirable that it is made of a metal such as aluminum.

As shown in FIG. 1, the circuit board 30 includes an electronic component 33 and a substrate 32 on which these electronic components 33 are mounted, and controls the operation of the switching element 11. Further, the circuit board 30 has a drive IC and a microcomputer (microcomputer) as electronic components 33. The drive IC is electrically connected to the switching element 11 and causes an on / off drive by passing a current through the switching element 11. A microcomputer has a processor and a memory that execute various arithmetic processes. The circuit board 30 is electrically connected to an electronic control unit (ECU) outside the power conversion device. That is, the circuit board 30 outputs a drive signal to the switching element 11 built in the semiconductor module 10 based on the torque request input from the ECU and the signals detected by various sensors. Further, the circuit board 30 is formed with a board bolt hole 31 fixed to the case 50.

The shielding plate 40 is a plate-shaped member having a flat flat portion 41 and a border portion 42 formed around the flat portion 41. The shielding plate 40 is arranged between the circuit board 30 and the semiconductor module 10 in the Z direction. The shielding plate 40 is formed with a hole 43 through which the terminal 12 connected to the circuit board 30 is passed. Specifically, the hole portion 43 is formed in the flat portion 41. Of the terminals 12, the range passing through the hole 43 is a straight line parallel to the Z direction. Further, the edge portion 42 is formed with a shielding plate bolt hole 44 fixed to the case 50. The flat portion 41 and the circuit board 30 are arranged in parallel and facing each other. Further, in the present embodiment, the shielding plate 40 is made of metal.

The distance between the shielding plate 40 and the circuit board 30 in the Z direction is larger than the distance between the shielding plate 40 and the main body 13.

The thickness of the shielding plate 40 in the Z direction is larger than the thickness of the substrate 32 in the Z direction. That is, the heat capacity of the shielding plate 40 is larger than the heat capacity of the substrate 32. Therefore, even if the heat generated from the main body 13 is transferred to the shielding plate 40, it can be suppressed from being transferred from the shielding plate 40 to the circuit board 30.

The case 50 has a case body 52 that opens in the Z direction, and a case lid 51 that is bolted to the case body 52 to close the opening 54. In this embodiment, the case 50 is formed by die casting of aluminum or the like. Further, the case main body 52 has a convex portion 53 for fixing the shielding plate 40 and the circuit board 30 to the case main body 52.

Specific examples of the auxiliary component 60 include a reactor 61, a filter capacitor 62, a smoothing capacitor 63, and a current sensor 64.

The reactor 61 boosts the voltage of the DC power supply based on the on / off drive of the switching element 11.

The filter capacitor 62 smoothes the DC current of the input DC power supply.

The smoothing capacitor 63 is connected in parallel with the semiconductor module 10 and smoothes the DC current boosted by the semiconductor module 10 and the reactor 61.

The current sensor 64 detects the phase current flowing in the winding of each phase of the three-phase AC motor.

In the present embodiment, the electronic component 33 is arranged on the side of the substrate 32 facing the main body 13. That is, the substrate 32 is arranged between the shielding plate 40 and the electronic component 33 in the Z direction.

In the power conversion device 1, after the laminate 2 and the auxiliary component 60 are housed in the case body 52, the shielding plate 40 and the circuit board 30 are fixed to the convex portion 53, and finally the case lid portion 51 is bolted to the case body 52. It is fastened and formed.

As shown in FIG. 3, a part of the main body 13 is present in the range where the shielding plate 40 is projected in the Z direction. That is, a part of the main body portion 13 exists outside the range in which the hole portion 43 is projected in the Z direction. Specifically, all the main body portions 13 constituting the laminated body 2 are partially present in the range where the shielding plate 40 is projected in the Z direction. Further, a part of the switching element 11 is present in the range where the shielding plate 40 is projected in the Z direction.

Further, as shown in FIG. 1, a shielding plate 40 is arranged between the main body 13 and the circuit board 30 in the Z direction.

The number of holes 43 is one, and it has a rectangular shape when viewed from the Z direction. All the terminals 12 extending from the plurality of semiconductor modules 10 are passed through the one hole 43. Contrary to this embodiment, if the hole 43 is provided in each of the terminals 12, it is necessary to form the position of the hole 43 with respect to the XY plane position of the terminal 12 with high accuracy. On the other hand, in the present embodiment, it is possible to eliminate the need to form the hole 43 with high accuracy by passing all the terminals 12 through one hole 43. Further, when the shielding plate 40 is assembled to the case 50, the risk that the terminal 12 abuts on the shielding plate 40 and the terminal 12 is damaged can be suppressed.

As shown in FIG. 3, the electronic component 33 exists in the range in which the portion of the shielding plate 40 facing the part of the main body 13 is projected in the Z direction. That is, when the power conversion device 1 is viewed from the opening 54, the shielding plate 40 exists in the entire range in which the range in which the main body 13 is projected in the Z direction and the range in which the electronic component 33 is projected in the Z direction overlap. .. Further, as shown in FIG. 1, a shielding plate 40 is arranged between the main body 13 and the electronic component 33 in the Z direction.

As shown in FIG. 1, the case 50 and the shielding plate 40, and the shielding plate 40 and the circuit board 30 are in direct contact with each other. Specifically, the shielding plate bolt hole 44 and the substrate bolt hole 31 are fixed to the convex portion 53 by being tightened together with the bolt 70. The bolt 70 is inserted in the Z direction with respect to the shielding plate bolt hole 44 and the substrate bolt hole 31.

Hereinafter, the effect of the power conversion device 1 by having the above-described configuration will be described.

In the present embodiment, the main body portion 13 exists not only in the projection range of the hole portion 43 but also in the projection range of the shielding plate 40. This means that, contrary to the present embodiment, the opening area of the hole portion 43 is smaller than that in the case where the projection range of the hole portion 43 includes the entire main body portion 13. Therefore, the amount of convection that the air heated in the main body 13 reaches the circuit board 30 through the hole 43 can be reduced. Therefore, it is possible to prevent the temperature of the circuit board 30 from rising due to the heat of the semiconductor module 10. The smaller the opening area of the hole 43, the better the above-mentioned effect.

Further, among the main body 13, the switching element 11 has the largest calorific value. Therefore, in the present embodiment, the presence of the switching element 11 in the range where the shielding plate 40 is projected in the Z direction can further suppress the temperature rise of the circuit board 30.

Further, the shorter the electric path between the switching element 11 and the electronic component 33, the more the electromagnetic noise generated in the path can be suppressed. On the other hand, when the electronic component 33 is arranged near the connection portion with the terminal 12 in the circuit board 30 in order to shorten the above-mentioned electric path, the heat of the main body portion 13 is generated by the air in the hole portion 43. It is easily transmitted to the electronic component 33 via convection.

In view of these points, in the present embodiment, the electronic component 33 exists in the range in which the portion of the shielding plate 40 facing the part of the main body 13 is projected in the Z direction. Therefore, the shielding plate 40 can suppress the heat generated from the main body 13 from being transferred to the electronic component 33 via the air. Further, as compared with the case where the electronic component 33 does not exist in the range where the main body 13 is projected in the Z direction, the electronic component 33 can be arranged near the connection portion with the terminal 12 in the circuit board 30. can. Therefore, the electric path between the switching element 11 and the electronic component 33 can be shortened. The larger the volume of the shielding plate 40 contained between the main body 13 and the electronic component 33 in the Z direction, the better the above-mentioned effect. In particular, when the power conversion device 1 is viewed from the opening 54, it is preferable that the shielding plate 40 is present in the entire range in which the main body 13 is projected in the Z direction and the electronic component 33 is projected in the Z direction. ..

Further, in the present embodiment, the shielding plate 40 is in direct contact with the case 50. Specifically, the edge portion 42 and the convex portion 53 are in direct contact with each other. Therefore, the heat of the main body 13 transmitted through the air convected in the case 50 can be dissipated from the shielding plate 40 to the case 50. Therefore, it is possible to suppress the heat of the main body 13 from being transferred from the shielding plate 40 to the circuit board 30 via the convected air. The higher the thermal conductivity of the shielding plate 40, the better the above-mentioned effect. Specifically, it is desirable that the shielding plate 40 is made of metal.

(Second Embodiment)
The power conversion device 1 will be described with reference to FIGS. 4 to 5.

In the first embodiment, a part of the electronic component 33 is included in the range where the main body portion 13 is projected in the Z direction. On the other hand, in the second embodiment, as shown in FIG. 4, the entire electronic component 33 exists outside the range in which the main body 13 is projected in the Z direction. In particular, in the present embodiment, the entire electronic component 33 exists outside the range in which the laminated body 2 is projected in the Z direction.

Further, the entire electronic component 33 exists outside the range in which the hole portion 43 is projected in the Z direction. That is, the entire electronic component 33 exists in the range where the shielding plate 40 is projected in the Z direction.

In the first embodiment, the electronic component 33 is arranged on the side of the substrate 32 facing the main body 13. On the other hand, in the second embodiment, as shown in FIG. 5, the electronic component 33 is arranged on the side of the substrate 32 opposite to the side facing the main body 13. That is, the electronic component 33 is arranged on the side of the substrate 32 facing the case lid 51. Further, in the Z direction, the circuit board 30 is arranged between the shielding plate 40 and the electronic component 33.

The semiconductor module 10 has a first terminal 12a and a second terminal 12b as terminals 12. The plurality of first terminals 12a extend from the first switching element 11a in the Z direction and are connected to the circuit board 30. Further, the plurality of second terminals 12b extend in the Z direction from the second switching element 11b and are connected to the circuit board 30.

In the first embodiment, the number of holes 43 was one. On the other hand, in the second embodiment, as shown in FIG. 4, the number of holes 43 is a plurality. That is, the shielding plate 40 is formed with a first hole portion 43a and a second hole portion 43b as the hole portion 43. The plurality of first terminals 12a pass through the first hole portion 43a, and the plurality of second terminals 12b pass through the second hole portion 43b. That is, all the first terminals 12a pass through the first hole portion 43a, and all the second terminals 12b pass through the second hole portion 43b.

The range in which the first switching element 11a is projected in the Z direction includes the entire first hole portion 43a, and the range in which the second switching element 11b is projected in the Z direction includes the entire second hole portion 43b. included. Further, the range in which the main body portion 13 is projected in the Z direction includes the entire first hole portion 43a and the second hole portion 43b.

The plurality of first terminals 12a and the plurality of second terminals 12b are arranged side by side in the Y direction. Specifically, the first terminal 12a and the second terminal 12b extending from one semiconductor module 10 are arranged in a straight line in the Y direction. The distance between the two adjacent first terminals 12a and the distance between the two adjacent second terminals 12b are smaller than the distance between the adjacent first terminals 12a and the second terminal 12b.

Further, the main body portion 13 has a central portion 13a sandwiched between the adjacent first terminal 12a and the second terminal 12b when the power conversion device 1 is viewed from the opening 54. That is, in the Y direction, the central portion 13a exists between the first terminal 12a and the second terminal 12b. The range in which the shielding plate 40 is projected in the Z direction includes the central portion 13a.

There is no shielding plate 40 between the two adjacent first terminals 12a and between the two adjacent second terminals 12b, and there is a shielding between the adjacent first terminals 12a and the second terminal 12b. There is a plate 40.

Hereinafter, the effect of the power conversion device 1 by having the above-described configuration will be described.

In the present embodiment, the electronic component 33 exists outside the range in which the hole 43 is projected in the Z direction. Therefore, the electronic component 33 can be kept away from the air convection in the hole 43, and heat can be suppressed from being transferred to the electronic component 33. The farther the electronic component 33 is from the range in which the hole 43 is projected in the Z direction, the more the above-mentioned effect is improved. Specifically, it is preferable that the entire electronic component 33 exists outside the range in which the main body 13 is projected in the Z direction. In particular, it is preferable that the entire electronic component 33 exists outside the range in which the laminated body 2 is projected in the Z direction.

In the present embodiment, the electronic component 33 is arranged on the side of the substrate 32 opposite to the side facing the main body 13. Therefore, in addition to the shielding plate 40, the substrate 32 can shield the heat transferred through the air convected inside the case 50 from the electronic component 33. That is, it is possible to further suppress the transfer of heat to the electronic component 33.

By the way, the smaller the hole 43, the more the effect of the convection shielding by the shielding plate 40 can be improved. On the other hand, the smaller the hole 43, the greater the risk that the terminal 12 will hit the shielding plate 40 during the work of inserting the terminal 12 into the hole 43, resulting in damage to the terminal 12.

In view of these points, in the present embodiment, the hole 43 through which the terminal 12 is passed is the first hole 43a through which the first terminal 12a is passed and the first hole 43a through which the second terminal 12b is passed. It is provided separately from the two-hole portion 43b. Therefore, since the shielding plate 40 does not exist between the first terminals 12a and between the second terminals 12b, the risk of the terminal 12 hitting the shielding plate 40 can be reduced as described above. On top of that, since the shielding plate 40 exists between the first terminal 12a and the second terminal 12b, compared with the case where the first hole portion 43a and the second hole portion 43b are not separated as described above. For example, the effect of convection shielding by the shielding plate 40 can be improved. The above-mentioned effect is improved as the volume of the central portion 13a included in the range projected in the Z direction of the shielding plate 40 is larger.

(Third Embodiment)
The power conversion device 1 will be described with reference to FIGS. 6 to 7.

In the first embodiment, the shielding plate 40 was fixed to the case body 52. On the other hand, in the third embodiment, as shown in FIG. 6, the shielding plate 40 is fixed to the circuit board 30. Specifically, the shielding plate bolt hole 44 and the board bolt hole 31 are fastened by the bolt 70. That is, the shielding plate 40 is not in direct contact with the case main body 52, but is fixed to the case main body 52 via the circuit board 30.

In the second embodiment, a plurality of terminals 12 are passed through one hole 43. On the other hand, in the third embodiment, as shown in FIG. 7, one terminal 12 is passed through one hole 43. That is, one hole 43 is formed so as to surround the periphery of one terminal 12.

All of the holes 43 among the plurality of holes 43 are included in the range in which the switching element 11 is projected in the Z direction.

Further, as shown in FIG. 6, in the present embodiment, the power conversion device 1 includes a fitting portion 80 arranged in the hole portion 43. The fitting portion 80 is formed of an electrically insulating material. Specifically, it is made of a resin having thermal conductivity and elasticity such as highly thermally conductive silicon. The fitting portion 80 is formed with an insertion hole 81 for inserting the terminal 12.

The fitting portion 80 is in direct contact with the terminal 12 and the shielding plate 40. Specifically, the fitting portion 80 is fitted to the shielding plate 40 so as to close the hole portion 43. Then, the terminal 12 is inserted into the insertion hole 81 so that the fitting portion 80 and the terminal 12 come into contact with each other without a gap. That is, the fitting portion 80 is arranged between the terminal 12 and the shielding plate 40.

Hereinafter, the effect of the power conversion device 1 by having the above-described configuration will be described.

The terminal 12 is connected to the circuit board 30. Therefore, the heat generated from the main body 13 may be conducted to the circuit board 30 via the terminal 12. Therefore, the fitting portion 80 is arranged in the hole portion 43 so that the fitting portion 80 is in direct contact with the hole portion 43 and the terminal 12. By doing so, the heat transferred to the terminal 12 can be dissipated to the shielding plate 40 via the fitting portion 80. The above-mentioned effect is improved as the thermal conductivity of the fitting portion 80 is higher.

(Other embodiments)
Disclosure in this specification, drawings and the like is not limited to the illustrated embodiments. The disclosure includes exemplary embodiments and modifications by those skilled in the art based on them. For example, disclosure is not limited to the parts and / or element combinations shown in the embodiments. Disclosure can be carried out in various combinations. The disclosure can have additional parts that can be added to the embodiment. Disclosures include those in which the parts and / or elements of the embodiment are omitted. Disclosures include the replacement or combination of parts and / or elements between one embodiment and another.

In the first embodiment, the shielding plate 40 and the case 50 are fixed by fastening bolts 70 to the shielding plate bolt holes 44, but the present disclosure is not limited to this. Specifically, the shielding plate 40 and the case 50 may be fixed by, for example, welding or an adhesive.

In the first embodiment, the terminal 12 has a rod shape, but the present disclosure is not limited to this, and the terminal 12 may have a plate shape as long as it is parallel to the Z direction within the range passing through the hole 43. good. Further, although the terminal 12 has a linear shape, the present disclosure is not limited to this, and the terminal 12 may have a polygonal line shape.

In the first embodiment, the shielding plate 40 is made of metal, but the present disclosure is not limited to this, and the shielding plate 40 may be made of resin. Further, the range in which the shielding plate 40 is projected in the Z direction includes all the main body portions 13 among the plurality of constituents of the laminated body 2, but the present disclosure is not limited to this, and constitutes the laminated body 2. One or more of the plurality of main body portions 13 may be included in the range in which the shielding plate 40 is projected in the Z direction. Further, the range in which the shielding plate 40 is projected in the Z direction includes the switching element 11, but the present disclosure is not limited to this, and at least the main body 13 is included in the range in which the shielding plate 40 is projected in the Z direction. If a part is included, the switching element 11 may not be included.

In the first embodiment, when the power conversion device 1 is viewed from the opening 54, the electronic component 33 is located in a range in which the portion of the shielding plate 40 facing a part of the main body 13 is projected in the Z direction. The whole exists. However, the present disclosure is not limited to this, and a part of the electronic component 33 may be included in the range of the shielding plate 40 in which the part of the shielding plate 40 facing the part of the main body 13 is projected in the Z direction.

In the first embodiment, the distance between the shielding plate 40 and the circuit board 30 in the Z direction is larger than the distance between the shielding plate 40 and the main body 13. However, the present disclosure is not limited to this, and the distance between the shielding plate 40 and the circuit board 30 in the Z direction may be smaller than the distance between the shielding plate 40 and the main body 13. Further, the thickness of the shielding plate 40 in the Z direction is larger than the thickness of the substrate 32 in the Z direction, but the present disclosure is not limited to this, and the thickness of the shielding plate 40 in the Z direction is the thickness of the substrate 32 in the Z direction. It may be smaller than the thickness.

In the first embodiment, the hole portion 43 has one hole, but the present disclosure is not limited to this, and the number and shape can be appropriately changed. For example, as many holes 43 as the number of semiconductor modules 10 may be provided, and a plurality of terminals 12 extending from one semiconductor module 10 may be passed through one hole 43.

In the first embodiment, the hole portion 43 is formed in the flat portion 41, but the present disclosure is not limited to this, and the hole portion 43 is formed so as to straddle the edge portion 42 and the flat portion 41. May be good.

In the second embodiment, the shielding plate 40 and the circuit board 30 are fixed by fastening bolts 70 to the shielding plate bolt holes 44 and the substrate bolt holes 31, but the present disclosure is limited to this. is not it. Specifically, the shielding plate 40 and the circuit board 30 may be fixed by, for example, welding or an adhesive.

In the second embodiment, the hole 43 includes the entire range in which the switching element 11 is projected in the Z direction, but the present disclosure is not limited to this, and the range in which the switching element 11 is projected in the Z direction is not limited to this. The hole 43 may be included in addition to the above.

In the second embodiment, the entire electronic component 33 exists outside the range in which the laminated body 2 is projected in the Z direction, but the present disclosure is not limited to this, and the laminated body 2 is projected in the Z direction. A part of the electronic component 33 may be present in the specified range.

In the third embodiment, the fitting portion 80 is formed of an elastic member, but the present disclosure is not limited to this, and the fitting portion 80 may be formed of an inelastic member. Further, although one terminal 12 is inserted in the fitting portion 80, the present disclosure is not limited to this, and the fitting portion is inserted into the hole portion 43 as in the first embodiment and the second embodiment. 80 may be fitted.

In the first to third embodiments, the range in which the shielding plate 40 is projected in the Z direction includes a part of the main body portion 13, but the present disclosure is not limited to this, and as shown in FIG. The entire main body 13 may be included in the range projected from the shielding plate 40 in the Z direction.

1 ... Power converter 10 Semiconductor module, 11 Switching element, 11a 1st switching element, 11b 2nd switching element, 12 terminal, 12a 1st terminal, 12b 2nd terminal, 13 Main body, 20 Cooler, 22 Laminated part, 30 Circuit board, 33 Electronic components, 40 Shielding plate, 43 holes, 43a 1st hole, 43b 2nd hole, 50 cases, 80 fittings.

Claims (7)

A plurality of semiconductor modules (10) having a main body portion (13) in which the switching element (11) is resin-sealed, and a terminal (12) connected to the switching element.
A cooler (20) having a laminated portion (22) alternately laminated with the plurality of the semiconductor modules and cooling the semiconductor modules, and a cooler (20).
A circuit board (30) connected to the switching element by the terminal and controlling the operation of the switching element.
A shielding plate (40) arranged between the main body and the circuit board and formed with a hole (43) through which the terminal passes.
A case (50) for accommodating the semiconductor module, the cooler, the shielding plate, and the circuit board is provided.
A power conversion device in which at least a part of the main body is present in a range in which the shielding plate is projected in the Z direction, assuming that the direction in which the terminal passes through the hole is the Z direction. The circuit board has an electronic component (33) that is electrically connected to the switching element.
The power conversion device according to claim 1, wherein the electronic component exists in a range of the shielding plate that faces a part of the main body and is projected in the Z direction. The circuit board has an electronic component (33) that is electrically connected to the switching element.
The power conversion device according to claim 1, wherein the entire electronic component exists outside the range in which the hole is projected in the Z direction. The power conversion device according to claim 2 or 3, wherein the electronic component is arranged on the side of the circuit board opposite to the side facing the main body. The power conversion device according to any one of claims 1 to 4, wherein the shielding plate is in direct contact with the case. The semiconductor module includes a first switching element (11a) and a second switching element (11b) as the switching element.
It has a first terminal (12a) and a second terminal (12b) as the terminals.
The shielding plate is formed with a first hole portion (43a) and a second hole portion (43b) as the hole portion.
The first switching element is connected to the circuit board via a plurality of the first terminals, and the second switching element is connected to the circuit board via a plurality of the second terminals.
The distance between the two adjacent first terminals and the distance between the two adjacent second terminals is smaller than the distance between the adjacent first terminal and the second terminal.
The power conversion device according to any one of claims 1 to 5, wherein the plurality of the first terminals pass through the first hole portion, and the plurality of the second terminals pass through the second hole portion. A fitting portion (80) formed of an electrically insulating material and fitted into the hole portion is provided.
The power conversion device according to any one of claims 1 to 6, wherein the fitting portion is in direct contact with the terminal and the shielding plate.

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