JP2021136425A - Wafer test device - Google Patents

Abstract

To provide a wafer test device with accurate alignment and high operating rate by providing a wafer test unit equipped with means for separating a process related to raising and lowering of a wafer tray of a wafer positioning stage from the wafer positioning stage, ensuring parallelism of the wafer tray with a probe card, and raising and lowering the wafer tray vertically and by providing means for making the wafer tray mounting surface follow the inclination of the wafer tray in the wafer positioning stage.SOLUTION: A wafer test device includes a wafer tray elevating mechanism 60, an alignment stage swing mechanism 40, and a wafer positioning stage elevating mechanism 50 to maintain the parallelism between a wafer tray 23 and a probe card 21 and align the wafer 15 with the probe card 21, and the wafer 15 and the probe card 21 can be brought into contact with each other with high accuracy by vertically elevating and lowering the wafer tray elevating mechanism 60.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wafer test apparatus, and more particularly, a probe card having a terminal for contacting a wafer electrode used in a wafer burn-in test apparatus, a post-process test apparatus, a pre-process test apparatus, and the like. An alignment that controls the position of a wafer test unit having a load board on which a test circuit or the like is mounted, a wafer tray on which a wafer is mounted, and a wafer mounted on the wafer tray in the X, Y, and circumferential directions. The present invention relates to a wafer testing apparatus including a wafer positioning unit having a stage, and performing a test by pressurizing contact between a wafer electrode and a probe card terminal.

Similar to the semiconductor package test, the wafer test is performed in an environment of high temperature or low temperature by using a test device called a prober to perform an electrical property test such as a stress test or a functional test.
After the wafer test is completed, the wafer is cut and assembled, and then mounted as a semiconductor package on a burn-in socket or a test socket, and a burn-in test or a post-process test is performed.

On the other hand, in the wafer test, the wafer chuck part of the prober device is separated into the wafer tray and the wafer positioning stage to realize a multi-wafer test device with a multi-stage configuration, and the space surrounded by the probe card and the wafer tray is evacuated. Patent Document 1 discloses a wafer inspection device that tests a wafer by making a pressure contact with the wafer.

In Patent Document 1, a wafer is placed on a chuck member via a wafer tray and conveyed to a position facing the probe card, and the conveyed wafer together with the wafer tray is directed toward the probe card by using an elevating device. After moving and bringing the plurality of electrodes of the semiconductor device provided on the wafer into contact with the plurality of terminals provided on the probe card, the wafer is further overdriven toward the probe card, and then the probe card and the wafer are further driven. The space between the tray and the probe card is depressurized to maintain the contact state between the electrodes of the semiconductor device and the terminals of the probe card, and the means for contacting the probe card that separates the chuck member from the wafer tray is disclosed. The invention is disclosed to move to a position corresponding to another probe card to prepare for the next wafer test.

That is, in the invention according to Patent Document 1, vacuum pressure is used for electrical connection between the wafer mounted on the wafer tray, which is the wafer mounting stage, and the probe card, and the wafer mounting stage is the wafer tray and the wafer tray. A multi-stage wafer inspection device has been realized by adopting a method of separating into wafer positioning stages equipped with a push-up alignment mechanism.

Patent No. 6031292

In the invention described in Patent Document 1, the wafer mounting portion is separated into a wafer tray and a member that pushes up the wafer tray, a unit provided with the member and an alignment mechanism is used as a wafer positioning stage, and the wafer is mounted on the wafer tray for alignment. The wafer tray is pushed up to the probe card side, sucked by vacuum pressure, and then the wafer positioning stage is lowered and moved to prepare for mounting, aligning, and taking out the wafer on the next prober. , The height of the prober mechanism is lower than that of the conventional device, and a multi-stage wafer inspection device is realized.
However, since the wafer tray on which the wafer is placed is raised and lowered by raising and lowering the wafer positioning stage, vertical raising and lowering of the wafer positioning stage and horizontality of the probe card mounted on the test unit are important. When the test units are loaded in multiple stages, there is a problem that the horizontal mounting of each test unit and the vertical elevation of the wafer positioning stage greatly affect the position accuracy, and higher accuracy assembly is required.
Furthermore, the wafer positioning stage is separated from the probe card of the wafer tray by raising the wafer positioning stage at the start of the test, lowered to the wafer take-out position, mounted on the wafer (there is also a wafer take-out process after the test is performed), and the wafer. The problem is that one test unit must spend a long time involved in all processes from alignment of the electrodes of the probe card to the terminals of the probe card, contact with the probe card by raising the wafer tray, and suction by the vacuum mechanism. was there.

Therefore, the problem to be solved by the present invention is
The wafer test unit is provided with a means for separating the process of raising and lowering the wafer tray by the wafer positioning stage from the wafer positioning stage, ensuring parallelism with the probe card, and raising and lowering the wafer tray vertically.
The wafer positioning stage is provided with means for carrying out only the wafer alignment process, making the wafer tray mounting surface follow the inclination of the wafer tray, and raising and lowering a short distance perpendicular to the plane of the wafer tray. , Highly accurate alignment and high operating rate test equipment can be provided.

The means for solving the problem of the present invention is as follows.

First,
This is a wafer test device that conducts tests by applying pressure contact between the electrodes of the wafer and the terminals of the probe card.
A wafer test unit, a wafer positioning unit, a device frame on which the wafer test unit is mounted, a wafer positioning unit slide mechanism that laterally conveys the wafer positioning unit, and a wafer positioning unit slide mechanism.
With
The wafer test unit is
A road board on which a test circuit etc. is mounted and
With the probe card
A wafer tray on which the wafer is placed and
A vacuum chamber forming a closed space together with the load board, the probe card, and the wafer tray.
A wafer tray elevating mechanism that moves the wafer tray between the position where the wafer is placed and the position where the wafer tray contacts the vacuum chamber.
A wafer test apparatus comprising.

Second,
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
A wafer tray holding plate on which the wafer tray is placed and a wafer tray holding plate
A drive mechanism having a ball screw, a slide shaft that slides by driving the ball screw, and a slide unit that fits with the slide shaft.
The drive motor that drives the ball screw and
A slide mechanism with a slide shaft and a slide unit,
With
The drive mechanism
The slide units are installed at the four corners of the vacuum chamber.
The tips of the slide shafts of the previous term are connected to the four corners of the wafer tray holding plate.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide units are installed at the four corners of the vacuum chamber.
The wafer test apparatus according to the first aspect, wherein the tips of the slide shafts are connected to the four corners of the wafer tray holding plate.

Third,
The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, the drive motor, and the slide mechanism are provided.
The drive mechanism
The slide units are installed at two diagonally opposite locations at the four corners of the vacuum chamber, and the tips of the previous slide shafts are connected to the two diagonally opposed locations at the four corners of the wafer tray holding plate.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide unit is installed at two diagonally opposed locations at the four corners of the vacuum chamber, and the tips of the slide shafts are connected to two diagonally opposed locations at the four corners of the wafer tray holding plate. The wafer test apparatus according to the first to second.

Fourth,
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
With the wafer tray holding plate
With the drive mechanism
With the drive motor
With
The drive mechanism
The slide units are installed at four locations at the four corners of the vacuum chamber.
The tips of the slide shafts are connected to four corners of the wafer tray holding plate.
The wafer test apparatus according to the first to second aspects, wherein the ball screw is connected to the drive motor.

Fifth,
The wafer tray elevating mechanism is
A ball spline with an integrated ball screw is used for the drive mechanism.
The wafer test apparatus according to the first to fourth aspects, wherein a ball spline is used for the slide mechanism.

Sixth,
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
With the wafer tray holding plate
A drive mechanism having a ball screw, a slide nut, and an upper bearing and a lower bearing of the ball screw.
With the drive motor
With the slide mechanism
The base plate having the lower bearing and
With
The drive mechanism
The early ball screws connected to the drive motor are installed at two diagonally opposite locations of the vacuum chamber and the four corners of the base plate via the upper bearing and the lower bearing.
The slide nuts of the previous term were installed at two diagonally opposite locations at the four corners of the wafer tray holding plate.
The slide mechanism
Both ends of the slide shaft in the previous period are connected to the vacuum chamber and the four corners of the base plate diagonally facing each other.
The wafer test apparatus according to the first aspect, wherein the slide units of the first term are installed at two diagonally opposite positions of the four corners of the wafer tray holding plate.

Seventh,
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
With the wafer tray holding plate
With the drive mechanism
With the drive motor
With the base plate
With
The drive mechanism in the previous term
The early ball screws connected to the drive motor are installed at four locations of the vacuum chamber and the four corners of the base plate via the upper bearing and the lower bearing.
The wafer test unit according to the first aspect, wherein the slide nuts are installed at four positions at four corners of the wafer tray holding plate.

Eighth,
The wafer positioning unit is
Driven by the wafer positioning unit slide mechanism, it is arranged under the wafer test unit so as to face the wafer tray.
A wafer positioning stage on which the wafer tray is placed and alignment between the electrodes of the wafer and the terminals of the probe card, and
A position information shooting mechanism with a camera and
With
The wafer positioning stage is
An alignment stage that controls the positions in the X, Y, and rotation directions,
An alignment stage swing mechanism that makes the inclination of the wafer tray mounting surface of the alignment stage follow the inclination of the wafer tray.
A wafer positioning stage elevating mechanism that elevates and elevates the wafer positioning stage,
The wafer test apparatus according to the first to seventh aspects.

Ninth,
The alignment stage swing mechanism is
When the wafer positioning stage is raised, the abutting members that come into contact with the four corners of the lower surface of the wafer tray holding plate and
A rocking plate having the abutting member at the four corners,
Spherical plain bearings with moving and fixed parts,
A spring member that supports the load applied to the outer peripheral portion of the rocking plate, and
A rocking mechanism mounting plate, which is installed with a space for the rocking plate to swing, is provided below the rocking plate.
The abutting member is
When the alignment stage swing mechanism is raised by the wafer positioning stage elevating mechanism and the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface of the alignment stage moves the wafer tray back and forth and left and right. Has a height that can be moved
The spherical plain bearing is
Installed in the central part between the rocking plate and the rocking mechanism mounting plate,
The movable portion is connected to the rocking plate, and the fixed portion is connected to the rocking mechanism mounting plate.
The spring member is
The wafer test unit according to the first to eighth aspects, wherein a plurality of wafer test units are arranged on the outer peripheral portion where the spherical bearing is installed.

Tenth,
The wafer positioning stage elevating mechanism
With the swing mechanism mounting plate
A drive mechanism with a slide unit and a drive unit,
A wafer positioning unit mounting plate on which the wafer positioning unit is mounted and a wafer positioning unit mounting plate.
With
The wafer test unit according to the first to ninth aspects, wherein the drive mechanism is provided at four corners of the swing mechanism mounting plate and the wafer positioning unit mounting plate.

Eleventh,
The wafer test unit according to the first to tenth aspects, wherein a pneumatic device is used for the drive mechanism.

Twelfth,
The device frame
A frame of the wafer test apparatus is formed by accommodating one set of the wafer test units and connecting the apparatus frames in the horizontal direction and the vertical direction.
The wafer test unit according to the first to eleventh aspects, wherein the apparatus frame is provided with a structure in which the wafer positioning unit is movable in the lateral direction corresponding to a plurality of the wafer test units.

According to the present invention, the following effects can be obtained.

According to the first invention
A wafer test unit, a wafer positioning unit, an apparatus frame on which the wafer test unit is mounted, and a wafer positioning unit slide mechanism for laterally transporting the wafer positioning unit are provided.
The wafer test unit
A load board on which a test circuit or the like is mounted, a probe card, a wafer tray on which the wafer is placed, a vacuum chamber forming a space closed together with the load board, the probe card, and the wafer tray, and the above. By providing a wafer tray elevating mechanism for moving the wafer tray between the position where the wafer is placed and the position where the wafer tray contacts the vacuum chamber.
The wafer tray on which the wafer is placed can be raised and lowered within the wafer test unit without being carried by the wafer positioning unit, and the wafer positioning unit can be moved in preparation for the next test, and the height of the test apparatus can be increased. The operating rate can be increased.

According to the second invention
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
A wafer tray holding plate on which the wafer tray is placed and a wafer tray holding plate
A drive mechanism having a ball screw, a slide shaft that slides by driving the ball screw, and a slide unit that fits with the slide shaft.
The drive motor that drives the ball screw and
With a slide mechanism having a slide shaft and a slide unit,
The drive mechanism
The slide units are installed at the four corners of the vacuum chamber.
The tips of the slide shafts of the previous term are connected to the four corners of the wafer tray holding plate.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide units are installed at the four corners of the vacuum chamber.
By connecting the tips of the slide shafts to the four corners of the wafer tray holding plate,
The wafer tray mounted on the wafer tray holding plate can be moved up and down between a position in contact with the vacuum chamber and a position on which the wafer is placed, and the wafer tray can be moved up and down. The wafer tray is held horizontally on the tray holding plate, and the wafer tray can be raised and lowered perpendicularly to the vacuum chamber by driving the drive mechanism, and the wafer is raised to the probe card held in the vacuum chamber. It can be contacted with precision.

According to the third invention
The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, the drive motor, and the slide mechanism are provided.
The drive mechanism
The slide units are installed at two diagonally opposed locations at the four corners of the vacuum chamber, and the tips of the slide shafts are connected to two diagonally opposed locations at the four corners of the wafer tray holding plate.
The ball screw is connected to the drive motor,
The slide mechanism
The slide units are installed at two diagonally opposed locations at the four corners of the vacuum chamber, and the tips of the slide shafts are connected to the two diagonally opposed locations at the four corners of the wafer tray holding plate.
The wafer tray is held horizontally on the wafer tray holding plate, and the drive mechanism can raise and lower the wafer tray vertically with respect to the vacuum chamber, and the probe held in the vacuum chamber. The wafer can be brought into contact with the card with high precision.
Further, since the two drive mechanisms are driven synchronously, the wafer tray having a heavier weight than that of the second invention can be moved at high speed and with low vibration.

According to the fourth invention
The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, and the drive motor are provided.
The drive mechanism
The slide units are installed at four locations at the four corners of the vacuum chamber.
The tips of the slide shafts are connected to four corners of the wafer tray holding plate.
By connecting the ball screw to the drive motor,
The wafer tray is held horizontally on the wafer tray holding plate, and the drive mechanism can raise and lower the wafer tray vertically with respect to the vacuum chamber, and the probe held in the vacuum chamber. The wafer can be brought into contact with the card with high precision.
Further, since the four drive mechanisms are driven synchronously, the wafer tray having a heavier weight than that of the third invention can be moved at high speed and with low vibration.

According to the fifth invention
The wafer tray elevating mechanism is
A ball spline with an integrated ball screw is used for the drive mechanism.
A ball spline is used for the slide mechanism,
It can also be applied to the second to fourth inventions, and the quantity of the drive mechanism can be used from one set to four sets.
The wafer tray can be raised and lowered vertically by raising and lowering the wafer tray holding plate, and the payload of the wafer tray raising and lowering mechanism can be made to correspond to a large weight such as 50 kg, 80 kg, 100 kg, and is low at high speed. It can be raised and lowered by vibration.

According to the sixth invention
The wafer tray elevating mechanism is
A drive mechanism having the vacuum chamber, the wafer tray, the wafer tray holding plate, the ball screw, the slide nut, and the upper bearing and the lower bearing of the ball screw, the drive motor, the slide mechanism, and the above. With a base plate with a lower bearing,
The drive mechanism
The ball screws connected to the drive motor are installed at two diagonally opposite locations of the vacuum chamber and the four corners of the base plate via the upper bearing and the lower bearing.
The slide nuts are installed at two diagonally opposed positions at the four corners of the wafer tray holding plate.
The slide mechanism
Both ends of the slide shaft are connected to the vacuum chamber and two diagonally opposite four corners of the base plate.
By installing the slide unit at two diagonally opposite locations at the four corners of the wafer tray holding plate, the slide unit is installed.
The wafer tray is held horizontally on the wafer tray holding plate, and the drive mechanism can raise and lower the wafer tray vertically with respect to the vacuum chamber, and the probe held in the vacuum chamber. The wafer can be brought into contact with the card with high precision.
Further, since the two drive mechanisms are driven synchronously, the high-weight wafer tray can be moved at high speed and with low vibration.
Although the cost of the mechanical product is lower than that of the third invention, the height of the wafer tray elevating mechanism is increased and the stroke of the wafer positioning stage elevating mechanism is also increased because the base plate is provided.

According to the seventh invention
The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, the drive motor, and the base plate are provided.
The early ball screws connected to the drive motor are installed at four locations of the vacuum chamber and the four corners of the base plate via the upper bearing and the lower bearing.
The drive mechanism in the previous term
By installing the slide nuts at four locations at the four corners of the wafer tray holding plate,
The wafer tray is held horizontally on the wafer tray holding plate, and the drive mechanism can raise and lower the wafer tray vertically with respect to the vacuum chamber, and the probe held in the vacuum chamber. The wafer can be brought into contact with the card with high precision.
Further, since the four drive mechanisms are driven synchronously, the wafer tray having a heavier weight than that of the sixth invention can be moved at high speed and with low vibration.
Since the base plate is provided as in the sixth invention, the height of the wafer tray elevating mechanism is increased, and the stroke of the wafer positioning stage elevating mechanism is also increased.

According to the eighth invention
The wafer positioning unit
Driven by the wafer positioning unit slide mechanism, it is arranged under the wafer test unit so as to face the wafer tray.
A position information photographing mechanism having the wafer positioning stage and a camera is provided.
The wafer positioning stage
An alignment stage that controls the positions in the X, Y, and rotation directions,
An alignment stage swing mechanism that makes the inclination of the wafer tray mounting surface of the alignment stage follow the inclination of the wafer tray, and
By providing a wafer positioning stage elevating mechanism for elevating and elevating the wafer positioning stage,
By pushing up the alignment stage and bringing it into contact with the wafer tray, the wafer tray is pushed up to a height at which it can move back and forth and left and right.
By this push-up, the wafer and the probe card can be aligned. Further, the function of the alignment stage swing mechanism causes the inclination of the alignment stage to follow the inclination of the wafer tray, and moves the wafer tray to a position where the wafer is aligned without changing the inclination of the wafer tray. be able to.
After the electrodes of the wafer and the terminals of the probe card are aligned, the wafer tray is conveyed by the wafer tray elevating mechanism, and the wafer positioning stage is the next scheduled wafer test unit. Can be moved to, and the operating rate of the test equipment can be increased.

According to the ninth invention
The alignment stage swing mechanism is
When the wafer positioning stage is raised, abutting members that come into contact with the four corners of the lower surface of the wafer tray holding plate, a rocking plate having the abutting members at the four corners, and a spherical slide bearing having a movable portion and a fixing portion. A spring member that supports a load applied to the outer peripheral portion of the rocking plate, and a rocking mechanism mounting plate that is installed under the rocking plate with a space for the rocking plate to swing. ,
The abutting member is
When the alignment stage swing mechanism is raised by the wafer positioning stage elevating mechanism and the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface of the alignment stage moves the wafer tray back and forth and left and right. Has a height that can be moved
The spherical plain bearing is
It is installed in the central portion between the rocking plate and the rocking mechanism mounting plate, the movable portion is connected to the rocking plate, and the fixed portion is connected to the rocking mechanism mounting plate.
The spring member is
By arranging a plurality of spherical bearings on the outer peripheral portion where the spherical bearings are installed,
The alignment stage can be swung in all directions, and the load applied to the outer peripheral portion of the swing plate can be balanced by arranging a plurality of the spring members around the spherical slide bearing. ..
Further, according to the tenth invention, the wafer positioning stage is raised by the wafer positioning stage elevating mechanism, so that the abutting members arranged at the four corners of the upper surface of the rocking plate are formed on the lower surface of the wafer tray holding plate. In contact with the four corners, the inclination of the rocking plate follows the inclination of the wafer tray holding plate, and at the same time, the wafer tray mounting surface of the alignment stage can follow the inclination of the wafer tray holding plate.

According to the tenth invention
The wafer positioning stage elevating mechanism
The swing mechanism mounting plate, a drive mechanism having a slide portion and a drive portion, and a wafer positioning unit mounting plate on which a wafer positioning unit is mounted are provided.
By providing the drive mechanism at the four corners of the swing mechanism mounting plate and the wafer positioning unit mounting plate,
The swing mechanism mounting plate is moved up and down by driving the wafer positioning stage elevating mechanism, the abutting member comes into contact with the wafer tray holding plate, and the wafer mounting surface of the alignment stage comes into contact with the wafer tray. The wafer tray is pushed up to a height that allows it to be moved back and forth and left and right.
Since the position of the wafer tray mounting surface is higher than that of the abutting member, when the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface becomes the wafer tray. The wafer tray is pushed up slightly from the holding plate to enable movement in the front-back and left-right directions.
Further, the function of the alignment stage swing mechanism allows the wafer tray to maintain parallelism with the wafer tray holding plate.
Due to the effects of the ninth and tenth inventions, the wafer tray can be pushed up without changing the inclination of the wafer tray, and the wafer and the probe card in the previous period can be aligned with high accuracy.

According to the eleventh invention
Since a pneumatic device is used for the drive mechanism, the wafer positioning stage elevating mechanism can be realized by a simple mechanism.
The drive unit of the drive mechanism may be mounted on either side of the swing mechanism mounting plate or the wafer positioning unit mounting plate.

According to the twelfth invention
The apparatus frame accommodates one set of the wafer test units, and the apparatus frames are connected in the horizontal direction and the vertical direction to form a frame of the wafer test apparatus.
By providing the apparatus frame with a structure in which the wafer positioning unit can be moved laterally corresponding to a plurality of the wafer test units.
The wafer positioning unit can align the wafer placed on the wafer tray with the probe card with respect to all the wafer test units arranged in the lateral direction, and is a simple wafer test apparatus. The frame can be constructed.

It is an external perspective view which shows the main structure of the wafer test apparatus which concerns on 1st Embodiment of this invention. It is a perspective view which shows the wafer test unit which concerns on 2nd, 3rd, 5th Embodiment of this invention. FIG. 3 is a perspective view of the wafer test unit shown in FIG. 2 as viewed from below. It is a perspective view which shows the wafer tray elevating mechanism which concerns on 2nd, 3rd, and 5th Embodiment of this invention. FIG. 5 is a perspective view of the wafer test unit shown in FIG. 4 as viewed from below. It is a perspective view which shows the wafer test unit which concerns on 6th Embodiment of this invention. FIG. 6 is a perspective view of the wafer test unit shown in FIG. 6 as viewed from below. It is a perspective view which shows the wafer tray elevating mechanism which concerns on 6th Embodiment of this invention. FIG. 5 is a perspective view of the wafer test unit shown in FIG. 8 as viewed from below. It is sectional drawing which shows the wafer tray elevating mechanism which concerns on 2nd, 3rd, and 5th Embodiment of this invention. It is a perspective view which shows the wafer positioning unit which concerns on 8th to 12th Embodiment of this invention. It is a perspective view which shows the structure of the wafer positioning unit shown in FIG. FIG. 5 is a front view showing a state in which the wafer tray elevating mechanism is raised and the wafer positioning stage is lowered in a wafer test apparatus equipped with the wafer tray elevating mechanism according to the second, third, and fifth embodiments of the present invention. FIG. 3 is a front view showing a state in which the wafer tray elevating mechanism is lowered in the wafer test apparatus shown in FIG. FIG. 14 is a front view showing a state in which the wafer positioning stage is raised and the wafer tray is pushed up in the wafer test apparatus shown in FIG. It is a front view which shows the state which the wafer tray elevating mechanism is raised, and the wafer positioning stage is lowered in the wafer test apparatus which mounted the wafer tray elevating mechanism which concerns on 6th Embodiment of the invention. FIG. 5 is a front view showing a state in which the wafer tray elevating mechanism is lowered in the wafer test apparatus shown in FIG. FIG. 6 is a front view showing a state in which the wafer positioning stage is raised and the wafer tray is pushed up in the wafer test apparatus shown in FIG. It is a perspective view which shows the state which the wafer test apparatus of this invention is loaded in 4 rows in a row direction, and 3 rows in a row direction. It is a front view of the wafer test apparatus shown in FIG.

Hereinafter, embodiments for carrying out the present invention will be described in more detail with reference to the drawings with reference to a wafer test apparatus including a wafer level burn-in.
Here, in the attached drawings, the same members are designated by the same reference numerals, and duplicate description is omitted.
Since the description here is one embodiment of the present invention, the present invention is not limited to the relevant embodiment.

FIG. 1 shows a wafer test apparatus 10 on which a wafer test unit 20 according to the first embodiment of the present invention is mounted. The wafer test unit 20, the apparatus frame 11, the wafer positioning stage 32, and the position information photographing mechanism 33 are shown. The wafer positioning unit 30 and the wafer positioning unit slide mechanism 31 are provided.

The wafer test unit 20 includes a wafer tray elevating mechanism 60 for elevating and elevating the wafer tray 23 (FIG. 2), and details will be described with reference to FIGS. 11 and 12, but the wafer positioning stage 32 includes an alignment stage 34 and an alignment stage. A swing mechanism 40 and a wafer positioning stage elevating mechanism 50 are provided.

Details of the wafer tray elevating mechanism 60, the alignment stage swing mechanism 40, and the wafer positioning stage elevating mechanism 50 according to the main embodiment of the present invention will be described with reference to FIGS. 2 and 2.

FIG. 2 shows the appearance of the wafer test unit 20 on which the wafer tray elevating mechanism 60 according to the second, third, and fifth embodiments of the present invention is mounted, and shows the load board 16 and the wafer tray elevating mechanism 60. The wafer tray holding plate 61, the wafer tray 23, the frame 25, and the tester unit 26 are displayed, and the wafer tray elevating mechanism 60 is lowered to a position where the wafer 15 is mounted.

FIG. 3 is a perspective view of the wafer test unit 20 of FIG. 2 as viewed from below. The load board 16, the wafer tray elevating mechanism 60, the wafer tray 23, the frame 25, the tester portion 26, and a vacuum are shown. The chamber 24, the probe card 21, and the seal member 22 are displayed.

Although details will be described with reference to FIG. 10, the space surrounded by the vacuum chamber 60, the probe card 21, the sealing member 22b (FIG. 10), the sealing member 22, and the wafer tray 23 is a vacuum mechanism 29 (not shown). Is omitted), and a pressure connection is made between the wafer 15 and the probe card 21.

FIG. 4 is a perspective view showing the wafer tray elevating mechanism 60 according to the second, third, and fifth embodiments of the present invention. The wafer tray elevating mechanism 60 includes the vacuum chamber 24 and a drive mechanism 70. The slide mechanism 80, the wafer tray 23, the wafer tray holding plate 61, the sealing member 22, the sealing member 22a (FIG. 10), the sealing member 22b (FIG. 10), and the probe card 21 (FIG. 5). , Is equipped.

The drive mechanism 70 includes a ball screw 71, a slide shaft 77 that slides by driving the ball screw 71, and a slide unit 76 that fits with the slide shaft.
The slide mechanism 80 includes a slide shaft 81 and a slide unit 82.

Further, the drive mechanism 70 is driven by the drive motor 75 to slide the slide shaft 77. The drive motor 75 is installed in the vacuum chamber 24 from above the load board 16 via a mounting bracket, and in order to lower the height of the test unit, a method of driving the ball screw 71 with a belt is adopted. ing.

The slide unit 76 of the drive mechanism 70 and the slide unit 82 of the slide mechanism 80 are installed at two positions diagonally opposed to each other at the four corners of the vacuum chamber, and the slide shaft 77 of the drive mechanism 70 and the slide mechanism 80 of the slide mechanism 80. The slide shaft 81 is connected to two diagonally opposed positions at the four corners of the wafer tray holding plate 61.

A connecting member 27 connecting the load board 16 (visualized) and the probe card 21 (FIG. 5) is displayed and is arranged inside the vacuum chamber 24. The positional relationship of the members will be described with reference to FIG.

FIG. 5 is a perspective view of the wafer tray elevating mechanism 60 of FIG. 4 as viewed from below, and all of the displayed members are the same as those of FIG. 4 except for the probe card 21 and the seal member 22. The description will be omitted, and the sealing member 22 will be described with reference to FIG.

The wafer tray elevating mechanism 60 according to the fourth embodiment of the present invention has a configuration in which the drive mechanism 70 is installed at all four locations, but other than that, it is the same as in FIGS. 4 and 5. The explanatory diagram is omitted.

FIG. 6 shows the appearance of the wafer test unit 20 on which the wafer tray elevating mechanism 60 according to the sixth embodiment of the present invention is mounted, and shows the load board 16, the wafer tray elevating mechanism 60, and the wafer tray 23. , The frame 25 and the tester unit 26 are displayed, and the wafer tray elevating mechanism 60 is lowered to a position where the wafer is mounted.

FIG. 7 is a perspective view of the wafer test unit 20 of FIG. 6 as viewed from below. The load board 16, the wafer tray elevating mechanism 60, the wafer tray 23, the frame 25, the tester portion 26, and a vacuum are shown. The chamber 24, the probe card 21, and the seal member 22 are displayed.

Although details will be described with reference to FIG. 10, the space surrounded by the vacuum chamber 60, the probe card 21, the sealing member 22b (FIG. 10), the sealing member 22, and the wafer tray 23 is the vacuum mechanism 29 (the vacuum mechanism 29 (FIG. 10). The pressure is reduced by (not shown), and a pressure connection is made between the wafer 15 and the probe card 21.

FIG. 8 is a perspective view showing the wafer tray elevating mechanism 60 according to the sixth embodiment of the present invention. The wafer tray elevating mechanism 60 includes the vacuum chamber 24, the drive mechanism 70, and the slide mechanism 80. The wafer tray 23, the wafer tray holding plate 61, the sealing member 22, the sealing member 22a (FIG. 10), the sealing member 22b (FIG. 10), the probe card 21 (FIG. 9), and the base plate 62. It has.

The drive mechanism 70 includes a ball screw 71a, a slide nut 72, an upper bearing 73 that supports the ball screw 71a, and a lower bearing 74, and the slide mechanism 80 includes a slide shaft 81 and a slide unit 82. The drive mechanism is driven by the drive motor 75, and is driven by the drive motor 75.
The drive motor 75 is installed in the vacuum chamber 24 from above the load board 16 via a mounting bracket, and the drive motor 75 directly drives the ball screw 71a.

The upper bearings 73 of the drive mechanism 70 are installed at two diagonally opposed positions at the four corners of the vacuum chamber, and the slide nut 72 of the drive mechanism 70 and the slide unit 82 of the slide mechanism 80 are the wafer tray holding plates. The lower bearing 74 of the drive mechanism 70 is installed on the base plate 62, and both ends of the slide shaft 81 of the slide mechanism 80 are the vacuum chamber 24 and the base. The ball screw 71a is connected to the drive motor 75, and is connected to two diagonally opposed locations at the four corners of the plate 62.

A connecting member 27 connecting the load board 16 (visualized) and the probe card 21 (FIG. 9) is displayed and is arranged inside the vacuum chamber 24. The positional relationship of the members will be described with reference to FIG.

FIG. 9 is a perspective view of the wafer tray elevating mechanism 60 of FIG. 8 as viewed from below, and all of the displayed members are the same as those of FIG. 4 except for the probe card 21 and the seal member 22. The description will be omitted, and the sealing member 22 will be described with reference to FIG.

The wafer tray elevating mechanism 60 according to the seventh embodiment of the present invention has a configuration in which the drive mechanisms 70 are installed at all four locations, but other than that, it is the same as in FIGS. 8 and 9. The explanatory diagram is omitted.

FIG. 10 is a cross-sectional view showing the configuration of a space (sealed space) surrounded by the vacuum chamber 24 constituting the wafer test unit 20, the probe card 21, and the wafer tray 23.

The wafer tray elevating mechanism 60 is raised (the portion indicated by the alternate long and short dash line in the figure), and is surrounded by the load board 16, the sealing member 22a, the vacuum chamber 24, the sealing member 22b, and the probe card 21 of the previous period. The first enclosed space 24a and
A second sealed space 24b surrounded by the vacuum chamber 24, the sealing member 22b, the early probe card 21, the sealing member 22, and the wafer tray 23 is formed.

By vacuum-sucking the first closed space 24a, an electrical connection between the load board 16 and the probe card 21 is made via the connecting member 27 such as a pogo tower, and the second closed space 24b is provided. Vacuum suction makes an electrical connection between the probe card 21 and the wafer 15.
The vacuum suction is performed by the vacuum mechanism 29, and the pressure of the vacuum mechanism 29 is adjusted to reduce the pressure, pressurize, and open the closed space to atmospheric pressure.

FIG. 11 is a perspective view showing the appearance of each member constituting the wafer positioning unit 30 according to the eighth embodiment of the present invention, which includes the wafer positioning stage 32 and the position information photographing mechanism 33. The wafer positioning unit 30 can be moved in the lateral direction (row direction) by the wafer positioning unit slide mechanism 31.

FIG. 12 is a perspective view showing the appearance of the members constituting the wafer positioning unit 30 according to the eighth to twelfth embodiments of the present invention, and in order to make the configuration of the wafer positioning stage 32 easy to understand, the shaking The alignment stage 34 above the moving plate 41 is separated upward, the swing mechanism mounting plate 44 is separated downward, and the wafer positioning unit mounting plate 52 is also separated downward and displayed.

The wafer positioning stage 32 includes the alignment stage 34 which has the wafer tray mounting portion 35 and controls the positions in the X direction, the Y direction, and the rotation direction, the alignment stage swing mechanism 40, and the wafer positioning stage elevating and lowering. It is equipped with a mechanism 50. Although not shown, the wafer tray mounting portion 35 has a suction port for sucking and holding the wafer tray 23, and is sucked by the vacuum mechanism 29.

The alignment stage swing mechanism 40 according to a ninth embodiment of the present invention includes a swing plate 41 on which the alignment stage 34 is mounted and abutting members 42 that come into contact with four corners of the lower surface of the wafer tray holding plate 61. The swing mechanism mounting plate 44 having a spherical slide bearing 45 at a central position and having a plurality of spring members 46 radially on the outer peripheral portion of the spherical slide bearing 45 is provided.

Further, the central portion of the swing plate 41 is connected to the movable portion (the portion connected to the ball of the ball joint) of the spherical slide bearing 45, and the central portion of the swing mechanism mounting plate 44 is fixed to the spherical slide bearing 45. The rocking space of the rocking plate 41 is secured between the rocking plate 41 and the rocking mechanism mounting plate 44. In this figure, a ball joint type bearing is used for the spherical slide bearing 45, and a leaf spring is used for the spring member 46.

The abutting member 42 raises the alignment stage swing mechanism 40 by the wafer positioning stage elevating mechanism 50, and when the abutting member 42 comes into contact with the wafer tray holding plate 61, the wafer tray of the alignment stage 34 The mounting surface 35 has a height that allows the wafer tray 23 to be moved back and forth and left and right.
The height that can be moved back and forth and left and right may be a height of several millimeters.

The wafer positioning stage elevating mechanism 50 according to the tenth embodiment of the present invention includes the swing mechanism mounting plate 44, a wafer positioning unit mounting plate 52, and a drive mechanism 51 having a slide portion 51b and a drive portion 51a. I have.

The drive portion 51a of the drive mechanism 51 is installed on the wafer positioning unit mounting plate 52, and the tips of the slide portions 51b are connected to the four corners of the swing mechanism mounting plate 44. The installation locations of the drive unit 51a and the slide unit 51b can be exchanged.

FIG. 13 shows the wafer test device 10 equipped with the wafer test device 20 provided with the tray elevating mechanism 60 according to the second, third, and fifth embodiments of the present invention. The wafer tray 23 is pushed up, the wafer positioning stage 32 is stopped downward, and the wafer positioning unit slide mechanism 31 shows a state in which the wafer tray 23 can be moved laterally. The test process is from before the start to the end of the test. Indicates the state.

The wafer positioning stage 32 includes the alignment stage 34, the early alignment stage swing mechanism 40, and the wafer positioning stage elevating mechanism 50.

FIG. 14 shows a state in which the wafer tray elevating mechanism 60 is lowered from the state of FIG. 13 to a position where the wafer 15 is placed, and the wafer is taken out and mounted in this state. Since the structure of the figure is the same as that of FIG. 13, the description of the members will be omitted.

FIG. 15 shows a state in which the wafer positioning stage 32 is pushed up by the wafer positioning stage elevating mechanism 50 from the state of FIG. 14 and the abutting member 42 is in contact with the lower surface of the wafer tray holding plate 61. Although it is difficult to do so, when the abutting member 42 comes into contact with the wafer tray holding plate 61, the wafer tray mounting surface 35 is pushed up by several millimeters from the wafer tray holding plate 61 and moves back and forth and left and right. It is ready to be used.

Further, when the abutting member 42 constituting the alignment stage swing mechanism 40 comes into contact with the wafer tray holding plate 61 in the previous period and stops at four places, the wafer tray mounting surface 35 of the alignment stage 34 can be moved. The inclination of the wafer tray holding plate 61 in the previous period can be followed, and the inclination when the wafer tray 23 is finished to be pushed up is the same as the inclination of the wafer tray holding plate 61, and the wafer 15 and the probe card 21 are inclined. Can be aligned.

Since the height at which the wafer tray 23 is pushed up is a height at which the wafer tray can be moved back and forth and left and right, a pushing height of several millimeters may be sufficient.
Since the structure of the drawings is the same as that of FIGS. 13 and 14, the description of the members will be omitted.

Since the test apparatus using four sets of drive mechanisms according to the fourth embodiment of the present invention is not significantly different from the case of using two drive mechanisms, the illustration and description thereof will be omitted.

FIG. 16 shows the wafer test device 10 equipped with the wafer test device 20 provided with the tray elevating mechanism 60 according to the sixth embodiment of the present invention, in which the wafer tray elevating mechanism 60 provides the wafer tray 23. When pushed up, the wafer positioning stage 32 stops downward, indicating a state in which the wafer positioning stage 32 can be moved laterally by the unit slide mechanism. As the test process, the state from before the start to the end of the test is shown.
Since the structure of the figure is the same as that of FIG. 13, the description of symbols not described is omitted.

FIG. 17 shows a state in which the wafer tray elevating mechanism 60 is lowered from the state of FIG. 16 to a position where the wafer 15 is placed, and the wafer is taken out and mounted in this state. Since the description of the members is the same as that in FIG. 16, the description will be omitted.

FIG. 18 shows a state in which the wafer positioning stage 32 is pushed up by the wafer positioning stage elevating mechanism 50 from the state of FIG. 17, and the abutting member 42 is in contact with the lower surface of the wafer tray holding plate 61. Although difficult to distinguish in the figure, the wafer tray mounting surface 35 pushes the wafer tray up to a height at which the wafer tray can be moved back and forth and left and right when the abutting member 42 comes into contact with the wafer tray holding plate 61.

Further, when the abutting member 42 constituting the alignment stage swing mechanism 40 comes into contact with the wafer tray holding plate 61 of the previous period and stops at four places, the wafer tray mounting surface 35 of the alignment stage 34 becomes the wafer tray mounting surface 35 of the previous period. The inclination of the wafer tray holding plate 61 can be followed, and the inclination when the wafer tray 23 is finished to be pushed up is the same as the inclination of the wafer tray holding plate 61, and the wafer 15 and the probe card 21 are aligned with each other. It can be performed.

Since the height at which the wafer tray 23 is pushed up is such that the wafer tray can be moved back and forth and left and right, a push-up height of several millimeters may be sufficient.
Since the structure of the figure is the same as that of FIG. 16, the description of the members will be omitted.

Since the test apparatus using four types of drive mechanisms according to the seventh embodiment of the present invention is not significantly different from the case where two drive mechanisms are used, the illustration and description thereof will be omitted.

As described above, the wafer positioning stage 32 is pushed up by the functions of the alignment stage swing mechanism 40 and the wafer positioning stage elevating mechanism 50, and the thrusts provided at the four corners of the upper surface of the swing plate 41. When the abutting member 42 comes into contact with the four corners of the lower surface of the wafer tray holding plate 61, the inclination of the alignment stage 34 can be made to follow the inclination of the wafer tray holding plate 61.

The height of the wafer tray mounting surface 35 of the alignment stage 34 is set higher than that of the abutting member 42, so that when the abutting member 42 comes into contact with the wafer tray holding plate 61, the wafer tray Is pushed up by several millimeters from the wafer tray holding plate 61 and is in a state where it can be moved back and forth and left and right.

The centers of the drive mechanism 70 and the slide mechanism 80 constituting the wafer tray elevating mechanism 60 (second to seventh inventions) shown in FIGS. 13 to 15 and 16 to 18 are located at the four corners of the vacuum chamber 24. Although it is installed, it can also be installed outside the vacuum chamber 24.
Considering ensuring the parallelism between the vacuum chamber 24, the probe card 21, and the wafer tray 23 and minimizing the space of the wafer tray elevating mechanism 60, it is considered that the method of installing in the vacuum chamber is the best, and this method is adopted. It is adopted.

FIG. 19 is a perspective view showing a wafer test system 100 in which the wafer test apparatus 10 according to the eleventh embodiment of the present invention is loaded with four types in the row direction and three types in the step direction.
The wafer positioning unit 32 slides in the row direction by the wafer positioning unit slide mechanism 31, and can handle tests in any row.

FIG. 20 shows a front view of the wafer test system 100 configured with FIG. The wafer positioning unit 32 slides laterally on the slide unit 31 and can handle any row of tests.

Since the present invention is configured as described above, it is possible to specifically deal with the following problems.
The process of raising and lowering the wafer tray by the wafer positioning stage is separated from the wafer positioning stage, and a wafer tray raising and lowering mechanism is provided as a means for ensuring parallelism with the probe card and raising and lowering the wafer tray vertically.
The wafer positioning stage is responsible only for the wafer alignment process, and the alignment stage swing mechanism is used as a means for raising and lowering the wafer tray mounting surface perpendicular to the plane of the wafer tray by following the inclination of the wafer tray. By providing a wafer positioning stage elevating mechanism
It is possible to provide a highly accurate alignment between a wafer electrode and a probe card terminal and a wafer test apparatus having a high operating rate.

10 Wafer test equipment 11 Equipment frame 15 Wafer 16 Load board 20 Wafer test unit 21 Probe card 22 Sealing member 22a Sealing member 22b Sealing member 23 Wafer tray 24 Vacuum chamber 24a First sealed space 24b Second sealed space 25 Frame 26 Tester Part 27 Connection member 29 Vacuum mechanism 30 Wafer positioning unit 31 Wafer positioning unit Slide mechanism 32 Wafer positioning stage 33 Position information imaging mechanism 34 Alignment stage 35 Wafer tray mounting part 40 Alignment stage swing mechanism 41 Swing plate 42 Butting member 44 Swing mechanism mounting plate 45 Spherical sliding bearing 46 Spring member 50 Wafer positioning stage elevating mechanism 51 Drive mechanism 51a Drive unit 51b Slide unit 52 Wafer positioning unit mounting plate 60 Wafer tray elevating mechanism 61 Wafer tray holding plate 62 Base plate 70 Drive mechanism 71 Ball screw 71a Ball screw 72 Slide nut 73 Upper bearing 74 Lower bearing 75 Drive motor 76 Slide unit 77 Slide shaft 80 Slide mechanism 81 Slide shaft 82 Slide unit 100 Wafer test system

The present invention relates to a wafer test apparatus, and more particularly, a probe card having a terminal for contacting a wafer electrode used in a wafer burn-in test apparatus, a post-process test apparatus, a pre-process test apparatus, and the like. An alignment that controls the position of a wafer test unit having a load board on which a test circuit or the like is mounted, a wafer tray on which a wafer is mounted, and a wafer mounted on the wafer tray in the X, Y, and circumferential directions. The present invention relates to a wafer testing apparatus including a wafer positioning unit having a stage, and performing a test by pressurizing and contacting a wafer electrode and a probe card terminal with vacuum pressure.

Similar to the semiconductor package test, the wafer test is performed in an environment of high temperature or low temperature by using a test device called a prober to perform an electrical property test such as a stress test or a functional test.
After the wafer test is completed, it is mounted on a burn-in socket or a test socket as a semiconductor package through a wafer cutting / assembling process, and a burn-in test or a post-process test is performed.

On the other hand, in the wafer test, the wafer chuck part of the prober device is separated into the wafer tray and the wafer positioning stage to realize a multi-wafer test device with a multi-stage configuration, and the space surrounded by the probe card and the wafer tray is evacuated. Patent Document 1 discloses a wafer inspection device that tests a wafer by making a pressure contact with the wafer.

In Patent Document 1, a wafer is placed on a chuck member via a wafer tray and conveyed to a position facing the probe card, and the conveyed wafer together with the wafer tray is directed toward the probe card by using an elevating device. After moving and bringing the plurality of electrodes of the semiconductor device provided on the wafer into contact with the plurality of terminals provided on the probe card, the wafer is further overdriven toward the probe card, and then the probe card and the wafer are further driven. The space between the tray and the probe card is depressurized to maintain the contact state between the electrodes of the semiconductor device and the terminals of the probe card, and the means for contacting the probe card that separates the chuck member from the wafer tray is disclosed. The invention is disclosed to move to a position corresponding to another probe card to prepare for the next wafer test.

That is, in the invention according to Patent Document 1, vacuum pressure is used for electrical connection between the wafer mounted on the wafer tray, which is the wafer mounting stage, and the probe card, and the wafer mounting stage is the wafer tray and the wafer tray. A multi-stage wafer inspection device has been realized by adopting a method of separating into wafer positioning stages equipped with a push-up alignment mechanism.

Patent No. 6031292

In the invention described in Patent Document 1, the wafer mounting portion is separated into a wafer tray and a member that pushes up the wafer tray, a unit provided with the member and an alignment mechanism is used as a wafer positioning stage, and the wafer is mounted on the wafer tray for alignment. The wafer tray is pushed up to the probe card side, sucked by vacuum pressure, and then the wafer positioning stage is lowered and moved to prepare for mounting, aligning, and taking out the wafer on the next prober. , The height of the prober mechanism is lower than that of the conventional device, and a multi-stage wafer inspection device is realized.
However, since the wafer tray on which the wafer is placed is raised and lowered by raising and lowering the wafer positioning stage, vertical raising and lowering of the wafer positioning stage and horizontality of the probe card mounted on the test unit are important. When the test units are loaded in multiple stages, there is a problem that the horizontal mounting of each test unit and the vertical elevation of the wafer positioning stage greatly affect the position accuracy, and higher accuracy assembly is required.
Furthermore, the wafer positioning stage is separated from the probe card of the wafer tray by raising the wafer positioning stage at the start of the test, lowered to the wafer take-out position, mounted on the wafer (there is also a wafer take-out process after the test is performed), and the wafer. The problem is that one test unit must spend a long time involved in all processes from alignment of the electrodes of the probe card to the terminals of the probe card, contact with the probe card by raising the wafer tray, and suction by the vacuum mechanism. was there.

Therefore, the problem to be solved by the present invention is
The wafer test unit is provided with a means for separating the process of raising and lowering the wafer tray by the wafer positioning stage from the wafer positioning stage, ensuring parallelism with the probe card, and raising and lowering the wafer tray vertically.
The wafer positioning stage is provided with means for carrying out only the wafer alignment process, making the wafer tray mounting surface follow the inclination of the wafer tray, and raising and lowering a short distance perpendicular to the plane of the wafer tray. , Highly accurate alignment and high operating rate test equipment can be provided.

The means for solving the problem of the present invention is as follows.

First,
This is a wafer test device that conducts tests by pressurizing and contacting the electrodes of the wafer and the terminals of the probe card with vacuum pressure.
Around a load board on which a test circuit or the like is mounted, a probe card, a wafer tray on which the wafer is placed, a space sandwiched between the load board and the probe card, and a space sandwiched between the probe card and the wafer tray. A wafer test unit with a vacuum chamber that surrounds and forms an enclosed space,
A wafer that is arranged under the wafer test unit, has a wafer positioning stage on which the wafer tray is placed and aligns between the electrodes of the wafer and the terminals of the probe card, and a position information photographing mechanism equipped with a camera. Positioning unit and
A wafer positioning unit slide mechanism that conveys the wafer positioning unit in the lateral direction,
An apparatus frame on which the wafer test unit is mounted and
With
The wafer test unit is
A wafer test apparatus comprising a wafer tray elevating mechanism for elevating and elevating the wafer tray between a position on which the wafer is placed and a position in contact with the vacuum chamber.

Second,
The wafer tray elevating mechanism is
With the vacuum chamber
A wafer tray holding plate on which the wafer tray is placed and a wafer tray holding plate
A drive mechanism having a ball screw, a slide shaft that slides by driving the ball screw, and a slide unit that fits with the slide shaft.
The drive motor that drives the ball screw and
A slide mechanism with a slide shaft and a slide unit,
With
The drive mechanism
The slide unit is installed at the required locations at the four corners of the vacuum chamber.
The tips of the slide shafts of the previous term are connected to the four corners of the wafer tray holding plate facing the locations where the slide units are installed.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide unit is installed at four corners of the vacuum chamber where the slide unit of the drive mechanism is not installed.
The wafer test apparatus according to the first aspect, wherein the tips of the slide shafts are connected to the four corners of the wafer tray holding plate where the slide shafts of the drive mechanism are not installed.

Third,
The required location where the drive mechanism of the wafer tray elevating mechanism is installed is
The required number can be selected from 1 to 4 depending on the load applied to the wafer tray holding plate and the speed at which the wafer tray holding plate is moved up and down.
The wafer test apparatus according to the second description, wherein the place to be installed is determined only in the case of two places, and in the case of two places, the wafer is installed in two places diagonally opposite to each other at the four corners.

Fourth,
The wafer tray elevating mechanism is
A ball spline with an integrated ball screw is used for the drive mechanism.
The second to third wafer test apparatus according to the second to third feature, wherein a ball spline is used for the slide mechanism.

Fifth,
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray holding plate
A drive mechanism having a ball screw, a slide nut, and an upper bearing and a lower bearing of the ball screw.
With the drive motor
With the slide mechanism
The lower bearing, the base plate on which the lower end of the slide shaft of the slide mechanism is installed, and
With
The drive mechanism
Early ball screws connected to the drive motor are installed at required locations at the four corners of the vacuum chamber and the base plate via the upper bearing and the lower bearing.
The slide nuts of the previous term are installed at the four corners of the wafer tray holding plate so as to face the locations where the upper bearings and the lower bearings are installed .
The slide mechanism
Both ends of the slide shaft in the previous period are connected to the vacuum chamber and the four corners of the base plate where the upper and lower bearings of the drive mechanism are not installed .
The wafer test apparatus according to the first aspect, wherein the slide unit of the first term is installed at four corners of the wafer tray holding plate where the slide nuts of the drive mechanism are not installed.

Sixth,
The required location where the drive mechanism of the wafer tray elevating mechanism is installed is
The required number can be selected from 1 to 4 depending on the load applied to the wafer tray holding plate and the speed at which the wafer tray holding plate is moved up and down.
The wafer test apparatus according to a fifth feature, wherein the place where the wafer is installed is determined only in the case of two places, and in the case of the case of two places, the wafer is installed in two places diagonally opposite to each other at the four corners.

Seventh,
The wafer positioning stage is
The wafer positioning unit is configured,
Driven by the wafer positioning unit slide mechanism, it is arranged under the wafer test unit so as to face the wafer tray.
An alignment stage that controls the positions in the X, Y, and rotation directions,
An alignment stage swing mechanism that makes the inclination of the wafer tray mounting surface of the alignment stage follow the inclination of the wafer tray.
A wafer positioning stage elevating mechanism that elevates and elevates the wafer positioning stage,
The wafer test unit according to the first to sixth.

Eighth,
The alignment stage swing mechanism is
When the wafer positioning stage rises,
Abutting members that come into contact with the four corners of the lower surface of the wafer tray holding plate, and
A rocking plate having the abutting member at the four corners,
Spherical plain bearings with moving and fixed parts,
A spring member that supports the load applied to the outer peripheral portion of the rocking plate, and
A rocking mechanism mounting plate installed with a space for the rocking plate to swing under the rocking plate, and a rocking mechanism mounting plate.
With
The abutting member is
When the alignment stage swing mechanism is raised by the wafer positioning stage elevating mechanism and the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface of the alignment stage moves the wafer tray back and forth and left and right. Has a height that can be
The spherical plain bearing is
Installed in the central part between the rocking plate and the rocking mechanism mounting plate,
The movable portion is connected to the rocking plate, and the fixed portion is connected to the rocking mechanism mounting plate.
The spring member is
The wafer test apparatus according to a seventh aspect, wherein a plurality of the spherical bearings are arranged on the outer peripheral portion where the spherical bearings are installed.

Ninth,
The wafer positioning stage elevating mechanism
With the swing mechanism mounting plate
A drive mechanism with a slide unit and a drive unit,
A wafer positioning unit mounting plate on which the wafer positioning unit is mounted and a wafer positioning unit mounting plate.
With
Wafer testing unit according to the seventh the driving mechanism, and which are located at the four corners between the swing mechanism mounting plate and the wafer positioning unit mounting plate.

Tenth,
The device frame
The wafer test unit is housed , and the device frame is connected in the horizontal direction and the vertical direction to form a frame of the wafer test device.
The wafer test unit according to the first to ninth aspects, wherein the apparatus frame is provided with a structure in which the wafer positioning unit is movable in the lateral direction corresponding to a plurality of the wafer test units.

According to the present invention, the following effects can be obtained.

According to the first invention
This is a wafer test device that conducts tests by pressurizing and contacting the electrodes of the wafer and the terminals of the probe card with vacuum pressure.
Around a load board on which a test circuit or the like is mounted, a probe card, a wafer tray on which the wafer is placed, a space sandwiched between the load board and the probe card, and a space sandwiched between the probe card and the wafer tray. A wafer test unit with a vacuum chamber that surrounds and forms an enclosed space,
A wafer that is arranged under the wafer test unit, has a wafer positioning stage on which the wafer tray is placed and aligns between the electrodes of the wafer and the terminals of the probe card, and a position information photographing mechanism equipped with a camera. Positioning unit and
A wafer positioning unit slide mechanism that conveys the wafer positioning unit in the lateral direction,
An apparatus frame on which the wafer test unit is mounted and
With
The wafer test unit is
By providing the wafer tray elevating mechanism for elevating and lowering the wafer tray between the position where the wafer is placed and the position where the wafer is in contact with the vacuum chamber.
The wafer tray on which the wafer is placed can be raised and lowered by the wafer test unit itself without being carried by the wafer positioning unit to prevent misalignment due to movement of the wafer and probe card after alignment, resulting in high accuracy. Can be aligned.
The wafer positioning unit can be moved in preparation for the next test, and the operating rate of the test apparatus can be increased.

According to the second invention
The wafer tray elevating mechanism is
With the vacuum chamber
A wafer tray holding plate on which the wafer tray is placed and a wafer tray holding plate
A drive mechanism having a ball screw, a slide shaft that slides by driving the ball screw, and a slide unit that fits with the slide shaft.
The drive motor that drives the ball screw and
A slide mechanism with a slide shaft and a slide unit,
With
The drive mechanism
The slide unit is installed at the required locations at the four corners of the vacuum chamber.
The tips of the slide shafts of the previous term are connected to the four corners of the wafer tray holding plate facing the locations where the slide units are installed.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide unit is installed at four corners of the vacuum chamber where the slide unit of the drive mechanism is not installed.
The tips of the slide shafts are connected to the four corners of the wafer tray holding plate where the slide shafts of the drive mechanism are not installed.
The wafer tray placed on the wafer tray holding plate can be moved up and down between a position in contact with the vacuum chamber and a position on which the wafer is placed.
The wafer tray is held horizontally on the wafer tray holding plate, and the wafer tray can be moved up and down perpendicularly to the vacuum chamber by driving the drive mechanism, and is sucked and held in the vacuum chamber. The wafer can be brought into contact with the probe card with high precision.

According to the third invention
The required location where the drive mechanism of the wafer tray elevating mechanism is installed is
The required number can be selected from 1 to 4 depending on the load applied to the wafer tray holding plate and the speed at which the wafer tray holding plate is moved up and down.
The place to be installed is determined only in the case of two places, and in the case of two places, it is installed in two places diagonally facing each other at the four corners.
The optimum required number can be selected according to the payload required by the wafer tray holding plate and the ascending / descending speed. When a plurality of the driving mechanisms are installed, the plurality of the driving mechanisms are driven in synchronization with each other. As a result, the payload of the wafer tray holding plate can be increased, and the wafer tray can be raised and lowered at high speed and with low vibration.

According to the fourth invention
The wafer tray elevating mechanism is
A ball spline with an integrated ball screw is used for the drive mechanism.
By using a ball spline for the slide mechanism,
Commercially available products can be used for the drive mechanism and the slide mechanism, the tray elevating mechanism can be easily constructed, and the wafer tray holding plate can be elevated vertically, at high speed and with low vibration, and the drive mechanism can be installed. Depending on the number, the payload of the wafer tray holding plate can be increased to a large weight such as 50 kg, 80 kg, or 100 kg.

According to the fifth invention
The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray holding plate
A drive mechanism having a ball screw, a slide nut, and an upper bearing and a lower bearing of the ball screw.
With the drive motor
With the slide mechanism
The lower bearing, the base plate on which the lower end of the slide shaft of the slide mechanism is installed, and
With
The drive mechanism
Early ball screws connected to the drive motor are installed at required locations at the four corners of the vacuum chamber and the base plate via the upper bearing and the lower bearing.
The slide nuts of the previous term are installed at the four corners of the wafer tray holding plate so as to face the locations where the upper bearings and the lower bearings are installed .
The slide mechanism
Both ends of the slide shaft in the previous period are connected to the vacuum chamber and the four corners of the base plate where the upper and lower bearings of the drive mechanism are not installed .
By installing the slide unit in the previous term at the four corners of the wafer tray holding plate where the slide nuts of the drive mechanism are not installed.
The wafer tray placed on the wafer tray holding plate can be moved up and down between a position in contact with the vacuum chamber and a position on which the wafer is placed, and the wafer tray becomes the wafer. The wafer is held horizontally on the tray holding plate, and the wafer tray can be moved up and down perpendicularly to the vacuum chamber by driving the drive mechanism, and the wafer is sucked and held by the vacuum chamber on the probe card. Can be contacted with high precision.
Although the cost of the mechanical product is lower than that of the second invention, the height of the wafer tray elevating mechanism is increased and the stroke of the wafer positioning stage elevating mechanism is also increased because the base plate is provided.

According to the sixth invention
The required location where the drive mechanism of the wafer tray elevating mechanism is installed is
The required number can be selected from 1 to 4 depending on the load applied to the wafer tray holding plate and the speed at which the wafer tray holding plate is moved up and down.
The place to be installed is determined only in the case of two places, and in the case of two places, it is installed in two places diagonally facing each other at the four corners.
The optimum required number can be selected according to the payload required by the wafer tray holding plate and the ascending / descending speed. When a plurality of the driving mechanisms are installed, the plurality of the driving mechanisms are driven in synchronization with each other. As a result, the payload of the wafer tray holding plate can be increased, and the wafer tray can be raised and lowered at high speed and with low vibration.

According to the seventh invention
The wafer positioning stage is
The wafer positioning unit is configured,
Driven by the wafer positioning unit slide mechanism, it is arranged under the wafer test unit so as to face the wafer tray.
An alignment stage that controls the positions in the X, Y, and rotation directions,
An alignment stage swing mechanism that makes the inclination of the wafer tray mounting surface of the alignment stage follow the inclination of the wafer tray.
A wafer positioning stage elevating mechanism that elevates and elevates the wafer positioning stage,
By providing
By pushing up the alignment stage and bringing it into contact with the wafer tray, the wafer tray is pushed up to a height at which it can move back and forth and left and right.
By this push-up, the wafer and the probe card can be aligned. Further, the tilt of the alignment stage is made to follow the tilt of the wafer tray by the function of the alignment stage swing mechanism, and the wafer tray is aligned with the wafer and the probe card without changing the tilt of the wafer tray. it can be moved to a position to perform.
The transfer of the wafer tray after the alignment is performed is performed by the wafer tray elevating mechanism, and the wafer positioning stage can be moved to the next scheduled wafer test unit of the test apparatus. The operating rate can be increased.

According to the eighth invention
The alignment stage swing mechanism is
When the wafer positioning stage rises,
Abutting members that come into contact with the four corners of the lower surface of the wafer tray holding plate, and
A rocking plate having the abutting member at the four corners,
Spherical plain bearings with moving and fixed parts,
A spring member that supports the load applied to the outer peripheral portion of the rocking plate, and
A rocking mechanism mounting plate installed with a space for the rocking plate to swing under the rocking plate, and a rocking mechanism mounting plate.
With
The abutting member is
When the alignment stage swing mechanism is raised by the wafer positioning stage elevating mechanism and the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface of the alignment stage moves the wafer tray back and forth and left and right. Has a height that can be
The spherical plain bearing is
Installed in the central part between the rocking plate and the rocking mechanism mounting plate,
The movable portion is connected to the rocking plate, and the fixed portion is connected to the rocking mechanism mounting plate.
The spring member is
By arranging a plurality of spherical bearings on the outer peripheral portion where they are installed,
The alignment stage can swing in all directions, and the load applied to the outer peripheral portion of the swing plate can be balanced by arranging the plurality of the spring members around the spherical slide bearing. ..
Further, the wafer positioning stage is raised by the wafer positioning stage elevating mechanism , and the abutting member arranged on the rocking plate comes into contact with the four corners of the lower surface of the wafer tray holding plate, thereby causing the rocking plate. Follows the inclination of the wafer tray holding plate.
Since the rocking plate mounts the alignment stage, the wafer tray mounting surface of the alignment stage can follow the inclination of the wafer tray holding plate.
Further, since the wafer tray is suction-held by the wafer tray holding plate, the wafer tray mounting surface of the alignment stage can obtain the same inclination as the wafer tray.
In the abutting member, when the alignment stage swing mechanism is raised by the wafer positioning stage elevating mechanism and the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface of the alignment stage is said to be the same. Since the wafer tray has a height that allows it to move back and forth and left and right, it is possible to align the wafer mounted on the wafer tray with the probe card.

According to the ninth invention
The wafer positioning stage elevating mechanism
With the swing mechanism mounting plate
A drive mechanism with a slide unit and a drive unit,
A wafer positioning unit mounting plate on which the wafer positioning unit is mounted and a wafer positioning unit mounting plate.
With
By the driving mechanism is provided at the four corners between the wafer positioning unit mounting plate and the rocking mechanism mounting plate,
The swing mechanism mounting plate is raised by driving the wafer positioning stage elevating mechanism, and the abutting member comes into contact with the wafer tray holding plate, and at the same time , the wafer mounting surface of the alignment stage comes into contact with the wafer tray. The wafer tray is pushed up to a height that allows it to be moved back and forth and left and right.
Since the position of the wafer tray mounting surface is higher than that of the abutting member, when the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface becomes the wafer tray. The wafer tray is pushed up slightly from the holding plate to enable movement in the front-back and left-right directions.
Further, the function of the alignment stage swing mechanism allows the wafer tray to maintain parallelism with the wafer tray holding plate.
In combination with the effect of the eighth invention, the wafer tray can be pushed up without changing the inclination of the wafer tray, and the alignment between the wafer and the probe card in the previous period can be performed with high accuracy.

According to the tenth invention
The device frame
The wafer test unit is housed , and the device frame is connected in the horizontal direction and the vertical direction to form a frame of the wafer test device.
By providing the apparatus frame with a structure in which the wafer positioning unit can be moved laterally corresponding to a plurality of the wafer test units.
The wafer positioning unit can align the wafer placed on the wafer tray with the probe card with respect to all the wafer test units arranged in the lateral direction, and is a simple wafer test apparatus. The frame can be constructed.

It is an external perspective view which shows the main structure of the wafer test apparatus which concerns on 1st Embodiment of this invention. It is a perspective view which shows the wafer test unit provided with the wafer tray elevating mechanism which concerns on 1st and 2nd to 4th Embodiment of this invention. FIG. 3 is a perspective view of the wafer test unit shown in FIG. 2 as viewed from below. It is a perspective view which shows the wafer tray elevating mechanism which concerns on 2nd to 4th Embodiment of this invention. FIG. 5 is a perspective view of the wafer test unit shown in FIG. 4 as viewed from below. It is a perspective view which shows the wafer test unit provided with the wafer tray elevating mechanism which concerns on 5th and 6th Embodiment of this invention. FIG. 6 is a perspective view of the wafer test unit shown in FIG. 6 as viewed from below. It is a perspective view which shows the wafer tray elevating mechanism which concerns on 5th and 6th Embodiment of this invention. FIG. 8 is a perspective view of the wafer tray elevating mechanism shown in FIG. 8 as viewed from below. It is a front view (cross section ) which shows the arrangement of the wafer test unit and the wafer tray elevating mechanism which concerns on 1st to 4th Embodiment of this invention. It is a perspective view which shows the wafer positioning unit which includes the wafer positioning stage which concerns on 7th to 9th Embodiment of this invention. It is a perspective view which shows the structure of the wafer positioning unit shown in FIG. In a wafer test apparatus equipped with a wafer test unit provided with a wafer tray elevating mechanism according to the second to fourth embodiments of the present invention, a front surface showing a state in which the wafer tray elevating mechanism is raised and the wafer positioning stage is lowered. It is a figure. FIG. 3 is a front view showing a state in which the wafer tray elevating mechanism is lowered in the wafer test apparatus shown in FIG. FIG. 14 is a front view showing a state in which the wafer positioning stage is raised and the wafer tray is pushed up in the wafer test apparatus shown in FIG. In a wafer test apparatus equipped with a wafer test unit provided with a wafer tray elevating mechanism according to the fifth and sixth embodiments of the present invention, a front surface showing a state in which the wafer tray elevating mechanism is raised and the wafer positioning stage is lowered. It is a figure. FIG. 5 is a front view showing a state in which the wafer tray elevating mechanism is lowered in the wafer test apparatus shown in FIG. FIG. 6 is a front view showing a state in which the wafer positioning stage is raised and the wafer tray is pushed up in the wafer test apparatus shown in FIG. It is a perspective view which shows the state which the wafer test apparatus which concerns on 1st to 10th Embodiment of this invention is loaded in 4 rows in a row direction, and 3 stages in a row direction. It is a front view of the wafer test apparatus shown in FIG.

Hereinafter, embodiments for carrying out the present invention will be described in more detail with reference to the drawings with reference to a wafer test apparatus including a wafer level burn-in.
Here, in the attached drawings, the same members are designated by the same reference numerals, and duplicate description is omitted.
Since the description here is one embodiment of the present invention, the present invention is not limited to the relevant embodiment.

FIG. 1 shows a wafer test apparatus 10 on which a wafer test unit 20 according to the first embodiment of the present invention is mounted. The wafer test unit 20, the apparatus frame 11, the wafer positioning stage 32, and the position information photographing mechanism 33 are shown. The wafer positioning unit 30 and the wafer positioning unit slide mechanism 31 are provided.

The wafer test unit 20 includes a wafer tray elevating mechanism 60 for elevating and elevating the wafer tray 23 (FIG. 2), and details will be described with reference to FIGS. 11 and 12, but the wafer positioning stage 32 includes an alignment stage 34 and an alignment stage. A swing mechanism 40 and a wafer positioning stage elevating mechanism 50 are provided.

Details of the wafer tray elevating mechanism 60, the alignment stage swing mechanism 40, and the wafer positioning stage elevating mechanism 50 according to the main embodiment of the present invention will be described with reference to FIGS. 2 and 2.

FIG. 2 shows the appearance of the wafer test unit 20 provided with the wafer tray elevating mechanism 60 according to the second to fourth embodiments of the present invention, showing the load board 16, the wafer tray elevating mechanism 60, and the wafer tray. The holding plate 61, the wafer tray 23, the frame 25, and the tester unit 26 are displayed, and the wafer tray elevating mechanism 60 is lowered to a position where the wafer 15 (FIG. 4) is mounted.

Figure 3 is a perspective view of the wafer testing unit 20 as viewed from below in FIG. 2, and the wafer tray elevating mechanism 60 and the low Dobodo 16, and the wafer tray 23, and the frame 25, the tester 26 , The vacuum chamber 24 , the probe card 21, and the seal member 22 are displayed.

Although details will be described with reference to FIG. 10, the space surrounded by the vacuum chamber 60, the probe card 21, the seal member 22b (FIG. 10), and the seal member 22 , the vacuum chamber 60, the wafer tray 23, and the previous period seal. The space surrounded by the member 22b and the early seal member 22 is depressurized by a vacuum mechanism 29 (not shown), and a pressure connection is made between the wafer 15 and the probe card 21.

FIG. 4 is a perspective view showing the wafer tray elevating mechanism 60 according to the second to fourth embodiments of the present invention, wherein the wafer tray elevating mechanism 60 includes the vacuum chamber 24, a drive mechanism 70, and a slide mechanism 80. The wafer tray holding plate 61 , the sealing member 22, the sealing member 22a (FIG. 10), and the sealing member 22b (FIG. 10) are provided. The wafer tray 23 and the connecting member 27 are displayed for easy understanding.

The drive mechanism 70 includes a ball screw 71, a slide shaft 77 that slides by driving the ball screw 71, and a slide unit 76 that fits with the slide shaft.
The slide mechanism 80 includes a slide shaft 81 and a slide unit 82.

Further, the drive mechanism 70 is driven by the drive motor 75 to slide the slide shaft 77. The drive motor 75 is installed in the vacuum chamber 24 from above the load board 16 via a mounting bracket, and in order to lower the height of the test unit, a method of driving the ball screw 71 with a belt is adopted. ing.

The slide units 76 of the drive mechanism 70 are installed at two diagonally opposed positions at the four corners of the vacuum chamber 24, and the slide units 82 of the slide mechanism 80 are the vacuum chambers in which the slide unit 76 of the drive mechanism 70 is not installed. It is installed at two diagonally opposite locations at the four corners of the 24.

Further, the slide shaft 77 of the drive mechanism 70 and the slide shaft 81 of the slide mechanism 80 are connected to two diagonally opposite positions of the four corners of the wafer tray holding plate 61, respectively.

The connecting member 27 that connects the load board 16 (visualized) and the probe card 21 (FIG. 5) is displayed and is arranged inside the vacuum chamber 24. The positional relationship of the members will be described with reference to FIG.

FIG. 5 is a perspective view of the wafer tray elevating mechanism 60 of FIG. 4 as viewed from below, and all of the displayed members are the same as those of FIG. 4 except for the probe card 21 and the seal member 22. The description will be omitted, and the sealing member 22 will be described with reference to FIG.

FIG. 6 shows the appearance of the wafer test unit 20 provided with the wafer tray elevating mechanism 60 according to the fifth and sixth embodiments of the present invention, and shows the load board 16 , the wafer tray elevating mechanism 60, and the above. The wafer tray 23, the frame 25, and the tester unit 26 are displayed, and the wafer tray elevating mechanism 60 is lowered to a position where the wafer 15 is mounted.

FIG. 7 is a perspective view of the wafer test unit 20 of FIG. 6 as viewed from below. The load board 16 , the wafer tray elevating mechanism 60, the wafer tray 23, the frame 25, and the tester unit 26. , The vacuum chamber 24 , the probe card 21, and the seal member 22 are displayed.

Although details will be described with reference to FIG. 10, the vacuum chamber 60, the probe card 21, the sealing member 22b , the space surrounded by the sealing member 22 , the vacuum chamber 60, the wafer tray 23, and the early sealing member 22b. The space surrounded by the seal member 22 in the first half is decompressed by the vacuum mechanism 29, and a pressure connection is made between the wafer 15 and the probe card 21.

FIG. 8 is a perspective view showing the wafer tray elevating mechanism 60 according to the fifth and sixth embodiments of the present invention, in which the wafer tray elevating mechanism 60 includes the vacuum chamber 24, a drive mechanism 70, and a slide mechanism. 80, the wafer tray holding plate 61 , the sealing member 22, the sealing member 22a (FIG. 10), the sealing member 22b (FIG. 10), and the base plate 62 are provided. The connecting member 27, the probe card 21, and the wafer tray 23 are displayed for easy understanding.

The drive mechanism 70 includes a ball screw 71a, a slide nut 72, an upper bearing 73 that supports the ball screw 71a, and a lower bearing 74, and the slide mechanism 80 includes the slide shaft 81 and the slide unit 82 .
The drive mechanism is driven by the drive motor 75, and the drive motor 75 is installed in the vacuum chamber 24 from above the load board 16 via a mounting bracket, and the drive motor 75 directly drives the ball screw 71a. The method is adopted.

The early ball screws 71a of the drive mechanism 70 are installed at two positions diagonally opposed to each other at the four corners of the vacuum chamber 24 via the upper bearing 73, and diagonally at the four corners of the base plate 62 via the lower bearing 74. The slide nuts 72 are installed at two opposite locations, and the slide nuts 72 of the previous term are installed at the four corners of the wafer tray holding plate 61 so as to face the locations where the upper bearings 73 and the lower bearings 74 are installed.

Further, in the slide mechanism 80, both ends of the slide shaft 81 in the previous period are connected to the vacuum chamber 24 and the four corners of the base plate 62 where the upper bearing 73 and the lower bearing 74 of the drive mechanism 70 are not installed.
The slide unit 82 of the previous term is installed at the four corners of the wafer tray holding plate 61 so as to face the positions where the slide shafts 81 are connected.

A connecting member 27 connecting the load board 16 (visualized) and the probe card 21 (FIG. 9) is displayed and is arranged inside the vacuum chamber 24. The positional relationship of the members will be described with reference to FIG.

FIG. 9 is a perspective view of the wafer tray elevating mechanism 60 of FIG. 8 as viewed from below, and all of the displayed members are the same as those of FIG. 8 except for the probe card 21 and the seal member 22. The description will be omitted, and the sealing member 22 will be described with reference to FIG.

FIG. 10 shows the configuration of two spaces (sealed spaces) surrounded by the load board 16 constituting the wafer test unit 20, the vacuum chamber 24, the probe card 21, and the wafer tray 23. It is a cross-sectional view.

By ascending the wafer tray elevating mechanism 60 (the portion indicated by the alternate long and short dash line in the figure), the load board 16, the sealing member 22a , the vacuum chamber 24, the sealing member 22b, and the probe card 21 of the previous period are used. The first enclosed space 24a surrounded by
A second sealed space 24b surrounded by the vacuum chamber 24, the sealing member 22b , the early probe card 21, the sealing member 22, and the wafer tray 23 is formed.

By vacuum-sucking the first closed space 24a, an electrical connection between the load board 16 and the probe card 21 is made via the connecting member 27 such as a pogo tower, and the second closed space 24b is provided. Vacuum suction makes an electrical connection between the probe card 21 and the wafer 15.
The vacuum suction is performed by the vacuum mechanism 29, and the pressure of the vacuum mechanism 29 is adjusted to reduce the pressure, pressurize, and open the closed space to atmospheric pressure.

FIG. 11 is a perspective view showing the appearance of the wafer positioning unit 30 provided with the wafer positioning stage 32 according to the seventh to ninth embodiments of the present invention, and is a perspective view showing the wafer positioning stage 32 and the position information photographing mechanism. The wafer positioning unit 30 can be moved in the lateral direction (row direction) by the wafer positioning unit slide mechanism 31.

FIG. 12 is a perspective view showing the appearance of the members constituting the wafer positioning stage 32 according to the seventh to ninth embodiments of the present invention, and is above the rocking plate 41 in order to make the configuration easy to understand. The alignment stage 34 is separated upward, the swing mechanism mounting plate 44 is separated downward, and the wafer positioning unit mounting plate 52 is also separated downward and displayed.

The wafer positioning stage 32 includes the alignment stage 34 which has the wafer tray mounting surface 35 and controls the positions in the X, Y, and rotation directions, the alignment stage swing mechanism 40, and the wafer positioning stage elevating and lowering. It is equipped with a mechanism 50. Although not shown, the wafer tray mounting surface 35 has a suction port for sucking and holding the wafer tray 23, and is sucked by the vacuum mechanism 29.

The alignment stage swing mechanism 40 according to an eighth embodiment of the present invention includes a swing plate 41 on which the alignment stage 34 is mounted and abutting members 42 that come into contact with four corners of the lower surface of the wafer tray holding plate 61. The swing mechanism mounting plate 44 having a spherical slide bearing 45 at a central position and having a plurality of spring members 46 radially on the outer peripheral portion of the spherical slide bearing 45 is provided.

Further, the central portion of the swing plate 41 is connected to the movable portion (the portion connected to the ball of the ball joint) of the spherical slide bearing 45, and the central portion of the swing mechanism mounting plate 44 is fixed to the spherical slide bearing 45. The rocking space of the rocking plate 41 is secured between the rocking plate 41 and the rocking mechanism mounting plate 44. In this figure, a ball joint type bearing is used for the spherical slide bearing 45, and a leaf spring is used for the spring member 46.

The abutting member 42 raises the alignment stage swing mechanism 40 by the wafer positioning stage elevating mechanism 50, and when the abutting member 42 comes into contact with the wafer tray holding plate 61, the wafer tray of the alignment stage 34 The mounting surface 35 has a height that allows the wafer tray 23 to be moved back and forth and left and right. The height at which the wafer tray 23 can be moved back and forth and left and right may be a height that pushes up the wafer tray 23 by several millimeters .

The wafer positioning stage elevating mechanism 50 according to a ninth embodiment of the present invention includes the swing mechanism mounting plate 44, a wafer positioning unit mounting plate 52, and a drive mechanism 51 having a slide portion 51b and a drive portion 51a. I have.

The drive portion 51a of the drive mechanism 51 is installed on the wafer positioning unit mounting plate 52, and the tips of the slide portions 51b are connected to the four corners of the swing mechanism mounting plate 44. The installation locations of the drive unit 51a and the slide unit 51b can be exchanged.

13, by the wafer testing apparatus 10 equipped with the wafer test apparatus 20 from the second with a pre-Symbol wafer tray elevating mechanism 60 according to a fourth embodiment of the present invention, the by the wafer tray elevating mechanism 60 The wafer tray 23 is pushed up, the wafer positioning stage 32 is stopped downward, and the wafer positioning unit slide mechanism 31 shows a state in which it can be moved laterally. The test process is from before the start to the end of the test. Indicates the state.

The wafer positioning stage 32 includes the alignment stage 34, the early alignment stage swing mechanism 40, and the wafer positioning stage elevating mechanism 50.

FIG. 14 shows a state in which the wafer tray elevating mechanism 60 is lowered from the state of FIG. 13 to a position where the wafer 15 is placed, and the wafer 15 is taken out and mounted in this state. Since the structure of the figure is the same as that of FIG. 13, the description of the members will be omitted.

FIG. 15 shows a state in which the wafer positioning stage 32 is pushed up by the wafer positioning stage elevating mechanism 50 from the state of FIG. 14 and the abutting member 42 is in contact with the lower surface of the wafer tray holding plate 61. Although it is difficult to do so, the wafer tray mounting surface 35 is in a state where the wafer tray 23 can be moved back and forth and left and right when the abutting member 42 comes into contact with the wafer tray holding plate 61.

Further, when the abutting member 42 constituting the alignment stage swing mechanism 40 comes into contact with the wafer tray holding plate 61 in the previous period and stops at four places, the wafer tray mounting surface 35 of the alignment stage 34 can be moved. The inclination of the wafer tray holding plate 61 in the previous period can be followed, and the inclination when the wafer tray 23 is finished to be pushed up is the same as the inclination of the wafer tray holding plate 61, and the wafer 15 and the probe card 21 are inclined. Can be aligned.

Since the height at which the wafer tray 23 is pushed up is a height at which the wafer tray 23 can be moved back and forth and left and right, the height at which the wafer tray 23 is pushed up by several millimeters from the wafer tray holding plate 61 in the previous period may be sufficient. Since the structure of the drawings is the same as that of FIGS. 13 and 14, the description of the members will be omitted.

FIG. 16 shows the wafer test apparatus 10 equipped with the wafer test apparatus 20 provided with the wafer tray elevating mechanism 60 according to the fifth and sixth embodiments of the present invention, and the wafer tray elevating mechanism 60 provides the wafer. The wafer 23 is pushed up, the wafer positioning stage 32 is stopped downward, and the wafer positioning unit slide mechanism 31 shows a state in which it can be moved in the lateral direction. As the test process, the state from before the start to the end of the test is shown. Since the structure of the figure is the same as that of FIG. 13, the description of symbols not described is omitted.

FIG. 17 shows a state in which the wafer tray elevating mechanism 60 is lowered from the state of FIG. 16 to a position where the wafer 15 is placed, and the wafer 15 is taken out and mounted in this state. Since the description of the members is the same as that in FIG. 16, the description will be omitted.

FIG. 18 shows a state in which the wafer positioning stage 32 is pushed up by the wafer positioning stage elevating mechanism 50 from the state of FIG. 17, and the abutting member 42 is in contact with the lower surface of the wafer tray holding plate 61. Although it is difficult to distinguish in the figure, the wafer tray mounting surface 35 pushes up the wafer tray 23 to a height that allows it to move back and forth and left and right when the abutting member 42 comes into contact with the wafer tray holding plate 61.

Further, when the abutting member 42 constituting the alignment stage swing mechanism 40 comes into contact with the wafer tray holding plate 61 of the previous period and stops at four places, the wafer tray mounting surface 35 of the alignment stage 34 becomes the wafer tray mounting surface 35 of the previous period. The inclination of the wafer tray holding plate 61 can be followed, and the inclination when the wafer tray 23 is finished to be pushed up is the same as the inclination of the wafer tray holding plate 61, and the wafer 15 and the probe card 21 are aligned with each other. It can be performed.

Since the height at which the wafer tray 23 is pushed up is such that the wafer tray 23 can be moved back and forth and left and right, a push-up height of several millimeters may be sufficient.
Since the structure of the figure is the same as that of FIG. 16, the description of the members will be omitted.

As described above, the wafer positioning stage 32 is pushed up by the functions of the alignment stage swing mechanism 40 and the wafer positioning stage elevating mechanism 50, and the thrusts provided at the four corners of the upper surface of the swing plate 41. When the abutting member 42 comes into contact with the four corners of the lower surface of the wafer tray holding plate 61, the inclination of the alignment stage 34 can be made to follow the inclination of the wafer tray holding plate 61.

The height of the wafer tray mounting surface 35 of the alignment stage 34 is set higher than that of the abutting member 42, so that when the abutting member 42 comes into contact with the wafer tray holding plate 61, the wafer tray 23 is pushed up by several millimeters from the wafer tray holding plate 61 and is in a state where it can be moved back and forth and left and right.

The centers of the drive mechanism 70 and the slide mechanism 80 constituting the wafer tray elevating mechanism 60 shown in FIGS. 13 to 15 and 16 to 18 are installed at the four corners of the vacuum chamber 24. It can also be installed outside the vacuum chamber 24.
Considering ensuring the parallelism between the vacuum chamber 24, the probe card 21, and the wafer tray 23 and minimizing the space of the wafer tray elevating mechanism 60, it is considered that the method of installing in the vacuum chamber is the best, and this method is adopted. It is adopted.

FIG. 19 is a perspective view showing a wafer test system 100 in which the apparatus frame 11 according to the tenth embodiment of the present invention is loaded in four rows in a row direction and three stages in a row direction.
The wafer positioning stage 32 slides in the row direction by the wafer positioning unit slide mechanism 31, and can handle tests in any row.

FIG. 20 shows a front view of the wafer test system 100 configured with FIG. The wafer positioning unit 30 and the wafer positioning slide unit 31 are installed in each stage.

Since the present invention is configured as described above, it is possible to specifically deal with the following problems.
The process of raising and lowering the wafer tray by the wafer positioning stage is separated from the wafer positioning unit, and a wafer tray raising and lowering mechanism is provided as a means for ensuring parallelism with the probe card and raising and lowering the wafer tray vertically.
The wafer positioning unit is responsible only for the alignment of the wafer and the probe card, and the alignment stage swings as a means for raising and lowering the wafer tray mounting surface perpendicular to the plane of the wafer tray by following the inclination of the wafer tray. By providing a mechanism and a wafer positioning stage elevating mechanism,
It is possible to provide a highly accurate alignment between a wafer electrode and a probe card terminal and a wafer test apparatus having a high operating rate.

10 Wafer test equipment 11 Equipment frame 15 Wafer 16 Load board 20 Wafer test unit 21 Probe card 22 Sealing member 22a Sealing member 22b Sealing member 23 Wafer tray 24 Vacuum chamber 24a First sealed space 24b Second sealed space 25 Frame 26 Tester Part 27 Connection member 29 Vacuum mechanism 30 Wafer positioning unit 31 Wafer positioning unit Slide mechanism 32 Wafer positioning stage 33 Position information imaging mechanism 34 Alignment stage 35 Wafer tray mounting surface 40 Alignment stage swing mechanism 41 Swing plate 42 Butting member 44 Swing mechanism mounting plate 45 Spherical sliding bearing 46 Spring member 50 Wafer positioning stage elevating mechanism 51 Drive mechanism 51a Drive unit 51b Slide unit 52 Wafer positioning unit mounting plate 60 Wafer tray elevating mechanism 61 Wafer tray holding plate 62 Base plate 70 Drive mechanism 71 Ball screw 71a Ball screw 72 Slide nut 73 Upper bearing 74 Lower bearing 75 Drive motor 76 Slide unit 77 Slide shaft 80 Slide mechanism 81 Slide shaft 82 Slide unit 100 Wafer test system

Claims (12)

This is a wafer test device that conducts tests by applying pressure contact between the electrodes of the wafer and the terminals of the probe card.
A wafer test unit, a wafer positioning unit, a device frame on which the wafer test unit is mounted, a wafer positioning unit slide mechanism that laterally conveys the wafer positioning unit, and a wafer positioning unit slide mechanism.
With
The wafer test unit is
A road board on which a test circuit etc. is mounted and
With the probe card
A wafer tray on which the wafer is placed and
A vacuum chamber forming a closed space together with the load board, the probe card, and the wafer tray.
A wafer test apparatus comprising: a wafer tray elevating mechanism for elevating and lowering the wafer tray between a position on which the wafer is placed and a position where the wafer tray contacts the vacuum chamber. The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
A wafer tray holding plate on which the wafer tray is placed and a wafer tray holding plate
A drive mechanism having a ball screw, a slide shaft that slides by driving the ball screw, and a slide unit that fits with the slide shaft.
The drive motor that drives the ball screw and
A slide mechanism with a slide shaft and a slide unit,
With
The drive mechanism
The slide units are installed at the four corners of the vacuum chamber.
The tips of the slide shafts of the previous term are connected to the four corners of the wafer tray holding plate.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide units are installed at the four corners of the vacuum chamber.
The wafer test apparatus according to claim 1, wherein the tips of the slide shafts are connected to the four corners of the wafer tray holding plate. The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, the drive motor, and the slide mechanism are provided.
The drive mechanism
The slide units are installed at two diagonally opposite locations at the four corners of the vacuum chamber, and the tips of the previous slide shafts are connected to the two diagonally opposed locations at the four corners of the wafer tray holding plate.
The ball screw of the previous term is connected to the drive motor,
The slide mechanism
The slide unit is installed at two diagonally opposed locations at the four corners of the vacuum chamber, and the tips of the slide shafts are connected to two diagonally opposed locations at the four corners of the wafer tray holding plate. The wafer test apparatus according to any one of claims 1 to 2. The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, and the drive motor are provided.
The drive mechanism
The slide units are installed at four locations at the four corners of the vacuum chamber.
The tips of the slide shafts of the previous term are connected to the four corners of the wafer tray holding plate.
The wafer test apparatus according to any one of claims 1 to 2, wherein the ball screw of the previous term is connected to the drive motor. The wafer tray elevating mechanism is
A ball spline with an integrated ball screw is used for the drive mechanism.
The wafer test unit according to any one of claims 1 to 4, wherein a ball spline is used for the slide mechanism. The wafer tray elevating mechanism is
With the vacuum chamber
With the wafer tray
With the wafer tray holding plate
A drive mechanism having a ball screw, a slide nut, and an upper bearing and a lower bearing of the ball screw.
With the drive motor
With the slide mechanism
The base plate having the lower bearing and
With
The drive mechanism
The early ball screws connected to the drive motor are installed at two diagonally opposite locations of the vacuum chamber and the four corners of the base plate via the upper bearing and the lower bearing.
The slide nuts of the previous term were installed at two diagonally opposite locations at the four corners of the wafer tray holding plate.
The slide mechanism
Both ends of the slide shaft in the previous period are connected to the vacuum chamber and the four corners of the base plate diagonally facing each other.
The wafer test apparatus according to claim 1, wherein the slide units of the previous term are installed at two diagonally opposite locations at the four corners of the wafer tray holding plate. The wafer tray elevating mechanism is
The vacuum chamber, the wafer tray, the wafer tray holding plate, the drive mechanism, the drive motor, and the base plate are provided.
The drive mechanism in the previous term
The early ball screws connected to the drive motor are installed at four locations of the vacuum chamber and the four corners of the base plate via the upper bearing and the lower bearing.
The wafer test apparatus according to claim 1, wherein slide nuts of the previous term are installed at four positions at four corners of the wafer tray holding plate. The wafer positioning unit is
Driven by the wafer positioning unit slide mechanism, it is arranged under the wafer test unit so as to face the wafer tray.
A wafer positioning stage on which the wafer tray is placed and alignment between the electrodes of the wafer and the terminals of the probe card, and
A position information shooting mechanism with a camera and
With
The wafer positioning stage is
An alignment stage that controls the positions in the X, Y, and rotation directions,
An alignment stage swing mechanism that makes the inclination of the wafer tray mounting surface of the alignment stage follow the inclination of the wafer tray.
A wafer positioning stage elevating mechanism that elevates and elevates the wafer positioning stage,
The wafer test apparatus according to any one of claims 1 to 7, wherein the wafer test apparatus is provided. The alignment stage swing mechanism is
When the wafer positioning stage rises,
Abutting members that come into contact with the four corners of the lower surface of the wafer tray holding plate, and
A rocking plate having the abutting member at the four corners,
Spherical plain bearings with moving and fixed parts,
A spring member that supports the load applied to the outer peripheral portion of the rocking plate, and
A rocking mechanism mounting plate, which is installed with a space for the rocking plate to swing, is provided below the rocking plate.
The abutting member is
When the alignment stage swing mechanism is raised by the wafer positioning stage elevating mechanism and the abutting member comes into contact with the wafer tray holding plate, the wafer tray mounting surface of the alignment stage moves the wafer tray back and forth and left and right. Has a height that can be
The spherical plain bearing is
Installed in the central part between the rocking plate and the rocking mechanism mounting plate,
The movable portion is connected to the rocking plate, and the fixed portion is connected to the rocking mechanism mounting plate.
The spring member is
The wafer test apparatus according to any one of claims 1 to 8, wherein a plurality of the spherical bearings are arranged on the outer peripheral portion where the spherical bearings are installed. The wafer positioning stage elevating mechanism
With the swing mechanism mounting plate
A drive mechanism with a slide unit and a drive unit,
A wafer positioning unit mounting plate on which the wafer positioning unit is mounted and a wafer positioning unit mounting plate.
With
The wafer test apparatus according to any one of claims 1 to 9, wherein the drive mechanism is provided at four corners of the swing mechanism mounting plate and the wafer positioning unit mounting plate. The wafer test apparatus according to any one of claims 1 to 10, wherein a pneumatic device is used for the drive mechanism. The device frame
A frame of the wafer test apparatus is formed by accommodating one set of the wafer test units and connecting the apparatus frames in the horizontal direction and the vertical direction.
The wafer test apparatus according to any one of claims 1 to 11, wherein the apparatus frame is provided with a structure in which the wafer positioning unit is laterally movable corresponding to a plurality of the wafer test units.

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