JP2021132160A - Component mounting system and method - Google Patents

Abstract

To suppress deterioration of the quality of a board and deterioration of production efficiency even when some of a plurality of components cannot be mounted on the board.SOLUTION: A component mounting system that mounts multiple components on a board includes at least one mounting machine, a control device that causes at least one mounting machine to mount some of a plurality of components on the board when some of the plurality of components cannot be mounted on the board, and a board collection device that collects a board on which some of the plurality of components are not mounted and some of the plurality of components are mounted, and when only some of the plurality of components are mounted on the board, the control device causes at least one mounting machine to mount only some of the plurality of components on the board.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to component mounting systems and methods.

Conventionally, as a production system for surface mount devices that produce a board by mounting electronic components on a board according to a production program, mounting information (mounting position, mounting result, etc.) is recorded each time an electronic component is mounted on the board, and an abnormality is obtained. It is known that when production is interrupted due to the occurrence of a situation, the recording of on-board information is stored as a continuous production file on a non-volatile recording medium (see, for example, Patent Document 1). In this production system, after the abnormal situation is resolved, production is restarted based on the loading information recorded in the continuous production file. Further, conventionally, as a component mounting line in which mounting machines are arranged in series in a plurality of stages, for an unmounted board in which parts have not been mounted due to a failure of at least one mounting machine, the identification code and mounting of the board have not been completed. It is known that a state is associated with a state and stored (see, for example, Patent Document 2). In this component mounting line, allocation for allocating and mounting shared parts of the failed mounting machine to a mounting machine selected from normal mounting machines other than the failed mounting machine based on the identification code and the mounting incomplete state. A component mounting program is created. Then, the allocation component is mounted on the unmounted board by executing the allocation component mounting program on the selected mounting machine.

Japanese Unexamined Patent Publication No. 2003-031998 Japanese Unexamined Patent Publication No. 2013-143470

By the way, in a component mounting system in which a plurality of components are mounted on a board, a part of the plurality of components may not be mounted on the board due to some factor during the production of the board. In this case, it is conceivable to manually mount the components that could not be mounted on the board later, but the quality of the board may deteriorate due to mounting omission or mounting error. In addition, when a component that could not be mounted is later mounted on a board using a mounting machine, it is necessary for a worker to skip mounting the mounted component, resulting in deterioration of production efficiency and mounted component. There is a risk of quality deterioration due to incorrect mounting of. Further, at the start of production (mounting) of the board, it may not be possible to mount a part of a plurality of parts on the board. In this case, the production of the board is stopped and a part of the plurality of parts is waited until it can be mounted on the board, but depending on the waiting time, the production efficiency may be deteriorated.

Therefore, the main object of the present disclosure is to suppress deterioration of the quality of the substrate and deterioration of production efficiency when a part of a plurality of parts cannot be mounted on the substrate.

The component mounting system of the present disclosure includes at least one mounting machine, and when a part of the plurality of parts cannot be mounted on the board in a component mounting system for mounting a plurality of parts on a board, the above-mentioned A control device for mounting a part of the plurality of parts on the substrate on at least one mounting machine, and a part of the plurality of parts not mounted on the substrate and other than the part of the plurality of parts. When the control device includes a board recovery device for collecting the mounted board and only a part of the plurality of components other than the part thereof is mounted on the board, the control device is mounted on the at least one mounting machine. Only a part of the plurality of parts is mounted on the substrate.

In the component mounting system of the present disclosure, when a part of a plurality of parts cannot be mounted on a board, the control device mounts a part of a plurality of parts on the board in at least one mounting machine. Further, when a part of the plurality of parts is not mounted on the board in this way, the board recovery device is a board on which a part of the plurality of parts is not mounted and a part other than the part of the plurality of parts is mounted. To collect. Further, when only a part of a plurality of parts is mounted on the board, the control device mounts only a part of the plurality of parts on the board in at least one mounting machine. As a result, when a part of a plurality of parts cannot be mounted on the board, only a part of the plurality of parts is mounted on the board, and then the board is mounted on the board recovered by the board recovery device. Parts that could not be mounted can be mounted later by at least one mounting machine. As a result, according to the component mounting system of the present disclosure, when a part of a plurality of components cannot be mounted on the board, the processing required for the worker is reduced, and the quality of the board is deteriorated and the production efficiency is reduced. Deterioration can be suppressed satisfactorily.

It is a schematic block diagram which shows the component mounting system of this disclosure. It is a perspective view which shows the mounting machine included in the component mounting system of this disclosure. It is a flowchart for demonstrating the procedure of mounting a component on a board in the component mounting system of this disclosure. It is a flowchart which illustrates the routine executed by the control part of the printing apparatus of the component mounting system of this disclosure. It is a flowchart which illustrates the routine executed by the control part of the mounting machine of the component mounting system of this disclosure. It is a flowchart which illustrates the routine executed by the management apparatus of the component mounting system of this disclosure. It is a flowchart which illustrates the routine executed by the control part of the board recovery apparatus of the component mounting system of this disclosure.

Next, a mode for carrying out the invention of the present disclosure will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram showing a component mounting system 1 of the present disclosure. The component mounting system 1 shown in the figure includes a printing device 2, a mounting machine 3 for a plurality of units (for example, 4 units in this embodiment), a board recovery device 4, a reflow device 5, and a management device for managing and controlling the entire system. (Control device) 10 and the like are included.

The printing device 2 prints solder on the wiring pattern of the substrate S, and the substrate transporting device for transporting the substrate S, the printing head, the head moving device for moving the printing head, and the fixed screen mask are fixed. Includes frames, etc. (all not shown). Further, the printing device 2 includes a mark camera 21 and a print control unit 25. The mark camera 21 captures an ID attached to the substrate S, a positioning reference mark, and the like, and transmits the captured data to the print control unit 25.

The print control unit 25 is a computer including a CPU, ROM, RAM, a storage device, etc., and exchanges information with the management device 10 via wireless or wired communication, as well as imaging data of the mark camera 21, a substrate transfer device, and printing. Acquire the detected values of various sensors (not shown) installed in the head, head moving device, etc. The print control unit 25 controls the substrate transfer device, the print head, the head moving device, and the like based on the information from the management device 10, the detected values of various sensors, and the like. Further, when the printing of the solder on one substrate S is completed, the print control unit 25 outputs information indicating that the formation of the solder printing is completed together with the ID of the substrate S acquired via the mark camera 21 in the management device 10. Send to.

Each of the plurality of mounting machines 3 is a surface mounting machine capable of mounting a plurality of components on the substrate S, and is arranged on the rear side of the printing apparatus 2 along the transport direction of the substrate S as shown in FIG. .. As shown in FIG. 2, each mounting machine 3 includes a housing 30, a component supply unit 31, a board transfer device 32, an XY moving device 33, a mounting head 34, and a mounting control unit 35. Further, each mounting machine 3 includes a parts camera 36, a mark camera 37, a nozzle station 38, and the like.

The component supply unit 31 is provided at the front of each mounting machine 3, and pulls out the tape from the plurality of reels 310 around which the tape accommodating the plurality of components is wound, and pulls the tapes to the component supply position in the y-axis direction in FIG. Send to. In each reel 310, the plurality of parts are each protected by a film covering the surface of the tape, and the film is peeled off before the parts reach the part supply position. The plurality of reels 310 may accommodate different parts or may accommodate the same parts. Further, the substrate transfer device 32 conveys the substrate S from the left side to the right side in the drawing along the x-axis direction in FIG.

The XY moving device 33 includes an X-axis slider 33x to which the mounting head 34 can be detachably attached (replaceable), and a Y-axis slider 33y. The X-axis slider 33x is moved by a motor (not shown) along the X-axis guide rail Rx fixed to the Y-axis slider 33y so as to extend in the x-axis direction in FIG. Further, the Y-axis slider 33y is moved by a motor (not shown) along the Y-axis guide rail Ry arranged above the substrate transfer device 32 so as to extend in the y-axis direction in FIG. As a result, the mounting head 34 can be moved to an arbitrary position above the substrate S by the XY moving device 33.

As shown in FIG. 2, the mounting head 34 has a plurality of suction nozzles 39 (for example, eight in this embodiment) that are detachably supported by the head body 34a via a head body 34a and a nozzle holder (not shown). Each includes an R-axis drive device, a Q-axis drive device, a first Z-axis drive device, and a second Z-axis drive device (not shown). Each suction nozzle 39 sucks a part and releases the sucked part according to the air pressure supplied from an air pressure supply device (not shown). Further, the head body 34a is equipped with a suction nozzle 39 corresponding to a component to be suctioned. The R-axis drive device integrally rotates (revolves) a plurality of suction nozzles 39 around the central axis of the head body 34a. The Q-axis drive device rotates (rotates) each suction nozzle 39 around the central axis. The first and second Z-axis drive devices individually raise and lower the corresponding suction nozzles 39 along the Z-axis at two locations on the revolution orbit of the suction nozzle 39. As a result, the parts supplied by the parts supply unit 31 can be simultaneously sucked by the two suction nozzles 39 and mounted on the board S transported by the substrate transfer device 32.

The parts camera 36 is installed between the parts supply unit 31 and the board transfer device 32. The parts camera 36 images the parts sucked by the suction nozzle 39 of the mounting head 34 from below, and transmits the imaged data to the mounting control unit 35. Further, the mark camera 37 is attached to the X-axis slider 33x of the XY moving device 33. The mark camera 37 images an ID attached to the substrate S, a positioning reference mark, and the like, and transmits the imaged data to the mounting control unit 35. The nozzle station 38 is arranged between the component supply unit 31 and the substrate transfer device 32. The suction nozzle 39 mounted on the mounting head 34 is stocked in the nozzle station 38.

The mounting control unit 35 of each mounting machine 3 is a computer including a CPU, ROM, RAM, storage device, etc., and exchanges information with the management device 10 via wireless or wired communication, and also exchanges information with the parts camera 36 and the mark camera 37. The image data of the above, the detection values of various sensors (not shown) installed in the component supply unit 31, the board transfer device 32, the XY moving device 33, the mounting head 34, and the like are acquired. The mounting control unit 35 mounts the parts supply unit 31, the board transfer device 32, the XY moving device 33, based on the information from the management device 10, the imaging data of the parts camera 36 and the mark camera 37, the detection values of various sensors, and the like. Controls the head 34 and the like. Further, when the mounting process of the component on one board S is completed, the mounting control unit 35 together with the ID of the board S acquired via the mark camera 37 and the information of the component actually mounted on the board S (hereinafter, referred to as "Mounted component information") is transmitted to the management device 10.

The board recovery device 4 includes a stocker 40 capable of accommodating a plurality of boards S, a board transfer device 41, a distribution mechanism 42, a storage mechanism 43, a mark camera 44, and a control unit 45. The substrate transfer device 41 is a conveyor that conveys the substrate S from the mounting machine 3 on the most downstream side. The distribution mechanism 42 selectively switches the transfer destination of the substrate S by the substrate transfer device 41 between the reflow device 5 and the stocker 40. The storage mechanism 43 can store the substrate S distributed to the stocker 40 side by the distribution mechanism 42 in the stocker 40. The mark camera 44 captures an ID, a positioning reference mark, and the like attached to the substrate S from the mounting machine 3, and transmits the captured data to the control unit 45.

The control unit 45 of the board recovery device 4 is a computer including a CPU, ROM, RAM, storage device, etc., and exchanges information with the management device 10 via wireless or wired communication, and also captures data of the mark camera 44 and a board. Acquires detection values and the like of various sensors (not shown) installed in the transport device 41, the distribution mechanism 42, the storage mechanism 43, and the like. The control unit 45 controls the substrate transfer device 41, the distribution mechanism 42, the storage mechanism 43, and the like based on the information from the management device 10, the image pickup data of the mark camera 44, the detection values of various sensors, and the like. Further, the control unit 45 distributes one board S to the reflow device 5 or the stocker 40 side, and then transfers the board S together with the ID of the board S acquired through the mark camera 44 (reflow device 5 or the stocker 40). ) Is transmitted to the management device 10.

The reflow device 5 is arranged on the rear side of the substrate recovery device 4, and is a substrate transfer device that conveys the substrate S from the substrate recovery device 4 and a heating unit (not shown) that heats the substrate S conveyed by the substrate transfer device. And a reflow control unit 55 that exchanges information with the management device 10 to control a substrate transfer device, a heating unit, and the like. The reflow control unit 55 is a computer including a CPU, a ROM, a RAM, a storage device, and the like. The reflow device 5 melts the solder on the substrate S by heating the substrate S to a predetermined reflow temperature (for example, 220 ° C.-260 ° C.) in the heating unit. As a result, the molten solder is cooled and solidified, so that each component is electrically connected and fixed to the wiring pattern of the substrate S.

In the present embodiment, the management device 10 is a general-purpose computer including a CPU, ROM, RAM, storage device, and the like, and an input device such as a display, a keyboard, and a mouse is connected to the management device 10. Further, the storage device of the management device 10 stores the production program of the substrate S and the production information related to the production of the substrate S. The production program defines the mounting order of components on the board S in the plurality of mounting machines 3 of the component mounting system 1, the number of boards S to be produced, and the like. Further, the production information includes print information indicating the solder printing position on the substrate S, component information regarding the components mounted on the substrate S, the target mounting position (XY coordinates) of each component on the substrate S, and mounting on the mounting head 34. The nozzle information and the like regarding the suction nozzle 39 are included. The component information is determined according to the type of components mounted on the board S by each mounting machine 3, the inventory status of the parts (the state in which the reel 310 is set on the mounting machine 3), and the mounting status of the parts by the mounting machine 3. It shows the parts and the like to be mounted on the board S by the mounting machine 3. The management device 10 executes a production program using production information and the like when producing the board S, and is a print control unit 25 of the printing device 2, a mounting control unit 35 of each mounting machine 3, and a control unit 45 of the board recovery device 4. And various command signals and the like are given to the reflow control unit 55 of the reflow device 5.

Subsequently, the operation of the component mounting system 1 of the present disclosure will be described with reference to FIGS. 3 to 7.

FIG. 3 is a flowchart for explaining a component mounting procedure on the substrate S in the component mounting system 1. As shown in the figure, when producing the board S on which a plurality of parts are mounted, the management device 10 first receives information indicating the inventory status and the supply status of the parts input by the worker via the input device. , Information indicating the setting status of the component (reel 310) in each mounting machine 3 from each mounting control unit 35 is acquired (step S10). Next, the management device 10 is allowed to be mounted on the board S of the parts housed in the reel 310 set (supplied) in the mounting machine 3, and is mounted on the parts that are out of stock (out of stock) and already mounted on the board S. The component information (components to be mounted on the board S by each mounting machine 3) is set for each ID of the board S so that the mounting of the components on the board S is prohibited. Further, in step S20, the management device 10 is mounted on a component whose mounting on the substrate S is prohibited (see component P1 in FIG. 1), so-called POP component or shield component (see component P2 in FIG. 1). Set the component information so that the mounting of is prohibited (cancelled). Further, the management device 10 causes the printing device 2 to start printing the solder on the board S (step S30) according to the production program in response to the instruction of the worker to produce the board S, that is, to operate the component mounting system 1.

When solder is printed on one substrate S by the printing apparatus 2 in step S30, the substrate S is sent from the printing apparatus 2 to the mounting machine 3 on the most upstream side, and a plurality of mounting machines 3 are sent to the substrate S. A plurality of parts are mounted according to the above (step S40). When all the components planned by all the mounting machines 3 are mounted on one board S (step S50: YES), the board S from the most downstream mounting machine 3 is provided by the board recovery device 4. Is sent to the reflow device 5. The reflow device 5 reflows the substrate S (step S60), whereby mounting of components on one substrate S is completed.

On the other hand, when a part (at least one) of a plurality of parts originally to be mounted on the board S is not mounted on the board S by at least one of the plurality of mounting machines 3 due to part shortage (step). S50: NO), the substrate S from the mounting machine 3 on the most downstream side is collected by the substrate recovery device 4 and stored in the stocker 40 (step S65). Then, the processes of steps S30 to S60 or S65 are repeatedly executed until the mounting or mounting of the components on the planned number of boards S is completed (step S70: NO). When the mounting or mounting of the components on the planned number of boards S is completed (step S70: YES), the management device 10 stops the operations of the printing device 2, each mounting machine 3, the board recovery device 4, and the reflow device 5. , The production of the substrate S is stopped.

FIG. 4 is a flowchart illustrating a routine executed by the print control unit 25 of the printing apparatus 2 for printing solder on one substrate S. As shown in the figure, when printing the solder on the substrate S, the print control unit 25 first acquires the ID of the target substrate S based on the image pickup data from the mark camera 21 (step S300). Further, the print control unit 25 transmits the ID to the management device 10 in order to acquire the print execution information indicating whether or not the solder is printed on the substrate S of the acquired ID from the management device 10. The management device 10 transmits the print execution information corresponding to the ID received from the print control unit 25 to the print control unit 25 (step S310). The print execution information is set to indicate that the substrate S (ID) before the solder is printed has not been printed, and that the substrate S (ID) after the solder has been printed has been printed. It is a thing. When the print execution information of the substrate S is acquired from the management device 10 in step S310, the print control unit 25 determines whether or not the solder has already been printed on the substrate S based on the print execution information (step). S320).

When it is determined in step S320 that no solder is printed on the substrate S based on the print execution information from the management device 10 (step S320: YES), the print control unit 25 receives a command signal from the management device 10 or The board transfer device, the print head, the head moving device, and the like of the printing device 2 are controlled so as to print the solder on the board S according to the printing information and the like (step S330). After the printing of the solder on the substrate S is completed, the print control unit 25 transmits the ID of the substrate S and the information indicating that the printing of the solder is completed to the management device 10 (step S340), and mounts the substrate S. It is sent to the machine 3 (step S350). The management device 10 sets (updates) the ID received from the print control unit 25 so as to indicate that the print execution information has been printed. On the other hand, when it is determined that the solder has already been printed on the substrate S based on the print execution information from the management device 10 (step S320: NO), the print control unit 25 performs the processes of steps S330 and S340. The board transfer device, the print head, the head moving device, and the like are controlled so as to skip and send the board S to the mounting machine 3 without printing the solder (step S350). After the process of step S350, the print control unit 25 starts the solder printing process on the next substrate S.

FIG. 5 is a flowchart illustrating a routine executed by the mounting control unit 35 of each mounting machine 3 in order to mount the components on one board S. As shown in the figure, when mounting the components on the board S, the mounting control unit 35 of each mounting machine 3 first acquires the ID of the target board S based on the imaging data from the mark camera 37 ( Step S400). Further, the mounting control unit 35 transmits the ID to the management device 10 in order to grasp the components that can be mounted on the board S of the acquired ID. The management device 10 transmits component information (components to be mounted on the board S by the mounting machine 3) corresponding to the ID received from the mounting control unit 35 to the mounting control unit 35 (step S410).

When the component information is acquired from the management device 10 in step S410, the mounting control unit 35 corresponds to mounting only the components included in the component information, that is, the components specified by the management device 10 on the substrate S. The mounting machine 3 is controlled (step S420). Further, the mounting control unit 35 transmits the ID of the board S and the mounted component information indicating the components actually mounted on the board S (hereinafter, appropriately referred to as “mounted components”) to the management device 10 (step). S430), the mounting machine 3 is controlled so as to send the board S to the subsequent stage side (mounting machine 3 or board recovery device 4) (step S440). After the process of step S430, the mounting control unit 35 starts mounting the components on the next board S.

FIG. 6 is a flowchart illustrating a routine executed by the management device 10 that has received the ID of the board S and the mounted component information from the mounting control unit 35 in step S430 of FIG. As shown in the figure, when the management device 10 receives the ID of the board S and the mounted component information from the mounting control unit 35, the management device 10 correlates the ID and the mounted component information with each other and stores the ID and the mounted component information in the storage device (step S80). .. Further, the management device 10 should be originally mounted on the board S of the ID by the mounting machine 3 corresponding to the mounting control unit 35 that has transmitted the ID or the like based on the mounted component information (mounted parts) or the like. Regardless, it is determined whether or not there is a component that is not mounted (step S81).

When it is determined in step S81 that a part (at least one) of the components that should be originally mounted on the board S of the ID from the mounting control unit 35 is not mounted (step S81: YES), the management device 10 , A component so as to indicate that a part of the component (hereinafter, appropriately referred to as “non-mounted component”) is a component to be mounted on the board S of the ID by the mounting machine 3 corresponding to the mounting control unit 35. The information is updated (step S83). On the other hand, when it is determined in step S81 that all the components that should be originally mounted on the board S of the ID are mounted (step S81: NO), the management device 10 transmits the ID and the like. The component information is updated so that the mounting machine 3 corresponding to the mounting control unit 35 does not have a component to be mounted on the board S of the ID (step S85). Further, when the non-mounted component is mounted on the board S of the ID by the mounting machine 3 corresponding to the mounting control unit 35 that has transmitted the ID or the like, the management device 10 makes a negative determination in step S81, and the mounting machine The component information is updated so as to indicate that there is no component to be mounted on the board S of the ID according to 3 (step S85). When the process of step S83 or S85 is executed, the management device 10 ends the routine of FIG.

FIG. 7 is a flowchart illustrating a routine executed by the control unit 45 of the substrate recovery device 4 in order to distribute the substrate S from the mounting machine 3 on the most downstream side to the reflow device 5 or the stocker 40. As shown in the figure, when the substrate S is sorted, the control unit 45 of the substrate recovery device 4 first acquires the ID of the target substrate S based on the imaging data from the mark camera 44 (step S500). Further, the control unit 45 transmits the ID to the management device 10 in order to acquire the mounted component information indicating the components mounted on the board S of the acquired ID from the management device 10. The management device 10 transmits the mounted component information corresponding to the ID received from the control unit 45 to the control unit 45 (step S510). When the mounted component information is acquired from the management device 10 in step S510, the control unit 45 determines whether or not each mounting machine 3 mounts all the components on the board S based on the mounted component information (step S510). S520).

When it is determined in step S520 that each mounting machine 3 mounts all the components on the board S (step S520: YES), the control unit 45 sends the board S from the mounting machine 3 side to the reflow device 5. The substrate transfer device 41 and the distribution mechanism 42 are controlled in this manner (step S530). Further, the control unit 45 transmits the ID of the board S and the information indicating the transmission destination of the board S (in this case, the reflow device 5) to the management device 10 (step S540), and executes the processes after step S500 again. do. The management device 10 stores the ID received from the control unit 45 and the transmission destination in the storage device in association with each other.

On the other hand, in step S520, when it is determined that at least one of the mounting machines 3 does not mount at least one kind of component on the board S based on the mounted component information from the management device 10 ( Step S520: NO), the control unit 45 controls the substrate transfer device 41, the distribution mechanism 42, and the storage mechanism 43 so as to send the substrate S from the mounting machine 3 side to the stocker 40 side and store it in the stocker 40. (Step S535). Further, the control unit 45 transmits the ID of the board S and the information indicating the transmission destination (in this case, the stocker 40) of the board S to the management device 10 (step S540), and executes the processes after step S500 again. .. The management device 10 stores the ID received from the control unit 45 and the transmission destination in the storage device in association with each other.

In the component mounting system 1 in which the above-described processing is executed, when a part of a plurality of components cannot be mounted on the board S due to a component shortage, the management device 10 as a control device and each mounting control unit 35 Only a part of the plurality of parts other than a part of the plurality of components is mounted on the substrate S on the plurality of mounting machines 3 (steps S10 and S20 in FIG. 3 and S420 in FIG. 5). Further, when a part of the plurality of components is not mounted on the board S due to the component shortage, the management device 10 should mount the unmounted components on the board S based on the mounted component information from the mounting control unit 35. The component information is updated so as to indicate that the component is a component (step S83 in FIG. 6). Further, in the component mounting system 1, the board recovery device 4 mounts a substrate S on which a part of a plurality of parts (unmounted parts) is not mounted and a part other than a part of the plurality of parts (mounted parts) is mounted. It is stored in the stocker 40 without being sent to the reflow device 5 (steps S500-S520 and S535 in FIG. 7).

Then, in the component mounting system 1, after the mounting or mounting of the components on the planned number of boards S is completed, when the missing parts arrive and the reel 310 is replenished to the corresponding mounting machine 3, the components are replenished. Is transmitted from the mounting control unit 35 to the management device 10. In response to this, the management device 10 cancels the out-of-parts setting and remotely controls the automatic guided vehicle (AGV) 7 via wireless communication so as to take out the substrate S from the stocker 40 and put it into the printing device 2. .. As a result, in the component mounting system 1, the production of the substrate S is automatically restarted in response to the arrival of the missing component, and a part of the plurality of components, that is, not mounted on at least one of the plurality of mounting machines 3. Only the components can be mounted on the substrate S (step S420 in FIG. 5).

That is, in the component mounting system 1, when a part of a plurality of components cannot be mounted on the board S due to a component shortage, only a part of the plurality of parts is mounted on the board S and the board S is mounted on the board. It is collected by the collection device 4. After that, when the parts shortage is resolved and the parts are replenished to the corresponding mounting machine 3, the board S stored in the stocker 40 is put into the printing device 2, and the parts already mounted on the board S (mounted parts). ), The unmounted parts that were lacking due to the mounting machine 3 to which the parts were replenished are mounted on the substrate S without mounting the same parts on the board S.

As a result, according to the component mounting system 1, it is no longer necessary to manually mount the components (non-mounted components) that could not be mounted on the board S due to the component shortage, and the components are cut off. It is possible to reduce the processing required for workers (for example, the processing to skip the mounting of mounted parts) at that time, and to satisfactorily suppress the deterioration of the quality of the substrate S and the deterioration of production efficiency due to the shortage of parts. Become. Further, when a part of a plurality of parts is out of stock at the start of production (mounting) of the board S, in the part mounting system 1, only the parts other than the parts that are out of stock are mounted on the board S. It is also possible to mount only the unmounted components on the substrate S after the components arrive. As a result, depending on the arrival waiting time of the parts, the time required for the production of the plurality of boards S can be shortened and the production efficiency can be further improved as compared with the case of stopping the production of the board S and waiting for the arrival of the missing parts. can.

Further, when the non-mounted parts are mounted on the substrate S after the parts are cut off, the printing device 2 already prints the solder on the substrate S. As described above, the print control unit 25 After the printing of the solder on the substrate S is completed, the ID of the substrate S and the print execution information indicating that the printing of the solder is completed are transmitted to the management device 10 (step S340 in FIG. 4). Further, the management device 10 sets (updates) the ID received from the print control unit 25 so as to indicate that the print execution information has been printed. As a result, in the component mounting system 1, it is possible to automatically skip the printing of the solder on the substrate S on which the solder has already been printed and other than a part of the plurality of components (non-mounted components) is mounted. The generation of defective substrates can be satisfactorily suppressed.

In addition, the management device 10 as a control device is prohibited (stopped) from mounting so-called POP parts and shield parts (P2), which are mounted on the parts (P1) whose mounting on the substrate S is prohibited due to the lack of parts. ) Is set (step S20 in FIG. 3). As a result, it is possible to satisfactorily suppress the occurrence of defective substrates due to parts shortage.

In the component mounting system 1, when a component runs out during the production of the board S, the board S is prohibited from mounting the out-of-parts component (and the corresponding POP component, etc.) from that point. You may continue to mount parts that are not out of parts. Further, according to the component mounting system 1, a part of a plurality of components is attached to the substrate S due to a factor other than the component shortage, for example, when the corresponding component cannot be sucked by any of the suction nozzles 39. Even when it becomes impossible to mount the components other than the components that cannot be mounted, it is possible to mount the components other than the components on the substrate S so that the deterioration of the quality of the substrate S and the deterioration of the production efficiency can be suppressed. Further, the component mounting system 1 may include a single mounting machine 3 capable of mounting a plurality of components on the board S, and may include a plurality of mounting machines 3 capable of mounting a single component on the board S. It may include. Further, the component mounting system 1 does not include the reflow device 5, and is configured to store the board S on which all the parts are mounted and the board S on which some parts are not mounted in separate stockers. May be good.

It goes without saying that the invention of the present disclosure is not limited to the above-described embodiment, and various changes can be made within the scope of the extension of the present disclosure. Furthermore, the above-described embodiment is merely a specific embodiment of the invention described in the column of the outline of the invention, and does not limit the elements of the invention described in the column of the outline of the invention.

The invention of the present disclosure can be used in the manufacturing industry of component mounting systems and the like.

1 component mounting system, 2 printing device, 21 mark camera, 25 printing control unit, 3 mounting machine, 30 housing, 31 component supply unit, 32 board transfer device, 33 XY moving device, 33x X-axis slider, 33y Y-axis slider , 34 mounting head, 34a head body, 35 mounting control unit, 36 parts camera, 37 mark camera, 38 nozzle station, 39 suction nozzle, 310 reel, 4 board recovery device, 40 stocker, 41 board transfer device, 42 sorting mechanism, 43 retractor, 44 mark camera, 45 control unit, 5 reflow device, 55 reflow control unit, 10 management device, P1, P2 parts, Rx X-axis guide rail, Ry Y-axis guide rail, S board.

Claims (7)

In a component mounting system that includes at least one mounting machine and mounts a plurality of components on a board.
When a part of the plurality of parts cannot be mounted on the board, a control device for mounting a part other than the part of the plurality of parts on the board on the at least one mounting machine.
A substrate recovery device for collecting the substrate on which the partial portion of the plurality of components is not mounted and other than the partial portion of the plurality of components is mounted is provided.
The control device is a component that mounts only a part of the plurality of parts on the board on at least one mounting machine when only a part of the plurality of parts is mounted on the board. Implementation system. In the component mounting system according to claim 1,
The control device is a component mounting system that prohibits mounting of a component mounted on the partial of the plurality of components when a part of the plurality of components cannot be mounted on the substrate. In the component mounting system according to claim 1 or 2.
When all of the plurality of components are mounted on the board, the board recovery device sends the board to the rear stage side, the part of the plurality of components is not mounted, and the plurality of components are mounted. A component mounting system that stores the board on which a part other than the above is mounted in a stocker. In the component mounting system according to any one of claims 1 to 3,
A printing device for printing solder on the substrate is further provided.
The control device is a component mounting system that skips printing of the solder on the substrate on which the solder has already been printed by the printing device and only a part of the plurality of components is mounted. In the component mounting system according to claim 4,
A component mounting system further comprising a reflow device for reflowing the substrate on which the plurality of components are mounted. In the component mounting system according to any one of claims 1 to 5,
When a part of the plurality of parts cannot be mounted on the board due to a part shortage, the control device causes at least one mounting machine to mount a part other than the part of the plurality of parts on the board. Component mounting system. In a component mounting method in which a plurality of components are mounted on a board by at least one mounting machine,
When a part of the plurality of parts cannot be mounted on the board, at least one mounting machine is used to mount a part other than the part of the plurality of parts on the board.
The substrate on which the part of the plurality of parts is not mounted and the part other than the part of the plurality of parts is mounted is collected.
After a part of the plurality of parts can be mounted on the board, at least one mounting machine mounts only the part of the plurality of parts on the board.
Component mounting method.

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