JP2021128752A5 - - Google Patents
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- JP2021128752A5 JP2021128752A5 JP2020191783A JP2020191783A JP2021128752A5 JP 2021128752 A5 JP2021128752 A5 JP 2021128752A5 JP 2020191783 A JP2020191783 A JP 2020191783A JP 2020191783 A JP2020191783 A JP 2020191783A JP 2021128752 A5 JP2021128752 A5 JP 2021128752A5
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- tiles
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- memory
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062975577P | 2020-02-12 | 2020-02-12 | |
| US62/975,577 | 2020-02-12 | ||
| US16/859,829 | 2020-04-27 | ||
| US16/859,829 US11226816B2 (en) | 2020-02-12 | 2020-04-27 | Systems and methods for data placement for in-memory-compute |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021128752A JP2021128752A (ja) | 2021-09-02 |
| JP2021128752A5 true JP2021128752A5 (https=) | 2023-10-02 |
| JP7550614B2 JP7550614B2 (ja) | 2024-09-13 |
Family
ID=77177440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020191783A Active JP7550614B2 (ja) | 2020-02-12 | 2020-11-18 | インメモリコンピューティングに対するデータ配置のための方法及びその方法が適用されたメモリモジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US11226816B2 (https=) |
| JP (1) | JP7550614B2 (https=) |
| KR (1) | KR102653014B1 (https=) |
| CN (1) | CN113254359B (https=) |
| TW (1) | TWI848184B (https=) |
Families Citing this family (16)
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| TWI850513B (zh) * | 2020-03-06 | 2024-08-01 | 南韓商三星電子股份有限公司 | 用於記憶體內計算的方法及用於計算的系統 |
| CN115885344A (zh) * | 2020-06-16 | 2023-03-31 | 格罗克公司 | 用于确定性处理器的确定性近计算存储器以及存储器单元与处理单元之间的增强数据移动 |
| US11901035B2 (en) | 2021-07-09 | 2024-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of differentiated thermal throttling of memory and system therefor |
| US12032829B2 (en) | 2021-07-21 | 2024-07-09 | Samsung Electronics Co., Ltd. | Memory device performing in-memory operation and method thereof |
| CN116486862B (zh) | 2022-01-13 | 2024-07-26 | 长鑫存储技术有限公司 | 地址译码电路、存储器及控制方法 |
| US20230315920A1 (en) * | 2022-04-02 | 2023-10-05 | Intel Corporation | Apparatus and method to implement homomorphic encyption and computation with dram |
| KR20230143014A (ko) | 2022-04-04 | 2023-10-11 | 삼성전자주식회사 | 반도체 패키지 |
| US12567122B1 (en) | 2022-04-19 | 2026-03-03 | Nvidia Corporation | Application programming interface to modify tensor dimensions |
| EP4407620B1 (en) * | 2023-01-27 | 2026-04-29 | Samsung Electronics Co., Ltd. | Memory device and method of operating the same |
| KR20240175962A (ko) * | 2023-06-14 | 2024-12-23 | 삼성전자주식회사 | Dsp 및 이를 이용한 전자 장치 |
| CN119149457A (zh) * | 2023-06-16 | 2024-12-17 | 华为技术有限公司 | 内存系统 |
| CN119201035A (zh) * | 2023-06-26 | 2024-12-27 | 华为技术有限公司 | 一种数据处理的方法、芯片和计算设备 |
| KR102814916B1 (ko) * | 2023-08-23 | 2025-05-30 | 삼성전자주식회사 | 메모리 장치 및 그 동작 방법 |
| KR20250103566A (ko) * | 2023-12-27 | 2025-07-07 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | 메모리 디바이스, 메모리 시스템 및 메모리 디바이스를 이용한 데이터 계산 방법 |
| US12596490B2 (en) * | 2024-03-13 | 2026-04-07 | Nvidia Corporation | Memory management using a register |
| US20260050543A1 (en) * | 2024-08-13 | 2026-02-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Compute-in-memory systems and methods with weight update circuits |
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| KR940004434A (ko) | 1992-08-25 | 1994-03-15 | 윌리엄 이. 힐러 | 스마트 다이나믹 랜덤 억세스 메모리 및 그 처리방법 |
| US5953738A (en) * | 1997-07-02 | 1999-09-14 | Silicon Aquarius, Inc | DRAM with integral SRAM and arithmetic-logic units |
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| JP4250900B2 (ja) | 2002-03-14 | 2009-04-08 | ソニー株式会社 | 記憶装置 |
| KR100874949B1 (ko) | 2006-11-15 | 2008-12-19 | 삼성전자주식회사 | 단일 명령 다중 자료 프로세서 및 그것을 위한 메모리어레이 구조 |
| WO2010014696A1 (en) * | 2008-07-29 | 2010-02-04 | Marvell World Trade, Ltd. | Processing rasterized data |
| US8521958B2 (en) * | 2009-06-04 | 2013-08-27 | Micron Technology, Inc. | Internal processor buffer |
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| US20140331014A1 (en) * | 2013-05-01 | 2014-11-06 | Silicon Graphics International Corp. | Scalable Matrix Multiplication in a Shared Memory System |
| KR101937544B1 (ko) * | 2013-12-26 | 2019-01-10 | 인텔 코포레이션 | 메모리 액세스 중 데이터 재배열 |
| US10185499B1 (en) * | 2014-01-07 | 2019-01-22 | Rambus Inc. | Near-memory compute module |
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| US9547441B1 (en) * | 2015-06-23 | 2017-01-17 | Pure Storage, Inc. | Exposing a geometry of a storage device |
| US11079936B2 (en) | 2016-03-01 | 2021-08-03 | Samsung Electronics Co., Ltd. | 3-D stacked memory with reconfigurable compute logic |
| US10180906B2 (en) * | 2016-07-26 | 2019-01-15 | Samsung Electronics Co., Ltd. | HBM with in-memory cache manager |
| US10242728B2 (en) * | 2016-10-27 | 2019-03-26 | Samsung Electronics Co., Ltd. | DPU architecture |
| US10175980B2 (en) | 2016-10-27 | 2019-01-08 | Google Llc | Neural network compute tile |
| US9922696B1 (en) | 2016-10-28 | 2018-03-20 | Samsung Electronics Co., Ltd. | Circuits and micro-architecture for a DRAM-based processing unit |
| ES2933675T3 (es) * | 2016-12-31 | 2023-02-13 | Intel Corp | Sistemas, métodos y aparatos para informática heterogénea |
| JP6988231B2 (ja) | 2017-07-26 | 2022-01-05 | 富士通株式会社 | 情報処理装置、情報処理システム、情報処理方法及び情報処理プログラム |
| US10866900B2 (en) | 2017-10-17 | 2020-12-15 | Samsung Electronics Co., Ltd. | ISA extension for high-bandwidth memory |
| US20190130291A1 (en) * | 2017-10-27 | 2019-05-02 | Wave Computing, Inc. | Dynamic reconfiguration with partially resident agents |
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| KR102410566B1 (ko) * | 2018-02-05 | 2022-06-17 | 삼성전자주식회사 | 반도체 메모리 장치, 이를 포함하는 메모리 시스템 및 반도체 메모리 장치의 동작 방법 |
| US10572568B2 (en) | 2018-03-28 | 2020-02-25 | Intel Corporation | Accelerator for sparse-dense matrix multiplication |
| US10664287B2 (en) * | 2018-03-30 | 2020-05-26 | Intel Corporation | Systems and methods for implementing chained tile operations |
| US10691182B2 (en) * | 2019-05-20 | 2020-06-23 | Intel Corporation | Layered super-reticle computing: architectures and methods |
| US11237903B2 (en) * | 2019-06-25 | 2022-02-01 | Intel Corporation | Technologies for providing ECC pre-provisioning and handling for cross-point memory and compute operations |
| US12248762B2 (en) * | 2020-01-07 | 2025-03-11 | SK Hynix Inc. | Processing-in-memory (PIM) devices |
-
2020
- 2020-04-27 US US16/859,829 patent/US11226816B2/en active Active
- 2020-08-18 KR KR1020200103072A patent/KR102653014B1/ko active Active
- 2020-11-04 TW TW109138406A patent/TWI848184B/zh active
- 2020-11-06 CN CN202011228228.8A patent/CN113254359B/zh active Active
- 2020-11-18 JP JP2020191783A patent/JP7550614B2/ja active Active
-
2021
- 2021-12-10 US US17/548,220 patent/US11782707B2/en active Active
-
2023
- 2023-09-14 US US18/368,515 patent/US12236239B2/en active Active
-
2025
- 2025-02-21 US US19/060,087 patent/US20250190216A1/en active Pending
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