JP2021128752A5 - - Google Patents
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- JP2021128752A5 JP2021128752A5 JP2020191783A JP2020191783A JP2021128752A5 JP 2021128752 A5 JP2021128752 A5 JP 2021128752A5 JP 2020191783 A JP2020191783 A JP 2020191783A JP 2020191783 A JP2020191783 A JP 2020191783A JP 2021128752 A5 JP2021128752 A5 JP 2021128752A5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062975577P | 2020-02-12 | 2020-02-12 | |
| US62/975,577 | 2020-02-12 | ||
| US16/859,829 | 2020-04-27 | ||
| US16/859,829 US11226816B2 (en) | 2020-02-12 | 2020-04-27 | Systems and methods for data placement for in-memory-compute |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021128752A JP2021128752A (ja) | 2021-09-02 |
| JP2021128752A5 true JP2021128752A5 (https=) | 2023-10-02 |
| JP7550614B2 JP7550614B2 (ja) | 2024-09-13 |
Family
ID=77177440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020191783A Active JP7550614B2 (ja) | 2020-02-12 | 2020-11-18 | インメモリコンピューティングに対するデータ配置のための方法及びその方法が適用されたメモリモジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US11226816B2 (https=) |
| JP (1) | JP7550614B2 (https=) |
| KR (1) | KR102653014B1 (https=) |
| CN (1) | CN113254359B (https=) |
| TW (1) | TWI848184B (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI850513B (zh) * | 2020-03-06 | 2024-08-01 | 南韓商三星電子股份有限公司 | 用於記憶體內計算的方法及用於計算的系統 |
| EP4165637A4 (en) * | 2020-06-16 | 2024-07-10 | Groq, Inc. | DETERMINISTIC MEMORY CLOSE TO COMPUTATION FOR DETERMINISTIC PROCESSOR AND ENHANCED DATA MOVEMENT BETWEEN MEMORY UNITS AND PROCESSING UNITS |
| US11901035B2 (en) | 2021-07-09 | 2024-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of differentiated thermal throttling of memory and system therefor |
| US12032829B2 (en) | 2021-07-21 | 2024-07-09 | Samsung Electronics Co., Ltd. | Memory device performing in-memory operation and method thereof |
| CN116486862B (zh) | 2022-01-13 | 2024-07-26 | 长鑫存储技术有限公司 | 地址译码电路、存储器及控制方法 |
| US20230315920A1 (en) * | 2022-04-02 | 2023-10-05 | Intel Corporation | Apparatus and method to implement homomorphic encyption and computation with dram |
| KR20230143014A (ko) | 2022-04-04 | 2023-10-11 | 삼성전자주식회사 | 반도체 패키지 |
| US12567122B1 (en) | 2022-04-19 | 2026-03-03 | Nvidia Corporation | Application programming interface to modify tensor dimensions |
| KR20240175962A (ko) * | 2023-06-14 | 2024-12-23 | 삼성전자주식회사 | Dsp 및 이를 이용한 전자 장치 |
| CN119149457A (zh) * | 2023-06-16 | 2024-12-17 | 华为技术有限公司 | 内存系统 |
| CN119201035A (zh) * | 2023-06-26 | 2024-12-27 | 华为技术有限公司 | 一种数据处理的方法、芯片和计算设备 |
| KR102814916B1 (ko) * | 2023-08-23 | 2025-05-30 | 삼성전자주식회사 | 메모리 장치 및 그 동작 방법 |
| EP4602600A1 (en) * | 2023-12-27 | 2025-08-20 | Yangtze Memory Technologies Co., Ltd. | Memory device, memory system, and method for data calculation with the memory device |
| US12596490B2 (en) * | 2024-03-13 | 2026-04-07 | Nvidia Corporation | Memory management using a register |
| US20260050543A1 (en) * | 2024-08-13 | 2026-02-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Compute-in-memory systems and methods with weight update circuits |
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| KR940004434A (ko) * | 1992-08-25 | 1994-03-15 | 윌리엄 이. 힐러 | 스마트 다이나믹 랜덤 억세스 메모리 및 그 처리방법 |
| US5953738A (en) * | 1997-07-02 | 1999-09-14 | Silicon Aquarius, Inc | DRAM with integral SRAM and arithmetic-logic units |
| US6295586B1 (en) * | 1998-12-04 | 2001-09-25 | Advanced Micro Devices, Inc. | Queue based memory controller |
| JP4250900B2 (ja) | 2002-03-14 | 2009-04-08 | ソニー株式会社 | 記憶装置 |
| KR100874949B1 (ko) | 2006-11-15 | 2008-12-19 | 삼성전자주식회사 | 단일 명령 다중 자료 프로세서 및 그것을 위한 메모리어레이 구조 |
| US8477146B2 (en) * | 2008-07-29 | 2013-07-02 | Marvell World Trade Ltd. | Processing rasterized data |
| US8521958B2 (en) * | 2009-06-04 | 2013-08-27 | Micron Technology, Inc. | Internal processor buffer |
| US9542101B2 (en) * | 2013-01-22 | 2017-01-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | System and methods for performing embedded full-stripe write operations to a data volume with data elements distributed across multiple modules |
| US20140331014A1 (en) * | 2013-05-01 | 2014-11-06 | Silicon Graphics International Corp. | Scalable Matrix Multiplication in a Shared Memory System |
| JP6388654B2 (ja) * | 2013-12-26 | 2018-09-12 | インテル・コーポレーション | メモリアクセス中のデータ並べ替え |
| US10185499B1 (en) * | 2014-01-07 | 2019-01-22 | Rambus Inc. | Near-memory compute module |
| US10996959B2 (en) | 2015-01-08 | 2021-05-04 | Technion Research And Development Foundation Ltd. | Hybrid processor |
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| US11079936B2 (en) | 2016-03-01 | 2021-08-03 | Samsung Electronics Co., Ltd. | 3-D stacked memory with reconfigurable compute logic |
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| US10175980B2 (en) | 2016-10-27 | 2019-01-08 | Google Llc | Neural network compute tile |
| US10242728B2 (en) | 2016-10-27 | 2019-03-26 | Samsung Electronics Co., Ltd. | DPU architecture |
| US9922696B1 (en) * | 2016-10-28 | 2018-03-20 | Samsung Electronics Co., Ltd. | Circuits and micro-architecture for a DRAM-based processing unit |
| EP4089531B1 (en) * | 2016-12-31 | 2024-06-26 | Intel Corporation | Systems, methods, and apparatuses for heterogeneous computing |
| JP6988231B2 (ja) | 2017-07-26 | 2022-01-05 | 富士通株式会社 | 情報処理装置、情報処理システム、情報処理方法及び情報処理プログラム |
| US10866900B2 (en) * | 2017-10-17 | 2020-12-15 | Samsung Electronics Co., Ltd. | ISA extension for high-bandwidth memory |
| US20190130291A1 (en) * | 2017-10-27 | 2019-05-02 | Wave Computing, Inc. | Dynamic reconfiguration with partially resident agents |
| US11373088B2 (en) | 2017-12-30 | 2022-06-28 | Intel Corporation | Machine learning accelerator mechanism |
| KR102410566B1 (ko) * | 2018-02-05 | 2022-06-17 | 삼성전자주식회사 | 반도체 메모리 장치, 이를 포함하는 메모리 시스템 및 반도체 메모리 장치의 동작 방법 |
| US10572568B2 (en) | 2018-03-28 | 2020-02-25 | Intel Corporation | Accelerator for sparse-dense matrix multiplication |
| US10664287B2 (en) | 2018-03-30 | 2020-05-26 | Intel Corporation | Systems and methods for implementing chained tile operations |
| US10691182B2 (en) * | 2019-05-20 | 2020-06-23 | Intel Corporation | Layered super-reticle computing: architectures and methods |
| US11237903B2 (en) * | 2019-06-25 | 2022-02-01 | Intel Corporation | Technologies for providing ECC pre-provisioning and handling for cross-point memory and compute operations |
| US12248762B2 (en) * | 2020-01-07 | 2025-03-11 | SK Hynix Inc. | Processing-in-memory (PIM) devices |
-
2020
- 2020-04-27 US US16/859,829 patent/US11226816B2/en active Active
- 2020-08-18 KR KR1020200103072A patent/KR102653014B1/ko active Active
- 2020-11-04 TW TW109138406A patent/TWI848184B/zh active
- 2020-11-06 CN CN202011228228.8A patent/CN113254359B/zh active Active
- 2020-11-18 JP JP2020191783A patent/JP7550614B2/ja active Active
-
2021
- 2021-12-10 US US17/548,220 patent/US11782707B2/en active Active
-
2023
- 2023-09-14 US US18/368,515 patent/US12236239B2/en active Active
-
2025
- 2025-02-21 US US19/060,087 patent/US20250190216A1/en active Pending
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