JP2021125609A - Sticking apparatus of adhesion tape to substrate, and sticking method - Google Patents

Abstract

To neatly stick an adhesion tape such as a protective tape, or the like to a substrate such as a wrapped wafer at high work efficiency and at low cost.SOLUTION: A sticking apparatus 1 comprises: a support table 40; a sticking roller 41; a pressing roller 42; a movement mechanism that moves at least one of both the sticking roller 41 and the pressing roller 42, and the support table 40 so as to relatively move the sticking roller 41 and the pressing roller 42 on a wafer 2 at the same time; and control means that controls the movement mechanism. The pressing roller 42 is arranged so as to move in front of the sticking roller 41 when relatively moving on the wafer 2. The control means controls the movement mechanism so that a sticking roller 41 sticks a protective tape 3 to the wafer 2 in order from a part of the one end side, and the pressing roller 42 presses the wafer 2 against the support table 40 before the sticking roller 41 presses the protective tape 3 to the wafer 2.SELECTED DRAWING: Figure 6

Description

The present invention relates to a sticking device and a sticking method for sticking an adhesive tape such as a protective tape to a substrate such as a wafer.

Portable electronic devices such as mobile phones, notebook PCs, tablet PCs, and PDAs are required to be smaller, lighter, and more sophisticated, and along with this, the semiconductor devices used in these electronic devices are becoming more expensive. There is an increasing need for integration and thinning. A fan-out type semiconductor package has been proposed as a semiconductor packaging technology that meets such needs. The fan-out type is a package having a structure in which a fine rewiring layer formed on a semiconductor chip is expanded to the outside of the outer shape of the chip, and can increase the transmission speed of electric signals while achieving a thin shape. Moreover, since the external connection terminal can be arranged on the outside of the semiconductor chip, it is possible to support multiple pins and to reduce the size of the semiconductor chip.

In the manufacturing process of a fan-out type semiconductor package, high-temperature heat treatment is required to form a rewiring layer or a solder ball on the semiconductor chip. At this time, the semiconductor chip is resin-sealed. The sealed substrate (resin wafer) may shrink, and the sealed substrate (resin wafer) may warp.

Here, in the semiconductor package manufacturing process, when the back surface of the sealing substrate (resin wafer) is polished for thinning, or when the sealing substrate (resin wafer) is diced for individualization, A protective tape is attached to the surface of the sealing substrate (resin wafer). As a method of sticking the protective tape on the surface of the sealing substrate (resin wafer), a strip-shaped protective tape wider than the sealing substrate (resin wafer) is pulled out on the sealing substrate (resin wafer) and pressed by a sticking roller. After sticking to the surface of the sealing substrate (resin wafer), there is a method of cutting the protective tape along the outer shape of the sealing substrate (resin wafer). However, if the sealing substrate (resin wafer) is warped, there is a problem that it is difficult to neatly attach the protective tape to the surface of the sealing substrate (resin wafer).

In order to eliminate the warp of the substrate, Patent Document 1 includes a holding means having a holding surface capable of sucking and holding the adherend, and a warp correcting means for pressing the adherend against the holding means. When the adherend is warped, the holding means sucks and holds the adherend on the holding surface, and the warp correcting means presses the adherend against the holding surface for a predetermined time to prevent the adherend from warping. A technique for correcting and adsorbing and holding the entire surface of an adherend on a holding surface is disclosed.

JP-A-2019-96704

However, in the technique described in Patent Document 1, it is necessary to drive a decompression means such as a decompression pump or a vacuum ejector to attract and hold the adherend on the holding surface, so that the work efficiency is lowered and the device cost is high. There is a problem with. Further, depending on the wafer, adsorption and holding may not be possible, and there is also a problem that the technique described in Patent Document 1 cannot be applied.

The present invention has been made to solve the above problems, and is a sticking device and sticking device for sticking an adhesive tape such as a protective tape on a warped substrate such as a wafer efficiently, at low cost, and neatly. Provide a method.

The first aspect of the present invention relates to a sticking device for sticking an adhesive tape to a substrate. The sticking device of the present invention includes a support table on which a substrate is placed, a sticking roller that presses an adhesive tape supplied on the substrate from above to attach the substrate to the substrate, and presses the substrate from above to support the substrate. A pressing roller that presses against the table, a moving mechanism that moves at least one of the attaching roller, the pressing roller, and the support table so that the attaching roller and the pressing roller move relative to each other on the substrate at the same time. The pressing roller is provided with a control means for controlling the moving mechanism, and the pressing roller is arranged so as to move in front of the sticking roller when relatively moving on the substrate, and the control means is arranged so as to move in front of the sticking roller. Sequentially attaches the adhesive tape to the substrate from a portion on one end side thereof, and the pressing roller presses the substrate against the support table before the adhesive roller attaches the adhesive tape to the substrate. It is characterized by controlling the moving mechanism.

In the sticking device of the present invention, when the pressing roller starts to move relatively on the substrate, the pressing roller moves from the position of the distal end of the substrate to the proximal end and the distal end of the substrate. It can be configured to come into contact with the substrate within a range up to the center position of the intervening length.

Further, in the sticking apparatus of the present invention, after the adhesive tape is attached to the substrate by the attachment roller, the portion of the adhesive tape not attached to the substrate is cut from the portion attached to the substrate. It can be configured to further include a cutting device to perform.

Further, in the sticking device of the present invention, the moving mechanism simultaneously moves the sticking roller and the pressing roller, and the sticking device presses the adhesive tape attached to the substrate from above to press the substrate. Further provided with a secondary sticking roller that presses against the secondary sticking roller and a second moving mechanism that moves at least one of the secondary sticking roller and the support table so that the secondary sticking roller moves relatively on the substrate. The control means can be configured to control the second moving mechanism so that the secondary sticking roller sequentially presses the adhesive tape against the substrate from a portion on one end side thereof.

A second aspect of the present invention relates to a method of attaching an adhesive tape to a substrate. The sticking method of the present invention includes a tape supply step of supplying an adhesive tape onto a substrate placed on a support table, and a sticking roller that moves relatively on the substrate to attach the adhesive tape by the sticking roller. The sticking step of pressing from above and sequentially sticking to the substrate from one end side thereof, and the sticking roller by moving the front of the sticking roller relative to the sticking roller at the same time as the sticking roller. It is characterized by including a pressing step of pressing the substrate from above by the pressing roller and pressing the substrate against the support table prior to the operation of the roller attaching the adhesive tape to the substrate.

In the attachment method of the present invention, after the adhesive tape is attached to the substrate by the attachment roller, a portion of the adhesive tape that is not attached to the substrate is cut from the portion that is attached to the substrate. It can be configured to include more steps.

Further, in the sticking method of the present invention, after the adhesive tape is stuck to the substrate by the sticking roller, the secondary sticking roller moves relatively on the substrate, so that the secondary sticking roller causes the adhesive tape to move. It can be configured to further include a secondary sticking step of pressing the adhesive tape from above and sequentially pressing it against the substrate from a portion on one end side thereof.

According to the present invention, the pressing roller is simultaneously moving on the substrate in front of the sticking roller moving on the substrate, and the pressing roller presses the substrate from above before the sticking roller attaches the adhesive tape to the substrate. The warp of the substrate is corrected by pressing it against the support table. Therefore, the sticking roller sticks the adhesive tape to the substrate whose warpage has been corrected by the pressing roller in order from the tip portion toward the opposite side, so that the adhesive tape can be neatly stuck to the substrate. ..

In addition, the pressing roller and the attaching roller move at the same time, and the adhesive tape is attached by the attaching roller from the part where the pressing roller corrects the warp of the substrate, and the adhesive tape is attached immediately after correcting the warp of the substrate. As a result, the substrate is prevented from warping again when the adhesive tape is attached, so that a stable application operation can be realized.

In addition, since the pressing roller corrects the warp of the substrate and the adhesive roller attaches the adhesive tape to the substrate, the adhesive tape can be efficiently attached to the substrate, and the work efficiency can be improved. Further, it is not necessary to suck and hold the substrate on the support table, and a decompression means such as a decompression pump or a vacuum ejector is not required when the adhesive tape is attached, so that the work cost can be reduced.

Further, when an adhesive tape is attached to a substrate mounted on a support frame such as a dicing frame using a dicing tape or the like, as in Patent Document 1, the decompression means is driven to attract and hold the substrate on the holding surface. However, unless the dicing tape or the like is processed (for example, the dicing tape or the like is provided with a round hole for adsorbing the substrate), only the dicing tape or the like is adsorbed and held, and the substrate is not adsorbed and held. Further, if the substrate is held while correcting the warp of the substrate by the adhesive force of the dicing tape or the like instead of the adsorption and holding by the decompression means, the adhesive force of the dicing tape or the like is weak. Therefore, the substrate is held before the adhesive tape is attached to the substrate. There is a possibility that the warp will occur again. On the other hand, in the present invention, the adhesive tape can be efficiently and neatly attached to the substrate regardless of whether or not a dicing tape or the like is used.

It is a top view which shows the schematic structure of the sticking apparatus. It is a side view which shows the schematic structure of the tape supply part and the sticking part. It is a figure explaining the adhesive start position position which the protective tape is pulled out. It is a figure explaining the initial position of a pressing roller. It is a figure explaining the process of sticking a protective tape to a wafer. It is a figure explaining the process of sticking a protective tape to a wafer. It is a figure explaining the process of sticking a protective tape to a wafer. It is a figure explaining the process of sticking a protective tape to a wafer. It is a figure explaining the process of sticking a protective tape to a wafer.

The present invention relates to a sticking device and a sticking method for sticking an adhesive tape such as a protective tape to a substrate such as a wafer by a sticking roller by using its adhesiveness, and the adhesive tape can be neatly attached to the substrate even if the substrate is warped. The purpose is to attach it, and it can be effectively used especially in the manufacturing process of a fan-out type semiconductor package.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In this embodiment, a case where a protective tape is attached to the wafer will be described as an example. In the present embodiment, the X direction, the Y direction, and the Z direction are orthogonal to each other, the X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction is the vertical direction (vertical direction) orthogonal to the horizontal plane. ). It should be noted that the thicknesses of the wafer, protective tape, dicing frame, dicing tape, etc. are exaggerated in each drawing for easy understanding.

FIG. 1 is a plan view schematically showing the overall configuration of the sticking device 1 of the present embodiment. The sticking device 1 is a device for sticking the protective tape 3 to the wafer 2 mounted on the dicing frame 4 via the dicing tape 5 as shown in FIG. As shown in FIG. 1, the sticking device 1 includes a frame supply unit A for accommodating a plurality of dicing frames 4, a wafer supply unit B for accommodating a plurality of wafers 2, a tape supply unit C for holding a protective tape 3, and dicing. It includes a sticking portion D for sticking the protective tape 3 to the wafer 2 mounted on the frame 4, and a secondary sticking portion E for pressing the protective tape 3 stuck on the wafer 2 against the wafer 2.

The frame supply unit A supplies the dicing frame 4 onto the support table 40 of the sticking unit D (dicing frame supply step).

The wafer supply unit B supplies the wafer 2 onto the support table 40 of the sticking unit D, and mounts the wafer 2 on the dicing frame 4 in the present embodiment (board supply process).

The tape supply section C supplies the protective tape 3 onto the wafer 2 of the sticking section D (tape supply step).

In the sticking portion D, at least one of the sticking roller 41, the pushing roller 42, and the support table 40 is moved so that the sticking roller 41 and the pushing roller 42 move relatively on the wafer 2 at the same time. As a result, the protective tape 3 supplied on the wafer 2 by the sticking roller 41 is pressed from above, and the protective tape 3 is sequentially stuck to the wafer 2 from the portion on the tip end side thereof. At the same time, the warpage of the wafer 2 is corrected by pressing the wafer 2 from above by the pressing roller 42 at the front position where the attaching roller 41 attaches the protective tape 3 to the wafer 2 and pressing it against the support table 40 (adhesion step). And pressing process).

In the present embodiment, the support table 40 (wafer 2) is kept stationary, the sticking roller 41 and the pushing roller 42 are moved together, and the sticking roller 41 and the pushing roller 42 are moved simultaneously with respect to the wafer 2. The sticking roller 41 and the pressing roller 42 are moving relative to each other on the wafer 2 at the same time. Not limited to this, the sticking roller 41 and the pushing roller 42 are made stationary, the support table 40 (wafer 2) is moved, and the wafer 2 is moved with respect to the sticking roller 41 and the pushing roller 42, whereby the sticking roller 41 is moved. And the pressing roller 42 may move relatively on the wafer 2 at the same time. Further, by moving both the support table 40 (wafer 2) and the sticking roller 41 and the pressing roller 42 in the directions facing each other, the sticking roller 41 and the pressing roller 42 move relatively on the wafer 2 at the same time. You may do so.

Further, in the sticking portion D, after the protective tape 3 is stuck to the wafer 2 by the sticking roller 41, the portion of the protective tape 3 that is not stuck to the wafer 2 is stuck to the wafer 2 by using the cutting device 50. Cutting from (cutting process).

In the secondary sticking portion E, the protective tape 3 is stuck to the wafer 2 by the sticking roller 41, and then the support table 40 is moved to raise the protective tape 3 stuck to the wafer 2 by the secondary sticking roller 60. Is pressed against the wafer 2 in order from the tip end toward the other end side (the other end) on the opposite side (secondary sticking step).

The sticking device 1 has a protrusion processing unit F that processes a surplus portion of the protective tape 3 attached to the wafer 2, and a frame storage unit G that stores a dicing frame 4 on which the wafer 2 to which the protective tape 3 is attached is mounted. And further equipped.

Further, the sticking device 1 includes various devices such as a processing device and a moving mechanism that perform various operations in each part, a conveying mechanism that conveys a wafer 2, a protective tape 3, a dicing frame 4, etc. between each part, and various other devices. Further, the control means 6 for controlling the operation and processing the signals and data received from various devices is provided. The sticking device 1 is configured by mounting these various devices and control means 6 on the machine base 7 and the side wall 8 erected on the machine base 7. The control means 6 can be configured by, for example, a computer provided with a microcomputer, a memory, an HDD, or the like and given processing power by software.

First, the frame supply unit A will be described. As shown in FIG. 1, the frame supply unit A includes a storage cassette 10 that can store a plurality of dicing frames 4 in a vertically stacked state, and a frame transfer mechanism 11 that takes out the dicing frame 4. The storage cassette 10 can be raised and lowered using, for example, an elevating mechanism (not shown) such as an elevator mechanism, and is raised each time the dicing frame 4 is taken out by the frame transport mechanism 11, so that a plurality of dicing frames 4 can be moved from above. It is supplied to the frame transfer mechanism 11 in order.

The frame transport mechanism 11 is a transport arm in the present embodiment, and can reciprocate between the frame supply portion A and the sticking portion D along the guide rail 12 extending in the Y direction. The frame transport mechanism 11 can hold the dicing frame 4 by suction, and the arm portion is provided with a suction portion 13 such as a suction pad.

The control means 6 controls the storage cassette 10 and the frame transfer mechanism 11, takes out the dicing frames 4 one by one from the storage cassette 10 by the frame transfer mechanism 11, and conveys and supplies the dicing frame 4 to the sticking portion D. It is placed on the support table 40 described later.

Next, the wafer supply unit B will be described. As shown in FIG. 1, the wafer supply unit B includes a storage cassette 20 that can store a plurality of wafers 2 in a vertically stacked state, and a wafer transfer mechanism 21 that takes out the wafers 2. The storage cassette 20 can be raised and lowered using, for example, an elevating mechanism (not shown) such as an elevator mechanism, and is raised each time the wafer 2 is taken out by the wafer transport mechanism 21, so that the plurality of wafers 2 are wafers in order from the top. It is supplied to the transport mechanism 21.

The wafer transfer mechanism 21 is a transfer arm in the present embodiment, and moves between the wafer supply unit B and the attachment unit D by reciprocating the guide rail 22 extending in the Y direction and the guide rail 23 extending in the X direction. It is possible. The wafer transfer mechanism 21 is integrally rotatably connected to a rotation shaft 24 whose base extends in the vertical direction, and the arm portion can be swiveled in a horizontal plane. The wafer transfer mechanism 21 can hold the wafer 2 by suction, and the arm portion is provided with a suction portion 25 such as a suction pad.

The control means 6 controls the storage cassette 20 and the wafer transfer mechanism 21, takes out the wafers 2 from the storage cassette 20 one by one by the wafer transfer mechanism 21, conveys and supplies the wafer 2 to the sticking portion D, and will be described later. Place it on the support table 40.

Next, the tape supply unit C will be described. As shown in FIGS. 1 and 2, the tape supply unit C includes a feeding device 30 for feeding out the protective tape 3, a chuck mechanism 31 for pulling out the protective tape 3 to the sticking portion D, and a pulling out mechanism 35. The protective tape 3 has a strip-like shape having a width (length in the X direction) larger than that of the wafer 2, and is provided with an adhesive layer or the like on a base material such as a flexible resin film or a mount. The release sheet 9 is temporarily attached.

The feeding device 30 includes a supply roll 32 for the protective tape 3, a recovery roll 33 for the release sheet 9, and various other rollers 34A to 34F. The protective tape 3 is wound around the supply roll 32 in a roll shape together with the release sheet 9, and reaches the chuck mechanism 31 via the rollers 34A to 34F. The release sheet 9 is separated from the protective tape 3 by the pinch roller 34C, and then wound on the recovery roll 33 via the rollers 34G to 34H. The roller 34E is a dancer roller. The pull-out mechanism 35 can hold the protective tape 3 in between, and can reciprocate along the guide rail 36.

The chuck mechanism 31 holds the tip end portion (end portion on one end side in the length direction) of the strip-shaped protective tape 3. The chuck mechanism 31 includes a pair of upper and lower seat chucks 37 and 38. The pair of upper and lower sheet chucks 37, 38 have a horizontally long plate shape, and the length thereof is larger than the width of the protective tape 3 (the length in the X direction), and the length direction thereof is the same as the width direction of the protective tape 3. Is facing. In the present embodiment, the upper sheet chuck 37 retains its entire width by adsorbing the tip end portion of the protective tape 3 on its lower surface. The means for adsorbing the protective tape 3 is not particularly limited, and various known means can be used. The lower seat chuck 38 holds the entire width of the protective tape 3 by sandwiching the tip portion of the protective tape 3 with the upper seat chuck 37.

The pair of seat chucks 37 and 38 reciprocate in the Y direction by separate horizontal movement mechanisms. The pair of sheet chucks 37, 38 will be described in detail later, but have a drawing start point position (position shown in FIG. 8B) and a drawing end point position (position shown in FIG. 2) for pulling out the protective tape 3 from the feeding device 30. Move back and forth between. The withdrawal end point position is located immediately above the adhesion start end position at which the protective tape 3 is started to be attached. Here, the "adhesion start end position" is a position near the distal end of the wafer 2, and in the present embodiment, as shown in FIG. 3, on the dicing frame 4 outside the distal end of the wafer 2. The position. The distal end of the wafer 2 refers to the farthest end of the wafer 2 in the direction in which the protective tape 3 is pulled out and conveyed by the pair of sheet chucks 37 and 38. The "adhesion start position" may be a position that coincides with the distal end of the wafer 2, but is preferably a position on the dicing frame 4 described above, and extends outward beyond the distal end of the wafer 2. The position is good. The protective tape 3 is placed on the support table 40 by at least reaching the distal end of the wafer 2 placed on the support table 40 by the tip of the protective tape 3 held by the pair of sheet chucks 37, 38. It is supplied so as to cover the wafer 2 on the wafer 2.

Returning to FIGS. 1 and 2, the horizontal movement mechanism is not particularly limited as long as it reciprocates the pair of seat chucks 37 and 38 in the Y direction, and various known means may be used. can. The horizontal movement mechanism for moving the upper seat chuck 37 will be described later. For the lower seat chuck 38, for example, a slider (not shown) that can slide a guide rail 39 extending in the Y direction is attached to the lower seat chuck 38, and for example, a ball screw or a cylinder driven by a motor is attached. By using the slider to reciprocate along the guide rail 39, the lower seat chuck 38 can be reciprocated in the Y direction.

Further, the upper seat chuck 37 can independently reciprocate in the vertical direction with respect to the holder 43 by the vertical movement mechanism 45 attached to the holder 43. The vertical movement mechanism 45 is not particularly limited as long as it moves the upper seat chuck 37 in the vertical direction, and various known means can be used. The upper seat chuck 37 can be moved in the vertical direction by connecting it to, for example, a ball screw or a cylinder (not shown) using a motor as a drive source via a mounting member (not shown).

The control means 6 controls the horizontal movement mechanism of the feeding device 30 and the chuck mechanism 31 to pull out the strip-shaped protective tape 3 from the supply roll 32 and place it on the wafer 2 placed on the support table 40 described later of the sticking portion D. Supply to.

Next, the sticking portion D will be described. As shown in FIGS. 1 and 2, the sticking portion D presses the support table 40 on which the wafer 2 is placed and the protective tape 3 supplied on the wafer 2 from above to stick the sticking roller 41 to the wafer 2. A pressing roller 42 that presses the wafer 2 placed on the support table 40 from above and presses it against the support table 40, a horizontal movement mechanism that simultaneously reciprocates the sticking roller 41 and the pressing roller 42 in the Y direction, and a protective tape. It is provided with a cutting device 50 for cutting 3.

The support table 40 supports the wafer 2 on its upper surface. In the present embodiment, the dicing frame 4 is placed on the support table 40, and the wafer 2 is mounted on the dicing frame 4 via the dicing tape 5. The dicing frame 4 is placed on the support table 40 in a positioned state, and is fixed by a fixing means (not shown) so as not to be displaced. Further, the wafer 2 is mounted in a state of being positioned on the dicing frame 4.

The support table 40 can be raised and lowered by an elevating mechanism while supporting the wafer 2. The support table 40 is always at a position where the wafer 2 is separated from the sticking roller 41, the pressing roller 42, and the upper sheet chuck 37 (positions shown in FIGS. 2 and 5A), but the support table 40 is raised by the elevating mechanism. As a result, the wafer 2 moves to a position where the wafer 2 comes into contact with the sticking roller 41, the pressing roller 42, and the upper sheet chuck 37 (positions shown in FIGS. 5 (B) and 6 to 8). The elevating mechanism is not particularly limited as long as it elevates the support table 40, and various known means can be used. The support table 40 can be raised and lowered by connecting it to, for example, a ball screw using a motor as a drive source, a cylinder (not shown), or the like via a mounting member (not shown).

Further, the support table 40 can reciprocate in the Y direction by the horizontal movement mechanism while supporting the wafer 2. The support table 40 will be described in detail later, but the position below the sticking roller 41 (shown in FIGS. 2 and 5 to 8) and the secondary sticking roller 60 (position shown in FIG. 9) of the secondary sticking portion E to be described later. ) Reciprocates to and from the lower position. The horizontal movement mechanism is not particularly limited as long as the support table 40 is reciprocated in the Y direction, and various known means can be used. For example, a slider (not shown) that can slide a rail extending in the Y direction is attached to the support table 40, and the slider is guided to a guide rail (not shown) using, for example, a ball screw or a cylinder (not shown) that uses a motor as a drive source. By reciprocating along (not shown), the support table 40 can be reciprocated in the Y direction.

As shown in FIGS. 1 and 2, the sticking roller 41 has a horizontally long columnar shape, the length thereof is larger than the width of the protective tape 3 (the length in the Y direction), and the length direction thereof is the protective tape 3 It faces the same direction as the width of.

The sticking roller 41 is held between the pair of holders 43. The pair of holders 43 reciprocate in the Y direction by the horizontal movement mechanism. The horizontal movement mechanism is not particularly limited as long as the pair of holders 43 are reciprocated in the Y direction, and various known means can be used. For example, a slider (not shown) that can slide a guide rail 44 extending in the Y direction is attached to one holder 43, and the slider is guided by using, for example, a ball screw or a cylinder (not shown) that uses a motor as a drive source. By reciprocating along the rail 44, the pair of holders 43 can be reciprocated in the Y direction, and the sticking roller 41 can be reciprocated in the Y direction accordingly.

The sticking roller 41 can independently reciprocate in the vertical direction with respect to the holder 43 by the vertical movement mechanism 46 attached to the holder 43. The vertical movement mechanism 46 is not particularly limited as long as it moves the sticking roller 41 in the vertical direction, and various known means can be used. The sticking roller 41 can be moved in the vertical direction by connecting it to, for example, a ball screw or a cylinder (not shown) whose drive source is a motor via a mounting member (not shown).

When the sticking roller 41 starts sticking the protective tape 3 to the wafer 2, the sticking roller 41 is located near the outside of the bonding start end position as shown in FIG. , Move to the bonding end position where the attachment of the protective tape 3 to the wafer 2 is completed. Here, the "adhesion end position" is a position near the proximal end of the wafer 2, and may be a position that coincides with the proximal end of the wafer 2, or the proximal end of the wafer 2 is outward. It may be a position on the dicing frame 4 beyond. In FIG. 3, the “adhesion end position” is shown at a position on the dicing frame 4 beyond the proximal end of the wafer 2. The proximal end of the wafer 2 refers to the closest end of the wafer 2 in the direction in which the protective tape 3 is pulled out and conveyed by the pair of sheet chucks 37 and 38.

Returning to FIGS. 1 and 2, the pair of holders 43 hold, in addition to the sticking roller 41, the chuck sheet 37 on the upper side of the chuck mechanism 31, the pressing roller 42, the cutting device 50, and the roller 34F of the feeding device 30 in between. doing. As a result, the upper chuck sheet 37, the pressing roller 42, the cutting device 50, and the roller 34F of the feeding device 30 reciprocate in the Y direction at the same time as the sticking roller 41 by the horizontal moving mechanism.

The sticking roller 41 is arranged in the vicinity of the upper chuck sheet 37, and when the sticking of the protective tape 3 is started, the sticking roller 41 is outward in the length direction of the protective tape 3 with respect to the tip end portion of the protective tape 3. They are located at intervals. Further, the lower end of the sticking roller 41 is located at substantially the same height as the lower end of the upper chuck sheet 37.

The sticking roller 41 moves with respect to the wafer 2 by the horizontal movement mechanism with the protective tape 3 sandwiched between the wafer 2 and the wafer 2, so that the protective tape 3 is sequentially opposed to the wafer 2 in the length direction. Press from above toward the other end of the side. As a result, the protective tape 3 is attached to the wafer 2.

As shown in FIGS. 1 and 2, the pressing roller 42 has a horizontally long columnar shape, the length thereof is larger than the width of the wafer 2 (the length in the X direction), and the length direction is that of the sticking roller 41. It faces the same direction as the length direction. The pressing roller 42 is arranged so as to sandwich the upper chuck sheet 37 with the sticking roller 41, and is located at a distance from the sticking roller 41 on the other end side of the protective tape 3 in the length direction. Therefore, when the sticking roller 41 sticks the protective tape 3 to the wafer 2, the sticking roller 41 is located in front of the direction in which the sticking roller 41 moves with respect to the wafer 2. The pressing roller 42 is located below the roller 34F of the feeding device 30, that is, below the protective tape 3, and the lower end of the pressing roller 42 is located at substantially the same height as the lower end of the sticking roller 41. ing.

The pressing roller 42 moves on the wafer 2 by the horizontal movement mechanism, which will be described in detail later, so that the pressing roller 41 presses the wafer 2 from above before the protective tape 3 is attached to the wafer 2. As a result, by pressing the wafer 2 against the support table 40, when the wafer 2 is warped, the warp of the wafer 2 is corrected prior to the operation of the sticking roller 41 to attach the protective tape 3 to the wafer 2. ..

With reference to FIG. 4, the initial position of the pressing roller 42 when the protective tape 3 is started to be attached to the wafer 2, that is, the pressing roller 42 starts moving to the wafer 2 together with the attaching roller 41. The initial position of the wafer is not particularly limited. However, in order to attach the protective tape 3 neatly to the wafer 2 with the affixing roller 41, after correcting the warp of the wafer 2 with the pressing roller 42, the protective tape 3 is attached with the subsequent affixing roller 41 without much delay. It is preferable to attach it to the wafer 2. If the distance between the pressing roller 42 and the sticking roller 41 is long, the warp of the wafer 2 remains between the pressing roller 42 and the sticking roller 41, or even if the warping of the wafer 2 is corrected by the pressing roller 42, the sticking roller 41 is formed. This is because there is a risk that the warp of the wafer 2 will return before it moves. Therefore, from this viewpoint, the initial position of the pressing roller 42 is preferably close to the position of the distal end of the wafer 2. On the other hand, when the distance between the pressing roller 42 and the affixing roller 41 is short, the protective tape 3 is sucked and held by the upper sheet chuck 37 between the pressing roller 42 and the affixing roller 41, or the pressing roller 42 and the affixing roller 41 are attracted and held. It may be difficult to pass the protective tape 3 between the two. From these points of view, the initial position of the pressing roller 42 is preferably from the position of the distal end of the wafer 2 to the position inside the pressing roller 42 and the position of the greatest warp in the wafer 2, for example, the distal end of the wafer 2. And to the central position, which is half the length between the proximal ends, more preferably the length between the distal end of the wafer 2 and the distal and proximal ends of the wafer 2. It is the range up to the position corresponding to 1/3 of the distal radius.

Returning to FIGS. 1 and 2, the pressing roller 42 can independently reciprocate in the vertical direction with respect to the holder 43 by the vertical movement mechanism 47 attached to the holder 43. The vertical movement mechanism 47 is not particularly limited as long as it moves the pressing roller 42 in the vertical direction, and various known means can be used. The pressing roller 42 can be moved in the vertical direction by connecting it to, for example, a ball screw or a cylinder (not shown) using a motor as a drive source via a mounting member (not shown).

The pressing roller 42 is an integral unit with the roller 34F, and the unit can be independently reciprocated in the vertical direction with respect to the holder 43 by the vertical movement mechanism 47, but the pressing roller 42 and the roller 34F are not necessarily the same. And does not have to be a unit.

The cutting device 50 includes a cutter 51, a cutter holder 52 that holds the cutter 51, and a vertical movement mechanism that moves the cutter 51 in the vertical direction. The cutter 51 has a cutting position (position shown in FIG. 8B) for cutting the protective tape 3 and a standby position above the cutting position (FIGS. 2 and 5), which will be described in detail later by the vertical movement mechanism. It moves up and down between the position shown in FIG. 8A). The vertical movement mechanism is not particularly limited as long as it moves the cutter 51 in the vertical direction, and various known means can be used. For example, the cutter holder 52 is connected to, for example, a ball screw or a cylinder (not shown) using a motor as a drive source via a mounting member (not shown), and the cutter holder 52 is moved up and down. The cutter 51 can be moved in the vertical direction. Further, the cutter 51 may be attached to the cutter holder 52 so as to be movable in the vertical direction.

Next, a method of attaching the protective tape 3 to the wafer 2 at the attachment portion D will be described. First, the control means 6 controls the horizontal movement mechanism of the lower seat chuck 38, and from the state shown in FIG. 2, as shown in FIG. 5 (A), attaches the lower seat chuck 38 to the bonding start position. Move from the withdrawal end point position directly above to the withdrawal start point position.

Then, as shown in FIG. 5B, the control means 6 controls the vertical movement mechanisms 45 and 47 to move the upper seat chuck 37 and the pressing roller 42 downward, and at the same time, raises and lowers the support table 40. By controlling the mechanism to raise the support table 40, the wafer 2 placed on the support table 40 is brought into contact with the upper sheet chuck 37 and the pressing roller 42. As a result, the distal end of the wafer 2 and the vicinity of the inside and outside thereof are pressed from above by the upper sheet chuck 37, and the tip of the protective tape 3 attracted and held by the upper sheet chuck 37 is attached to the wafer 2 and the dicing frame 4. Temporarily worn. Further, the wafer 2 is pressed from above by the pressing roller 42 and pressed against the support table 40, so that the warp of the wafer 2 is partially corrected.

Then, as shown in FIG. 6A, the control means 6 controls the vertical movement mechanism 45 to move the upper sheet chuck 37 upward to separate it from the wafer 2 and control the vertical movement mechanism 46. The sticking roller 41 is moved downward.

Then, the control means 6 controls the horizontal movement mechanism of the holder 43 that holds the sticking roller 41, the pressing roller 42, and the like, and moves the holder 43 as shown in FIG. 6B to move the sticking roller 41. And the pressing roller 42 is moved with respect to the wafer 2 at the same time. As a result, the pressing roller 42 presses the wafer 2 from above while moving on the wafer 2 toward the proximal end of the wafer 2. As a result, the warp of the wafer 2 is gradually corrected by the pressing roller 42.

On the other hand, the sticking roller 41 reaches the bonding start end position near the distal end of the wafer 2, presses the tip of the protective tape 3 from above, sticks it to the dicing frame 4 and further to the wafer 2, and then pushes it. The protective tape 3 is sequentially pressed against the wafer 2 from the tip end toward the opposite side while moving on the wafer 2 in a state where the warp is corrected by the pressing roller 42 following the roller 42. As a result, the protective tape 3 is gradually attached to the wafer 2 by the attachment roller 41.

As shown in FIG. 7A, when the pressing roller 42 reaches the vicinity of the proximal end of the wafer 2, the control means 6 controls the vertical movement mechanism 47 to move the pressing roller 42 upward to the wafer. Separate from 2. The pressing roller 42 can be separated from the wafer 2 by lowering the support table 40 without moving the pressing roller 42 upward. In this case, the vertical movement mechanism 46 is controlled to move the sticking roller 41 downward so as to follow the lowering of the support table 40.

Then, as shown in FIG. 7B, when the sticking roller 41 reaches the bonding end position near the proximal end of the wafer 2, the control means 6 is a holder 43 that holds the sticking roller 41, the pressing roller 42, and the like. By controlling the horizontal movement mechanism and stopping the movement of the holder 43, the movement of the sticking roller 41 and the pressing roller 42 is stopped. As a result, the protective tape 3 is attached to the entire surface of the wafer 2.

When the protective tape 3 is attached to the wafer 2, the control means 6 controls the vertical movement mechanism 45 to move the upper sheet chuck 37 downward as shown in FIG. 8A, and the drawing end point. A portion of the protective tape 3 that is not attached to the wafer 2 is sandwiched and held between the seat chuck 38 on the lower side at the position and sucked and held.

Then, the control means 6 controls the vertical movement mechanism of the cutter 51 to move the cutter 51 downward as shown in FIG. 8B, and uses the cutter 51 to move the cutter 51 onto the wafer 2 of the protective tape 3. The unattached portion is cut from the portion attached to the wafer 2. As a result, the work of attaching the protective tape 3 to the wafer 2 in the attaching portion D is completed. After cutting the protective tape 3, the control means 6 controls the vertical movement mechanism of the cutter 51 to move the cutter 51 upward to position it in the standby position.

After that, when the support table 40 moves to the secondary sticking portion E as described later, the control means 6 controls the vertical movement mechanisms 46 and 47 to appropriately move the sticking roller 41 and the pressing roller 42 in the vertical direction, respectively. The sticking roller 41 and the pushing roller 42 are positioned so that the lower ends of the sticking roller 41 and the pushing roller 42 are located at substantially the same height as the lower end of the upper chuck sheet 37. Then, by controlling the horizontal movement mechanism of the holder 43 that holds the upper chuck sheet 37, the sticking roller 41, the pressing roller 42, etc., and moving the holder 43, the upper chuck sheet 37, the sticking roller 41, and the pressing roller are moved. Return 42 to its original position again. Further, the control means 6 controls the horizontal movement mechanism of the lower seat chuck 38 to move the lower seat chuck 38 together with the upper seat chuck 37 from the withdrawal start point position to the withdrawal end point position to provide new protection. Pull out the tape 3 to just above the bonding start position.

Next, the secondary sticking portion E will be described. As shown in FIGS. 1 and 2, the secondary attachment portion E includes a secondary attachment roller 60 that presses the protective tape 3 attached to the wafer 2 from above and presses it against the wafer 2.

The secondary sticking roller 60 has a horizontally long columnar shape, the length thereof is larger than the width of the protective tape 3 (the length in the Y direction), and the length direction thereof faces the same direction as the width direction of the protective tape 3. ing.

The control means 6 controls the elevating mechanism and the horizontal movement mechanism of the support table 40, and as shown in FIG. 9, the control means 6 mounts the support table 40 on which the wafer 2 to which the protective tape 3 is attached is placed on the secondary attachment roller 60. The secondary sticking roller 60 is brought into contact with the protective tape 3 on the wafer 2 by moving it to a position below. At this time, the secondary sticking roller 60 is brought into contact with the tip of the protective tape 3 first stuck to the wafer 2 by the sticking roller 41 at the sticking portion D.

Then, the control means 6 controls the horizontal movement mechanism of the support table 40 to move the support table 40 and move the wafer 2 with respect to the secondary sticking roller 60 as shown in FIG. The protective tape 3 attached to the wafer 2 by the secondary attachment roller 60 is sequentially applied from the tip end to the other end, that is, the protective tape 3 first attached to the wafer 2 by the attachment roller 41 at the attachment portion D. It is pressed against the wafer 2 by pressing from above toward the end on the opposite side in the length direction from the tip. As a result, the protective tape 3 is strongly attached to the wafer 2. Further, since the protective tape 3 is pressed against the wafer 2 from the direction opposite to that at the time of the first attachment in the attachment portion D, the protective tape 3 can be attached more neatly.

In the present embodiment, the secondary sticking roller 60 is made stationary, the support table 40 (wafer 2) is moved, and the wafer 2 is moved with respect to the secondary sticking roller 60 to move the secondary sticking roller 60. Moves relatively on the wafer 2, whereby the protective tape 3 is pressed against the wafer 2 by the secondary sticking roller 60. Not limited to this, by keeping the support table 40 (wafer 2) stationary, moving the secondary sticking roller 60, and moving the secondary sticking roller 60 with respect to the wafer 2, the secondary sticking roller 60 becomes a wafer. 2 It may be made to move relatively on the top at the same time. Further, by moving the support table 40 (wafer 2) and the secondary sticking roller 60 in the directions facing each other, the secondary sticking roller 60 may move relatively on the wafer 2.

Next, the protrusion processing unit F will be described. In the protrusion processing unit F, the protective tape 3 is processed on the portion of the protective tape 3 attached to the wafer 2 that protrudes from the outer peripheral edge of the dicing frame 4 or the wafer 2, so that the protective tape 3 is applied to the outer peripheral edge of the dicing frame 4 or the wafer 2. Do not stick out.

As shown in FIG. 1, the dicing frame 4 (dicing frame with wafer) on which the wafer 2 to which the protective tape 3 is attached in the secondary attachment portion E is mounted on the secondary attachment portion E by the frame transfer mechanisms 70 and 71. It is conveyed and supplied from the support table 40 to the processing table 80 of the protrusion processing unit F. Each of the frame transfer mechanisms 70 and 71 is a transfer arm in the present embodiment, and can reciprocate along the guide rails 72 and 73 extending in the Y direction, respectively. The frame transfer mechanisms 70 and 71 can hold the dicing frame 4 with a wafer by suction, and the arm portion is provided with suction portions 74 and 75 such as a suction pad. The arm portion of the frame transport mechanism 71 is reversible, and after receiving the dicing frame 4 with a wafer from the frame transport mechanism 70, the arm portion is inverted so that the dicing frame 4 with a wafer can be placed on the processing table 80. Is.

The method of processing the portion of the protective tape 3 protruding from the outer peripheral edge of the dicing frame 4 or the wafer 2 in the protrusion processing unit F is not particularly limited, and for example, the protective tape 3 is cut along the outer shape of the dicing frame 4 or the wafer 2. By doing so, the protective tape 3 can be prevented from protruding from the wafer 2. Further, by folding back the portion of the protective tape 3 that protrudes from the dicing frame 4 or the outer peripheral edge of the wafer 2, the protective tape 3 can be prevented from protruding from the dicing frame 4 or the wafer 2. These treatments can be performed using various known devices (not shown). Since the shape of the dicing frame 4 in the present embodiment is an octagon with the corners of the quadrangle dropped, the protective tape 3 protrudes. For example, the dicing frame 4 may have another shape for the purpose of eliminating the protrusion of the protective tape 3.

The dicing frame 4 with a wafer that has been subjected to the protrusion processing is conveyed and supplied to the frame storage unit G by moving the processing table 80 along the guide rail 81.

As shown in FIG. 1, the frame storage unit G is provided with a storage cassette 90 that can store a plurality of dicing frames 4 with wafers in a vertically stacked state. The storage cassette 90 can be raised and lowered using, for example, an elevator mechanism or other lifting mechanism (not shown). In the frame storage unit G, the storage cassette 90 is raised and lowered each time the dicing frame 4 with a wafer is stored, and a plurality of dicing frames 4 with a wafer are sequentially stored.

As described above, according to the sticking device 1 and the sticking method of the present embodiment, the pushing roller 42 is moving on the wafer 2 at the same time in front of the sticking roller 41 moving on the wafer 2, and the sticking roller 41 is protected. Before the tape 3 is attached to the wafer 2, the pressing roller 42 presses the wafer 2 from above and presses it against the support table 40 to correct the warp of the wafer 2. Therefore, the sticking roller 41 sticks the protective tape 3 to the wafer 2 in a state where the warp is corrected by the pressing roller 42 sequentially from the tip portion toward the opposite side, so that the protective tape 3 is neatly attached to the wafer 2. Can be pasted on.

Further, the pressing roller 42 and the attaching roller 41 move at the same time, and the protective tape 3 is attached by the attaching roller 41 from the portion where the pressing roller 42 has corrected the warp of the wafer 2, and the wafer 2 is immediately protected by correcting the warp. By sticking the tape 3, the wafer 2 is prevented from warping again when the protective tape 3 is stuck, so that a stable sticking operation can be realized.

In addition, since the pressing roller 42 corrects the warp of the wafer 2 and the sticking roller 41 sticks the protective tape 3 to the wafer 2, the protective tape 3 can be efficiently stuck to the wafer 2, and the work efficiency can be improved. .. Further, it is not necessary to suck and hold the wafer 2 on the support table 40, and a decompression means such as a decompression pump or a vacuum ejector is not required when the protective tape 3 is attached, so that the work cost can be reduced.

Further, since the protective tape 3 is attached to the wafer 2 mounted on the dicing frame 4 using the dicing tape 5, the decompression means is driven to hold the wafer 2 on the holding surface as in Patent Document 1. Even so, unless the dicing tape 5 is processed (for example, the dicing tape 5 is provided with a round hole for adsorbing the wafer 2), only the dicing tape 5 is adsorbed and held, and the wafer 2 is not adsorbed and held. Further, when the wafer 2 is held while correcting the warp of the wafer 2 by the adhesive force of the dicing tape 5 instead of being attracted and held by the decompression means, the adhesive force of the dicing tape 5 is weak, so that the protective tape 3 is attached to the wafer 2. There is a possibility that the wafer 2 will be warped again before being attached. On the other hand, in the sticking device 1 and the sticking method of the present embodiment, the protective tape 3 can be efficiently and neatly stuck to the wafer 2 regardless of whether the dicing tape 5 is used or not.

Although one embodiment of the present invention has been described above, the present invention is not limited to this embodiment, and various modifications can be made without departing from the spirit of the present invention.

As a modification, in the above embodiment, in FIG. 5B, instead of raising the support table 40, the holder 43 is lowered, so that the upper sheet is placed on the wafer 2 placed on the support table 40. The chuck 37 and the pressing roller 42 may be brought into contact with each other.

As another modification, when the dicing tape 5 is attached to the wafer 2, in the above embodiment, the protective tape 3 may be read as the dicing tape 5 without the dicing tape 5.

As another modification, in the above embodiment, the protective tape 3 is attached to the wafer 2 with the wafer 2 mounted on the dicing frame 4, but the wafer 2 is not mounted on the dicing frame 4 but is attached to the support table 40. It may be placed and the protective tape 3 may be attached.

As another modification, in the above embodiment, the protective tape 3 is secondarily attached to the wafer 2, but the secondary attachment is not always necessary. Specifically, the secondary sticking portion E and the secondary sticking step are not always necessary.

As another modification, in the above embodiment, the wafer 2 is placed on the support table 40 in a state of being warped so as to be convex upward, but the warping method of the wafer 2 is not particularly limited and is convex downward. It may be placed on the support table 40 in a warped state so as to become. Further, the orientation of the wafer 2 when placed on the support table 40 is not particularly limited. Further, in the above embodiment, the shape of the wafer 2 is quadrangular, but the shape of the wafer 2 is not particularly limited and may be circular or hexagonal.

As another modification, in the above embodiment, the substrate and the adhesive tape are the wafer 2 and the protective tape 3, but the adhesive tape is not particularly limited as long as it is an adhesive tape, and the substrate needs to be attached with the adhesive tape. There is no particular limitation as long as there is.

1 Sticking device 2 Wafer (board)
3 Protective tape (adhesive tape)
6 Control means 40 Support table 41 Sticking roller 42 Pushing roller 50 Cutting device 60 Secondary sticking roller

Claims (7)

It is a sticking device that sticks adhesive tape to the board.
A support table on which the board is placed and
An adhesive roller that presses the adhesive tape supplied on the substrate from above to attach it to the substrate, and
A pressing roller that presses the substrate from above and presses it against the support table.
A moving mechanism that moves at least one of the sticking roller, the pushing roller, and the support table so that the sticking roller and the pushing roller move relatively on the substrate at the same time.
A control means for controlling the movement mechanism and
With
The pressing roller is arranged so as to move in front of the sticking roller when relatively moving on the substrate.
In the control means, the sticking roller sequentially sticks the adhesive tape to the substrate from a portion on one end side thereof, and the pressing roller attaches the adhesive tape to the substrate before the sticking roller attaches the adhesive tape to the substrate. A sticking device that controls the moving mechanism so as to be pressed against the support table. When the pressing roller begins to move relatively on the substrate, the pressing roller extends from the position of the distal end of the substrate to the central position of the length between the proximal and distal ends of the substrate. The sticking device according to claim 1, which is in contact with the substrate within the range of. Claim 1 further comprises a cutting device that attaches the adhesive tape to the substrate by the attachment roller and then cuts a portion of the adhesive tape that is not attached to the substrate from the portion that is attached to the substrate. Or the sticking device according to 2. The moving mechanism simultaneously moves the sticking roller and the pressing roller.
The sticking device is
A secondary sticking roller that presses the adhesive tape attached to the substrate from above and presses it against the substrate.
A second moving mechanism that moves at least one of the secondary sticking roller and the support table so that the secondary sticking roller moves relatively on the substrate.
With more
The control means according to any one of claims 1 to 3, wherein the control means controls the second moving mechanism so that the secondary sticking roller sequentially presses the adhesive tape against the substrate from a portion on one end side thereof. Sticking device. It is a sticking method that sticks adhesive tape to the board.
A tape supply process that supplies adhesive tape on a substrate placed on a support table,
By moving the sticking roller relatively on the substrate, the adhesive tape is pressed from above by the sticking roller, and the sticking step of sticking the adhesive tape to the board is sequentially performed from the portion on one end side thereof.
The pressing roller moves in front of the sticking roller on the substrate at the same time as the sticking roller, so that the sticking roller advances the adhesive tape to the substrate by the pressing roller prior to the operation of the sticking roller. The pressing process of pressing from above and pressing against the support table,
Including, pasting method. 5. The fifth aspect of the present invention further includes a cutting step of attaching the adhesive tape to the substrate by the attachment roller and then cutting a portion of the adhesive tape not attached to the substrate from the portion attached to the substrate. The sticking method described in. After the adhesive tape is attached to the substrate by the attachment roller, the secondary attachment roller moves relatively on the substrate to press the adhesive tape from above by the secondary attachment roller and one end thereof. The sticking method according to claim 5 or 6, further comprising a secondary sticking step of pressing the substrate sequentially from the side portion.

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