JP2021123096A - Liquid discharge head and manufacturing method of the same - Google Patents

Abstract

To provide a liquid discharge head in which a plate-like cover member is disposed around a recording element substrate including at least a discharge port for discharging a liquid and which prevents a resin sealing a gap between the recording element substrate and the cover member from oozing on a surface of the cover member.SOLUTION: A recording element substrate 101 and a cover member 103 are joined to a first surface of a support substrate 102 so that the cover member 103 protrudes farther, and a sealing resin 104 is provided so as to fill a gap formed between the recording element substrate 101 and the cover member 103. At least a part of a side surface of the cover member 103 facing the gap between the recording element substrate 101 and the cover member 103 is covered with a solid material different from the sealing resin 104.SELECTED DRAWING: Figure 3

Description

The present invention relates to a liquid discharge head that discharges a liquid from a discharge port to a recording medium or the like, and a method for manufacturing the same.

The liquid discharge head includes a side shooter type that discharges the liquid toward the upper side of the recording element that applies energy for discharging the liquid. In this type of liquid discharge head, the recording element substrate on which the recording element and the discharge port are formed is joined onto the support substrate, and the recording element substrate protrudes from the support substrate. If the recording element substrate protrudes from the support substrate, the recording element substrate is present when the recording medium comes into contact with the liquid discharge head due to a transfer defect while the recording medium is being conveyed, or when the liquid discharge head itself is dropped. May be damaged. Therefore, Patent Document 1 discloses a liquid discharge head in which a cover member having a larger amount of protrusion from the support substrate than the recording element substrate is arranged on the support substrate so as to surround the recording element substrate. In this liquid discharge head, since the cover member protrudes from the recording element substrate, the risk of damage to the recording element substrate due to contact with an object is reduced.

JP-A-2017-209942

In a liquid discharge head in which a cover member is arranged around a recording element substrate, this resin is used when a sealing resin is applied to the gap between the recording element substrate and the cover member and cured. May seep out onto the surface of the cover member and harden. The resin that adheres to the surface of the cover member and is hardened may peel off when cleaning the surface of the recording element substrate and enter the discharge port, which may cause a discharge failure.

An object of the present invention is a liquid discharge head in which a cover member is arranged around a recording element substrate, and it is possible to suppress the possibility that a resin sealing between the recording element substrate and the cover member exudes to the surface of the cover member. It is an object of the present invention to provide a liquid discharge head and a method for manufacturing the same.

The liquid discharge head of the present invention
Support board and
A recording element substrate bonded to the first surface of the support substrate having at least a discharge port for discharging a liquid, and a recording element substrate.
The cover member arranged so as to surround the recording element substrate on the first surface and joined to the first surface, and the gap between the recording element substrate and the cover member are filled on the first surface. With the sealing resin provided in the above
At least a part of the side surface of the cover member facing the gap is covered with a solid substance different from the sealing resin.

According to the present invention, it is a liquid discharge head in which a cover member is arranged around the recording element substrate, and it is possible to suppress the possibility that the resin sealing between the recording element substrate and the cover member exudes to the surface of the cover member. Liquid discharge head can be obtained.

It is a figure explaining the liquid discharge head. It is a figure explaining the joining of a cover member to a support substrate. It is a figure explaining the liquid discharge head of 1st Embodiment of this invention. It is a figure explaining the bonding state of the cover member according to the amount of adhesive. It is a figure explaining the liquid discharge head of the 2nd Embodiment. It is a figure explaining the liquid discharge head of 3rd Embodiment. It is a figure explaining the liquid discharge head of 4th Embodiment.

Next, a mode for carrying out the present invention will be described with reference to the drawings. Before explaining the liquid discharge head based on the present invention, a general configuration of the liquid discharge head will be described with reference to FIG. FIG. 1A is a perspective view of the liquid discharge head, and FIG. 1B is a plan view of the liquid discharge head.

The liquid ejection head shown in FIG. 1 is mounted on a liquid ejection head such as an inkjet recording device and is used for ejecting a liquid such as ink to a recording medium such as paper, and is a side shooter type. Is. One or more recording element substrates 101 are bonded to the first surface of the support substrate 102 with an adhesive or the like. In the example shown in FIG. 1, three recording element substrates 101 are joined to the illustrated upper surface of the support substrate 102. The recording element substrate 101 is made of a silicon substrate at least at a portion to be joined to the support substrate 102. In the recording element substrate 101, a plurality of energy generating elements (not shown) are provided on one surface of the silicon substrate, and the discharge port forming member is arranged so as to cover the forming region of the energy generating element. In the discharge port forming member, a discharge port for discharging a liquid is formed as a through hole at a position facing the energy generating element for each energy generating element. The space sandwiched between one surface of the silicon substrate and the discharge port forming member is a flow path for supplying the liquid to the position of the energy generating element. Further, the silicon substrate is formed with a liquid supply path (not shown) penetrating from the other surface of the silicon substrate to one surface in order to supply the liquid to the flow path. The portion shown as the recording element substrate 101 in FIGS. 1A and 1B shows the surface of the discharge port forming member included in the recording element substrate 101.

In order to supply an electric signal from the main body of the liquid discharge device equipped with the liquid discharge head to the recording element board 101, a wiring board (not shown) having electrical wiring is also provided, and the wiring board is also the first support board 102. It is joined to the surface of the surface with an adhesive or the like. Various methods can be used for the electrical connection between the recording element substrate 101 and the wiring board, but the connection using flying leads and the connection by wire bonding are common. After the recording element substrate 101 and the wiring board are electrically connected, the lead portion or the wire portion, which is the electrical connection portion, is insulated and protected so as not to come into contact with the liquid. A general insulation protection method is a method in which a curable liquid resin is applied from above the electrical connection portion and cured, and the electrical connection portion is embedded in the cured resin. Examples of the liquid resin used here include compositions such as thermosetting, UV (ultraviolet) curable or moisture curable epoxy resins, acrylic resins, and silicone resins. A contact pin, a connector, or the like is generally used for the electrical connection between the wiring board and the main body of the liquid discharge device.

As an adhesive for joining the recording element substrate 101 and the wiring substrate to the support substrate 102, a heat-curable or UV-curable adhesive can be used, and in particular, an epoxy-based adhesive, an acrylic-based adhesive, or an acrylic adhesive or A urethane adhesive or the like can be used. The support substrate 102 is formed with a liquid supply port that communicates with the liquid supply path formed in the recording element substrate 101 to supply the liquid to the recording element substrate 101. The liquid supplied from the liquid supply port of the support substrate 102 to the recording element substrate 101 is supplied to the position of the energy generating element on the recording element substrate 101. Then, when the energy generating element is driven by the electric signal supplied through the wiring board, the liquid becomes droplets due to the action of the energy generating element, is discharged from the discharge port, and lands on the recording medium. As a result, the liquid was recorded on the recording medium. If the recording element substrate 101 and the wiring board are electrically connected and the recording element substrate 101 and the wiring board are joined to the support substrate 102, the liquid discharge head can be operated for the time being.

By the way, in the state where the recording element substrate 101 is bonded to the first surface of the support substrate 102, the recording element substrate 101 protrudes from the support substrate 102, and the recording element substrate 101 is projected when the recording medium is contacted or the liquid discharge head is dropped. Is easily damaged. Therefore, in the liquid discharge head, a cover member 103 is provided on the first surface of the support substrate 102 so as to surround the recording element substrate 101. The amount of protrusion of the support substrate 102 from the first surface of the cover member 103 is larger than that of the recording element substrate 101. More specifically, the cover member 103 is a plate-shaped member, and an opening having a shape corresponding to the recording element substrate 101 is hollowed out. Since the cover member 103 protrudes from the support substrate 102 more than the recording element substrate 101, the possibility of contact of an object with the recording element substrate 101 is reduced, and the possibility of damage to the recording element substrate 101 is also reduced. .. From the viewpoint of low manufacturing cost, a resin molded product is widely used for the cover member 103. The cover member 103 is joined to one surface of the support substrate 102 by an adhesive 105. As the adhesive 105 used here, one made of a thermosetting type or a room temperature curing type resin composition can be appropriately selected and used.

The opening formed in the cover member 103 is formed so as to have a size slightly larger than the outer shape of the recording element substrate 101 so that the recording element substrate 101 does not come into contact with the cover member 103. There is a gap between the cover member 103 and the cover member 103. This gap may be left, but if a part of the liquid discharged from the discharge port collects in this gap, it may fall on the recording medium and contaminate the recording medium. It is preferable to fill in. Therefore, a curable resin is applied as the sealing resin 104 to the gap between the recording element substrate 101 and the cover member 103, and then the sealing resin 104 is cured, so that the gap is formed by the sealing resin 104. To be filled and sealed.

The joining of the cover member 103 to the support substrate 102 and the application of the sealing resin to the gap between the recording element substrate 101 and the cover member 103 will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view taken along the line II-II in FIG. 1 (b). First, as shown in FIG. 2A, the adhesive 105 is applied to the first surface of the support substrate 102 to which the recording element substrate 101 and the like have already been bonded in accordance with the bonding position of the cover member 103. The adhesive 105 preferably has physical properties such that the cross-sectional shape when applied is as shown in FIG. 2 (a). Next, as shown in FIG. 2B, the cover member 103 is placed on the adhesive 105 so that one surface of the cover member 103 faces up so as to crush the adhesive 105 on the support substrate 102. Press and cure the adhesive 105. The one surface of the cover member 103 is the surface of the plate-shaped cover member 103 that is opposite to the support substrate 102. Therefore, the other surface of the cover member 103 is a surface facing the first surface of the support substrate 102. In this example, the adhesive 105 does not protrude from the gap between the support substrate 102 and the other surface of the cover member 103. Next, as shown in FIG. 2C, the sealing resin 104 is applied so as to fill the gap between the recording element substrate 101 and the cover member 103, and the sealing resin 104 is applied. Let it cure. As the sealing resin 104, any curable resin composition such as a thermosetting type, a UV curing type, and a room temperature curing type can be used. In particular, as the sealing resin 104, a resin composition appropriately selected from the viewpoints that the accuracy of bonding the recording element substrate 101 to the support substrate 102 is not adversely affected and the chemical resistance to the liquid for discharge is used shall be used. Can be done.

Regarding the sealing resin 104 applied to the gap between the recording element substrate 101 and the cover member 103, depending on the coating amount thereof, as shown in FIG. 2C, the cover member 103 and the recording element substrate 101 are on the upper surface side of each drawing. May form a meniscus that extends to the edge. Since the recording element substrate 101 is formed of a silicon substrate, the liquid sealing resin 104 does not exude to the surface of the upper surface of the recording element substrate 101 as shown. On the other hand, when the cover member 103, which is a resin molded product, is used from the viewpoint of cost and the like, the sealing resin 104 touching the side surface of the cover member 103 has fine details peculiar to the surface of the resin molded product. It may seep out to one surface of the cover member 103 along the groove. The sealing resin 104 that has exuded to one surface of the cover member 103 is cured at the exuded tip. Since the sealing resin 104 exudes to one surface of the cover member 103 due to the capillary phenomenon, the sealing resin 104 that has exuded and hardened has a fine size and is peeled off from the cover member 103. It's easy to do. In the liquid discharge head, when the liquid for discharge remains on the surface of the recording element substrate 101, a wiping process is performed in which the liquid remaining on the surface is wiped off with a rubber wiper as a part of the cleaning process. At this time, when the wiping operation is started from one surface of the cover member 103 in order to secure the approaching distance in the wiping operation, the cured sealing resin 104 existing on one surface of the cover member 103 is peeled off, and the rubber wiper May move with. The sealing resin 104 that has moved together with the rubber wiper clogs the discharge port, and as a result, the liquid cannot be normally discharged from the liquid discharge head, and recording on a recording medium may not be possible.

Therefore, in the liquid discharge head based on the present invention, at least a part of the side surface of the plate-shaped cover member 103 facing the gap between the recording element substrate 101 and the cover member 103 is a solid material other than the sealing resin 104. It is characterized by being covered with. The side surface facing the gap between the recording element substrate 101 and the cover member 103 is a part of the side wall forming the gap when viewed from the gap between the recording element substrate 101 and the cover member 103, and is formed on the cover member 103. It can be said that it is a part of the side wall of the opening. Further, this side surface is also a side surface facing the recording element substrate 101 via a gap. By covering at least a part of the side surface of the cover member 103 with the solid material in this way, when the liquid sealing resin 104 is applied to the gap between the recording element substrate 101 and the cover member 103, the sealing resin The end of the meniscus 104 does not reach the cover member 103. As a result, it is also possible to prevent the sealing resin 104 from seeping out to one surface of the cover member 103 along the groove formed in the cover member 103 which is a resin molded product. Hereinafter, each embodiment of the liquid discharge head based on the present invention will be described.

[First Embodiment]
FIG. 3 is a cross-sectional view showing a liquid discharge head according to the first embodiment of the present invention. FIG. 3 (a) shows a cross-sectional configuration of the liquid discharge head of the present embodiment corresponding to the cross-section taken along the line II-II of FIG. 1 (b), and FIGS. 3 (b) and 3 (c) show. The manufacturing process of the liquid discharge head is shown. In this liquid discharge head, the cover member 103 is joined to the support substrate 102 via the adhesive 105 in the same manner as shown in FIGS. 1 and 2. However, in the present embodiment, the adhesive 105 protrudes from the edge of the cover member 103 as compared with the one shown in FIG. 2C, and the recording element substrate 101 and the cover member 103 are formed on the side surfaces of the cover member 103. It covers at least a part of the side surface facing the gap. The adhesive 105 functions as a solid that covers at least a part of the side surface of the cover member 103. However, the adhesive 105 has not reached one surface of the cover member 103. The gap between the recording element substrate 101 and the cover member 103 is filled with the sealing resin 104, and the sealing resin 104 comes into contact with the adhesive 105 in the region of the gap on the cover member 103 side. However, it is not in contact with the side surface of the cover member 103 itself.

Since at least a part of the side surface of the cover member 103 is covered with the adhesive as described above, the coating position of the adhesive 105 on the support substrate 102 corresponds to the opening of the cover member 103 in the process of manufacturing the liquid discharge head. Get as close to the position as possible. As the adhesive 105, one having poor wettability with respect to the liquid sealing resin 104 to be applied in the subsequent step is selected. Assuming that the wettability is evaluated by the contact angle of the sealing resin 104 in the liquid state, the sealing is such that the contact angle with respect to the adhesive 105 is 70 ° or more, preferably 80 ° or more, and more preferably 90 ° or more. It is preferable to select a combination of the resin 104 for use and the adhesive 105. The property of poor wettability to the adhesive 105, that is, the property of being repelled by the adhesive 105, is due to the surface free energy of each resin material. Therefore, it is preferable to confirm in advance the wettability of the sealing resin 104 with respect to the adhesive 105 in a liquid state. In the present embodiment, as the sealing resin 104, a room temperature curable urethane resin obtained by mixing an isocyanate compound and a phenol compound is used. Examples of the resin composition having poor wettability of the sealing resin 104n, which is a urethane resin, include fluorocarbons and compounds having a dimethylsiloxane bond, that is, fluororesins and silicone resins. In the present embodiment, as the adhesive 105, a silicone resin composition having a dimethylsiloxane structure and capable of being cured by a condensation reaction at room temperature is used. The adhesive 105 needs a certain viscosity and thixotropy. The viscosity of the adhesive 105 is preferably 40 to 1000 Pa · s, more preferably 50 to 300 Pa · s. The thixotropy ratio of the adhesive 105 is preferably about 1.0 to 3.0. In the manufacture of the liquid discharge head, as shown in FIG. 3A, an adhesive 105 made of a silicone resin having a dimethylsiloxane structure is projected from the edge of the opening of the cover member 103, and the side surface of the cover member 103 is manufactured. At least a part is covered with the adhesive 105. Hereinafter, this specific process when manufacturing the liquid discharge head of the present embodiment will be described.

First, as shown in FIG. 3B, the adhesive 105 is applied to the first surface of the support substrate 102 at a position closer to the side surface of the cover member 103 than in the state of FIG. 2A. Next, as shown in FIG. 3C, the cover member 103 is placed on the layer of the adhesive 105 to bond the cover member 103 to the support substrate 102. At this time, since the coating position of the adhesive 105 on the support substrate 102 is close to the side surface of the cover member 103, the adhesive 105 rises from the edge of the cover member 103 along the side surface of the cover member 103. After that, the sealing resin 104 is applied to the gap between the recording element substrate 101 and the cover member 103. Since it is necessary for the sealing resin 104 to fill this gap, it is desirable that the viscosity in the liquid state is low. Specifically, the viscosity of the sealing resin 104 in the liquid state is preferably 10 Pa · s or less, more preferably 5 Pa · s or less, and even more preferably 1 Pa · s. Such a viscosity range of the sealing resin 104 is considerably lower than the viscosity of the adhesive 105 in the liquid state.

Since the side surface of the cover member 103 is covered with the adhesive 105 and the sealing resin 104 in the liquid state has poor wettability with respect to the adhesive 105, as shown in FIG. 2C in the present embodiment. No rising up to the edge of the opening of the cover member 103 of the sealing resin 104 does not occur. When the liquid discharge head was manufactured using the sealing resin 104 made of urethane resin having a viscosity of 4 Pa · s in the liquid state, the sealing resin 104 may touch the side surface of the cover member 103 itself. It did not exude to the surface of the plastic.

[Second Embodiment]
The second embodiment is an application example of the first embodiment in which the present invention is applied to a liquid discharge head having a larger cover member 103. In the first embodiment, the adhesive 105 is applied to the support substrate 102 so that the adhesive 105 for joining protrudes to the side surface of the opening of the cover member 103 when the cover member 103 is joined to the support substrate 102. ing. However, as the size of the cover member 103 increases, the dimensional tolerance also increases, so that it becomes difficult to control the coating position when the adhesive is applied so that the adhesive 105 protrudes from the side surface of the opening of the cover member 103. For example, a cover member having a length of 100 mm has a dimensional tolerance of 0.3 mm, but a cover member having a length of 1000 mm has a dimensional tolerance of 0.8 mm, which is larger than that of a cover member having a length of 100 mm. It will be more than doubled. Controlling the coating position of the adhesive 105 becomes difficult even if the thickness is 0.5 mm, because the parts are distorted or misaligned. Hereinafter, the liquid discharge head of the present embodiment will be described assuming that the length of the cover member 103 is, for example, 1000 mm.

Here, the influence of the distortion and the displacement of the cover member 103 will be described, but first, the influence of the difference in the coating amount of the adhesive 105 will be described. FIG. 4 is a cross-sectional view showing a difference in protrusion of the adhesive 105 on the side surface of the cover member 103 due to a difference in the amount of the adhesive 105 applied to the support substrate 102. FIG. 4A shows a case where the amount of the adhesive 105 applied is small, and almost the entire side surface of the cover member 103 is not covered with the adhesive. In this case, when the sealing resin 104 is applied to the gap between the recording element substrate 101 and the cover member 103, the sealing resin 104 comes into contact with the side surface of the cover member 103 itself. When the sealing resin 104 comes into contact with the side surface of the cover member 103 itself, the sealing resin 104 may seep out to one surface of the cover member 103. On the other hand, FIG. 4B shows a case where the amount of the adhesive 105 applied is too large. If the amount of the adhesive 105 applied is too large, the amount of the adhesive 105 protruding to the side surface of the cover member 103 is too large, and the adhesive 105 runs on one surface of the cover member 103. Similar to the sealing resin 104, the adhesive 105 that rides on one surface of the cover member 103 peels off when the one surface of the cover member 103 is wiped with a rubber wiper, causing clogging of the discharge port and the like. It causes. Therefore, the amount of the adhesive 105 applied needs to be controlled so that the adhesive 105 covers the main portion of the side surface of the cover member 103 but does not ride on one surface of the cover member 103.

FIG. 4 illustrates the difference in the form of the adhesive rising due to the difference in the amount of the adhesive 105 applied, but even if the amount of the adhesive 105 applied is the same, the edge of the opening of the cover member 103 The relationship between the adhesive 105 and the coating position of the adhesive 105 causes the same problem as that shown in FIG. That is, if the distance between the coating position and the edge of the opening of the cover member 103 is too large, a sufficient covering area of the adhesive 105 on the side surface of the cover member 103 is secured as shown in FIG. 4A. become unable. When the coating position and the edge of the opening of the cover member 103 are too close to each other, the adhesive rides on one surface of the cover member 103 as shown in FIG. 4 (b).

In the present embodiment, the side surface of the cover member 103 is sufficiently covered with the adhesive 105, and the cover member 103 is joined to the support substrate 102 so as to prevent the adhesive 105 from riding on one surface of the cover member 103. The crimp plate 106 is used at the time. FIG. 5 is a cross-sectional view showing a manufacturing process of the liquid discharge head according to the second embodiment. First, an amount of the adhesive 105 that would normally allow the adhesive 105 to ride onto the first surface of the cover member 103 is applied to the first surface of the support substrate 102. As the adhesive 105, the same adhesive as that used in the first embodiment is used. Then, when the cover member 103 is pressed against the adhesive 105 for joining with the support substrate 102, the crimp plate 106 is pressed against one surface of the cover member 103 as shown in FIG. 5 (a). , The cover member 103 is pressed via the crimp plate 106. The crimp plate 106 has a shape that protrudes from the edge of the opening of the cover member 103 toward the opening. That is, the crimp plate 106 includes a portion that projects from the position of the side surface of the cover member 103. As a result, even if the layer of the adhesive 105 rises due to being pressed, it is blocked by the crimping plate 106, and the adhesive 105 is prevented from wrapping around one surface of the cover member 103. The pressure-bonding plate 106 preferably presses the entire surface of one surface of the cover member 103, and is therefore preferably made of a material that is elastically deformed. As the material constituting the crimp plate 106, a general rubber material is sufficient.

In this embodiment, as shown in FIG. 5 (a). The adhesive 105 comes into contact with the crimping plate 106 in the process of pressing, but the contacted adhesive 105 may adhere to the surface of the crimping plate 106. In order to prevent this adhesion, a disposable PTFE (polytetrafluoroethylene) film or the like may be sandwiched between the pressure-bonding plate 106 and the cover member 103 as an adhesion-preventing film. By sandwiching the PTFE film, it is possible to obtain a desired coating state of the adhesive 105 on the side surface of the cover member 103 while preventing the adhesive 105 from adhering to the pressure-bonding plate 106. When the adhesive 105 is cured, the pressing of the cover member 103 by the crimping plate 106 is stopped.

After joining the cover member 103 to the support substrate 102 via the adhesive 105 as described above, as shown in FIG. 5B, the recording element substrate 101 and the cover are as in the case of the first embodiment. The sealing resin 104 is applied to the gap between the member 103 and cured. As a result, since the side surface of the cover member 103 is covered with the adhesive 105, it is possible to obtain a liquid discharge head in which the sealing resin does not exude to one surface of the cover member 103.

[Third Embodiment]
In the first and second embodiments, the adhesive 105 is raised on the side surface of the cover member 103 facing the gap between the recording element substrate 101 and the cover member 103, so that the sealing resin 104 is formed on the side surface of the cover member 103. Was prevented from contacting. The solid material that covers the side surface of the cover member 103 to prevent contact with the sealing resin 104 is not limited to the adhesive 105 provided for joining the cover member 103 to the support substrate 102. The side surface of the cover member 103 may be covered with a solid substance that is different from the sealing resin 104 and is not the adhesive 105 used for joining the cover member 103. In the third embodiment, the side surface of the cover member 103 is covered with a coating resin material that is neither the sealing resin 104 nor the adhesive 105, so that the sealing resin 104 rises and the cover member 103 An example of preventing exudation to one surface will be described. FIG. 6 is a diagram showing the liquid discharge head of the third embodiment, and FIG. 6A shows a cross-sectional configuration of a main part of the liquid discharge head after the cover member 103 is joined to the support substrate 102. There is. In the figure, reference numeral X indicates one surface of the cover member 103, and reference numeral Y indicates the side surface of the cover member 103 facing the gap between the recording element substrate 101 and the cover member 103.

As shown in the figure, in the liquid discharge head of the third embodiment, the resin material 107 for coating is applied to one surface X and the side surface Y of the cover member 103. The resin material 107 is different from the sealing resin 104 and the adhesive 105, and as in the case of the first embodiment, the wettability of the sealing resin 104 in a liquid state with respect to the resin material 107 is not good. It is made of such materials. In the present embodiment, urethane resin is used as the sealing resin 104, but as a material showing low wettability of urethane resin, there is a resin having water repellency, and the resin having water repellency can be used for the resin material 107. .. In particular, as the water-repellent resin, an alkoxysilane compound having a dimethylsiloxane structure, a fluorine-based compound having a perfluoro group, and the like are preferably used as the resin material 107. Assuming that the wettability is evaluated by the contact angle of the sealing resin 104 in the liquid state, the sealing is performed so that the contact angle with respect to the resin material 107 is 70 ° or more, preferably 80 ° or more, and more preferably 90 ° or more. It is preferable to select a combination of the resin 104 and the resin material 107. As a resin material 107, it is natural to use a material having high adhesion to the cover member 103. In the present embodiment, a resin composition containing an alkoxysilane compound having a dimethylsiloxane structure is used as the coating resin material 107, and the resin material 107 is applied to the cover member 103 so that the film thickness is 0.1 μm or less. .. If the resin material 107 is applied even thinner, the influence on the discharge port provided on the recording element substrate 101 can be reduced even when the resin material 107 is peeled off after the liquid discharge head is completed. The mainstream is to set the diameter of the discharge port provided on the recording element substrate 101 to 10 to 20 μm, and there is a particular problem even if a resin layer having a thickness of 0.1 μm is mixed with the discharge port of such a size. It does not become. In the present embodiment, it is premised that the resin material 107 made of a material having high adhesion is used, and even if the resin material 107 is peeled off, the influence on the discharge port is minimized. As a guide, if the size of the peeled piece is about 1/100 of the diameter of the discharge port, no problem will occur. Examples of the coating method of the resin material 107 for coating include a method of immersing the cover member 103 in a liquid obtained by diluting the resin material 107 with a solvent, a method of drawing directly on the cover member 103, and a method of spray coating.

When coating is performed by immersing the cover member 103 in the solution of the resin material 107, the entire cover member 103 after coating is water repellent. As a result, it becomes difficult to join the cover member 103 to the support substrate 102 with the adhesive 105 due to water repellency. Therefore, in the present embodiment, the resin material 107 applied to the cover member 103 is left only in a desired region, and the resin material 107 applied to other parts is removed. The desired region referred to here is a region where the sealing resin 104 to be applied in a later process may come into contact with the cover member 103, specifically, the side surface Y of the cover member 103. Examples of the method for removing the resin material 107 applied to the portion other than the side surface Y include a method by plasma irradiation using normal pressure plasma and the like, a method by UV (ultraviolet) irradiation, and the like. In this embodiment, the resin material 107 is removed using atmospheric pressure plasma. Since the method using normal pressure plasma irradiates plasma from the plasma ejection port with high straightness, it has a feature that only the irradiated portion is subjected to plasma treatment. The area other than the irradiated area is not plasma-treated. Hereinafter, processing by atmospheric pressure plasma will be described.

After the plate-shaped cover member 103 is immersed in the solution of the resin material 107 to form a layer of the resin material 107 over the entire cover member 103, it is always on the other surface of the cover member 103 as shown in FIG. 6 (b). Irradiation with pressure plasma removes the resin material 107 on the other surface. In addition, the other surface of the cover member 103 is in a state where the adhesiveness is improved by the plasma treatment. Then, as in the first embodiment, the cover member 103 is joined to the support substrate 102 with the adhesive 105, and then the sealing resin 104 is applied to obtain a cross-sectional configuration as shown in FIG. 6A. The liquid discharge head to have is formed. When the sealing resin 104 is applied to the gap between the recording element substrate 101 and the cover member 103, the sealing resin 104 comes into some contact with the side surface Y of the cover member 103 due to gravity. However, since the layer of the resin material 107 for coating is formed on the side surface Y of the cover member 103, one surface X of the cover member 103 is formed through a fine groove formed in the cover member 103 which is a resin molded product. The exudation of the sealing resin 104 is suppressed.

An example of manufacturing a liquid discharge head based on the present embodiment will be described. By immersing the cover member 103 in a liquid in which an alkoxysilane compound having a dimethylsiloxane structure is dissolved in a solvent, the resin material 107 is applied to the entire cover member 103, and then the treatment with atmospheric pressure plasma is performed as described above. went. As a result, it was possible to create a liquid discharge head in which the sealing resin 104 does not exude on one surface X of the cover member 103.

[Fourth Embodiment]
In the fourth embodiment, as an application example of the third embodiment, a liquid discharge head in which a step is formed on the side surface of the cover member 103 will be described. FIG. 7 is a diagram showing a liquid discharge head according to the fourth embodiment. As shown in FIG. 7A, a step is formed on the side surface of the plate-shaped cover member 103 on the right side of the drawing. In the figure, reference numeral D indicates the other surface of the cover member 103, and reference numeral B indicates a surface that appears as parallel to the other surface of the cover member 103 due to the formation of the step. Reference numeral A indicates a region between the step and one surface of the cover member 103 on the side surface of the cover member 103, and similarly, reference numeral C indicates a region between the step and the other surface of the cover member 103. ing. Due to the formation of the step, the other surface of the cover member 103 is narrower than the one surface. By immersing the cover member 103 having the stepped side surface in the liquid in which the resin material 107 for coating is dissolved in a solvent as in the third embodiment, the entire cover member 103 is covered with resin. Material 107 is applied. As the resin material 107, for example, an alkoxysilane compound having a dimethylsiloxane structure is used. FIG. 7A shows a state in which the resin material 107 is applied to the entire cover member 103.

After applying the resin material 107, as shown in FIG. 7B, the other surface D of the cover member 103 is irradiated with atmospheric pressure plasma. As a result, the resin material 107 is removed from the other surface D of the cover member 103 and the small surface B of the stepped portion. The surface B at the step becomes a surface state having higher adhesiveness by undergoing plasma treatment. Next, as shown in FIG. 7C, the adhesive 105 is applied to the first surface of the support substrate 102 as in the first embodiment, and the cover member 103 is attached to the support substrate 102 via the adhesive 105. Join. Further, by applying the sealing resin 104 to the gap between the recording element substrate 101 and the cover member 103, a liquid discharge head having the cross-sectional structure shown in FIG. 7D can be obtained. As the sealing resin 104 and the adhesive 105 in the present embodiment, the same ones as those used in the first embodiment can be used, respectively.

The surface B whose adhesiveness has been enhanced by the treatment with normal pressure plasma faces the side of the support substrate 102 in the state shown in FIG. 7 (d). On the other hand, the regions A and C, which are the side surfaces of the cover member 103, are covered with the resin material 107, which has poor wettability of the sealing resin 104. In the figure, the sealing resin 104 comes into contact with the side surface of the cover member 103 only in the region A, but when the amount of the sealing resin 104 increases, the sealing resin 104 also comes into contact with the surface B. Come into contact. When the sealing resin 104 comes into contact with the surface B, the sealing resin 104 adheres to the surface B with a high adhesive force, but the sealing resin 104 has poor wettability with respect to the region C. , The sealing resin 104 does not crawl up the portion of the region C. Therefore, even in this liquid discharge head, the sealing resin 104 does not exude to one surface of the cover member 103.

Further, when the sealing resin 104 is adhered to the surface B which is a part of the side surface portion of the cover member 103 with a high adhesive force, it is possible to prevent the sealing resin 104 from peeling off from the side surface of the cover member 103. can do. When the sealing resin 104 is peeled from the side surface of the cover member 103, a liquid such as a recording liquid may be accumulated in the gap after the peeling, and the collected liquid may fall on a recording medium or the like. According to the embodiment, the risk of the liquid falling can be eliminated. Therefore, in order to reduce the risk of the liquid falling, the sealing resin 104 may be brought into contact with the surface B when the sealing resin 104 in the liquid state is applied to the gap.

101 Recording element substrate 102 Support substrate 103 Cover member 104 Sealing resin 105 Adhesive

Claims (16)

Support board and
A recording element substrate bonded to the first surface of the support substrate having at least a discharge port for discharging a liquid, and a recording element substrate.
A plate-shaped cover member arranged so as to surround the recording element substrate on the first surface and joined to the first surface.
A sealing resin provided so as to fill the gap between the recording element substrate and the cover member on the first surface, and
A liquid discharge head, wherein at least a part of a side surface of the cover member facing the gap is covered with a solid substance different from the sealing resin. The liquid discharge head according to claim 1, wherein the cover member is made of a resin molded product. The liquid discharge head according to claim 1 or 2, wherein the cover member is bonded to the first surface via an adhesive, and the solid substance is the adhesive. The liquid discharge head according to claim 1 or 2, wherein the solid material is made of a resin material different from the sealing resin and is not provided on the surface of the cover member facing the first surface. According to claim 4, a step is formed on the side surface of the cover member so as to have a surface facing the first surface, and the solid object is not provided on the surface facing the first surface at the step. The liquid discharge head described. The liquid discharge head according to claim 5, wherein the sealing resin is in contact with a surface facing the first surface at the step. A support substrate, a recording element substrate bonded to a first surface of the support substrate having at least a discharge port for discharging a liquid, and a recording element substrate arranged so as to surround the recording element substrate on the first surface. In the method for manufacturing a liquid discharge head having a plate-shaped cover member joined to the surface of 1.
A step of covering at least a part of the side surface of the cover member facing the recording element substrate with a solid material on the first surface.
A step of applying a sealing resin different from the solid material to the gap formed between the recording element substrate and the cover member covered with the solid material.
A method for manufacturing a liquid discharge head. The cover member is made of a resin molded product, and the sealing resin has a contact angle of 70 ° or more with respect to the solid substance in a liquid state. The method for manufacturing a liquid discharge head according to claim 7. The coating step includes a step of applying an adhesive to the first surface and a step of pressing the cover member toward the adhesive.
By the pressing step, the cover member is joined to the first surface via the adhesive, and the adhesive is raised on the side surface, and the adhesive is raised as a solid substance. The method for manufacturing a liquid discharge head according to claim 7 or 8, wherein the side surface is covered. The liquid discharge head according to claim 9, wherein in the pressing step, a crimping plate including a portion protruding from the position of the side surface is pressed against a surface of the cover member opposite to the first surface. Production method. The method for manufacturing a liquid discharge head according to claim 10, wherein in the pressing step, an adhesion prevention film for preventing the adhesive from adhering to the crimp plate is sandwiched between the crimp plate and the cover member. The liquid discharge head according to claim 7 or 8, wherein the solid material is made of a resin material different from the sealing resin and is not provided on the surface of the cover member facing the first surface. Production method. The step of providing the solid material on the entire cover member and
The cover member includes a step of removing the solid substance from the surface of the cover member facing the first surface.
The method for manufacturing a liquid discharge head according to claim 12, wherein after the removing step, the cover member is joined to the first surface and the coating step is carried out. The method according to claim 13, wherein the removing step is a step of removing the solid substance by plasma treatment. A step is formed on the side surface of the cover member so as to have a surface facing the first surface, and the solid matter is removed from the surface facing the first surface at the step by the plasma treatment. The method for manufacturing a liquid discharge head according to claim 14. The method for manufacturing a liquid discharge head according to claim 15, wherein in the coating step, the sealing resin is brought into contact with a surface facing the first surface.

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