CN108724941B

CN108724941B - Liquid ejection head

Info

Publication number: CN108724941B
Application number: CN201810316176.6A
Authority: CN
Inventors: 河村省吾; 广泽稔明; 稻田源次; 安间弘雅; 尾崎靖彦; 岩野卓也; 石松伸
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 2017-04-21
Filing date: 2018-04-10
Publication date: 2021-04-16
Anticipated expiration: 2038-04-10
Also published as: JP2018176698A; US20180304620A1; JP6891033B2; US10507644B2; CN108724941A

Abstract

A liquid ejection head, comprising: a printing element substrate including an ejection port for ejecting liquid; a wiring member including a wiring electrically connected to the printing element substrate; a connection portion that electrically connects the printing element substrate to the wiring member; a support member that supports the wiring member; a sealing material that seals the connection portion; and a cover member provided to the support member. In the liquid ejection head, the wiring member is a belt-like member, and a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered with the sealing material and the cover member.

Description

Liquid ejection head

Technical Field

The present disclosure relates to a liquid ejection head, and a representative example of the liquid ejection head is an inkjet system suitable for a printing apparatus that performs a printing operation by ejecting recording liquid such as ink.

Background

Heretofore, as a well-known liquid ejection head, there is a liquid ejection head of which a representative example is an ink jet system, in which a flexible wiring substrate such as a TAB film or the like is electrically connected to a printing element substrate. Covering the electrical connection portion establishing electrical connection by inner wire bonding, or the like with a sealing material formed of an epoxy resin having ink resistance as a main component makes it possible to prevent troubles such as adhesion of ink to the electrical connection portion or the like. For example, in a TAB film, a copper wiring body is formed by patterning on a base film formed of a polyimide film, and further, the wiring is protected by a film such as an aramid film or the like. In some cases, surface modification is performed on the polyimide film and the polyaramide film by plasma treatment to improve the adhesive strength between the films and the sealing material.

As described in japanese patent laid-open No. 2001-322274, there is a technique of covering an electrical connection portion by making the size of a nozzle plate larger than the size of an actuator member provided with an electrode to prevent ink from adhering to the electrical connection portion.

However, in the technique proposed in japanese patent laid-open No. 2001-322274, a sealing material such as an epoxy resin or the like is cured between the nozzle plate and the actuator substrate including the electrical connection portion; therefore, warpage (warp) is formed on the nozzle plate due to the difference in the linear expansion coefficient, and the printing quality may be deteriorated. Therefore, the resin that can be used is limited to a resin having a relatively low viscosity such as a two-liquid mixing type adhesive having a low curing temperature or an ultraviolet curing adhesive.

Disclosure of Invention

The present disclosure provides a liquid ejection head using a flexible wiring member and a thermosetting sealing material, in which intrusion of ink into an electrical connection portion is suppressed, and which has high electrical reliability.

One aspect of the present disclosure is a liquid ejection head, including: a printing element substrate including an ejection port for ejecting liquid; a wiring member including a wiring electrically connected to the printing element substrate; a connection portion that electrically connects the printing element substrate to the wiring member; a support member that supports the wiring member; a sealing material that seals the connection portion; and a cover member provided to the support member. In the liquid ejection head, the wiring member is a belt-like member, and a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered with the sealing material and the cover member.

Further, an aspect of the present disclosure is a liquid ejection head including: a printing element substrate including an ejection port for ejecting liquid; a wiring member including a wiring electrically connected to the printing element substrate; a connection portion that electrically connects the printing element substrate and the wiring member; and a support member that supports the wiring member, wherein a part of a surface of the wiring member provided to the support member that supports the wiring member is provided to the support member without being exposed.

Other features of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the attached drawings.

Drawings

Fig. 1 is a perspective view illustrating a liquid ejection head of a first exemplary embodiment.

Fig. 2 is a perspective view showing a manufacturing process of the liquid ejection head of the first exemplary embodiment.

Fig. 3 is a plan view showing a manufacturing process of the liquid ejection head of the first exemplary embodiment.

Fig. 4 is a sectional view taken along line IV-IV in fig. 3.

Fig. 5 is an enlarged view of a portion V in fig. 4.

Fig. 6 is an enlarged sectional view of a portion taken along line VI-VI in fig. 1.

Fig. 7 is a plan view showing a liquid ejection head of the second exemplary embodiment.

Fig. 8 is an enlarged sectional view of a portion taken along line VIII-VIII in fig. 7.

Fig. 9 is a plan view showing a liquid ejection head of the third exemplary embodiment.

Fig. 10 is a sectional view taken along line X-X in fig. 9.

Fig. 11 is an enlarged view of a portion XI in fig. 10.

Fig. 12 is a plan view showing a liquid ejection head of the fourth exemplary embodiment.

Fig. 13 is a sectional view taken along line XIII-XIII in fig. 12.

Fig. 14 is an enlarged view of a portion XIV in fig. 13.

Fig. 15 is a perspective view illustrating a liquid ejection head of the fifth exemplary embodiment.

Fig. 16 is a perspective view illustrating an exploded state of a liquid ejection head of the fifth exemplary embodiment.

Fig. 17 is a perspective view illustrating a liquid ejection head of a sixth exemplary embodiment.

Fig. 18 is an enlarged sectional view of a portion taken along line XVIII-XVIII in fig. 17.

Fig. 19 is a plan view showing a liquid ejection head of the seventh exemplary embodiment.

Fig. 20 is a perspective view showing an exploded state of a liquid ejection head of the seventh exemplary embodiment.

Fig. 21 is a sectional view taken along line XXI-XXI in fig. 19.

Fig. 22 is an enlarged view of a portion XXII in fig. 21.

Detailed Description

First embodiment

Examples of the embodiments will be explained hereinafter with reference to the drawings. Note that the following description does not limit the scope of the present disclosure. In the exemplary embodiment, although a thermal method of ejecting liquid by generating bubbles in the liquid using a heat generating element is taken as an example, the present disclosure can be applied to a liquid ejection head that employs a piezoelectric method and other various liquid ejection methods. Note that the present disclosure can be applied to, in addition to a typical printing apparatus, such as a copying machine, a facsimile machine including a communication system, a word processor including a printing unit, and the like, and can also be applied to an industrial printing apparatus in which apparatuses performing various processes are combined.

The configuration of the liquid ejection head according to the first exemplary embodiment will be explained. Fig. 1 is a perspective view of a liquid ejection head according to the present exemplary embodiment. Fig. 2 is a perspective view illustrating a manufacturing process of the liquid ejection head, fig. 3 is a plan view of the liquid ejection head during the manufacturing process, fig. 4 is a sectional view taken along line IV-IV in fig. 3, and fig. 5 is an enlarged view of a portion V in fig. 4. Further, fig. 6 is an enlarged sectional view of a portion taken along line VI-VI in fig. 1.

As shown in fig. 1, the liquid ejection head 3 is a liquid ejection head in the center of which a printing element substrate 10 that ejects liquid such as ink is arranged. As shown in fig. 2, the printing element substrate 10 is arranged on a support member 30 and electrically connected to a belt-shaped flexible wiring substrate 40, the belt-shaped flexible wiring substrate 40 being a wiring member that transmits a driving signal or the like from the printing apparatus main body.

In the printing element substrate 10, a circuit and a heating resistor are formed on a silicon substrate having a thickness of about 0.6mm to 0.8mm, and an ejection orifice forming member 12 provided with an ejection orifice 13 is laminated on the silicon substrate. A terminal 16 electrically connected to the flexible wiring substrate 40 is provided on the first end side of the silicon substrate surface. The support member 30 includes a liquid communication port 31 that supplies ink to the printing element substrate 10, and the support member 30 is adhered and fixed to the printing element substrate 10 with the first adhesive 60 in such a manner that the liquid communication port 31 communicates with the flow path 11 provided on the back surface of the printing element substrate 10.

In the flexible wiring substrate 40, a copper wiring body having a thickness of 0.01mm to 0.02mm is formed by patterning on a polyimide base film 42 having a thickness of 0.025mm to 0.050 mm. Further, a terminal 41 that establishes electrical connection with the printing element substrate 10 is formed at an end portion of the flexible wiring substrate 40. In addition to the portions to become the terminals 41, the flexible wiring substrate 40 is covered with a polyimide or polyaramid film 43 having a thickness of 0.004mm to 0.050mm to prevent corrosion. The terminals 41 are deposited with gold plating to prevent corrosion. In the flexible wiring substrate 40, the surface of the base film 42 is adhered and fixed to the upper surface of the supporting member 30 with the second adhesive 61. The flexible wiring substrate 40 is provided from the upper surface of the support member 30 to the side surface of the support member 30 adjacent to the upper surface.

The terminals 16 on the printing element substrate 10 and the terminals 41 provided on the longitudinal first end side of the flexible wiring substrate 40 are electrically connected to each other by wire bonding. Further, as shown in fig. 3, 4, and 5, the electrical connection portion is covered and sealed with a first sealing material 110.

The first sealing material 110 seals a portion from the ejection orifice forming member 12 provided on the main surface of the printing element substrate 10 to the coating film 43 of the flexible wiring substrate 40 in such a manner as to cover the gold wiring 50 of the electrical connection portion. A thermosetting epoxy resin having high elasticity (1GPa or more) to protect the electrical connection portion from external force, and high viscosity so that the thermosetting epoxy resin does not flow out to the ejection orifice 13 side and so that the coating shape is stable is used for the first sealing material 110.

A plate-shaped cover member 130 surrounding an edge portion of the support member 30 on the ejection orifice face side and provided with an opening 131 is adhered and fixed to the support member 30 in a form of forming a dam (dam) with the third adhesive 62. The surface height of the cover member 130 is substantially the same as the surface height of the printing element substrate 10. As shown in fig. 1 and 6, the second sealing material 111 is filled between the opening 131 of the cover member 130 and the printing element substrate 10, so that the flexible wiring substrate 40 is buried. The first sealing material 110 is provided in a form protruding from the surface of the second sealing material 111.

The cap member 130 functions to cap the contact surface of the cap member of the liquid ejection head 3 during the recording standby. Therefore, it is desirable that, when capping is performed, a sealing material, a filling material, or the like is applied in the opening 131 and fills the gap and the unevenness of the ejection orifice surface to form a closed space.

A two-liquid mixing type rubber-modified epoxy resin having low elasticity (0.01GPa or less) and capable of curing at normal temperature is used as the second sealing material 111 and filled in a shallow region of the upper opening; therefore, external pressure is not easily applied to the printing element substrate 10 and the components around the printing element substrate 10.

Therefore, substantially the entire flexible wiring substrate 40 (including a portion electrically connected to the printing element substrate 10) on the ejection orifice side of the liquid ejection head 3 is covered with the cover member 130, the first sealing material 110, and the second sealing material 111. In other words, the portion of the flexible wiring substrate 40 provided on the upper surface of the support member 30 is covered with the cover member 130 and the sealing material without being exposed to the outside. Although two kinds of sealing materials are used in the present exemplary embodiment, the flexible wiring substrate 40 may be covered with one kind of sealing material without being limited to the above case. In the configuration of the present exemplary embodiment, a liquid such as ink or the like does not easily enter the electrical connection portion, and electrical reliability can be improved.

Second exemplary embodiment

Fig. 7 is a plan view of the liquid ejection head for explaining the liquid ejection head of the second exemplary embodiment, and fig. 7 is a view seen through the second sealing material 111 for convenience of explanation. Fig. 8 is an enlarged sectional view of a portion taken along line VIII-VIII in fig. 7 and shows the second sealing material 111.

As shown in fig. 7, in the second exemplary embodiment, the support member 30 is provided with a groove 32 formed below the middle portion of the flexible wiring substrate 40, the groove being located on the ejection orifice surface side and being wider than the width of the flexible wiring substrate 40. Due to the groove 32, the second sealing material 111 filled in the dam seals both surfaces of the front surface side and the back surface side of a part of the flexible wiring substrate 40.

Due to the difference in the linear expansion coefficient, the bonding strength of a portion where a plurality of materials are bonded to each other in a complicated manner may be reduced. For example, the flexible wiring substrate 40 interposed between the cover member 130 and the support member 30 has a portion bonded by the second adhesive 61 and the third adhesive 62. However, as in the present exemplary embodiment, the decrease in the bonding strength is prevented by creating a portion bonded only by the second sealing material 111 in the region of the flexible wiring substrate 40 including the electrical connection portion. In the above case, even when ink adheres to the side surface of the liquid ejection head, it is possible to make it difficult for ink to intrude into the electrical connection portion.

Third exemplary embodiment

Fig. 9 is a plan view of the liquid ejection head for explaining the liquid ejection head of the third exemplary embodiment, and fig. 9 is a view seen through the second sealing material 111 for convenience of explanation. Fig. 10 is a sectional view taken along line X-X in fig. 9 and is a diagram showing the second sealing material 111. Further, fig. 11 is an enlarged view of a portion XI in fig. 10.

As shown in fig. 9, in the third exemplary embodiment, the printing element substrate 10 is adhered and fixed to a support plate 70 provided to the support member 30. The support plate 70 is not only a support member that supports the printing element substrate 10, but also a flow path member that fluidly communicates the printing element substrate 10 and the support member 30 with each other. Desirably, the material of the support plate 70 is, for example, alumina or a resin material.

The support member 30 includes an edge portion 33 surrounding the support plate 70. The height of the edge portion 33 is configured to be substantially the same as the height of the support plate 70 adhered and fixed to the support member 30, and a groove is formed between the edge portion 33 and the support plate 70. The flexible wiring substrate 40 is fixed with the second adhesive 61 so that the portion where the flexible wiring substrate 40 is electrically connected to the printing element substrate 10 is located at the support plate 70, and further, the flexible wiring substrate 40 is also fixed to the edge portion 33 with the second adhesive 61 so that the flexible wiring substrate 40 extends to the side surface of the liquid ejection head. The edge portion 33 and the support member 30 may be integrally formed.

The groove formed between the edge portion 33 and the support plate 70 exerts the same effect as the groove of the second exemplary embodiment. In other words, both the front surface and the back surface of a part of the flexible wiring substrate 40 are sealed over the entire circumference with the second sealing material 111; therefore, the ink can be made less likely to intrude into the electrical connection portion.

Fourth exemplary embodiment

Fig. 12 is a plan view of the liquid ejection head for explaining the liquid ejection head of the fourth exemplary embodiment, and for convenience of explanation, fig. 12 is a view seen through the second sealing material 111. Fig. 13 is a sectional view taken along line XIII-XIII in fig. 12, and is a diagram showing the second sealing material 111. Further, fig. 14 is an enlarged view of a portion XIV in fig. 13.

As shown in fig. 12, in the fourth exemplary embodiment, a dam is formed at an edge portion on the ejection orifice surface side of the liquid ejection head 3 with the third sealing material 112. A material having high viscosity that stabilizes the coating shape is used for the third sealing material 112 to form the same shape as that of the above-described lid member. Since this shape is formed by coating, an adhesive for the cover member is not required.

As shown in fig. 12 and 14, the second sealing material 111 is filled between the third sealing material 112 and the printing element substrate 10 so that the flexible wiring substrate 40 is buried. With the above configuration as well, the electrical reliability can be improved in the same manner as the above exemplary embodiment.

Fifth exemplary embodiment

Fig. 15 is a perspective view showing a liquid ejection head of the fifth exemplary embodiment, and fig. 16 is a perspective view of the liquid ejection head in an exploded state. The liquid ejection head of the fifth exemplary embodiment is a so-called page-wide type liquid ejection head provided with a length corresponding to the width of a printing medium. As shown in fig. 15, a plurality of

printing element substrates

10a, 10b, 10c, and 10d are arranged in the liquid ejection head 3 in a staggered manner. Further, as shown in fig. 16, the liquid ejection head includes a plurality of

flexible wiring substrates

40a, 40b, 40c, and 40 d. Further, the cover member 130 is provided with a single opening having a shape matching the shape of the printing element substrates arranged in a staggered manner. A plurality of printing element substrates are arranged in the opening. Contacts for electrically connecting each printing element substrate 10 to the corresponding flexible wiring substrate 40 are provided at the edge of the relevant printing element substrate 10 extending in the longitudinal direction. Further, a second sealing material 111 is filled between the cover member 130 and the

printing element substrates

10a, 10b, 10c, and 10d to bury the

flexible wiring substrates

40a, 40b, 40c, and 40 d.

Since the single opening 131 is formed for the plurality of printing element substrates, the amount of the second sealing material 111 applied to each printing element substrate becomes uniform, which does not vary at each position of the printing element substrate. As in the page-width type liquid ejection head of the present exemplary embodiment, in the configuration including the plurality of printing element substrates 10, the number of electrical connection portions is increased; therefore, the application of the present disclosure is particularly preferable.

Sixth exemplary embodiment

Fig. 17 is a perspective view showing a liquid ejection head of the sixth exemplary embodiment, and fig. 18 is an enlarged sectional view of a portion taken along line XVIII-XVIII in fig. 17. The sixth exemplary embodiment relates to a page-wide type liquid ejection head, as in the fifth exemplary embodiment, and as shown in fig. 17, a plurality of

printing element substrates

10a, 10b, 10c, and 10d are arranged in a straight line.

The plurality of printing element substrates are arranged in the single opening 131 of the cover member 130 and in the frame formed by the edge portion 33 of the support member 30 such that the ejection orifices are adjacent to each other in the array direction of the ejection orifices. Further, a second sealing material is filled between the cover member 130 and the plurality of

printing element substrates

10a, 10b, 10c, and 10d, so that the flexible wiring substrate located on the ejection orifice surface side is buried.

Since a sealing material having a low viscosity is used as the second sealing material 111 filled around the printing element substrates as shown in the cross-sectional view of fig. 18, the second sealing material 111 is also filled in the gap between the

printing element substrates

10a and 10b arranged adjacent to each other. The present exemplary embodiment can reduce the size of the liquid ejection head linearly by configuring the plurality of printing element substrates 10. Therefore, the interval between the electrical connection portions is smaller than that of the fifth exemplary embodiment; however, by providing the configuration of the present disclosure, the liquid ejection head can improve its electrical reliability. Further, the page-width type liquid ejection head having the configurations shown in the fifth exemplary embodiment and the sixth exemplary embodiment can be applied to a liquid ejection head in which liquid circulates. Specifically, the above is a liquid ejection head configured in the following manner: the liquid inside the pressure chamber, in which an element that generates energy for ejecting the liquid is disposed, circulates between the pressure chamber and an external member. Since the flow rate of the liquid is large and the operation time of the liquid ejection head is long in such a circulating page-width type liquid ejection head, application of the configuration of the present disclosure is particularly preferable.

Seventh exemplary embodiment

Fig. 19 is a plan view of the liquid ejection head for explaining the liquid ejection head of the seventh exemplary embodiment, and fig. 20 is a perspective view of the liquid ejection head in an exploded state. Further, fig. 21 is a sectional view taken along line XXI-XXI in fig. 19, and fig. 22 is an enlarged view of a portion XXII in fig. 21.

The seventh exemplary embodiment has such a configuration: in this configuration, the printing element substrate 10 including the electrical connection portion on the back surface is used. As shown in fig. 20, the printing element substrate 10 is adhered and fixed to the support plate 70, wherein the back surface of the printing element substrate 10 is electrically connected to the flexible wiring substrate 40 and sealed with the first sealing material 110. Further, the flexible wiring substrate 40 is adhered and fixed to the edge portion 33 of the support member 30. Further, the cover member 130 is bonded and fixed to the edge portion 33. Further, as shown in fig. 22, the second sealing material 111 is filled between the cover member 130 and the printing element substrate 10 so that the flexible wiring substrate 40 located on the ejection port surface side and the electrical connection portion of the flexible wiring substrate 40 are buried. Also, with the present exemplary embodiment, electrical reliability can be improved in the same manner as the above-described exemplary embodiment.

With the above configuration, a configuration in which ink is less likely to intrude can be provided in a liquid ejection head using a flexible wiring substrate and a thermosetting sealing material; therefore, electrical reliability can be improved.

While the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the disclosure is not limited to the disclosed exemplary embodiments. The scope of the claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A liquid ejection head, comprising:

a printing element substrate including an ejection port for ejecting liquid;

a wiring member including a wiring electrically connected to the printing element substrate;

a connection portion that electrically connects the printing element substrate to the wiring member;

a support member that supports the wiring member;

a sealing material that seals the connection portion; and

a cover member having an opening through which the printing element substrate is exposed and provided on a side of the support member where an ejection port surface is located,

characterized in that the wiring member is a tape-like member, and

a part of the wiring member is provided on a support surface of the support member that supports the wiring member, the part of the wiring member including a first part interposed between the cover member and the support member and a second part provided in the opening, wherein the second part is covered with the sealing material, and the part of the wiring member is not exposed to the outside.

2. A liquid ejection head according to claim 1,

the sealing material is provided in a region between the printing element substrate and the cap member when viewed in a direction in which liquid is ejected from the ejection orifice.

3. A liquid ejection head according to claim 2,

the sealing material includes a first sealing material sealing the connection portion and a second sealing material provided in a region between the first sealing material and the cover member.

4. A liquid ejection head according to claim 3,

the portion of the wiring member is covered with the first sealing material, the second sealing material, and the cover member.

5. A liquid ejection head according to claim 3 or 4,

the viscosity of the first sealing material is higher than the viscosity of the second sealing material.

6. A liquid ejection head according to any one of claims 1 to 4,

a groove is provided in the surface of the support member, the sealing material is provided in the groove, and a portion around the wiring member is covered with the sealing material.

7. A liquid ejection head according to claim 6,

a terminal is provided on a first side of the wiring member in a longitudinal direction, and the terminal is electrically connected to a terminal provided on the printing element substrate.

8. A liquid ejection head according to any one of claims 1 to 4,

the cover member is a plate-like member provided with an opening, and the printing element substrate is arranged within the opening.

9. A liquid ejection head according to any one of claims 1 to 4,

the entire surface of the portion of the wiring member is covered with the sealing material and the cover member.

10. A liquid ejection head according to any one of claims 1 to 4,

the wiring member is provided from the surface of the support member to a side surface adjacent to the surface of the support member.

11. A liquid ejection head according to claim 3 or 4,

the first sealing material protrudes from a surface of the second sealing material.

12. A liquid ejection head according to any one of claims 1 to 4,

the support member is provided with a plurality of the printing element substrates, and each of the printing element substrates is provided with the wiring member.

13. A liquid ejection head according to claim 12,

the plurality of printing element substrates are arranged along a straight line.

14. A liquid ejection head according to claim 12,

the printing element substrate is disposed within the opening of the cover member.

15. A liquid ejection head according to claim 7,

the terminals of the printing element substrate are provided at an edge portion of the printing element substrate extending in a length direction of the printing element substrate.

16. A liquid ejection head according to any one of claims 1 to 4,

the liquid ejection head is a page-wide type liquid ejection head having a length corresponding to a width of a printing medium.

17. A liquid ejection head according to any one of claims 1 to 4, further comprising:

an element that generates energy for ejecting liquid; and

a pressure chamber in which the element is arranged,

wherein liquid within the pressure chamber circulates between within the pressure chamber and outside the pressure chamber.