JP2013202857A - Liquid jetting head and liquid jetting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid jetting head in which joining of an actuator device and a wiring board is secured, and also which is prevented from being deformed, and to provide a liquid jetting device.SOLUTION: A liquid jetting head includes: a channel forming substrate 10 having a pressure chamber 12 communicating with a nozzle 21, and provided with a piezoelectric element 300 for generating pressure in the pressure chamber 12; and a wiring board 200 driving the piezoelectric element 300, wherein a mount section 90a is connected to the wiring board 200 with an ACP 220 in an insertion hole 120. Inside the insertion hole 120, a first filler 211 is filled to cover the mount section 90a connected to the wiring board 200, and second filler 212 is filled on the upper side of the first filler 211. The first filler 211 is formed of a material having lower viscosity than the second filler 212, and the second filler 212 is formed of a material having ink resistance.

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus, and more particularly to an ink jet recording head and an ink jet recording apparatus that eject ink as a liquid.

  A liquid ejecting head that ejects a liquid is provided with a piezoelectric element (actuator device) on one side of a flow path forming substrate provided with a pressure chamber communicating with a nozzle, and the pressure in the pressure chamber is changed by the displacement of the piezoelectric element. Inkjet recording heads that eject ink droplets from nozzles are also known.

  As an ink jet recording head, a protective substrate having a through hole through which a piezoelectric element is exposed is attached to a flow path forming substrate, and a COF substrate (wiring substrate) for supplying a drive signal is inserted into the through hole. Some are connected to a piezoelectric element (see, for example, Patent Document 1). The COF substrate and the piezoelectric element are connected by an anisotropic conductive adhesive or the like in the through hole.

  When the ink flows into the through hole and the ink contacts the anisotropic conductive adhesive, the anisotropic conductive adhesive swells. For this reason, there is a possibility of causing electrical contact failure between the piezoelectric element and the COF substrate. Therefore, filling the through hole with a resin such as a potting agent prevents the ink from coming into contact with the anisotropic conductive adhesive that bonds the COF substrate and the piezoelectric element, resulting in poor electrical contact. To prevent that.

JP 2011-025493 A

  However, since the resin filled in the through holes is cured and contracted, stress is applied to the flow path forming substrate and the protective substrate due to the contraction of the adhesive. If stress is generated in each member constituting the ink jet recording head, the head may be deformed. The deformation of the head may cause problems such as a decrease in durability of the head itself and a decrease in ink ejection accuracy.

  Such a problem exists not only in an ink jet recording head but also in a liquid ejecting head that ejects liquid other than ink.

  In view of such circumstances, an object of the present invention is to provide a liquid ejecting head and a liquid ejecting apparatus that can ensure the bonding between an actuator device and a wiring board and can prevent deformation.

An aspect of the present invention that solves the above problems includes a flow path forming substrate that includes a pressure chamber that communicates with a nozzle that discharges liquid, and that includes an actuator device that generates pressure in the pressure chamber, and drives the actuator device. And a housing member that is joined to the actuator device side of the flow path forming substrate and has an insertion hole through which the wiring substrate is inserted, and the actuator device is attached to the wiring substrate within the insertion hole. A mounting portion to be connected is provided, and the inside of the insertion hole is filled with a first filler so as to cover the mounting portion connected to the wiring substrate, and a second filler is disposed above the first filler. Filled with a filler, the first filler is formed of a material having a lower viscosity than the second filler, and the second filler is formed of a material having liquid resistance. That a liquid-jet head.
In such an aspect, even if liquid enters the insertion hole, the second filler having liquid resistance covers the first filler, so that the first filler and the connection portion between the wiring board and the mounting portion are covered. It is possible to prevent the liquid from reaching. Thereby, the electrical connection defect of a mounting part and a wiring board can be prevented. Furthermore, by using the first filler having a low viscosity, it is possible to suppress shrinkage hardening due to the first filler and the second filler. Deformation of the recording head can be prevented.

  Here, it is preferable that the mounting portion is connected to the wiring board by an anisotropic conductive adhesive. According to this, it is possible to more reliably prevent poor electrical connection between the mounting portion of the actuator device and the wiring board.

  The housing member is provided with a manifold forming portion that opens to the opposite side of the flow path forming substrate and communicates with the pressure chamber, and a first member that is joined to the flow path forming substrate; and the manifold A second member that forms a manifold communicating with the pressure chamber by being joined to the first member so as to seal an opening of the forming portion; and a third member that is joined to the second member; The second filler is filled to the opposite side of the flow path forming substrate from the boundary between the second member and the third member, and the second member and the third member are the second filling. It is preferable to join with a material having a lower viscosity than the agent. According to this, even if a stress is generated in the third member due to the contraction of the second filler, the stress is relieved by the material provided between the second member and the third member. As described above, since the stress applied to each member can be further reduced, the deformation of the liquid ejecting head can be more reliably prevented.

  The housing member is provided with a manifold forming portion that opens to the opposite side of the flow path forming substrate and communicates with the pressure chamber, and a first member that is joined to the flow path forming substrate; and the manifold A second member that forms a manifold communicating with the pressure chamber by being joined to the first member so as to seal an opening of the forming portion; and a third member that is joined to the second member; The second member includes a flexible sealing film and a fixing plate to which the sealing film is bonded with an adhesive, and the second filler forms the flow path more than the second member. It is preferable that the substrate is filled. According to this, electrical connection failure between the mounting portion and the wiring board can be more reliably prevented.

According to another aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head according to the above aspect.
In such an aspect, there is provided a liquid ejecting apparatus capable of ensuring the bonding between the actuator device and the wiring board and preventing the deformation.

FIG. 3 is an exploded perspective view illustrating the recording head according to the first embodiment. FIG. 3 is a plan view of the recording head according to the first embodiment. It is sectional drawing to which the principal part of the AA 'line cross section of FIG. 2 was expanded. FIG. 6 is a cross-sectional view and a main-portion cross-sectional view of a recording head according to Embodiment 2. It is a perspective view which shows schematic structure of a liquid ejecting apparatus.

<Embodiment 1>
Hereinafter, the present invention will be described in detail based on embodiments. An ink jet recording head is an example of a liquid ejecting head, and is also simply referred to as a recording head.

1 is an exploded perspective view showing a recording head according to Embodiment 1 of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a main portion of a cross section taken along line AA ′ of FIG. As shown in these drawings, the recording head I according to this embodiment includes a flow path forming substrate 10, a protective substrate 30, and a case head 110 (not shown in FIGS. 1 and 2). And a compliance substrate 40 sandwiched between the protective substrate 30 and the case head 110. The protective substrate 30, the compliance substrate 40, and the case head 110 are examples of the first member, the second member, and the third member described in the claims, respectively, and these constitute the housing member described in the claims.

  In this embodiment, the flow path forming substrate 10 is made of a silicon single crystal substrate, and an elastic film 50 made of silicon dioxide is formed on one surface thereof.

  In the flow path forming substrate 10, a row in which the pressure chambers 12 partitioned by the plurality of wall portions 11 are arranged in parallel in the width direction (short direction) by anisotropic etching from the other surface side is Two rows are provided in the longitudinal direction of the chamber 12. In addition, an ink supply path 14 and a communication path 13 constituting an individual flow path for each nozzle 21 are partitioned by a wall portion 11 on one end side in the longitudinal direction of the pressure chamber 12 of the flow path forming substrate 10. The ink supply path 14 and the communication path 13 are arranged outside the two rows of the pressure chambers 12 in each row of the pressure chambers 12.

  The ink supply path 14 generates a flow path resistance for ink between a manifold 100 and a pressure chamber 12 described later, and communicates with one end side in the longitudinal direction of the pressure chamber 12 and has a smaller cross-sectional area than the pressure chamber 12. Have Each communication path 13 communicates with the side of the ink supply path 14 opposite to the pressure chamber 12 and has a larger cross-sectional area than the width direction (short direction) of the ink supply path 14.

  On the surface of the flow path forming substrate 10 opposite to the elastic film 50, a nozzle plate 20 having nozzles 21 is fixed by an adhesive, a heat welding film, or the like. Each nozzle 21 communicates with the vicinity of the end of each pressure chamber 12 opposite to the ink supply path 14. The nozzle plate 20 is made of, for example, glass ceramics, a silicon single crystal substrate, stainless steel, or the like.

  On the other hand, as described above, the elastic film 50 is formed on the surface of the flow path forming substrate 10 opposite to the nozzle plate 20, and the insulator film 55 is formed on the elastic film 50. Further, the first electrode 60, the piezoelectric layer 70, and the second electrode 80 are laminated on the insulator film 55 to constitute the piezoelectric element 300. The piezoelectric element 300 refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. In general, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure chamber 12. In the present embodiment, the first electrode 60 is a common electrode of the piezoelectric element 300, and the second electrode 80 is an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for the convenience of the drive circuit and wiring. That is, in this embodiment, the piezoelectric element 300 is provided as an actuator device that causes a pressure change in the ink (liquid) in the pressure chamber 12.

  Connected to the second electrode 80 of each piezoelectric element 300 is a lead electrode 90 such as gold (Au) extending to the vicinity of the end of the flow path forming substrate 10 opposite to the ink supply path 14. Has been. A voltage is selectively applied to each piezoelectric element 300 via the lead electrode 90. In the present embodiment, the end portion of the lead electrode 90 opposite to the piezoelectric element 300 is a mounting portion 90a to which a terminal of a wiring board 200 described later is electrically connected.

  On the flow path forming substrate 10 on which the piezoelectric element 300 is formed, a protective substrate 30 having a piezoelectric element holding portion 31 having a space that does not hinder the movement of the piezoelectric element 300 in a region facing the piezoelectric element 300. Bonded by an adhesive 35 or the like. Since the piezoelectric element 300 is disposed in the piezoelectric element holding portion 31, it is protected in a state where it is hardly affected by the external environment. In addition, the piezoelectric element holding part 31 may be sealed or may not be sealed. In addition, the piezoelectric element holding unit 31 may be provided independently for each piezoelectric element 300 or may be provided continuously over a plurality of piezoelectric elements 300. In the present embodiment, the piezoelectric element holding portion 31 is continuously provided across the plurality of piezoelectric elements 300.

  A manifold forming portion 32, which is a recess having an opening on the opposite side of the protective substrate 30 from the flow path forming substrate 10, is formed in a region facing the piezoelectric element holding portion 31 on the protective substrate 30. The opening of the manifold forming portion 32 is sealed by a compliance substrate 40 described later, and the manifold 100 is formed by the manifold forming portion 32 and the compliance substrate 40.

  The manifold 100 is a common ink chamber (liquid chamber) for the plurality of individual flow paths, and is continuously provided in the short direction (width direction) of the plurality of individual flow paths. The manifold 100 is provided to the vicinity of both end portions of the protective substrate 30 in the longitudinal direction of the pressure chamber 12, and one end portion side of the manifold 100 is provided to a region facing the end portion of the individual flow path. . Thus, by providing the manifold 100 above the piezoelectric element holding portion 31 (a region overlapping the piezoelectric element holding portion 31 when viewed in plan), it is necessary to widen the manifold 100 to the outside in the longitudinal direction of the pressure chamber 12. In addition, the longitudinal width of the pressure chamber 12 of the recording head I can be reduced to reduce the size.

  In addition, the protective substrate 30 has one end communicating with the end portion of the communication path 13 that is an individual flow path, and the supply portion 101 that is a through hole penetrating in the thickness direction with the other end communicating with one end portion of the manifold 100. Is provided. The manifold 100 communicates with the pressure chamber 12 via the supply unit 101.

  In the present embodiment, one supply unit 101 is provided across the communication path 13 which is a plurality of individual flow paths. Then, the ink from the manifold 100 is supplied to the communication path 13, the ink supply path 14, and the pressure chamber 12, which are individual flow paths, via the supply unit 101. That is, in the present embodiment, the supply unit 101 functions as a part of the manifold 100.

  Examples of the material of the protective substrate 30 include glass, ceramic material, metal, resin, and the like, but it is preferable that the protective substrate 30 is formed of a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10. In this embodiment, a silicon single crystal substrate that is the same material as the flow path forming substrate 10 is used.

  Further, the protective substrate 30 is provided with a first insertion hole 102 that penetrates in the thickness direction in a region corresponding to the two rows of the pressure chambers 12 and through which the wiring substrate 200 is inserted. In the present embodiment, there are two rows in which a plurality of piezoelectric elements 300 are arranged in parallel, and two wiring boards 200 corresponding to each row are inserted into one first insertion hole 102.

  A mounting portion 90 a that is an end portion of the lead electrode 90 is exposed in the first insertion hole 102. A terminal (not shown) of the wiring board 200 is electrically connected to the exposed portion. The wiring board 200 has flexibility in which a driving circuit 201 for driving the piezoelectric element 300 is mounted on a wiring (not shown). For example, a chip-on-film (COF), a tape carrier package (TCP), or the like. A flexible printed circuit board (FPC) can be used.

  In the first insertion hole 102, an end portion (mounting portion 90a) of the lead electrode 90 connected to the piezoelectric element 300 is located. Within the first insertion hole 102, the terminal of the wiring board 200 and the mounting portion 90a of the actuator device are electrically connected via an anisotropic conductive adhesive (ACP) 220. Although details will be described later, the mounting portion 90 a of the lead electrode 90 connected to the terminal of the wiring substrate 200 by the ACP 220 is covered with the first filler 211.

  A compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded to the opening surface side of the manifold forming portion 32 of the protective substrate 30, and the opening of the manifold forming portion 32 is sealed by the compliance substrate 40.

  The sealing film 41 is made of a material having low rigidity and flexibility, for example, a polyphenylene sulfide (PPS) film having a thickness of about several μm. The sealing film 41 is bonded to the fixing plate 42 with an adhesive 47 (see FIG. 3).

  The fixing plate 42 is made of a hard material such as a metal such as stainless steel (SUS) having a thickness of about several tens of μm. The fixing plate 42 is provided over the periphery of the manifold 100 of the protective substrate 30, and a region facing the manifold 100 is an opening 43 that is completely removed in the thickness direction.

  In addition, the fixing plate 42 is provided with an ink introduction portion 44 that protrudes toward the opening 43 side. The ink introduction portion 44 has a storage means (not shown) that penetrates in the thickness direction and stores ink. ) Is provided to the manifold 100. An ink introduction path 45 is provided.

  By such an opening 43 of the fixing plate 42, one surface of the manifold 100 is a flexible portion 46 that can be flexibly deformed and is sealed only by the flexible sealing film 41.

  As shown in FIG. 3, a case head 110 is provided on the side of the compliance substrate 40 opposite to the protective substrate 30. The case head 110 is bonded with an adhesive 48 so as to cover the compliance substrate 40, and the rigidity of the entire recording head I is improved. The case head 110 is provided with a second insertion hole 113 that penetrates in the thickness direction and communicates with the first insertion hole 102 of the protective substrate 30. The second insertion hole 113 communicates with the outside of the recording head I. The first insertion hole 102 and the second insertion hole 113 constitute the insertion hole 120 described in the claims.

  The case head 110 also includes a liquid channel 111. Ink is supplied to the liquid channel 111 from an ink cartridge (not shown). The ink supplied to the liquid flow path 111 is supplied to the manifold 100 via the ink introduction path 45. The material of the case head 110 is not particularly limited, and examples thereof include glass, a ceramic material, a metal, and a resin.

  In the recording head I having the above-described configuration, ink is taken into the manifold 100 from the storage unit that stores external ink (not shown) via the liquid flow path 111, and the inside from the manifold 100 to the nozzle 21 is filled with ink. After satisfying the condition, a voltage is applied between each of the first electrode 60 and the second electrode 80 corresponding to the pressure chamber 12 in accordance with a recording signal from the drive circuit 201 to bend and deform the piezoelectric element 300 and the diaphragm. As a result, the pressure in each pressure chamber 12 increases and ink is ejected from the nozzle 21.

  Here, the first filler 211 and the second filler 212 filled in the insertion hole 120 will be described in detail.

  In the insertion hole 120, a first filler 211 is provided so as to cover the mounting portion 90 a of the lead electrode 90 electrically connected to the terminal of the wiring board 200 by the ACP 220. In addition, a second filler 212 is filled on the upper side of the first filler 211 filled in the insertion hole 120.

  The 1st filler 211 should just be provided so that the junction part of the mounting part 90a and the terminal of the wiring board 200 may be covered at least. The second filler 212 only needs to be provided so as to cover the entire surface of the first filler 211. In the present embodiment, the first filler 211 covers the joint portion between the mounting portion 90 a and the terminal of the wiring board 200 and is filled until reaching the side surface of the insertion hole 120. Further, the second filler 212 is filled in the insertion hole 120 so as to cover the entire surface of the first filler 211.

  The first filler 211 is formed from a material having a lower viscosity than the second filler 212. Although there is no particular limitation on the material, for example, a silicone adhesive is preferably used as the first filler 211.

  The second filler 212 is formed from a material having high ink resistance (liquid resistance). At least a material having higher ink resistance than the first filler 211 is used for the second filler 212. Although there is no particular limitation on the material, for example, an epoxy adhesive is preferably used as the second filler 212.

  The term “ink resistance” as used herein means that ink or a solvent component of the ink (hereinafter, ink or the like) is not substantially infiltrated or dissolved in the ink or the like. That is, the ink or the like that has contacted the second filler 212 penetrates the second filler 212 and reaches the first filler 211, or the second filler 212 is partially removed by the ink or the like. The second filler 212 is formed of a material that can prevent ink 211 from directly touching 211. In addition, the 1st filler 211 may use what has high ink resistance, and may use what does not have ink resistance.

  For example, ink resistance can be specified numerically by immersion high temperature accelerated evaluation. That is, a sample in which a filler is applied to a filler or a material that does not dissolve in ink is immersed in ink, and the volume change rate of the sample before and after immersion is measured. The ink resistance of the second filler 212 is higher than the ink resistance of the first filler 211, which means that the volume change rate of the second filler 212 is smaller than the volume change rate of the first filler 211. That is.

  As described above, the first filler 211 is provided so as to cover the joint portion between the mounting portion 90 a and the terminal of the wiring board 200. Thereby, it can prevent more reliably that the terminal of the wiring board 200 peels from the mounting part 90a.

  In addition, the second filler 212 has higher ink resistance than the first filler 211. As a result, even if ink or the like enters the insertion hole 120 and contacts the second filler 212, it can be reliably prevented that the ink or the like touches the first filler 211. That is, ink or the like infiltrates into the second filler 212 and reaches the first filler 211, or the ink or the like dissolves part of the second filler 212 and directly contacts the first filler 211. Can be reliably prevented.

  As described above, since ink or the like does not contact the first filler 211, it is possible to prevent the first filler 211 from infiltrating and reaching the ACP 220. Thereby, it is possible to prevent electrical contact failure between the mounting portion 90a and the terminal of the wiring board 200 due to the infiltration of the ACP 220 with ink or the like.

  As described above, the viscosity of the first filler 211 is lower than the viscosity of the second filler 212. Thereby, since the first filler 211 has a degree of curing shrinkage smaller than that of the second filler 212, the stress generated in each member such as the flow path forming substrate 10, the protective substrate 30, and the case head 110 can be suppressed. Moreover, since the 2nd filler 212 should just be able to cover the 1st filler 211, it is possible to reduce the thickness and quantity as much as possible. Therefore, even if the second filler 212 is cured and contracted, the influence is small, and the stress generated in each member such as the flow path forming substrate 10 can be almost ignored.

  In general, a material such as an adhesive having a low viscosity applicable to the first filler 211 does not have sufficient ink resistance. On the other hand, a material such as an adhesive having high ink resistance that can be applied to the second filler 212 generally has a high viscosity and a large stress due to curing shrinkage. Therefore, if only one of the first filler 211 and the second filler 212 is used to cover the joint portion between the mounting portion 90a and the terminal of the wiring board 200, the ink resistance is insufficient, or the flow path A large stress is applied to the formation substrate 10 and the like.

  On the other hand, the recording head I according to the present embodiment uses two types of the first filler 211 and the second filler 212, which have different ink resistance and different degrees of cure shrinkage. By adopting such a configuration, for example, even if the ink enters the insertion hole 120 from the ink flow path of the recording head I or from the outside of the recording head I, the second filler 212 having ink resistance becomes the first. Since the first filler 211 is covered, the ink can be prevented from reaching the first filler 211 and the ACP 220. Thereby, the electrical connection failure of the mounting part 90a and the terminal of the wiring board 200 can be prevented.

  Furthermore, by using the first filler 211 having a low viscosity, shrinkage hardening due to the first filler 211 and the second filler 212 can be suppressed, so that the flow path forming substrate 10 and the like are prevented from being stressed. Thus, deformation of the recording head I can be prevented.

  In this way, by using the first filler 211 and the second filler 212, the recording head I that can secure the bonding between the mounting portion 90a (actuator device) and the terminal of the wiring board 200 and prevent deformation. Can be provided. Since the deformation of the recording head I is prevented, the durability of the recording head I is improved, and the displacement of the nozzle 21 of the nozzle plate 20 does not occur, so that it is possible to prevent a decrease in ink ejection accuracy.

  In addition, the compliance substrate 40 as the second member and the case head 110 as the third member are bonded to each other with an adhesive 48, and the viscosity of the adhesive 48 is lower than that of the second member. A second filler 212 is provided above the boundary between the compliance substrate 40 and the case head 110 (on the side opposite to the flow path forming substrate 10). That is, the second filler 212 is provided so as to contact the side surface of the second insertion hole 113 of the case head 110.

  As described above, the second filler 212 has a higher viscosity than the first filler 211. The first filler 211 acts to pull the side surface of the second insertion hole 113 inward by being cured and contracted. That is, a slight stress can be generated in the case head 110. However, since the adhesive 48 having a viscosity lower than that of the second filler 212 is provided between the case head 110 and the compliance substrate 40, the stress is absorbed by the adhesive 48. Therefore, the stress generated in the case head 110 can be prevented from being applied to the compliance substrate 40, the protection substrate 30, the flow path forming substrate 10, the nozzle plate 20, and the like. Thereby, since the stress applied to each member can be reduced, the deformation of the recording head I can be more reliably prevented.

  Here, the compliance substrate 40 includes a sealing film 41 and a fixing plate 42, and the sealing film 41 is bonded to the fixing plate 42 with an adhesive 47. The adhesive 47 may be inevitably selected from the viewpoint of uniformity of thickness at the time of application, adhesion, cost, and reliability that it is difficult to peel off, and the like. Furthermore, in the case head 110, the wall thickness between the liquid flow path 111 and the insertion hole 120 cannot be sufficiently taken, and the liquid flow path 111 and the insertion hole 120 may have to be close to each other. In such a case, the ink may infiltrate into the adhesive 47 at the interface between the sealing film 41 and the fixing plate 42, and the ink may leak out to the insertion hole 120 side.

  Therefore, in such a case, as shown in FIG. 3, if the first filler 211 is in contact with the adhesive 47, the ink may infiltrate the first filler 211 and the ACP 220 may peel off.

  Therefore, when the adhesive 47 as described above must be used or when the wall between the liquid flow path 111 and the insertion hole 120 cannot be thickened, the second filler 212 is a compliance substrate. It is preferable to fill the lower side than 40 (flow path forming substrate 10 side). That is, the second filler 212 is brought into contact with the protective substrate 30.

  By providing the second filler 212 below the compliance substrate 40, even if the ink enters the insertion hole 120 via the adhesive 47, the second filler 212 causes the ink to be filled with the first filler. Intrusion into 211 can be prevented.

  In addition, by disposing the compliance substrate 40 in a place other than between the protective substrate 30 and the case head 110, the ink itself does not enter the insertion hole 120 via the adhesive 47 as described above. May be. Such a configuration will be described in Embodiment 2.

<Embodiment 2>
FIG. 4 is a cross-sectional view of the recording head according to the present embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 4, the recording head I is protected by a flow path forming substrate 10, a nozzle plate 20 joined to the flow path forming substrate 10 through a communication plate 15, a protective substrate 30, and an adhesive (not shown). And a case head 110 bonded to the substrate 30. The protective substrate 30 and the case head 110 constitute a housing member described in the claims.

  The communication plate 15 is provided with a plurality of communication passages 16 penetrating in the thickness direction so as to face the pressure chambers 12. The communication plate 15 is joined to the flow path forming substrate 10 so that each communication passage 16 communicates with each pressure chamber 12. The nozzle plate 20 is joined to the communication plate 15 so that each nozzle 21 communicates with each communication path 16.

  The communication plate 15 and the case head 110 protrude laterally from the flow path forming substrate 10 and the protective substrate 30 (left and right sides in FIG. 4, outside the insertion hole 120). By forming a concave portion that is opened laterally from the portion where the communication plate 15 and the case head 110 protrude and the side surfaces of the flow path forming substrate 10 and the protective substrate 30, the concave portion is sealed by the compliance substrate 40. A manifold 100 is formed.

  Like the recording head I according to the present embodiment, the compliance substrate 40 may be provided not on the side of the protective substrate 30 and the case head 110 but on the sides thereof.

  As described in the first embodiment, the compliance substrate 40 may be forced to use the adhesive 47 having no ink resistance. However, since the compliance substrate 40 is provided on the side of the protective substrate 30 and the case head 110, the adhesive 47 is not exposed in the insertion hole 120.

  Further, since the manifold 100 is formed on the side of the pressure chamber 12, the thickness of the wall between the manifold 100 and the insertion hole 120 in the protective substrate 30 and the case head 110 can be sufficiently increased. Further, the adhesive for joining the protective substrate 30 and the case head 110 is not as strict as the adhesive 47 required for the compliance substrate 40, and an ink-resistant adhesive can be used. Thereby, it is possible to more reliably prevent ink from entering the insertion hole 120 via the interface between the protective substrate 30 and the case head 110.

  As described above, in the recording head I according to this embodiment, ink does not enter the insertion hole 120 from the manifold 100. For this reason, it is possible to fill the insertion hole 120 with the first filler 211 to the upper side of the boundary between the protective substrate 30 and the case head 110. As a result, a sufficient amount of the first filler 211 can be filled into the insertion hole 120, and the terminal of the wiring board 200 and the mounting portion 90a can be more reliably prevented.

<Other embodiments>
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above.

  Although the 2nd filler 212 was provided directly on the upper side of the 1st filler 211, it is not limited to such an aspect. For example, another filler (material is arbitrary) may be provided between the first fillers 211, and the second filler 212 may be provided thereon. Further, the second filler 212 does not need to be exposed in the insertion hole 120. That is, another filler may be provided on the upper side of the second filler 212. In any case, the second filler 212 can prevent the ink that has entered the insertion hole 120 from reaching the first filler 211.

  Further, as the housing member, the first embodiment exemplifies a member including the protective substrate 30, the compliance substrate 40, and the case head 110, and the second embodiment exemplifies a member including the protective substrate 30 and the case head 110. It is not limited to an aspect. For example, an insertion hole may be provided only in the protective substrate 30 and the insertion hole may be filled with the first filler 211 and the second filler 212.

  In the first embodiment described above, the terminals of the wiring board 200 and the mounting portion 90a of the lead electrode 90, which is the mounting portion 90a, are electrically connected by the ACP 220. However, the present invention is not limited to this. For example, the terminals of the wiring board 200 and the mounting portion 90a of the lead electrode 90 may be connected using a non-conductive adhesive (hereinafter abbreviated as NCP). When NCP is used, the mounting portion 90a and the terminal of the wiring board 200 are directly crimped to achieve electrical connection, and both are fixed with a resin adhesive. Therefore, in the mounting process, after NCP is applied to the mounting portion 90a, a load is applied using a crimping tool with the wiring board 200 disposed thereon, and the NCP is applied from the joint surface between each terminal and each mounting portion 90a. Each terminal and each mounting part 90a are crimped | bonded, eliminating. Thereby, each terminal and each mounting part 90a are joined in a direct contact state, and each terminal and each mounting part 90a are fixed around the joint surface by the excluded NCP.

  In this case, the terminals of the wiring board 200 connected by NCP and the periphery of the mounting portion 90 a are covered with the first filler 211 and further covered with the second filler 212. Thereby, since the ink is prevented from flowing into the insertion hole 120, it is possible to prevent the adjacent mounting portions 90a from being short-circuited by the ink.

  Furthermore, the terminals of the wiring board 200 and the mounting portions 90a of the lead electrodes 90 may be joined with a metal such as solder. Even in this case, it is possible to prevent the adjacent mounting portions 90a from being short-circuited by the ink.

  In the first embodiment described above, the actuator device having the thin film piezoelectric element 300 is described as the actuator device that causes a pressure change in the pressure chamber 12. However, the present invention is not particularly limited thereto. Actuator device having a thick film type piezoelectric element formed by a method such as sticking, or an actuator device having a longitudinal vibration type piezoelectric element in which piezoelectric materials and electrode forming materials are alternately stacked to expand and contract in the axial direction Etc. can be used. In addition, as an actuator device, a heating element is arranged in the pressure chamber 12 and a liquid droplet is ejected from a nozzle by a bubble generated by heat generation of the heating element, or static electricity is generated between the diaphragm and the electrode. A so-called electrostatic actuator device that deforms the diaphragm by electrostatic force and discharges droplets from the nozzle can be used. In any actuator device, the mounting portion 90a may be provided on the flow path forming substrate.

  The recording heads of these embodiments are mounted on an ink jet recording apparatus which is an example of a liquid ejecting apparatus. FIG. 5 is a schematic diagram illustrating an example of an ink jet recording apparatus.

  As shown in FIG. 5, the ink jet recording apparatus 1 includes a storage chamber in which a plurality of different color inks such as black (B), cyan (C), magenta (M), and yellow (Y) are stored. And a recording head I having an ink cartridge (liquid storage means) 2 mounted thereon. The recording head I is mounted on the carriage 3, and the carriage 3 on which the recording head I is mounted is provided on a carriage shaft 5 attached to the apparatus main body 4 so as to be movable in the axial direction. Then, the driving force of the driving motor 6 is transmitted to the carriage 3 through a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 is moved along the carriage shaft 5. On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage shaft 5, so that a recording medium S such as paper fed by a paper feeding device (not shown) is conveyed on the platen 8. ing.

  Although the ink jet recording apparatus 1 has been exemplified in which the recording head I is mounted on the carriage 3 and moves in the main scanning direction, it is not particularly limited to this. For example, the present invention can also be applied to a so-called line type recording apparatus in which the recording head I is fixed and printing is performed simply by moving a recording sheet such as paper in the sub-scanning direction.

  Furthermore, the present invention is intended for a wide range of liquid jet heads in general, for example, for manufacturing recording heads such as various ink jet recording heads used in image recording apparatuses such as printers, and color filters such as liquid crystal displays. The present invention can also be applied to a coloring material ejecting head, an organic EL display, an electrode material ejecting head used for forming electrodes such as an FED (field emission display), a bioorganic matter ejecting head used for biochip manufacturing, and the like.

  DESCRIPTION OF SYMBOLS 1 Inkjet recording apparatus (liquid ejecting apparatus), I Inkjet recording head (liquid ejecting head), 10 Flow path formation board, 12 Pressure chamber, 20 Nozzle plate, 21 Nozzle, 30 Protection board (1st member), 32 Manifold Forming part, 40 compliance substrate (second member), 41 sealing film, 42 fixing plate, 47, 48 adhesive, 90 lead electrode, 90a mounting part, 100 manifold, 102 first insertion hole, 110 case head (third) Member), 113 second insertion hole, 120 insertion hole, 200 wiring board, 211 first filler, 212 second filler, 220 anisotropic conductive adhesive (ACP), 300 piezoelectric element (actuator device)

Claims (5)

A flow path forming substrate having a pressure chamber communicating with a nozzle for discharging liquid and provided with an actuator device for generating pressure in the pressure chamber;
A wiring board for driving the actuator device;
A housing member that is joined to the actuator device side of the flow path forming substrate and has an insertion hole through which the wiring substrate is inserted;
The actuator device is provided with a mounting portion connected to the wiring board in the insertion hole,
The insertion hole is filled with a first filler so as to cover the mounting portion connected to the wiring board, and a second filler is filled above the first filler,
The first filler is formed from a material having a lower viscosity than the second filler,
The liquid ejecting head, wherein the second filler is formed of a material having liquid resistance. The liquid ejecting head according to claim 1,
The mounting portion is connected to the wiring board by an anisotropic conductive adhesive. The liquid ejecting head according to claim 1 or 2,
The housing member is
A manifold forming portion that opens to the opposite side of the flow path forming substrate and communicates with the pressure chamber is provided, and a first member that is joined to the flow path forming substrate;
A second member that forms a manifold communicating with the pressure chamber by being joined to the first member so as to seal the opening of the manifold forming portion;
A third member joined to the second member,
The second filler is filled to the opposite side of the flow path forming substrate from the boundary between the second member and the third member,
The liquid ejecting head, wherein the second member and the third member are bonded with a material having a viscosity lower than that of the second filler. The liquid ejecting head according to claim 1 or 2,
The housing member is
A manifold forming portion that opens to the opposite side of the flow path forming substrate and communicates with the pressure chamber is provided, and a first member that is joined to the flow path forming substrate;
A second member that forms a manifold communicating with the pressure chamber by being joined to the first member so as to seal the opening of the manifold forming portion;
A third member joined to the second member,
The second member includes a flexible sealing film and a fixing plate to which the sealing film is bonded with an adhesive,
The liquid ejecting head, wherein the second filler is filled closer to the flow path forming substrate than the second member.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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