JP2018052098A - Liquid jet head, liquid jet device and method for production of liquid jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid jet head and liquid jet device restraining deterioration of an adhesive force between a resin-made substrate and the other substrate, and to provide a method for production of the liquid jet head.SOLUTION: A liquid jet head (recording head 3) is equipped with a first substrate (communication substrate 24) in which a space to be a flow channel (common liquid chamber 25) is formed in such a state as opening on one side, and a resin-made second substrate (sealing film 49) which seals the opening from one side of the first substrate (communication substrate 24) and partitions a flow channel (common liquid chamber 25). The first substrate (communication substrate 24) and the second substrate (sealing film 49) are adhered through a first adhesion layer (53) comprising a silicone adhesive laminated on one side face of the first substrate (communication substrate 24) and a second adhesion layer (54) comprising an epoxy adhesive laminated on the first adhesion layer (53).SELECTED DRAWING: Figure 4

Description

  The present invention relates to a liquid ejecting head including a substrate made of resin, a liquid ejecting apparatus, and a method for manufacturing the liquid ejecting head.

  Liquid ejecting apparatuses equipped with a liquid ejecting head include, for example, image recording apparatuses such as an ink jet printer and an ink jet plotter, but recently, taking advantage of the feature that a very small amount of liquid can be landed accurately at a predetermined position. It is also applied to various manufacturing equipment. For example, a display manufacturing apparatus for manufacturing a color filter such as a liquid crystal display, an electrode forming apparatus for forming an electrode such as an organic EL (Electro Luminescence) display or FED (surface emitting display), and a chip for manufacturing a biochip (biochemical element) Applied to manufacturing equipment. In the image recording apparatus, liquid ink is ejected from the liquid ejecting head, and in the display manufacturing apparatus, a solution of each color material of R (Red), G (Green), and B (Blue) is ejected from the liquid ejecting head. In the electrode forming apparatus, a liquid electrode material is ejected from the liquid ejecting head, and in the chip manufacturing apparatus, a bioorganic solution is ejected from the liquid ejecting head.

  The liquid ejecting head includes, for example, a nozzle plate having a plurality of nozzles, a pressure chamber forming substrate in which a plurality of spaces serving as pressure chambers communicating with the nozzles are formed, and a common liquid chamber that supplies liquid to the pressure chambers. A communication substrate or the like in which a space to be (also referred to as a manifold) is formed is provided. In addition, as a liquid ejecting head, there is one in which a part of a space serving as a common liquid chamber (manifold portion) is partitioned by a thin film having flexibility (that is, a thin film substrate made of resin) (for example, a patent). Reference 1). The liquid ejecting head absorbs the pressure fluctuation in the common liquid chamber by this thin film. Further, as an adhesive for adhering such a thin film to a communication substrate, a silicone-based adhesive is used (see Patent Document 1).

JP 2006-068539 A

  However, when bonding using a silicone-based adhesive, components (eg, sulfur (S), nitrogen (N), plasticizer, etc.) contained in the resin thin film become a catalyst poison, and the silicone-based adhesive is cured. There was a possibility that it may be hindered or the adhesive strength may be reduced. In particular, in a liquid ejecting head, an addition reaction type silicone-based adhesive is preferably used, and thus such a problem is likely to occur.

  The present invention has been made in view of such circumstances, and an object thereof is a liquid ejecting head, a liquid ejecting apparatus, and a liquid in which a decrease in adhesive force between a substrate made of resin and another substrate is suppressed. It is to provide a method for manufacturing an ejection head.

The liquid jet head of the present invention has been proposed in order to achieve the above-described object, and includes a first substrate formed in a state where a space serving as a flow path is opened on one side surface,
A second substrate made of a resin that seals the opening from the one side surface of the first substrate and partitions the flow path;
The first substrate and the second substrate include a first adhesive layer made of a silicone-based adhesive laminated on the one side surface of the first substrate, and the first adhesive layer. It is characterized by being bonded through a second adhesive layer made of a laminated epoxy adhesive.

  According to this configuration, since the second substrate is bonded to the first substrate side via the second adhesive layer that is an epoxy adhesive, the first adhesive that is a silicone adhesive is contained in the component contained in the resin. It can suppress that the adhesive force of this adhesive layer falls. As a result, peeling of the second substrate can be suppressed, and the reliability of the liquid jet head can be improved.

Further, in the above-described configuration, a third substrate bonded to a region outside the region where the second substrate is bonded to the one side surface of the first substrate is provided,
The first substrate and the third substrate are preferably bonded via the first adhesive layer laminated on the one side surface of the first substrate.

  According to this configuration, the first adhesive layer can be shared between the first substrate and the second substrate, and between the first substrate and the third substrate. Configuration is simplified.

  Furthermore, in any of the above configurations, the first adhesive layer preferably includes an epoxy group.

  According to this structure, the adhesiveness (namely, adhesive force) of a 1st contact bonding layer and a 2nd contact bonding layer can be improved.

  In any of the above configurations, it is desirable that the Young's modulus of the first adhesive layer is lower than the Young's modulus of the second adhesive layer.

  According to this configuration, even if shear stress occurs between the first substrate and the second substrate due to the difference between the linear expansion coefficient of the first substrate and the linear expansion coefficient of the second substrate, This adhesive layer can relieve this stress.

Furthermore, in any one of the above configurations, the first adhesive layer includes a curing accelerating catalyst containing platinum,
It is desirable that a promoter layer containing tantalum oxide is formed at least in a region where the first adhesive layer is laminated on the one side surface of the first substrate.

  According to this configuration, the effect of promoting the curing of the first adhesive layer by the curing accelerating catalyst can be enhanced by the promoter layer. As a result, the adhesive strength by the first adhesive layer can be increased.

  Furthermore, a liquid ejecting apparatus of the invention includes any one of the liquid ejecting heads having the above-described configurations.

  According to this configuration, the reliability of the liquid ejecting apparatus can be increased.

Further, in the method of manufacturing the liquid jet head according to the aspect of the invention, the first substrate formed in a state where the space serving as the flow path is opened on one surface, and the one surface of the first substrate from the one surface. And a second substrate made of a resin that seals the opening and partitions the flow path,
Forming a first adhesive layer made of a silicone-based adhesive on the one side surface of the first substrate, and curing the first adhesive layer;
The first adhesive layer laminated on the first substrate or the surface of the second substrate on the side facing the first substrate is made of an epoxy-based adhesive. Two adhesive layers are formed, and the second adhesive layer is cured in a state where the first adhesive layer and the second adhesive layer are sandwiched between the first substrate and the second substrate, A second adhesive layer curing step for adhering
It is characterized by including.

  According to this configuration, since the first adhesive layer is cured before the second substrate is bonded, it is possible to suppress a decrease in the adhesive force of the first adhesive layer due to the components included in the second substrate. .

Furthermore, in the manufacturing method, the first adhesive layer includes an epoxy group,
In the first adhesive layer curing step, the first adhesive layer is formed by forming the first adhesive layer in a semi-cured state in which the degree of curing has progressed from a liquid state on the one side surface of the first substrate. Process,
After the first adhesive layer forming step, it is preferable to include a main curing step in which the semi-cured first adhesive layer is fully cured.

  According to this method, it is possible to prevent the epoxy group from moving from the surface of the first adhesive layer to the inside. As a result, an epoxy group can be left on the surface of the first adhesive layer after the main curing, and the adhesion between the first adhesive layer and the second adhesive layer can be improved.

In any of the above production methods, the first adhesive layer includes a curing acceleration catalyst containing platinum,
It is desirable that a promoter layer containing tantalum oxide is formed at least in a region where the first adhesive layer is laminated on the one side surface of the first substrate.

  According to this method, the effect of promoting the curing of the first adhesive layer by the curing accelerating catalyst can be enhanced by the promoter layer. As a result, the adhesive strength by the first adhesive layer can be increased.

FIG. 3 is a perspective view illustrating a configuration of a printer. FIG. 2 is an exploded perspective view illustrating a configuration of a recording head. FIG. 3 is a cross-sectional view illustrating a configuration of a recording head. FIG. 4 is an enlarged view of a region A in FIG. 3. FIG. 6 is a state transition diagram illustrating a method for manufacturing a recording head. FIG. 6 is a state transition diagram illustrating a method for manufacturing a recording head. FIG. 6 is a state transition diagram illustrating a method for manufacturing a recording head. FIG. 6 is a state transition diagram illustrating a method for manufacturing a recording head. FIG. 6 is a state transition diagram illustrating a method for manufacturing a recording head. FIG. 6 is a state transition diagram illustrating a method for manufacturing a recording head. It is sectional drawing explaining the structure of the recording head in 2nd Embodiment. It is a table | surface which shows the result of having measured the adhesive strength of the silicone type adhesive agent in various materials. It is sectional drawing explaining the structure of the recording head in 2nd Embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the embodiments described below, various limitations are made as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the following description unless otherwise specified. However, the present invention is not limited to these embodiments. In the following, as an example of the liquid ejecting head of the present invention, an ink jet recording head (hereinafter referred to as recording head) 3 mounted on an ink jet printer (hereinafter referred to as printer) 1 which is a kind of liquid ejecting apparatus is taken as an example. I will give you a description.

  FIG. 1 is a perspective view of the printer 1. The printer 1 is an apparatus that records an image or the like by ejecting ink (a type of liquid) onto the surface of a recording medium 2 (a type of landing target) such as a recording paper. The printer 1 includes a recording head 3, a carriage 4 to which the recording head 3 is attached, a carriage moving mechanism 5 that moves the carriage 4 in the main scanning direction, a conveyance mechanism 6 that transfers the recording medium 2 in the sub scanning direction, and the like. Yes. Here, the ink is stored in an ink cartridge 7 as a liquid supply source. The ink cartridge 7 is detachably attached to the recording head 3. It is also possible to employ a configuration in which the ink cartridge is disposed on the main body side of the printer and supplied from the ink cartridge to the recording head through the ink supply tube.

  The carriage moving mechanism 5 includes a timing belt 8. The timing belt 8 is driven by a pulse motor 9 such as a DC motor. Therefore, when the pulse motor 9 operates, the carriage 4 is guided by the guide rod 10 installed on the printer 1 and reciprocates in the main scanning direction (width direction of the recording medium 2). The position of the carriage 4 in the main scanning direction is detected by a linear encoder (not shown) which is a kind of position information detecting means. The linear encoder transmits the detection signal, that is, the encoder pulse (a kind of position information) to the control unit of the printer 1.

  Next, the recording head 3 will be described. FIG. 2 is an exploded perspective view illustrating the configuration of the recording head 3. FIG. 3 is a cross-sectional view illustrating the configuration of the recording head 3. FIG. 4 is an enlarged view of region A in FIG. In the following description, the stacking direction of the members will be described as the vertical direction as appropriate. As shown in FIG. 2, the recording head 3 in the present embodiment is attached to the head case 16 in a state where the actuator unit 14 and the flow path unit 15 are stacked.

  The head case 16 is a resin box-like member, and is formed in a state in which the liquid introduction path 18 that supplies ink to each pressure chamber 30 penetrates in the vertical direction. The liquid introduction path 18 is a space for storing ink common to a plurality of formed pressure chambers 30 together with a common liquid chamber 25 described later. In the present embodiment, two liquid introduction paths 18 are formed corresponding to the rows of pressure chambers 30 arranged in two rows. Further, as shown in FIG. 3, an accommodation space 17 that is recessed in a rectangular parallelepiped shape from the lower surface of the head case 16 (the surface on the nozzle plate 21 side) to the middle of the head case 16 in the height direction, as shown in FIG. 3. Is formed. When a flow path unit 15 to be described later is joined in a state of being positioned on the lower surface of the head case 16, the actuator unit 14 (the pressure chamber forming substrate 29, the sealing plate 33, the drive IC 34, etc.) stacked on the communication substrate 24 is obtained. It is configured to be accommodated in the accommodating space 17. Further, an insertion opening 19 is provided in a part of the ceiling surface of the accommodation space 17 so as to communicate the space outside the head case 16 and the accommodation space 17. Through the insertion opening 19, an end portion of a wiring board such as an FPC (flexible printed circuit board) (not shown) is inserted into the accommodation space 17 and connected to the actuator unit 14 in the accommodation space 17.

  As shown in FIG. 3, the actuator unit 14 in the present embodiment is unitized by stacking a pressure chamber forming substrate 29, a vibration plate 31, a piezoelectric element 32 that is a kind of actuator, a sealing plate 33, and a driving IC 34. In this state, it is laminated on the communication substrate 24. The actuator unit 14 is formed smaller than the accommodation space 17 so that it can be accommodated in the accommodation space 17.

  The pressure chamber forming substrate 29 is a silicon substrate that constitutes a lower portion of the actuator unit 14 (portion unit 15 side portion). A part of the pressure chamber forming substrate 29 is removed in the thickness direction by etching or the like, and a plurality of spaces to be the pressure chambers 30 are arranged in parallel along the nozzle row direction. The space is partitioned by the communication substrate 24 at the lower side and partitioned by the diaphragm 31 to form the pressure chamber 30. In addition, this space, that is, the pressure chamber 30 is formed in two rows corresponding to the nozzle rows formed in two rows. Each pressure chamber 30 is a hollow portion that is long in a direction orthogonal to the nozzle row direction, and an individual communication passage 26 (described later) communicates with an end portion on one side in the longitudinal direction, and will be described later on an end portion on the other side. The nozzle communication path 27 communicates.

  The diaphragm 31 is a thin film substrate having elasticity, and is laminated on the upper surface of the pressure chamber forming substrate 29 (surface opposite to the flow path unit 15 side). The diaphragm 31 seals the upper opening of the space to be the pressure chamber 30. In other words, the pressure chamber 30 is partitioned by the diaphragm 31. A portion of the diaphragm 31 corresponding to the pressure chamber 30 (specifically, an upper opening of the pressure chamber 30) functions as a displacement portion that displaces in a direction away from or close to the nozzle 22 as the piezoelectric element 32 is bent and deformed. To do. That is, a region corresponding to the upper opening of the pressure chamber 30 in the diaphragm 31 is a drive region 35 in which bending deformation is allowed. On the other hand, a region outside the upper opening of the pressure chamber 30 in the diaphragm 31 is a non-driving region 36 in which bending deformation is inhibited.

The vibration plate 31 is, for example, an elastic film made of silicon dioxide (SiO ₂ ) formed on the upper surface of the pressure chamber forming substrate 29 and an insulator made of zirconium oxide (ZrO ₂ ) formed on the elastic film. And a membrane. Then, the piezoelectric elements 32 are stacked in regions corresponding to the pressure chambers 30 on the insulating film (the surface opposite to the pressure chamber forming substrate 29 side of the vibration plate 31), that is, in the driving region 35. The piezoelectric element 32 in the present embodiment is a so-called flexural mode piezoelectric element. The piezoelectric element 32 is formed by, for example, sequentially laminating a lower electrode layer, a piezoelectric layer, and an upper electrode layer on the vibration plate 31. Either the upper electrode film or the lower electrode film is a common electrode formed in common for each piezoelectric element 32, and the other is an individual electrode formed individually for each piezoelectric element 32. When an electric field corresponding to the potential difference between the two electrodes is applied between the lower electrode layer and the upper electrode layer, the piezoelectric element 32 bends and deforms in a direction away from or near to the nozzle 22. Note that the piezoelectric elements 32 in the present embodiment are formed in two rows along the nozzle row direction corresponding to the pressure chambers 30 arranged in two rows along the nozzle row direction.

  Further, the individual terminals 41 and the common terminals 42 are stacked in the non-driving region 36 of the diaphragm 31 in the present embodiment. That is, the individual terminal 41 and the common terminal 42 are formed on the upper surface of the diaphragm 31 (the surface facing the sealing plate 33). Specifically, in the direction orthogonal to the nozzle row direction, individual terminals 41 are formed outside the row of one piezoelectric element 32 and outside the row of the other piezoelectric element 32, and are common between the rows of both piezoelectric elements 32. A terminal 42 is formed. The individual terminal 41 is a terminal portion of a wiring extending from the individual electrode of the piezoelectric element 32 and is electrically connected to the individual electrode. The individual terminal 41 is formed for each piezoelectric element 32. On the other hand, the common terminal 42 is a terminal portion of a wiring extending from the common electrode of the piezoelectric element 32 and is electrically connected to the common electrode. In the present embodiment, the common terminal 42 is connected to both the common electrode of one piezoelectric element 32 and the common electrode of the other piezoelectric element 32. The individual terminals 41 and the common terminal 42 are in contact with corresponding bump electrodes 37 (described later).

  As shown in FIG. 3, the sealing plate 33 is a silicon disposed with a gap with respect to the piezoelectric element 32 with an insulating photosensitive adhesive 43 interposed between the sealing plate 33 and the vibration plate 31. It is a made substrate. A plurality of bump electrodes 37 for outputting a drive signal from the drive IC 34 to the piezoelectric element 32 side are formed on the lower surface (the surface on the pressure chamber forming substrate 29 side) of the sealing plate 33 in the present embodiment. As shown in FIG. 3, the bump electrode 37 is located at a position corresponding to one individual terminal 41 formed outside one piezoelectric element 32, and the other individual terminal 41 formed outside the other piezoelectric element 32. , A position corresponding to the common terminal 42 formed between the rows of both piezoelectric elements 32, and the like. Each bump electrode 37 is connected to a corresponding individual terminal 41 or common terminal 42. As the bump electrode 37, a so-called resin core bump made of a resin portion and a conductive layer covering the surface of the resin portion, a metal bump made of a metal such as gold (Au), or the like is preferably used. A lower surface side wiring 39 connected to the bump electrode 37 is formed on the lower surface of the sealing plate 33 (the surface on the pressure chamber forming substrate 29 side). As shown in FIG. 3, the lower surface side wiring 39 extends from the bump electrode 37, and passes through the sealing plate 33 in the thickness direction, and the upper surface (pressure chamber formation) of the sealing plate 33. It is connected to the upper surface side wiring 46 laminated on the surface opposite to the substrate 29).

  The drive IC 34 is an IC chip for driving the piezoelectric element 32 and is laminated on the upper surface of the sealing plate 33 via an adhesive 48 such as an anisotropic conductive film (ACF). As shown in FIG. 3, a plurality of IC terminals 47 connected to the terminal portions of the upper surface side wiring 46 are formed on the lower surface (surface on the sealing plate 33 side) of the drive IC 34. Among the IC terminals 47, a plurality of IC terminals 47 corresponding to the individual terminals 41 are arranged in parallel along the nozzle row direction. In this embodiment, two rows of IC terminals 47 are formed corresponding to the rows of piezoelectric elements 32 arranged in two rows.

  The flow path unit 15 to which the actuator unit 14 and the head case 16 are joined includes a communication substrate 24 (corresponding to the first substrate in the present invention), a nozzle plate 21 (corresponding to the third substrate in the present invention), and compliance. A substrate 28 is provided. The communication substrate 24 is a substrate made of silicon, and in this embodiment, is formed from a silicon single crystal substrate whose surface (upper surface and lower surface) has a crystal plane orientation of (110). As shown in FIG. 3, the communication substrate 24 is in common with a space serving as a common liquid chamber 25 (a type of flow path) that communicates with the liquid introduction path 18 and stores ink common to the pressure chambers 30. An individual communication path 26 that individually supplies ink from the liquid introduction path 18 to each pressure chamber 30 via the liquid chamber 25 and a nozzle communication path 27 that connects the pressure chamber 30 and the nozzle 22 are anisotropically etched. It is formed by. A space serving as the common liquid chamber 25 (that is, the common liquid chamber 25) is a long space along the nozzle row direction, and two spaces are formed corresponding to the liquid introduction paths 18. The common liquid chamber 25 includes a first liquid chamber 25a penetrating through the thickness direction of the communication substrate 24, and a lower surface (a surface opposite to the pressure chamber forming substrate 29 side) to an upper surface (the pressure chamber forming substrate 29 side). And a second liquid chamber 25b formed in a state where the thin wall portion is left in the middle of the plate thickness direction. A part of the opening on the upper surface side of the first liquid chamber 25 a communicates with the liquid introduction path 18 formed in the head case 16. Further, the opening on the lower surface side (the side opposite to the head case 16 side) of the space serving as the common liquid chamber 25 is sealed with a sealing film 49 (corresponding to the second substrate in the present invention) of the compliance substrate 28 described later. Has been. That is, the lower surface of the common liquid chamber 25 is partitioned by the sealing film 49. The individual communication path 26 is formed in a state of penetrating the thin portion in the second liquid chamber 25b. A plurality of the individual communication paths 26 are opened at positions corresponding to the pressure chambers 30 of the common liquid chamber 25. That is, a plurality of the individual communication paths 26 are formed along the direction in which the pressure chambers 30 are arranged in parallel (in other words, the nozzle row direction). Similarly, a plurality of nozzle communication paths 27 are also formed along the nozzle row direction.

  The nozzle plate 21 is a silicon substrate (for example, a silicon single crystal substrate) bonded to the lower surface of the communication substrate 24. The nozzle plate 21 of the present embodiment is bonded to a region that is out of the compliance substrate 28 so as not to overlap the compliance substrate 28. In other words, the nozzle plate 21 is joined to a central region that is out of the opening on the lower surface side of the common liquid chamber 25 of the communication substrate 24. In the nozzle plate 21, a plurality of nozzles 22 (referred to as nozzle rows) are provided in a straight line shape (in other words, a row shape) along the longitudinal direction of the nozzle plate 21. In the present embodiment, two rows of nozzle rows are formed corresponding to the rows of pressure chambers 30 formed in two rows. The plurality of nozzles 22 (nozzle rows) arranged side by side are provided at equal intervals from the nozzle 22 on one end side to the nozzle 22 on the other end side at a pitch corresponding to the dot formation density.

  The compliance substrate 28 is a flexible substrate bonded to a lower surface of the communication substrate 24 and corresponding to the common liquid chamber 25. In other words, the compliance substrate 28 is bonded to a region outside the region where the nozzle plate 21 is bonded on the lower surface of the communication substrate 24. The compliance substrate 28 in the present embodiment is formed on the outer periphery of the nozzle plate 21 so as not to interfere with the nozzle plate 21. That is, as shown in FIGS. 2 and 3, an exposure opening 51 that exposes the nozzle plate 21 (specifically, the nozzle surface 40) is formed in the center portion of the compliance substrate 28. Furthermore, the compliance substrate 28 is formed by laminating a sealing film 49 having low rigidity and flexibility on a hard fixed substrate 50 made of metal or the like (SUS (stainless steel) in the present embodiment). The sealing film 49 is a thin film substrate made of resin, and is bonded to the communication substrate 24. That is, the compliance substrate 28 is bonded to the communication substrate 24 with the sealing film 49 side facing upward. In addition, the region of the fixed substrate 50 that faces the common liquid chamber 25 is an opening that is removed in the thickness direction. For this reason, the lower surface of the common liquid chamber 25 is sealed only with the sealing film 49 and functions as a compliance section that absorbs pressure fluctuations of ink in the common liquid chamber 25. In addition, it is also possible to adopt a configuration in which two compliance substrates are provided corresponding to the common liquid chambers formed in two rows and the compliance substrates are respectively bonded to both sides of the nozzle plate.

  Here, the nozzle plate 21 and the compliance substrate 28 are bonded to the communication substrate 24 with an adhesive. Specifically, as shown in FIG. 4, the communication substrate 24 and the nozzle plate 21 are bonded via a first adhesive layer 53 made of a silicone-based adhesive laminated on the lower surface of the communication substrate 24. . On the other hand, the communication substrate 24 and the compliance substrate 28 include a first adhesive layer 53 made of a silicone adhesive laminated on the lower surface of the communication substrate 24, and an epoxy adhesive laminated on the first adhesive layer 53. It adheres via the 2nd adhesion layer 54 which consists of. The first adhesive layer 53 is an adhesive layer common to the nozzle plate 21 and the compliance substrate 28, and is formed on the entire lower surface excluding the region corresponding to the common liquid chamber 25 of the communication substrate 24. The second adhesive layer 54 is an adhesive for adhering the compliance substrate 28, and is formed between the first adhesive layer 53 and the compliance substrate 28. More specifically, the second adhesive layer 54 is formed on the sealing film 49 in a region where both the fixed substrate 50 and the sealing film 49 of the compliance substrate 28 are laminated. In other words, the second adhesive layer 54 is formed on the lower surface of the communication substrate 24 in a region to which the compliance substrate 28 is bonded, excluding a region corresponding to the common liquid chamber 25.

  In addition, the 1st contact bonding layer 53 in this embodiment consists of a thermosetting and addition reaction type silicone adhesive, and contains the epoxy group. As described above, by including an epoxy group in the first adhesive layer 53, the adhesion (that is, the adhesive force) between the first adhesive layer 53 and the second adhesive layer 54 can be improved. That is, when the first adhesive layer 53 is formed on the lower surface of the communication substrate 24, the first adhesive layer 53 is formed so that the epoxy group stays on the surface (the surface on the second adhesive layer 54 side). The adhesion between the second adhesive layer 54 made of an epoxy adhesive and the first adhesive layer 53 can be improved. As a result, it is possible to suppress peeling at the interface between the first adhesive layer 53 and the second adhesive layer 54. In the present embodiment, the Young's modulus of the first adhesive layer 53 is lower than the Young's modulus of the second adhesive layer 54 in the cured state. In other words, the first adhesive layer 53 is softer than the second adhesive layer 54. For example, the Young's modulus of the first adhesive layer 53 is about 2 GPa, and the Young's modulus of the second adhesive layer 54 is about 7 GPa. As a result, during heating when bonding the compliance substrate 28 and the communication substrate 24, the difference between the linear expansion coefficient of the communication substrate 24 and the linear expansion coefficient of the compliance substrate 28 causes a gap between the communication substrate 24 and the compliance substrate 28. Even if shear stress occurs, the second adhesive layer 54 can relieve this stress. As a result, the compliance substrate 28 can be prevented from being peeled off from the communication substrate 24. Furthermore, the surface free energy of the first adhesive layer 53 is lower than the surface free energy of the communication substrate 24. That is, the surface of the first adhesive layer 53 has higher liquid repellency than the surface of the communication substrate 24, and has a contact angle of 80 degrees to 100 degrees, for example. Therefore, even when the liquid second adhesive layer 54 is formed on the surface of the cured first adhesive layer 53 when the compliance substrate 28 is bonded to the communication substrate 24, the epoxy is removed from the second adhesive layer 54. The system adhesive can be prevented from flowing out to the communication substrate 24 side. A method for bonding the nozzle plate 21 and the compliance substrate 28 to the communication substrate 24 will be described in detail later.

  In this way, since the compliance substrate 28 is bonded to the communication substrate 24 side via the second adhesive layer 54 that is an epoxy adhesive, a silicone adhesive is used depending on the components contained in the sealing film 49 that is a resin. It can suppress that the adhesive force of a certain 1st contact bonding layer 53 falls. That is, it can suppress that the component contained in the sealing film 49 becomes a catalyst poison, and the hardening of the 1st contact bonding layer 53 is inhibited or that adhesive force falls. As a result, peeling of the compliance substrate 28 can be suppressed, and the reliability of the recording head 3 and thus the reliability of the printer 1 can be improved. Although it is conceivable that the compliance substrate 28 and the communication substrate 24 are bonded only by the second adhesive layer 54, as described above, when shear stress is generated between the communication substrate 24 and the compliance substrate 28. The compliance substrate 28 may be peeled off from the communication substrate 24. In addition, an epoxy adhesive having a low Young's modulus may be used as the second adhesive layer 54. However, such an adhesive has a low crosslinking density and may swell when exposed to ink. On the other hand, in this embodiment, sealing is performed via the first adhesive layer 53 that is a silicone-based adhesive and the second adhesive layer 54 that is an epoxy-based adhesive having a higher Young's modulus. Since the film 49 is bonded to the communication substrate 24, it is difficult to swell even when exposed to ink, and the shear stress between the communication substrate 24 and the compliance substrate 28 can be increased.

  In the present embodiment, a silicone-based adhesive is used as a portion of the adhesive that is exposed to ink other than the joint between the compliance substrate 28 and the communication substrate 24. Specifically, the joint portion between the communication substrate 24 and the nozzle plate 21, the joint portion between the head case 16 and the communication substrate 24, and the joint portion between the communication substrate 24 and the pressure chamber forming substrate 29 are silicone-based. Bonded with adhesive.

  Next, a manufacturing method of the liquid jet head, particularly a method of bonding the nozzle plate 21 and the compliance substrate 28 to the communication substrate 24 will be described in detail. 5 to 10 are state transition diagrams in the region A for explaining a method of bonding the nozzle plate 21 and the compliance substrate 28 to the communication substrate 24. FIG. Note that the adhesive application method in the present embodiment employs a transfer method in which the adhesive is once transferred to the film 55 and the adhesive on the film 55 is transferred to the communication substrate 24 or the compliance substrate 28.

  First, in the first adhesive layer 53 curing step, the first adhesive layer 53 made of a silicone-based adhesive is formed on the lower surface of the communication substrate 24, and the nozzle plate 21 is pressed against the lower surface of the communication substrate 24 to perform the first operation. The adhesive layer 53 is cured. More specifically, a first adhesive layer forming step for forming a semi-cured first adhesive layer 53 having a degree of curing from a liquid state on the lower surface of the communication substrate 24, and then a semi-cured first adhesive. A main curing step of main curing the layer 53 is performed.

  More specifically, as shown in FIG. 5, in the first adhesive layer forming step, a silicone-based adhesive containing an epoxy group (hereinafter referred to as a first adhesive 53 ′) is transferred onto the film 55. Specifically, although not shown, a screen plate is disposed on the stage, and the first adhesive is placed at a predetermined position on the stage by applying a liquid first adhesive 53 'and squeegeeing it. 53 'is arranged. The film 55 is brought into contact with the first adhesive 53 ′ on the stage, and the first adhesive 53 ′ is transferred to the film 55. As a result, as shown in FIG. 5, a liquid first adhesive 53 ′ is formed on the film 55. In this state, the film 55 is placed on, for example, a hot plate or the like and heated to such an extent that the first adhesive 53 ′ is not fully cured. As a result, the first adhesive 53 ′ is semi-cured, and the fluidity of the first adhesive 53 ′ is suppressed. For example, the viscosity of the first adhesive 53 ′ is several tens of Pa · s to several hundred Pa · s. The semi-cured first adhesive 53 ′ is transferred to the lower surface of the communication substrate 24. That is, as shown in FIG. 6, the film 55 is attached to the communication substrate 24 with the surface on which the first adhesive 53 ′ is formed facing the lower surface of the communication substrate 24. In FIG. 6, the lower surface of the communication substrate 24 (the surface on which the first adhesive layer 53 is formed) faces downward, but actually, the lower surface of the communication substrate 24 faces upward. In this state, the film 55 is brought close to the communication substrate 24 from above to bring the first adhesive 53 ′ into contact with the communication substrate 24. Next, as shown in FIG. 7, the film 55 is peeled off from the communication substrate 24. As a result, the semi-cured first adhesive layer 53 is formed in a region other than the region that becomes the common liquid chamber 25 (that is, the lower surface side opening of the common liquid chamber 25) on the lower surface of the communication substrate 24. In this way, by making the first adhesive layer 53 in a semi-cured state, the epoxy group is likely to remain on the surface of the first adhesive layer 53 after being transferred to the communication substrate 24.

  Thereafter, as shown in FIG. 8, in the main curing step, the nozzle plate 21 is pressed against the lower surface of the communication substrate 24 with the relative positions of the communication substrate 24 and the nozzle plate 21 being matched. That is, the semi-cured first adhesive layer 53 is sandwiched between the communication substrate 24 and the nozzle plate 21, and the nozzle plate 21 and the communication substrate 24 are pressed toward each other. By heating in this state, the first adhesive layer 53 in a semi-cured state is fully cured. As a result, the nozzle plate 21 is bonded to the communication substrate 24. Moreover, the area | region which remove | deviated from the nozzle plate 21 among the lower surfaces of the communication board | substrate 24 is the state which the 1st contact bonding layer 53 of the state hardened | cured is exposed.

  Next, second adhesive layer curing is performed in which the second adhesive layer 54 is cured with the first adhesive layer 53 and the second adhesive layer 54 sandwiched therebetween to bond the communication substrate 24 and the compliance substrate 28. Move to the process. Specifically, first, either the surface of the first adhesive layer 53 laminated on the communication substrate 24 or the surface of the compliance substrate 28 facing the communication substrate 24 (that is, the sealing film 49). Then, a second adhesive layer 54 made of an epoxy adhesive is formed. In the present embodiment, as shown in FIG. 9, a liquid second adhesive layer 54 is applied to a predetermined position on the sealing film 49 of the compliance substrate 28 by, for example, a transfer method. When the second adhesive layer 54 is applied on the compliance substrate 28 side as in the present embodiment, the application of the second adhesive layer 54 can be performed in parallel with the first adhesive layer curing step. .

  Thereafter, as shown in FIG. 10, the compliance substrate 28 on which the second adhesive layer 54 is formed is brought close to the communication substrate 24 side, and the compliance substrate 28 is bonded to the communication substrate 24. That is, the communication substrate 24 and the compliance substrate 28 are sandwiched between the communication substrate 24 and the compliance substrate 28 with the first adhesive layer 53 in a fully cured state and the second adhesive layer 54 in a liquid state interposed therebetween. Press in the approaching direction. Here, since the surface of the first adhesive layer 53 has higher liquid repellency than the surface of the communication substrate 24, the epoxy adhesive forming the second adhesive layer 54 is pushed out by pressing, It can suppress flowing out to the communication substrate 24 side. In addition, since the first adhesive layer 53 includes an epoxy group, the adhesion between the first adhesive layer 53 and the second adhesive layer 54 can be improved.

  Then, the communication substrate 24 and the compliance substrate 28 are heated in a pressed state, and the second adhesive layer 54 in the liquid state is fully cured. At this time, the compliance substrate 28 and the communication substrate 24 expand due to heating. As described above, the compliance substrate 28 is composed of the fixed substrate 50 made of SUS and the sealing film 49 made of resin, and the communication substrate 24 is composed of a silicon single crystal substrate. Therefore, the degree of expansion differs between the two. Specifically, the compliance substrate 28 expands larger than the communication substrate 24. Then, since the second adhesive layer 54 is cured in this expanded state, after that, when the heating is stopped and the compliance substrate 28 and the communication substrate 24 are cooled to room temperature, the shear between the compliance substrate 28 and the communication substrate 24 is sheared. Stress is generated. However, in the present embodiment, the second adhesive layer 54 and the first adhesive layer 53 having a Young's modulus lower than that of the second adhesive layer 54 are provided between the compliance substrate 28 and the communication substrate 24. This shear stress can be relaxed. That is, the shear stress can be relaxed by the first adhesive layer 53 provided between the second adhesive layer 54 and the communication substrate 24. As a result, the compliance substrate 28 can be prevented from being peeled off from the communication substrate 24. That is, the communication substrate 24 can be firmly bonded to the compliance substrate 28. In this way, the flow path unit 15 is created.

  When the flow path unit 15 is manufactured, the actuator unit 14 and the flow path unit 15 are joined. Then, by joining the flow path unit 15 to which the actuator unit 14 is joined to the lower surface of the head case 16, the actuator unit 14 is accommodated in the accommodation space 17 and the recording head 3 is created. In addition, the timing which joins the nozzle plate 21 and the compliance board | substrate 28 to the communication board | substrate 24 is not restricted to above-described embodiment. For example, the actuator unit 14 can be bonded to the communication substrate 24 before the nozzle plate 21 and the compliance substrate 28 are bonded to the communication substrate 24. Furthermore, the actuator unit 14 and the head case 16 can be bonded to the communication substrate 24 before the nozzle plate 21 and the compliance substrate 28 are bonded to the communication substrate 24.

  As described above, since the first adhesive layer 53 is cured before the compliance substrate 28 is bonded to the communication substrate 24, the first adhesive layer 53 is bonded by the components contained in the sealing film of the compliance substrate 28. It can suppress that power falls. Moreover, since the 1st contact bonding layer 53 was formed in the communication board | substrate 24 in the semi-hardened state, and was hardened after that, it can suppress that an epoxy group moves from the surface of the 1st contact bonding layer 53 to an inside. That is, by setting the first adhesive layer 53 in a semi-cured state, the fluidity of the adhesive can be suppressed and the movement of the epoxy group can be suppressed. As a result, an epoxy group can be left on the surface of the first adhesive layer 53 after the main curing, and the adhesion between the first adhesive layer 53 and the second adhesive layer 54 can be improved.

  Incidentally, in the above-described embodiment, the compliance substrate 28 is configured by the fixed substrate 50 and the sealing film 49, but is not limited thereto. For example, a compliance substrate made of only a resin in which the plate thickness in the region corresponding to the common liquid chamber is thinned by etching or the like and the plate thickness in other regions is thickened may be employed. In this case, the compliance substrate is the second substrate in the present invention. Further, in the above-described embodiment, the communication substrate 24 and the nozzle plate 21 are bonded via the first adhesive layer 53, but the present invention is not limited to this. For example, the communication substrate 24 and the nozzle plate 21 can be bonded via another adhesive (adhesive layer). Furthermore, in the above-described embodiment, the recording head 3 in which the drive IC 34 is provided on the sealing plate 33 is illustrated, but the present invention is not limited to this. For example, a configuration in which a driving circuit is formed on the sealing plate itself without providing a driving IC on the sealing plate may be employed.

  In addition, when an addition reaction type silicone adhesive containing a curing accelerating catalyst for accelerating the curing of the adhesive is used as the first adhesive layer 53, a promoter layer is formed in a region where the first adhesive layer 53 is laminated. It is desirable to provide For example, in the second embodiment shown in FIG. 11, the promoter layer 56 is provided on the lower surface of the communication substrate 24. FIG. 11 is an enlarged cross-sectional view of a main part of the recording head 3 in the second embodiment.

  Specifically, as shown in FIG. 11, a promoter layer 56 is formed in a region where the first adhesive layer 53 is laminated on the lower surface of the communication substrate 24. In the present embodiment, the promoter layer 56 is also formed on the upper surface of the nozzle plate 21 in the region where the first adhesive layer 53 is laminated. In addition, the third adhesive layer 57 that bonds the head case 16 and the communication substrate 24, and the fourth adhesive layer 58 that bonds the pressure chamber forming substrate 29 and the communication substrate 24 are the same as the first adhesive layer 53. Similarly, an addition reaction type silicone adhesive containing a curing accelerating catalyst is used. For this reason, among the upper surface of the communication substrate 24, among the region where the third adhesive layer 57 is stacked, the region where the fourth adhesive layer 58 is stacked, and the lower surface of the pressure chamber forming substrate 29, The co-catalyst layer 56 is also formed in the region where the fourth adhesive layer 58 is laminated.

  Here, the curing accelerating catalyst is for accelerating the curing of the silicone-based adhesive. For example, platinum (Pt) or a catalyst containing platinum (Pt) is preferably used. The co-catalyst layer 56 is a layer that can enhance the effect of the curing accelerating catalyst (that is, the effect of accelerating curing). For example, a layer containing tantalum oxide (TaOx) or tantalum oxide (TaOx) is used. Preferably used. FIG. 12 is a table showing the results of measuring the adhesive strength of an addition reaction type silicone adhesive containing platinum (Pt) using various materials. In the measurement experiment, a SUS surface (TaOx in FIG. 12), a SUS plate (SUS in FIG. 12), an aluminum plate (Al in FIG. 12), and an iron plate (see FIG. Two pieces of Fe) in No. 12 were prepared, and the two plates were bonded using an addition reaction type silicone adhesive containing platinum (Pt), and then the shear strength was measured. The case where the shear strength was 10 MPa or more was evaluated as ◎, the case where the shear strength was 2 MPa or more and less than 10 MPa was evaluated as ◯, and the case where the shear strength was 2 MPa or less was evaluated as ×. As shown in FIG. 13, in all cases of SUS plate (SUS), aluminum plate (Al), and iron plate (Fe). On the other hand, the plate (TaOx) in which tantalum oxide (TaOx) was formed on the surface of SUS was marked with ◎, and it was found that the shear strength was increased. That is, it has been found that when tantalum oxide (TaOx) is present on the surface, the adhesion strength of the addition reaction type silicone adhesive containing platinum (Pt) is increased.

  As described above, since the promoter layer 56 containing tantalum oxide (TaOx) is formed in the lower surface of the communication substrate 24 in the region where the first adhesive layer 53 is laminated, the curing promotion containing platinum (Pt) is performed. The effect of the catalyst (that is, the effect of promoting the curing of the first adhesive layer 53) can be enhanced. Thereby, the adhesive strength by the 1st contact bonding layer 53 can be raised. As a result, the bonding strength between the communication substrate 24 and the compliance substrate 28 and the bonding strength between the communication substrate 24 and the nozzle plate 21 can be increased. Further, since the promoter layer 56 is also formed on the upper surface of the nozzle plate 21 in the region where the first adhesive layer 53 is laminated, the bonding strength between the communication substrate 24 and the nozzle plate 21 can be further increased. . Furthermore, in the present embodiment, since the promoter layer 56 is formed in the region where the third adhesive layer 57 is laminated on the upper surface of the communication substrate 24, the bonding strength between the head case 16 and the communication substrate 24 is increased. Can be increased. The promoter is provided in each of a region where the fourth adhesive layer 58 is laminated on the upper surface of the communication substrate 24 and a region where the fourth adhesive layer 58 is laminated on the lower surface of the pressure chamber forming substrate 29. Since the layer 56 is formed, the bonding strength between the pressure chamber forming substrate 29 and the communication substrate 24 can be increased. The promoter layer 56 is preferably formed on both of the two substrates to be joined, but may be formed only on one of the substrates.

  Each co-catalyst layer 56 is formed using, for example, an ALD method (atomic layer deposition method) or a CVD method before applying an adhesive to the surface of each substrate. The method for forming the cocatalyst layer 56 is not limited to these, and any method may be used as long as it has a high adhesion to the substrate. The cocatalyst layer 56 on the lower surface of the communication substrate 24 and the cocatalyst layer 56 of the nozzle plate 21 are regions where the first adhesive layer 53 is to be laminated before the first adhesion step by ALD or the like. Formed. In addition, the promoter layer 56 on the upper surface of the communication substrate 24 is formed by the ALD method or the like before the third adhesive layer 57 and the fourth adhesive layer 58 are applied to the communication substrate 24. The fourth adhesive layer 58 is formed in a region where the fourth adhesive layer 58 is to be laminated. Further, the co-catalyst layer 56 of the pressure chamber forming substrate 29 is scheduled to be laminated before the fourth adhesive layer 58 is applied to the pressure chamber forming substrate 29 by an ALD method or the like. Formed in the region. The other configuration of the recording head 3 and the manufacturing method of the recording head 3 are the same as those in the first embodiment, and the description thereof is omitted.

  By the way, the region where the promoter layer 56 is formed is not limited to the region where the adhesive layer is laminated. For example, in the third embodiment shown in FIG. 13, the promoter layer 56 is provided on the entire surface including the wall surface of the flow path inside the communication substrate 24. FIG. 13 is an enlarged cross-sectional view of the main part of the recording head 3 in the third embodiment.

  Specifically, as shown in FIG. 13, the upper surface, the side surface, the lower surface of the communication substrate 24 and the inner wall surface of the internal flow path (that is, the common liquid chamber 25, the individual communication path 26 and the nozzle communication path 27) A promoter layer 56 is formed. In addition, the promoter layer 56 is formed on the lower surface and side surfaces of the pressure chamber forming substrate 29 and the inner wall surface of the pressure chamber 30 (including the lower surface of the vibration plate 31). Further, a promoter layer 56 is formed on the upper surface, the side surface, the lower surface of the nozzle plate 21, and the inner wall surface of the nozzle 22. That is, in this embodiment, the promoter layer 56 is formed not only on the region where the adhesive layer is laminated, but also on the inner wall surface of a series of flow paths from the common liquid chamber 25 to the nozzle 22. Thus, by forming the co-catalyst layer 56, the adhesive strength of each adhesive layer can be increased in the region where the adhesive layers are laminated. Further, the promoter layer 56 on the inner wall surface of the flow path functions as a protective film having ink resistance, and can prevent each substrate forming the flow path from being eroded by ink. The other configuration of the recording head 3 and the manufacturing method of the recording head 3 are the same as those in the second embodiment described above, and thus the description thereof is omitted.

  In the above description, the ink jet recording head 3 has been described as an example of the liquid ejecting head, but the present invention can also be applied to other liquid ejecting heads. For example, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material ejecting head used for forming an electrode such as an organic EL (Electro Luminescence) display, FED (surface emitting display), a biochip (biochemical element) The present invention can also be applied to bioorganic matter ejecting heads and the like used in the production of In a color material ejecting head for a display manufacturing apparatus, a solution of each color material of R (Red), G (Green), and B (Blue) is ejected as a kind of liquid. Further, an electrode material ejecting head for an electrode forming apparatus ejects a liquid electrode material as a kind of liquid, and a bioorganic matter ejecting head for a chip manufacturing apparatus ejects a bioorganic solution as a kind of liquid.

DESCRIPTION OF SYMBOLS 1 ... Printer, 2 ... Recording medium, 3 ... Recording head, 4 ... Carriage, 5 ... Carriage moving mechanism, 6 ... Conveying mechanism, 7 ... Ink cartridge, 8 ... Timing belt, 9 ... Pulse motor, 10 ... Guide rod, 14 DESCRIPTION OF SYMBOLS ... Actuator unit, 15 ... Flow path unit, 16 ... Head case, 17 ... Storage space, 18 ... Liquid introduction path, 19 ... Insertion opening, 21 ... Nozzle plate, 22 ... Nozzle, 24 ... Communication substrate, 25 ... Common liquid chamber , 25a ... first liquid chamber, 25b ... second liquid chamber, 26 ... individual communication passage, 27 ... nozzle communication passage, 28 ... compliance substrate, 29 ... pressure chamber forming substrate, 30 ... pressure chamber, 31 ... vibration plate, 32 ... Piezoelectric element, 33 ... Sealing plate, 34 ... Driving IC, 35 ... Driving area, 36 ... Non-driving area, 37 ... Bump electrode, 39 ... Lower side wiring, 41 ... Individual terminal, 42 ... Through terminals, 43 ... photosensitive adhesive, 45 ... through wiring, 46 ... upper surface side wiring, 47 ... IC terminal, 48 ... adhesive, 49 ... sealing film, 50 ... fixed substrate, 51 ... exposed opening, 53 ... first 1 adhesive layer, 53 '... 1st adhesive agent, 54 ... 2nd adhesive layer, 55 ... film, 56 ... co-catalyst layer, 57 ... 3rd adhesive layer, 58 ... 4th adhesive layer

Claims (9)

A first substrate formed in a state where a space serving as a flow path is opened on one surface;
A second substrate made of a resin that seals the opening from the one side surface of the first substrate and partitions the flow path;
The first substrate and the second substrate include a first adhesive layer made of a silicone-based adhesive laminated on the one side surface of the first substrate, and the first adhesive layer. A liquid jet head, which is bonded through a second adhesive layer made of a laminated epoxy adhesive. A third substrate bonded to a region outside the region to which the second substrate is bonded on the one side surface of the first substrate;
The liquid ejecting head, wherein the first substrate and the third substrate are bonded via the first adhesive layer laminated on the one side surface of the first substrate.   The liquid ejecting head according to claim 1, wherein the first adhesive layer includes an epoxy group.   4. The liquid jet head according to claim 1, wherein a Young's modulus of the first adhesive layer is lower than a Young's modulus of the second adhesive layer. 5. The first adhesive layer includes a curing accelerating catalyst containing platinum;
The cocatalyst layer containing tantalum oxide is formed at least in a region where the first adhesive layer is laminated on the one side surface of the first substrate. The liquid ejecting head according to claim 4.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1. A first substrate formed in a state where a space to be a flow path is opened on one side surface, and a resin that seals the opening from the one side surface of the first substrate and partitions the flow path A second substrate comprising: a liquid jet head manufacturing method comprising:
Forming a first adhesive layer made of a silicone-based adhesive on the one side surface of the first substrate, and curing the first adhesive layer;
The first adhesive layer laminated on the first substrate or the surface of the second substrate on the side facing the first substrate is made of an epoxy-based adhesive. Two adhesive layers are formed, and the second adhesive layer is cured in a state where the first adhesive layer and the second adhesive layer are sandwiched between the first substrate and the second substrate, A second adhesive layer curing step for adhering
A method of manufacturing a liquid ejecting head, comprising: The first adhesive layer includes an epoxy group,
In the first adhesive layer curing step, the first adhesive layer is formed by forming the first adhesive layer in a semi-cured state in which the degree of curing has progressed from a liquid state on the one side surface of the first substrate. Process,
The liquid ejecting head manufacturing method according to claim 7, further comprising: a main curing step of performing a main curing of the semi-cured first adhesive layer after the first adhesive layer forming step. The first adhesive layer includes a curing accelerating catalyst containing platinum;
The promoter layer containing tantalum oxide is formed at least in a region where the first adhesive layer is laminated on the one side surface of the first substrate. A method for manufacturing the liquid jet head according to claim 8.

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