JP2018176580A - Liquid ejection head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid ejection head, which is able to highly accurately adjust an amount of projection of a protective member even in a case where a warped support member is used.SOLUTION: First, a support member 1 provided with an adhesive layer 12 for sticking an element substrate 2 and a projection 13 provided around the adhesive layer 12 and capable of being deformed and hardened is formed. Then, the element substrate 2 is sucked by a suction surface 101 of a finger having this suction surface 101 and a reference formation surface 102 substantially parallel to the suction surface 101. Then, while the sucked element substrate 2 is placed on and stuck to a support member 1 via the adhesive layer 12, the projection 13 is pressed and deformed with the reference formation surface 102 and, furthermore, the projection 13 is hardened to form a reference part 14. Thereafter, while a protective member 3 is brought into contact with the reference part 14, the protective member is joined to the support member 1.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a liquid discharge head for discharging a liquid such as ink and a method of manufacturing the same.

In a liquid discharge head used in a liquid discharge apparatus such as an ink jet recording apparatus, the distance between the element substrate for discharging the liquid and the recording medium is shortened to obtain high definition print quality and the like. A technique for enhancing the landing accuracy of the ink on the recording medium has been studied. In addition to this, a technique for providing a liquid discharge head with a protective member which protrudes to the recording medium side further than the element substrate so that the element substrate and the recording medium do not contact and damage the element substrate is also studied. There is. In order to achieve both high-definition print quality and protection of the element substrate by using these techniques, the protrusion amount of the protection member is adjusted with high accuracy to make the distance between the element substrate and the recording medium as small as possible. While shortening, it is necessary to form a protection member which protrudes beyond the element substrate.
Patent Document 1 discloses a liquid discharge head in which a discharge port forming member (element substrate) for discharging a liquid and a protective member are bonded to a substrate (support member) made of stainless steel or the like. In this liquid discharge head, the protective member is made to protrude to the recording medium side more than the element substrate by making the protective member thicker than the discharge port forming member.

JP, 2005-014505, A

In recent years, inexpensive resin materials have attracted attention as materials for supporting members in order to reduce the cost of liquid discharge heads. However, when the support member is formed of a resin material, particularly when the liquid discharge head is long, the support member may be largely warped in the discharge direction of the liquid.
When bonding the element substrate to the warped support member, the heights of all the element substrates may be made uniform by changing the thickness of the adhesive layer for bonding the element substrate and the support member according to the location. Conceivable. Therefore, when bonding the protection member of patent document 1 with respect to the support member which has curvature, in order to make uniform the projection amount of the protection member which protrudes from an element substrate, the adhesion | attachment which adheres a protection member and a support member It is conceivable to change the thickness of the agent layer depending on the place. However, if the thickness of the adhesive layer changes depending on the location, the position in the height direction of the protective member may change due to the difference in the amount of shrinkage when the adhesive is cured. In this case, it is difficult to adjust the amount of protrusion of the protection member with high accuracy, and in some cases, the element substrate may protrude beyond the protection member.

  Therefore, an object of the present invention is to provide a liquid discharge head capable of adjusting the amount of protrusion of the protective member with high accuracy even when a support member having a warp is used, and a method of manufacturing the same.

A method of manufacturing a liquid discharge head according to the present invention is a method of manufacturing a liquid discharge head including an element substrate that discharges liquid, a support member that supports the element substrate, and a protective member that protects the element substrate. A protrusion forming step of forming the support member provided with an adhesive layer for bonding a substrate, and a protrusion which is provided around the adhesive layer and capable of deformation and curing, an adsorption surface, and the adsorption The element substrate is adsorbed by the adsorption surface of the adsorption member having a reference forming surface substantially parallel to the surface, and the adsorbed element substrate is mounted on the support member via the adhesive layer and adhered. A reference forming step of pressing the projection with the reference forming surface to deform the projection and then curing the projection to form a reference, and bringing the protective member into contact with the reference; , Said Characterized in that it comprises a bonding step of bonding the member to the supporting member.
A liquid discharge head according to the present invention comprises a support member, an element substrate for discharging a liquid supported by the support member, and a protection member for protecting the element substrate, wherein the protection member is It is characterized in that it is joined to the support member in a state of being in contact with a reference portion which is a projection provided on the support member.

  According to the present invention, even when a support member having a warp is used, it is possible to adjust the amount of protrusion of the protection member with high accuracy.

FIG. 2 is a view showing a liquid discharge head according to a first embodiment. FIG. 7 is a view showing a finger used in the method of manufacturing a liquid discharge head according to the first embodiment. It is a figure for demonstrating the application | coating process which concerns on 1st Embodiment. It is a figure for demonstrating the reference | standard formation process which concerns on 1st Embodiment. It is a figure for demonstrating the reference | standard formation process which concerns on 1st Embodiment. It is a figure which shows the joining jig used at the joining process which concerns on 1st Embodiment. It is a figure for demonstrating the joining process concerning 1st Embodiment. It is a figure which shows the liquid discharge head which concerns on 2nd Embodiment. It is a figure which shows the support member of the liquid discharge head which concerns on 3rd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, components having the same function may be denoted by the same reference numerals, and the description thereof may be omitted.
First Embodiment
FIG. 1 is a schematic perspective view showing the main part of a liquid discharge head (more specifically, an element substrate used in a liquid discharge head) according to a first embodiment of the present invention. A liquid discharge head 10 shown in FIG. 1 includes a support member 1, an element substrate 2 having a discharge port (not shown) for discharging a liquid, and a protection member 3 for protecting the element substrate 2. The element substrate 2 and the protective member 3 are bonded (bonded) to the support member 1. The element substrate 2 is supported by the support member 1.
The number of element substrates 2 is not particularly limited. In the example of FIG. 1, the three element substrates 2 are arranged in line along the X direction which is the longitudinal direction of the support member 1. Further, the longitudinal direction of the element substrate 2 is along the longitudinal direction of the support member 1.
The protective member 3 is formed to surround the element substrate 2. The protective member 3 protrudes further than the element substrate 2 in the Z direction which is the height direction. The Z direction is substantially parallel to the discharge direction in which the element substrate 2 discharges the liquid.

Hereinafter, a method of manufacturing the liquid discharge head 10 shown in FIG. 1 will be described. In the method of manufacturing the liquid discharge head 10, a coating step of applying an adhesive to the support member 1 and a reference formation of bonding the element substrate 2 to the support member 1 and forming a reference portion to be a reference of the position of the protective member 3 And a bonding step of bonding the protective member 3 to the support member 1.
FIG. 2 is a schematic view schematically showing a finger used in the method of manufacturing a liquid discharge head according to the present embodiment. Fig.2 (a) is a schematic perspective view which shows a finger, FIG.2 (b) is a schematic front view which shows a finger. In addition, in FIG. 2, the finger of the inversion state which upside down was used is shown.
The finger 100 shown in FIG. 2 is a suction member used when the element substrate 2 is suctioned (held) and placed on the support member 1 in the reference formation step. The finger 100 has a main body portion 100 a and a suction surface 101 and a reference forming surface 102 formed on the main body portion 100 a. The suction surface 101 and the reference forming surface 102 project downward in the direction of gravity than the main body 100 a in the use state.
The adsorption surface 101 is a surface for adsorbing the element substrate 2. In the suction surface 101, suction holes 101a for suctioning the element substrate are formed. A plurality of suction holes 101a are provided in parallel in two rows in the illustrated example, but the present invention is not limited to this example. The element substrate 2 is adsorbed to the adsorption surface 101 by suctioning air from the adsorption holes 101 a.
The reference forming surface 102 is a surface for forming a reference portion which becomes a reference of the position of the protective member 3 in the Z direction when the protective member 3 is joined to the support member 1. The reference forming surfaces 102 are provided on both sides of the suction surface 101 in the Y direction which is the lateral direction of the support member 1 when the finger 100 is used. The position of the reference forming surface 102 in the X direction is not particularly limited, but in the present embodiment, the center of the suction surface 101 and the center of the reference forming surface 102 provided on both sides are aligned in a straight line along the Y direction. There is. Note that two or more reference formation surfaces 102 may be provided.
The suction surface 101 and the reference forming surface 102 are substantially parallel to each other. The inter-plane distance d, which is the difference between the height (position in the Z direction) of the suction surface 101 and the reference formation surface 102, defines the height of the reference portion as described later. Further, as described later, since the protective member 3 is joined to the support member 1 while being in contact with the reference portion in the joining process, the height of the reference portion defines the amount of protrusion of the protective member 3 in the Z direction. Therefore, by adjusting the inter-plane distance d, it is possible to adjust the amount of protrusion of the protective member 3. In the present embodiment, the inter-plane distance d is substantially the same as the thickness of the element substrate 2. Here, “substantially the same” means that the difference between the inter-plane distance d and the thickness of the element substrate 2 is within ± 50 μm.

Next, the manufacturing process of the liquid discharge head will be described.
First, an application step of applying an adhesive to the support member 1 will be described. FIG. 3 is a view for explaining the coating process. Specifically, FIG. 3 (a) is a schematic perspective view showing the support member after the end of the coating process, and FIG. 3 (b) is a schematic front view showing the support member after the end of the coating process. FIG.3 (c) is a schematic top view which shows the support member after completion | finish of a coating process.
As shown in FIG. 3, the support member 1 is provided with a supply port 11 for supplying a liquid to the element substrate 2. The position, shape and number of the supply ports 11 are not particularly limited. In the present embodiment, in order to bond the element substrate 2 to the support member 1 for each supply port 11, the three supply ports 11 are arranged in a straight line along the X direction which is the longitudinal direction of the support member 1.
The material of the support member 1 is a resin material in the present embodiment. More specifically, the material of the support member 1 is a resin material filled with a filler to reduce the linear expansion coefficient. When the support member 1 is formed of a resin material, the support member 1 may be bent in the Z direction as shown in FIG. 3 (b).
The application step is also a projection forming step of forming the support member 1 having the adhesive layer 12 for bonding the element substrate 2 and the projection 13 provided around the adhesive layer 12. Specifically, in the application step, the adhesive is applied to the support member 1 to form the adhesive layer 12 and the protrusion 13 on the support member 1.
The adhesive layer 12 is formed to surround each supply port 11. The type of adhesive forming the adhesive layer 12 is selected according to the curing means for curing the adhesive and the height required for the adhesive layer 12. In the present embodiment, the adhesive layer 12 is formed of a thermosetting adhesive.
The height h1 of the adhesive layer 12 is determined so that when the element substrate 2 is bonded to the support member 1 via the adhesive layer 12, all the element substrates 2 can be aligned to the same height. Ru. The parameters for determining the height h1 of the adhesive layer 12 include, for example, the amount of warpage and flatness of the support member 1 in the height direction, the thickness tolerance and flatness of the element substrate, the inclination of the finger 5 during use, etc. Can be mentioned. In the present embodiment, the height h1 of the adhesive layer 12 is 0.2 mm.

The protrusions 13 are formed of a material that can be deformed and cured. The type of material forming the protrusions 13 is selected according to the curing means, the required height and the hardness after curing. The protrusion 13 may be formed of the same material as the adhesive layer 12 or may be formed of a different material, but in the present embodiment, the same material (thermosetting adhesive) as the adhesive layer 12 is used. It is formed. For example, a composition is prepared, and those manufactured using this composition are considered to be formed of the same material.
The protrusion 13 is deformed in a reference formation process described later, and is formed as a reference part which becomes a reference of the position of the protection member 3 in the Z direction. Specifically, when the element substrate 2 adsorbed on the suction surface 101 of the finger 100 shown in FIG. 2 is placed on the supply port 11, the protrusion 13 is formed by the reference forming surface 102 of the finger 100. It is formed as a reference part by being pressed and further cured. Therefore, when the element substrate 2 is placed on the supply port 11, the protrusion 13 is formed at a position in contact with the reference forming surface 102. In the example of the figure, each of the supply ports 11 is formed in the Y direction which is the short direction of the support member 1 so that the reference portion is formed on each of the two reference forming surfaces 102 of the finger 100 for each supply port 11. It is provided on both sides. Therefore, the protrusions 13 are formed at six locations on the support member 1.
The arrangement and number of the protrusions 13 are not limited to the examples shown in the drawings. The protrusions 13 may be formed at three or more places in total on both sides of the supply port 11 in the Y direction. The protrusion 13 is arranged such that the distance between the protrusion 13 and the outer periphery of the bonding area 3a is L / 2 or less, where L is the length in the X direction of the bonding area 3a to which the protective member 3 is bonded. Is preferred. This is to suppress the tilting of the protective member 3 when joining the protective member 3 to the support member 1.
The height h2 of the protrusion 13 is h1-d or more if it is the inter-plane distance d which is the difference between the height (position in the Z direction) of the suction surface 101 of the finger 100 and the reference forming surface 102. good. In the present embodiment, the height h2 of the protrusion 13 is h2 = 0.2 mm (= h1).

Subsequently, the reference forming step will be described.
FIG. 4 and FIG. 5 are diagrams for explaining the reference forming process. Specifically, FIG. 4 (a) is a schematic perspective view showing the liquid discharge head in the reference forming process, and FIG. 4 (b) is a schematic front view showing the liquid discharge head in the reference forming process. . FIG. 4C is a schematic perspective view showing the liquid discharge head in the reference forming process. FIG. 5A is a schematic perspective view showing the liquid discharge head after completion of the reference formation process, and FIG. 5B is a schematic front view showing the liquid discharge head after completion of the reference formation process.
In the reference forming step, first, the element substrate 2 is adsorbed on the adsorption surface 101 of the finger 100, and the adsorbed element substrate 2 is placed on the supply port 11 of the support member 1 on which the adhesive layer 12 and the projection 13 are formed. It is placed via the adhesive layer 12. Then, while the adhesive layer 12 is heated to bond the element substrate 2 with the support member 1 via the gap (adhesive layer 12), the projection 13 is deformed while being pressed by the reference forming surface 102 of the finger 100. Then, the projection 13 is formed as the reference portion 14 by heating and curing the projection 13 after deformation.
Assuming that the inter-plane distance, which is the difference in height between the suction surface 101 of the finger 100 and the reference formation surface 102 in the Z direction, is d, as described above, the inter-plane distance d from the upper surface of the element substrate 2 Only formed lower. In the present embodiment, the height of the reference portion 14 is made the same as that of the adhesive layer 12 as described above in order to reduce the difference in the cure contraction amount which is the contraction amount due to the curing of the adhesive layer 12 and the protrusion 13. There is.
The amount of warpage of the support member 1 is measured in advance by a laser displacement meter or the like so that the height of the adhesive layer 12 and the protrusion 13 in the Z direction becomes a desired value at the place where the warpage of the support member 1 is the smallest. It is adjusted by controlling the finger 100 based on the amount of warpage.
By repeating the above steps for each supply port 11, as shown in FIG. 5, a reference portion 14 is formed which is smaller from the upper surface of the element substrate 2 by the distance d between the surfaces, that is, smaller by the thickness of the element substrate 2. The liquid discharge head 10 can be formed.

The heating of the adhesive layer 12 and the protrusion 13 is performed by heating the finger 100. The heating temperature and heating time of the finger 100 are appropriately set according to the type of adhesive used for the adhesive layer 12 and the protrusion 13. In the present embodiment, the heating temperature is 150 ° C., and the heating time is 60 s. Although the shape of the reference part 14 is a cylindrical shape in FIG. 5, it is not limited to this example. It is preferable that the reference | standard part 14 is a linear protrusion along the X direction which is a longitudinal direction of the supporting member 1, from a viewpoint of suppressing a deformation | transformation of the protection member 3 mentioned later. This can be realized by forming the protrusions 13 linearly along the X direction.
In FIG. 5, the positions of the upper surfaces of all the reference portions 14 are substantially aligned, but in fact, they are slightly shifted due to the difference in the cure shrinkage amount due to the difference in the stopping accuracy of the finger 100 and the height of the reference portions 14 . In the subsequent bonding step, the protective member 3 is positioned in the Z direction by contacting the three reference portions 14 having the highest height in the Z direction, that is, the most projecting portions of the reference portions 14. At this time, if the center of gravity of the support member 1 is not included in the virtual region which is the region connecting the three projecting standard portions 14 by virtual straight lines, the protection member is used as the support member 1 in the later bonding step. At the time of joining, there is a possibility that the support member 1 falls. In this case, the protective member 3 is inclined and joined to the support member 1.
For this reason, in order to prevent the support member 1 and the protection member from being inclined and joined, the center of gravity of the support member 1 is included in the virtual region connecting the three projecting reference portions 14. It is preferable to form In the present embodiment, three reference portions 14 out of the six reference portions 14 are intentionally projected more than the other reference portions 14 so that the center of gravity of the support member 1 is included in the virtual area. This is realized, for example, by forming the three reference portions 14 to be projected more than the other reference portions 14 by setting the stop position of the finger 100 in the Z direction higher than that of the other reference portions 14. it can.

Next, a bonding step of bonding the protective member to the support member 1 will be described. 6 and 7 are views for explaining the bonding process. Specifically, FIG. 6 is a schematic perspective view showing a joining jig for joining the protective member to the support member. FIG. 7A is a schematic perspective view showing the liquid discharge head in the bonding process, and FIG. 7B is a schematic front view showing the liquid discharge head in the bonding process.
As shown in FIG. 6, in the bonding jig 20, suction holes (not shown) for fixing (sucking) the protective member 3 are formed, and the protective member 3 is formed by suctioning air from the suction holes. Adsorb. At this time, as shown in FIG. 7B, the bonding jig 20 is fixed so that the protective surface 3 b of the protective member 3 for protecting the element substrate 2 faces downward, ie, the protective surface 3 b contacts the bonding jig 20. Since the protective member 3 is formed so as to surround the element substrate 2 as shown in FIG. 1, the recess 20 a is formed so that the region surrounded by the protective member 3 of the bonding jig 20 does not abut the element substrate 2. It is formed.
When the protective member 3 is fixed to the bonding jig 20, as shown in FIG. 7, the liquid discharge head 10 is placed on the bonding jig 20 with the element substrate 2 facing downward and the element substrate 2 in the recess 20a of the bonding jig 20. Place to fit. Thereby, the protection member 3 abuts only on the reference portion 14 on the support member 1. Further, an adhesive agent is applied to an adhesion area of the support member 1 to be adhered to the protective member 3 to form an adhesive layer 15 in advance. Although the kind of adhesive which forms the adhesive layer 15 is not specifically limited, In this embodiment, it is a thermosetting adhesive.
The protective layer 3 and the support member 1 are bonded by heating and curing the adhesive layer 15 in a state where the liquid discharge head 10 is placed on the bonding jig 20. The amount of protrusion of the protective member 3 is defined by the thickness of the protective member 3 and the inter-surface distance d which is the difference between the suction surface 101 of the finger 100 and the height of the reference forming surface 102. In the present embodiment, the thickness of the protective member 3 is 0.5 mm.

According to the present embodiment described above, the support member provided with the adhesive layer 12 for bonding the element substrate 2 and the projection 13 provided around the adhesive layer 12 and capable of deformation and curing. 1 is formed. Thereafter, the element substrate 2 is adsorbed by the suction surface 101 of a finger having the suction surface 101 and the reference formation surface 102 substantially parallel to the suction surface 101. Then, while attaching and adhering the adsorbed element substrate 2 to the support member 1 via the adhesive layer 12, the protrusion 13 is pressed and deformed by the reference forming surface 102, and the protrusion 13 is further cured. To form the reference portion 14. Thereafter, the protective member 3 is joined to the support member 1 while being in contact with the reference portion 14.
As a result, while the element substrate 2 adsorbed on the adsorption surface 101 is placed on the support member 1, the projection 13 is pressed and deformed on the reference formation surface 102 to form the reference portion 14, and the protection member 3 is formed. It is joined to the support member 1 in a state of being in contact with the reference portion 14. Therefore, the amount of protrusion of the protective member 3 is defined by the height of the reference portion 14, and the height of the reference portion 14 is adjusted with high accuracy by adjusting the difference in height between the suction surface 101 and the reference formation surface 102. can do. Therefore, even when the support member 1 having a warp is used, the amount of protrusion of the protection member 3 can be adjusted with high accuracy. In addition, even if a force is applied to the protective member 3 due to the difference in the amount of curing and shrinkage of the adhesive layer 15, the deformation of the protective member 3 can be suppressed because it is supported by the reference portion.
Further, in the present embodiment, three or more reference portions 14 are provided, so that it is possible to support the protection member at three or more points. For this reason, it becomes possible to suppress that the protection member 3 inclines in a joining process, and the support member 1 and the protection member 3 are shifted and joined. Therefore, it becomes possible to adjust the projection amount of the protection member 3 more accurately.
Further, in the present embodiment, the center of gravity of the support member 1 is included in a region where the three projecting reference portions of the reference portions 14 are connected by a straight line. For this reason, it is possible to suppress that the support member 1 tilts in the joining step and the support member 1 and the protective member 3 are shifted and joined. Therefore, it becomes possible to adjust the projection amount of the protection member 3 more accurately.
Further, in the present embodiment, the protrusions 13 are formed of the adhesive layer 12 in the lateral direction of the support member 1 so as to be pressed by each of the reference forming surfaces 102 provided on both sides of the suction surface 101 of the finger 100. It is provided on both sides. Thus, the reference portions 14 can be formed simultaneously on both sides of the element substrate 2.
Further, in the present embodiment, since the protrusion 13 and the adhesive layer 12 are formed of the same material, it becomes possible to simultaneously form the protrusion 13 with the adhesive layer 12.

Second Embodiment
FIG. 8 is a schematic perspective view showing the liquid discharge head of the present embodiment. FIG. 8 shows the liquid discharge head after completion of the reference formation process. The liquid discharge head 10a of the present embodiment shown in FIG. 8 differs from the liquid discharge head 10 of the first embodiment shown in FIG. Specifically, in the liquid discharge head 10 of the first embodiment, the longitudinal direction of the element substrate 2 is provided along the longitudinal direction of the support member 1. However, the liquid discharge head 10 a of the present embodiment is an element The longitudinal direction of the substrate 2 is provided along the lateral direction of the support member 1. Even in such a case, it is possible to manufacture the liquid discharge head 10a in which the protrusion amount of the protection member is adjusted with high accuracy as in the first embodiment. Such a liquid ejection head 10 a is suitable for ejecting ink of different colors from each of the element substrates 2.

Third Embodiment
FIG. 9 is a schematic perspective view showing the support member of the present embodiment. In FIG. 9, the support member after the end of the coating process is shown.
In the first embodiment, the reference portion 14 is formed by curing the projection 13 formed of the adhesive shown in FIG. The supporting member 1 of the present embodiment shown in FIG. 9 is provided with a protrusion 13 a made of resin instead of the protrusion 13. The resin forming the projection 13a may be any resin that can be deformed and cured. For example, the resin forming the protrusion 13a may be a thermosetting resin or a thermoplastic resin. In the present embodiment, the protrusion 13a is formed of a thermoplastic resin.
The protrusion 13 a may be formed when the support member 1 is molded, or may be adhered to the support member 1 after the support member 1 is molded. The height of the protrusion 13a is the same as the height of the protrusion 13 of the first embodiment.
In the reference formation step, as the element substrate 2 adsorbed on the suction surface 101 of the finger 100 is lowered with respect to the support member 1, the reference formation surface 102 of the finger 100 abuts on the projection 13 a. In this state, the finger 100 is further lowered while heating and melting the protrusion 13a, whereby the protrusion 13a is deformed. Thereafter, when the adhesive layer 12 reaches a desired height, the adhesive layer 12 is heated to adhere the element substrate 2 to the support member 1. After the element substrate 2 is bonded, the projection 13 a is cured by cooling the reference forming surface 102 of the finger 100 to form the projection 13 a as the reference 14.
By repeating the above steps for each supply port 11, the liquid discharge head 10 shown in FIG. 1 can be manufactured.
In the present embodiment, since the reference portion 14 can be formed of a material different from that of the adhesive layer 12, a desired reference portion can be easily formed.

  In each embodiment described above, the illustrated configuration is merely an example, and the present invention is not limited to the configuration.

Reference Signs List 1 support member 2 element substrate 3 protective member 10, 10a liquid discharge head 12 adhesive layer 13, 13a protrusion 14 reference portion 100 finger 101 suction surface 102 reference formation surface

Claims (9)

A method of manufacturing a liquid discharge head, comprising: an element substrate for discharging a liquid; a support member for supporting the element substrate; and a protective member for protecting the element substrate.
A protrusion forming step of forming the support member provided with an adhesive layer for bonding the element substrate, and a protrusion which is provided around the adhesive layer and which can be deformed and cured;
The element substrate is adsorbed by the adsorption surface of an adsorption member having an adsorption surface and a reference formation surface substantially parallel to the adsorption surface, and the adsorbed element substrate is placed on the support member via the adhesive layer. A reference forming step of pressing the projection with the reference forming surface to deform the projection while curing and forming the projection as a reference;
And a bonding step of bonding the protective member to the support member while bringing the protective member into contact with the reference portion.   The method of manufacturing a liquid discharge head according to claim 1, wherein three or more reference portions are provided.   The liquid according to claim 2, wherein, in the reference forming step, the reference portion is formed such that the center of gravity of the support member is included in a region connecting the three projecting most reference portions of the reference portions by straight lines. Method of manufacturing a discharge head.   4. The projection according to claim 1, wherein the projections are provided on both sides of the adhesive layer in the lateral direction of the support member so as to be pressed by each of the reference forming surfaces provided on both sides of the suction surface. The manufacturing method of the liquid discharge head of any one of these.   The method for manufacturing a liquid discharge head according to any one of claims 1 to 4, wherein the protrusion is formed of a thermosetting adhesive.   The method for manufacturing a liquid discharge head according to any one of claims 1 to 4, wherein the protrusion is formed of a thermosetting resin.   The method for manufacturing a liquid discharge head according to any one of claims 1 to 7, wherein the protrusion is formed of a thermoplastic resin.   The method of manufacturing a liquid discharge head according to any one of claims 1 to 4, wherein the protrusion is formed of the same material as the adhesive layer. A liquid discharge head comprising: a support member; an element substrate for discharging a liquid supported by the support member; and a protection member for protecting the element substrate.
The liquid discharge head according to claim 1, wherein the protective member protrudes from the element substrate and is joined to the support member in a state of being in contact with a reference portion which is a projection provided on the support member.

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