JP2004358903A - Method and apparatus for laminating materials to be laminated - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To always stably laminate materials to be laminated irrespective of the existence of dust and internal stress with respect to a method for laminating the materials in which the materials are bonded together and laminated and a lamination apparatus. <P>SOLUTION: In the method for laminating the materials, a resin 16 to be laminated formed on a first substrate 20 and a second substrate 30A are laminated and joined to each other. By ejecting a pressurized fluid from an ejection hole 66B while the periphery 30b of the second substrate 30A is attracted to a channel for attraction 62B, the second substrate 30A is forcibly deformed to be convex toward the first substrate 20. In this state, the first substrate 20 (resin 16) is joined to the second substrate 30A. Even when the second substrate 30A is warped or inclined, the warpage and the inclination are eliminated by deforming the second substrate forcibly, so that the substrates 20 and 30A can surely be joined together. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and a device for laminating objects to be laminated, and more particularly to a method and an apparatus for laminating objects to be joined by joining a plurality of objects to be laminated.
[0002]
[Prior art]
2. Description of the Related Art In general, various functional elements and devices are produced by laminating a plurality of laminated bodies made of a resin or other material. For example, when manufacturing a micro device, a stacked body having a predetermined pattern is formed using a mold, and a plurality of the stacked bodies are stacked to manufacture a micro device (for example, Patent Document 1). .
[0003]
FIG. 1 is a view for explaining a conventional method of laminating an object to be laminated and a laminating apparatus used for the method. In the drawing, a first substrate 1 and a second substrate 2 are stacked bodies on which a stacking process is performed.
[0004]
The laminating apparatus for laminating the first and second substrates 1 and 2 has a first support 3 for supporting the first substrate 1 and a second support 4 for supporting the second substrate 2. are doing. The first support 3 and the second support 4 are configured to be close to each other. In the drawings, for convenience of explanation, components other than the first and second supports 3 and 4 of the laminating apparatus are not shown.
[0005]
The first support 3 is provided with a suction hole 5, and the second support 4 is provided with a suction hole 6. Each of the suction holes 5 and 6 is connected to a suction device, and thus generates a suction force. The first substrate 1 is supported by the first support base 3 by the suction force generated by the suction holes 5, and similarly, the second substrate 2 is supported by the second support table 4 by the suction force generated by the suction holes 6. Is done.
[0006]
In order to stack the first substrate 1 and the second substrate 2, first, each of the substrates 1 and 2 is supported by each of the support bases 3 and 4, and an adhesive is applied to opposing surfaces of the substrates 1 and 2. . Then, the first support 3 and the second support 4 are moved so as to approach each other, and the first substrate 1 and the second substrate 2 are brought into contact with each other. Then, the first substrate 1 and the second substrate 2 are joined by a method such as fusion. Thereby, the first substrate 1 and the second substrate 2 are joined, and a laminated body is manufactured.
[0007]
[Patent Document 1]
JP 2002-323632 A
[0008]
[Problems to be solved by the invention]
In the case where the above-described conventional method and apparatus for laminating the objects to be laminated are employed, the first substrate 1 and the second substrate 2 do not have any deformation such as warpage, and the dust 7 does not exist in the environment where the lamination process is performed. In this case, high-precision multilayer processing can be performed.
[0009]
However, at the time of laminating the first substrate 1 and the second substrate 2, as shown in FIG. 2A, between the first substrate 1 and the first support 3, and between the first substrate 1 and the second support 2. The dust 7 may enter the space between the second support 4 and the second support 4. In this case, as illustrated, the first and second substrates 1 and 2 are inclined with respect to the mounting surfaces of the first and second support tables 3 and 4.
[0010]
As described above, when the first and second substrates 1 and 2 are joined by the dust 7 in an inclined state, the first substrate 1 and the second substrate 2 are connected as shown in FIG. A large space is generated between the substrates, and it is impossible to join the substrates 1 and 2 at this space.
[0011]
If the second substrate 2 is made of a plurality of materials, an internal stress is generated by heat application or the like. As described above, when the internal stress is generated inside the substrate, as shown in FIG. 2B, the first substrate 1 and the second substrate 2 are deformed such as warpage. Further, even if the substrate is made of a single material, if it is a resin sheet or the like, it is difficult to obtain a really smooth surface, and the substrate has deformation.
[0012]
As described above, when the first and second substrates 1 and 2 are joined in a state where deformation exists due to the internal stress, the first substrate 1 and the second substrate 1 are also joined as shown in FIG. 2, a portion largely separated occurs, and it becomes impossible to join the substrates 1 and 2 at this separated position. As described above, the conventional method and apparatus for laminating a stacked body has a problem that a highly reliable lamination process cannot be performed.
[0013]
The present invention has been made in view of the above points, and an object of the present invention is to provide a method and an apparatus for stacking a stacked body, which can always stably stack the stacked bodies regardless of the presence of dust or internal stress. And
[0014]
[Means for Solving the Problems]
In order to solve the above problems, the present invention is characterized by taking the following means.
[0015]
The invention according to claim 1 is
In a method of laminating a stacked body in which a first stacked body and a second stacked body are stacked and joined,
While deforming at least one of the laminated bodies themselves or the member to which the one laminated body is attached to the first laminated body or the second laminated body so as to be convex toward the other laminated body. And bonding the first stacked body and the second stacked body.
[0016]
According to the above invention, at the time of joining the first laminated body and the second laminated body, at least one laminated body itself or a member having the one laminated body mounted thereon is attached to the other laminated body. Since the bonding is performed while being deformed so as to be convex, even if the stacked body is deformed such as warpage, the deformation such as warpage is forcibly eliminated at the time when the stacked body is deformed to be convex.
[0017]
Then, when joining one laminated body to the other laminated body, the most protruding position deformed into a convex shape is joined first, and then the outer peripheral portion is joined sequentially. For this reason, when joining a pair of laminated objects, since both can be surely brought into close contact with each other and joined, the reliability of the laminated structure to be manufactured can be improved.
[0018]
The invention according to claim 2 is
The method for manufacturing a laminated structure according to claim 1,
When deforming the one laminated body itself or the member on which the one laminated body is mounted so as to be convex toward the other laminated body, the one laminated body itself or the one using a pressurized fluid. Wherein the member on which the laminated body is mounted is deformed.
[0019]
According to the above invention, since the stacked body is deformed to be convex using the pressurized fluid, the stacked body can be easily and surely deformed. Further, by adjusting the fluid pressure of the pressurized fluid, it is possible to adjust the deformability of the laminated body.
[0020]
The invention according to claim 3 is:
The method for manufacturing a laminated structure according to claim 1,
A spacer is provided between the one stacked body itself or a support base that supports the member to which the one stacked body is mounted and the one stacked body, and the spacer is arranged by the spacer. The body is deformed so as to be convex toward the other laminated body.
[0021]
According to the above invention, since the stacked body is deformed to be convex using the spacer provided on the support, the stacked body can be deformed with a simple configuration.
[0022]
The invention according to claim 4 is
A first support for mounting the first stacked body, and a second support for mounting the second stacked body;
In the laminating apparatus for laminating the first stacked body and the second stacked body by bringing the first supporting base and the second supporting base close to each other,
On at least one of the first support base and the second stacked body, the stacked body itself supported by the one support body or the member mounted with the stacked body is mounted on the other support body. It is characterized in that a deforming means for deforming so as to be convex is provided.
[0023]
According to the above invention, even if deformation such as warpage occurs in the stacked body, the deformation such as warpage is forcibly eliminated at the time when the stacked body is deformed to be convex. Then, when joining one laminated body to the other laminated body, the most protruding position deformed into a convex shape is joined first, and then the outer peripheral portion is joined sequentially. For this reason, when joining a pair of laminated objects, since both can be surely brought into close contact with each other and joined, the reliability of the laminated structure to be manufactured can be improved.
[0024]
The invention according to claim 5 is
The laminating apparatus according to claim 4,
The deformation means,
An injection hole for injecting a pressurized fluid provided in the one support,
Supply means for supplying the pressurized fluid to the injection holes,
A holding means for holding an outer peripheral position of the stacked body is provided outside the injection hole provided in the one support.
[0025]
According to the above invention, the object to be laminated is deformed so as to be convex by being pressurized by the pressurized fluid supplied from the supply means and flowing out from the injection holes, so that the object to be laminated can be easily and surely deformed.
[0026]
Further, by adjusting the fluid pressure of the pressurized fluid, it is possible to adjust the deformability of the laminated body. Further, since the stacked body is held at the outer peripheral position by the holding means, the stacked body does not separate from the support even when deformed by the pressurized fluid.
[0027]
The invention according to claim 6 is:
The laminating apparatus according to claim 4,
The deformation means,
A spacer provided on the one support and protruding from the support surface;
A holding means is provided at an outer peripheral position of the spacer provided on the one support, for holding the outer peripheral position of the stacked body by suction.
[0028]
According to the above invention, since the stacked body is deformed to be convex using the spacer protruding from the surface of the support, the stacked body can be easily and surely deformed. Further, since the outer peripheral position of the stacked body is suction-held by the holding means, the stacked body is securely supported by the support.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings.
[0030]
FIGS. 4 to 7 show a method of manufacturing a laminated structure 40A (see FIG. 6D) to which the method of laminating an object to be laminated according to the first embodiment of the present invention is applied. The method of manufacturing the laminated structure 40A generally includes a step of manufacturing the first substrate 20, a step of manufacturing the second substrate 30A, and a step of forming the stacked substrate formed on the first substrate 20 on the second substrate 30A. Laminating the resin 16. Hereinafter, each of these steps will be described.
[0031]
First, a method for manufacturing the first substrate 20 will be described with reference to FIG. In order to manufacture the first substrate 20, a mold 10 shown in FIG. The mold 10 has a configuration in which the concave portions 11 are patterned on a rigid material (for example, silicon, glass, or the like).
[0032]
The concave portion 11 is configured to correspond to a formation position of a resin laminate 35 (resin to be laminated 16) constituting a laminated structure 40A described later (see FIG. 6D).
[0033]
The resin solution 13 is dropped on the mold 10 using a dispenser 12. A sufficient amount of the resin solution 13 is dropped so as to completely cover at least the concave portion 11. Note that the arrangement of the resin solution 13 in the mold 10 is not limited to the configuration using the dispenser 12, and another method (for example, a method using a spinner) can be used.
[0034]
When the resin solution 13 is provided in the mold 10, the resin solution 13 is subsequently baked at an appropriate temperature to evaporate the solvent component (hereinafter, the resin solution 13 in this state is referred to as a resin 16 to be laminated). After the baking process has been completed, as shown in FIG. 4B, the resin 16 to be laminated is attached not only to the inside of the concave portion 11 of the mold 10 but also to the surface of the mold 10.
[0035]
Subsequently, as shown in FIG. 4 (C), a process of removing the laminated resin 16 attached to the surface of the mold 10 is performed. The grinder 14 is used for removing the resin 16 to be laminated.
[0036]
The grinding machine 14 is selected from a material that is softer than the material of the mold 10 and harder than the resin 16 to be laminated. The grinder 14 is rotated on the mold 10 by a rotating device (not shown), whereby the resin 16 to be laminated on the surface of the mold 10 is removed.
[0037]
FIG. 4D shows a state in which the resin 16 to be laminated on the surface of the mold 10 has been removed. As shown in FIG. 1, the resin 16 to be laminated on the surface of the mold 10 is removed by the grinding machine 14, but the resin 16 to be laminated located in the concave portion 11 remains without being removed.
[0038]
At this time, in this embodiment, since the method for removing the unnecessary resin to be laminated 16 using the grinding machine 14 by utilizing the surface accuracy of the mold 10 is used, the resin to be laminated 16 having high surface accuracy can be easily and quickly obtained. Can be formed in the mold 10. Further, as described above, since the grinder 14 is made of a material which is softer than the mold 10 and harder than the resin 16 to be laminated, damage to the mold 10 is small.
[0039]
In the above-described example, the example in which the grinder 14 is used to remove the unnecessary resin 16 to be laminated on the surface of the mold 10 has been described. However, the removal is performed by another method such as oxygen plasma ashing. It is also possible. In this embodiment, the resin solution 13 is used as the material of the resin 16 to be laminated. However, a resin that cures a liquid resin agent may be used.
[0040]
Subsequently, a method of manufacturing the second substrate 30A will be described with reference to FIG. To manufacture the second substrate 30A, a mold 21 shown in FIG. 5A is prepared. The mold 21 has a configuration in which the concave portion 24 is patterned on, for example, silicon or glass.
[0041]
The concave portion 24 is configured to correspond to the position where the resin laminate 35 (the resin 16 to be laminated) constituting the laminated structure 40A described later is formed (see FIG. 6D).
[0042]
A solvent 23 is dropped on the mold 21 using a dispenser 22. The solvent 23 is dropped at least in a sufficient amount to completely fill the recess 24. The disposition of the solvent 23 on the mold 24 is not limited to the configuration using the dispenser 22, but another method (for example, a method using a spinner) can be used.
[0043]
When the mold 21 is filled with the solvent 23, a resin sheet 25 is disposed on the mold 21 as shown in FIG. As the resin sheet 25, for example, polymethyl methacrylate (PMMA) can be used.
[0044]
When the resin sheet 25 is disposed on the mold 21, the mold 21 on which the resin sheet 25 is disposed is placed on a base 26, as shown in FIG. A weight 27 is placed on the upper part. As a result, the excess solvent 23 is extruded from between the mold 21 and the resin sheet 25, and the solvent 23 is located only in the concave portion 24 of the mold 21.
[0045]
Subsequently, the member in which the mold 21, the resin sheet 25, and the weight 27 are stacked on the base 26 is placed in a heating furnace and kept at a predetermined temperature for a time. As a result, the solvent 23 located in the concave portion 24 diffuses into the resin sheet 25 while dissolving the resin sheet 25, whereby the mold transfer by the mold 21 is performed. The temperature and the holding time of the heating furnace are appropriately selected depending on the materials and amounts of the solvent 23 and the resin sheet 25 used.
[0046]
When the above-described mold transfer is completed and the protrusion 28 corresponding to the shape of the recess 24 is integrally formed on the resin sheet 25, the mold is released from the mold 21 as shown in FIG. Thereby, a second substrate 30A having the protruding portions 28 is formed. In addition, as a method of manufacturing the second substrate 30A, a manufacturing method such as injection molding or press molding can be used in addition to the above-described manufacturing method.
[0047]
When the first substrate 20 and the second substrate 30A are manufactured as described above, the resin 16 to be laminated subsequently formed on the first substrate 20 (the first laminate to be described in claims) A process of stacking the second substrate 30A (the second stacked body described in the claims) is performed. FIG. 6 is a diagram for explaining a process of laminating the laminated resin 16 and the second substrate 30A.
[0048]
In order to laminate the laminated resin 16 formed on the first substrate 20 and the second substrate 30A, first, as shown in FIG. 6A, a container 36 filled with the solvent type adhesive 32 is prepared. I do. Then, the container 36 is heated to a predetermined temperature to generate the solvent vapor 33, and the second substrate 30A is placed thereon.
[0049]
At this time, the protrusion 28 of the second substrate 30A is in contact with the solvent vapor 33. As a result, the solvent vapor 33 uniformly adheres and solidifies on the surface of the second substrate 30A on which the protrusion 28 is formed. As a result, the second substrate 30A is in a state where the solvent type adhesive 32 is uniformly formed.
[0050]
Although the present embodiment shows an example in which the solvent-type adhesive 32 is formed only on the second substrate 30A, the first substrate 20 or the first substrate 20 and the first substrate 20 may be formed in the same manner as described above. A configuration in which the solvent type adhesive 32 is formed on both of the two substrates 30A may be adopted.
[0051]
Subsequently, as shown in FIG. 6B, the second substrate 30A is brought into contact with the first substrate 20, and the stacked portions formed on the first substrate 20 are formed on the protruding portions 28 of the second substrate 30A. A process for laminating the resin 16 is performed. That is, the protruding portion 28 (provided with the solvent type adhesive 32) formed on the second substrate 30A is brought into contact with the upper surface of the resin 16 to be laminated formed on the first substrate 20, and The resin 16 and the protrusion 28 are bonded.
[0052]
By the way, dust may enter between the second substrate 30A and the second support base 51B that supports the second substrate 30A. In this case, the second substrate 30A may be inclined with respect to the surface of the second support 51B. Further, in the process shown in FIGS. 5A and 5B, if the solvent 23 is applied unevenly, internal stress unevenly distributed during the heat treatment shown in FIG. 5C is generated. Then, the second substrate 30A is warped (deformed).
[0053]
For this reason, in the present embodiment, even if the second substrate 30A is deformed, or if the second substrate 30A is inclined (hereinafter, these lamination processes may not be performed properly). The reason is referred to as “the reason for internal stress”), and a laminating method that can surely be laminated with the laminated resin 16 of the first substrate 20 is used. However, for convenience of explanation, this laminating method will be described later. .
[0054]
When the protrusion 28 and the resin to be laminated 16 are bonded by the solvent type adhesive 32 as described above, the first substrate 20 and the second substrate 30A are subsequently separated. At this time, since the resin 16 to be laminated is bonded to the protruding portion 28, the resin 16 to be laminated is released from the first substrate 20. That is, as shown in FIG. 6C, the resin to be laminated 16 is in a state of being laminated on the second substrate 30A.
[0055]
By repeatedly performing the processing shown in FIGS. 6A to 6C on the second substrate 30A on which the laminated resin 16 is laminated, a plurality of laminated resins 16 are laminated, A laminated structure 40A having a resin laminate 35 as shown in FIG. 6D is manufactured. In the example shown in FIG. 6D, the resin laminate 35 is formed by laminating three layers of the resin 16 to be laminated. The laminated structure 40A manufactured in this manner is used as a micro device such as a three-dimensional photonic crystal element.
[0056]
In the above-described embodiment, as a method of providing the solvent-type adhesive 32 on the second substrate 30A, a method of vapor-condensing the solvent-type adhesive 32 onto the second substrate 30A after forming the solvent-type adhesive 32 into a solvent vapor 33 is used. Although the method was used, the method of providing the solvent-type adhesive 32 on the second substrate 30A is not limited to this, and a method using a spray, a method of dipping, or a method of potting may be used as long as an appropriate amount is provided. Etc. can also be used. Further, the resin to be laminated 16 and the protruding portion 28 can be joined by heat welding such as ultrasonic welding without using an adhesive.
[0057]
Next, referring to FIGS. 7 to 9, a laminating method capable of laminating the laminated resin 16 on the protruding portion 28 of the second substrate 30A reliably even if the second substrate 30A is deformed. Will be described. 7 is a diagram showing a laminating method for laminating the resin 16 to be laminated on the protruding portion 28 along a processing procedure, FIG. 8 is a configuration diagram of a laminating apparatus 50A used when performing the laminating method, and FIG. It is a figure which expands and shows the 1st and 2nd support bases 51A and 51B provided in 50 A of lamination apparatuses.
[0058]
First, the laminating apparatus 50A will be described with reference to FIGS. As shown in FIG. 8, the laminating apparatus 50A includes a first support 51A, a second support 51B, a moving mechanism 53, a base 54, a fixed base 59, and the like.
[0059]
The first support 51A is fixed to the moving mechanism 53. Further, the second support table 51B is fixed to the column 60. The first support table 51 is a suction chuck that supports the first substrate 20 by suction as shown in FIG. 7A. As shown in the enlarged view of FIG. 9, the first and second support tables 51A and 51B have annular suction grooves 62A and 62B formed in the support base body portions 61A and 61B. Suction passages 63A and 63B are formed to communicate with 62A and 62B.
[0060]
A suction device (not shown) is connected to the suction passages 63A and 63B, and a negative pressure is generated in the suction grooves 62A and 62B by operating the suction device. Therefore, by operating the suction device in a state where the substrates 20 and 30A are placed on the supports 51A and 51B, the substrates 20 and 30A are sucked by the supports 51A and 51B and supported by the supports. .
[0061]
The diameter of the suction groove 62 is set slightly smaller than the diameter of the first substrate 20. As a result, the support tables 51A and 51B (suction grooves 62A and 62B) suck the outer peripheral positions of the substrates 20 and 30A.
[0062]
Injection holes 66A and 66B are formed at the center of the surface of the support base body 61, more precisely, at the approximate center of the annular suction grooves 62A and 62B. Injection passages 65A and 65B are connected to the injection holes 66A and 66B, and a supply device 67 is connected to the injection passages 65A and 65B as shown in FIG. 9B.
[0063]
The supply device 67 is a device that supplies the pressurized fluid to the ejection passages 65A and 65B. Therefore, when the supply device 67 supplies the pressurized fluid to the ejection passages 65A and 65B, the pressurized fluid is supplied to the ejection holes. It flows out of 66A and 66B. In this embodiment, an example is shown in which air is used as the pressurized fluid. However, the pressurized fluid is not limited to air, and another gas such as an inert gas may be used. In addition, the liquid is not limited to a gas, and a liquid such as water can be used.
[0064]
Returning to FIG. 8, the description of the laminating apparatus 50A will be continued. The moving mechanism 53 includes a coarse moving mechanism 55, a fine moving mechanism 56, an elevating mechanism 57, and a moving table 58. The coarse movement mechanism 55 has a fine movement mechanism 56, an elevating mechanism 57, and a moving table 58 mounted thereon, and moves in a direction indicated by an arrow X in FIG.
[0065]
The fine movement mechanism 56 has a lifting mechanism 57 and a moving table 58 mounted thereon, and moves in the direction indicated by the arrow X in FIG. The movement accuracy of the fine movement mechanism 56 is set higher than the movement accuracy of the coarse movement mechanism 55. The coarse movement mechanism 55 and the fine movement mechanism 56 are used for positioning the first support table 51 with respect to the fixed second support table 52, but the two movement mechanisms 55 and 56 having different precisions. , Accurate positioning processing can be performed in a short time. Further, by providing the coarse movement mechanism 55, it becomes easy to mount the second substrate 30A on the second support table 51B.
[0066]
The elevating mechanism 57 has a function of elevating the moving table 58 (moving it in the direction of the arrow Z in the figure). Thus, the first support 51A approaches and separates from the second support 51B.
[0067]
Subsequently, a laminating method of laminating the resin 16 to be laminated on the protruding portion 28, which is performed using the laminating apparatus 50A having the above configuration, will be described. In order to laminate the resin 16 to be laminated formed on the first substrate 20 to the protruding portion 28 formed on the second substrate 30A, first, the first substrate 20 is supported by the first support 51A. At the same time, the second substrate 30A is supported by the second support 51B.
[0068]
Specifically, after the first substrate 20 is placed on the first support table 51A, the suction device is operated, and the first substrate 20 is subjected to the suction force (negative pressure) generated by the suction groove 62A. The first support 51A is sucked and supported. Similarly, the suction device is operated after the second substrate 30A is placed on the second support table 51B, and the second substrate 30A is moved to the second substrate 30A by the suction force (negative pressure) generated in the suction groove 62B. The support table 51B sucks and supports it. However, the supply device 67 connected to the injection passage 65 is in a stopped state.
[0069]
When the substrates 20 and 30A are supported by the supports 51A and 51B as described above, the moving mechanism 53 is subsequently activated to perform the positioning process between the first substrate 20 and the second substrate 30A. FIG. 7A shows a state in which the positioning processing of the first substrate 20 and the second substrate 30A has been completed. In this positioning end state, the laminated resin 16 formed on the first substrate 20 and the protruding portion 28 formed on the second substrate 30A are in a state of accurately facing each other.
[0070]
Note that FIG. 7 shows the first substrate 20 in which no deformation has occurred, but as described above, the second substrate 30A has a deformation such as warpage due to internal stress or the like. There is.
[0071]
When the positioning process is performed as described above, the supply device 67 (see FIG. 9) is subsequently activated to supply the pressurized fluid (compressed air) only to the injection passage 65B. As a result, the pressurized fluid pressurizes the injection passage 65B and the injection hole 66B.
[0072]
As described above, the outer peripheral portion 30b of the second substrate 30A is fixed by being sucked into the suction groove 62B, and the second substrate 30A is configured to be deformable. Therefore, the pressurized gas flowing out from the injection holes 66B accumulates between the second substrate 30A and the second support table 51B and urges the second substrate 30A upward.
[0073]
Due to this pressurized gas, the second substrate 30A (corresponding to one laminated body itself described in the claims) becomes the first substrate 20 (the other laminated body described in the claims) as shown in FIG. (Corresponding to the laminate itself). Specifically, the second substrate 30A is in a state of being expanded so as to form a substantially conical shape having the convex portion 30a as a top and inclining toward the outer peripheral portion 30b.
[0074]
As described above, by deforming the second substrate 30A so as to be convex toward the first substrate 20, even if the second substrate 30A is deformed such as warpage due to the above-described internal stress or the like. The deformation such as warpage is forcibly eliminated at the time of the deformation to be convex. That is, even when deformation or inclination such as warpage due to internal stress or the like is occurring, the deformation generated by the pressurized fluid is a large deformation relative to the deformation such as warpage. Therefore, when the second substrate 30A is deformed so as to be convex by the pressurized fluid, the deformation and inclination due to the internal stress or the like are forcibly eliminated.
[0075]
As described above, when the second substrate 30A is forcibly deformed by the pressurized fluid and the deformation or inclination is forcibly eliminated, the moving mechanism 53 is subsequently activated, and the first support 51A is moved to the second support 30A. Is moved (raised) toward the support table 51B.
[0076]
When the first support 51A rises toward the second support 51B, the most protruding protrusion 30a of the second substrate 30A first comes into contact with and joins the first substrate 20. When the first support base 51 is further raised, the outer peripheral portion of the projection 30a is sequentially joined to the first substrate 20.
[0077]
At this time, the deformation and inclination that irregularly occur in the second substrate 30A due to internal stress or the like are eliminated by forcibly deforming the second substrate 30A as described above. The substrate 20 and the second substrate 30A can be securely brought into close contact with each other and joined. Thereby, as shown in FIG. 7C, the protruding portion 28 formed on the second substrate 30A can be securely joined to the laminated resin 16 formed on the first substrate 20. Thus, the reliability of the laminated structure 40A manufactured can be improved.
[0078]
In addition, in the present embodiment, when the second substrate 30A is deformed to be convex, it is configured to be deformed by the pressurized fluid, so that the pressure of the pressurized fluid is uniformly applied to the second substrate 30A. be able to. Further, the fluid pressure of the pressurized fluid can be easily changed by controlling the supply device 67, and therefore, the amount of deformation of the second substrate 30A can be adjusted.
[0079]
Next, a second embodiment of the present invention will be described. 10 to 13 show a method of manufacturing laminated structures 40B and 40C (see FIGS. 12 (C) and 13 (C)) to which a method of laminating an object to be laminated according to a second embodiment of the present invention is applied. ing. In FIGS. 10 to 13, the same components as those shown in FIGS. 4 to 9 used in the above description are denoted by the same reference numerals, and description thereof will be omitted.
[0080]
In the present embodiment, the first substrate 20 is manufactured by the same manufacturing method as described above with reference to FIG. 4, but a resin sheet is used as the second substrate 30B. That is, in the first embodiment described above, the second substrate 30A having the protrusion 28 is used, but in the present embodiment, the resin 16 to be laminated is laminated on the second substrate 30B having no protrusion 28. It is characterized by:
[0081]
FIG. 10 shows a laminating method for laminating the resin 16 to be laminated on the second substrate 30B. To perform the lamination process, first, as shown in FIG. 10A, the first substrate 20 is supported on the first support 51A, and the second substrate 30B made of a resin sheet is mounted on the second support. 51B.
[0082]
The first substrate 20 is manufactured by the same manufacturing method as described above with reference to FIG. Further, in the present embodiment, the solvent type adhesive 32 is not provided on the second substrate 30B. Further, in the state shown in FIG. 10A, the supply device 67 connected to the injection passages 65A and 65B is in a stopped state.
[0083]
When the substrates 20 and 30B are supported by the supports 51A and 51B as described above, the moving mechanism 53 is subsequently activated to perform the positioning process between the first substrate 20 and the second substrate 30B. FIG. 10A shows a state in which the positioning processing of the first substrate 20 and the second substrate 30B has been completed.
[0084]
When the positioning process is completed as described above, the supply device 67 is subsequently activated to supply the pressurized fluid (compressed air) to the injection passage 65B of the large support table 51B. Thus, as shown in FIG. 10B, the pressurized fluid pressurizes the injection passage 65B and the injection hole 66B. Since the second substrate 30B is a resin sheet and has a deformable configuration, the second substrate 30B is attached to the first substrate 20 similarly to the first embodiment by the pressurized gas flowing out from the injection holes 66B. It is deformed so as to be convex. Therefore, also in the present embodiment, even if the second substrate 30B is deformed or tilted due to internal stress or the like, the deformation or tilt is forcibly eliminated when the second substrate 30B is deformed to be convex.
[0085]
As described above, when the second substrate 30B is forcibly deformed by the pressurized fluid and the deformation and the inclination are forcibly eliminated, the moving mechanism 53 is subsequently activated, and the first support 51A is moved to the second support base 51A. Is moved (raised) toward the support table 51B. Thus, the most protruding projection 30a of the second substrate 30B first comes into contact with the first substrate 20B, and then the outer peripheral portion of the projection 30a is sequentially joined to the first substrate 20.
[0086]
At this time, since the deformation and the inclination generated in the second substrate 30B due to the internal stress and the like are eliminated by forcibly deforming the second substrate 30B as described above, the present embodiment is also applicable. Thus, the first substrate 20 and the second substrate 30B can be securely brought into close contact with each other and joined. Thereby, as shown in FIG. 10C, the second substrate 30B and the resin to be laminated 16 formed on the first substrate 20 can be securely joined.
[0087]
In this embodiment, the adhesive is not provided on the second substrate 30B as described above. Therefore, in the present embodiment, the resin to be laminated 16 formed on the first substrate 20 and the second substrate 30B are joined by fusion. Note that, similarly to the first embodiment, it is also possible to bond the laminated resin 16 to the second substrate 30B by using the adhesive 32.
[0088]
When the first substrate 20 and the second substrate 30B are joined as described above, subsequently, as shown in FIG. 11A, the second support 51B is separated from the first support 51A. As a result, the second substrate 30B is separated from the first substrate 20. At this time, since the laminated resin 16 is bonded to the second substrate 30B by fusion, the laminated resin 16 is in a state of being laminated on the second substrate 30B. The second substrate 30B on which one layer of the resin 16 to be laminated is laminated is hereinafter referred to as a one-layer structure 80.
[0089]
When the one-layer structure body 80 is manufactured as described above, as shown in FIG. 11B, the dispenser 73 is used to cover the resin 16 to be laminated so as to cover the resin 16 to be laminated. Curable resin, etc.). Then, the coating resin liquid 72 is cured. As a result, as shown in FIG. 11C, a structure in which one layer of the resin 71 to be laminated is formed on the second substrate 30B made of a resin sheet is manufactured.
[0090]
FIG. 12 shows a method of manufacturing a laminated structure 40B by laminating two one-layer structures 80. To manufacture the laminated structure 40B, the one-layer structure 80A shown in FIG. 11B is used as a lower layer, and the one-layer structure 80B is laminated thereon.
[0091]
At this time, the one-layer structure 80B is arranged so that the resin 16 to be laminated is located at the upper part. That is, the resin 16 to be laminated of the one-layer structure 80A located in the lower layer is arranged so as to face the second substrate 30B of the second substrate 30B located in the upper layer. At this time, the coating resin liquid 72 remains in an uncured state.
[0092]
Subsequently, as shown in FIG. 12 (B), a coating resin liquid 72 is provided on the second substrate 30B located above using a dispenser 73. Thereby, the resin 16 to be laminated of the one-layer structure 80B is in a state of being covered with the coating resin liquid 72.
[0093]
Subsequently, the laminated one-layer structures 80A and 80B are subjected to a heat treatment to cure the coating resin liquid 72. Thus, the laminated structure 40B shown in FIG. 12C is manufactured.
[0094]
FIG. 13 shows a method of manufacturing a stacked structure 40C by stacking two single-layer structures 80. To manufacture the laminated structure 40C, the one-layer structure 80A shown in FIG. 11B is used as a lower layer, and the one-layer structure 80B is laminated thereon.
[0095]
At this time, the one-layer structure 80B is arranged so that the resin 16 to be laminated is located at the lower part. That is, the resin 16 to be laminated of the one-layer structure 80A located in the lower layer and the resin 16 to be laminated of the second substrate 30B located in the upper layer are arranged to face each other. At this time, the coating resin liquid 72 remains in an uncured state.
[0096]
Subsequently, as shown in FIG. 13B, the pair of one-layer structures 80A and 80B are butted and held by a jig (not shown). As a result, the coating resin liquid 72 disposed on the single-layer structure 80A is also in a state of covering the laminated resin 16 of the single-layer structure 80B. That is, the resin 16 to be laminated of each of the single-layer structures 80A and 80B is in a state of being covered with the coating resin liquid 72.
[0097]
Subsequently, the laminated one-layer structures 80A and 80B are subjected to a heat treatment to cure the coating resin liquid 72. Thereby, the laminated structure 40B shown in FIG. 13C is manufactured. The laminated structures 40B and 40C manufactured as described above can be used as a micro device such as an optical waveguide. Further, in the example described with reference to FIGS. 12 and 13, a configuration in which two single-layer structures 80 (80A and 80B) are stacked is shown, but the number of stacked single-layer structures 80 is limited to two. Instead, three or more layers may be formed.
[0098]
Next, a third embodiment of the present invention will be described. FIG. 14 shows a method of laminating a laminated body according to a third embodiment of the present invention. In FIG. 14, the same components as those shown in FIGS. 4 to 13 used in the above description are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, an example in which the resin 16 to be laminated formed on the first substrate 20 is laminated on the second substrate 30B made of a resin sheet, as in the second embodiment described above, will be described.
[0099]
To laminate the resin 16 to be laminated on the second substrate 30B, first, as shown in FIG. 14A, the first substrate 20 is supported on the first support base 82, and the first resin 20 is formed of a resin sheet. The second substrate 30B is supported by the second support 52. The support of each of the substrates 20 and 30B with respect to each of the support tables 52 and 82 generates a negative pressure in the suction grooves 62 and 69 by activating the suction device connected to the suction passages 63 and 70. The structure is such that the respective substrates 20, 30B are sucked into the support tables 52, 82 by suction.
[0100]
At this time, the spacer 85 is previously placed on the lower surface of the second support table 52. The spacer 85 is a block made of an elastic material such as a resin, for example, and is disposed at the center of the annular suction groove 69. In the figure, the spacer 85 is shown in a large size for easy understanding, but the actual thickness of the spacer 85 is about 30 to 50 μm.
[0101]
Accordingly, when the suction device is activated and a suction force is generated in the suction groove 69, the second substrate 30B is elastically deformed as shown in FIG. 14B, and the outer peripheral portion 30b is adsorbed on the second support table 52. Is done. Thus, the outer peripheral position is adsorbed by the suction groove 69 and the central portion is supported by the spacer 85, so that the second substrate 30B is deformed so as to be convex toward the first substrate 20. Therefore, even in the present embodiment, even if the second substrate 30B is deformed or inclined due to internal stress or the like, the deformation due to the warp or the like is forcibly performed when the second substrate 30B is deformed by the spacer 85. Will be resolved.
[0102]
When the second substrate 30B is deformed by the spacer 85 as described above, the moving mechanism 53 is subsequently activated to perform the positioning process between the first substrate 20 and the second substrate 30B. Subsequently, the moving mechanism 53 is activated, and moves (rises) the first support 82 toward the second support 52. As a result, the most protruding projection 30a of the second substrate 30B first comes into contact with the first substrate 20, and then the outer peripheral portion of the projection 30a is sequentially joined to the first substrate 20B.
[0103]
At this time, since the deformation and the inclination generated in the second substrate 30B due to the internal stress and the like are eliminated by forcibly deforming the second substrate 30B as described above, the present embodiment is also applicable. Thus, the first substrate 20 and the second substrate 30B can be securely brought into close contact with each other and joined. Accordingly, as shown in FIG. 14C, the second substrate 30B and the resin to be laminated 16 formed on the first substrate 20 can be securely joined.
[0104]
As described above, in the present embodiment, the second substrate 20B is deformed by a simple configuration in which the spacer 85 is disposed on the first support base 82, and the deformation caused by the internal stress or the like can be prevented. The inclination can be eliminated. Accordingly, the resin 16 to be laminated can be reliably laminated on the second substrate 30B, and the configuration of each of the support tables 52 and 82 can be simplified.
[0105]
In each of the above-described embodiments, only the second substrates 30A and 30B supported by the second support tables 51B and 52 are deformed to eliminate the deformation and inclination caused by internal stress and the like. . However, if the first substrate 20 is deformed or tilted due to internal stress or the like, the first substrate 20 is subjected to the same compulsory force applied to the second substrates 30A and 30B. It is also possible to adopt a configuration in which the stacking process is performed after performing a proper deformation to forcibly eliminate the deformation and inclination caused by the internal stress or the like.
[0106]
In particular, in the laminating apparatus 50A according to the above-described embodiment, since the first support 51A and the second support 51B have the same configuration, it is possible to selectively deform each of the substrates 20, 30A, and 30B into a convex shape. Can also be simultaneously deformed into a convex shape.
[0107]
【The invention's effect】
As described above, according to the present invention, the following various effects can be realized.
[0108]
According to the first and fourth aspects of the present invention, the deformation such as the warpage is forcibly eliminated at the time when the stacked body is deformed to be convex even if the deformation such as the warp occurs. At the time of joining the stacked bodies, the most protruding position deformed into a convex shape is joined first, and then the outer peripheral portions are joined sequentially, so that the pair of stacked bodies can be securely adhered and joined, and the The reliability of the laminated structure can be improved.
[0109]
According to the second and fifth aspects of the present invention, since the stacked body is deformed to be convex using the pressurized fluid, the stacked body can be easily and surely deformed. Further, by adjusting the fluid pressure of the pressurized fluid, it is possible to adjust the deformability of the laminated body.
[0110]
According to the third and sixth aspects of the present invention, since the stacked body is deformed to be convex using the spacer provided on the support, the stacked body is deformed with a simple configuration. be able to.
[Brief description of the drawings]
FIG. 1 is a view for explaining a conventional laminating apparatus.
FIG. 2 is a view for explaining a problem of a conventional laminating apparatus (part 1).
FIG. 3 is a view for explaining a problem of the conventional laminating apparatus (part 2).
FIG. 4 is a diagram for explaining a method for manufacturing a laminated structure to which the method for laminating a body to be laminated according to the first embodiment of the present invention is applied, and is for explaining a process for manufacturing a first substrate. FIG.
FIG. 5 is a diagram for explaining a method for manufacturing a laminated structure to which the method for laminating a body to be laminated according to the first embodiment of the present invention is applied, and is for explaining a process for manufacturing a second substrate. FIG.
FIG. 6 is a diagram for explaining a method of manufacturing a laminated structure to which the method of laminating a laminated body according to the first embodiment of the present invention is applied, in which a first substrate and a second substrate are laminated. It is a figure for explaining processing.
FIG. 7 is a diagram for explaining a method of manufacturing a laminated structure to which the method of laminating a body to be laminated according to the first embodiment of the present invention is applied, in which a first substrate and a second substrate are laminated. It is a figure for explaining processing in detail.
FIG. 8 is a diagram for explaining a laminating apparatus according to the first embodiment of the present invention.
FIG. 9 is an enlarged view showing a first support base provided in the laminating apparatus according to the first embodiment of the present invention.
FIG. 10 is a diagram for explaining a method of manufacturing a laminated structure to which the method of laminating a body to be laminated according to the second embodiment of the present invention is applied, in which a first substrate and a second substrate are laminated. It is a figure for explaining processing.
FIG. 11 is a diagram for explaining a method for manufacturing a laminated structure to which the method for laminating a body to be laminated according to the second embodiment of the present invention is applied, and is a diagram for explaining a resin coating process.
FIG. 12 is a diagram for explaining a method of manufacturing a laminated structure to which the method for laminating a laminated body according to the second embodiment of the present invention is applied, and is for explaining a process of laminating a one-layer structure. It is a figure (the 1).
FIG. 13 is a diagram for explaining a method for manufacturing a laminated structure to which the method for laminating a laminated body according to the second embodiment of the present invention is applied, and is for explaining a process for laminating a one-layer structure. It is a figure (the 2).
FIG. 14 is a view for explaining a method of laminating a laminated body and a laminating apparatus used therefor according to a third embodiment of the present invention.
[Explanation of symbols]
Type 10
13 Resin solution
14 Grinding machine
16 Laminated resin
20 First substrate
23 Solvent
25 resin sheet
30A, 30B Second substrate
32 Solvent adhesive
33 Solvent vapor
35 Resin laminate
40A-40C laminated structure
50A, 50B laminating device
51A first support base
51B, 82 Second support base
53 Moving mechanism
61A, 61B, 83 Support base body
62A, 62B Suction groove
63A, 63B Suction passage
65A, 65B Injection passage
66A, 66B injection hole
67 Supply device
71 Coating resin
80,80A, 80B Single-layer structure
85 Spacer

Claims (6)

In a method of laminating a stacked body in which a first stacked body and a second stacked body are stacked and joined,
While deforming at least one of the laminated bodies themselves or the member to which the one laminated body is attached to the first laminated body or the second laminated body so as to be convex toward the other laminated body. And bonding the first stacked body and the second stacked body to each other. The method according to claim 1, wherein:
When deforming the one laminated body itself or the member on which the one laminated body is mounted so as to be convex toward the other laminated body, the one laminated body itself or the one using a pressurized fluid. A member on which the object to be laminated is mounted is deformed. The method according to claim 1, wherein:
A spacer is provided between the one stacked body itself or a support base that supports the member to which the one stacked body is mounted and the one stacked body, and the spacer is arranged by the spacer. A method of laminating a body to be laminated, wherein the body is deformed so as to be convex toward the other body to be laminated. A first support for mounting the first stacked body, and a second support for mounting the second stacked body;
In the laminating apparatus for laminating the first stacked body and the second stacked body by bringing the first supporting base and the second supporting base close to each other,
On at least one of the first support base and the second stacked body, the stacked body itself supported by the one support body or a member mounted with the stacked body is mounted on the other support body. A laminating apparatus, comprising a deforming means for deforming to be convex. The laminating apparatus according to claim 4,
The deformation means,
An injection hole for injecting a pressurized fluid provided in the one support,
Supply means for supplying the pressurized fluid to the injection holes,
A stacking device, comprising: holding means for holding an outer peripheral position of the stacked body outside the injection hole provided in the one support. The laminating apparatus according to claim 4,
The deformation means,
A spacer provided on the one support and protruding from the support surface;
A laminating apparatus, further comprising: holding means for sucking and holding an outer peripheral position of the stacked body at an outer peripheral position of the spacer provided on the one support.

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