JP2017121760A - Liquid jetting head and method for manufacturing liquid jetting head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid jetting head that inhibits a mold agent from detaching from an opening edge of a substrate, and to provide a method for manufacturing a liquid jetting head.SOLUTION: The liquid jetting head includes: a nozzle plate 23 having a first surface 40 exposed to the outside and a nozzle formed at the first surface; a substrate 14 having a second surface 43 exposed to the outside in a position deviated from the first surface and a step 44 formed between the first surface and the second surface; and the mold agent 42 bonded to a step surface 45 on a side of a first face of the step, where an irregularity is formed at the step surface.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a liquid ejecting head including a nozzle for ejecting liquid and a substrate such as a fixed plate attached to a surface on the nozzle side, and a method for manufacturing the liquid ejecting head.

  As a liquid ejecting apparatus equipped with a liquid ejecting head, for example, there is an image recording apparatus such as an ink jet printer or an ink jet plotter, but recently, it has a feature that a very small amount of liquid can be landed accurately at a predetermined position. It has been applied to various manufacturing equipment. For example, a display manufacturing apparatus for manufacturing a color filter such as a liquid crystal display, an electrode forming apparatus for forming an electrode such as an organic EL (Electro Luminescence) display or FED (surface emitting display), and a chip for manufacturing a biochip (biochemical element) Applied to manufacturing equipment. The recording head for the image recording apparatus ejects liquid ink, and the color material ejecting head for the display manufacturing apparatus ejects solutions of R (Red), G (Green), and B (Blue) color materials. The electrode material ejecting head for the electrode forming apparatus ejects a liquid electrode material, and the bioorganic matter ejecting head for the chip manufacturing apparatus ejects a bioorganic solution.

  The liquid ejecting head includes a piezoelectric element (a kind of actuator) that causes pressure fluctuation in the liquid in the pressure chamber, and is configured to eject liquid from nozzles established in the nozzle plate by driving the piezoelectric element. Yes. Further, the surface (for example, the bottom surface) on the side where the nozzle plate is joined is provided with a substrate such as a fixed plate or a cover head in which an opening for exposing the nozzle plate is formed. And the area | region between the edge of the opening of a board | substrate and a nozzle plate is filled with mold agents, such as an adhesive agent and a filler (for example, patent document 1).

Japanese Patent Laying-Open No. 2015-166139

  Since the molding agent is exposed in the opening of the substrate, when the wiping member such as a wiper is used to wipe the nozzle surface of the nozzle plate, the molding agent may be rubbed and peeled off by the wiping member. . Further, liquid such as ink wiped from the nozzle surface by the wiping member may adhere to the molding agent, and the adhesive strength of the molding agent may be reduced due to damage from the liquid.

  SUMMARY An advantage of some aspects of the invention is that it provides a liquid ejecting head in which peeling of a molding agent at an opening edge of a substrate is suppressed, and a method for manufacturing the liquid ejecting head. is there.

The liquid ejecting head of the present invention has been proposed to achieve the above object, and includes a first surface exposed to the outside, and a nozzle plate having nozzles formed on the first surface;
A second surface exposed to the outside at a position deviating from the first surface, and a substrate having a step formed between the first surface and the second surface;
A mold agent bonded to the step surface on the first surface side of the step,
Asperities are formed on the step surface.

  According to the present invention, the bonding area of the molding agent can be increased by the unevenness of the step surface. As a result, the adhesive strength of the molding agent to the step surface can be increased, and the molding agent can be prevented from peeling off.

Further, in the above configuration, the stepped surface is a first surface that is formed by denting a part of the surface opposite to the second surface of the substrate halfway in the plate thickness direction and opening to the first surface side. With a recess
It is desirable that the molding agent is adhered in the first recess.

  According to this structure, the adhesion area of a molding agent can be increased more. As a result, the adhesive strength of the molding agent to the step surface can be further increased.

Furthermore, in the above configuration, the first recess is partitioned by a bottom surface formed along the second surface and a side surface extending in a direction intersecting the bottom surface,
A convex portion protruding toward the opposite side of the second surface is formed at a position away from the side surface of the bottom surface,
It is desirable that the height of the convex portion is lower than the height of the side surface.

  According to this configuration, it is possible to suppress the mold agent filled in the first recess from being detached from the first recess. As a result, the adhesive strength of the molding agent to the step surface can be further increased.

  In each of the above configurations, in the thickness direction of the substrate, the dimension from the surface opposite to the second surface to the bottom surface formed along the second surface of the first recess is, It is desirable that it is larger than half of the dimension from the surface opposite to the second surface to the second surface.

  According to this structure, the quantity of the molding agent with which it fills in a 1st recessed part can be increased more. As a result, the adhesive strength of the molding agent to the step surface can be further increased.

Furthermore, in each of the above-described configurations, the step surface includes a second recess that is formed by recessing a part of the second surface of the substrate halfway in the plate thickness direction and opened to the first surface side,
It is desirable that the molding agent is adhered in the second recess.

  According to this configuration, the bonding area of the molding agent can be further increased. Moreover, it can suppress that wiping members, such as a wiper, contact | wins and damages the opening edge of a board | substrate.

  In the above configuration, it is desirable that the first recess and the second recess communicate with each other through a through-hole penetrating in the thickness direction.

  According to this configuration, when the mold agent is filled in the first recess, air in the first recess is released from the through hole, so that the first recess is more reliably filled with the mold agent. Can do. Further, if the molding agent enters and solidifies into the through hole, it can be further suppressed that the molding agent is detached from the first recess. As a result, the adhesive strength of the molding agent to the step surface can be further increased.

Furthermore, in each of the above configurations, the step surface includes a groove recessed in the surface direction of the second surface,
The groove is preferably repeatedly provided along the extending direction of the step.

  According to this configuration, the molding agent is firmly fixed along the extending direction of the step.

Further, according to the method of manufacturing the liquid ejecting head of the invention, the first surface exposed to the outside, the nozzle plate having the nozzle formed on the first surface, and the position deviated from the first surface. Bonded to the second surface exposed to the outside, the substrate having a step formed between the first surface and the second surface, and the step surface on the first surface side of the step A liquid jet head manufacturing method comprising: a molding agent;
Forming a step for exposing the first surface to the substrate and forming a stepped surface on an edge of the opening; and
A mold agent bonding step of bonding a mold agent to the step surface in a state where the substrate is positioned so that a step is formed between the first surface and the second surface;
The substrate forming step includes an unevenness forming step of forming unevenness on the step surface.

  According to this method, it is possible to manufacture a liquid jet head in which peeling of the molding agent is suppressed.

  In the manufacturing method, it is preferable that the unevenness forming step is performed simultaneously with the formation of the opening.

  According to this method, a substrate having irregularities formed on the step surface can be easily manufactured.

  Furthermore, in the manufacturing method, it is preferable that the unevenness forming step is performed after the opening is formed.

  According to this method, it is possible to manufacture a stepped surface having a complicated uneven shape, and it is possible to manufacture a liquid jet head in which peeling of the molding agent is further suppressed.

FIG. 3 is a perspective view illustrating a configuration of a printer. FIG. 3 is an exploded perspective view of a recording head. It is sectional drawing explaining the structure of a unit head. FIG. 3 is an enlarged cross-sectional view of a main part of the recording head. It is a schematic diagram explaining the manufacturing method of a fixing plate. FIG. 6 is an enlarged cross-sectional view of a main part of a recording head according to a second embodiment. It is a schematic diagram explaining the manufacturing method of the stationary plate in 2nd Embodiment. It is a schematic diagram explaining the manufacturing method of the stationary plate in 2nd Embodiment. FIG. 10 is an enlarged cross-sectional view of a main part of a recording head according to a third embodiment. FIG. 10 is an enlarged cross-sectional view of a main part of a recording head according to a fourth embodiment. FIG. 10 is an enlarged cross-sectional view of a main part of a recording head according to a fifth embodiment. FIG. 10 is an enlarged plan view of a main part of a recording head according to a fifth embodiment. FIG. 10 is an enlarged plan view of a main part of a recording head according to a sixth embodiment. FIG. 10 is an enlarged plan view of a main part of a recording head according to a seventh embodiment. FIG. 10 is an exploded perspective view of a recording head according to an eighth embodiment. FIG. 20 is an enlarged plan view of a main part of a recording head according to an eighth embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the embodiments described below, various limitations are made as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the following description unless otherwise specified. However, the present invention is not limited to these embodiments. In the following, an ink jet recording head (hereinafter referred to as a recording head) which is a kind of liquid ejecting head according to the present invention, and an ink jet printer (hereinafter referred to as a printer) which is a kind of liquid ejecting apparatus equipped with the ink jet recording head. An example will be described.

  The configuration of the printer 1 will be described with reference to FIG. The printer 1 is an apparatus that records an image or the like by ejecting ink (a type of liquid) onto the surface of a recording medium 2 (a type of landing target) such as a recording paper. The printer 1 includes a recording head 3, a carriage 4 to which the recording head 3 is attached, a carriage moving mechanism 5 that moves the carriage 4 in the main scanning direction, a conveyance mechanism 6 that transfers the recording medium 2 in the sub scanning direction, and the like. Yes. Here, the ink is stored in an ink cartridge 7 as a liquid supply source. The ink cartridge 7 is detachably attached to the recording head 3. It is also possible to employ a configuration in which the ink cartridge is disposed on the main body side of the printer and supplied from the ink cartridge to the recording head through the ink supply tube.

  The carriage moving mechanism 5 includes a timing belt 8. The timing belt 8 is driven by a pulse motor 9 such as a DC motor. Therefore, when the pulse motor 9 operates, the carriage 4 is guided by the guide rod 10 installed on the printer 1 and reciprocates in the main scanning direction (width direction of the recording medium 2). The position of the carriage 4 in the main scanning direction is detected by a linear encoder (not shown) which is a kind of position information detecting means. The linear encoder transmits the detection signal, that is, the encoder pulse (a kind of position information) to the control unit of the printer 1.

  Next, the recording head 3 will be described. FIG. 2 is an exploded perspective view of the recording head 3. FIG. 3 is a cross-sectional view of the unit head 13 incorporated in the recording head 3. FIG. 4 is an enlarged cross-sectional view of a main part of the recording head 3. The recording head 3 is formed by laminating a holder 12, a plurality of unit heads 13, a fixed plate 14, and the like.

  The holder 12 is a synthetic resin member, and has a cartridge mounting portion 15 on the upper surface thereof. In the cartridge mounting portion 15, a plurality of ink introduction needles 16 are erected side by side along the main scanning direction corresponding to the inks of the ink cartridges 7 of the respective colors. The ink introduction needle 16 is a hollow needle-like member that is inserted into the ink cartridge 7. The ink stored in the ink cartridge 7 is introduced into a flow path (not shown) in the holder 12 through the ink introduction needle 16. The configuration for introducing the ink from the ink cartridge 7 into the holder 12 is not limited to the configuration using the ink introduction needle 16. For example, a porous member capable of absorbing ink is provided on each of the ink supply side and the reception side. It is also possible to employ a configuration in which ink is exchanged by providing and bringing the porous members into contact with each other.

  A plurality of unit heads 13 are attached below the holder 12. In the present embodiment, four unit heads 13 are arranged in parallel along the main scanning direction (that is, the direction orthogonal to the nozzle row direction) with the longitudinal direction aligned in the direction orthogonal to the main scanning direction. The unit heads 13 are bonded and fixed to the fixing plate 14 in a state of being positioned with respect to each other. The fixed plate 14 is a plate material formed of, for example, stainless steel (SUS), and protects the lower surface and side surfaces of the unit head 13. As shown in FIG. 2, the fixing plate 14 in the present embodiment is configured such that the peripheral portion thereof is bent upward (that is, the unit head 13 side) and is along the side surface of the unit head 13. In addition, four openings 14 a that expose the nozzles 24 of the unit heads 13 are formed in the fixed plate 14 corresponding to the unit heads 13. The number of unit heads 13 attached to the recording head 3 is not limited to four, and may be one or more. Further, the fixing plate 14 is not limited to one whose peripheral edge is bent upward, and a flat fixing plate can also be employed. The shape of the fixed plate 14, particularly the shape of the edge of the opening 14a will be described in detail later.

  Next, the configuration of the unit head 13 will be described. As shown in FIG. 3, the unit head 13 in the present embodiment is attached to the head case 19 in a state where the actuator unit 17 and the flow path unit 18 are stacked. For convenience, the stacking direction of each member will be described as the vertical direction.

  The head case 19 in the present embodiment is a box-shaped member made of synthetic resin. As shown in FIG. 3, a housing space 20 and a through space 22, which are long spaces along the nozzle row direction, are formed in the center portion of the head case 19. The accommodation space 20 is a space in which the actuator unit 17 is accommodated, and is recessed from the lower surface of the head case 19 to the middle of the plate thickness direction (that is, the direction orthogonal to the lower surface) by the thickness of the actuator unit 17. Is formed. The through space 22 communicates with the ceiling surface on the upper surface side of the accommodation space 20 and is formed in a state of penetrating the head case 19 in the plate thickness direction. A flexible cable 35 (a type of wiring member) that supplies a drive signal to a piezoelectric element 32 (described later) is disposed in the through space 22 and the accommodation space 20. 2 and 3, the flexible cable 35 extends from the upper surface opening of the through space 22 to the outside of the unit head 13 and is connected to a control board (not shown) provided in the holder 12. A liquid introduction path 21 through which ink flows is formed inside the head case 19. The liquid introduction path 21 is a flow path that connects a flow path in the holder 12 and a common liquid chamber 26 described later. In the present embodiment, the liquid introduction paths 21 are formed on both sides in the direction orthogonal to the nozzle row direction with the accommodation space 20 and the through space 22 interposed therebetween.

  A flow path unit 18 is connected to the lower surface of the head case 19. The flow path unit 18 is a long substrate along the nozzle row direction in which the communication substrate 25, the nozzle plate 23, and the compliance substrate 37 are laminated. The communication substrate 25 is a silicon plate material, and in this embodiment, is formed from a silicon single crystal substrate having a crystal plane orientation of the surface (upper surface and lower surface) as a (110) plane. As shown in FIG. 3, the communication substrate 25 communicates with the liquid introduction path 21, stores a common liquid chamber 26 in which ink common to the pressure chambers 30 is stored, and introduces liquid through the common liquid chamber 26. An individual communication path 27 that individually supplies ink from the passage 21 to each pressure chamber 30 and a nozzle communication path 28 that connects the pressure chamber 30 and the nozzle 24 are formed by anisotropic etching. The common liquid chamber 26 is a long space along the nozzle row direction, and is formed on both sides corresponding to the liquid introduction path 21. A plurality of individual communication passages 27 are opened at positions corresponding to the pressure chambers 30 of the common liquid chamber 26. That is, a plurality of the individual communication paths 27 are formed along the direction in which the pressure chambers 30 are arranged in parallel (in other words, the nozzle row direction). Similarly, a plurality of nozzle communication paths 28 are also formed along the nozzle row direction.

  The nozzle plate 23 is a silicon substrate (for example, a silicon single crystal substrate) bonded to the lower surface of the communication substrate 25 (that is, the surface opposite to the pressure chamber forming substrate 29). The nozzle plate 23 of the present embodiment is joined to a region that is out of the compliance substrate 37 so as not to overlap the compliance substrate 37. In other words, the nozzle plate 23 is joined to a central region that is out of the opening on the lower surface side of the common liquid chamber 26 of the communication substrate 25. On the nozzle surface 40 (corresponding to the first surface in the present invention) which is the lower surface of the nozzle plate 23, a plurality of nozzles 24 (referred to as nozzle rows) are linear (in other words, along the longitudinal direction of the nozzle plate 23). (In line). In the present embodiment, two rows of nozzle rows are formed corresponding to the rows of pressure chambers 30 formed in two rows. The plurality of nozzles 24 (nozzle rows) arranged side by side are provided at equal intervals from the nozzle 24 on one end side to the nozzle 24 on the other end side at a pitch corresponding to the dot formation density.

  The compliance substrate 37 is a flexible substrate bonded to the lower surface of the communication substrate 25 and corresponding to the common liquid chamber 26. That is, the compliance substrate 37 is bonded to a region of the communication substrate 25 that is not covered with the nozzle plate 23. The compliance substrate 37 in the present embodiment is a plate material in which a sealing film 39 having low rigidity and flexibility is laminated on a fixed substrate 38 made of a hard material such as metal. A region of the fixed substrate 38 that faces the common liquid chamber 26 is an opening that is removed in the thickness direction. For this reason, the lower surface of the common liquid chamber 26 is sealed only by the sealing film 39 and functions as a compliance unit that absorbs the pressure fluctuation of the ink in the common liquid chamber 32. Further, the compliance substrate 37 in the present embodiment is formed on the outer periphery of the nozzle plate 23. That is, the compliance substrate 37 has an opening (not shown) that exposes the nozzle plate 23 (specifically, the nozzle surface 40). A portion of the compliance substrate 37 that does not face the common liquid chamber 26 has a two-layer structure of a fixed substrate 38 and a sealing film 39. In addition, it is also possible to adopt a configuration in which compliance substrates having shapes corresponding to the common liquid chambers are bonded to both sides with the nozzle plate interposed therebetween, corresponding to the common liquid chambers formed in two rows.

  As shown in FIG. 3 and FIG. 4, the fixing plate 37 (specifically, the nozzle surface 40) is exposed on the lower surface of the compliance substrate 37 (specifically, the fixing substrate 38) with the opening 14 a exposed. 14 is joined. The edge of the opening 14 a of the fixed plate 14, that is, the end of the fixed plate 14 on the nozzle plate 23 side is retracted to the opposite side of the nozzle plate 23 from the end of the compliance substrate 37 on the nozzle plate 23 side. A gap 41 is formed between the compliance substrate 37 and the nozzle plate 23. The gap 41 is filled with a molding agent 42 such as an adhesive or a filler. The molding agent 42 in this embodiment is filled from the end surface (step surface 45 described later) of the fixed plate 14 on the nozzle plate 23 side to the end surface of the nozzle plate 23 on the fixed plate 14 side. That is, the molding agent 42 is bonded to the step surface 45 of the fixing plate 14 and extends toward the nozzle plate 23 side. By this molding agent 42, the end of the joint portion between the communication substrate 25 and the compliance substrate 37, the end of the joint portion between the communication substrate 25 and the nozzle plate 23, and the end of the joint portion between the compliance substrate 37 and the fixing plate 14 are formed. Covered. Thereby, it can suppress that a liquid approachs an inside through these junction parts, and the liquid inside the unit head 13 leaks.

  As shown in FIG. 3, the actuator unit 17 in the present embodiment is a unit formed by stacking a pressure chamber forming substrate 29, a vibration plate 31, a piezoelectric element 32, and a sealing plate 33. The actuator unit 17 is formed in a size that can be accommodated in the accommodating space 20 of the head case 19, and is accommodated in the accommodating space 20.

  The pressure chamber forming substrate 29 is a hard plate made of silicon, and in the present embodiment, is produced from a silicon single crystal substrate having the crystal plane orientation of the surface (upper surface and lower surface) as the (110) plane. A part of the pressure chamber forming substrate 29 is completely removed in the plate thickness direction by anisotropic etching, and a plurality of spaces to be the pressure chambers 30 are arranged in parallel along the nozzle row direction. The space is partitioned by the communication substrate 25 on the lower side and partitioned by the diaphragm 31 to form the pressure chamber 30. Further, this space, that is, the pressure chamber 30 is formed long in a direction orthogonal to the nozzle row direction, and the individual communication path 27 communicates with one end portion in the longitudinal direction, and the nozzle is formed at the other end portion. The communication path 28 communicates.

  The diaphragm 31 is a thin film member having elasticity, and is laminated on the upper surface of the pressure chamber forming substrate 29 (that is, the surface opposite to the communication substrate 25 side). The diaphragm 31 seals the upper opening of the space to be the pressure chamber 30. In other words, the upper surface of the pressure chamber 30 is partitioned by the diaphragm 31. A portion of the diaphragm 31 corresponding to the pressure chamber 30 (specifically, an upper opening of the pressure chamber 30) functions as a displacement portion that displaces in a direction away from or close to the nozzle 24 as the piezoelectric element 32 is bent and deformed. To do. That is, a region corresponding to the upper opening of the pressure chamber 30 in the diaphragm 31 is a drive region where bending deformation is allowed. The volume of the pressure chamber 30 changes due to the deformation (displacement) of the drive region (displacement portion). On the other hand, a region of the diaphragm 31 that is out of the upper opening of the pressure chamber 30 is a non-driving region in which bending deformation is hindered.

The diaphragm 31 includes, for example, an elastic film made of silicon dioxide (SiO ₂ ) formed on the upper surface of the pressure chamber forming substrate 29, and an insulator film made of zirconium dioxide (ZrO ₂ ) formed on the elastic film. , Consisting of. And the piezoelectric element 32 is laminated | stacked on the area | region (namely, drive area | region) corresponding to each pressure chamber 30 on this insulating film (surface on the opposite side to the pressure chamber formation board | substrate 29 side of the diaphragm 31). It is also possible to adopt a configuration in which the pressure chamber forming substrate and the diaphragm are integrated. In other words, an etching process is performed from the lower surface side of the pressure chamber forming substrate, a pressure chamber is formed on the upper surface side leaving a thin portion with a thin plate thickness, and a configuration in which this thin portion functions as a diaphragm may be adopted. it can.

  The piezoelectric element 32 in the present embodiment is a so-called flexural mode piezoelectric element. A plurality of the piezoelectric elements 32 are arranged in parallel along the nozzle row direction corresponding to each nozzle 24. Each piezoelectric element 32 is formed by sequentially laminating, for example, a lower electrode layer serving as an individual electrode, a piezoelectric layer, and an upper electrode layer serving as a common electrode in order from the vibration plate 31. Note that the lower electrode layer can be a common electrode and the upper electrode layer can be an individual electrode depending on the convenience of the drive circuit and wiring. The piezoelectric element 32 configured as described above bends and deforms in a direction away from or close to the nozzle 24 when an electric field corresponding to the potential difference between both electrodes is applied between the lower electrode layer and the upper electrode layer.

  As shown in FIG. 3, the sealing plate 33 is a substrate on which a piezoelectric element accommodation space 34 that can accommodate the piezoelectric elements 32 is formed. The sealing plate 33 is joined to the vibration plate 31 in a state where the piezoelectric element 32 is accommodated in the piezoelectric element accommodation space 34. In the present embodiment, two rows of piezoelectric element accommodating spaces 34 are formed corresponding to the rows of piezoelectric elements 32 formed in two rows. A connection space 36 is formed between the two piezoelectric element accommodation spaces 34 in which the sealing plate 33 is removed in the thickness direction. The connection space 36 communicates with the through space 22, and an end portion of the flexible cable 35 inserted into the through space 22 is disposed therein. In addition, as a sealing plate, the flat member in which a piezoelectric element accommodation space is not formed is also employable. In this case, a space for accommodating the piezoelectric element is formed by increasing the thickness of the adhesive for joining the vibration plate and the sealing plate and surrounding the periphery of the piezoelectric element with this adhesive. Further, it is possible to adopt a configuration in which a circuit such as a drive circuit or wiring is formed on the sealing plate itself.

  The unit head 13 formed as described above introduces ink from the ink cartridge 7 into the pressure chamber 30 via the liquid introduction path 21, the common liquid chamber 26 and the individual communication path 27. In this state, a drive signal from the control unit is supplied to the piezoelectric element 32 via the flexible cable 35, whereby the piezoelectric element 32 is driven to change the volume of the pressure chamber 30. By utilizing the pressure fluctuation accompanying the change in volume, ink droplets are ejected from the nozzle 24 communicating with the pressure chamber 30 via the nozzle communication path 28.

  Next, the shape of the fixing plate 14, particularly the bonding location with the molding agent 42 will be described in detail. 2 and 3, the fixing plate 14 in the present embodiment includes a bottom plate 46 in which an opening 14a is formed, and a side wall 47 extending upward (from the unit head 13 side) from the outer peripheral edge of the bottom plate 46. I have. The side wall 47 of the fixing plate 14 extends along the side surface of the unit head 13 and is joined to the side surface of the unit head 13. The bottom plate 46 of the fixed plate 14 is bonded to the compliance substrate 37 with the nozzle surface 40 of the nozzle plate 23 exposed in the opening 14a. Here, since the rigidity of the fixing plate 14 increases as the thickness thereof increases, the fixing plate 14 is resistant to external impact and is easy to handle. On the other hand, it becomes difficult to bend, and burrs are likely to occur during punching. On the other hand, the thinner the fixing plate 14 is, the easier it is to bend or the burrs are less likely to occur during punching. However, since rigidity becomes weak, it becomes weak to the impact from the outside, and becomes difficult to handle. For this reason, it is desirable that the thickness of the fixing plate 14 be 0.05 mm to 1.02 mm from the viewpoint of securing rigidity and ease of processing. The thickness of each part of the fixing plate 14 in this embodiment is set to 0.08 mm.

  As shown in FIG. 4, the exposed surface 43 (corresponding to the second surface in the present invention) which is the lower surface (surface opposite to the compliance substrate 37) of the bottom plate 46 of the fixed plate 14 is the nozzle surface of the nozzle plate 23. It is located below 40, that is, on the landing target side during the injection operation. In other words, the exposed surface 43 is exposed to the outside below the nozzle surface 40 at a position away from the nozzle surface 40. Further, as described above, the end of the bottom plate 46 of the fixed plate 14 on the nozzle plate 23 side is located on the opposite side of the nozzle plate 23 from the end of the compliance substrate 37 on the nozzle plate 23 side. That is, a part of the compliance substrate 37 protrudes into the opening 14a. A step 44 formed by the edge of the opening 14a is formed between the compliance substrate 37 and the exposed surface 43 protruding into the opening 14a. Since the nozzle surface 40 is exposed in the opening 14 a, the step 44 is formed between the exposed surface 43 and the nozzle surface 40. The surface of the step 44 on the nozzle plate 23 side is the step surface 45 in the present invention.

  Irregularities are formed on the step surface 45. In the present embodiment, fine irregularities that are invisible are formed on the surface of the step surface 45. The arithmetic average roughness (Ra) of the surface of the stepped surface 45 is preferably larger than the arithmetic average roughness (Ra) of the surface of the exposed surface 43, and the arithmetic average roughness ( It is more desirable to be larger than Ra). In the present embodiment, the arithmetic average roughness (Ra) of the surface of the fixing plate 14 other than the step surface 45 is substantially the same, and is smaller than the arithmetic average roughness (Ra) of the surface of the step surface 45. It has become. The end of one side of the molding agent 42 (the side opposite to the nozzle plate 23) is bonded to the step surface 45. Note that the end portion on the other side (nozzle plate 23 side) of the molding agent 42 is bonded to the end surface of the nozzle plate 23.

  Thus, since the unevenness | corrugation was formed in the level | step difference surface 45 to which the molding agent 42 adhere | attaches, the adhesion area of the molding agent 42 can be increased by this unevenness | corrugation. That is, the molding agent 42 before solidifying enters the depth of the concave and convex valleys of the step surface 45, and the molding agent 42 is solidified in this state, so that the contact area between the molding agent 42 and the step surface 45 can be increased. . As a result, the adhesive strength of the molding agent 42 to the stepped surface 45 can be increased, and the molding agent 42 can be prevented from peeling off. In particular, in the present embodiment, the step surface 45 is formed below the nozzle surface 40, and accordingly, the molding agent 42 is partially formed below the nozzle surface 40, including one end. The molding agent 42 in this portion is easily rubbed by a wiping member such as a wiper that wipes the nozzle surface 40. However, since the adhesive strength of the molding agent 42 to the stepped surface 45 is increased, it is possible to prevent the end portion on one side of the molding agent 42 from peeling off.

  Next, a method for manufacturing the recording head 3 will be described. First, a method for manufacturing the fixing plate 14 will be described. First, as shown in FIG. 5, in the substrate forming process, a nozzle surface 40 (this embodiment) is formed on a flat plate made of stainless steel (SUS) (a plate that becomes the fixed plate 14; hereinafter simply referred to as the fixed plate 14). In the embodiment, the opening 14a exposing the nozzle plate 23) is formed, and the step surface 45 is formed at the edge of the opening 14a. Specifically, from one surface (for example, exposed surface 43) side of the fixed plate 14 toward the other surface (for example, a bonding surface with the compliance substrate 37) side, a pressing die 48 (corresponding to the opening 14a) ( Specifically, the opening 14a is opened by pressing (punching) using a male die 48a and a female die 48b). In the present embodiment, the four openings 14a are formed so as to be aligned along a direction orthogonal to the nozzle row direction. Each opening 14a is formed in a size that allows the nozzle plate 23 to be exposed. It should be noted that the four openings 14a may be simultaneously opened by a single press process, or may be configured to form a single opening 14a by a single press process, so that a total of four press processes can be opened. You may make it let it. In addition, when burrs are generated at the edge of the opening 14a by pressing, pressing may be performed from the other surface side so as to crush the burrs, or the burrs may be removed by a file or the like.

  The substrate forming process includes an unevenness forming process for forming unevenness on the step surface 45. This unevenness forming step includes a method that is performed simultaneously with the formation of the opening 14a by pressing, and a method that is performed after the opening 14a is formed. For example, as the former method, there is a method in which irregularities are formed in advance on the pressing surface (in other words, the pressing surface) or the side surface of the press die 48, and the irregularities are formed on the step surface 45 when the opening 14a is formed by pressing. is there. Further, as the latter method, a method of physically rubbing the surface by rubbing the step surface 45 with a file, a method of physically rubbing the surface by spraying fine particles such as iron on the step surface 45, and a specific solution There is a method of chemically roughing the surface by immersing a portion including the stepped surface 45 into the surface. If the opening 14a is formed in the fixing plate 14 and the unevenness is formed in the stepped surface 45 in this way, the outer peripheral edge of the fixing plate 14 is opposite to the other (exposed to the exposed surface 43) by pressing (bending or drawing). The frame-like side wall 47 is formed.

  Next, the recording agent 3 is manufactured by injecting the molding agent 42 in a state where the unit head 13 is attached to the fixed plate 14 by the molding agent bonding step. Specifically, the unit head 13 is fixed so that the nozzle plate 23 is exposed to each opening 14 a of the fixing plate 14. More specifically, with the unit heads 13 positioned, the fixing plate 14 and the fixing substrate 38 of the compliance substrate 37 are bonded with an adhesive. In the state where the unit head 13 is positioned with respect to the fixed plate 14, a step 44 formed by the edge of the opening 14 a of the fixed plate 14 is formed between the nozzle surface 40 and the exposed surface 43. In this state, a liquid molding agent 42 is applied between the fixed plate 14 and the nozzle plate 23 using a method such as despacer or transfer printing, and solidified. As a result, the molding agent 42 is adhered to the step surface 45, and the molding agent 42 is filled in the gap 41 between the compliance substrate 37 of the unit head 13 and the nozzle plate 23, and the recording head 3 is created. It is also possible to inject the molding agent 42 between the side wall 47 of the fixed plate 14 and the side surface of the unit head 13 and between the side surfaces of the adjacent unit heads 13.

  As described above, since the molding agent 42 is adhered to the step surface 45 in a state where the irregularity is formed on the step surface 45 by the irregularity forming step, it is possible to manufacture the recording head 3 in which the peeling of the molding agent 42 is suppressed. it can. If the unevenness forming step is performed simultaneously with the formation of the opening 14 a of the fixed plate 14, the number of manufacturing steps of the recording head 3 can be reduced, and the fixed plate 14 with unevenness formed on the stepped surface 45, and thus the recording head 3 can be manufactured. Becomes easier. Further, if the unevenness forming step is performed after the opening 14a is formed, the unevenness of the stepped surface 45 can be formed by various methods, so that the unevenness (roughness) of the stepped surface 45 can be easily controlled. For example, it is possible to further suppress the peeling of the molding agent 42 by making the surface of the step surface 45 rougher.

  By the way, in the above-described first embodiment, fine irregularities are formed on the step surface 45, but the present invention is not limited to this. In other embodiments shown in FIGS. 6 to 14, larger unevenness is formed on the step surface 45.

  Specifically, in the second embodiment shown in FIG. 6, the upper surface of the step surface 45 (on the compliance substrate 37 side) is recessed to form irregularities. More specifically, the step surface 45 in the present embodiment has a part of the surface opposite to the exposed surface 43 of the fixed plate 14 (more specifically, the edge of the opening 14a) recessed in the middle of the plate thickness direction. The upper concave portion 51 (corresponding to the first concave portion in the present invention) is provided. The upper concave portion 51 opens to the nozzle surface 40 (that is, the nozzle plate 23) side, and forms an unevenness on the step surface 45. In other words, the upper concave portion 51 is a portion in which a part of the step surface 45 (a portion including the edge opposite to the exposed surface 43) is recessed along the exposed surface 43 on the opposite side to the nozzle plate 23. As shown in FIG. 6, the upper concave portion 51 in the present embodiment includes a bottom surface 51 a formed along the exposed surface 43, and a bottom surface 51 a from one end of the bottom surface 51 a (the side opposite to the nozzle plate 23). It is demarcated by a side surface 51b extending in a direction that intersects (orthogonal in the present embodiment). The molding agent 42 is adhered to the unevenness of the step surface 45, that is, the step surface 45 in the upper recess 51 and the outer step surface 45 of the upper recess 51. Thereby, the adhesion area of the molding agent 42 can be increased. As a result, the adhesive strength of the molding agent 42 to the stepped surface 45 can be increased, and the molding agent 42 can be prevented from peeling off. In particular, the molding agent 42 in the present embodiment is filled in the upper concave portion 51 and adhered to the compliance substrate 37 corresponding to the bottom surface 51a, the side surface 51b, and the upper concave portion 51 in the upper concave portion 51, so that the adhesive strength is further increased. be able to.

  Here, in the plate thickness direction of the fixing plate 14, the dimension from the surface opposite to the exposed surface 43 (that is, the bonding surface with the compliance substrate 37) to the bottom surface 51 a of the upper recess 51 (in other words, the upper recess 51. The depth (or the height of the side surface 51b) is preferably 30 μm or more. In the present embodiment, the dimension from the surface opposite to the exposed surface 43 to the exposed surface 43 (in other words, the thickness of the fixed plate 14) is 80 μm, and the bottom surface of the upper recess 51 from the surface opposite to the exposed surface 43. The dimension up to 51a is set to 30 μm. In the thickness direction of the fixed plate 14, the dimension from the surface opposite to the exposed surface 43 to the bottom surface 51 a of the upper recess 51 is half of the dimension from the surface opposite to the exposed surface 43 to the exposed surface 43. Larger is more desirable. That is, it is desirable that the depth of the upper recess 51 is deeper than half of the thickness of the fixed plate 14. In this way, the amount of the molding agent 42 filled in the upper concave portion 51 can be increased. As a result, the adhesive strength of the molding agent 42 to the step surface 45 can be further increased. Since other configurations are the same as those of the first embodiment described above, description thereof is omitted.

  Next, a method for manufacturing the fixing plate 14 in the present embodiment will be described. First, similarly to the first embodiment described above, in the substrate forming step, the opening 14a that exposes the nozzle surface 40 is formed in the fixing plate 14, and the step surface 45 and the unevenness are formed on the edge of the opening 14a. That is, as shown in FIG. 7, the first corresponding to the opening 14a from the exposed surface 43 side of the fixing plate 14 toward the surface opposite to the exposed surface 43 (that is, the bonding surface with the compliance substrate 37). The opening 14a is opened by pressing (punching) using the pressing die 53. If the opening 14 a is formed in the fixing plate 14, the unevenness is formed on the stepped surface 45 by the unevenness forming process. As shown in FIG. 8, the unevenness forming step in the present embodiment is performed by pressing from the surface opposite to the exposed surface 43 toward the exposed surface 43 of the fixing plate 14 rather than the first pressing die 53. The edge of the opening 14a is crushed in the middle of the fixing plate 14 in the thickness direction by press working using the second pressing die 54 having a slightly larger value. Thereby, the upper recessed part 51 is formed in the edge of the opening 14a of the fixing plate 14. That is, the fixing plate 14 having the unevenness 45 formed on the step surface 45 is created. Thus, the uneven | corrugated formation process included in the board | substrate formation process in this embodiment is performed after the opening 14a is formed. In addition, when the burr | flash has generate | occur | produced in the edge of the opening 14a, a burr | flash can be crushed by the press work by this 2nd type | mold 54 for presses. Further, the unevenness forming step can be performed simultaneously with the formation of the opening 14a. For example, processing is performed in one step using a stepped pressing die in which a punching pressing die and a crushing pressing die are integrated. Other than that, the manufacturing method and the like of the recording head 3 are the same as those in the first embodiment described above, and thus the description thereof is omitted.

  Further, in the third embodiment shown in FIG. 9, a convex portion 55 is formed in the upper concave portion 51 of the step surface 45 so that the molding agent 42 is more difficult to come off. Specifically, the step surface 45 in the present embodiment is formed by recessing a part of the surface on the side opposite to the exposed surface 43 of the fixing plate 14 in the middle of the plate thickness direction, as in the second embodiment. An upper recess 51 is provided. That is, the upper concave portion 51 is partitioned by a bottom surface 51a formed along the exposed surface 43 and a side surface 51b extending from one end of the bottom surface 51a in a direction intersecting the bottom surface 51a. And the convex part 55 which protruded toward the opposite side to the exposed surface 43 in the position away from the side surface 51b is formed in the bottom face 51a of the upper recessed part 51. As shown in FIG. The convex portion 55 in the present embodiment projects from the edge of the opening 14 a on the nozzle plate 23 side of the upper concave portion 51. The height of the convex portion 55 (that is, the dimension from the bottom surface 51a to the tip of the convex portion 55) is higher than the height of the side surface 51b (that is, the dimension from the bottom surface 51a to the surface opposite to the exposed surface 43). It is formed low. Therefore, in the upper concave portion 51, the interval between the convex portion 55 and the compliance substrate 37 is narrower than the interval between the bottom surface 51 a on the back side (that is, the side surface 51 b side) and the compliance substrate 37 than the convex portion 55. That is, the upper concave portion 51 is a space in which the inlet side (that is, the nozzle plate 23 side) is narrowed.

  Then, the molding agent 42 enters from the entrance side to the back side of the upper recess 51 and is solidified. As described above, by providing the convex portion 55 on the inlet side of the upper concave portion 51, it is possible to impart resistance to the removal of the molding agent 42. That is, the convex portion 55 that protrudes from the bottom surface 51 a toward the opposite side of the exposed surface 43 functions as a retaining agent for the molding agent 42. Thereby, it can suppress that the molding agent 42 with which the upper recessed part 51 was filled isolate | separates from the said upper recessed part 51. FIG. As a result, the adhesive strength of the molding agent 42 to the step surface 45 can be further increased. In addition, such a fixing plate 14 can be created by using, for example, a pressing die in which a concave portion is formed in a region corresponding to the convex portion 55 of the press surface when the upper concave portion 51 is formed by press working. Alternatively, when the opening 14a is formed by press working, a burr can be generated at the edge of the opening 14a, and the burr can be crushed to form the convex portion 55. Other configurations and manufacturing methods are the same as those of the above-described second embodiment, and thus description thereof is omitted.

  Furthermore, in the fourth embodiment shown in FIG. 10, an upper recess 51 and a lower recess 56 (corresponding to the second recess in the present invention) are formed on the step surface 45. Specifically, the step surface 45 in the present embodiment is a part of the surface opposite to the exposed surface 43 of the fixed plate 14 (more specifically, the edge of the opening 14a) in the middle of the plate thickness direction from the surface side. And a lower recess 56 formed by recessing a part of the exposed surface 43 of the fixing plate 14 (more specifically, the edge of the opening 14a) from the exposed surface 43 side to the middle of the plate thickness direction. And. The upper concave portion 51 and the lower concave portion 56 each open to the nozzle plate 23 side and form irregularities on the step surface 45. Similar to the second embodiment described above, the upper recess 51 is partitioned by a bottom surface 51a formed along the exposed surface 43 and a side surface 51b extending in a direction intersecting the bottom surface 51a. The lower recess 56 is also defined by a bottom surface 56a formed along the exposed surface 43 and a side surface 56b extending in a direction intersecting the bottom surface 56a. That is, the upper concave portion 51 and the lower concave portion 56 are formed by denting a part of the step surface 45 along the exposed surface 43 on the side opposite to the nozzle plate 23 while leaving a part of the step surface 45 in the plate thickness direction. Part. For this reason, the middle part in the plate thickness direction of the step surface 45 has a shape protruding to the nozzle plate 23 side. In the present embodiment, the width of the upper recess 51 (the nozzle plate 23 on the bottom surface 51a) is wider than the width of the lower recess 56 (the dimension from the end of the bottom surface 56a on the nozzle plate 23 side to the end opposite to the nozzle plate 23). The dimension from the side end to the end opposite to the nozzle plate 23) is formed wider. In addition, the width | variety of the upper recessed part 51 and the width | variety of the lower recessed part 56 can be set arbitrarily. For example, the width of the lower recess 56 may be equal to the width of the upper recess 51, and the width of the lower recess 56 may be wider than the width of the upper recess 51.

  The molding agent 42 is filled in the upper recess 51 and the lower recess 56. That is, the molding agent 42 is bonded to the bottom surface 51 a, the side surface 51 b and the compliance substrate 37 corresponding to the upper recess 51 in the upper recess 51, and the bottom surface 56 a and the side surface 56 b in the lower recess 56. Thereby, since the adhesion area of the molding agent 42 can be increased further, the adhesive strength can be further increased. Further, in this embodiment, the corner of the opening 14a on the exposed surface 43 side of the fixed plate 14 is cut when the lower concave portion 56 is pressed, so that a wiping member such as a wiper hits the corner and breaks. This can be suppressed. In addition, such a fixing plate 14 is formed by, for example, forming the upper concave portion 51 by pressing as in the second embodiment, and then crushing a part of the exposed surface 43 to form the lower concave portion 56 by pressing again. It is obtained by forming. Other configurations and manufacturing methods are the same as those of the above-described second embodiment, and thus description thereof is omitted.

  Further, in the fifth embodiment shown in FIGS. 11 and 12, a through hole 57 that communicates the upper recess 51 and the lower recess 56 is formed. Specifically, as in the fourth embodiment, the step surface 45 in the present embodiment is a part of the surface opposite to the exposed surface 43 of the fixed plate 14 from the surface side to the middle in the plate thickness direction. An upper concave portion 51 is formed, and a lower concave portion 56 is formed by denting a part of the exposed surface 43 of the fixed plate 14 from the exposed surface 43 side to the middle of the plate thickness direction. A through hole 57 penetrating in the plate thickness direction is formed in the fixing plate 14 between the bottom surface 51 a of the upper recess 51 and the bottom surface 56 a of the lower recess 56. As shown in FIG. 12, a plurality of the through holes 57 are formed along the extending direction of the edge of the opening 14a.

  The molding agent 42 is filled in the upper concave portion 51 and the lower concave portion 56 as in the fourth embodiment. In the present embodiment, the molding agent 42 is further filled in the through hole 57. As a result, not only the bonding area of the molding agent 42 increases, but the molding agent 42 that has entered the through hole 57 functions as an anchor, and the molding agent 42 can be further prevented from separating from the upper recess 51 and the lower recess 56. . As a result, the adhesive strength of the molding agent 42 to the step surface 45 can be further increased. Further, when the molding agent 42 is filled in the upper concave portion 51, air escapes from the through hole 57, so that it is possible to suppress the air from remaining in the upper concave portion 51. Thereby, the inside of the upper recessed part 51 can be more reliably filled with the molding agent 42, and adhesive strength can further be improved. Note that such a fixing plate 14 can be obtained, for example, by forming the upper concave portion 51 and the lower concave portion 56 by pressing as in the third embodiment, and then forming the through hole 57 with a punch or the like. Other configurations and manufacturing methods are the same as those of the above-described third embodiment, and thus description thereof is omitted.

  Incidentally, in the second to fifth embodiments described above, the uneven shape of the step surface 45 is aligned along the extending direction of the step 44 (that is, the extending direction of the edge of the opening 14a). Is not limited. For example, in the other embodiments shown in FIGS. 13 and 14, the unevenness is repeatedly formed along the extending direction of the step 44.

  Specifically, in the sixth embodiment shown in FIG. 13, the planar direction from the stepped surface 45 to the exposed surface 43 (more specifically, the surface direction of the exposed surface 43 and the edge of the opening 14 a in plan view) A plurality of rectangular grooves 58 that are recessed on the opposite side are formed. That is, the step surface 45 includes a plurality of rectangular grooves 58 that are recessed in the surface direction of the exposed surface 43. Each groove 58 is formed so as to penetrate in the plate thickness direction. That is, each groove 58 extends along the plate thickness direction. The groove 58 is repeatedly provided along the edge of the opening 14a (in other words, the extending direction of the step 44). The grooves 58 in this embodiment are formed at this pitch along the edge of the opening 14a. The molding agent 42 enters the groove 58 and is solidified. Thereby, the adhesion area of the molding agent 42 can be increased, and adhesive strength can be raised. In particular, since the molding agent 42 is firmly fixed along the edge of the opening 14a, it is possible to suppress the peeling of the molding agent 42 even if a force is applied to the molding agent 42 along the extending direction of the step 44. Note that such a groove 58 is formed simultaneously with the formation of the opening 14a by using, for example, a pressing die having a portion (convex portion) corresponding to the groove 58 when the opening 14a is formed by pressing. It is formed. Further, after forming the opening 14a by press working, the groove 58 may be formed by separate press working. Other configurations and manufacturing methods are the same as those in the first embodiment described above, and thus description thereof is omitted.

  In the seventh embodiment shown in FIG. 14, the planar direction from the step surface 45 to the exposed surface 43 (more specifically, the surface direction of the exposed surface 43 and opposite to the edge of the opening 14 a) in plan view. ), A plurality of wedge-shaped grooves 58 are formed. In other words, the step surface 45 includes a plurality of wedge-shaped grooves 58 that are recessed in the surface direction of the exposed surface 43. Each groove 58 in the present embodiment is also formed in a state of penetrating in the plate thickness direction, similarly to the above-described sixth embodiment. And this groove | channel 58 is repeatedly provided along the edge of the opening 14a. The grooves 58 in this embodiment are also formed at this pitch along the edge of the opening 14a. The molding agent 42 enters into the groove 58 and solidifies by capillary force. Thereby, the adhesion area of the molding agent 42 can be increased, and adhesive strength can be raised. In particular, since the molding agent 42 is firmly fixed along the edge of the opening 14a, it is possible to suppress the peeling of the molding agent 42 even if a force is applied to the molding agent 42 along the extending direction of the step 44. Other configurations and manufacturing methods are the same as those of the above-described sixth embodiment, and thus description thereof is omitted.

  In addition, the shape of the level | step difference surface illustrated to each above-mentioned embodiment can be combined, respectively. For example, the fine unevenness exemplified in the first embodiment may be formed on the tip surface of the stepped surface exemplified in the second to seventh embodiments. Moreover, you may form the groove | channel illustrated by 6th and 7th embodiment in the front-end | tip of the unevenness | corrugation illustrated by 2nd-5th embodiment. That is, it is also possible to adopt a configuration in which a plurality of grooves are repeatedly formed along the same direction at the tip of the ridge extending along the extending direction of the step. Furthermore, the shape of the groove is not limited to the shape exemplified in the sixth and seventh embodiments described above, and various shapes into which the molding agent 42 can enter can be employed.

  By the way, in each above-mentioned embodiment, although fixed board 14 was illustrated as a substrate of the present invention, it is not restricted to this. For example, the present invention can be applied to a cover member that protects the bottom and side surfaces of the recording head 3. For example, in the eighth embodiment shown in FIGS. 15 and 16, the cover member 65 is provided outside the fixing plate 64, and the step surface of the opening 65 a of the cover member 65 (first step surface 70 described later) is provided. Unevenness is formed. FIG. 15 is an exploded perspective view of the recording head 3 in the eighth embodiment. FIG. 16 is an enlarged plan view of the main part of the recording head 3 according to the eighth embodiment.

  As shown in FIG. 15, the recording head 3 in the present embodiment is formed by laminating a cover member 65 in addition to a holder 12, a plurality of unit heads 13, and a fixed plate 64. In addition, the fixed plate 64 in the present embodiment is formed in a flat plate shape. As in the first embodiment, four openings 64a are formed in the fixed plate 64, and the nozzle plate 23 of each unit head 13 is exposed in each opening 64a. The fixing plate 64 is bonded to the compliance substrate 37 as in the first embodiment. 15 and 16, a cover member 65 (corresponding to a substrate in the present invention) made of, for example, stainless steel (SUS) is attached below the compliance substrate 37. As shown in FIG. 15, the cover member 65 is configured such that the peripheral edge portion thereof is bent upward (that is, the unit head 13 side) to protect the side surface of the unit head 13. That is, the side wall stands up from the peripheral edge of the bottom plate, which is the portion fixed to the fixing plate 64 of the cover member 65. The cover member 65 (specifically, the bottom plate) is formed with a plurality (four in this embodiment) of openings 65a that expose the nozzle plate 23 according to each unit head 13.

  Further, in the present embodiment, as shown in FIG. 16, the edge of the opening 65 a of the cover member 65, that is, the end of the cover member 65 on the nozzle plate 23 side is the edge of the opening 64 a of the fixing plate 64, that is, fixed. The end of the plate 64 on the nozzle plate 23 side is retracted to the side opposite to the nozzle plate 23. As in the first embodiment described above, the gap 41 between the compliance substrate 37 and the nozzle plate 23 is filled with a molding agent 42. The molding agent 42 in the present embodiment is filled from the end surface of the cover member 65 on the nozzle plate 23 side (that is, the first step surface 70) to the end surface of the nozzle plate 23 on the cover member 65 side. Thereby, the end of the joint portion between the cover member 65 and the fixing plate 64 can be covered with the molding agent 42. Note that the lower surface of the fixing plate 64 (the surface on the cover member 65 side) is covered with the cover member 65, and the portion removed from the cover member 65 is also covered with the molding agent 42, so it is not exposed. On the other hand, the lower surface of the cover member 65 (the surface opposite to the fixed plate 64) is an exposed surface 67 exposed to the outside. That is, the exposed surface 67 which is the lower surface of the cover member 65 corresponds to the second surface in the present invention.

  A first step 69 formed by the edge of the opening 65 a of the cover member 65 is formed between the exposed surface 67 and the fixing plate 64 that protrudes into the opening 65 a of the cover member 65. Since the nozzle surface 40 (corresponding to the first surface in the present invention) is exposed in the opening 65 a, the first step 69 is formed between the exposed surface 67 and the nozzle surface 40. And the 1st level | step difference surface 70 which is the surface at the side of the nozzle plate 23 of this 1st level | step difference 69 becomes a level | step difference surface in this invention. Also in this embodiment, the second step 71 is formed at the edge of the opening 64a of the fixing plate 64, and the second step surface 72 is formed on the surface of the second step 71 on the nozzle plate 23 side. Yes.

  Here, on the first step surface 70, fine irregularities are formed as in the step surface of the fixing plate 14 in the first embodiment described above. Also in the present embodiment, it is desirable that the arithmetic average roughness (Ra) of the surface of the first step surface 70 is larger than the arithmetic average roughness (Ra) of the surface of the exposed surface 67. It is more desirable that it is larger than the arithmetic average roughness (Ra) of other surfaces. In the present embodiment, the arithmetic average roughness (Ra) of the surfaces of the cover member 65 other than the first step surface 70 is substantially the same, and the arithmetic average of the surface of the first step surface 70 is the same. It is smaller than the roughness (Ra). The end of one side of the molding agent 42 (the side opposite to the nozzle plate 23) is bonded to the first step surface 70. In the present embodiment, the second stepped surface 72 of the fixing plate 64 has the same unevenness as the first stepped surface 70. Further, the molding agent 42 is bonded to the second step surface 72.

  As described above, also in the present embodiment, since the unevenness is formed on the first step surface 70 to which the molding agent 42 is adhered, the adhesion area of the molding agent 42 can be increased by the unevenness. Thereby, the adhesive strength of the molding agent 42 to the first step surface 70 can be increased. In this embodiment, since the unevenness is also formed on the second step surface 72, the adhesive strength of the molding agent 42 to the second step surface 72 can be increased. Thereby, it can suppress further that the molding agent 42 peels. The unevenness does not need to be formed on both the first step surface 70 and the second step surface 72, and at least on the first step surface 70 that is the step surface on the lower side (that is, the exposed surface 67 side). It only has to be formed.

  The recording head 3 in the present embodiment is produced through a substrate forming process including a concavo-convex forming process and a molding agent adhering process, as in the first embodiment. Specifically, similarly to the method for manufacturing the fixing plate 14 of the first embodiment, the opening 64a is formed by press working to produce the fixing plate 64. Moreover, the cover member 65 is also produced by press work similarly to the manufacturing method of the fixing plate 14 of the first embodiment. Specifically, in the substrate forming step, an opening 65a that exposes the nozzle surface 40 is formed in a flat plate made of stainless steel (SUS) (a plate that becomes the cover member 65; hereinafter simply referred to as the cover member 65). Then, the first step surface 70 is formed at the edge of the opening 65a. Next, in the unevenness forming step, unevenness is formed on the first step surface 70. This concavo-convex forming step may be performed simultaneously with the formation of the opening 65a by press work, or may be performed after the opening 65a is formed, as in the method of manufacturing the fixing plate 14 of the first embodiment. In addition, when forming unevenness on the second step surface 72 of the fixing plate 64, the same method is used. If the opening 65a is formed in the cover member 65 and the unevenness is formed on the step surface, the outer peripheral edge of the cover member 65 is bent to the other side (the side opposite to the exposed surface 67) by pressing (bending). In addition, the cover member 65 is manufactured by bending or forming a through hole by pressing or the like according to the shape of the cover member 65.

  Next, the unit head 13 is positioned on the fixing plate 64 and fixed with an adhesive. When the unit head is positioned with respect to the fixed plate 64, the cover member 65 is put on the outside of the fixed plate 64 and fixed with an adhesive or the like. In this state, a first step 69 and a second step 71 are formed between the nozzle surface 40 and the exposed surface 67 of the cover member 65. In the molding agent 42 bonding step, the liquid molding agent 42 is applied and solidified between the cover member 65 and the nozzle plate 23 using a method such as despacer or transfer printing. As a result, the molding agent 42 is adhered to the first step surface 70 and the second step surface 72, and the molding agent 42 is filled in the gap 41 between the compliance substrate 37 of the unit head 13 and the nozzle plate 23, and recording is performed. A head 3 is created. Other configurations and manufacturing methods are the same as those in the first embodiment described above, and thus description thereof is omitted.

  In the present embodiment, the recording head 3 in which fine unevenness is formed on the first step surface 70 and the second step surface 72 is exemplified, but the present invention is not limited to this. The first stepped surface 70 or the second stepped surface 72 can be provided with the shape of the stepped surface exemplified in each of the above embodiments or a combination thereof. For example, an upper recess, a lower recess, or a groove may be formed on the first step surface.

  By the way, in each above-mentioned embodiment, although a fixed plate and a cover member were formed with stainless steel (SUS), it is not restricted to this. For example, the fixing plate or the cover member can be made of other metal or a silicon single crystal substrate. When the fixing plate or the cover member is made of a silicon single crystal substrate, the unevenness of the opening and the step surface can be formed by etching. Further, the nozzle plate in each of the embodiments described above is joined to a region off the opening on the lower surface side of the common liquid chamber of the communication substrate so as not to overlap with the compliance substrate, and the nozzle plate is disposed in the opening of the fixing plate or the cover member. Although it was exposed, it is not limited to this. For example, the opening on the lower surface side of the common liquid chamber of the communication substrate may be closed with the nozzle plate instead of the compliance substrate. In this case, the fixing plate and the cover member are joined so as to overlap a portion of the nozzle plate where the nozzle is not established. The nozzle surface of the nozzle plate exposed at the opening of the fixing plate or the cover member is the first surface in the present invention. Further, the recording head in each of the above embodiments includes a plurality of unit heads, but is not limited thereto. The present invention can be applied to a recording head having only one unit head.

  In the above description, the ink jet recording head mounted on the ink jet printer is exemplified as the liquid ejecting head. However, the liquid ejecting head can be applied to a liquid ejecting liquid other than ink. For example, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material ejecting head used for forming an electrode such as an organic EL (Electro Luminescence) display, FED (surface emitting display), a biochip (biochemical element) The present invention can also be applied to bioorganic matter ejecting heads and the like used in the production of

  DESCRIPTION OF SYMBOLS 1 ... Printer, 2 ... Recording medium, 3 ... Recording head, 4 ... Carriage, 5 ... Carriage moving mechanism, 6 ... Conveyance mechanism, 7 ... Ink cartridge, 8 ... Timing belt, 9 ... Pulse motor, 10 ... Guide rod, 12 DESCRIPTION OF SYMBOLS ... Holder, 13 ... Unit head, 14 ... Fixed plate, 14a ... Opening, 15 ... Cartridge mounting part, 16 ... Ink introduction needle, 17 ... Actuator unit, 18 ... Flow path unit, 19 ... Head case, 20 ... Storage space, DESCRIPTION OF SYMBOLS 21 ... Liquid introduction path, 22 ... Through space, 23 ... Nozzle plate, 24 ... Nozzle, 25 ... Communication board, 26 ... Common liquid chamber, 27 ... Individual communication path, 28 ... Nozzle communication path, 29 ... Pressure chamber formation board, 30 ... Pressure chamber, 31 ... Vibration plate, 32 ... Piezoelectric element, 33 ... Sealing plate, 34 ... Piezoelectric element accommodation space, 35 ... Flexible cable, 37 ... Comp An ounce substrate, 38 ... a fixed substrate, 39 ... a sealing film, 40 ... a nozzle surface, 41 ... a gap, 42 ... a molding agent, 43 ... an exposed surface, 44 ... a step, 45 ... a step surface, 46 ... a bottom plate, 47 ... a side wall, 48 ... Pressing die, 48a ... Male die, 48b ... Female die, 51 ... Upper concave portion, 51a ... Bottom surface, 51b ... Side surface, 53 ... First pressing die, 54 ... Second pressing die, 55 ... Convex 56, lower recess, 56a, bottom surface, 56b, side surface, 57, through hole, 58, groove, 64, fixing plate, 64a, opening, 65, cover member, 65a, opening, 67, exposed surface, 69th. 1 step, 70 ... first step surface, 71 ... second step, 72 ... second step surface

Claims (10)

A first plate exposed to the outside, and a nozzle plate having nozzles formed on the first surface;
A second surface exposed to the outside at a position deviating from the first surface, and a substrate having a step formed between the first surface and the second surface;
A mold agent bonded to the step surface on the first surface side of the step,
An unevenness is formed on the step surface. The step surface includes a first recess that is formed by recessing a part of the surface opposite to the second surface of the substrate to the middle of the plate thickness direction, and opening to the first surface side,
The liquid ejecting head according to claim 1, wherein the molding agent is adhered in the first recess. The first recess is defined by a bottom surface formed along the second surface and a side surface extending in a direction intersecting the bottom surface,
A convex portion protruding toward the opposite side of the second surface is formed at a position away from the side surface of the bottom surface,
The liquid ejecting head according to claim 2, wherein a height of the convex portion is lower than a height of the side surface.   In the plate thickness direction of the substrate, the dimension from the surface opposite to the second surface to the bottom surface formed along the second surface of the first recess is the second surface. The liquid ejecting head according to claim 2, wherein the liquid ejecting head is larger than half of a dimension from an opposite surface to the second surface. The step surface includes a second recess formed by recessing a part of the second surface of the substrate halfway in the plate thickness direction, and opening to the first surface side,
5. The liquid jet head according to claim 2, wherein the molding agent is adhered in the second recess.   The liquid ejecting head according to claim 5, wherein the first recess and the second recess are communicated with each other through a through-hole penetrating in the plate thickness direction. The step surface includes a groove recessed in the surface direction of the second surface,
The liquid ejecting head according to claim 1, wherein the groove is repeatedly provided along an extending direction of the step. A first surface exposed to the outside, a nozzle plate having nozzles formed on the first surface, a second surface exposed to the outside at a position deviating from the first surface, and the first A method of manufacturing a liquid jet head, comprising: a substrate having a step formed between one surface and the second surface; and a molding agent bonded to a step surface on the first surface side of the step. Because
Forming a step for exposing the first surface to the substrate and forming a stepped surface on an edge of the opening; and
A mold agent bonding step of bonding a mold agent to the step surface in a state where the substrate is positioned so that a step is formed between the first surface and the second surface;
The method of manufacturing a liquid jet head, wherein the substrate forming step includes an unevenness forming step of forming unevenness on the step surface.   The method of manufacturing a liquid jet head according to claim 8, wherein the unevenness forming step is performed simultaneously with the formation of the opening.   The method for manufacturing a liquid jet head according to claim 8, wherein the unevenness forming step is performed after the opening is formed.

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