JP2021111646A - Laser processing device and processing method - Google Patents

Abstract

To provide a laser processing device capable of suppressing the generation of a processing wait period of a workpiece and provide a processing method.SOLUTION: A laser processing device comprises: a processing part (12) that processes a workpiece by irradiating a laser beam to a workpiece (W); a coating cleaning part (40 and 42) that coats a coating film to the workpiece before the processing, and cleans the workpiece after the processing; a mounting part (30) that mounts the workpiece before the processing and the workpiece after the processing; a first transfer arm (50) that transmits the workpiece before the processing from the mounting part to the processing part, and transmits the workpiece after the coating film is coated to the processing part; and a second transfer arm (60) that transmits the workpiece after the processing to the mounting part from the processing part and transmits the workpiece before cleaning from the processing part. The first transfer arm makes the workpiece before the processing be standby near the processing part and executes a pre-processing standby for transporting the workpiece before the processing to the processing part after the workpiece after the processing is transmitted from the processing part.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laser processing apparatus and a processing method.

In a laser processing device that processes a work piece by irradiating the work piece with laser light, the device configuration has a function of applying a protective film to the work piece and a function of cleaning the work piece after processing. It has been known.

In the laser processing apparatus described in Patent Document 1, a wafer having a protective film formed on a processed surface is attracted and supported on a chuck table, and the chuck table that attracts and supports the wafer is moved from a wafer transfer position to a laser beam irradiation unit to perform a laser. Wafer processing is performed in the light irradiation unit.

After processing the wafer, the chuck table is moved from the laser beam irradiation unit to the wafer transfer position to convey the processed wafer. After the processed wafer is carried out from the chuck table, the next wafer to be processed is sucked and supported on the chuck table.

The laser processing apparatus described in Patent Document 2 includes a temporary placement area for temporarily placing a wafer taken out from the cassette. In the temporary placement area, the wafer before processing and the wafer after processing to which the coating film is applied are temporarily placed.

In the temporary placement area, the wafer before processing is carried into the processing table and the wafer after processing is carried out from the processing table. The processing table reciprocates the suction-supported wafer between the home position corresponding to the temporary placement area and the processing area.

Japanese Unexamined Patent Publication No. 2004-322168 Japanese Patent No. 6137798

However, in the apparatus described in Patent Document 1, it is difficult to convey the wafer to be processed to the laser beam irradiation unit of the next processing target during the period of reciprocating movement of the chuck table between the wafer transfer position and the laser beam irradiation unit. be.

Similarly, in the apparatus described in Patent Document 2, it is difficult to transfer the wafer to be processed to the processing region of the next wafer to be processed during the period of reciprocating movement of the processing table between the home position of the processing table and the processing region.

That is, both the apparatus described in Patent Document 1 and the apparatus described in Patent Document 2 have a waiting period for processing the wafer to be processed.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a laser processing apparatus and a processing method capable of suppressing the occurrence of a processing waiting period of a workpiece.

In order to achieve the above object, the following aspects of the invention are provided.

The laser processing apparatus according to the first aspect is a processing portion for processing a work piece by irradiating a work piece with a laser beam, and a coating film is applied to and processed on the work piece before processing. A coating cleaning unit that cleans the work piece after processing, a mounting part on which the work piece before processing and the work piece after processing are placed, and a work piece before processing is transported from the mounting part to the processing part. The first transport arm for transporting the workpiece after coating the coating film to the machined part, and the second transport arm separate from the first transport arm, which is the second transport arm after machining. It is provided with a second transport arm that transports the object from the machining section to the mounting section and transports the workpiece before cleaning from the machining section, and the first transfer arm transports the workpiece before machining to the machining section. This is a laser machining apparatus that waits in the immediate vicinity of the above, and after the processed workpiece is carried out from the processed portion, the pre-machining standby is performed to convey the unprocessed workpiece to the processed portion.

According to the first aspect, a first transport arm for transporting a work piece before processing from a mounting portion to a machining portion and a first transport arm for transporting a work piece after processing from a processing portion to a mounting portion. A second transport arm separate from the above is provided. The first transport arm makes the work piece before machining stand by in the immediate vicinity of the work piece during machining of the work piece, and after transporting the work piece that has been machined from the work piece, the work piece to be machined next is to be machined. Wait before processing to move the object to the processing part. As a result, it is possible to suppress the occurrence of a waiting period for processing the workpiece.

As the first transfer arm, an embodiment in which the workpiece coated with the coating film is conveyed from the mounting portion to the processed portion can be applied. The first transport arm may be applied in a mode of transporting the workpiece from the mounting portion to the processed portion via the coating and cleaning portion.

The second transport arm may be applicable in a mode of transporting the processed work piece from the machined portion to the mounting portion. The second transport arm may be applicable in a mode of transporting the workpiece from the processed portion to the mounting portion via the coating and cleaning portion.

In the second aspect, in the laser machining apparatus of the first aspect, the position where the workpiece is supported by the second transfer arm is below the position where the workpiece is supported by the first transfer arm.

According to the second aspect, the work piece after processing is conveyed under the work piece before processing. As a result, foreign matter such as debris that has fallen from the work piece after processing can be suppressed from adhering to the work piece before processing.

The third aspect is the laser processing apparatus of the first aspect or the second aspect, in which the accommodating portion for accommodating the workpiece, the embedding transport portion for transporting the workpiece from the accommodating portion to the mounting portion, and the mounting portion. The first transfer arm is provided with a coating cleaning transport section for transporting the workpiece to the coating cleaning section, and the first transport arm processes the workpiece to which the coating film is applied from the mounting section using the coating cleaning section. The second transfer arm conveys the work piece after processing from the processed portion to the mounting portion.

According to the third aspect, the transport path of the workpiece from the mounting portion to the processed portion, the transport route of the workpiece from the mounting portion to the coating cleaning portion, and the workpiece from the mounting portion to the accommodating portion. Is separated from the transport path. As a result, the second transfer arm is used to make the processed wafer stand by in the immediate vicinity of the mounting section, and the cleaning application transport section is used to transport the work piece that has been cleaned from the mounting section to the housing section. Can be carried out.

The fourth aspect is the laser processing apparatus of the third aspect, in which the coating cleaning unit includes a first coating cleaning unit and a second coating cleaning unit, and the coating cleaning transport unit mounts the workpiece as the first coating cleaning unit. It is provided with a first coating cleaning transporting section for transporting between the placing portion and a second coating cleaning transporting section for transporting the workpiece between the second coating cleaning portion and the mounting portion.

According to the fourth aspect, parallel processing of coating the coating film on the work piece before processing and cleaning the work piece after processing can be performed.

In the fifth aspect, in the laser processing apparatus of the fourth aspect, the first coating cleaning unit is arranged at a position opposite to the second coating cleaning unit with the mounting unit sandwiched between the first coating cleaning transport unit and the second coating cleaning unit. It has an integral structure with the coating / cleaning / transporting unit.

According to the fifth aspect, it is possible to save space in the transport path of the workpiece between the mounting portion and the first coating cleaning portion and the second coating cleaning portion.

In the sixth aspect, in the laser machining apparatus of any one of the third to sixth aspects, a pre-alignment unit for performing pre-alignment of the workpiece taken out from the accommodating unit and placed on the mounting unit is provided. Be prepared.

According to the sixth aspect, pre-alignment with respect to the workpiece can be performed at the mounting portion.

The processing method according to the seventh aspect is a processing method of irradiating a work piece with a laser beam to process the work piece, wherein a coating film is applied to the work piece before processing, and the work piece is processed. A coating film coating process that applies a coating film to a work piece before processing, and a work piece before processing and a work piece after processing using a coating cleaning unit that cleans the work piece after processing. This is the first processing transfer process in which the workpiece before processing is conveyed from the mounting portion to be mounted using the first transfer arm, and the workpiece after the coating film is applied is processed to process the workpiece. The first processing transfer process of transferring to a part, the processing process of irradiating the workpiece transferred to the processing part with laser light in the first processing transfer process to process the workpiece, and the first transfer arm. This is the second processing transfer process in which the processed work piece is conveyed from the processed part to the mounting part using a second transfer arm different from the above, and the work piece before cleaning is conveyed from the processed part. The second processing transfer process, the cleaning process of cleaning the work piece after processing using the coating and cleaning part, and the work piece before processing are made to stand by in the immediate vicinity of the processing part using the first transfer arm, and processing is performed. This is a machining method including a pre-machining standby step of carrying out a pre-machining standby for transporting the unmachined workpiece to the machining section after the workpiece to be machined is carried out from the part.

According to the seventh aspect, the same effect as that of the first aspect can be obtained.

In the seventh aspect, the same items as those specified in the second to sixth aspects can be appropriately combined. In that case, the component responsible for the processing or function specified in the laser processing apparatus can be grasped as the component of the processing method responsible for the corresponding processing or function.

According to the present invention, a first transport arm for transporting a work piece before processing from a mounting portion to a machining portion, and a first transport arm for transporting a work piece after processing from a processing portion to a mounting portion. Is equipped with another second transport arm. The first transport arm makes the work piece before machining stand by in the immediate vicinity of the work piece during machining of the work piece, and after transporting the work piece that has been machined from the work piece, the work piece to be machined next is to be machined. Wait before processing to move the object to the processing part. As a result, it is possible to suppress the occurrence of a waiting period for processing the workpiece.

FIG. 1 is an overall configuration diagram of a laser processing apparatus according to an embodiment. FIG. 2 is a schematic view of the laser processing apparatus shown in FIG. FIG. 3 is a functional block diagram of the laser processing apparatus shown in FIG. FIG. 4 is a perspective view showing a configuration example of the load arm and the unload arm. FIG. 5 is a flowchart showing the procedure of the processing method according to the embodiment. FIG. 6 is an explanatory diagram of standby before transportation. FIG. 7 is a perspective view showing the transfer of the wafer after processing. FIG. 8 is a perspective view showing a state in which the next wafer to be processed is moved to the processing table. FIG. 9 is a perspective view showing the return of the wafer to be processed to the cassette after cleaning. FIG. 10 is a perspective view showing a state in which the wafer to be processed after cleaning is placed on the temporary storage unit for transportation. FIG. 11 is a schematic view of a laser processing apparatus according to a comparative example. FIG. 12 is a schematic view of a laser processing apparatus according to a modified example of the embodiment. FIG. 13 is a schematic view of a laser processing apparatus according to a comparative example with respect to a modified example. FIG. 14 is a schematic view of a laser processing apparatus according to another comparative example with respect to a modified example.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same components are designated by the same reference numerals, and duplicate description will be omitted as appropriate.

[Explanation of Laser Machining Equipment According to the Embodiment]
〔overall structure〕
FIG. 1 is an overall configuration diagram of a laser processing apparatus according to an embodiment. The laser processing device 10 shown in the figure is a laser dicing device that irradiates a laser beam along a processing line set on the wafer W to form a laser processing region on the wafer W as a starting point of cutting along the processing line. be.

The laser processing device 10 includes a laser processing unit 12. The laser processing unit 12 includes a processing table 14 and a laser irradiation device. The illustration of the laser irradiation device is omitted. The laser irradiation device irradiates the wafer W, which is attracted and supported by the processing table 14, with laser light.
The term wafer W in the present specification may include an aspect in which a wafer is held in a wafer frame by using a tape. The wafer frame is illustrated in FIG. 4 using reference numerals WF. The tape is illustrated in FIG. 4 using the reference numeral WT.

The laser irradiation device includes a laser oscillator and a condensing optical system. The conditions of the laser light output from the laser oscillator are that the light source is a semiconductor laser-excited Nd: YAG laser, the wavelength is 1.1 micrometer, the laser spot cross-sectional area is 3.14 × ^10-8 square centimeters, and the oscillation form is a Q-switch pulse. The repetition frequency is 80 kilohertz or more and 120 kilohertz or less, the pulse width is 180 nanoseconds or more and 370 nanoseconds or less, and the output is 10 watts. A continuous wave laser beam may be applied as the laser beam.

The laser light output from the laser oscillator is incident on the condensing optical system. The condensing optical system includes a condensing lens. The condenser lens collects the laser light at the focusing position. The condensing optical system may appropriately include optical members such as an optical filter, a collimating lens, and a mirror.

The laser irradiation device may employ an aspect in which a Z-axis drive unit is provided inside the device and a part of the optical system housed inside the device is moved. In such an embodiment, the weight of the Z-axis drive unit can be reduced and the responsiveness can be improved.

The Z-axis drive unit includes a Z-axis drive mechanism and a Z-axis motor. The Z-axis drive unit moves a part of the optical system in the Z-axis direction to adjust the position of the condensing point on the wafer W in the Z-axis direction. The Z-axis drive unit may move the entire optical system in the Z-axis direction.

As the processing table 14, an XYθ table that moves the wafer W in the X-axis direction, the Y-axis direction, and the θ direction can be applied. As the processing table 14, a suction table that sucks and supports the wafer W can be applied.

For the relative movement between the laser irradiation device and the wafer, an embodiment in which the laser irradiation device is fixed and the processing table 14 is provided with a Z-axis drive unit may be applied. Further, an embodiment in which the laser irradiation device can be moved in the Y-axis direction and the Z-axis direction by using the Y-axis drive unit and the Z-axis drive unit and the Xθ table is applied to the processing table 14 may be applied. The laser processing unit 12 described in the embodiment corresponds to an example of the processing unit.

The laser processing device 10 includes a cassette mounting unit 20. A wafer cassette 22 in which a plurality of wafers are housed is placed in the cassette mounting unit 20. The cassette mounting portion 20 and the wafer cassette 22 described in the embodiment correspond to an example of the components of the accommodating portion.

The laser processing device 10 includes a temporary storage unit 30 for transportation. The temporary storage unit 30 for transportation includes two guides 32 arranged in the X-axis direction at a distance corresponding to the entire width of the wafer W. The two guides 32 extend in the Y-axis direction. The two guides 32 support the wafer W placed on the temporary storage unit 30 for transportation. The temporary storage unit 30 for transportation described in the embodiment corresponds to an example of a mounting unit.

The laser machining apparatus 10 includes a Y-axis transfer unit 34 and a Z-axis transfer unit 36. The Y-axis transport unit 34 transports the wafer W placed on the temporary storage unit 30 for transport in the Y-axis direction. The Y-axis transport unit 34 is arranged inside the temporary storage unit 30 for transport. The arrow lines with reference numerals Y ₁ , _2, and Y ₃ indicate the transfer direction of the wafer W using the Y-axis transfer unit 34.

The Z-axis transport unit 36 supports the transport temporary storage unit 30 so as to be able to move up and down in the Z-axis direction. The arrow line with the reference numeral Z indicates the moving direction of the temporary storage unit 30 for transportation using the Z-axis transport unit 36. The Y-axis transport unit 34 described in the embodiment corresponds to an example of the components of the mounting transport unit, the coating cleaning transport unit, the first coating cleaning transport unit, and the second coating cleaning transport unit. The Z-axis transport unit 36 described in the embodiment corresponds to an example of the components of the mounting transport unit, the coating cleaning transport unit, the first coating cleaning transport unit, and the second coating cleaning transport unit. The Y-axis transport unit 34 and the Z-axis transport unit 36 described in the embodiment correspond to an example of the first coating cleaning transport unit and the second coating cleaning transport unit having an integrated structure.

The laser processing device 10 includes a pre-alignment unit. The pre-alignment unit is placed inside the temporary storage unit 30 for transportation. The pre-alignment unit performs pre-alignment to adjust the orientation of the wafer W by aligning the orientation flare or notch of the wafer W with the specified direction. In FIG. 1, the pre-alignment portion is not shown. The pre-alignment unit is illustrated in FIG. 3 using reference numeral 70.

The laser processing device 10 includes a first coating cleaning device 40 and a second coating cleaning device 42. The first coating cleaning device 40 coats the wafer W before processing with a coating film. Further, the first coating cleaning device 40 cleans the processed wafer W.

The first coating cleaning apparatus 40 may apply a spin coater that forms a thin film on the wafer W by rotating the wafer W to which the coating liquid is supplied at a high speed. The spin coater functions as a cleaning device by rotating the wafer W to which the cleaning liquid is supplied at high speed. The second coating cleaning device 42 may apply the same configuration as the first coating cleaning device 40. It is also possible to include only one of the first coating cleaning device 40 and the second coating cleaning device 42 shown in FIG.

The first coating cleaning device 40 and the second coating cleaning device 42 described in the embodiment correspond to an example of the coating cleaning unit. The first coating cleaning device 40 described in the embodiment corresponds to an example of the first coating cleaning unit. The second coating cleaning device 42 described in the embodiment corresponds to an example of the second coating cleaning unit.

Laser processing causes debris. If debris adheres to the surface of the wafer W to be processed, the quality of the chip deteriorates, which causes a problem. Therefore, a protective film is applied to the surface of the wafer W, and processing is performed on the protective film to suppress the generation of debris.

The first coating cleaning device 40 is arranged at a position opposite to the second coating cleaning device 42 with the temporary storage unit 30 for transport in the Y-axis direction. Further, the temporary storage unit 30 for transportation, the first coating cleaning device 40, and the second coating cleaning device 42 are arranged at positions arranged in a row in the Y-axis direction.

As a result, using the Y-axis transport unit 34, the wafer W is transferred between the temporary storage unit 30 for transfer and the first coating cleaning device 40, and the temporary storage unit 30 for transfer and the second coating cleaning device 42 are connected to each other. Both transfer of wafer W between can be carried out.

The Y-axis transport unit 34 includes a first Y-axis transport unit that transports the wafer W between the transport temporary storage unit 30 and the first coating cleaning device 40, and the transport temporary storage unit 30 and the second coating cleaning device 42. A second Y-axis transport section for transporting the wafer W may be provided between the and.

A cassette mounting portion 20 is arranged on the ceiling surface of the second coating cleaning device 42. The cassette mounting portion 20 may be arranged on the ceiling surface of the first coating cleaning device 40. The ceiling surface of the first coating cleaning device 40 and the ceiling surface of the second coating cleaning device 42 may be configured so that the cassette mounting portion 20 can be arranged.

The laser processing device 10 includes a load arm 50 and an unload arm 60. The load arm 50 attracts and supports the wafer W before processing placed on the temporary storage unit 30 for transfer, and conveys the wafer W before processing to the laser processing unit 12. The unload arm 60 attracts and supports the processed wafer W, and conveys the processed wafer W from the laser processing unit 12 to the temporary storage unit 30 for transfer.

Arrows denoted by a reference sign X ₁ is directed from the conveyor temporary storage section 30 to the laser processing unit 12, indicating the conveying direction of the wafer W using the load arm 50. Arrows denoted by a reference sign X ₂ is directed from the laser processing unit 12 to the conveyance temporary storage section 30, indicating the conveying direction of the wafer W using the unload arm 60.

The configurations of the load arm 50 and the unload arm 60 will be described later. The load arm 50 described in the embodiment corresponds to an example of the first transport arm. The unload arm 60 described in the embodiment corresponds to an example of the second transport arm.

FIG. 2 is a schematic view of the laser processing apparatus shown in FIG. Code X ₁ such as shown in FIG. 2 corresponds to the code X ₁ such as shown in FIG. The laser processing device 10 transfers the wafer W by relaying the temporary storage unit 30 for transfer of the laser processing unit 12, the wafer cassette 22, the first coating cleaning device 40, and the second coating cleaning device 42.

The laser processing apparatus 10 can perform pre-processing standby on the wafer W before processing by using the load arm 50. The pre-processing standby is a process of waiting the next wafer W to be processed on the upper part of the laser processing unit 12 during the processing of the wafer W using the laser processing unit 12.

As a result, the next wafer W can be placed on the laser processing unit 12 immediately after the processed wafer W is carried out from the laser processing unit 12, and the processing waiting period in the laser processing unit 12 can be shortened. The standby position of the wafer W to be processed next in the standby before processing is not limited to the upper part of the laser processing unit 12 as long as it is in the immediate vicinity of the laser processing unit 12. As a recent example of the laser processing unit 12, a position closer to the laser processing unit 12 than an intermediate position between the laser processing unit 12 and the temporary storage unit 30 for transportation can be mentioned.

Further, the laser processing apparatus 10 can perform a cleaning standby on the processed wafer W by using the unload arm 60. The cleaning standby is a transfer path of the wafer W from the temporary storage unit 30 for transportation to the first coating cleaning device 40 or the second coating cleaning device 42 while the first coating cleaning device 40 or the second coating cleaning device 42 is in use. This is a process of making the processed wafer W stand by at the upper part of the above.

As a result, the processed wafer W can be discharged from the laser processing unit 12 without affecting the transfer of the processed wafer W to the first coating cleaning device 40 or the second coating cleaning device 42, and the waiting before processing can be waited for. The wafer W being carried out can be placed on the laser processing unit 12.

The standby position of the wafer W in the washing standby is not limited to the upper part of the temporary storage unit 30 for transportation as long as it is in the immediate vicinity of the temporary storage unit 30 for transportation. As a recent example of the temporary storage unit 30 for transportation, in the region between the laser processing unit 12 and the temporary storage unit 30 for transportation, the position closer to the temporary storage unit 30 for transportation than the intermediate position between the two is mentioned. Be done.

[Explanation of functional blocks]
FIG. 3 is a functional block diagram of the laser processing apparatus shown in FIG. The laser processing device 10 includes a control device 100. A computer is applied to the control device 100. The control device 100 executes a specified program to realize the function of the laser processing device 10 by using the hardware described below.

Various processors and various memories can be applied to the hardware of each part constituting the control device 100. An example of a processor is a CPU (Central Processing Unit). The CPU executes a program and functions as various processing units. Examples of the memory include ROM (Read Only Memory) and RAM (Random Access Memory).

The control device 100 includes a machining control unit 110 and a machining information acquisition unit 112. The machining control unit 110 controls the laser machining unit 12 based on the machining information acquired by using the machining information acquisition unit 112.

The machining information acquisition unit 112 acquires machining information from an external device or the like via an input interface. The processing information acquisition unit 112 may read the processing information stored in the processing information storage unit. The processing information may include wafer information such as the size and specifications of the wafer W. The processing information may include laser light information representing the conditions of the laser light applied to the processing.

The control device 100 includes a load arm control unit 114 and an unload arm control unit 116. The load arm control unit 114 controls the drive of the load arm drive unit 51 that drives the load arm 50 shown in FIG.

The load arm control unit 114 receives the sensor signal transmitted from the load arm position sensor 51A, grasps the position of the load arm 50 based on the sensor signal, and drives the load arm drive unit 51 according to the position of the load arm 50. To control.

The load arm drive unit 51 includes a horizontal transport unit, a horizontal motor, a vertical transport unit, and a vertical motor. The load arm control unit 114 controls the horizontal motor and the vertical motor to operate the load arm 50. The position of the load arm 50 may be the position of the wafer W supported by the load arm 50.

The unload arm control unit 116 controls the drive of the unload arm drive unit 61. The unload arm control unit 116 controls the operation of the unload arm drive unit 61 according to the position of the unload arm 60 grasped based on the sensor signal output from the unload arm position sensor 61A.

The unload arm drive unit 61 includes a horizontal transport unit, a horizontal motor, a vertical transport unit, and a vertical motor. The position of the unload arm 60 may be the position of the wafer W supported by the unload arm 60.

In FIG. 3, the components of the load arm drive unit 51 and the unload arm drive unit 61 are not shown. The components of the load arm drive unit 51 and the unload arm drive unit 61 are shown in FIG.

The load arm 50 and the unload arm 60 convey the wafer W in a region where they interfere with each other. Therefore, the load arm control unit 114 determines whether or not contact between the load arm 50 and the unload arm 60 can occur when the load arm 50 is driven, and determines that contact between the two can occur. Provides an interlock function such as stopping the operation of the load arm 50.

Similarly, the unload arm control unit 116 has an interlock function such as stopping the operation of the unload arm 60 when it is determined that contact between the load arm 50 and the unload arm 60 can occur.

The control device 100 includes a Y-axis transfer control unit 118, a Z-axis transfer control unit 120, and a pre-alignment control unit 122. The Y-axis transfer control unit 118 controls the drive of the Y-axis transfer unit 34, and the wafer W between the temporary storage unit 30 for transfer and the wafer cassette 22, the first coating cleaning device 40, or the second coating cleaning device 42. Control the transport of.

The Z-axis transport control unit 120 controls the drive of the Z-axis transport unit 36 to raise and lower the temporary storage unit 30 for transport. The Z-axis transfer control unit 120 transfers the wafer W between the wafer cassette 22 and the transfer temporary storage unit 30 using the transfer temporary storage unit 30.

Further, the Z-axis transfer control unit 120 transfers the wafer W between the first coating cleaning device 40 and the second coating cleaning device 42 and the temporary storage unit 30 for transportation using the temporary storage unit 30 for transportation.

The pre-alignment control unit 122 controls the operation of the pre-alignment unit 70 to perform pre-alignment of the wafer W taken out from the wafer cassette 22 and placed on the temporary storage unit 30 for transfer.

The control device 100 includes a coating cleaning control unit 124. The coating cleaning control unit 124 controls the operations of the first coating cleaning device 40 and the second coating cleaning device 42. The coating cleaning control unit 124 performs switching between coating and cleaning of the first coating cleaning device 40 and the second coating cleaning device 42, controlling the flow rate of the coating liquid and the cleaning liquid, controlling the rotation speed of the wafer W, and the like.

The coating cleaning control unit 124 is individually provided with a first coating cleaning control unit that controls the operation of the first coating cleaning device 40 and a second coating cleaning control unit that controls the operation of the second coating cleaning device 42. Can be applied.

The control device 100 includes a parameter storage unit 130 and a program storage unit 132. The parameter storage unit 130 stores control parameters applied to each unit of the control device 100. Each part of the control device 100 acquires the control parameter from the parameter storage unit 130 and executes the control based on the control parameter.

The program storage unit 132 stores programs applied to each unit of the control device 100. Each part of the control device 100 acquires a program from the program storage unit 132, executes the program, and realizes the function of each part.

The laser processing device 10 includes a display device 102 and an input device 104. The laser processing device 10 may include a touch panel type display device, and may use both the display device 102 and the input device 104.

The display device 102 displays various information such as operating state information and alarm information of the laser processing device 10. The control device 100 includes a display control unit 140. The display control unit 140 transmits a signal representing information to be displayed using the display device 102 to the display device 102.

The input device 104 may apply a keyboard, mouse, joystick, or the like. The control device 100 includes an input unit 142. The input unit 142 acquires a signal representing information transmitted from the input device 104. The input unit 142 may include a communication interface, an input port, and the like.

[Configuration example of load arm and unload arm]
FIG. 4 is a perspective view showing a configuration example of the load arm and the unload arm. In FIG. 4, a part of the laser processing apparatus 10 shown in FIG. 1 is enlarged and shown. Note that in FIG. 4, a part of the reference numerals shown in FIG. 1 is omitted.

The load arm 50 includes a horizontal arm portion 52, a vertical arm portion 54, and a chuck portion 56. The horizontal arm portion 52 includes a horizontal guide member 500, a horizontal carriage 502, a horizontal belt transport portion 504, and a horizontal motor 506.

The horizontal guide member 500 is a plate-shaped member extending in the X-axis direction, and a horizontal belt transport portion 504 and a horizontal motor 506 are attached to the horizontal guide member 500. The transport belt of the horizontal belt transport unit 504 is connected to the horizontal carriage 502. Further, the pulley around which the transport belt is wound in the horizontal belt transport unit 504 is connected to the horizontal motor 506. The horizontal carriage 502 is connected to the base end portion of the vertical arm portion 54.

The vertical arm portion 54 includes a vertical guide member 510, a vertical carriage 512, a vertical belt transport portion 514, and a vertical motor 516. The vertical guide member 510 is a plate-shaped member extending in the Z-axis direction, and a vertical belt transport portion 514 and a vertical motor 516 are attached to the vertical guide member 510.

The transport belt of the vertical belt transport unit 514 is connected to the vertical carriage 512. Further, the pulley around which the transport belt is wound in the vertical belt transport unit 514 is connected to the vertical motor 516. A chuck portion 56 is attached to the tip portion of the vertical carriage 512.

The horizontal belt transport unit 504 operates in response to the rotation of the horizontal motor 506. The horizontal carriage 502 reciprocates in the X-axis direction according to the operation of the horizontal belt transport unit 504. The vertical arm portion 54 reciprocates in the X-axis direction in response to the reciprocating movement of the horizontal carriage 502.

The vertical belt transport unit 514 operates in response to the rotation of the vertical motor 516. The vertical carriage 512 reciprocates in the Z-axis direction according to the operation of the vertical belt transport unit 514. The chuck portion 56 reciprocates in the Z-axis direction in response to the reciprocating movement of the vertical carriage 512.

The chuck portion 56 attracts and supports the wafer frame WF of the wafer W. The wafer W attracted and supported by the chuck portion 56 is reciprocated in the X-axis direction and the Z-axis direction according to the operation of the load arm 50.

The unload arm 60 includes a horizontal arm portion 62, a vertical arm portion 64, and a chuck portion 66. The horizontal arm portion 62 includes a horizontal guide member 600, a horizontal carriage 602, a horizontal belt transport portion 604, and a horizontal motor 606.

A horizontal belt transport unit 604 and a horizontal motor 606 are attached to the horizontal guide member 600. The transport belt of the horizontal belt transport unit 604 is connected to the horizontal carriage 602, and the pulley around which the transport belt is wound is connected to the horizontal motor 606. The horizontal carriage 602 is connected to the base end portion of the vertical arm portion 64.

The vertical arm portion 64 includes a vertical guide member 610, a vertical carriage 612, a vertical belt transport portion 614, and a vertical motor 616. The vertical guide member 610 is a plate-shaped member extending in the Z-axis direction, and a vertical belt transport portion 614 and a vertical motor 616 are attached to the vertical guide member 610.

The transport belt of the vertical belt transport unit 614 is connected to the vertical carriage 612, and the pulley around which the transport belt is wound is connected to the vertical motor 616. A chuck portion 66 is attached to the vertical carriage 612. The transfer of the wafer W using the unload arm 60 is the same as the transfer of the wafer W using the load arm 50. Here, the description of the transfer of the wafer W using the unload arm 60 will be omitted.

The support position of the wafer W using the unload arm 60 is lower than the support position of the wafer W using the load arm 50. In other words, the transfer path of the wafer W using the unload arm 60 is lower than the transfer path of the wafer W using the load arm 50.

The support position of the wafer W using the load arm 50 may or may not match the support position of the wafer W using the unload arm 60 in the X-axis direction. The same applies to the Y-axis direction.

The load arm 50 and the unload arm 60 are not limited to the embodiments shown in the present embodiment. For example, an articulated robot may be applied to the load arm 50 and the unload arm 60.

[Procedure of processing method according to the embodiment]
FIG. 5 is a flowchart showing the procedure of the processing method according to the embodiment. Hereinafter, the procedure of the processing method applied to the laser processing apparatus 10 will be described with reference to FIGS. 6 to 10 as appropriate. In addition, in FIGS. 6 to 10, a part of the reference numerals shown in FIG. 4 is omitted.

In the unprocessed wafer unloading step S10, Y-axis transport unit 34 and the Z-axis transport unit 36 shown in FIG. 1, the processing target wafer W ₁ is unloaded from the wafer cassette 22 is placed into transport temporary storage section 30. After the pre-processing wafer unloading step S10, the process proceeds to the pre-alignment step S12. The processing target wafer W ₁ is illustrated in FIG.

In the pre-alignment process S12, the pre-alignment unit 70 shown in FIG. 3 implements a pre-alignment of the processing target wafer W ₁ to be placed on the conveyor temporary storage section 30. After the pre-alignment step S12, the process proceeds to the coating step S14.

In the coating step S14, according to the judgment of the coating cleaning control unit 124, Y-axis transport unit 34 and the Z-axis transport unit 36, the processing target wafer W ₁ to be placed on the conveyor temporary storage section 30 first coating washing It is conveyed to the device 40 or the second coating cleaning device 42. The first coating cleaning device 40 or the second coating cleaning device 42 performs the application of the protective film with respect to the processing target wafer W _1. After the coating step S14, the process proceeds to the transfer step S16 after coating. The coating step S14 described in the embodiment corresponds to an example of the coating film coating step.

In after applying conveying step S16, Y-axis transport unit 34 and the Z-axis transport unit 36, the processing target wafer W ₁ which the coating film has been applied in the coating step S14, the first coating cleaning device 40 or the second coating cleaning device 42 To the temporary storage unit 30 for transportation. After the coating and transfer step S16, the process proceeds to the processing load step S18.

In processing load step S18, the load arm 50 shown in Figure 4 to feed the work target wafer W ₁ from the transport temporary storage section 30 to the laser processing unit 12. In processing load step S18, the load arm 50 is performed before processing standby of the processing target wafer W _1. After the machining loading step S18, the process proceeds to the machining possibility determination step S20. The machining loading step S18 described in the embodiment corresponds to an example of the first machining transfer step. Further, the pre-machining standby in the machining loading step S18 described in the embodiment corresponds to an example of the pre-machining standby step.

In the processability determination step S20, the load arm control unit 114 determines whether or not the _{processed wafer W 2 has been conveyed from the laser machined unit 12.} In the processability determination step S20, when the load arm control unit 114 determines that the processed wafer W ₂ has not been conveyed from the laser machined unit 12, a No determination is made. In the case of No determination, the load arm control unit 114 continues the processability determination step S20.

On the other hand, in the processing possibility determination step S20, when the load arm control unit 114 determines that the processed wafer W ₂ has been conveyed from the laser processing unit 12, a Yes determination is made. In the case of Yes determination, the process proceeds to the processing step S22.

FIG. 6 is an explanatory diagram of standby before transportation. Load arm 50 shown in the figure, the processing target wafer W ₁ adsorbed support, in the upper part of the processing table 14 is waiting for a processing target wafer W _1, to implement the unprocessed standby of the processing target wafer W _1.

Unload arm 60, the wafer W ₂ after processing adsorbed supported with the chuck portion 66 to transport the wafer W ₂ after processing the Z-axis direction.

Reference numeral Z ₂₁ in FIG. 6 indicates the direction of movement of the unloading arm 60 when the chuck portion 66 of the unload arm 60 adsorbs the wafer W ₁ after processing to be placed on the processing table 14. Reference numeral Z ₂₂ indicates the moving direction of the unload arm 60 when the _{processed wafer W 2} sucked by the chuck portion 66 of the unload arm 60 is taken out. Reference numeral X ₂ indicates the transport direction of the wafer W _{2 after processing.}

FIG. 7 is a perspective view showing the transfer of the wafer after processing. The unload arm 60 shown in the figure _{conveys the processed wafer W 2} to the upper part of the temporary storage unit 30 for transportation. The unload arm 60 conveys the processed wafer W _{2 under the processing target wafer W 1} supported by the load arm 50.

FIG. 8 is a perspective view showing a state in which the next wafer to be processed is moved to the processing table. In machining reaction process S22 shown in FIG. 5, the load arm control unit 114 places the processing target wafer W ₁ which is supported by using the load arm 50 to the work table 14. Laser processing unit 12 performs the processing for the processing target wafer W _1. After the machining step S22, the process proceeds to the machining unload step S24.

In machining unloading step S24, the unload arm 60 carries the processing target wafer W ₁ to be placed on the work table 14 from the laser processing unit 12, and conveyed to the top of the transport temporary storage section 30, a cleaning wait do. After the processing unload step S24, the process proceeds to the washability determination step S26. Incidentally, in FIG. 8 illustrates a wash stand of the wafer W ₂ after processing.

During the processing unloading step S24 for the processing target wafer W _{1, the} processing process S22 for the next processing target wafer W can be started. The machining unloading step S24 described in the embodiment corresponds to an example of the second machining transfer step. The cleaning standby in the processing unloading process S24 described in the embodiment corresponds to an example of the cleaning standby process.

In the cleaning possibility determination step S26, the unload arm control unit 116 determines whether or not at least one of the first coating cleaning device 40 and the second coating cleaning device 42 can be used. That is, the unload arm control unit 116 _{determines whether or not the washed wafer W 3} has moved from the transfer temporary storage unit 30 to the wafer cassette 22. The washed wafer W ₃ is shown in FIG.

In the cleaning possibility determination step S26, when the unload arm control unit 116 determines that at least one of the first coating cleaning device 40 and the second coating cleaning device 42 is in use, a No determination is made. In the case of No determination, the unload arm control unit 116 continues the washability determination step S26 until a Yes determination is made.

On the other hand, in the cleaning possibility determination step S26, when the unload arm control unit 116 determines that at least one of the first coating cleaning device 40 and the second coating cleaning device 42 can be used, a Yes determination is made. In the case of Yes determination, the process proceeds to the cleaning step S28.

FIG. 9 is a perspective view showing the return of the work to the cassette after cleaning. If the use of the transport temporary storage section 30 is made possible, the unload arm 60 carries a processing target wafer W ₁ after machining the laser processing unit 12 to the top of the transport temporary storage section 30.

Conveying the temporary storage unit 30 shown in FIG. 9, the cleaning is wafer W ₃ is placed after cleaning performed with the first coating cleaning device 40 or the second coating cleaning device 42. After the washed wafer W ₃ is housed in the wafer cassette 22, the unload arm 60 _{transports the wafer W 1} to be processed, which is waiting for cleaning, to the temporary storage unit 30 for transport.

FIG. 10 is a perspective view showing a state in which the processed wafer is placed on the temporary storage unit for transportation. It unload arm 60, to place the processing target wafer W ₁ after processing to transport for temporary storage unit 30. Y-axis transport unit 34 and the Z-axis transport unit 36 moves the processing target wafer W ₁ after processing the first coating cleaning device 40 or the second coating cleaning device 42.

In the cleaning step S28, the first coating cleaning device 40 or the second coating cleaning device 42 washes the processing target wafer W ₁ after processing. The selection between the first coating cleaning device 40 and the second coating cleaning device 42 is appropriately determined according to the availability of both. After the cleaning step S28, the process proceeds to the wafer accommodating step S30.

In the wafer accommodation step S30, Y-axis transport unit 34 transports the processing target wafer W ₁ after cleaning the conveyor temporary storage section 30. Next, the Z-axis transport unit 36 moves the processing target wafer W carrying temporary storage section _{30 1} is placed after washing the Z-axis direction. Next, Y-axis transport unit 34 transports the processing target wafer W ₁ after cleaning to be placed into the carrying temporary storage section 30 to the wafer cassette 22.

In the wafer accommodation step S30, unloaded from the wafer cassette 22, the coating of the protective film, after processing and cleaning processing target wafer W ₁ that is performed is accommodated in the wafer cassette 22, the control device 100 with respect to the processing target wafer W ₁ Finish the processing method.

[Action and effect of the first embodiment]
The laser processing apparatus 10 and the processing method according to the first embodiment can obtain the following effects.

[1]
The load arm 50 transfers the wafer W from the temporary storage unit 30 for transportation to the laser processing unit 12. The unload arm 60 transfers the wafer W from the laser processing unit 12 to the temporary storage unit 30 for transfer. During the processing of the wafer W using the laser processing unit 12, the load arm 50 makes the wafer W to be processed next stand by at the upper part of the processing table 14, and the unload arm 60 waits for the wafer after processing from the laser processing unit 12. After the W is carried out, the wafer W to be processed next is placed on the processing table 14 and waits before processing.

Thereby, for example, the takt time is shortened as compared with the embodiment in which only the load arm 50 is provided and the wafer W is transferred between the temporary storage unit 30 for transfer and the laser processing unit 12 by using the load arm 50. Can be done.

FIG. 11 is a schematic view of a laser processing apparatus according to a comparative example. The laser processing device 1 shown in the figure includes a cassette mounting unit 2A on which the wafer cassette 2 is placed, a temporary storage unit for transport 3, a first coating cleaning device 4, a second coating cleaning device 5, a laser processing unit 6, and processing. The front temporary storage unit 7 is provided.

Compared with the laser processing device 10 shown in FIG. 2, the laser processing device 1 has one transfer arm 8 that transfers the wafer W between the temporary storage unit 3 for transfer and the laser processing unit 6. The transport arm 8 is schematically illustrated by using an arrow line indicating the transport direction.

In the laser processing apparatus 1, when the wafer W is transferred from the temporary storage unit 3 for transfer to the laser processing unit 6, the transfer arm 8 transfers the wafer W to be processed to the temporary storage unit 7 before processing and makes the wafer W stand by, and the laser is used. After the processed wafer W is transferred from the processing unit 6 to the temporary storage unit 3 for transfer, the wafer to be processed is transferred from the temporary storage unit 7 before processing to the laser processing unit 12.

Then, the wafer W to be machined is processed during the period in which the transfer arm moves with the temporary storage unit 7 before processing, the laser processing unit 6, the temporary storage unit 3 for transfer, and the transfer arm moves to the temporary storage unit 7 before processing. It cannot be transported from the front temporary storage unit 7 to the laser processing unit 6.

On the other hand, in the laser processing apparatus 10 and the processing method shown in the present embodiment, the load arm 50 performs the standby before processing, and the unload arm 60 carries out the processed wafer W from the laser processing unit 12. The processing waiting period of the wafer W waiting before processing does not occur.

[2]
The Z-axis position where the unload arm 60 supports the wafer W is below the Z-axis position where the load arm 50 supports the wafer W. As a result, the transfer path of the wafer W after processing becomes the lower side of the transfer path of the wafer W before processing, and when debris or the like falls from the wafer W conveyed by using the unload arm 60, the load arm 50 It is possible to suppress the adhesion of debris and the like to the wafer W transported by using.

[3]
A Y-axis transfer unit 34 and a Z-axis transfer unit 36 that transfer wafers from the temporary storage unit 30 for transfer to the first coating cleaning device 40, the second coating cleaning device 42, and the wafer cassette 22 are provided. The unload arm 60 performs a washing standby in which the processed wafer W is made to stand by at the upper part of the temporary storage unit 30 for transportation. As a result, the wafer W can be transported from the temporary storage unit 30 for transfer to the first coating cleaning device 40 or the like while the unload arm 60 is waiting for the wafer W to be washed.

Further, it is possible to efficiently transfer a plurality of wafers W according to the processing conditions of the wafer W, the situation of the laser processing apparatus 10, and the like, and it is possible to operate the laser processing apparatus 10 efficiently.

[4]
The load arm 50 performs a pre-machining standby of the wafer W before machining at the upper part of the machining table 14. As a result, the area for temporarily storing the wafer W during the pre-processing standby such as the pre-processing temporary storage unit 7 shown in FIG. 11 becomes unnecessary, and the entire apparatus can be saved in space.

[5]
When the load arm 50 or the unload arm 60 fails, the device can be operated by using one of the non-failed ones. That is, the load arm 50 or the unload arm 60 can be replaced with each other by changing the program for operating the load arm 50 or the unload arm 60.

[6]
An unload arm 60 for transporting the wafer W from the laser processing section 12 to the transport temporary storage section 30 is provided. As a result, it is possible to deal with the wafer W in which deformation such as bending occurs during processing.

[7]
By changing the shape of the load arm 50 or the unload arm 60, it is possible to cope with a case where a plurality of types of wafers are mixed, such as a case where workpieces having different coating films are mixed or a case where wafers having different shapes are mixed. That is, the load arm 50 and the unload arm 60 can be individually controlled by applying the machining information acquired by using the machining information acquisition unit 112 shown in FIG.

[8]
A first coating cleaning device 40 and a second coating cleaning device 42 are provided, and parallel processing of coating and cleaning on a plurality of wafers W is performed. As a result, at least one of the waiting period for application and the waiting time for cleaning can be shortened. Further, three or more coating cleaning devices may be provided. Such an embodiment can further shorten at least one period of waiting for application and waiting for washing.

[9]
A pre-alignment unit 70 for performing pre-alignment of the wafer W placed on the temporary storage unit 30 for transportation is provided. As a result, pre-alignment with respect to the wafer W waiting to be applied can be performed.

[Modification example]
FIG. 12 is a schematic view of a laser processing apparatus according to a modified example of the embodiment. In the laser processing device 10A shown in the figure, the transfer path of the wafer W between the laser processing unit 12 and the temporary storage unit 30 for transfer is also used as the transfer path between the temporary storage unit 30 for transfer and the coating cleaning device 40A. NS. As a result, the space of the equipment is saved and the number of parts is reduced.

In the laser processing device 10A, the load arm 50A carries out the transfer of the wafer W from the temporary storage unit 30 for transfer to the coating cleaning device 40A and the transfer of the wafer W from the coating cleaning device 40A to the laser processing unit 12.

Further, in the laser processing device 10A, the unload arm 60A transfers the wafer W from the laser processing unit 12 to the coating cleaning device 40A and the wafer W from the coating cleaning device 40A to the temporary storage unit 30 for transportation.

In FIG. 12, the load arm 50A and the unload arm 60A are schematically illustrated by using arrow lines indicating the moving direction. The load arm 50A applied to the laser processing apparatus 10A may have the same configuration as the load arm 50 shown in FIG. 1 and the like. Further, the unload arm applied to the laser processing apparatus 10A may have the same configuration as the unload arm 60 shown in FIG. 1 and the like.

The laser processing device 10A includes a first load arm 50B for transporting the wafer W from the temporary storage unit 30 for transfer to the coating cleaning device 40A and a second load arm 50C for transporting the wafer W from the coating cleaning device 40A to the laser processing unit 12. You may prepare.

Further, the laser processing device 10A conveys the wafer W from the coating cleaning device 40A to the temporary storage unit 30 for transfer, the first unload arm 60B, and the laser processing unit 12 to the coating cleaning device 40A. (2) An unload arm 60C may be provided.

The laser processing apparatus 10A includes a transport unit 35A for transporting the wafer W from the wafer cassette 22 to the temporary storage unit 30 for transport, and a transport unit 35B for transporting the wafer W from the temporary storage unit 30 for transport to the wafer cassette 22. The transport unit 35A and the transport unit 35B are schematically illustrated by using arrow lines indicating the moving direction.

FIG. 13 is a schematic view of a laser processing apparatus according to a comparative example with respect to a modified example. The laser processing device 1A shown in the figure is a transfer arm that transfers the wafer W between the temporary storage unit 3 for transfer and the laser processing unit 6, and between the temporary storage unit 3 for transfer and the coating cleaning device 4A. It is common with the laser processing apparatus 10A shown in FIG. 12 in that it is also used as a transport arm for transporting the wafer W.

On the other hand, it differs from the laser processing device 10A provided with the load arm 50A and the unload arm 60A in that there is only one transfer arm 9 for transporting the wafer W between the coating cleaning device 4A and the laser processing unit 6. In FIG. 13, the transport arm 9 is schematically illustrated by using an arrow line indicating a moving direction.

The laser processing apparatus 1A transfers the processed wafer W to the laser processing unit 6 unless the processed wafer W has been transferred from the laser processing unit 6 to the temporary storage unit 3 for transfer. Cannot be moved.

On the other hand, the laser processing apparatus 10A shown in FIG. 12 can perform a processing standby in which the next wafer W to be processed is made to stand by in the immediate vicinity of the processing unit while the processing of the previous wafer W is being performed. The treatment referred to here is a general term for coating, processing and cleaning of a protective film.

FIG. 14 is a schematic view of a laser processing apparatus according to another comparative example with respect to a modified example. The laser processing apparatus 1B shown in the figure corresponds to the laser processing apparatus described in Japanese Patent No. 4777783. The laser processing device 1B includes a coating device 4B dedicated to protective film coating and a cleaning device 4C dedicated to cleaning instead of the coating cleaning device 4A provided in the laser processing device 1A shown in FIG.

Further, the laser processing device 1B is a transfer arm 9A and a laser processing unit that convey the wafer W from the transfer temporary storage unit 3 to the coating device 4B and transfer the wafer W from the cleaning device 4C to the transfer temporary storage unit 3. A transfer arm 9B for transporting the wafer W from 6 to the cleaning device 4C and for transporting the wafer W from the coating device 4B to the laser processing unit 6 is provided.

The coating of the protective film in the ablation process may have a longer actual treatment period than the standard treatment period due to differences in coating conditions and the like. In the laser processing apparatus 1B, when the coating period of the protective film on the wafer W exceeds the total period of the processing period on the wafer W and the cleaning period on the wafer W after processing, the wafer W waiting to be coated stays and is coated. Waiting period occurs.

Further, in the cleaning process, the cleaning period may be longer than the standard cleaning period depending on the cleanliness required for the wafer W after cleaning. In the laser processing apparatus 1B, when the cleaning period on the wafer W after processing exceeds the total period of the protective film coating period on the wafer W and the processing period on the wafer W, the wafer W waiting for cleaning stays. There is a waiting period for cleaning.

On the other hand, the laser processing apparatus 10A shown in FIG. 12 can perform a processing standby in which the next wafer W to be processed is made to stand by in the immediate vicinity of the processing unit while the processing of the previous wafer W is being performed.

[Other variants]
In the present embodiment, a dicing device for processing a wafer W has been exemplified as a laser processing device, but it can be applied to a laser processing device for processing a workpiece such as metal or ceramic. Further, the laser processing shown in the present embodiment can be applied to both surface processing of the workpiece such as ablation and formation of a laser machining region inside the workpiece.

In the embodiment of the present invention described above, the constituent requirements can be appropriately changed, added, or deleted without departing from the spirit of the present invention. The present invention is not limited to the embodiments described above, and many modifications can be made by a person having ordinary knowledge in the art within the technical idea of the present invention.

10, 10A ... Laser machining equipment, 12 ... Laser machining section, 20 ... Cassette mounting section, 22 ... Wafer cassette, 30 ... Temporary storage section for transport, 34 ... Y-axis transport section, 36 ... Z-axis transport section, 40 ... First coating cleaning device, 40A ... coating cleaning device, 42 ... second coating cleaning device, 50, 50A ... load arm, 60, 60A ... unload arm, 70 ... prealignment unit

Claims (7)

A processing unit that irradiates the work piece with laser light to process the work piece,
A coating cleaning unit that applies a coating film to the work piece before processing and cleans the work piece after processing.
A mounting portion on which the work piece before processing and the work piece after processing are placed,
A first transport arm that transports the work piece before processing from the above-mentioned placing portion to the processing portion, and a first transport arm that conveys the work piece after applying the coating film to the processing portion. When,
It is a second transport arm different from the first transport arm, transports the work piece after the work from the work part to the above-mentioned placing part, and carries out the work piece before the cleaning. The second transport arm that transports from the part and
With
The first transport arm makes the work piece before the work stand by in the immediate vicinity of the work part, and after the work piece after the work is carried out from the work part, the work piece before the work is carried out. A laser machining apparatus that performs pre-machining standby for transporting an object to the machining section. The laser machining apparatus according to claim 1, wherein the position of supporting the workpiece on the second transfer arm is below the position of supporting the workpiece on the first transfer arm. An accommodating portion for accommodating the work piece,
A mounting transport section that transports the work piece from the housing section to the above-mentioned resting section,
A coating cleaning and transporting unit that transports the workpiece from the above-mentioned placement unit to the coating and cleaning unit,
With
The first transport arm transports the work piece before processing to which the coating film has been applied by using the coating cleaning portion from the previously described placing portion to the processing portion.
The laser processing apparatus according to claim 1 or 2, wherein the second transfer arm conveys the processed object to be processed from the processed portion to the previously described placing portion. The coating cleaning unit includes a first coating cleaning unit and a second coating cleaning unit.
The coating cleaning and transporting unit describes the first coating and cleaning and transporting unit that transports the workpiece between the first coating and cleaning unit and the previously described placing portion, and the workpiece as the second coating and cleaning unit. The laser processing apparatus according to claim 3, further comprising a second coating cleaning transport section for transporting between the placement section. The first coating and cleaning unit is arranged at a position opposite to the second coating and cleaning unit with the above-mentioned placing portion in between.
The laser processing apparatus according to claim 4, wherein the first coating cleaning and transporting unit and the second coating and cleaning and transporting unit have an integral structure. The laser processing apparatus according to any one of claims 3 to 5, further comprising a pre-alignment unit for performing pre-alignment of the workpiece taken out from the accommodating unit and placed on the above-mentioned storage unit. It is a processing method of irradiating a work piece with a laser beam to process the work piece.
The coating film is applied to the work piece before processing, and the coating film is applied to the work piece before processing by using the coating cleaning portion for cleaning the work piece after processing. Coating film coating process and
This is the first processing transfer step of transporting the work piece before processing by using the first transfer arm from the mounting portion on which the work piece before processing and the work piece after processing are placed. The first processing transfer step of transporting the work piece after applying the coating film to the processing part for processing the work piece, and
In the first processing transfer step, the processing step of irradiating the work piece conveyed to the processing part with the laser beam to process the work piece, and
This is a second processing transfer step of transporting the processed work piece after processing from the processing portion to the previously described placing portion by using a second transfer arm different from the first transfer arm, and before performing the cleaning. The second processing transfer step of transporting the work piece from the processing part, and
A cleaning step of cleaning the workpiece after processing using the coating and cleaning unit, and
The work piece before the work is made to stand by in the immediate vicinity of the work part by using the first transport arm, and after the work piece after the work is carried out from the work part, the work piece before the work is carried out. A pre-machining standby process for carrying out a pre-machining standby for transporting a work piece to the machining section, and a pre-machining standby process.
Processing method including.

Images