JP2021106346A - Method for manufacturing resonance structure - Google Patents

Abstract

To provide a method for manufacturing a new resonance structure.SOLUTION: A method for manufacturing a resonance structure is a method for manufacturing a resonance structure including a first conductor, a second conductor, a third conductor, and a fourth conductor. The third conductor is configured to spread along a first direction, be located between the first conductor and the second conductor, and capacitively connect the first conductor with the second conductor. The fourth conductor spreads along the first direction and is electrically connected with the first conductor and the second conductor. The method for manufacturing a resonance structure includes preparing a rectangular substrate in which a plurality of units corresponding to the resonance structure is arranged in a second direction intersecting the first direction. The method for manufacturing a resonance structure includes forming, by hot dipping, a conductor corresponding to the first conductor and a conductor corresponding to the second conductor at two ends in the first direction of the rectangular substrate. The method for manufacturing a resonance structure includes cutting, on the rectangular substrate, the plurality of units adjacent in the second direction along the first direction.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a method for manufacturing a resonant structure.

The electromagnetic waves radiated from the antenna are reflected by the metal conductor. The electromagnetic wave reflected by the metal conductor has a phase shift of 180 °. The reflected electromagnetic wave is combined with the electromagnetic wave radiated from the antenna. The amplitude of the electromagnetic wave radiated from the antenna may be reduced by combining with the electromagnetic wave having a phase shift. As a result, the amplitude of the electromagnetic wave radiated from the antenna becomes small. By setting the distance between the antenna and the metal conductor to 1/4 of the wavelength λ of the radiated electromagnetic wave, the influence of the reflected wave is reduced.

On the other hand, an antenna in which a decrease in radio wave intensity is reduced is known even on a metal conductor (Patent Document 1).

International Publication No. 2018/174026

The antenna described in Patent Document 1 includes a resonance structure. There is a demand for a method for efficiently manufacturing this resonant structure.

An object of the present disclosure is to provide a method for manufacturing a resonance structure, which can efficiently manufacture the resonance structure.

The method for manufacturing a resonance structure according to an embodiment of the present disclosure is a method for manufacturing a resonance structure including a first conductor, a second conductor, a third conductor, and a fourth conductor. The second conductor faces the first conductor in the first direction. The third conductor extends along the first direction, is located between the first conductor and the second conductor, and is configured to capacitively connect the first conductor and the second conductor. Has been done. The fourth conductor extends along the first direction and is electrically connected to the first conductor and the second conductor. The method for manufacturing the resonance structure includes preparing a rectangular substrate in which a plurality of units corresponding to the resonance structure are arranged in a second direction intersecting with the first direction. The method for manufacturing the resonance structure is to form a conductor corresponding to the first conductor and a conductor corresponding to the second conductor at two ends of the rectangular substrate in the first direction by a hot-dip plating method. include. The method for manufacturing the resonance structure includes cutting the plurality of units adjacent to each other in the second direction along the first direction in the rectangular substrate.

According to the method for manufacturing a resonance structure according to an embodiment of the present disclosure, the resonance structure can be efficiently manufactured.

It is a top view of the antenna which concerns on one Embodiment of this disclosure. It is sectional drawing of the antenna along the L1-L1 line shown in FIG. It is a flowchart which shows the manufacturing process of the manufacturing method of the resonance structure which concerns on one Embodiment of this disclosure. It is a top view of the laminated substrate which concerns on one Embodiment of this disclosure. It is sectional drawing of the laminated substrate along the L2-L2 line shown in FIG. It is a top view of the rectangular substrate which concerns on one Embodiment of this disclosure. It is a top view of the rectangular substrate after a forming process. It is a figure explaining the cutting process.

In the present disclosure, the "dielectric material" may include either a ceramic material or a resin material as a composition. Ceramic materials include aluminum oxide sintered body, aluminum nitride sintered body, mulite sintered body, glass-ceramic sintered body, crystallized glass in which crystal components are precipitated in the glass base material, and mica or titanium. Includes microcrystalline sintered body such as aluminum acid. The resin material includes a cured product such as an epoxy resin, a polyester resin, a polyimide resin, a polyamide-imide resin, a polyetherimide resin, and a liquid crystal polymer.

In the present disclosure, the "conductive material" may include any of a metal material, an alloy of metal materials, a cured product of a metal paste, and a conductive polymer as a composition. Metallic materials include copper, silver, palladium, gold, platinum, aluminum, chromium, nickel, cadmium lead, selenium, manganese, tin, vanadium, lithium, cobalt, titanium and the like. Alloys include multiple metallic materials. The metal paste agent includes a powder of a metal material kneaded with an organic solvent and a binder. The binder includes an epoxy resin, a polyester resin, a polyimide resin, a polyamide-imide resin, and a polyetherimide resin. The conductive polymer includes a polythiophene-based polymer, a polyacetylene-based polymer, a polyaniline-based polymer, a polypyrrole-based polymer, and the like.

Hereinafter, a plurality of embodiments of the present disclosure will be described with reference to the drawings. In the components shown in FIGS. 1 to 8, the same components are designated by the same reference numerals.

In the embodiments of the present disclosure, the XYZ coordinate system is adopted. Hereinafter, when the X-axis positive direction and the X-axis negative direction are not particularly distinguished, the X-axis positive direction and the X-axis negative direction are collectively referred to as "X direction". When the Y-axis positive direction and the Y-axis negative direction are not particularly distinguished, the Y-axis positive direction and the Y-axis negative direction are collectively referred to as "Y direction". When the Z-axis positive direction and the Z-axis negative direction are not particularly distinguished, the Z-axis positive direction and the Z-axis negative direction are collectively referred to as "Z direction".

Hereinafter, the first direction is shown as the X direction. The second direction is shown as the Y direction. The third direction is shown as the Z direction. The first plane is shown as the XY plane. However, the first direction does not have to be orthogonal to the second direction. The first direction may intersect the second direction. The third direction does not have to be orthogonal to the first plane. The third direction may intersect the first plane.

FIG. 1 is a plan view of the antenna 1 according to the embodiment of the present disclosure. FIG. 2 is a cross-sectional view of the antenna 1 shown in FIG.

As shown in FIG. 1, the antenna 1 includes a resonance structure 10 and a feeder line 70. As shown in FIGS. 1 and 2, the resonance structure 10 includes a base 20, a first conductor 30, a second conductor 40, a third conductor 50, and a fourth conductor 60. The first conductor 30 and the second conductor 40 are also referred to as anti-conductors. Each of the first conductor 30, the second conductor 40, the third conductor 50, the fourth conductor 60, and the feeder line 70 contains a conductive material. The first conductor 30, the second conductor 40, the third conductor 50, the fourth conductor 60, and the feeder line 70 may contain the same conductive material or may contain different conductive materials.

The antenna 1 may exhibit an Artificial Magnetic Conductor Character with respect to an electromagnetic wave having a predetermined frequency incident on the surface of the resonance structure 10 in which the third conductor 50 is located from the outside.

In the present disclosure, the "artificial magnetic wall characteristic" means the characteristic of the surface where the phase difference between the incident wave and the reflected wave at one resonance frequency is 0 degrees. The antenna 1 may have an operating frequency in the vicinity of at least one of at least one resonance frequency. On the surface having artificial magnetic wall characteristics, the phase difference between the incident wave and the reflected wave becomes smaller than the range from −90 degrees to +90 degrees in the operating frequency band.

The substrate 20 contains a dielectric material. The substrate 20 may have an arbitrary shape according to the shape of the third conductor 50 or the like. The substrate 20 may have a substantially rectangular parallelepiped shape. The relative permittivity of the substrate 20 may be appropriately adjusted according to the desired operating frequency of the antenna 1.

The first conductor 30 faces the second conductor 40 in the X direction. The first conductor 30 may be located at the end of the substrate 20 on the negative direction side of the X axis. The first conductor 30 is along the Y direction. The first conductor 30 includes at least one first connecting conductor 31 and a connecting portion 32. In this embodiment, the first conductor 30 includes two first connecting conductors 31. However, the first conductor 30 may include three or more first connecting conductors 31. The first connecting conductor 31 and the connecting portion 32 may contain the same conductive material or may contain different conductive materials.

As shown in FIG. 1, the plurality of first connecting conductors 31 are arranged in the Y direction. When the first conductor 30 includes three or more first connecting conductors 31, the plurality of first connecting conductors 31 may be arranged in the Y direction at substantially equal intervals. As shown in FIG. 2, the first connecting conductor 31 extends along the Z direction.

The first connecting conductor 31 is configured to electrically connect the third conductor 50 and the fourth conductor 60. For example, the first connecting conductor 31 includes two ends. One end of the first connecting conductor 31 is configured to be electrically connected to a connecting portion 54 of the third conductor 50, which will be described later. The other end of the first connecting conductor 31 is configured to be electrically connected to a part of the fourth conductor 60 on the negative direction side of the X axis. The first connecting conductor 31 may be a through-hole conductor, a via conductor, or the like.

As shown in FIG. 2, the connecting portion 32 surrounds the end portion of the resonance structure 10 on the negative direction side of the X axis in a U shape in a cross-sectional view of the resonance structure 10. For example, the connecting portion 32 includes a portion 33 and a portion 34 extending in the XY plane and a portion 35 extending in the YZ plane. The portion 33, the portion 34, and the portion 35 are integrated. The portion 33 is located on the connecting portion 54 described later of the third conductor 50. The portion 33 is configured to be electrically connected to the connecting portion 54. The portion 34 is located on a part of the fourth conductor 60 on the negative direction side of the X axis. The portion 34 is configured to be electrically connected to a part of the fourth conductor 60 on the negative direction side of the X axis. The portion 35 is located on the surface of the substrate 20 on the negative side of the X-axis. The portion 35 is configured to be electrically connected to the end of the third conductor 50 on the negative side of the X-axis of the connecting portion 56 described later.

When the connecting portion 32 surrounds the end portion of the resonance structure 10 on the negative direction side of the X axis in a U shape, the thickness of the end portion of the resonance structure 10 on the negative direction side of the X axis can be increased. By increasing the thickness of the end portion of the resonance structure 10 on the negative direction side of the X axis, the end portion of the resonance structure 10 on the negative direction side of the X axis may be less likely to be deformed. Since the end portion of the resonance structure 10 on the negative direction side of the X axis is less likely to be deformed, the stress applied to the first connecting conductor 31 can be reduced. By reducing the stress applied to the first connecting conductor 31, the possibility of damage to the first connecting conductor 31 can be reduced.

As shown in FIG. 1, the second conductor 40 faces the first conductor 30 in the X direction. The second conductor 40 may be located at the end of the substrate 20 on the positive direction side of the X axis. The second conductor 40 is along the Y direction. The second conductor 40 includes at least one second connecting conductor 41 and a connecting portion 42. In this embodiment, the second conductor 40 includes two second connecting conductors 41. However, the second conductor 40 may include three or more second connecting conductors 41. The second connecting conductor 41 and the connecting portion 42 may contain the same conductive material or may contain different conductive materials.

The plurality of second connecting conductors 41 are arranged in the Y direction. When the second conductor 40 includes three or more second connecting conductors 41, the plurality of second connecting conductors 41 may be arranged in the Y direction at substantially equal intervals. As shown in FIG. 2, the second connecting conductor 41 extends along the Z direction.

The second connecting conductor 41 is configured to electrically connect the third conductor 50 and the fourth conductor 60. For example, the second connecting conductor 41 includes two ends. One end of the second connecting conductor 41 is configured to be electrically connected to a connecting portion 55 of the third conductor 50, which will be described later. The other end of the second connecting conductor 41 is configured to be electrically connected to a part of the fourth conductor 60 on the positive direction side of the X axis. The second connecting conductor 41 may be a through-hole conductor, a via conductor, or the like.

As shown in FIG. 2, the connecting portion 42 surrounds the end portion of the resonance structure 10 on the positive direction side of the X axis in a U shape in a cross-sectional view of the resonance structure 10. For example, the connecting portion 42 includes a portion 43 and a portion 44 extending in the XY plane and a portion 45 extending in the YZ plane. The portion 43, the portion 44, and the portion 45 are integrated. The portion 43 is located on the connecting portion 55 of the third conductor 50, which will be described later. The portion 43 is configured to be electrically connected to the connecting portion 55. The portion 44 is located on a part of the fourth conductor 60 on the positive direction side of the X axis. The portion 44 is configured to be electrically connected to a part of the fourth conductor 60 on the positive direction side of the X axis. The portion 45 is located on the surface of the substrate 20 on the positive direction side of the X axis. The portion 45 is configured to be electrically connected to the end of the third conductor 50 on the positive direction side of the X-axis of the connecting portion 57 described later.

When the connecting portion 42 surrounds the end portion of the resonance structure 10 on the positive direction side of the X axis in a U shape, the thickness of the end portion of the resonance structure 10 on the positive direction side of the X axis can be increased. By increasing the thickness of the end portion of the resonance structure 10 on the X-axis positive direction side, the end portion of the resonance structure 10 on the X-axis positive direction side may be less likely to be deformed. Since the end portion of the resonance structure 10 on the positive direction side of the X axis is less likely to be deformed, the stress applied to the second connecting conductor 41 can be reduced. By reducing the stress applied to the second connecting conductor 41, the possibility of damage to the second connecting conductor 41 can be reduced.

The third conductor 50 is along the X direction. The third conductor 50 may spread along the X direction. The third conductor 50 may extend along the XY plane. The third conductor 50 is located between the first conductor 30 and the second conductor 40. The third conductor 50 includes a fifth conductor 51 and a sixth conductor 52. The third conductor 50 may include an inner conductor 53 and connecting portions 54, 55, 56, 57. The fifth conductor 51, the sixth conductor 52, the inner conductor 53, and the connecting portions 54 to 57 may contain the same conductive material or may contain different conductive materials.

The fifth conductor 51 and the sixth conductor 52 are located on the upper surface of the substrate 20. A part of the fifth conductor 51 and a part of the sixth conductor 52 may be located in the substrate 20. The fifth conductor 51 and the sixth conductor 52 are arranged in the X direction. The fifth conductor 51 and the sixth conductor 52 may have a substantially rectangular shape.

The fifth conductor 51 includes the ends 51a and 51b. The end portion 51a is located on the X-axis positive direction side of the fifth conductor 51. The end portion 51b is located on the X-axis negative direction side of the fifth conductor 51. The ends 51a and 51b are along the Y direction.

The sixth conductor 52 includes the ends 52a and 52b. The end portion 52a is located on the X-axis negative direction side of the sixth conductor 52. The end portion 52b is located on the X-axis positive direction side of the sixth conductor 52. The ends 52a and 52b are along the Y direction.

The end portion 51a of the fifth conductor 51 and the end portion 52a of the sixth conductor 52 face each other with a gap in the X direction. The fifth conductor 51 and the sixth conductor 52 are configured to be capacitively connected by facing the end portion 51a and the end portion 52a with a gap. The gap between the end portion 51a and the end portion 52a may be appropriately selected in consideration of the desired operating frequency of the antenna 1.

The end portion 51b of the fifth conductor 51 is configured to be electrically connected to the connecting portion 54. The fifth conductor 51 and the connecting portion 54 may be integrated. The end portion 52b of the sixth conductor 52 is configured to be electrically connected to the connecting portion 55. The sixth conductor 52 and the connecting portion 55 may be integrated.

The width of the fifth conductor 51 in the Y direction may be narrower than the distance between the first connecting conductors 31 located at both ends in the Y direction among the plurality of first connecting conductors 31 arranged in the Y direction. With such a configuration, even if the spacing between the first connecting conductors 31 located at both ends of the antenna 1 varies in the Y direction, the variation in antenna characteristics due to the variation can be reduced. The width of the sixth conductor 52 in the Y direction may be narrower than the distance between the second connecting conductors 41 located at both ends in the Y direction among the plurality of second connecting conductors 41 arranged in the Y direction. With such a configuration, even if the distance between the plurality of second connecting conductors 41 located at both ends of the antenna 1 varies in the Y direction, the variation in the antenna characteristics due to the variation can be reduced.

The structure of the fifth conductor 51 and the structure of the sixth conductor 52 may be appropriately adjusted according to the desired operating frequency of the antenna 1. The operating frequency of the antenna 1 may change depending on the structures of the fifth conductor 51 and the sixth conductor 52. The length A from the end portion 51b of the fifth conductor 51 to the end portion 52b of the sixth conductor 52 is the length B of the first region 201 in the X direction as shown in FIG. 6 described later, and FIG. 6 described later. It may be longer than the length C of the second region 202 in the X direction as shown in. By making the length A longer than the length B and the length C, the amount of deviation of the operating frequency of the antenna 1 from the design value can be reduced as described later.

As shown in FIG. 2, the inner conductor 53 is located in the substrate 20. The inner conductor 53 is not connected to the fifth conductor 51 and the sixth conductor 52. The inner conductor 53 is located on the negative side of the Z axis with respect to the fifth conductor 51 and the sixth conductor 52. As shown in FIG. 1, the inner conductor 53 may have a substantially rectangular shape.

The inner conductor 53 is configured to capacitively connect the fifth conductor 51 and the sixth conductor 52. For example, in the Z direction, the inner conductor 53 is separated from the fifth conductor 51 and the sixth conductor 52. In the XY plane, a portion of the inner conductor 53 may overlap a portion of the fifth conductor 51. In the XY plane, the other part of the inner conductor 53 may overlap the part of the sixth conductor 52. The inner conductor 53 can be capacitively connected to a part of the fifth conductor 51 and a part of the sixth conductor 52 by overlapping a part of the fifth conductor 51 and a part of the sixth conductor 52.

The connecting portion 54 and the connecting portion 55 are located on the upper surface of the substrate 20. The connecting portion 54 is located on the upper surface of the substrate 20 on the negative side of the X-axis. The connecting portion 55 is located on the X-axis positive direction side of the upper surface of the substrate 20. A part of the connecting part 54 and a part of the connecting part 55 may be located in the substrate 20.

The connecting portion 54 is configured to be electrically connected to the end portion 51b of the fifth conductor 51. The connecting portion 54 may be integrated with the fifth conductor 51. The width of the connecting portion 54 in the Y direction may be wider than the width of the fifth conductor 51 in the Y direction. The connecting portion 54 is electrically connected to the connecting portion 32 by contacting the portion 33 on the connecting portion 54 and by contacting the portion 35 with the end portion of the connecting portion 54 on the negative direction side of the X axis. It is configured in. The connecting portion 54 is configured to be electrically connected to the first connecting conductor 31 by penetrating the connecting portion 54 through the first connecting conductor 31.

The connecting portion 55 is configured to be electrically connected to the end portion 52b of the sixth conductor 52. The connecting portion 55 may be integrated with the sixth conductor 52. The width of the connecting portion 55 in the Y direction may be wider than the width of the sixth conductor 52 in the Y direction. The connecting portion 55 is electrically connected to the connecting portion 42 by contacting the portion 43 on the connecting portion 55 and by contacting the portion 45 with the end portion of the connecting portion 55 on the positive direction side of the X axis. It is configured in. The connecting portion 55 is configured so that the second connecting conductor 41 penetrates the connecting portion 55 to be electrically connected to the second connecting conductor 41.

The connecting portion 56 and the connecting portion 57 are located inside the substrate 20. The connecting portion 56 is located on the negative side of the Z axis with respect to the connecting portion 54. The connecting portion 57 is located on the negative side of the Z axis with respect to the connecting portion 55. The connecting portion 56 is configured to be electrically connected to the first connecting conductor 31 by penetrating the connecting portion 56 through the first connecting conductor 31. The connecting portion 57 is configured to be electrically connected to the second connecting conductor 41 by penetrating the connecting portion 57 through the second connecting conductor 41. The connecting portion 56 is configured to be electrically connected to the connecting portion 32 by contacting the portion 35 with the end portion of the connecting portion 56 on the negative direction side of the X axis. The connecting portion 57 is configured to be electrically connected to the connecting portion 42 by contacting the portion 45 with the end portion of the connecting portion 57 on the positive direction side of the X axis.

The connecting portion 54 and the connecting portion 56 are arranged along the Z direction. The distance between the connecting portion 54 and the connecting portion 56 in the Z direction may be ½ or less of the wavelength of the resonance frequency of the resonance structure 10. The connecting portion 55 and the connecting portion 57 are arranged along the Z direction. The distance between the connecting portion 55 and the connecting portion 57 in the Z direction may be ½ or less of the wavelength of the resonance frequency of the resonance structure 10. With such a configuration, it is possible to reduce leakage of electromagnetic waves in a predetermined frequency band including the resonance frequency from each of the first conductor 30 and the second conductor 40 to the outside of the resonance structure 10. By reducing the leakage of electromagnetic waves in a predetermined frequency band to the outside of the resonance structure 10, the first conductor 30 and the second conductor 40 can more function as an electric wall described later.

The third conductor 50 is configured to capacitively connect the first conductor 30 and the second conductor 40. For example, the third conductor 50 is configured to be electrically connected to the first conductor 30 by the connecting portion 54 and the connecting portion 56 as described above. As described above, the third conductor 50 is configured to be electrically connected to the second conductor 40 by the connecting portion 55 and the connecting portion 57. The first conductor 30 electrically connected to the connecting portions 54 and 56 and the second conductor 40 electrically connected to the connecting portions 55 and 57 are capacitively composed of the fifth conductor 51 and the sixth conductor 52. By being connected to, it can be connected capacitively.

The fourth conductor 60 is along the X direction. The fourth conductor 60 may extend along the X direction. The fourth conductor 60 may extend along the XY plane. The fourth conductor 60 is separated from the third conductor 50. The fourth conductor 60 may face the third conductor 50 in the Z direction. The fourth conductor 60 may be located on the lower surface of the substrate 20. A part of the fourth conductor 60 may be located in the substrate 20. The fourth conductor 60 may have any shape depending on the shape of the third conductor 50. The fourth conductor 60 may have a substantially rectangular shape.

The fourth conductor 60 is configured to be electrically connected to the first conductor 30 and the second conductor 40. For example, the fourth conductor 60 is configured to be electrically connected to the first connecting conductor 31 by the first connecting conductor 31 penetrating the fourth conductor 60. The fourth conductor 60 is configured to be electrically connected to the connecting portion 32 by contacting the portion 35 with the end portion of the fourth conductor on the negative direction side of the X axis. The fourth conductor 60 is configured so that the second connecting conductor 41 penetrates the fourth conductor 60 and is electrically connected to the second connecting conductor 41. The fourth conductor 60 is configured to be electrically connected to the connecting portion 42 by contacting the portion 45 with the end portion of the fourth conductor on the positive direction side of the X axis.

The fourth conductor 60 is configured to provide a reference potential in the antenna 1. The fourth conductor 60 may be configured to be electrically connected to the ground of the device including the antenna 1. Various components of the device including the antenna 1 may be located on the Z-axis negative direction side of the fourth conductor 60. The antenna 1 can maintain the radiation efficiency at the operating frequency by having the above-mentioned artificial magnetic wall characteristics even when the various parts are located on the Z-axis negative direction side of the fourth conductor 60.

The feeder line 70 is configured to be electromagnetically connected to the third conductor 50. In the present disclosure, the "electromagnetic connection" may be an electrical connection or a magnetic connection. In the present embodiment, one end of the feeder line 70 is configured to be electrically connected to the sixth conductor 52 of the third conductor 50. The other end of the feeder line 70 may be configured to be electrically connected to an RF (Radio Frequency) module or the like of a device including the antenna 1. A part of the feeder line 70 may be located on the upper surface of the substrate 20.

When the electromagnetic wave is radiated by the antenna 1, the feeder line 70 is configured to supply the electric power from the RF module or the like of the device including the antenna 1 to the third conductor 50. The feeder line 70 is configured to supply the electric power from the third conductor 50 to the RF module or the like when the electromagnetic wave is received by the antenna 1.

When the resonance structure 10 resonates at a predetermined frequency, a loop current that flows in a loop through the first conductor 30, the second conductor 40, the third conductor 50, and the fourth conductor 60 can be generated. From the loop current, the first conductor 30 can be seen as an electric wall extending in the YZ plane on the negative direction side of the X axis, and the second conductor 40 can be seen as an electric wall spreading in the YZ plane on the positive direction side of the X axis. Further, when viewed from the loop current, no conductor or the like is located on the Y-axis positive direction side and the Y-axis negative direction side. That is, when viewed from the loop current, the Y-axis positive direction side and the Y-axis negative direction side are electrically open. Since the Y-axis positive direction side and the Y-axis negative direction side are electrically opened, the XZ plane on the Y-axis positive direction side and the XY plane on the Y-axis negative direction side are magnetic walls from the loop current. Can be seen as. By surrounding the loop current with these two electric walls and the two magnetic walls, the antenna 1 has an artificial magnetic wall with respect to an electromagnetic wave of a predetermined frequency incident on the upper surface of the resonance structure 10 from the positive direction side of the Z axis. Shows the characteristics.

FIG. 3 is a flowchart showing a manufacturing process of the manufacturing method of the resonance structure 10 according to the embodiment of the present disclosure.

In the preparation step S10, for example, the rectangular substrate 200 as shown in FIG. 6 is prepared from the laminated substrate 100 (substrate) as shown in FIGS. 4 and 5.

As shown in FIG. 4, a plurality of units 110 are arranged in a grid pattern along the X direction and the Y direction on the laminated substrate 100. The unit 110 corresponds to the resonant structure 10. As shown in FIG. 5, in the laminated substrate 100, the first layer 101, the second layer 102, the third layer 103, the fourth layer 104, and the fifth layer 105 are laminated. The laminated substrate 100 may be formed by laminating the first layer 101 to the fifth layer 105. The laminated substrate 100 may be formed as a flexible printed circuit board (FPC).

The first layer 101 includes a conductor layer 160 corresponding to the fourth conductor 60. The second layer 102 includes a dielectric layer 120 corresponding to a part of the substrate 20. The third layer 103 includes a conductor layer 153 corresponding to the inner conductor 53, a conductor layer 156 corresponding to the connecting portion 56, a conductor layer 157 corresponding to the connecting portion 57, and a dielectric layer corresponding to a part of the substrate 20. Includes 120. The fourth layer 104 includes a dielectric layer 120 corresponding to a part of the substrate 20. The fifth layer 105 includes a conductor layer 151 corresponding to the fifth conductor 51 and the connecting portion 54, and a conductor layer 152 corresponding to the sixth conductor 52 and the connecting portion 55. When the feeder 70 is formed as a wiring layer, the fifth layer 105 may include a wiring layer corresponding to the feeder 70. The feeder line 70 may be formed separately after the resonance structure 10 is formed.

The first through hole 131 may be formed in the laminated substrate 100 at a position corresponding to the first connecting conductor 31. A second through hole 141 may be formed in the laminated substrate 100 at a position corresponding to the second connecting conductor 41.

The laminated substrate 100 may include regions 100a, 100b, 100c, 100d. Units 110 do not have to be arranged in the regions 100a to 100d. The regions 100a to 100d may be marked with an alignment mark used when cutting the laminated substrate 100. The region 100a is located at the end of the laminated substrate 100 on the negative direction side of the X axis. The region 100b is located at the end of the laminated substrate 100 on the positive direction side of the X axis. The regions 100a and 100b are along the Y direction. The region 100c is an end portion of the laminated substrate 100 on the negative direction side of the Y axis. The region 100d is an end portion of the laminated substrate 100 on the positive direction side of the Y axis. The regions 100c and 100d are along the X direction.

The laminated substrate 100 includes lines 106, 107, 108. The line 106 is a line that separates adjacent units 110 in the X direction. The line 106 is along the Y direction. The line 107 is a line that separates the adjacent region 100a and the unit 110 adjacent to the region 100a in the X direction. The line 107 is along the Y direction. The line 108 is a line that separates the region 100b from the unit 110 adjacent to the region 100b in the X direction. Line 108 is along the Y direction. The widths of the lines 106, 107, and 108 may be a width in consideration of a cutting allowance when cutting the laminated substrate 100, which will be described later.

In the preparation step S10, the rectangular substrate 200 as shown in FIG. 6 may be prepared by cutting the laminated substrate 100 along the Y direction, for example, along the lines 106, 107, 108. For example, in the preparation step S10, the laminated substrate 100 may be cut with reference to the marks attached to the regions 100a to 100d. Cutting of the laminated substrate 100 may be carried out by die cutting and / or laser cutting. However, in the preparation step S10, the method of preparing the rectangular substrate 200 is not limited to cutting the laminated substrate 100. If the rectangular substrate 200 on which the first layer 101, the second layer 102, the third layer 103, the fourth layer 104, and the fifth layer 105 are laminated can be prepared, the rectangular substrate 200 can be formed by any method. , May be prepared.

A plurality of units 110 are arranged along the Y direction on the rectangular substrate 200. A plurality of units 110 are connected to the rectangular substrate 200 along the Y direction. The rectangular substrate 200 includes a region 200c and a region 200d. The region 200c is a part of the region 100c of the laminated substrate 100. The region 200d is a part of the region 100d of the laminated substrate 100. The regions 200a and 200d may be marked for alignment, which is used when cutting the rectangular substrate 200.

In the forming step S11, a conductor 230 corresponding to the first conductor 30 and a conductor 240 corresponding to the second conductor 40, as shown in FIG. 7, are formed at two ends of the rectangular substrate 200 in the X direction by a hot-dip plating method. Is formed. In FIG. 7 and FIG. 8 described later, dots are provided on the conductor 230 and the conductor 240 for convenience of explanation. In the hot-dip plating method, each of the first region 201 and the second region 202 may be immersed in the molten metal as shown in FIG.

The first region 201 is a region on the negative side of the X-axis of the rectangular substrate 200. The first region 201 includes a region corresponding to the first conductor 30. The first region 201 includes the ends of the regions 200c and 200d on the negative side of the X-axis. The first through hole 131 is located in the first region 201. The first region 201 may be set so as to be away from the end portion 51b of the fifth conductor 51 as shown in FIG. The length B of the first region 201 in the X direction may be shorter than the length A as described above with reference to FIG.

The second region 202 is a region on the positive direction side of the X-axis of the rectangular substrate 200. The second region 202 includes a region corresponding to the second conductor 40. The second region 202 includes the ends of the regions 200c and 200d on the positive direction side of the X axis. The second through hole 141 is located in the second region 202. The second region 202 may be set away from the end 52b of the sixth conductor 52 as shown in FIG. The length C of the second region 202 in the X direction may be the same as or different from the length B of the first region 201 in the X direction. The length C may be shorter than the length A as described above with reference to FIG.

By immersing the first region 201 in the molten metal, the molten metal can adhere to the surface of the first region 201. By immersing the first region 201 in the molten metal, the molten metal can be filled in the first through hole 131 located in the first region 201. The molten metal adhering to the surface of the first region 201 and the molten metal filled in the first through hole 131 are cured. The conductor 230 can be formed by curing the molten metal.

By immersing the second region 202 in the molten metal, the molten metal can adhere to the surface of the second region 202. By immersing the second region 202 in the molten metal, the molten metal can be filled in the second through hole 141 located in the second region 202. The molten metal adhering to the surface of the second region 202 and the molten metal filled in the second through hole 141 are cured. The conductor 240 can be formed by curing the molten metal.

When the molten metal is attached to the surface of the first region 201 by immersing the first region 201 in the molten metal, the molten metal also adheres to the X-axis positive direction side of the unit 110 beyond the first region 201. May be done. Similar to the first region 201, when the molten metal is adhered to the surface of the second region 202, the molten metal may be adhered to the X-axis negative direction side of the unit 110 beyond the second region 202.

Here, as described above with reference to FIG. 1, the operating frequency of the antenna 1 may change depending on the structures of the fifth conductor 51 and the sixth conductor 52. As described above, the first region 201 may be set away from the end 51b of the fifth conductor 51 as shown in FIG. Since the end portion 51b of the fifth conductor 51 is separated from the first region 201, even if the molten metal adheres to the X-axis positive direction side of the unit 110 beyond the first region 201, the molten metal is the fifth. The possibility of adhering to the conductor 51 can be reduced. As described above, the second region 202 may be set away from the end 52b of the sixth conductor 52 as shown in FIG. Since the end portion 52b of the sixth conductor 52 is separated from the second region 202, even if the molten metal adheres to the negative side of the X-axis of the unit 110 beyond the second region 202, the molten metal remains in the sixth region 202. The possibility of adhering to the conductor 52 can be reduced. By reducing the possibility of molten metal adhering to the fifth conductor 51 and the sixth conductor 52, the possibility that the structures of the fifth conductor 51 and the sixth conductor 52 change from the design values can be reduced. By reducing the possibility that the structures of the fifth conductor 51 and the sixth conductor 52 change from the design value, the possibility that the operating frequency of the antenna 1 deviates from the design value can be reduced.

As described above with reference to FIG. 1, the length A from the end portion 51b of the fifth conductor 51 to the end portion 52b of the sixth conductor 52 is the length B of the first region 201 in the X direction and the first It may be longer than the length C of the two regions 202 in the X direction. Due to the long length A, even if molten metal adheres to the 5th conductor 51 and the 6th conductor 52, the change in the length of the 5th conductor 51 and the 6th conductor 62 in the X direction from the design value is reduced. obtain. By reducing the change from the design value of the lengths of the fifth conductor 51 and the sixth conductor 62 in the X direction, the amount of deviation of the operating frequency of the antenna 1 from the design value can be reduced.

In the cutting step S12, the rectangular substrate 300 on which the conductor 230 and the conductor 240 as shown in FIG. 7 are formed is cut along the X direction, for example, along the lines 301, 302, and 303. For example, in the cutting step S12, the rectangular substrate 300 may be cut with reference to the marks attached to the regions 200a and 200d. Cutting of the rectangular substrate 300 may be performed by die cutting and / or laser cutting. The line 301 is a line that divides adjacent units 110 in the Y direction. Line 301 is along the X direction. The line 302 is a line that separates the area 200c from the unit 110 adjacent to the area 200c in the Y direction. The line 302 is along the X direction. The line 303 is a line that separates the area 200d and the unit 110 adjacent to the area 200d in the Y direction. The line 303 is along the X direction. The width of the lines 301, 302, and 303 may be a width in consideration of a cutting allowance when cutting the rectangular substrate 300.

After forming the conductor 230 and the conductor 240 in the forming step S11, the cutting step S12 is executed, so that the metal adheres to the Y-axis positive direction surface and the Y-axis negative direction side surface of the resonance structure 10. Can be reduced. By reducing the adhesion of metal to the Y-axis positive direction surface and the Y-axis negative direction side surface of the resonance structure 10, the XZ plane on the Y-axis positive direction side of the resonance structure 10 and the Y-axis The negative XY plane can better function as a magnetic wall.

As described above, according to the present embodiment, a new method for manufacturing the resonance structure 10 can be provided.

The configuration according to the present disclosure is not limited to the embodiments described above, and can be modified or modified in many ways. For example, the functions and the like included in each component and the like can be rearranged so as not to be logically inconsistent, and a plurality of components and the like can be combined or divided into one.

The figure illustrating the configuration according to the present disclosure is schematic. The dimensional ratios on the drawings do not always match the actual ones.

In the present disclosure, the description of "first", "second", "third" and the like is an example of an identifier for distinguishing the configuration. The configurations distinguished by the descriptions such as "first" and "second" in the present disclosure can exchange numbers in the configurations. For example, the first conductor can exchange the identifiers "first" and "second" with the second conductor. The exchange of identifiers takes place at the same time. Even after exchanging identifiers, the configuration is distinguished. The identifier may be deleted. The configuration with the identifier removed is distinguished by a code. Based only on the description of identifiers such as "first" and "second" in the present disclosure, the interpretation of the order of the configurations, the grounds for the existence of the lower number identifier, and the existence of the higher number identifier. It should not be used as a basis for.

1 Antenna 10 Resonant structure 20 Base 30 First conductor 31 First connecting conductor 32 Connection part 33, 34, 35 Part 40 Second conductor 41 Second connecting conductor 42 Connection part 43, 44, 45 Part 50 Third conductor 51 No. 5 Conductor 51a, 51b End 52 6th Conductor 52a, 52b End 53 Conductor 54, 55, 56, 57 Connection 60 4th Conductor 70 Feeding Line 100 Laminated Substrate (Substrate)
100a, 100b, 100c, 100d region 101 1st layer 102 2nd layer 103 3rd layer 104 4th layer 105 5th layer 106, 107, 108, wire 110 Unit 120 Dielectric layer 131 1st through hole 141 2nd through Holes 151,152,153,156,157,160, Conductor layer 200 Rectangular substrate 200c, 200d Region 201 1st region 202 2nd region 230,240 Conductor 300 Rectangular substrate 301, 302, 303 Lines

Claims (7)

It is a method of manufacturing a resonance structure.
The resonance structure is
With the first conductor
A second conductor facing the first conductor in the first direction,
A third conductor that extends along the first direction, is located between the first conductor and the second conductor, and is configured to capacitively connect the first conductor and the second conductor. When,
Includes a fourth conductor that extends along the first direction and is electrically connected to the first conductor and the second conductor.
The method for manufacturing the resonance structure is as follows.
To prepare a rectangular substrate in which a plurality of units corresponding to the resonance structure are arranged in a second direction intersecting with the first direction.
By the hot-dip plating method, a conductor corresponding to the first conductor and a conductor corresponding to the second conductor are formed at two ends of the rectangular substrate in the first direction.
A method for manufacturing a resonance structure, comprising cutting the plurality of units adjacent to each other in the second direction along the first direction in the rectangular substrate. The method for manufacturing a resonant structure according to claim 1.
The first conductor extends along a third direction intersecting a first plane including the first direction and the second direction, and electrically connects the third conductor and the fourth conductor 1 or Includes multiple first connecting conductors
The second conductor includes one or more second connecting conductors extending along the third direction and electrically connecting the third conductor and the fourth conductor.
Preparing the rectangular substrate
Forming one or more first through holes at positions corresponding to the one or more first connecting conductors of the unit, and
Including forming one or more second through holes at positions corresponding to the one or more second connecting conductors of the unit.
To form the conductor, the one or more first through holes are formed in the one or more first through holes by the hot-dip plating method, and the one or more second through holes are formed. A method for manufacturing a resonant structure, which comprises forming the one or more second connecting conductors. The method for manufacturing a resonant structure according to claim 2.
The one or a plurality of first connecting conductors are a plurality of the first connecting conductors arranged in the second direction.
The one or a plurality of second connecting conductors are a plurality of the second connecting conductors arranged in the second direction.
The third conductor includes a fifth conductor and a sixth conductor facing each other in the first direction.
The width of the fifth conductor in the second direction is narrower than the distance between both ends of the plurality of first connecting conductors in the second direction.
A method for manufacturing a resonance structure, wherein the width of the sixth conductor in the second direction is narrower than the distance between both ends of the plurality of second connecting conductors in the second direction. The method for manufacturing a resonant structure according to claim 3.
Forming the conductor includes immersing a first region corresponding to the position of the first conductor and a second region corresponding to the position of the second conductor in the molten metal.
The first region is set to include the end of the fifth conductor on the first conductor side.
A method for manufacturing a resonance structure, wherein the second region is set to include an end portion of the sixth conductor on the second conductor side. The method for manufacturing a resonant structure according to claim 4.
The length from the end of the fifth conductor on the first conductor side to the end of the sixth conductor on the second conductor side is the length of the first region in the first direction and the first. A method for manufacturing a resonant structure, which is longer than each of the lengths of the two regions in the first direction. The method for manufacturing a resonant structure according to any one of claims 1 to 5.
Preparing the rectangular substrate
Preparing a substrate to which the plurality of units are connected along the first direction.
A method for manufacturing a resonant structure, comprising preparing the rectangular substrate by cutting the substrate along the second direction. The method for manufacturing a resonant structure according to any one of claims 1 to 6.
The rectangular substrate is a method for manufacturing a resonance structure in which a conductor layer corresponding to the third conductor and a conductor layer corresponding to the fourth conductor are laminated via a dielectric layer.

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