JP2021084162A - Cutting device - Google Patents

Cutting device Download PDF

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Publication number
JP2021084162A
JP2021084162A JP2019214137A JP2019214137A JP2021084162A JP 2021084162 A JP2021084162 A JP 2021084162A JP 2019214137 A JP2019214137 A JP 2019214137A JP 2019214137 A JP2019214137 A JP 2019214137A JP 2021084162 A JP2021084162 A JP 2021084162A
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Prior art keywords
cutting
cutting blade
mount
blade
rotating shaft
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JP7461132B2 (en
Inventor
秀次 新田
Hideji Nitta
秀次 新田
治信 湯澤
Harunobu Yuzawa
治信 湯澤
嘉男 松下
Yoshio Matsushita
嘉男 松下
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2019214137A priority Critical patent/JP7461132B2/en
Priority to KR1020200147615A priority patent/KR20210065844A/en
Priority to CN202011338136.5A priority patent/CN112847857A/en
Priority to TW109141260A priority patent/TW202120257A/en
Publication of JP2021084162A publication Critical patent/JP2021084162A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)

Abstract

To provide a cutting device configured so that a wafer and a cutting blade are not damaged and so that cutting water and chips are not suctioned through a space between a mount and the cutting blade.SOLUTION: A cutting device 2 comprises control means 70 that when a value gauged by a pressure gauge 56 does not reach an allowable value, checks a rotary shaft 26 from starting to rotate and cutting water from being started to be supplied, and when the value gauged by the pressure gauge 56 reaches the allowable value, permits the rotary shaft 26 to start to rotate and permits the cutting water to be started to be supplied after the rotary shaft 26 starts to rotate.SELECTED DRAWING: Figure 3

Description

本発明は、被加工物を保持する保持手段と、保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、切削ブレードと被加工物に切削水を供給する切削水供給手段と、保持手段と切削手段とを相対的に加工送りする送り手段と、を含む切削装置に関する。 The present invention includes a holding means for holding a work piece, a cutting means for rotatably supporting a cutting blade provided with a cutting edge for cutting the work piece held by the holding means, and a cutting blade and a work piece. The present invention relates to a cutting apparatus including a cutting water supply means for supplying cutting water to an object and a feeding means for relatively processing and feeding a holding means and a cutting means.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、切削ブレードを回転可能に備えた切削装置によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 A wafer in which a plurality of devices such as ICs and LSIs are partitioned by a planned division line and formed on the surface is divided into individual device chips by a cutting device equipped with a rotatable cutting blade, and each divided device chip is portable. Used for electrical equipment such as telephones and personal computers.

本出願人は、切削ブレードをナットでマウントに締結する際に必要な特殊工具の回避、切削ブレードをナットでマウントに締結する際の個人差の回避、を可能にした切削装置を提案した（たとえば特許文献１参照）。 The applicant has proposed a cutting device that enables avoidance of special tools required when fastening a cutting blade to a mount with a nut and avoidance of individual differences when fastening a cutting blade to a mount with a nut (for example). See Patent Document 1).

この切削装置は、被加工物を保持する保持手段と、保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、切削ブレードと被加工物に切削水を供給する切削水供給手段と、保持手段と切削手段とを相対的に加工送りする送り手段とを含む。切削手段は、回転軸と、回転軸を回転可能に支持するハウジングと、回転軸の先端に形成され切削ブレードを保持するマウントとを備える。マウントは、切削ブレードの中央に形成された開口に挿入されるボス部と、ボス部の外周に形成され切削ブレードの切り刃を露出させて支持するリング状の支持部と、ボス部と支持部との間に開口し切削ブレードを吸引保持する吸引孔と、吸引孔を吸引源に連通する連通路とを有する。 This cutting device includes a holding means for holding a work piece, a cutting means for rotatably supporting a cutting blade provided with a cutting edge for cutting the work piece held by the holding means, and a cutting blade and a work piece. It includes a cutting water supply means for supplying cutting water to a work piece and a feeding means for relatively feeding the holding means and the cutting means. The cutting means includes a rotating shaft, a housing that rotatably supports the rotating shaft, and a mount formed at the tip of the rotating shaft to hold the cutting blade. The mount has a boss portion inserted into an opening formed in the center of the cutting blade, a ring-shaped support portion formed on the outer periphery of the boss portion to expose and support the cutting blade of the cutting blade, and a boss portion and a support portion. It has a suction hole that opens between the two and holds the cutting blade for suction, and a communication passage that communicates the suction hole with the suction source.

特開２００２−１５４０５４号公報Japanese Unexamined Patent Publication No. 2002-154504

しかし、マウントと切削ブレードとの間に異物が介在し充分な吸引力が得られない状態で切削ブレードを回転させて切削加工を施すとウエーハおよび切削ブレードを損傷させるという問題がある。 However, there is a problem that the wafer and the cutting blade are damaged when the cutting blade is rotated and the cutting process is performed in a state where foreign matter is interposed between the mount and the cutting blade and a sufficient suction force cannot be obtained.

また、マウントに切削ブレードが適正に装着されている場合であっても、切削水を供給した際に、マウントと切削ブレードとの間の僅かな隙間から切削水と共に切削屑が吸引されてしまうという問題がある。 In addition, even if the cutting blade is properly mounted on the mount, when the cutting water is supplied, the cutting debris is sucked together with the cutting water from the slight gap between the mount and the cutting blade. There's a problem.

上記事実に鑑みてなされた本発明の課題は、ウエーハおよび切削ブレードを損傷させることがないと共に、マウントと切削ブレードとの間から切削水および切削屑が吸引されることがない切削装置を提供することである。 An object of the present invention made in view of the above facts is to provide a cutting apparatus that does not damage the wafer and the cutting blade and does not attract cutting water and cutting debris from between the mount and the cutting blade. That is.

本発明は上記課題を解決するために以下の切削装置を提供する。すなわち、被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該切削ブレードと被加工物に切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含む切削装置であって、該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され該切削ブレードを保持するマウントと、から少なくとも構成され、該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始および切削水の供給開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容すると共に該回転軸の回転開始時以降において切削水の供給開始を許容する制御手段を備える切削装置を本発明は提供する。 The present invention provides the following cutting apparatus in order to solve the above problems. That is, a holding means for holding the work piece, a cutting means for rotatably supporting a cutting blade provided with a cutting blade for cutting the work piece held by the holding means, and the cutting blade and the work piece. A cutting device including a cutting water supply means for supplying cutting water to an object, a feeding means for relatively processing and feeding the holding means and the cutting means, and the cutting means includes a rotating shaft and the cutting means. It consists of at least a housing that rotatably supports the axis of rotation and a mount that is formed at the tip of the axis of rotation and holds the cutting blade, the mount being inserted into an opening formed in the center of the cutting blade. A boss portion, a ring-shaped support portion formed on the outer periphery of the boss portion to expose and support the cutting edge of the cutting blade, and an opening between the boss portion and the support portion to suck the cutting blade. A suction hole to be held and a communication path communicating the suction hole to the suction source are included, and a pressure gauge is provided in the communication passage. If the value measured by the pressure gauge does not reach an allowable value, the rotation is performed. The start of rotation of the shaft and the start of supply of cutting water are blocked, and when the value measured by the pressure gauge reaches the permissible value, the start of rotation of the rotating shaft is permitted and the cutting water is allowed after the start of rotation of the rotating shaft. The present invention provides a cutting device provided with a control means for allowing the start of supply of the cutting device.

好ましくは、該切削手段は、該切削ブレードが対向するように２個配設され、該制御手段は、該圧力計が計測した値が許容値に達した状態で双方の該切削手段の該マウントに該切削ブレードが装着されている場合に、一方の該切削手段のみによる該保持手段に保持された被加工物の切削を許容すると共に、他方の該切削手段の該回転軸を回転させる。 Preferably, two cutting means are arranged so that the cutting blades face each other, and the control means mounts the cutting means on both sides in a state where the value measured by the pressure gauge reaches an allowable value. When the cutting blade is mounted on the machine, the cutting of the workpiece held by the holding means by only one of the cutting means is allowed, and the rotation axis of the other cutting means is rotated.

本発明の切削装置は、被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該切削ブレードと被加工物に切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含み、該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され該切削ブレードを保持するマウントと、から少なくとも構成され、該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始および切削水の供給開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容すると共に該回転軸の回転開始時以降において切削水の供給開始を許容する制御手段を備えるので、マウントと切削ブレードとの間に異物が介在し充分な吸引力が得られない場合は、圧力計が計測した値が許容値に達しないため切削加工が開始されず、ウエーハおよび切削ブレードを損傷させるという問題が解消する。また、本発明の切削装置においては、回転軸の回転開始時以降において切削水の供給開始を許容するので、マウントおよび切削ブレードに切削水および切削水が付着しても、マウントおよび切削ブレードの遠心力によって切削水および切削屑が吹き飛ばされ、マウントと切削ブレードとの間の僅かな隙間から切削水と共に切削屑が吸引されることがない。 The cutting apparatus of the present invention includes a holding means for holding a work piece, a cutting means for rotatably supporting a cutting blade provided with a cutting edge for cutting the work piece held by the holding means, and the like. The cutting means includes a cutting water supply means for supplying cutting water to the cutting blade and the workpiece, and a feeding means for relatively feeding the holding means and the cutting means, and the cutting means includes a rotating shaft and the same. It consists of at least a housing that rotatably supports the axis of rotation and a mount that is formed at the tip of the axis of rotation and holds the cutting blade, the mount being inserted into an opening formed in the center of the cutting blade. A boss portion, a ring-shaped support portion formed on the outer periphery of the boss portion to expose and support the cutting edge of the cutting blade, and an opening between the boss portion and the support portion to suck the cutting blade. A suction hole to be held and a communication path communicating the suction hole to the suction source are included, and a pressure gauge is provided in the communication passage. If the value measured by the pressure gauge does not reach an allowable value, the rotation is performed. The start of rotation of the shaft and the start of supply of cutting water are blocked, and when the value measured by the pressure gauge reaches the permissible value, the start of rotation of the rotating shaft is permitted and the cutting water is allowed after the start of rotation of the rotating shaft. Since it is equipped with a control means that allows the start of supply, if foreign matter intervenes between the mount and the cutting blade and sufficient suction force cannot be obtained, the value measured by the pressure gauge does not reach the allowable value, so cutting is performed. Is not started and the problem of damaging the wafer and cutting blade is solved. Further, in the cutting apparatus of the present invention, since the supply of cutting water is allowed to start after the start of rotation of the rotating shaft, even if the cutting water and the cutting water adhere to the mount and the cutting blade, the mount and the cutting blade are centrifuged. The force blows off the cutting water and cutting debris, and the cutting debris is not sucked together with the cutting water from the slight gap between the mount and the cutting blade.

本発明に従って構成された切削装置の一部斜視図。A partial perspective view of a cutting apparatus configured according to the present invention. （ａ）図１に示す切削手段の一部斜視図、（ｂ）（ａ）に示す状態から切削水供給部を跳ね上げた状態を示す斜視図、（ｃ）（ｂ）に示す状態から切削ブレードを取り外した状態を示す斜視図。(A) A partial perspective view of the cutting means shown in FIG. 1, a perspective view showing a state in which the cutting water supply unit is flipped up from the state shown in (b) and (a), and cutting from the states shown in (c) and (b). A perspective view showing a state in which the blade is removed. 図１に示す切削手段の一部断面図。A partial cross-sectional view of the cutting means shown in FIG.

以下、本発明に従って構成された切削装置の好適実施形態について図面を参照しつつ説明する。 Hereinafter, preferred embodiments of the cutting apparatus configured according to the present invention will be described with reference to the drawings.

図１に示す切削装置２は、被加工物を保持する保持手段４と、保持手段４に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段６と、切削ブレードと被加工物に切削水を供給する切削水供給手段８（図２参照）と、保持手段４と切削手段６とを相対的に加工送りする送り手段１０と、を含む。なお、図１には、互いに直交するＸ軸方向、Ｙ軸方向、Ｚ軸方向がそれぞれ矢印Ｘ、Ｙ、Ｚで示されている。Ｘ軸方向およびＹ軸方向が規定する平面は実質上水平である。 The cutting device 2 shown in FIG. 1 is a cutting means that rotatably supports a holding means 4 for holding a work piece and a cutting blade having a cutting edge for cutting the work piece held by the holding means 4 on the outer periphery. 6 includes a cutting water supply means 8 (see FIG. 2) that supplies cutting water to the cutting blade and the workpiece, and a feeding means 10 that relatively feeds the holding means 4 and the cutting means 6. In FIG. 1, the X-axis direction, the Y-axis direction, and the Z-axis direction, which are orthogonal to each other, are indicated by arrows X, Y, and Z, respectively. The plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

保持手段４は、Ｘ軸方向に移動自在に基板１２に搭載されたＸ軸可動板１４と、Ｘ軸可動板１４の上面に固定された支柱１６と、支柱１６の上端に固定されたカバー板１８とを備える。カバー板１８には円形開口１８ａが形成され、円形開口１８ａを通って上方に延びるチャックテーブル２０が支柱１６の上端に回転自在に搭載されている。チャックテーブル２０は、支柱１６に内蔵されたチャックテーブル用モータ（図示していない。）によって上下方向に延びる軸線を中心として回転される。 The holding means 4 includes an X-axis movable plate 14 mounted on the substrate 12 so as to be movable in the X-axis direction, a support column 16 fixed to the upper surface of the X-axis movable plate 14, and a cover plate fixed to the upper end of the support column 16. It is provided with 18. A circular opening 18a is formed in the cover plate 18, and a chuck table 20 extending upward through the circular opening 18a is rotatably mounted on the upper end of the support column 16. The chuck table 20 is rotated about an axis extending in the vertical direction by a chuck table motor (not shown) built in the support column 16.

チャックテーブル２０の上端部分には、吸引手段（図示していない。）に接続された多孔質の円形状の吸着チャック２２が配置されている。そして、チャックテーブル２０においては、吸引手段で吸着チャック２２の上面に吸引力を生成することにより、吸着チャック２２の上面に載せられた被加工物を吸引保持するようになっている。また、チャックテーブル２０の周縁には、周方向に間隔をおいて複数のクランプ２４が配置されている。 A porous circular suction chuck 22 connected to a suction means (not shown) is arranged at the upper end of the chuck table 20. Then, in the chuck table 20, the work piece placed on the upper surface of the suction chuck 22 is sucked and held by generating a suction force on the upper surface of the suction chuck 22 by the suction means. Further, a plurality of clamps 24 are arranged on the peripheral edge of the chuck table 20 at intervals in the circumferential direction.

図示の実施形態の切削手段６は、互いにＹ軸方向に間隔をおいて切削ブレードが対向するように２個配設された第一の切削手段６ａおよび第二の切削手段６ｂを有している。図示の実施形態の切削手段６においては、保持手段４に保持された被加工物を２個の切削ブレードによって同時に切削加工を施すことができるようになっている。図２および図３を参照して説明すると、第一の切削手段６ａは、回転軸２６（図３参照）と、回転軸２６を回転可能に支持するハウジング２８と、回転軸２６の先端に形成され切削ブレード３０を保持するマウント３２と、から少なくとも構成されている。 The cutting means 6 of the illustrated embodiment has two first cutting means 6a and a second cutting means 6b arranged so that the cutting blades face each other at intervals in the Y-axis direction. .. In the cutting means 6 of the illustrated embodiment, the workpiece held by the holding means 4 can be cut at the same time by two cutting blades. Explaining with reference to FIGS. 2 and 3, the first cutting means 6a is formed on the rotary shaft 26 (see FIG. 3), the housing 28 that rotatably supports the rotary shaft 26, and the tip of the rotary shaft 26. It is composed of at least a mount 32 that holds the cutting blade 30.

回転軸２６の他端には、回転軸２６を回転させるためのモータ（図示していない。）が連結されている。図２に示すとおり、ハウジング２８の先端にはブレードカバー３４が装着されている。ブレードカバー３４は、ハウジング２８の先端に固定された主部３６と、主部３６に揺動自在に支持された可動部３８とを含む。切削ブレード３０は、円筒状の基台４０と、基台４０の片側面の外周部に装着された環状の切り刃４２とを有する。基台４０の中央部には円形状の開口４０ａが形成されている。なお、図３においては、便宜上、ブレードカバー３４を省略している。 A motor (not shown) for rotating the rotating shaft 26 is connected to the other end of the rotating shaft 26. As shown in FIG. 2, a blade cover 34 is attached to the tip of the housing 28. The blade cover 34 includes a main portion 36 fixed to the tip of the housing 28 and a movable portion 38 swingably supported by the main portion 36. The cutting blade 30 has a cylindrical base 40 and an annular cutting blade 42 mounted on the outer peripheral portion of one side surface of the base 40. A circular opening 40a is formed in the central portion of the base 40. In FIG. 3, the blade cover 34 is omitted for convenience.

図３を参照して説明を続けると、マウント３２は、切削ブレード３０の中央に形成された開口４０ａに挿入されるボス部４４と、ボス部４４の外周に形成され切削ブレード３０の切り刃４２を露出させて支持するリング状の支持部４６と、ボス部４４と支持部４６との間に開口し切削ブレード３０を吸引保持する吸引孔５０と、吸引孔５０を吸引源５２に連通する連通路５４とを含む。 Continuing the description with reference to FIG. 3, the mount 32 has a boss portion 44 inserted into the opening 40a formed in the center of the cutting blade 30 and a cutting blade 42 formed on the outer periphery of the boss portion 44. A ring-shaped support portion 46 that exposes and supports the cutting blade 40, a suction hole 50 that opens between the boss portion 44 and the support portion 46 to suck and hold the cutting blade 30, and a connection that communicates the suction hole 50 with the suction source 52. Includes passage 54.

ボス部４４は円柱状に形成されており、ボス部４４の直径は切削ブレード３０の基台４０の開口４０ａの直径に対応している。支持部４６の外径は切削ブレード３０の切り刃４２の外径よりも小さく、マウント３２に切削ブレード３０が装着された際に、マウント３２から切り刃４２が露出するようになっている。また、支持部４６のＹ軸方向先端面は、ボス部４４のＹ軸方向先端面よりも後退している。 The boss portion 44 is formed in a columnar shape, and the diameter of the boss portion 44 corresponds to the diameter of the opening 40a of the base 40 of the cutting blade 30. The outer diameter of the support portion 46 is smaller than the outer diameter of the cutting blade 42 of the cutting blade 30, and when the cutting blade 30 is mounted on the mount 32, the cutting blade 42 is exposed from the mount 32. Further, the Y-axis direction tip surface of the support portion 46 is recessed from the Y-axis direction tip surface of the boss portion 44.

ボス部４４と支持部４６との間には、支持部４６の先端よりもＹ軸方向に更に後退した環状凹所４８が設けられており、この環状凹所４８には、切削ブレード３０を吸引保持するための吸引孔５０が形成されている。図示の実施形態のマウント３２には一対の吸引孔５０が設けられている。吸引孔５０は１個でもよいが、回転バランスを良好にするために等角度間隔で２個以上形成されているのが好ましい。図３に示すとおり、各吸引孔５０は吸引源５２に連通路５４を介して連通している。連通路５４には、連通路５４内の圧力を計測する圧力計５６と、連通路５４を開閉するためのバルブ５８とが配設されている。そして、マウント３２においては、バルブ５８を開けた状態で吸引源５２を作動することにより、ボス部４４に嵌め合わされた切削ブレード３０を吸引保持するようになっている。 An annular recess 48 further retracted in the Y-axis direction from the tip of the support 46 is provided between the boss portion 44 and the support portion 46, and the cutting blade 30 is sucked into the annular recess 48. A suction hole 50 for holding is formed. The mount 32 of the illustrated embodiment is provided with a pair of suction holes 50. The number of suction holes 50 may be one, but it is preferable that two or more suction holes 50 are formed at equal angular intervals in order to improve the rotational balance. As shown in FIG. 3, each suction hole 50 communicates with the suction source 52 via a communication passage 54. The communication passage 54 is provided with a pressure gauge 56 for measuring the pressure in the communication passage 54 and a valve 58 for opening and closing the communication passage 54. Then, in the mount 32, the cutting blade 30 fitted to the boss portion 44 is sucked and held by operating the suction source 52 with the valve 58 open.

また、第一の切削手段６ａは、図１に示すとおり、Ｙ軸方向に移動自在に適宜の支持部材（図示していない。）に支持されたＹ軸可動片６０と、Ｚ軸方向に移動自在にＹ軸可動片６０に支持されたＺ軸可動片６２とを含む。Ｚ軸可動片６２の下端には、上記ハウジング２８が固定されている。なお、第二の切削手段６ｂについては、第一の切削手段６ａと同一の構成でよいので第一の切削手段６ａの構成と同一の符号を付し、説明を省略する。 Further, as shown in FIG. 1, the first cutting means 6a moves in the Z-axis direction with the Y-axis movable piece 60 supported by an appropriate support member (not shown) so as to be movable in the Y-axis direction. Includes a Z-axis movable piece 62 freely supported by a Y-axis movable piece 60. The housing 28 is fixed to the lower end of the Z-axis movable piece 62. Since the second cutting means 6b may have the same configuration as the first cutting means 6a, the same reference numerals as those of the first cutting means 6a are given, and the description thereof will be omitted.

図２を参照して切削水供給手段８について説明する。切削水供給手段８は、ブレードカバー３４の主部３６に付設された円筒状の供給口６４と、供給口６４に連通する一対のノズル６６とを含む。供給口６４は切削水供給源（図示していない。）に連通しており、供給口６４と切削水供給源とを連通する水路（図示していない。）には、この水路を開閉するバルブ（図示していない。）が設けられている。図２（ｂ）および図２（ｃ）に示すとおり、ノズル６６には複数の噴射孔６８が形成されている。そして、切削水供給手段８においては、保持手段４に保持された被加工物に切削手段６によって切削加工を施す際に、切削水供給源から供給口６４に供給された切削水をノズル６６の噴射孔６８から切削水を切削ブレード３０および被加工物に向かって噴射するようになっている。 The cutting water supply means 8 will be described with reference to FIG. The cutting water supply means 8 includes a cylindrical supply port 64 attached to the main portion 36 of the blade cover 34, and a pair of nozzles 66 communicating with the supply port 64. The supply port 64 communicates with a cutting water supply source (not shown), and a valve for opening and closing this water channel in a water channel (not shown) communicating the supply port 64 and the cutting water supply source. (Not shown) is provided. As shown in FIGS. 2 (b) and 2 (c), a plurality of injection holes 68 are formed in the nozzle 66. Then, in the cutting water supply means 8, when the workpiece held by the holding means 4 is cut by the cutting means 6, the cutting water supplied from the cutting water supply source to the supply port 64 is sent to the nozzle 66. Cutting water is injected from the injection hole 68 toward the cutting blade 30 and the workpiece.

図３に示すとおり、圧力計５６には、切削装置２の作動を制御する制御手段７０が電気的に接続されており、圧力計５６で計測した値が制御手段７０に送られるようになっている。コンピュータから構成されている制御手段７０は、制御プログラムに従って演算処理する中央処理装置（ＣＰＵ）と、制御プログラム等を格納するリードオンリメモリ（ＲＯＭ）と、演算結果等を格納する読み書き可能なランダムアクセスメモリ（ＲＡＭ）とを有する（いずれも図示していない。）。そして、制御手段７０は、圧力計５６が計測した値が許容値に達しない場合は回転軸２６の回転開始および切削水の供給開始を阻止し、圧力計５６が計測した値が許容値に達した場合は回転軸２６の回転開始を許容すると共に回転軸２６の回転開始時以降において切削水の供給開始を許容するようになっている。 As shown in FIG. 3, a control means 70 for controlling the operation of the cutting device 2 is electrically connected to the pressure gauge 56, and the value measured by the pressure gauge 56 is sent to the control means 70. There is. The control means 70 composed of a computer includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores a control program and the like, and a readable and writable random access that stores an arithmetic result and the like. It has a memory (RAM) (neither is shown). Then, the control means 70 blocks the start of rotation of the rotating shaft 26 and the start of supply of cutting water when the value measured by the pressure gauge 56 does not reach the permissible value, and the value measured by the pressure gauge 56 reaches the permissible value. In this case, the rotation of the rotating shaft 26 is allowed to start, and the supply of cutting water is allowed to start after the rotation of the rotating shaft 26 starts.

図示の実施形態の送り手段１０は、図１に示すとおり、Ｘ軸送り手段７２と、基台１２をまたいで配設された門型フレーム（図示せず）に配設された第一・第二のＹ軸送り手段７４ａ、７４ｂと、第一・第二のＺ軸送り手段７６ａ、７６ｂとを含む。Ｘ軸送り手段７２は、Ｘ軸可動板１４に連結されＸ軸方向に延びるボールねじ７８と、ボールねじ７８を回転させるモータ８０とを有する。そして、Ｘ軸送り手段７２は、ボールねじ７８によりモータ８０の回転運動を直線運動に変換してＸ軸可動板１４に伝達し、切削手段６に対して保持手段４をＸ軸方向に相対的に加工送りする。 As shown in FIG. 1, the feeding means 10 of the illustrated embodiment is arranged on the X-axis feeding means 72 and the gantry frame (not shown) arranged across the base 12. The second Y-axis feeding means 74a and 74b and the first and second Z-axis feeding means 76a and 76b are included. The X-axis feeding means 72 includes a ball screw 78 that is connected to the X-axis movable plate 14 and extends in the X-axis direction, and a motor 80 that rotates the ball screw 78. Then, the X-axis feeding means 72 converts the rotational motion of the motor 80 into a linear motion by the ball screw 78 and transmits it to the X-axis movable plate 14, and the holding means 4 is relative to the cutting means 6 in the X-axis direction. Process and send to.

第一のＹ軸送り手段７４ａは、Ｙ軸可動片６０に連結されＹ軸方向に延びるボールねじ８２と、ボールねじ８２を回転させるモータ８４とを有する。そして、第一のＹ軸送り手段７４ａは、ボールねじ８２によりモータ８４の回転運動を直線運動に変換してＹ軸可動片６０に伝達し、保持手段４に対して第一の切削手段６ａをＹ軸方向に相対的に加工送り（割り出し送り）する。また、第一のＹ軸送り手段７４ａにおいてはモータ８４がボールねじ８２のＹ軸方向一端部に接続されている一方、第二のＹ軸送り手段７４ｂにおいてはモータ８４がボールねじ８４のＹ軸方向他端部に接続されている点を除き、第二のＹ軸送り手段７４ｂは第一のＹ軸送り手段７４ａと同一の構成でよい。そして、第二のＹ軸送り手段７４ｂは、保持手段４に対して第二の切削手段６ｂをＹ軸方向に相対的に加工送り（割り出し送り）する。 The first Y-axis feeding means 74a includes a ball screw 82 that is connected to the Y-axis movable piece 60 and extends in the Y-axis direction, and a motor 84 that rotates the ball screw 82. Then, the first Y-axis feeding means 74a converts the rotational motion of the motor 84 into a linear motion by the ball screw 82 and transmits it to the Y-axis movable piece 60, and causes the first cutting means 6a to the holding means 4. Machining feed (index feed) is performed relative to the Y-axis direction. Further, in the first Y-axis feeding means 74a, the motor 84 is connected to one end of the ball screw 82 in the Y-axis direction, while in the second Y-axis feeding means 74b, the motor 84 is connected to the Y-axis of the ball screw 84. The second Y-axis feeding means 74b may have the same configuration as the first Y-axis feeding means 74a, except that it is connected to the other end in the direction. Then, the second Y-axis feed means 74b processes and feeds (indexes) the second cutting means 6b relative to the holding means 4 in the Y-axis direction.

第一のＺ軸送り手段７６ａは、Ｚ軸可動片６２に連結されＺ軸方向に延びるボールねじ（図示していない。）と、このボールねじを回転させるモータ８６とを有する。そして、第一のＺ軸送り手段７６ａは、ボールねじによりモータ８６の回転運動を直線運動に変換してＺ軸可動片６２に伝達し、保持手段４に対して第一の切削手段６ａをＺ軸方向に相対的に加工送り（切り込み送り）する。また、第一のＺ軸送り手段７６ａと同一の構成でよい第二のＺ軸送り手段７６ｂは、保持手段４に対して第二の切削手段６ｂをＺ軸方向に相対的に加工送り（切り込み送り）する。 The first Z-axis feeding means 76a has a ball screw (not shown) connected to the Z-axis movable piece 62 and extending in the Z-axis direction, and a motor 86 for rotating the ball screw. Then, the first Z-axis feeding means 76a converts the rotational motion of the motor 86 into a linear motion by the ball screw and transmits it to the Z-axis movable piece 62, and Z the first cutting means 6a with respect to the holding means 4. Machining feed (cut feed) is performed relative to the axial direction. Further, the second Z-axis feed means 76b, which may have the same configuration as the first Z-axis feed means 76a, feeds (cuts) the second cutting means 6b relative to the holding means 4 in the Z-axis direction. Send).

上述したとおりの切削装置２では、第一の切削手段６ａまたは第二の切削手段６ｂのいずれかにおいて、マウント３２と切削ブレード３０との間に異物等が介在していると、マウント３２と切削ブレード３０との間に隙間が生じ、この隙間から連通路５４内に空気が流入するため、連通路５４内の圧力が許容値（たとえば、絶対圧０．０３ＭＰａ程度）まで下がらず、マウント３２が切削ブレード３０を保持する吸引力が所要値に達することがない。したがって、圧力計５６が計測した値が許容値に達しない場合に制御手段７０は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始および切削水の供給開始を阻止する。 In the cutting device 2 as described above, if foreign matter or the like is interposed between the mount 32 and the cutting blade 30 in either the first cutting means 6a or the second cutting means 6b, the mount 32 and the cutting device 2 are cut. Since a gap is created between the blade and the blade 30 and air flows into the communication passage 54 from this gap, the pressure in the communication passage 54 does not drop to an allowable value (for example, an absolute pressure of about 0.03 MPa), and the mount 32 is mounted. The suction force that holds the cutting blade 30 does not reach the required value. Therefore, when the value measured by the pressure gauge 56 does not reach the permissible value, the control means 70 prevents the start of rotation of the rotating shafts 26 of both the first and second cutting means 6a and 6b and the start of supply of cutting water. To do.

一方、第一・第二の切削手段６ａ、６ｂの双方において、マウント３２と切削ブレード３０との間に異物等が介在していない場合、切削ブレード３０をマウント３２に吸引保持（装着）させた際に、マウント３２の支持部４６と切削ブレード３０とが密着することになる。そうすると、連通路５４内の圧力が許容値まで下がり、所要の吸引力で切削ブレード３０がマウント３２に保持される。したがって、圧力計５６が計測した値が許容値に達した場合に制御手段７０は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始を許容すると共に、双方の回転軸２６の回転開始時以降において切削水の供給開始を許容する。 On the other hand, in both the first and second cutting means 6a and 6b, when no foreign matter or the like is interposed between the mount 32 and the cutting blade 30, the cutting blade 30 is suction-held (mounted) on the mount 32. At that time, the support portion 46 of the mount 32 and the cutting blade 30 come into close contact with each other. Then, the pressure in the communication passage 54 drops to an allowable value, and the cutting blade 30 is held by the mount 32 with a required suction force. Therefore, when the value measured by the pressure gauge 56 reaches the permissible value, the control means 70 allows the rotation of both the rotation shafts 26 of the first and second cutting means 6a and 6b to start, and also rotates both of them. The start of supply of cutting water is allowed after the start of rotation of the shaft 26.

このように図示の実施形態の切削装置２においては、いずれか一方の圧力計５６が計測した値が許容値に達しない場合は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始および切削水の供給開始を阻止し、双方の圧力計５６が計測した値が許容値に達した場合は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始を許容すると共に、双方の回転軸２６の回転開始時以降において切削水の供給開始を許容する制御手段７０を備えるので、マウント３２と切削ブレード３０との間に異物が介在し充分な吸引力が得られない場合には切削加工が開始されないため、ウエーハおよび切削ブレード３０を損傷させることがない。 As described above, in the cutting device 2 of the illustrated embodiment, if the value measured by one of the pressure gauges 56 does not reach the permissible value, the rotating shafts of both the first and second cutting means 6a and 6b. When the start of rotation of 26 and the start of supply of cutting water are blocked and the values measured by both pressure gauges 56 reach the permissible values, the rotation shafts 26 of both the first and second cutting means 6a and 6b Since the control means 70 that allows the start of rotation and also allows the start of supply of cutting water after the start of rotation of both rotating shafts 26 is provided, foreign matter is interposed between the mount 32 and the cutting blade 30 and sufficient suction is provided. If no force is obtained, the cutting process is not started, so that the wafer and the cutting blade 30 are not damaged.

また、切削装置２においては、回転軸２６の回転開始時以降において切削水の供給開始を許容するので、マウント３２および切削ブレード３０に切削水および切削水が付着しても、マウント３２および切削ブレード３０の遠心力によって切削水および切削屑が吹き飛ばされ、マウント３２と切削ブレード３０との間の僅かな隙間から切削水と共に切削屑が吸引されることがない。 Further, in the cutting device 2, since the supply of cutting water is allowed to start after the start of rotation of the rotating shaft 26, even if the cutting water and the cutting water adhere to the mount 32 and the cutting blade 30, the mount 32 and the cutting blade The cutting water and cutting debris are blown off by the centrifugal force of 30, and the cutting debris is not sucked together with the cutting water from the slight gap between the mount 32 and the cutting blade 30.

また、切削装置２においては、第一・第二の切削手段６ａ、６ｂのいずれか一方のみによって、保持手段４に保持された被加工物を切削するときがある。このようなとき、制御手段７０は、双方の圧力計５６が計測した値が許容値に達した状態で双方のマウント３２に切削ブレード３０が装着されている場合に、第一・第二の切削手段６ａ、６ｂの一方のみによる被加工物の切削を許容すると共に、第一・第二の切削手段６ａ、６ｂの他方の回転軸２６を回転させる。 Further, in the cutting device 2, there are cases where the workpiece held by the holding means 4 is cut by only one of the first and second cutting means 6a and 6b. In such a case, the control means 70 performs the first and second cutting when the cutting blades 30 are mounted on both mounts 32 in a state where the values measured by both pressure gauges 56 reach the permissible values. It allows cutting of the workpiece by only one of the means 6a and 6b, and rotates the other rotating shaft 26 of the first and second cutting means 6a and 6b.

これによって、一方の切削手段６の切削によって発生する切削屑が他方の切削手段６のマウント３２に付着してマント３２が汚染されることがない。すなわち、圧力計５６が計測した値が許容値に達した状態で他方の切削手段６のマウント３２に切削ブレード３０が装着されていることによって、他方の切削手段６のマウント３２への切削屑の付着が防止される。 As a result, the cutting chips generated by the cutting of one cutting means 6 do not adhere to the mount 32 of the other cutting means 6 and the cloak 32 is not contaminated. That is, when the cutting blade 30 is attached to the mount 32 of the other cutting means 6 in a state where the value measured by the pressure gauge 56 reaches the allowable value, the cutting chips on the mount 32 of the other cutting means 6 are removed. Adhesion is prevented.

また、他方の切削手段６の切削ブレード３０がマウント３２に装着されていても、一方の切削手段６の切削によって発生する切削屑が切削ブレード３０とマウント３２との僅かな隙間から吸引されることがない。すなわち、他方の切削手段６の回転軸２６を回転させることで、回転による遠心力によってマウント３２と切削ブレード３０との僅かな隙間から切削屑が吸引されることが防止される。 Further, even if the cutting blade 30 of the other cutting means 6 is mounted on the mount 32, the cutting chips generated by the cutting of the other cutting means 6 are sucked from the slight gap between the cutting blade 30 and the mount 32. There is no. That is, by rotating the rotating shaft 26 of the other cutting means 6, it is possible to prevent the cutting chips from being sucked from the slight gap between the mount 32 and the cutting blade 30 due to the centrifugal force generated by the rotation.

なお、図示の実施形態の切削装置２において切削手段６を２個備える例を説明したが、切削手段６は１個であってもよい。 Although the example in which the cutting device 2 of the illustrated embodiment is provided with two cutting means 6 has been described, the number of cutting means 6 may be one.

２：切削装置
４：保持手段
６：切削手段
６ａ：第一の切削手段
６ｂ：第二の切削手段
８：切削水供給手段
１０：送り手段
２６：回転軸
２８：ハウジング
３０：切削ブレード
３２：マウント
４２：切り刃
４４：ボス部
４６：支持部
５０：吸引孔
５２：吸引源
５４：連通路
５６：圧力計
７０：制御手段 2: Cutting device 4: Holding means 6: Cutting means 6a: First cutting means 6b: Second cutting means 8: Cutting water supply means 10: Feeding means 26: Rotating shaft 28: Housing 30: Cutting blade 32: Mount 42: Cutting blade 44: Boss 46: Support 50: Suction hole 52: Suction source 54: Communication passage 56: Pressure gauge 70: Control means

Claims (2)

被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該切削ブレードと被加工物に切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含む切削装置であって、
該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され該切削ブレードを保持するマウントと、から少なくとも構成され、
該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、
該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始および切削水の供給開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容すると共に該回転軸の回転開始時以降において切削水の供給開始を許容する制御手段を備える切削装置。 The holding means for holding the work piece, the cutting means for rotatably supporting the cutting blade provided with the cutting edge for cutting the work piece held by the holding means, and the cutting blade and the work piece A cutting apparatus including a cutting water supply means for supplying cutting water, and a feeding means for relatively processing and feeding the holding means and the cutting means.
The cutting means is composed of at least a rotating shaft, a housing that rotatably supports the rotating shaft, and a mount formed at the tip of the rotating shaft to hold the cutting blade.
The mount includes a boss portion inserted into an opening formed in the center of the cutting blade, a ring-shaped support portion formed on the outer periphery of the boss portion to expose and support the cutting edge of the cutting blade, and the mount. It includes a suction hole that opens between the boss portion and the support portion to suck and hold the cutting blade, and a communication passage that communicates the suction hole with the suction source.
A pressure gauge is provided in the communication passage, and if the value measured by the pressure gauge does not reach the permissible value, the rotation start of the rotating shaft and the supply start of cutting water are blocked, and the value measured by the pressure gauge is prevented. A cutting device provided with a control means that allows the start of rotation of the rotating shaft when the permissible value is reached and also allows the start of supply of cutting water after the start of rotation of the rotating shaft. 該切削手段は、該切削ブレードが対向するように２個配設され、
該制御手段は、該圧力計が計測した値が許容値に達した状態で双方の該切削手段の該マウントに該切削ブレードが装着されている場合に、一方の該切削手段のみによる該保持手段に保持された被加工物の切削を許容すると共に、他方の該切削手段の該回転軸を回転させる請求項１記載の切削装置。 Two cutting means are arranged so that the cutting blades face each other.
The control means is a holding means by only one of the cutting means when the cutting blade is attached to the mount of both cutting means in a state where the value measured by the pressure gauge reaches an allowable value. The cutting apparatus according to claim 1, wherein the cutting apparatus is allowed to cut the workpiece held in the machine and rotates the rotation axis of the other cutting means.
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JP2015023139A (en) * 2013-07-18 2015-02-02 株式会社ディスコ Cutting device
JP2015023222A (en) * 2013-07-22 2015-02-02 株式会社ディスコ Cutting apparatus
JP2016111173A (en) * 2014-12-05 2016-06-20 株式会社ディスコ Cutting device
JP2018010952A (en) * 2016-07-13 2018-01-18 株式会社ディスコ Cutting apparatus
JP2019104068A (en) * 2017-12-08 2019-06-27 株式会社ディスコ Cutting device

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US5934973A (en) * 1995-10-20 1999-08-10 Boucher; John N. Semiconductor wafer dicing saw
JP2015023139A (en) * 2013-07-18 2015-02-02 株式会社ディスコ Cutting device
JP2015023222A (en) * 2013-07-22 2015-02-02 株式会社ディスコ Cutting apparatus
JP2016111173A (en) * 2014-12-05 2016-06-20 株式会社ディスコ Cutting device
JP2018010952A (en) * 2016-07-13 2018-01-18 株式会社ディスコ Cutting apparatus
JP2019104068A (en) * 2017-12-08 2019-06-27 株式会社ディスコ Cutting device

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