JP2021081277A - X-ray diffraction measurement device - Google Patents

Abstract

To provide an X-ray diffraction measurement device with which it is possible to coaxially emit an X-ray and visible light at the same time and detect what happened when a defect on measurement object surface is irradiated with the X-ray.SOLUTION: An X-ray diffraction measurement device 1 comprises: a light source 44 for emitting a visible laser beam; and a standing mirror 24 arranged on the optical axis of the X-ray emitted from an X-ray tube 10, for reflecting the laser beam emitted by the light source 44 and causing it to be emitted coaxially with the X-ray from the tip of a cylindrical pipe 14. The standing mirror 24 is constructed so that a passage hole 24a is formed that allows the X-ray emitted from the X-ray tube 10 to pass through and the visible laser beam is reflected on a reflection plane in the periphery of edges of the passage hole 24a. The reflected light from a measurement object OB is guided to an opposite direction in the same optical path as the laser beam and branched by a beam splitter 25 before being received by a photodetector.SELECTED DRAWING: Figure 1

Description

The present invention relates to an X-ray diffraction measuring device that irradiates an object to be measured with X-rays and detects the X-ray intensity at a plurality of positions of an X-ray diffraction image formed by the diffracted X-rays generated at the X-ray irradiation point. ..

Conventionally, there is a method using X-ray diffraction as a method for nondestructively measuring characteristic values such as residual stress and surface hardness of a metallic object. For example, the X-ray diffraction measuring device of Patent Document 1 irradiates an object to be measured with X-rays at a predetermined incident angle, images a diffraction ring with the X-rays diffracted by the object to be measured, and obtains an image of the imaged diffraction ring. The shape is detected and analyzed by the cosα method to measure the residual stress of the object to be measured. Further, in the X-ray diffraction measuring device of Patent Document 2, a plurality of scintillation counters are arranged on a plane perpendicular to the optical axis of the emitted X-rays at different distances from the optical axis of the emitted X-rays, and the emitted X-rays are arranged. The object to be measured is irradiated vertically, and the intensity of the diffracted X-rays detected by each scintillation counter with respect to the distance of the emitted X-rays from the optical axis is regarded as a change in the diffracted X-ray intensity in one radial direction. The characteristic value based on the hardness of the surface of the object is calculated. In such an X-ray diffraction measuring device, like the X-ray diffraction measuring device of Patent Document 1, the position of the place where the X-ray is irradiated (that is, the measuring place) can be visually confirmed with the X-ray. There are devices equipped with the function of irradiating visible light having the same optical axis. By using this function, X-ray diffraction measurement can be performed by setting the measurement point to a desired point.

Japanese Patent No. 5835191 Japanese Patent No. 6020848

However, when X-ray diffraction measurement is performed while moving the X-ray diffraction measurement device with respect to the object to be measured as in the X-ray diffraction measurement device of Patent Document 2, the X-ray irradiation point (measurement point) is always located. There is a desire to confirm that the location is the desired location, but the conventional device has a problem that it can irradiate X-rays and visible light separately, but cannot irradiate them at the same time. In addition, when performing X-ray diffraction measurement while moving the X-ray diffraction measuring device with respect to the object to be measured, if there is a defect such as unevenness or scratches on the surface of the object to be measured, when the measured characteristic value changes. There is also a problem that it is difficult to determine whether or not the characteristic value itself has changed. That is, when X-rays are applied to a portion having a defect such as unevenness or scratches, the measured characteristic value may be affected. Therefore, when the measured characteristic value changes, the cause is the unevenness or scratches on the surface. It is a problem that it is difficult to determine whether it is due to a defect such as the above or the characteristic value itself.

The present invention has been made to solve this problem, and an object of the present invention is to irradiate an object to be measured with X-rays and to obtain a plurality of X-ray diffraction images formed by diffracted X-rays generated at an X-ray irradiation point. In an X-ray diffraction measuring device that detects the X-ray intensity at a position, X-rays and visible light can be simultaneously irradiated coaxially, and the emitted X-rays irradiate defects such as irregularities and scratches on the surface of the object to be measured. It is an object of the present invention to provide an X-ray diffraction measuring device capable of detecting the X-ray diffraction measuring device.

In order to achieve the above object, a feature of the present invention is that an X-ray tube that emits X-rays and an X-ray emitted from the X-ray tube are passed through a through hole to allow substantially parallel light having a predetermined cross-sectional diameter. An X-ray emitting mechanism that emits X-rays toward the object to be measured, and an X formed by the diffracted X-rays generated by the object to be measured when X-rays are emitted from the X-ray emitting mechanism toward the object to be measured. Diffractive X-ray intensity detecting means for detecting X-ray intensity at a plurality of positions of a line diffraction image, and visible light emission for emitting visible parallel light on the same optical axis as the X-ray emission mechanism. In the X-ray diffraction measuring device provided with the means, the visible light emitting means reflects the light source that emits visible light and the visible light that is arranged on the optical axis of the X-ray emitted from the X-ray tube and emitted by the light source. It is provided with a reflecting member for incident on the through hole of the X-ray emitting mechanism, and the reflecting member is formed with a passing hole through which X-rays emitted from the X-ray tube are passed, and the visible light emitted by the light source is passed through the passing hole. It is because it is made to reflect on the reflecting surface around the edge.

According to this, X-rays and visible light can be irradiated coaxially at the same time. As a result, the X-ray irradiation point (measurement point) can always be confirmed as the visible light irradiation point. Further, the reflective member is arranged on the optical axis of the X-ray emitted from the X-ray tube, but since the X-ray emitted from the X-ray tube passes through the passage hole formed in the reflective member, It is possible to prevent the X-ray intensity from being reduced by the reflective member.

Further, another feature of the present invention includes a reflected light intensity detecting means for detecting the intensity of the reflected light generated by the visible light emitted from the visible light emitting means reflected by the object to be measured, and the reflected light intensity detection. The means is a light path changing member that is arranged between the light source and the reflecting member and reflects a part of the reflected light, and the reflected light reflected by the light path changing member is incident and has an intensity corresponding to the intensity of the incident light. It is equipped with a receiver that outputs a signal.

According to this, when the visible light emitted from the X-ray diffraction measuring device is irradiated to defects such as irregularities and scratches on the object to be measured, the intensity of the reflected light of the visible light changes. It is possible to detect that the coaxial emitted X-rays are applied to defects such as irregularities and scratches on the object to be measured.

Another feature of the present invention is that the visible light emitting means includes an optical element for linearly polarized light that converts visible light into linearly polarized light, and the reflected light intensity detecting means is from a measurement object reflected by an optical path changing member. It is provided with a reflected light dividing means for dividing the reflected light into two polarized lights having different polarization directions by 90 °, and the receiver is made to be two receivers for incident light divided by the reflected light dividing means. ..

According to this, the reflected light intensity of visible light can be detected by the total of the light intensities detected by the two receivers, and the polarization characteristic of visible light is detected by the light intensity detected by the two receivers, respectively. Can be detected. This makes it possible to increase the types of defects on the surface of the object to be measured that can be detected. Specifically, if the minute unevenness (roughness) on the surface of the object to be measured changes from the normal state, the polarization characteristics of the reflected light will change, and scratches, protrusions, dents, rust, foreign matter, etc. will appear on the surface of the object to be measured. If there is, the intensity of reflected light changes.

Further, another feature of the present invention is a determination means for comparing the intensity of the signal output by the receiver with a preset allowable value and determining the presence or absence of an abnormality based on the comparison result, and a diffracted X-ray intensity detecting means. The characteristic value calculation means for calculating the characteristic value of the object to be measured using a plurality of detected X-ray intensities, and the characteristic value calculated by the characteristic value calculation means when the determination means determines an abnormality are the surfaces of the object to be measured. It is equipped with an identification means that enables identification of being affected by the condition.

According to this, only by confirming the final result obtained by the measurement of the X-ray diffraction measuring device, the fluctuation of the characteristic value of the object to be measured is due to defects such as surface irregularities and scratches, or the characteristic value itself. It is possible to determine whether it is a thing.

Another feature of the present invention is a distance detecting means using a time-of-flight measurement principle that detects the distance from the light emitting point to the reflecting point by detecting the time until the emitted light is reflected and returned. The optical axis of the light source of the distance detecting means is aligned with the optical axis of the light source of the visible light emitting means.

According to this, the distance to the X-ray irradiation point of the object to be measured can be detected, and when the object to be measured has a step, when the X-ray is irradiated beyond the step, the X-ray is irradiated. It can be detected. Further, by adjusting the position of the X-ray diffraction measuring device with respect to the object to be measured so that the value detected by the distance detecting means becomes the set value, the distance from the X-ray irradiation point to the surface on which the X-ray diffraction image is formed. Can be the set value.

It is an overall block diagram which shows the X-ray diffraction measurement system including the X-ray diffraction measurement apparatus which concerns on one Embodiment of this invention. It is a figure which removed the bottom wall of the housing of the X-ray diffraction measuring apparatus of FIG. 1, and looked at the X-ray diffraction measuring apparatus from the optical axis direction of the emitted X-ray. In the X-ray diffraction measuring apparatus of FIG. 1, it is a figure which shows the optical path of the laser beam after a rising mirror enlarged in the vertical direction of the optical axis of the emitted X-ray. It is a figure which visually showed the relationship of the diffraction X-ray intensity detected by four scintillation counters when the distance from the X-ray irradiation point to the diffraction X-ray detection plane is a set value, and (A) is the object to be measured. Is a case where the surface hardness is small, and (B) is a case where the surface hardness is large. In the X-ray diffraction measuring apparatus of FIG. 1, the main components of the laser light emitting / receiving mechanism are viewed from the X-ray tube side in the X-ray emitting direction. It is a flow chart of the program executed by the controller of the X-ray diffraction measurement system of FIG. It is a figure which looked at the main component of the laser light emission / light receiving mechanism in the 1st modification of this invention in the X-ray emission direction from the X-ray tube side. It is a figure which looked at the main component of the laser light emission / light receiving mechanism in the 2nd modification of this invention in the X-ray emission direction from the X-ray tube side. It is an enlarged view of the X-ray diffraction measurement apparatus when this invention is applied to another X-ray diffraction measurement apparatus.

The configuration of the X-ray diffraction measurement system including the X-ray diffraction measurement device according to the embodiment of the present invention will be described with reference to FIGS. 1 to 5. As shown in FIG. 1, this X-ray diffraction measurement system moves at a constant speed like an X-ray diffraction measurement device 1, an arm type moving device, a high voltage power supply 75, a computer device 70, an end detection sensor 60, and a belt conveyor. It is composed of a moving mechanism having a long stage St. The stage St is a plane, the moving direction is parallel to this plane, and the object to be measured OB is placed at regular intervals. Therefore, when the stage St moves, the placed measurement object OB moves and comes directly under the X-ray diffraction measuring device 1 one after another. Then, the X-ray diffraction measurement system continuously irradiates the measurement object OB directly under the X-ray diffraction measurement device 1 with X-rays from the front end to the rear end, and is based on the intensity distribution of the diffracted X-rays. The characteristic value is measured, and an inspection is performed to detect an abnormal part for each measurement target OB. In this embodiment, the object to be measured OB is an iron flat plate. Further, as shown in FIG. 1, the moving direction of the stage St is the Y direction, the vertical direction of the plane of the stage St is the Z direction, and the direction perpendicular to the Y direction and the Z direction is the X direction.

As shown in FIG. 1, the X-ray diffraction measuring device 1 enters the X-ray tube 10 that emits X-rays into the housing 50 and the X-rays emitted by the X-ray tube 10 and emits the X-rays through the cylindrical pipe. X-ray emission mechanism, laser light emission / reception mechanism that emits visible laser light on the same optical axis as the emitted X-ray and receives reflected light at the measurement target OB, and is generated at the X-ray irradiation point of the measurement target OB. It houses a plurality of scintillation counters 21 for detecting the intensity of diffracted X-rays, and a rectangular plate 20 to which an X-ray emission mechanism and a scintillation counter 21 are attached. Further, various circuits for controlling the operation and inputting a detection signal by being connected to the X-ray tube 10 and the scintillation counter 21 are also built in the housing 50, and the housing 50 is shown in FIG. The various circuits surrounded by the alternate long and short dash line outside are housed in the alternate long and short dash line inside the housing 50. In FIG. 1, the circuit board, the electric wire, the fixture, the air cooling fan, and the like are omitted. Further, a laser emitter 40 that emits visible laser light having a minute cross section as parallel light is attached to a part of the outer wall of the housing 50.

As shown in FIGS. 1 and 2, the housing 50 is formed in a substantially rectangular parallelepiped shape, and has a bottom wall 50a, a front wall 50b, a rear wall 50c, a top wall 50d, a slope wall 50e, and a side wall 50f. The bottom wall 50a is formed with a rectangular hole 50a1 for allowing the fixed block 22 and the cylindrical pipe 14, which are X-ray emitting mechanisms, to be taken out of the housing 50 by a predetermined length from the tip. The optical axis of the X-ray emitted from the X-ray diffraction measuring device 1 is substantially perpendicular to the bottom wall 50a and the top wall 50d, and is substantially parallel to the front wall 50b, the rear wall 50c, and the side wall 50f. Further, one of the side walls 50f is connected to a turntable 55 that makes the rotating portion 53 rotatable, and the tip arm 54 of the arm-type moving device is connected to the rotating portion 53. The rotating portion 53 can be manually fixed to the turntable 55 at an arbitrary rotation angle, and in the arm type moving device, a plurality of arms are connected by joints and the position and posture of the tip can be arbitrarily set. It can be fixed in a state. As a result, the housing 50 (X-ray diffraction measuring device 1) can change the position and posture with respect to the stage St and the measurement object OB.

The X-ray tube 10 is formed in a long shape, and is fixed to the housing 50 so that the central axis is parallel to the bottom wall 50a, the top wall 50d, and the side wall 50f at the upper part of the housing 50, and has a high voltage. A high voltage is supplied from the power source 75, and X-rays are emitted from the exit port 11 under the control of the X-ray control circuit 30. The X-ray control circuit 30 is controlled by a controller 71 that constitutes a computer device 70 described later, and the X-ray tube 10 emits X-rays of a constant intensity from the X-ray tube 10 when a command is input from the controller 71. The drive current and drive voltage supplied from the high voltage power supply 75 are controlled. Further, the X-ray tube 10 includes a cooling device (not shown), and the X-ray control circuit 30 also controls a drive signal supplied to the cooling device. As a result, the temperature of the X-ray tube 10 is kept constant.

As shown in FIG. 1, there is a rising mirror 24 directly below the exit port 11 of the X-ray tube 10, and a columnar through hole 24a is formed in the rising mirror 24. The riser mirror 24 is fixed to the rectangular parallelepiped plate 20 so that the central axis of the through hole 24a substantially coincides with the optical axis of the X-rays emitted from the exit port 11, and is emitted from the exit port 11. Most of the X-rays pass through the through hole 24a and are emitted. FIG. 3 is a cross-sectional view showing from the portion of the through hole 24a where the X-ray is emitted to the object to be measured OB by enlarging only the direction perpendicular to the optical axis of the emitted X-ray. As shown in FIG. 3, X-rays that have passed through the through hole 24a enter the columnar through hole 22a formed in the fixed block 22, pass through the through hole 22a, and the bottom of the through hole 22a becomes an end. It is incident on the hole 14a of the cylindrical pipe 14 fixed to the fixing block 22. The X-rays incident on the hole 14a of the cylindrical pipe 14 pass through the hole 14a and are emitted from the through hole 15a of the passage member 15 fixed to the tip of the hole 14a toward the object to be measured OB. The optical axis of the X-ray emitted from the exit port 11, the central axis of the through holes 24a and 22a, the central axis of the cylindrical pipe 14 (hole 14a) and the central axis of the through hole 15a are all the same, and the exit port 11 The X-rays emitted from are diffused X-rays, but by passing through these through holes and the holes 14a of the cylindrical pipe 14, the X-rays emitted from the through holes 15a become substantially parallel X-rays. Note that FIG. 3 also shows the optical path of the laser beam emitted from the laser light source 44 described later, which will be described later.

As shown in FIG. 1, the fixing block 22 is fixed to the center of the rectangular parallelepiped plate 20 so that the central axis is substantially perpendicular to the upper surface and the lower surface of the rectangular parallelepiped plate 20. The central axis of the fixed block 22 is the same as the central axis of the through hole 22a and the cylindrical pipe 14, and the upper and lower surfaces of the rectangular parallelepiped plate 20 are attached in parallel to the upper surface wall 50d and the bottom surface wall 50a of the housing 50. Therefore, the X-ray emitted from the tip (through hole 15a) of the cylindrical pipe 14 is emitted in a state where the optical axis thereof is perpendicular to the upper surface wall 50d and the bottom surface wall 50a.

As shown in FIG. 1, the rectangular parallelepiped plate 20 has a portion where the central axis of the fixed block 22 (the central axis of the cylindrical pipe 14) intersects the lower surface of the rectangular parallelepiped plate 20 (abbreviated as the center of the lower surface of the rectangular parallelepiped plate 20). Four scintillation counters 21-1 to 21-4 are attached in the vicinity of the circumference having a predetermined diameter centered on the same) so that the central axis is perpendicular to the upper surface and the lower surface of the rectangular parallelepiped plate 20. The X-ray incident surfaces of the four scintillation counters 21-1 to 21-4 are included in one plane parallel to the upper surface and the lower surface of the rectangular parallelepiped plate 20, and thereafter, this plane is included in the X-ray detection plane. That is. The circle shown by the two-point chain line in FIG. 2 is an X-ray when the distance from the X-ray irradiation point of the object to be measured OB to the X-ray detection plane (hereinafter referred to as the distance between the irradiation point and the detection plane) is a set value. This is the position where the X-ray intensity in the radial direction of the diffraction ring formed on the detection plane peaks. For the sake of clarity, the peak position is drawn so as to be on the entire circumference of the diffraction ring, but in reality, since the bottom wall 50a has a rectangular hole 50a1, the diffraction ring is located near the side wall 50f. It is not formed, and there is no portion where the peak is formed near the side wall 50f. Further, in FIG. 1, for the sake of clarity, the four scintillation counters 21-1 to 21-4 are drawn so as not to overlap when viewed from the X direction, but the positions of the scintillation counters 21-1 to 21-4 are shown in FIG. The one shown in 2 is formal.

The scintillation counters 21-1 to 21-4 amplify the intensity of fluorescence generated by incident X-rays with a photomultiplier tube and output a signal having an intensity corresponding to the intensity of the fluorescence, and are generally used. The X-ray incident surface has a certain size. As can be seen from FIG. 2, the X-ray incident surfaces of the four scintillation counters 21-1 to 21-4 are different in distance from the central axis of the fixed block 22 (the central axis of the cylindrical pipe 14). The X-ray incident surface of the scintillation counters 21-1, 21-3 deviates from the circle of the two-point chain line at which the X-ray intensity in the radial direction of the diffraction ring peaks, but the intensity of the diffracted X-ray is equal to or higher than a predetermined value. Detect by the intensity of. This is because the X-rays irradiated to the object to be measured OB have a predetermined cross-sectional diameter, and the X-ray irradiation point has a predetermined diameter, so that the intensity of the diffracted X-rays is predetermined in the radial direction of the diffraction ring. This is because the above range is wide. That is, there is a wide range in which the intensity of the diffracted X-rays is equal to or higher than a predetermined value on both sides of the two-dot chain line circle shown in FIG. Detect with an intensity equal to or higher than a predetermined value.

As described above, the housing 50 of the X-ray diffraction measuring device 1 can be fixed at an arbitrary position and posture. Therefore, by adjusting the position and posture described later, the distance between the irradiation point and the detection plane can be adjusted. Can be set to a set value so that the optical axis of the emitted X-rays is perpendicular to the surface of the object to be measured OB. When the optical axis of the emitted X-rays is perpendicular to the surface of the object to be measured OB, the intensity distribution of the diffracted X-rays in the radial direction of the diffracted ring becomes substantially constant regardless of the circumferential position (rotation angle) of the diffracted ring. Therefore, the distance (radius value) of the emitted X-rays of the scintillation counters 21-1 to 21-4 from the optical axis (the central axis of the fixed block 22 and the cylindrical pipe 14) and the scintillation counters 21-1 to 21-4 are The relationship with the detected intensity of the diffracted X-ray can be regarded as substantially the same as the relationship in the radial direction at one circumferential position of the diffract ring. That is, the relationship between the radius value and the intensity of the diffracted X-ray is substantially the same as the case where the scintillation counters 21-1 to 21-4 are arranged so as to be stacked in the radial direction at one circumferential position of the diffraction ring. is there.

In FIG. 4, the horizontal axis is the distance (radius value) of the emitted X-ray from the optical axis, the vertical axis is the diffracted X-ray intensity, and the diffracted X-ray intensity detected by the scintillation counters 21-1 to 21-4 is shown. It is a plotted graph. On the graph, the X-ray incident surfaces of the scintillation counters 21-1 to 21-4 are shown corresponding to the radial values, and the intensity distribution of the diffracted X-rays in the radial direction of the diffractive ring is shown by dotted lines. (A) is a case where the surface hardness of the portion irradiated with the emitted X-ray is small, and (B) is a case where the surface hardness of the portion irradiated with the emitted X-ray is large. As shown by the dotted line in the graph, the intensity distribution of the diffracted X-rays is widened at the place where the surface hardness is large. The greater the surface hardness, the greater the spread of this intensity distribution. The diffracted X-ray intensity detected by the scintillation counters 21-1 to 21-4 can be regarded as the average value of the intensity distribution curve of the diffracted X-ray having the X-ray incident surface as shown by the points plotted in the graph. In order to obtain the spread of the intensity distribution of the diffracted X-ray from the characteristic value, the values such as the half-value width and the integral width of the intensity distribution curve may be calculated, but only the values of the four scintillation counters 21-1 to 21-4 are used. That is, it is not possible to calculate the half-value width or the integral width with four points plotted on the graph. Therefore, if the diffracted X-ray intensity detected by the scintillation counters 21-1 to 21-4 is A, D, B, C in descending order of the radius value of the location where the X-ray incident surface is arranged, {(DA). ) + (BC)} is used as a characteristic value representing the spread of the intensity distribution of the diffracted X-rays.

As can be seen by comparing the four plots in (A) and (B) of FIG. 4, the values of (DA) and (BC) become smaller as the intensity distribution of the diffracted X-rays becomes wider. Then, these values become smaller as the intensity distribution of the diffracted X-rays becomes wider. Therefore, the characteristic value calculated by {(DA) + (BC)} is a characteristic value representing the spread of the intensity distribution of the diffracted X-rays, so that the intensity of the emitted X-rays is constant. Once the permissible value is determined, the abnormal portion can be detected by comparing the characteristic value with the permissible value. Further, the degree of abnormality can be determined from the magnitude of the characteristic value. It should be noted that whether the one having a small surface hardness of the object to be measured OB is abnormal or the one having a large surface hardness is abnormal depends on the object to be measured OB. That is, it depends on the measurement object OB whether the characteristic value calculated by {(DA) + (BC)} is abnormal when it is larger than the permissible value or abnormal when it is smaller than the permissible value. ..

The scintillation counters 21-1 to 21-4 convert the fluorescence generated by the scintillator by the incident X-rays into electrons by a photomultiplier tube, amplify it, and output the electric signal by the amplified electrons. Since the intensity of the electric signal corresponds to the intensity of the incident X-ray, the X-ray intensity can be detected as the intensity of the electric signal. As shown in FIG. 1, the scintillation counters 21-1 to 21-4 have signal lines connected to the SD signal extraction circuits 31 to 34, and the electricity corresponding to the X-ray intensity output by the scintillation counters 21-1 to 21-4. The signal is input to the SD signal extraction circuits 31 to 34. The SD signal extraction circuits 31 to 34 are circuits that convert the input electric signal into a flat signal by an integrating circuit or the like, then convert it into digital data by an AD converter and output it, and input a command to start operation from the controller 71. Then, the AD converter operates, and digital data of the strength of the electric signal corresponding to the X-ray strength is input to the controller 71. Then, {(DA) + (BC)} is calculated in the controller 71, and the presence / absence of abnormality and the degree of abnormality are determined from the calculated values.

In order to be able to calculate and determine the above-mentioned characteristic value using the value corresponding to the diffracted X-ray intensity detected by the scintillation counters 21-1 to 21-4, it is generated regardless of the X-ray irradiation point. The intensity of the diffracted X-rays is substantially constant, and the intensity distribution of the diffracted X-rays in the radial direction of the diffracted ring formed on the X-ray detection plane is substantially constant regardless of the circumferential position (rotation angle) of the diffracted ring. There must be. However, if there are defects such as scratches, protrusions, dents, rust, and foreign matter adhesion on the surface of the object to be measured OB, this premise may not hold. The X-ray diffraction measuring device 1 has a laser beam emitting / receiving mechanism, which simultaneously irradiates the laser beam with the same optical axis as the emitted X-ray to receive the reflected light from the surface of the object to be measured OB for measurement. This is for detecting defects on the surface of the object OB. That is, when a defect is detected on the surface of the object to be measured OB, the calculated characteristic value is for indicating that the characteristic value is not the original characteristic value of the object to be measured OB. In order to perform measurement by this system, the X-ray irradiation point is at a predetermined position, the distance between the irradiation point and the detection plane is a set value, and the optical axis of the emitted X-ray with respect to the measurement object OB is vertical. However, the laser light emitting / receiving mechanism is also used when adjusting the position and orientation of the X-ray diffraction measuring device 1 (housing 50) so as to satisfy these.

FIG. 5 is a view of the main components of the laser light emitting / receiving mechanism viewed from the X-ray tube 10 side in the X-ray emitting direction (opposite direction to the Z direction). As shown in FIG. 5, the laser light emitting / receiving mechanism includes a laser light source 44, a collimating lens 26, a beam splitter 25, a rising mirror 24 having a through hole 24a formed therein, and a photodetector 27. In FIG. 1, the phytodetector 27 is not shown hidden behind the beam splitter 25, and the signal line in the reflected light intensity detection circuit 36 exits from the phytodetector 27 on the back side of the beam splitter 25. It is a line that is splitting. The laser drive circuit 35 shown in FIG. 1 outputs a drive signal to the laser light source 44 when an operation command is input from the controller 71, and the laser light source 44 emits a laser beam when the drive signal is input. The emitted laser light passes through the collimating lens 26 and becomes a slightly focused laser light. Slightly focusing means focusing so as to focus near the tip of the cylindrical pipe 14 as shown in FIG. 3, and FIG. 3 is an enlarged view of only the direction perpendicular to the optical axis of the emitted X-rays. Therefore, it is actually almost parallel light.

The laser beam that has become substantially parallel light is transmitted by the beam splitter 25 and then reflected by the rising mirror 24 toward the through hole 22a of the fixed block 22, but the rising mirror 24 has a through hole. Since the 24a is formed, only the laser beam incident on the surface surrounding the through hole 24a is reflected. The diameter of the through hole 24a is slightly larger than the diameter of the hole 14a of the cylindrical pipe 14, but as described above, the laser light passing through the collimating lens 26 is a slightly focused laser light, so that the through hole 24a The laser beam reflected by the surface surrounding the lens is incident on the cylindrical pipe 14. Then, after condensing light near the tip of the cylindrical pipe 14, it diffuses and irradiates the object to be measured OB. As shown by the optical path of the laser beam drawn by the dotted line in FIG. 3, the laser beam irradiated to the measurement object OB forms a ring-shaped irradiation pattern, but FIG. 3 shows only the direction perpendicular to the optical axis of the emitted X-ray. Since it is an enlarged view, it is a point visually. Further, the irradiation point of the laser beam is a ring-shaped irradiation pattern surrounding the irradiation point of the emitted X-ray, but there is a possibility that a defect existing on the surface of the object to be measured OB exists only in the irradiation point portion of the emitted X-ray. Since the property is extremely low and the stage St is moving, when the emitted X-ray is irradiated to the defective portion on the surface of the object to be measured, it can be said that the laser beam is also irradiated to the same defective portion.

When the surface of the object to be measured OB is irradiated with laser light, reflected light and scattered light are generated at the irradiation point. As can be seen from FIG. 3, the laser light is the optical axis of the laser light (the optical axis of the emitted X-ray). ), The reflected light does not enter the hole 14a of the cylindrical pipe 14 because it is incident on the object to be measured OB so as to have a small angle with respect to). However, since scattered light is generated in various directions, the scattered light generated in the direction opposite to the incident direction of the laser light is incident on the hole 14a of the cylindrical pipe 14 and is in the same light path as the laser light path. Go in the opposite direction. Hereinafter, scattered light generated in the object to be measured OB and traveling in the same optical path as the optical path of the laser beam in the opposite direction is referred to as reflected light. The reflected light traveling in the opposite direction is reflected by the rising mirror 24, and about half of the reflected light is reflected by the beam splitter 25 and is incident on the photodetector 27. The photodetector 27 outputs a signal having an intensity corresponding to the intensity of the received light, and as shown in FIG. 1, the signal output by the photodetector 27 is input to the reflected light intensity detection circuit 36.

When the operation start command is input from the controller 71, the reflected light intensity detection circuit 36 amplifies the signal input from the photodetector 27, converts it into digital data by the AD converter, and outputs the data to the controller 71 at the set time interval. To do. The controller 71 captures the digital data output by the reflected light intensity detection circuit 36 at the same timing as the timing of capturing the digital data output by the SD signal extraction circuits 31 to 34. As a result, the reflected light intensity data of the location of the measurement target OB corresponding to the characteristic value calculated by {(DA) + (BC)} is acquired. Since the reflected light intensity fluctuates when there are defects such as scratches, protrusions, dents, rusts, and foreign matter adhesion on the surface of the object to be measured OB, the controller 71 has acquired a reflected light intensity smaller than the preset allowable value. At the time, it is possible to add information that can identify that the measured characteristic value is affected by the surface condition of the object to be measured OB.

As described above, the laser light emitting / receiving mechanism sets the X-ray irradiation point at a predetermined position, sets the distance between the irradiation point and the detection plane as a set value, and makes the optical axis of the emitted X-ray perpendicular to the measurement object OB. , It is also used when adjusting the position and orientation of the X-ray diffraction measuring device 1 (housing 50). At this time, the laser emitter 40 fixed to the slope wall 50e of the housing 50 is also used. As shown in FIG. 1, the laser emitter 40 has a laser light source 43 fixed to a cylindrical frame 41 and a collimating lens 42 fixed near the tip of the cylindrical frame 41, and is a laser. The laser beam emitted from the light source 43 is emitted as parallel light by the collimating lens 42. The laser light source 43 emits laser light when a drive signal is input from the laser drive circuit 37, and when the laser drive circuit 37 inputs a position and attitude adjustment command from the input device 72, the controller 71 issues a command to start operation. Upon input, the laser light source 43 outputs a drive signal for emitting laser light. The laser emitter 40 is fixed in the fixed block 51, and the fixed block 51 is fixed to the slope wall 50e of the housing 50, so that the laser emitter 40 is integrated with the housing 50. This fixed position is a position where the optical axis of the laser beam of the laser emitter 40 intersects the optical axis of the emitted X-ray, and the distance from the intersecting point to the X-ray detection plane becomes a set value.

When a position / attitude adjustment command is input from the input device 72, the controller 71 outputs an operation command to the laser drive circuits 35 and 37 and the reflected light intensity detection circuit 36, whereby the laser light is emitted from the surface of the measurement object OB. Two laser light irradiation points are formed by the laser light of the emitting / receiving mechanism and the laser light of the laser emitting device 40. Then, digital data corresponding to the reflected light intensity is input to the controller 71 from the reflected light intensity detection circuit 36. The controller 71 displays the reflected light intensity, which is an appropriate numerical value of the input digital data, on the display device 73. As described above, since the distance from the point where the optical axes of the two laser beams intersect to the X-ray detection plane is a set value, the X-ray diffraction measuring device 1 (housing) so that the two laser beam irradiation points match. If the position of the body 50) is adjusted, the distance between the irradiation point and the detection plane becomes a set value. Further, the intensity of the light received by the photodetector 27 is maximized when the optical axis of the laser light of the laser light emitting / receiving mechanism (the optical axis of the emitted X-ray) with respect to the object to be measured OB is vertical. If the position of the X-ray diffraction measuring device 1 (housing 50) is adjusted so that the displayed reflected light intensity is equal to or higher than an appropriately determined set value, the optical axis of the emitted X-rays with respect to the object to be measured OB becomes vertical. Become.

In the vicinity of the side surface of the stage St, an end detection sensor 60 for detecting that the front end and the rear end of the measurement object OB are at the positions where the emitted X-rays are irradiated is attached. The edge detection sensor 60 detects the front and rear ends of the object to be measured OB depending on whether or not the laser beam is received near the side surface on the opposite side of the stage St, and outputs a signal of a predetermined intensity when the laser beam is received. However, there is no signal output unless the laser light is received. The end detection circuit 61 is integrated with the end detection sensor 60, and when the strength of the signal input from the end detection sensor 60 becomes 0 from the predetermined strength after the operation command is input from the controller 71, it means "tip detection". The signal to be output is output to the controller 71, and when the intensity becomes a predetermined value from 0, a signal meaning "rear end detection" is output to the controller 71. The line detected by the end detection sensor 60 (the optical axis of the laser beam on the opposite side) is slightly behind the optical axis of the emitted X-ray with respect to the moving direction of the object to be measured OB, and will be described later. When the "tip detection" signal is output, X-rays are emitted and the diffracted X-ray intensity is detected after a preset time, and when the "rear end detection" signal is output, the X-rays are emitted and the diffracted X-ray intensity is detected. Immediately, the emission of X-rays and the detection of the intensity of diffracted X-rays are stopped. This is because normal evaluation cannot be performed when the emitted X-rays are applied to the edges of the front end and the rear end of the measurement object OB, and therefore evaluation is not performed in this state.

The computer device 70 includes a controller 71, an input device 72, and a display device 73. The controller 71 is an electronic control device whose main part is a microcomputer equipped with a CPU, ROM, RAM, a large-capacity storage device, etc., and executes a program stored in the large-capacity storage device to execute an X-ray diffraction measuring device 1. In addition to controlling the operation of, the input digital data is used to perform calculations to determine pass / fail, evaluate the degree of abnormality, and determine the presence or absence of surface defects. The input device 72 is connected to the controller 71 and is used by an operator for inputting various parameters, operation instructions, and the like. The display device 73 is also connected to the controller 71 to display various setting statuses, operating statuses, inspection results, etc. of the X-ray diffraction measurement system.

Next, using the X-ray diffraction measurement system including the X-ray diffraction measurement device configured as described above, the measurement object OB placed on the long stage St moving at a constant speed is inspected one after another. The operation of the X-ray diffraction measurement system in the case will be described. In this explanation, the one having a smaller surface hardness of the object to be measured OB, that is, the one in which the characteristic value calculated by {(DA) + (BC)} is larger than the permissible value is described as an abnormality. To do. First, the operator turns on the power of the X-ray diffraction measurement system, makes the measurement object OB directly under the X-ray diffraction measurement device 1, and inputs a position and attitude adjustment command from the input device 72. As a result, two laser light irradiation points are formed on the object to be measured OB, and the reflected light intensity is displayed on the display device 73. Therefore, the position of the X-ray diffraction measurement device 1 (housing 50) is adjusted. The two laser beam irradiation points are matched, and the irradiation points are set at the intended position on the measurement object OB and in front of the line detected by the edge detection sensor 60 by an appropriate distance. Then, the posture of the X-ray diffraction measuring device 1 is adjusted so that the reflected light intensity displayed on the display device 73 becomes equal to or higher than the set value. This completes the adjustment of the position and orientation of the X-ray diffraction measuring device 1 (housing 50). If it is clear that the thickness of the object to be measured OB is the same as that at the time of the previous inspection and the position and posture of the X-ray diffraction measuring device 1 (housing 50) have not changed, this position and posture. Adjustment may be omitted.

Next, the operator activates a device for moving the stage St, and inputs the inspection start from the input device 72. As a result, the controller 71 starts executing the installed program of the flow shown in FIG. 6 in step S1. Hereinafter, description will be given according to the flow shown in FIG.

First, in step S2, the controller 71 starts time measurement by the clock built in the controller 71, and in step S3, outputs a command to start operation to the end detection circuit 61. As a result, the end detection circuit 61 outputs a signal meaning "tip detection" and "rear end detection" each time the tip and rear ends of the object to be measured are detected by the signal from the end detection sensor 60 as described above. Output to the controller 71. Next, in step S4, the controller 71 sets m, which is a number for identifying the measurement target OB, to “1”, and sets n, which is a number for identifying the measurement point, to “1” in step S5. Then, in step S6, the end detection circuit 61 waits for the signal of "tip detection" in the first measurement object OB to be input while repeating the determination of No. When the input is made, it is determined as Yes and the process proceeds to step S7. The measurement time is reset to 0 in S7, and the time T preset in step S8 is waited while repeating the determination of No. As described above, the line detected by the end detection sensor 60 (the optical axis of the laser beam on the opposite side) is slightly behind the optical axis of the emitted X-ray with respect to the moving direction of the measurement object OB. , Since the accurate inspection is not performed when the emitted X-rays hit the edge of the measurement target OB, wait until the X-ray irradiation point is separated from the edge of the measurement target OB by a small distance and the inspection can be performed accurately. Because.

When the time T elapses, the controller 71 determines Yes and goes to step S9, outputs a command for starting emission to the X-ray control circuit 30 in step S9, and commands emission start to the laser drive circuit 35 in step S10. Is output, a data output start command is output to the SD signal extraction circuits 31 to 34 in step S11, and a data output start command is output to the reflected light intensity detection circuit 36 in step S12. As a result, the X-ray diffraction measuring device 1 (housing 50) irradiates the measurement target OB with X-rays and laser light, and the digital data of the diffracted X-ray intensity and the digital data of the reflected light intensity are input to the controller 71. Next, in step S13, the controller 71 waits while repeating the determination of No until the time reaches (T + Δt), determines Yes when the time reaches (T + Δt), proceeds to step S14, and in step S14, the SD signal. Data I (n, m) having an intensity corresponding to the diffracted X-ray intensity input from the extraction circuits 31 to 34 is taken into the memory. The acquisition time is set in advance, and all the data input from the SD signal extraction circuits 31 to 34 during this set time is acquired. Next, in step S15, the data R (n, m) of the intensity corresponding to the reflected light intensity input from the reflected light intensity detection circuit 36 is taken into the memory. Next, in step S16, the captured diffraction X-ray intensity data I (n, m) is averaged to obtain the respective intensity values of the above-mentioned signals A, B, C, and D, and {(DA) + ( The characteristic value V (n, m) is calculated from the calculation of BC)}.

Next, in step S17, if the characteristic value V (n, m) obtained in step S16 is equal to or less than the permissible value L, the controller 71 determines Yes and goes to step S19, and if it exceeds the permissible value L, the controller 71 proceeds to step S19. After determining No, the process proceeds to step S18, the characteristic value V (n, m) is stored in another memory area as abnormal location data, and then the process proceeds to step S19. Next, in step S19, if the data R (n, m) of the intensity corresponding to the reflected light intensity captured in step S15 is equal to or more than the permissible value D, the controller 71 determines Yes and goes to step S21. If it is less than the permissible value D, it is determined as No, the process proceeds to step S20, the data R (n, m) is stored in another memory area as surface defect location data, and then the process proceeds to step S21. Then, in step S21, the controller 71 determines whether or not the signal of "rear end detection" in the first measurement object OB has been input from the end detection circuit 61, but since the inspection has just started at this stage, No. The determination is made, the process goes to step S22, n is incremented, and the process returns to step S13. Then, in step S13, the measurement waits until the measurement time reaches T + n · Δt (T + 2 · Δt in this case), and when the measurement time reaches T + n · Δt, it is determined to be Yes and the process proceeds to step S14, and steps S14 to S22 described above are performed. Is performed, and the process returns to step S13.

In this way, the characteristic value V (n, m) and the reflected light intensity R (n, m) are acquired each time the measurement time increases by Δt, such as T + Δt, T + 2, Δt, T + 3, Δt, and so on. It is determined whether the value V (n, m) is below the permissible value and whether the reflected light intensity R (n, m) is above the permissible value. If No, the characteristic value V (n, m) is determined. m) and the reflected light intensity R (n, m) are stored in different memory areas. Then, when the signal of "rear end detection" is input from the end detection circuit 61, it is determined as Yes in step S21, the process proceeds to step S23, and a command to stop emission is output to the X-ray control circuit 30 in step S23. In step S24, an output stop command is output to the laser drive circuit 35, an output stop command is output to the SD signal extraction circuits 31 to 34 in step S25, and an output stop command is output to the reflected light intensity detection circuit 36 in step S26. Outputs the command of. As a result, the X-ray irradiation and the laser beam irradiation to the measurement object OB are stopped, and the output of the data corresponding to the diffracted X-ray intensity and the reflected light intensity is stopped. As described above, the line detected by the end detection sensor 60 (the optical axis of the laser beam on the opposite side) is slightly behind the optical axis of the emitted X-ray with respect to the moving direction of the object to be measured OB. When the detection sensor 60 detects the rear end, the emitted X-ray does not cover the edge of the rear end of the object to be measured OB. Therefore, when the "rear end detection" signal is input, the X-ray irradiation and data output are immediately stopped.

Next, in step S27, the controller 71 determines whether or not there is a characteristic value V (n, m) stored in another memory area, and if not, determines that there is no, proceeds to step S26, and displays "pass". Is displayed on the display device 73 together with the identification information of the measurement target OB corresponding to m = 1. At this time, there is a slight possibility that the reflected light intensity R (n, m) stored in another memory area is present, but the characteristic value V (n, m) is not affected by the surface defect. Assuming that there is no problem, "pass" is given.

If there is a characteristic value V (n, m) stored in another memory area, it is determined to be Yes, the process proceeds to step S29, and the reflected light intensity R (n, m) stored in another memory area in step S29. It is determined whether or not there is m), and if not, it is determined as No, and the process proceeds to step S30, and the display of "failure" is displayed on the display device 73 together with the identification information of the measurement target OB corresponding to m = 1. This is a process in which the cause of the characteristic value V (n, m) being less than the permissible value is not the influence of the surface defect of the measurement target OB but the abnormality of the surface hardness of the measurement target OB and is rejected. .. Then, in step S31, from n of the stored data, the moving speed F of the stage St stored in advance, the time T, and the distance B from the line detected by the end detection sensor 60 to the optical axis of the emitted X-ray, F. -Calculate (T + n · Δt) -B and calculate the distance from the tip of the measurement target OB at the abnormal location. Further, the magnitude obtained by subtracting the permissible value L from the characteristic value V (n, m) is applied to a table of the degree of abnormality stored in advance to determine the degree of abnormality. In the table of the degree of abnormality, the amount of deviation from the magnitude obtained by subtracting the permissible value L from the characteristic value V (n, m) is divided for each range, and "fine", "small", "medium", "large", and " The degree of abnormality is defined as "extra large" or "1", "2", "3", "4", "5". The magnitude obtained by subtracting the permissible value L from the characteristic value V (n, m) may be used as it is as the degree of abnormality. Then, the controller 71 displays the distance from the tip of the abnormal portion calculated in this way and the degree of the determined abnormality on the display device 73. In this display, the inspection result can be easily understood by displaying the abnormal location and the degree of abnormality in the figure in addition to the numerical display.

Further, in step S29, it is determined whether or not there is a reflected light intensity R (n, m) stored in another memory area, and if there is, it is determined as Yes, the process proceeds to step S32, and the characteristic value V (n) is determined in step S32. , M) n (natural number representing the measurement point) is all determined to match n of the reflected light intensity R (n, m). When there is n that does not match, it means that there is an abnormal portion of the surface hardness, so it is determined as No, and the process proceeds to step S30, and the above-described processing is performed in step S30 and step S31. If there are a plurality of characteristic values V (n, m) and there is an n that does not match the reflected light intensity R (n, m) n, it is added to the abnormal surface hardness. Since there are surface defects to the extent that the characteristic value V (n, m) is affected, the indication of "surface defects existed" and the defect locations are shown as in the processes of steps S33 and S34 described later. May be displayed.

Further, in step S32, it is determined whether all n of the characteristic values V (n, m) match n of the reflected light intensity R (n, m), and if there are all matching n, Yes. After making a determination, the process proceeds to step S33, "surface defect exists" is displayed, and in step S34, the distance from the tip of the object to be measured OB at the defect location is calculated by calculating F · (T + n · Δt) −B. Then, it is displayed on the display device 73. This means that there are no abnormalities in surface hardness, but there are surface defects to the extent that the characteristic value V (n, m) is affected. Whether or not this measurement object OB is passed may be determined by the measurement object OB. For example, the surface defect is passed as no problem, or the surface of the object to be measured OB is observed and judged after the inspection.

When any of the processes of step S26, step S31, or step S34 is completed, the controller 71 goes to step S35, increments m in step S35 and returns to step S5, with respect to the measurement object OB with m = 2. , Steps S5 to S34 described above are performed. Then, in step S35, m is incremented and the process returns to step S5, and the same processing is performed on the measurement target OB with m = 3. In this way, the measurement object OB placed on the moving stage St and moving one after another is inspected, and the inspection result is displayed on the display device 73. The operator sees the result displayed on the display device 73, removes the measurement object OB determined to be unacceptable from the stage St, and separates it from the other measurement object OBs. What to do with the measurement object OB determined to have a surface defect is determined by the measurement object OB as described above. Then, when the measurement target OB to be inspected disappears and the operator inputs an inspection stop command from the input device 72, it is determined as Yes in step S36, the process proceeds to step S37, and the end detection circuit 61 is operated in step S37. Outputs a stop command and stops time measurement using the built-in clock. Next, in step S38, the diffracted X-ray intensity data V (n, m) and the reflected light intensity R (n, m) stored as data below the permissible value are moved to another memory area, and the next inspection is performed. The memory area used at this time is emptied, and the execution of the program ends in step S39.

In this way, after moving the stage St, if an inspection start command is input from the input device 72, the controller 71 can execute the installed program to execute the measurement target OB mounted on the stage St. The inspections are performed one after another, and the inspection results are displayed on the display device 73 in order. When the operator wants to analyze in detail the cause of the abnormality of the measurement object OB determined to be unacceptable, the operator sets the measurement object OB in an X-ray diffraction measuring device for obtaining an X-ray diffraction image, and finds the abnormality. An X-ray diffraction image may be measured. In addition, when it is decided to judge whether or not to pass the measurement object OB determined to have a surface defect by observing the surface, the surface of the measurement object OB is visually observed or observed with a microscope to determine the defect. Judge from the type and size of. In general, surface defects such as foreign matter adhesion and dirt can be removed, so that a pass judgment can be made.

The permissible value L set in the controller 71 needs to have a constant intensity of X-rays applied to the measurement target OB. As described above, the X-ray control circuit 30 controls the drive current and the drive voltage supplied from the high-voltage power supply 75 to the X-ray tube 10 so that X-rays having a constant intensity are emitted from the X-ray tube 10. However, the intensity of X-rays emitted from the X-ray tube 10 may change after a long period of time. Therefore, the standard measurement object OB is periodically measured to confirm that the characteristic value V is within the permissible range. Then, when it is out of the permissible range, maintenance of the X-ray diffraction measuring device 1 is performed, or the setting of the X-ray control circuit 30 is changed so that the characteristic value V of the standard measurement object OB is within the permissible range. , Or change the permissible value L. Further, as for the permissible value D set in the controller 71, since the intensity of the laser beam applied to the measurement object OB needs to be constant, the standard measurement object OB is periodically measured and the reflected light is reflected. Confirm that the intensity R is within the permissible range. Then, when it is out of the permissible range, maintenance of the X-ray diffraction measuring device 1 is performed, or the setting of the laser drive circuit 35 is changed so that the reflected light intensity R of the standard measurement object OB is within the permissible range. , Or change the permissible value D.

As can be understood from the above description, in the above embodiment, the X-ray tube 10 that emits X-rays and the X-rays emitted from the X-ray tube 10 are passed through the through holes 22a, 14a, and 15a. An X-ray emitting mechanism that emits X-rays toward the object to be measured OB with substantially parallel light having a predetermined cross-sectional diameter, and an X-ray emitting mechanism that emits X-rays toward the object to be measured OB when the X-ray emitting mechanism emits X-rays to the object to be measured OB. The scintillation counters 21-1 to 21-4 for detecting the X-ray intensity at a plurality of positions of the X-ray diffraction image formed by the diffracted X-rays generated in the above process, and the optical axis of the X-rays emitted from the X-ray emission mechanism. In the X-ray diffraction measuring device 1 provided with a laser light emitting / receiving mechanism for emitting visible laser light on the same optical axis, the laser light emitting / receiving mechanism includes a laser light source 44 for emitting laser light and an X-ray tube. It is provided with a rising mirror 24 arranged on the optical axis of the X-ray emitted from the 10 and reflecting the laser light emitted by the laser light source 44 and incident on the through holes 22a, 14a, 15a of the X-ray emitting mechanism. The raising mirror 24 is formed with a through hole 24a through which X-rays emitted from the X-ray tube 10 pass, and the laser light emitted by the laser light source 44 is reflected by a reflecting surface around the end of the through hole 24a. ing.

According to this, X-rays and visible laser light can be simultaneously irradiated coaxially. As a result, the X-ray irradiation point (measurement point) can always be confirmed as the laser beam irradiation point. Further, the rising mirror 24 is arranged on the optical axis of the X-ray emitted from the X-ray tube 10, but the X-ray emitted from the X-ray tube 10 is a through hole 24a formed in the rising mirror 24. Since it has passed through the above, it is possible to prevent the rise mirror 24 from reducing the X-ray intensity.

Further, in the above embodiment, the laser light emitting / receiving mechanism includes a reflected light intensity detecting means for detecting the intensity of the reflected light generated by reflecting the laser light on the object to be measured OB, and the reflected light intensity detecting means. Is a beam splitter 25 that is arranged between the laser light source 44 and the riser mirror 24 and reflects a part of the reflected light, and the intensity of the reflected light reflected by the beam splitter 25 that is incident and corresponds to the intensity of the incident light. It is provided with a photodetector 27 that outputs the signal of.

According to this, when the laser beam emitted from the X-ray diffraction measuring device 1 irradiates a defect such as unevenness or scratches on the object to be measured OB, the intensity of the reflected light of the laser beam changes, so that the laser It is possible to detect that the emitted X-rays coaxial with the light are applied to defects such as irregularities and scratches on the object to be measured OB.

Further, in the above embodiment, a determination function for comparing the strength of the signal output by the photodetector 27 with a preset allowable value and determining the presence or absence of an abnormality based on the comparison result, and scintillation counters 21-1 to 21-4. The characteristic value calculation function that calculates the characteristic value of the object to be measured OB using the multiple X-ray intensities detected by is and the characteristic value calculated by the characteristic value calculation function when the judgment function determines an abnormality is the object to be measured. A program having an identification function that enables identification of being affected by the surface condition of the OB is installed in the controller 71.

According to this, only by confirming the final result obtained by the measurement of the X-ray diffraction measuring device 1, whether the fluctuation of the characteristic value of the object to be measured OB is due to defects such as surface irregularities and scratches, or the characteristic value. It is possible to determine whether it is due to itself.

(Modification example 1)
The X-ray diffraction measurement system in the above embodiment detects the intensity of the reflected light of the laser light that is simultaneously irradiated on the same optical axis as the emitted X-ray, and determines whether or not the intensity is equal to or higher than the allowable value, and the defect on the surface of the object to be measured OB. However, defects on the surface of the object to be measured OB may be detected by adding characteristics other than the intensity of the reflected light. The first modification is a form in which the polarization characteristic of the reflected light is detected in addition to the intensity of the reflected light, and the defect on the surface of the object to be measured OB is detected by the intensity and the polarization characteristic of the reflected light.

FIG. 7 is a view of the main parts of the laser light emitting / receiving mechanism of the modified example 1 viewed from the X-ray tube 10 side in the X-ray emitting direction. The point where the laser light that has passed through the mating lens 26 passes through the polarizer 28 and the reflected light from the measurement object OB reflected by the beam splitter 25 are divided into two by the polarizing beam splitter 29, and the reflected light is divided into two. The point is that the photodetectors 27-1 and 27-2 receive light and detect the intensity of each reflected light. In the first modification, the reflected light intensity detection circuit 36 shown in FIG. 1 inputs signals from the two photodetectors 27-1 and 27-2, converts the intensity of each signal into digital data, and outputs the signals to the controller 71. doing. The polarizing element 28 has a polarization axis in the vertical direction of FIG. 7, passes through the polarizer 28 and the beam splitter 25, and the laser beam reflected by the rising mirror 24 becomes polarized light having a polarizing surface in the vertical direction of FIG. In FIG. 1, the polarized light has a plane of polarization in the direction perpendicular to the paper surface. When this polarized laser beam is reflected by the object to be measured OB, the reflected light has a polarization component different from that in the vertical direction shown in FIG. 7. The polarizing beam splitter 29 has a polarization axis parallel to the paper surface, and the polarization component of the reflected light reflected by the riser mirror 24 is only the polarization component parallel to the paper surface, similar to the polarization component of the laser light that has passed through the polarizer 28. If so, most of the reflected light passes through the polarizing beam splitter 29 and is received by the photodetector 27-2. However, since the reflected light has a polarization component different from that in the vertical direction of FIG. 7, the polarization component of the reflected light reflected by the rising mirror 24 also has a polarization component different from the polarization component parallel to the paper surface.

Therefore, as the reflected light incident on the polarizing beam splitter 29, the transmitted light and the reflected light are generated. The ratio of the transmitted light to the reflected light differs depending on the polarization component of the reflected light, and the polarization component of the reflected light changes depending on the minute unevenness (roughness) on the surface of the object to be measured OB. Therefore, if the ratio of the light transmitted through the polarizing beam splitter 29 to the light reflected is calculated as the ratio of the light intensity detected by the photodetectors 27-1 and 27-2, minute irregularities on the surface of the object to be measured OB are calculated. Changes in (roughness) can be detected. Specifically, the controller 71 stores the permissible range of the ratio of the light intensity detected by the photodetectors 27-1 and 27-2, and the calculated light intensity detected by the photo detectors 27-1 and 27-2. When the ratio is out of the permissible range, it may be determined that the surface of the object to be measured OB has a defect related to minute irregularities (roughness). Generally, when the minute unevenness (roughness) of the surface of the object to be measured OB becomes large, the reflected light has many polarization components different from the polarization components of the irradiated laser light.

Further, in the first modification, the total intensity of the light detected by the photodetectors 27-1 and 27-2 can be used as the intensity of the reflected light, and as in the above embodiment, the intensity of the reflected light changes. It is also possible to detect defects on the surface of the object to be measured OB. Specifically, when the minute unevenness (roughness) of the surface of the object to be measured changes from the normal state, the polarization characteristics of the reflected light change, and scratches, protrusions, dents, rust, and foreign matter adhere to the surface of the object to be measured OB. If there is such a thing, the intensity of the reflected light changes.

(Modification 2)
The X-ray diffraction measurement system in the above embodiment and the first modification is based on the premise that the surface of the object to be measured OB is flat. If the object to be measured OB has a step and it is necessary to detect that the X-ray is irradiated beyond the step, the X-ray diffraction measurement system according to the above embodiment and the first modification may be used. When the intensity of the reflected light of the laser light changes, it cannot be detected whether it is due to a defect on the surface or due to irradiation of the laser light (X-ray) beyond the step portion. In the second modification, in addition to the intensity of the reflected light, the distance to the point where the reflected light is generated is also detected, and it is detected that the laser beam (X-ray) is irradiated beyond the stepped portion of the measurement target OB. Is.

FIG. 8 is a view of the main parts of the laser light emitting / receiving mechanism of the modified example 2 viewed from the X-ray tube 10 side in the X-ray emitting direction. The difference between the modified example 2 and the modified example 2 is that the modified example 2 is different from the modified example 2. A point where the polarizing beam splitter 56 is arranged instead of the polarizer 28, and a distance measuring instrument based on the measurement principle of time of flight are provided in the housing 50, and the collimating lens 58 is emitted from the laser light source 57 of the distance measuring instrument. The point is that the laser beam that becomes substantially parallel light is reflected by the polarizing beam splitter 56 and irradiated coaxially with the laser beam from the laser light source 44. The sensor of the distance measuring instrument is attached to an appropriate position on the lower surface of the rectangular parallelepiped plate 20. The laser light source 57 emits laser light in pulses at regular intervals, and the distance measuring instrument is the time from when the laser light source 57 emits pulse light to when the reflected light of the pulsed laser light is incident on the sensor. Is measured, and the distance from the laser light source 57 to the sensor is calculated from the time. When the laser beam (X-ray) is irradiated beyond the step of the object to be measured OB, the distance measured by the distance measuring instrument is different. Therefore, the digital data of the distance measured by the distance measuring instrument is input to the controller 71. By determining whether or not the input distance data is within the permissible range stored in the controller 71 in advance, the laser beam (X-ray) is irradiated beyond the step of the measurement object OB. Detect that.

The laser light emitted from the laser light source 57 and becomes substantially parallel light by the collimating lens 58 is a laser light that is slightly focused like the laser light emitted from the laser light source 44, and is the laser light shown in FIG. The object to be measured OB is irradiated with an optical path similar to that of the above. Further, the light source of the distance measuring device of the time-of-flight measurement principle is not only a laser light source but also an LED light source, but if the light source has the required measurement accuracy, the distance measuring device of the LED light source may be used. Good. In that case, the collimating lens 58 may be eliminated. Unlike the laser light, the light from the LED light source travels in various directions, but the light in the optical path shown in FIG. 3 is reflected by the rising mirror 24 and irradiates the object to be measured OB, so that the distance measurement is performed. be able to.

Further, as the laser light of the laser light source 57 of the distance measuring instrument, a wavelength having a wavelength in the invisible region is selected, and photodetectors 27-1 and 27-2 having sensitivity in the visible region are used. Even if the laser light from the laser light source 57 reflected by the measurement object OB is incident on the photodetectors 27-1 and 27-2, it does not affect the detection of the reflected light intensity. When the photodetectors 27-1 and 27-2 are sensitive to the invisible region, only the light in the visible light region passes through the optical path between the beam splitter 25 and the polarizing beam splitter 29. A dichroic mirror to be split may be arranged. Since there are various distance measuring instruments on the market for the time-of-flight measurement principle, they have measurement accuracy that can detect the step of the object to be measured OB, and the wavelength of the laser light or LED light is non-existent. The one in the visible region may be selected.

If a distance measuring instrument based on the measurement principle of time of flight is provided, the value detected by the distance measuring instrument when the distance between the irradiation point and the detection plane becomes the set value is set as the set value, and the distance measuring instrument can be used. By adjusting the position of the X-ray diffraction measuring device 1 (housing 50) with respect to the object to be measured OB so that the detected distance becomes the set value, the distance between the irradiation point and the detection plane can be set to the set value. Therefore, in the second modification, the laser emitter 40 may not be provided.

The implementation of the present invention is not limited to the above-described embodiments and modifications, and various modifications can be made as long as the object of the present invention is not deviated.

In the above-described embodiment and modification, the laser light source 44 is used as the light source that emits visible light, but the rising mirror 24 is small enough to emit visible light and can be fixed to the rectangular plate 20. A light source other than the laser light source 44 may be used as long as it can reflect visible light and irradiate the object to be measured OB. For example, an SLD light source may be used instead of the laser light source 44, or an LED light source may be used instead of the laser light source 44 and the collimating lens 26. The LED light emitted from the LED light source travels in various directions, but only the light in the optical path shown in FIG. 3 is reflected by the rising mirror 24 and irradiated to the object to be measured OB.

Further, in the above embodiment, the four scintillation counters 21-1 to 21-4 are fixed to the rectangular parallelepiped plate 20 as shown in FIG. 2, but the four X-ray incident surfaces are fixed to the fixing block 22 and the cylindrical pipe. If the distance from the central axis of 14 is different, the rotation angle of the interval in the arrangement may be any angle. Further, if the intensity of the diffracted X-rays can be detected accurately even if the X-ray incident surface of the scintillation counters 21-1 to 21-4 is smaller than that of the present embodiment, the scintillation counters 21-1 to 21-4 May be arranged in a row in the radial direction at positions of arbitrary rotation angles.

Further, in the above embodiment, the number of scintillation counters 21 is four, but if the characteristic value based on the intensity change of the diffracted X-rays in the radial direction can be calculated, the number of scintillation counters 21 may be three. It may be 5 or more. For example, if there are three, assuming that A, B, and C are in descending order of distance from the fixed block 22 on the X-ray incident surface and the central axis of the cylindrical pipe 14, the characteristic values are calculated by (BAC). For example, if there are six values, and A, B, C, D, E, and F are set in descending order of the distance, the characteristic value is {(CBA) + (DE). The value calculated by −F)} can be adopted. Further, when the number of scintillation counters 21 is further increased, characteristic values such as a half price range and an integrated price range may be calculated.

Further, in the above embodiment, the present invention is applied to the case where the measurement object OB is placed on the stage St of the moving mechanism and moves at a constant speed, but the measurement object OB is applied to the X-ray diffraction measuring device 1. The present invention can be applied in any case as long as it moves relatively. For example, the present invention can be applied even when the measurement object OB is placed on a fixed stage and the X-ray diffraction measuring device 1 is moved in parallel with the surface of the measurement object OB. Further, in the present invention, even if the measurement object OB does not move relative to the X-ray diffraction measuring device 1, the measurement object OB is placed one after another on a fixed stage and each measurement is performed. It can be applied even when inspecting a set portion of the object OB.

Further, in the above embodiment, the presence or absence of defects on the surface of the object to be measured OB is determined at the location where the abnormality is detected by the characteristic value V, but the characteristic value V is stored at all the measurement points and all the measurement points are stored. The presence or absence of defects on the surface of the object to be measured OB may be determined at the measurement point. In this case, since the characteristic value V becomes an enormous number, a change curve may be created from the characteristic value V and the measurement position, and the points where surface defects are detected may be displayed as dots on the change curve. .. In addition to determining the presence or absence of defects on the surface of the object to be measured OB based on the reflected light intensity and the polarized light characteristics of the reflected light, a change curve is created from the reflected light intensity, the polarized light characteristics of the reflected light, and the measurement position, and the characteristic values are created. It may be displayed in comparison with the change curve of V.

Further, in the above embodiment, only the evaluation is performed as to whether or not the characteristic value V of the measurement target object OB exceeds the permissible value, but other than this, defects on the surface of the measurement target object OB are detected. The average value, the maximum value, the minimum value, the fluctuation range, the average deviation, and the standard deviation may be calculated from the characteristic value V excluding the characteristic value V at the time of evaluation.

Further, in the above embodiment, the scintillation counter 21 is used to detect the intensity of the diffracted X-ray, but any X-ray detection sensor can be used if the intensity of the X-ray can be detected accurately and at high speed. May be good.

Further, in the above embodiment, the present invention is applied to an X-ray diffraction measuring apparatus having a scintillation counter 21 for detecting the intensity of diffracted X-rays at a plurality of locations, but the present invention irradiates the measurement object OB with X-rays. However, any X-ray diffraction measuring device that detects the X-ray intensity at a plurality of positions of the X-ray diffraction image formed by the diffracted X-rays generated at the X-ray irradiation point can be applied. it can. For example, instead of the mechanism for irradiating the LED light coaxially with the X-ray in the X-ray diffraction measuring device in Patent Document 1 of the prior art document, a laser light emitting / receiving mechanism is provided as in the above embodiment and the modified example. May be good. FIG. 9 is an enlarged view when the laser light emitting / receiving mechanism of the above embodiment is provided in the X-ray diffraction measuring apparatus of Patent Document 1 of the prior art document. In FIG. 9, the numbers assigned to each component and member of the X-ray diffraction measuring device refer to the numbers assigned to the X-ray diffraction measuring device of Patent Document 1 as they are, so that the laser beam emitting / receiving mechanism of the above embodiment is used as it is. The collimating lens 26, the beam splitter 25, and the rising mirror 24 in the above are numbered 46, 45, and 47 in order so that the numbers do not overlap. Note that FIG. 9 is based on the X-ray diffraction measuring device developed by the applicant of the present application in order to miniaturize the X-ray diffraction measuring device shown in Patent Document 1, and therefore X shown in Patent Document 1 is used. The shape is different from that of the X-ray diffraction measuring device, but the basic structure has not changed.

The X-ray diffraction measuring device in Patent Document 1 of the prior art document images a diffraction ring which is an X-ray diffraction image by the diffraction X-ray generated at the X-ray irradiation point, reads the imaged diffraction ring, and performs residual stress from the shape. However, as shown in FIG. 9, a measuring method is also possible in which the object to be measured OB is moved with respect to the device to image the diffraction ring, and the object to be measured OB is evaluated in the moved range. Therefore, as in the above-described embodiment and modification, a visible laser beam is emitted coaxially with the emitted X-ray, and the intensity and polarization characteristics of the reflected light are detected to detect defects on the surface of the object to be measured and image the image. It is possible to determine the presence or absence of the influence of the defect on the X-ray diffraction image. Further, the X-ray diffraction measuring device in Patent Document 1 of the prior art document captures an X-ray diffraction image on an imaging plate, scans the imaging plate with laser light, and detects the reflected light intensity together with the scanning position to detect X-rays. Although it is an apparatus for detecting the X-ray intensity at each position of the diffraction image, the present invention can be applied to another type of apparatus as long as it can detect the X-ray intensity at each position of the X-ray diffraction image. For example, a device provided with an image pickup device such as an X-ray CCD having a plane having the same width as the imaging plate 15 and detecting the X-ray intensity at each position of the X-ray diffraction image by an electric signal output from each pixel of the image pickup device. However, the present invention can be applied.

Further, in the above embodiment, the edge detection sensor 60 detects the front end and the rear end of the measurement object OB depending on the presence or absence of light reception of the laser beam emitted from the opposite side of the stage St. Reference numeral 60 denotes any operating principle as long as the front end and the rear end of the object to be measured OB can be detected. For example, the edge detection sensor 60 is provided with an imaging function, a bright spot or a special mark is provided on the opposite side of the stage St, and the bright spot or the special mark disappears or appears from the captured image, so that the object to be measured is OB. It may be one that detects the front end and the rear end of the.

1 ... X-ray diffraction measuring device, 10 ... X-ray tube, 11 ... Exit, 14 ... Cylindrical pipe, 15 ... Passage member, 20 ... Square plate, 21,21-1 to 21-4 ... Scintillation counter, 22 ... Fixed block, 24 ... Rise mirror, 25 ... Beam splitter, 26 ... Collimating lens, 27, 27-1, 27-2 ... Photodetector, 28 ... Polarizer, 29 ... Polarized beam splitter, 40 ... Laser emitter , 41 ... Frame, 42 ... Collimating lens, 43 ... Laser light source, 44 ... Laser light source, 45 ... Beam splitter, 46 ... Collimating lens, 47 ... Rising mirror, 50 ... Housing, 50a ... Bottom wall , 50a1 ... Hole, 50b ... Front wall, 50c ... Rear wall, 50d ... Top wall, 50e ... Slope wall, 50f ... Side wall, 51 ... Fixed block, 53 ... Rotating part, 54 ... Tip arm, 55 ... Rotating table, 56 ... Polarization beam splitter, 57 ... Laser light source, 58 ... Collimating lens, 60 ... Edge detection sensor, 70 ... Computer device, 71 ... Controller, 72 ... Input device, 73 ... Display device, 75 ... High voltage power supply, St. … Stage, OB… Measurement object

Claims (5)

An X-ray tube that emits X-rays and
An X-ray emission mechanism that emits X-rays emitted from the X-ray tube toward an object to be measured by passing them through a through hole to make them substantially parallel light having a predetermined cross-sectional diameter.
When X-rays are emitted from the X-ray emission mechanism toward the measurement object, the X-ray intensity at a plurality of positions of the X-ray diffraction image formed by the diffraction X-rays generated by the measurement object is detected. Diffractive X-ray intensity detecting means and
In an X-ray diffraction measuring apparatus provided with visible light emitting means for emitting visible parallel light on the same optical axis as the X-ray optical axis emitted from the X-ray emitting mechanism.
The visible light emitting means is arranged on an optical axis of a light source that emits visible light and X-rays emitted from the X-ray tube, reflects visible light emitted by the light source, and penetrates the X-ray emitting mechanism. Equipped with a reflective member that enters the hole
The reflecting member is characterized in that a passing hole through which X-rays emitted from the X-ray tube is passed is formed, and visible light emitted by the light source is reflected by a reflecting surface around the end of the passing hole. X-ray diffraction measuring device. In the X-ray diffraction measuring apparatus according to claim 1,
A reflected light intensity detecting means for detecting the intensity of the reflected light generated by reflecting the visible light emitted from the visible light emitting means on the measurement object is provided.
The reflected light intensity detecting means incidents a light path changing member arranged between the light source and the reflecting member to reflect a part of the reflected light and the reflected light reflected by the light path changing member, and is incident. An X-ray diffraction measuring device including a receiver that outputs a signal having an intensity corresponding to the intensity of the light. In the X-ray diffraction measuring apparatus according to claim 2.
The visible light emitting means includes an optical element for linearly polarized light that converts visible light into linearly polarized light.
The reflected light intensity detecting means includes a reflected light dividing means that divides the reflected light from the measurement object reflected by the optical path changing member into two polarized lights having different polarization directions by 90 °.
The X-ray diffraction measuring device is characterized in that the light receivers are two light receivers that incident light divided by the reflected light dividing means. In the X-ray diffraction measuring apparatus according to claim 2 or 3.
A determination means for comparing the intensity of the signal output by the receiver with a preset allowable value and determining the presence or absence of an abnormality based on the comparison result.
A characteristic value calculating means for calculating a characteristic value of the measurement object using a plurality of X-ray intensities detected by the diffracted X-ray intensity detecting means, and a characteristic value calculating means.
When the determination means determines an abnormality, the characteristic value calculated by the characteristic value calculation means is provided with an identification means capable of identifying that the characteristic value is affected by the surface state of the measurement object. An X-ray diffraction measuring device characterized by the above. In the X-ray diffraction measuring apparatus according to claim 1 to 4.
It is equipped with a distance detecting means using a time-of-flight measurement principle that detects the distance from the light emitting point to the reflecting point by detecting the time until the emitted light is reflected and returned.
An X-ray diffraction measuring apparatus, characterized in that the optical axis of the light source of the distance detecting means is aligned with the optical axis of the light source of the visible light emitting means.

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