JP2021076435A - Shut resistance module and mounting structure of shut resistance module - Google Patents

Abstract

To provide a shut resistance module with which it is possible to perform current detection with good accuracy.SOLUTION: A shut resistance module (1) of the present invention comprises: a shut resistor (2) provided with a resistive element (5), a first electrode (6) provided at one end of the resistor and a second electrode (7) provided at the other end of the resistor; and a conductive member (4) electrically connected to the first electrode and arranged between the second electrode and the resistive element by being spaced therefrom, and constituting a current path (C2) in a direction opposite a current path (C1) flowing to the shut resistor.SELECTED DRAWING: Figure 4

Description

The present invention relates to a shunt resistor module including a shunt resistor and a mounting structure of the shunt resistor module.

For example, a shunt resistor is used to detect a current in a power semiconductor device or the like.

Patent Document 1 discloses a structure of a shunt resistor provided with a resistor and electrodes (wiring members) on both sides thereof, and a bus bar is connected to the electrodes. Further, the shunt resistor is provided with a voltage detection terminal for measuring a voltage value between electrodes.

Japanese Unexamined Patent Publication No. 2016-217829

By the way, a magnetic flux is generated when a current flows through the shunt resistor, and when the voltage detection terminal is affected by this magnetic flux, the voltage value fluctuates, causing a problem that an accurate current value cannot be measured.

Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a shunt resistor module capable of accurately detecting a current and a mounting structure of the shunt resistor module.

The shunt resistor module of one aspect of the present invention includes a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor. A current flowing through the shunt resistor, which is electrically connected to the first electrode and is arranged at a distance between the second electrode and the resistor. It is characterized by including a conductive member that constitutes a current path opposite to the path.

The mounting structure of the shunt resistance module according to one aspect of the present invention is a mounting structure for connecting the shunt resistance module to a current measurement circuit, and has an external connection terminal at a position facing the second electrode of the shunt resistance module. Then, an insulated fixing member is inserted into a through hole formed from the second electrode to the conductive member at a position facing the second electrode, and the shunt resistance module is fixed to the external connection terminal. At the same time, the second electrode is electrically connected to the external connection terminal.

According to the shunt resistor module of the present invention, the conductive members are arranged to face each other at intervals from the shunt resistor, and at this time, the first electrode of the shunt resistor and the conductive member are electrically connected. As a result, current paths can be formed in the shunt resistor and the conductive member in opposite directions, and the magnetic flux can be canceled, so that current detection can be performed with high accuracy.

According to the mounting structure of the shunt resistor module of the present invention, the shunt resistor module can be appropriately connected to the current measurement circuit without impairing the current path in the opposite direction between the shunt resistor and the conductive member.

It is a perspective view of the power semiconductor module provided with the shunt resistance module of this embodiment. It is an exploded perspective view of the shunt resistance module of this embodiment. It is an exploded perspective view which showed the connection structure of the shunt resistance module of this embodiment to a power semiconductor module in an enlarged manner. It is sectional drawing of the shunt resistance module of this embodiment. It is sectional drawing of the shunt resistance module which shows another embodiment.

Hereinafter, the shunt resistance module according to the present embodiment will be described with reference to the accompanying drawings.

<Shunt resistance module 1 of this embodiment>
For example, when a current flows through a shunt resistor for current detection attached to a power semiconductor module, magnetic flux is generated according to the right-handed screw rule. At this time, a large current flows through the shunt resistor, so that a large magnetic flux is generated, and this magnetic flux fluctuates the voltage value between the electrodes of the shunt resistor. As a result, there arises a problem that the current value cannot be detected with high accuracy. Therefore, as a result of intensive research, the present inventor has developed a structure capable of canceling the magnetic flux generated when a current flows through the shunt resistor.

That is, the shunt resistance module 1 of the present embodiment has the following features.
(1) A shunt including a resistor 5, a first electrode 6 provided at one end of the resistor 5, and a second electrode 7 provided at the other end of the resistor 5. Provide a resistor 2.
(2) It is electrically connected to the first electrode 6 and is arranged at a distance between the second electrode 7 and the resistor 5, and is opposite to the current path C1 flowing through the shunt resistor 2. A conductive plate 4 constituting the current path C2 is provided.
Hereinafter, the structure of the shunt resistor module 1 of the present embodiment will be specifically described.

FIG. 1 is a perspective view of a power semiconductor module 10 including the shunt resistance module 1 of the present embodiment. FIG. 2 is an exploded perspective view of the shunt resistor module 1 of the present embodiment. FIG. 3 is an enlarged perspective view showing an enlarged connection structure of the shunt resistor module 1 of the present embodiment to the power semiconductor module 10. FIG. 4 is a cross-sectional view of the shunt resistor module 1 of the present embodiment.

In the power semiconductor module 10 shown in FIG. 1, a semiconductor element or the like is arranged in a housing 15, and a drive substrate 16 is arranged on the surface of the housing 15. Further, a plurality of external connection terminals 10a to 10d are provided at both ends of the housing 15 in the Y direction. For example, the shunt resistor module 1 is attached to the external connection terminals 10a. Further, on both sides of the external connection terminals 10a to 10d in the X direction, fixing holes 17 through which bolts or the like can be inserted are provided to fix the power semiconductor module 10 to the external heat radiation fins or the like.

As shown in FIG. 1, the shunt resistor module 1 and the bus bar 11 of the present embodiment can be superposed on the external connection terminal 10a of the power semiconductor module 10 and fixed by the fixing member 18.

As shown in FIG. 2, the shunt resistor module 1 of the present embodiment includes a shunt resistor 2, an insulating sheet 3 as an insulating member, and a conductive plate 4 as a conductive member, as shown in FIG. .. The X1-X2 direction and the Y1-Y2 direction shown in FIG. 2 are two directions orthogonal to each other on a plane.

(Shunt resistor 2)
As shown in FIGS. 2 and 4, the shunt resistor 2 has a flat plate shape that is longer in the Y1-Y2 direction than the width dimension in the X1-X2 direction, and has a resistor 5 and one end of the resistor 5 ( It is configured to have a first electrode 6 provided at the Y1 side end) and a second electrode 7 provided at the other end (Y2 side end) of the resistor 5. The first electrode 6 and the second electrode 7 have lower electrical resistance values than the resistor 5. Although the material is not limited, for example, the resistor 5 is a metal such as Cu—Ni type, Cu—Mn type, or Ni—Cr type, and the electrodes 6 and 7 are metals such as Cu. ..

As shown in FIGS. 2 and 4, the length dimension L1 of the first electrode 6 in the Y1-Y2 direction is shorter than the length dimension L2 of the second electrode 7 in the Y1-Y2 direction. Here, the "length dimension" indicates the length in the direction parallel to the current path C1 formed in the first electrode 6 and the second electrode 7. The second electrode 7 has a length dimension extending from the position of the external connection terminal 10a to the surface of the drive substrate 16. As a result, the second electrode 7 can be connected to the external connection terminal 10a, and the pin-shaped voltage detection terminal 8b provided on the second electrode 7, which will be described later, is attached to the surface of the drive substrate 16 of the power semiconductor module 10. It can be properly inserted into the formed connection hole 16b. On the other hand, the first electrode 6 may be electrically connected to the conductive plate 4 and has an area in which the voltage detection terminal 8a can be arranged, and the length dimension L1 of the first electrode 6 is set to the second. It can be shorter than the length dimension L2. This makes it possible to appropriately and reliably connect and fix the shunt resistor 2 to the power semiconductor module 10 while suppressing the increase in size.

As shown in FIGS. 2 and 4, a through hole 2a is formed in the second electrode 7. As will be described later, the through hole 2a is a fixing hole for inserting the fixing member 18.

As shown in FIGS. 2 and 4, voltage detection terminals 8a and 8b are formed on the lower surfaces of the first electrode 6 and the second electrode 7 (the side facing the power semiconductor module 10). These voltage detection terminals 8a and 8b have, for example, a pin shape protruding in the direction of the power semiconductor module 10. The voltage detection terminals 8a and 8b can be attached to the lower surfaces of the first electrode 6 and the second electrode 7 by welding or the like.

(Insulation sheet 3)
As shown in FIGS. 2 and 4, the insulating sheet 3 is arranged so as to be superposed on the flat plate-shaped shunt resistor 2. The "sheet" means a thin plate, and the material and sheet structure of the insulating sheet 3 are such that the second electrode 7 and the resistor 5 and the conductive plate 4 are electrically insulated from each other. The condition is not particularly limited. As an example, the insulating sheet 3 is a sheet made of an insulating polymer such as polyethylene. Further, the insulating sheet 3 may be separated into a plurality of sheets instead of one sheet. Further, the insulating sheet 3 may or may not be flexible.

As shown in FIG. 4, the length dimension L3 of the insulating sheet 3 is shorter than the length dimension L4 of the shunt resistor 2. As shown in FIG. 4, the surface of the second electrode 7 and the resistor 5 is covered by the insulating sheet 3, while the Y1 side end portion 6a of the surface of the first electrode 6 is not covered by the insulating sheet 3. It is considered to be exposed.

As shown in FIG. 2, for example, the width dimension of the insulating sheet 3 (the length dimension in the X1-X2 direction) is formed to be about the same as the width dimension of the shunt resistor 2, but the width dimension is not limited. Absent.

As shown in FIGS. 2 and 4, the insulating sheet 3 is formed with a through hole 3a having the same size at a position overlapping the through hole 2a formed in the second electrode 7.

Further, in the present embodiment, the insulating sheet 3 has been described as an example of the insulating member, but the insulating layer is provided as a configuration for insulating the second electrode 7, the resistor 5, and the conductive plate 4. It can also be formed by coating on the surfaces of the electrode 7 and the resistor 5. However, by using the insulating sheet 3, it is possible to more reliably electrically insulate the second electrode 7 and the resistor 5 from the conductive plate 4, and the assembly of the shunt resistor module 1 becomes complicated. Not preferable.

(Conductive plate 4)
As shown in FIGS. 2 and 4, the conductive plate 4 is arranged so as to be overlapped on the insulating sheet 3. In this embodiment, the conductive plate 4 has a length dimension L5 similar to that of the shunt resistor 2. The conductive plate 4 may be formed longer in the Y1-Y2 direction than the shunt resistor 2. At this time, the conductive plate 4 extends in the Y2 direction from the Y2 side end of the second electrode 7 of the shunt resistor 2. The material of the conductive plate 4 is not limited, but it is preferably a material having excellent conductivity. For example, the conductive plate 4 is made of the same material as the electrodes 6 and 7, or a material having the same main component. Specifically, the conductive plate 4 can be formed of a Cu plate.

As shown in FIG. 4, the Y1 side end portion 4b of the conductive plate 4 abuts on the Y1 side end portion 6a of the exposed first electrode 6 without being covered by the insulating sheet 3 and is electrically connected. At this time, a convex portion that projects the Y1 side end portion 4b of the conductive plate 4 in the direction of the first electrode 6 (the downward direction shown in FIG. 4) so as to be easily electrically connected to the first electrode 6. It is preferable to have a shape.

As shown in FIGS. 2 and 4, the conductive plate 4 is formed with through holes 4a having the same size at positions overlapping the through holes 2a and 3a in the thickness direction.

The conductive plate 4 has a flat plate shape and is formed long in the Y1-Y2 direction like the shunt resistor 2. The conductive plate 4 may have a form other than the flat plate shape, but by forming the conductive plate shape, it can be electrically connected to the first electrode 6 with high accuracy, and the shunt resistance module 1 can be made thinner. Can be realized.

(Assembly of shunt resistor module 1)
The shunt resistor 2, the insulating sheet 3, and the conductive plate 4 described above are superposed in the thickness direction, and at this time, Y1 of the conductive plate 4 is aligned so that the through holes 2a, 3a, and 4a are continuous in the thickness direction. The side end portion 4b and the first electrode 6 are joined by welding or the like. As a result, the conductive plate 4 and the first electrode 6 are electrically connected, and the insulating sheet 3 is interposed between the second electrode 7, the resistor 5, and the conductive plate 4, and is electrically insulated. It is said that it has been done. The joining method is not limited to welding, and may be the use of a conductive adhesive, solder joining, or the like. Further, as shown in another embodiment described later, it is also possible to screw the first electrode 6 and the conductive plate 4 together. By the above joining, the Y1 side end portion 4b of the conductive plate 4 and the first electrode 6 can be reliably electrically connected. The through hole 1a penetrating from the second electrode 7 of the shunt resistance module 1 to the conductive plate 4 (hereinafter, each continuous through hole 2a, 3a, 4a is described as one through hole) is a shunt resistor. It is also possible to superimpose the vessel 2, the insulating sheet 3 and the conductive plate 4, and to form the conductive plate 4 at once after joining the Y1 side end portion 4b and the first electrode 6.

Except for the joint region between the Y1 side end 4b of the conductive plate 4 and the first electrode 6, as shown in FIG. 4, a fixing member 18 such as a screw is inserted into the through hole 1a to fix the second electrode. The position of 7 can also be fixed together with the insulating sheet 3 and the conductive plate 4. The shunt resistor 2 and the insulating sheet 3 and the insulating sheet 3 and the conductive plate 4 may be joined by using an adhesive or the like.

<Mounting structure of shunt resistor module 1>
FIG. 3 is an enlarged perspective view showing an enlarged connection structure of the shunt resistor module 1 of the present embodiment to the power semiconductor module 10. As shown in FIG. 3, the shunt resistor module 1 of the present embodiment is attached to, for example, the external connection terminal 10a of the power semiconductor module 10.

At this time, as shown in FIGS. 3 and 4, a step is formed between the external connection terminal 10a and the drive substrate 16 located on the surface of the power semiconductor module 10. Therefore, a conductive ring (pedestal) 22 for adjusting the height is interposed between the shunt resistance module 1 and the external connection terminal 10a, and the height of the shunt resistance module 1 is as high as the surface of the drive board 16. It is preferable to adjust so as to be. Further, the shunt resistance module 1 and the external connection terminal 10a are electrically connected via the conductive ring 22.

As shown in FIG. 3, the bus bar 11 is superposed on the upper surface of the shunt resistance module 1. At this time, in a state where the through hole 11a formed in the bus bar 11 is aligned with the through hole 1a of the shunt resistance module 1, the fixing member 18 is penetrated through, for example, the insulating washer 23, the washer 24, and the spring washer 25. It is inserted through the holes 1a and 11a. The tip of the fixing member 18 is a threaded portion 18a, and similarly, the external connection terminal 10a is also threaded. Therefore, when the fixing member 18 is inserted into the through holes 1a and 11a, it can be screwed to the external connection terminal 10a, whereby the shunt resistor module 1 and the bus bar 11 are fixedly supported by the external connection terminal 10a. Can be done.

As shown in FIG. 3, for example, an insulating tube 26 is attached to the peripheral surface of the fixing member 18 except for the screw portion 18a at the tip. By inserting the insulating tube 26 into the fixing member 18 and shrinking it, it can be fixed around the fixing member 18. As shown in FIG. 4, the insulating tube 26 reaches the shunt resistor 2, the insulating sheet 3, the conductive plate 4, and the bus bar 11 in a state where the fixing member 18 is inserted into the through hole 1a. Therefore, when a current flows between the external connection terminal 10a and the bus bar 11 via the shunt resistance module 1, it is possible to prevent a problem that the current flows through the fixing member 18. In addition to the configuration using the insulating tube 26, for example, an insulating material may be coated, sprayed, or vapor-deposited on the surface of the fixing member 18 to form an insulating layer.

As shown in FIG. 3, pin-shaped voltage detection terminals 8a and 8b can be inserted on the surface of the drive board 16 of the power semiconductor module 10 at positions facing the voltage detection terminals 8a and 8b of the shunt resistor module 1. Connection holes 16a and 16b are formed. By inserting the voltage detection terminals 8a and 8b into the connection holes 16a and 16b, the voltage detection terminals 8a and 8b are electrically connected to the connection portions 27a and 27b of the current measurement circuit arranged in the connection holes 16a and 16b. be able to.

As described above, the shunt resistor module 1 of the present embodiment can be attached to the external connection terminal 10a of the power semiconductor module 10, and the voltage detection terminals 8a and 8b are electrically connected to the connection portions 27a and 27b of the current measurement circuit. Can be connected to.

In the current measurement, when a current flows between the power semiconductor module 10 and the bus bar 11 via the shunt resistor module 1, the voltage value between the voltage detection terminals 8a and 8b, that is, the electrode 6 of the shunt resistor 2 , Measure the voltage value between 7. At this time, since the resistance value of the resistor 5 of the shunt resistor 2 is known, the current value can be detected according to Ohm's law. In this way, the shunt resistor module 1 can be used as a current detection device.

<About the effect of this embodiment>
According to the shunt resistance module 1 of the present embodiment, the conductive plates 4 are arranged at intervals in the thickness direction of the shunt resistor 2, and the first electrode 6 and the conductive plate 4 of the shunt resistor 2 are electrically connected. Connected to. As a result, as shown in FIG. 1, when the shunt resistor module 1 is attached to the power semiconductor module 10 and the current is measured, the current path flowing through the shunt resistor module 1 is folded back by the shunt resistor 2 and the conductive plate 4. .. Therefore, as shown in FIG. 4, the current path C1 formed in the shunt resistor 2 and the current path C2 formed in the conductive plate 4 are in opposite directions. At this time, a magnetic flux (magnetic field) is generated in the shunt resistor 2 and the conductive plate 4 according to the right-handed screw rule, but since the current paths C1 and C2 are opposite to each other, the shunt resistor 2 and the conductive plate 4 have a magnetic flux (magnetic flux). The resulting magnetic fluxes rotate in the opposite direction, and the magnetic fluxes can cancel each other out. As a result, the influence of the magnetic flux on the voltage detection terminals 8a and 8b provided on the first electrode 6 and the second electrode 7 can be suppressed, and the current detection can be performed with high accuracy.

In the present embodiment, as shown in FIGS. 2 and 4, the insulating sheet 3 is interposed between the second electrode 7 and the resistor 5 and the conductive plate 4. As a result, the second electrode 7 and the resistor 5 and the conductive plate 4 can be reliably and electrically insulated, and the current path C1 in the opposite direction to the shunt resistor 2 and the conductive plate 4 C2 can be formed with high accuracy, and the effect of canceling the magnetic flux can be enhanced.

Further, in the present embodiment, the shunt resistance module 1 is formed with a through hole 1a from the second electrode 7 to the conductive plate 4 facing the second electrode 7 in the thickness direction, and the through hole 1a is formed. The insulated fixing member 18 is inserted into the structure. As a result, the shunt resistor module 1 can be appropriately fixed and supported, and it is possible to prevent a problem that a current flows between the shunt resistor 2 and the conductive plate 4 via the fixing member 18. Further, the fixing member 18 can connect the bus bar 11 to the shunt resistance module 1.

Further, in the present embodiment, the first electrode 6 and the second electrode 7 are provided with voltage detection terminals 8a and 8b on the side opposite to the conductive plate 4 side (lower side in the drawing of FIG. 4). .. Thereby, the voltage detection terminals 8a and 8b can be appropriately formed. In particular, in the mounting structure of the shunt resistor module 1, the voltage detection terminals 8a and 8b can be easily and surely connected to the current measurement circuit.

Further, in the mounting structure of the shunt resistance module 1 of the present embodiment, the external connection terminal 10a is provided at a position facing the second electrode 7 of the shunt resistance module 1, and the fixing member 18 is inserted through the external connection terminal 10a. The shunt resistance module 1 is fixed to the external connection terminal 10a, and the second electrode 7 is electrically connected to the external connection terminal 10a. As described above, in the present embodiment, the fixed support of the shunt resistor module 1 and the electrical connection to the external connection terminal 10a can be performed at the same time.

Further, in the mounting structure of the shunt resistor module 1 of the present embodiment, the shunt resistor module 1 is fixed to the external connection terminal 10a, and the voltage detection terminals 8a and 8b are connected to the current measurement circuit. In the present embodiment, the drive board 16 of the power semiconductor module 10 is provided with connection holes 16a and 16b into which voltage detection terminals 8a and 8b can be inserted, and connection portions 27a located in the connection holes 16a and 16b. , 27b are connected to the current measurement circuit. Therefore, in the present embodiment, when the shunt resistor module 1 is attached to the external connection terminal 10a, the voltage detection terminals 8a and 8b can be inserted into the connection holes 16a and 16b, and the voltage detection terminals 8a and 8b are inserted. It can be connected to a current measurement circuit. As described above, in the present embodiment, the voltage detection terminals 8a and 8b can be easily and surely connected to the current measurement circuit at the same time as the shunt resistance module 1 is attached to the power semiconductor module 10.

As described above, in the present embodiment, the shunt resistance module 1 and the bus bar 11 can be easily and surely attached to the power semiconductor module 10.

<Form of shunt resistor module of another embodiment>
FIG. 5 is a cross-sectional view of the shunt resistor module 30 showing another embodiment. The shunt resistor module 30 shown in FIG. 5 includes a shunt resistor 31 and a conductive plate 32, but the insulating sheet 3 shown in FIGS. 2 and 4 is not provided. The parts having the same reference numerals as those in FIGS. 2 and 4 have substantially the same configuration. As shown in FIG. 5, the Y1 side end portion 32b of the conductive plate 32 is formed as a convex portion protruding in the direction of the shunt resistor 31 (the direction shown in the drawing), and is formed between the second electrode 7 and the conductive plate 32. There is a predetermined interval.

As shown in FIG. 5, the first fixing member 33 is inserted into the through holes 7a and 32a provided in the second electrode 7 and the conductive plate 32. As a result, the distance between the second electrode 7 and the conductive plate 32 can be maintained at a predetermined dimension. However, it is more reliable by interposing the insulating sheet 3 shown in FIGS. 2 and 4 between the second electrode 7 and the conductive plate 32 without forming an air layer between the second electrode 7 and the conductive plate 32. In addition, it is possible to electrically insulate between the second electrode 7 and the conductive plate 32. The surface of the first fixing member 33 is insulated, similar to the fixing member 18 shown in FIG. As a result, it is possible to suppress a problem that a current flows between the second electrode 7 and the conductive plate 32 via the first fixing member 33.

Further, in the embodiment shown in FIG. 5, a through hole 30a continuous with the first electrode 6 of the shunt resistance module 30 and the Y1 side end portion 32b of the conductive plate 32 is formed, and the through hole 30a has a first through hole 30a. By inserting the fixing member 34 of 2, the first electrode 6 and the Y1 side end portion 32b of the conductive plate 32 are fixedly supported. At this time, the surfaces of the first electrode 6 and the Y1 side end portion 32b of the conductive plate 32 are in contact with each other and are electrically connected. Further, the surface of the second fixing member 34 is preferably conductive. Ordinary screws can be used for the second fixing member 34. As a result, the first electrode 6 and the conductive plate 32 can be more reliably and electrically connected to each other.

Further, the conductive plate 32 shown in FIG. 5 also serves as a bus bar. Therefore, the conductive plate 32 is formed so as to extend in the Y2 direction longer than the Y2 side end portion of the second electrode 7 of the shunt resistor 2. ing. As described above, since the conductive plate 32 also serves as a bus bar, the number of parts can be reduced and the manufacturing cost of the shunt resistor module 30 can be suppressed.
As described above, the present embodiment and the modified examples have been described, but as another embodiment, the above-described embodiments and modified examples may be combined in whole or in part.

Further, the present embodiment is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea. Further, if the technical idea can be realized in another way by the advancement of the technology or another technology derived from it, it may be carried out by using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea.

For example, in the present embodiment, the power semiconductor module 10 is taken as an example of the mounting structure of the shunt resistance module 1, but the electronic component on which the shunt resistance module 1 is mounted may be other than the power semiconductor module 10.
The feature points in the above embodiment are summarized below.

The shunt resistor module according to the above embodiment includes a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor. Is electrically connected to the first electrode, and is arranged at a distance between the second electrode and the resistor, and flows through the shunt resistor. It is characterized by including a conductive member that constitutes a current path opposite to the current path.

Further, in the shunt resistance module of the present embodiment, it is preferable that an insulating member is interposed between the second electrode and the resistor and the conductive member.

Further, in the shunt resistance module of the present embodiment, a through hole is formed from the second electrode to the conductive member at a position facing the second electrode, and the through hole is insulated and fixed. It is preferable that the member is inserted.

Further, in the shunt resistance module of the present embodiment, the conductive member can also serve as a bus bar.

Further, in the shunt resistance module of the present embodiment, it is preferable that the first electrode and the second electrode are provided with voltage detection terminals on the side opposite to the conductive member side.

Further, the mounting structure of the shunt resistance module of the above embodiment is a mounting structure for connecting the shunt resistance module to the current measurement circuit, and an external connection terminal is provided at a position facing the second electrode of the shunt resistance module. It is characterized in that the fixing member described above is inserted, the shunt resistance module is fixed to the external connection terminal, and the second electrode is electrically connected to the external connection terminal. And.

Further, in the mounting structure of the shunt resistor module of the present embodiment, it is preferable that the shunt resistor module is fixed to the external connection terminal and the voltage detection terminal described above is connected to the current measurement circuit.

As described above, the shunt resistor module of the present invention can accurately detect current, and can be applied to, for example, current detection for control applications such as power semiconductor devices and energy management of batteries.

1, 30: Shunt resistance modules 1a, 30a: Through holes 2, 31: Shunt resistor 3: Insulation sheet 4, 32: Conductive plate 5: Resistor 6: First electrode 7: Second electrode 8a, 8b: Voltage detection terminal 10: Power semiconductor module 10a: External connection terminal 11: Bus bar 15: Housing 16: Drive board 16a, 16b: Connection hole 18: Fixing member 22: Conductive ring 26: Insulation tube 27a, 27b: Connection part 33: First fixing member 34: Second fixing member C1, C2: Current path

Claims (7)

A shunt resistor comprising a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor.
It is electrically connected to the first electrode and is arranged at a distance between the second electrode and the resistor to form a current path opposite to the current path flowing through the shunt resistor. A shunt resistance module comprising: The shunt resistance module according to claim 1, wherein an insulating member is interposed between the second electrode and the resistor and the conductive member. The claim is characterized in that a through hole is formed from the second electrode to the conductive member at a position facing the second electrode, and an insulated fixing member is inserted through the through hole. 1 or the shunt resistance module according to claim 2. The shunt resistance module according to any one of claims 1 to 3, wherein the conductive member also serves as a bus bar. The shunt according to any one of claims 1 to 4, wherein the first electrode and the second electrode are provided with a voltage detection terminal on the side opposite to the conductive member side. Resistance module. It is a mounting structure that connects the shunt resistor module to the current measurement circuit.
The shunt resistance module has an external connection terminal at a position facing the second electrode, the fixing member according to claim 3 is inserted, and the shunt resistance module is fixed to the external connection terminal. , A mounting structure of a shunt resistance module, characterized in that the second electrode is electrically connected to the external connection terminal. The mounting structure of the shunt resistor module according to claim 6, wherein the voltage detection terminal according to claim 5 is connected to the current measurement circuit while the shunt resistor module is fixed to the external connection terminal. ..

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