JP2021062389A - Joint device - Google Patents

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JP2021062389A
JP2021062389A JP2019187634A JP2019187634A JP2021062389A JP 2021062389 A JP2021062389 A JP 2021062389A JP 2019187634 A JP2019187634 A JP 2019187634A JP 2019187634 A JP2019187634 A JP 2019187634A JP 2021062389 A JP2021062389 A JP 2021062389A
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base
heat flow
heat
joining
joined
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JP7319165B2 (en
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綾介 後藤
Ryosuke Goto
綾介 後藤
安藤　元彦
Motohiko Ando
元彦 安藤
隆司 関本
Takashi Sekimoto
隆司 関本
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Nippon Avionics Co Ltd
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Nippon Avionics Co Ltd
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Abstract

To provide a joint device capable of surely detecting joint failures of a joined article.SOLUTION: A joined article 115 is mounted on an upper surface of a base 101. The base 101 is composed, for instance, of heat-resistant glass. The base 101 is, for instance, a rectangular parallelepiped. Heat flow sensors 106a, 106b and 106c are provided so as to be brought into contact with the side face of the base 101, and measures a heat flow from the side face of the base 101. The heat flows measured in each of the heat flow sensors 106a, 106b and 106c are measured by a measuring instrument 111 to which the heat flow sensors are connected.SELECTED DRAWING: Figure 1

Description

本発明は、パルスヒート方式の接合装置に関するものである。 The present invention relates to a pulse heat type joining device.

厚膜プリント配線板、薄膜プリント配線板などのリード線の接続、プリント配線板へのＩＣリードの接続などに、パルスヒート方式の接合装置が用いられている。この接合装置では、被接合物を加圧する加熱電極（ヒータチップまたはヒータツール）に取り付けた温度センサ（熱電対）によって加熱電極の温度を測定し、測定された温度が予め設定された温度になるように加熱電極に供給する電流を制御している（特許文献１参照）。 A pulse heat type joining device is used for connecting lead wires of thick-film printed wiring boards, thin-film printed wiring boards, and the like, and connecting IC leads to printed wiring boards. In this joining device, the temperature of the heating electrode is measured by a temperature sensor (thermocouple) attached to the heating electrode (heater chip or heater tool) that pressurizes the object to be joined, and the measured temperature becomes a preset temperature. The current supplied to the heating electrode is controlled in this way (see Patent Document 1).

特開平１１−０５４９０６号公報Japanese Unexamined Patent Publication No. 11-054906

しかしながら、従来の接合装置では、加熱電極の温度を高精度に制御したとしても、必ずしも被接合物に、適切に熱が供給されているとは言えず、例えば、接合不良を見落とすなどのことが発生している。 However, in the conventional joining device, even if the temperature of the heating electrode is controlled with high accuracy, it cannot be said that heat is properly supplied to the object to be joined. For example, a joining defect may be overlooked. It has occurred.

本発明は、以上のような問題点を解消するためになされたものであり、被接合物の接合不良を確実に検出できるようにすることを目的とする。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to ensure that a bonding defect of an object to be joined can be detected.

本発明に係る接合装置は、被接合物が第１面に載置される基台と、基台の上方に向かい合って配置され、接合時に被接合物と当接する加熱電極と、加熱電極に電流を供給する電源と、第１面に隣接する基台の第２面に接して設けられ、基台の第２面からの熱流を測定する熱流センサとを備え、加熱電極は、被接合物を、基台の側に押さえて加圧するパルスヒート方式の電極である。 The joining device according to the present invention has a base on which the object to be joined is placed on the first surface, a heating electrode which is arranged facing above the base and comes into contact with the object to be joined at the time of joining, and a current on the heating electrode. A heat flow sensor provided in contact with the second surface of the base adjacent to the first surface and measuring the heat flow from the second surface of the base is provided, and the heating electrode is provided with an object to be joined. , It is a pulse heat type electrode that presses against the base side to pressurize.

上記接合装置の一構成例において、基台の第２面に、第１面と第２面との境界に沿って、熱流センサが複数設けられている。 In one configuration example of the joining device, a plurality of heat flow sensors are provided on the second surface of the base along the boundary between the first surface and the second surface.

上記接合装置の一構成例において、基台は、耐熱ガラスから構成されている。 In one configuration example of the joining device, the base is made of heat-resistant glass.

上記接合装置の一構成例において、基台の熱流センサが設けられている第２面に、熱流センサを挾んで配置され、基台より高い熱伝導性を有する放熱ブロックをさらに備える。 In one configuration example of the joining device, the heat flow sensor is arranged on the second surface where the heat flow sensor of the base is provided, and a heat radiation block having higher thermal conductivity than the base is further provided.

上記接合装置の一構成例において、放熱ブロックは、溝を備え、基台は、溝に嵌合している。 In one configuration example of the joining device, the heat dissipation block is provided with a groove, and the base is fitted in the groove.

上記接合装置の一構成例において、放熱ブロックを冷却する冷却機構をさらに備える。 In one configuration example of the joining device, a cooling mechanism for cooling the heat dissipation block is further provided.

以上説明したように、本発明によれば、被接合物が第１面に載置される基台の第２面に熱流センサを設けたので、被接合物の接合不良が確実に検出できる。 As described above, according to the present invention, since the heat flow sensor is provided on the second surface of the base on which the object to be joined is placed on the first surface, it is possible to reliably detect the bonding failure of the object to be joined.

図１は、本発明の実施の形態に係る接合装置の構成を示す構成図である。FIG. 1 is a configuration diagram showing a configuration of a joining device according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る接合装置の一部構成を示す斜視図である。FIG. 2 is a perspective view showing a partial configuration of a joining device according to an embodiment of the present invention. 図３は、本発明の実施の形態に係る接合装置の一部構成を示す斜視図である。FIG. 3 is a perspective view showing a partial configuration of the joining device according to the embodiment of the present invention. 図４Ａは、温度センサ１０４を用いた加熱電極１０２の温度変化（ａ）、熱流センサ１０６ａによる測定結果（ｂ）、熱流センサ１０６ｃによる測定結果（ｃ）の一例を示す特性図である。FIG. 4A is a characteristic diagram showing an example of a temperature change (a) of the heating electrode 102 using the temperature sensor 104, a measurement result (b) by the heat flow sensor 106a, and a measurement result (c) by the heat flow sensor 106c. 図４Ｂは、温度センサ１０４を用いた加熱電極１０２の温度変化（ａ）、熱流センサ１０６ａによる測定結果（ｂ）、熱流センサ１０６ｃによる測定結果（ｃ）の一例を示す特性図である。FIG. 4B is a characteristic diagram showing an example of a temperature change (a) of the heating electrode 102 using the temperature sensor 104, a measurement result (b) by the heat flow sensor 106a, and a measurement result (c) by the heat flow sensor 106c. 図５Ａは、温度センサ１０４を用いた加熱電極１０２の温度変化（ａ）、熱流センサ１０６ａによる測定結果（ｂ）、熱流センサ１０６ｂによる測定結果（ｃ）、熱流センサ１０６ｃによる測定結果（ｄ）の一例を示す特性図である。FIG. 5A shows the temperature change (a) of the heating electrode 102 using the temperature sensor 104, the measurement result (b) by the heat flow sensor 106a, the measurement result (c) by the heat flow sensor 106b, and the measurement result (d) by the heat flow sensor 106c. It is a characteristic diagram which shows an example. 図５Ｂは、温度センサ１０４を用いた加熱電極１０２の温度変化（ａ）、熱流センサ１０６ａによる測定結果（ｂ）、熱流センサ１０６ｂによる測定結果（ｃ）、熱流センサ１０６ｃによる測定結果（ｄ）の一例を示す特性図である。FIG. 5B shows the temperature change (a) of the heating electrode 102 using the temperature sensor 104, the measurement result (b) by the heat flow sensor 106a, the measurement result (c) by the heat flow sensor 106b, and the measurement result (d) by the heat flow sensor 106c. It is a characteristic diagram which shows an example. 図６は、制御部１０５、計測器１１１のハードウエア構成を示す構成図である。FIG. 6 is a configuration diagram showing a hardware configuration of the control unit 105 and the measuring instrument 111.

以下、本発明の実施の形態に係る接合装置について図１を参照して説明する。この接合装置は、基台１０１、加熱電極１０２、電源１０３、温度センサ１０４、制御部１０５、熱流センサ１０６ａ，１０６ｂ，１０６ｃを備える。 Hereinafter, the joining device according to the embodiment of the present invention will be described with reference to FIG. This joining device includes a base 101, a heating electrode 102, a power supply 103, a temperature sensor 104, a control unit 105, and heat flow sensors 106a, 106b, 106c.

基台１０１は、被接合物１１５が上面（第１面）に載置される。基台１０１は、例えば、耐熱ガラスから構成されている。また、基台１０１は、例えば直方体とされている。 On the base 101, the object to be joined 115 is placed on the upper surface (first surface). The base 101 is made of, for example, heat-resistant glass. Further, the base 101 is, for example, a rectangular parallelepiped.

加熱電極１０２は、基台１０１の上方に向かい合って配置され、接合時に被接合物１１５と当接する。加熱電極１０２は、例えば鉄系金属、モリブデン、タングステンなどの金属から構成されたヒータチップまたはヒータツールである。加熱電極１０２は、被接合物１１５を、基台１０１の側に押さえて加圧するパルスヒート方式の電極である。図示しない加圧機構により、加熱電極１０２は上下移動可能とされ、基台１０１の第１面との間で、被接合物１１５を挾み、被接合物１１５を基台１０１の側に押し付けて加圧可能とされている。 The heating electrode 102 is arranged so as to face the upper side of the base 101, and comes into contact with the object to be joined 115 at the time of joining. The heating electrode 102 is a heater chip or a heater tool made of, for example, a metal such as iron-based metal, molybdenum, or tungsten. The heating electrode 102 is a pulse heat type electrode that presses the object to be joined 115 toward the base 101 to pressurize it. The heating electrode 102 can be moved up and down by a pressurizing mechanism (not shown), and the object to be joined 115 is sandwiched between the first surface and the first surface of the base 101, and the object to be joined 115 is pressed against the base 101. It is possible to pressurize.

電源１０３は、加熱電極１０２に電流を供給する。温度センサ１０４は、加熱電極１０２の温度を測定する。温度センサ１０４は、例えば、熱電対から構成されている。制御部１０５は、温度センサ１０４が測定した温度をもとに加熱電極１０２に供給する電流を制御する。例えば、温度センサ１０４が測定した温度と、制御部１０５に設定された温度条件との差が０となるように、制御部１０５は、加熱電極１０２に供給する電流を制御する。 The power supply 103 supplies an electric current to the heating electrode 102. The temperature sensor 104 measures the temperature of the heating electrode 102. The temperature sensor 104 is composed of, for example, a thermocouple. The control unit 105 controls the current supplied to the heating electrode 102 based on the temperature measured by the temperature sensor 104. For example, the control unit 105 controls the current supplied to the heating electrode 102 so that the difference between the temperature measured by the temperature sensor 104 and the temperature condition set in the control unit 105 becomes zero.

熱流センサ１０６ａ，１０６ｂ，１０６ｃは、上面に隣接する基台１０１の側面（第２面）に接して設けられ、基台１０１の側面からの熱流を測定する。例えば、ビスマス−テルル系の熱流センサ１０６ａ，１０６ｂ，１０６ｃである。この例では、複数の熱流センサ１０６ａ，１０６ｂ，１０６ｃを設けている。熱流センサ１０６ａ，１０６ｂ，１０６ｃは、基台１０１の側面に、上面と側面との境界に沿って、配列されている。熱流センサ１０６ａ，１０６ｂ，１０６ｃは、基台１０１の側面に接している面と、この面と反対側の面との間の温度差に起因する熱流に応じた信号を出力する。熱流センサ１０６ａ，１０６ｂ，１０６ｃの各々で測定された熱流は、これらが接続する計測器１１１で計測される。 The heat flow sensors 106a, 106b, 106c are provided in contact with the side surface (second surface) of the base 101 adjacent to the upper surface, and measure the heat flow from the side surface of the base 101. For example, bismuth-tellurium heat flow sensors 106a, 106b, 106c. In this example, a plurality of heat flow sensors 106a, 106b, 106c are provided. The heat flow sensors 106a, 106b, 106c are arranged on the side surface of the base 101 along the boundary between the upper surface and the side surface. The heat flow sensors 106a, 106b, 106c output a signal corresponding to the heat flow due to the temperature difference between the surface in contact with the side surface of the base 101 and the surface on the opposite side to this surface. The heat flow measured by each of the heat flow sensors 106a, 106b, 106c is measured by the measuring instrument 111 to which they are connected.

なお、加熱電極１０２は、基台１０１の側方に向かい合って配置することもできる。この場合、被接合物１１５は、基台１０１の側面（第１面）に載置し、熱流センサ１０６ａ，１０６ｂ，１０６ｃは、基台１０１の上面および下面のいずれかの面（第２面）に接して設けることができる。 The heating electrode 102 may be arranged so as to face the side of the base 101. In this case, the object to be joined 115 is placed on the side surface (first surface) of the base 101, and the heat flow sensors 106a, 106b, 106c are mounted on either the upper surface or the lower surface (second surface) of the base 101. Can be provided in contact with.

ここで、図２に例示するように、基台１０１は、放熱ブロック１０７の溝１０８に嵌合して固定することができる。放熱ブロック１０７は、基台１０１より高い熱伝導性を有する材料から構成されている。放熱ブロック１０７は、例えば、銅やアルミニウムなどの金属から構成することができる。この構成とすることで、放熱ブロック１０７の溝１０８の側面は、基台１０１の熱流センサ１０６ａ，１０６ｂ，１０６ｃが設けられている側面に、熱流センサ１０６ａ，１０６ｂ，１０６ｃを挾んで配置される状態となる。なお、放熱ブロック１０７を冷却する冷却機構を用いることもできる。 Here, as illustrated in FIG. 2, the base 101 can be fitted and fixed in the groove 108 of the heat dissipation block 107. The heat radiating block 107 is made of a material having higher thermal conductivity than the base 101. The heat dissipation block 107 can be made of, for example, a metal such as copper or aluminum. With this configuration, the side surface of the groove 108 of the heat dissipation block 107 is in a state where the heat flow sensors 106a, 106b, 106c are arranged on the side surface of the base 101 where the heat flow sensors 106a, 106b, 106c are provided. It becomes. A cooling mechanism for cooling the heat dissipation block 107 can also be used.

また、放熱ブロック１０７は、２つの部分から構成することもできる。例えば、図３に示すように、第１放熱ブロック１０７ａと第２放熱ブロック１０７ｂとから構成することができる。第１放熱ブロック１０７ａには、一体とした状態で溝１０８となる切欠き１０８ａが形成されている。第１放熱ブロック１０７ａの面１７１ａと、第２放熱ブロック１０７ｂの面１７１ｂとを当接させて一体とすることで、放熱ブロック１０７とすることができる。また、ボルト（不図示）などを用いて切欠き１０８ａに基台１０１を固定し、この状態で第１放熱ブロック１０７ａと第２放熱ブロック１０７ｂとを一体とすれば、図２に示す構成とすることができる。 Further, the heat dissipation block 107 can also be composed of two parts. For example, as shown in FIG. 3, it can be composed of a first heat radiating block 107a and a second heat radiating block 107b. The first heat radiating block 107a is formed with a notch 108a that serves as a groove 108 in an integrated state. The heat dissipation block 107 can be formed by bringing the surface 171a of the first heat dissipation block 107a and the surface 171b of the second heat dissipation block 107b into contact with each other and integrating them. Further, if the base 101 is fixed to the notch 108a using a bolt (not shown) or the like and the first heat radiation block 107a and the second heat radiation block 107b are integrated in this state, the configuration shown in FIG. 2 is obtained. be able to.

上述した実施の形態によれば、通電されている加熱電極１０２により加熱される被接合物１１５への熱流量が、熱流センサ１０６ａ，１０６ｂ，１０６ｃにより測定されるので、被接合物１１５に供給されている熱の状態を、正確に把握することができる。熱流センサ１０６ａ，１０６ｂ，１０６ｃの測定結果を用いることで、被接合物１１５に対する加熱の良否判定が可能となる。 According to the above-described embodiment, the heat flow rate to the object to be joined 115 heated by the energized heating electrode 102 is measured by the heat flow sensors 106a, 106b, 106c and is supplied to the object to be joined 115. It is possible to accurately grasp the state of heat. By using the measurement results of the heat flow sensors 106a, 106b, 106c, it is possible to determine the quality of heating of the object to be joined 115.

ここで、基台１０１および基台１０１に対する熱流センサ１０６ａ，１０６ｂ，１０６ｃの配置について、より詳細に説明する。 Here, the arrangement of the heat flow sensors 106a, 106b, and 106c with respect to the base 101 and the base 101 will be described in more detail.

まず、基台の上面に熱流センサを配置し、この上に被接合物が載置される構成とすることで、被接合物に供給される熱流が、最も正確に測定できるものとなる。しかしながら、被接合物には、接合のための圧力が加わるため、上記構成では、熱流センサにも接合の圧力が加わる。このような状態では、接合のための圧力の大きさの違いによる接触熱伝達の変化が、測定結果に影響する。また、加わる圧力のために、熱流センサを破壊してしまう場合もある。これに対し、基台１０１の側面に熱流センサを配置し、基台１０１を伝導する熱流を測定する構成とすることで、上述した圧力による問題が発生しない。 First, by arranging the heat flow sensor on the upper surface of the base and placing the object to be joined on it, the heat flow supplied to the object to be joined can be measured most accurately. However, since the pressure for joining is applied to the object to be joined, the pressure for joining is also applied to the heat flow sensor in the above configuration. In such a state, the change in contact heat transfer due to the difference in the magnitude of the pressure for joining affects the measurement result. In addition, the applied pressure may destroy the heat flow sensor. On the other hand, by arranging the heat flow sensor on the side surface of the base 101 and measuring the heat flow conducted through the base 101, the above-mentioned problem due to the pressure does not occur.

次に、基台の材料について説明する。接合装置による接合においては、通常、被接合物が載置される基台の材質は、断熱材から構成する。これば、加熱電極からの熱量を効率良く被接合物に供給するためでる。仮に、基台を金属などの高い熱伝導率の材料から構成すると、基台側の放熱量が大き過ぎ、被接合物の温度が上がらない。また、この場合、電源が過剰な電流を消費し、電源容量オーバーなどの不都合が生じる。 Next, the material of the base will be described. In joining by a joining device, the material of the base on which the object to be joined is placed is usually composed of a heat insulating material. This is to efficiently supply the amount of heat from the heating electrode to the object to be joined. If the base is made of a material having a high thermal conductivity such as metal, the amount of heat radiated from the base side is too large and the temperature of the object to be joined does not rise. Further, in this case, the power supply consumes an excessive current, which causes inconvenience such as over power supply capacity.

一方、基台の断熱性能が高過ぎると熱流センサへの熱量の移動が起こりにくく、熱流値を検出することができない。実施の形態に係る接合装置の構成では、接合における断熱性と熱流センサの熱流測定とはトレードオフの関係にあるが、これをちょうど良く満たせる熱物性値を有する材質が、耐熱ガラス（代表物性値：熱伝導率１Ｗ／ｍ・ｋ、比熱７５０Ｊ／ｋｇ・Ｋ、密度２．２ｇ／ｃｍ3）であることが、発明者らの実験により突きとめることができた。よく知られているように、熱流センサを用いることでは，熱電対では測定できない微小熱流を測定できる。 On the other hand, if the heat insulating performance of the base is too high, it is difficult for the amount of heat to be transferred to the heat flow sensor, and the heat flow value cannot be detected. In the configuration of the joining device according to the embodiment, there is a trade-off relationship between the heat insulating property in joining and the heat flow measurement of the heat flow sensor, but a material having a thermal physical property value that can satisfy this is a heat-resistant glass (representative physical property value). : It was found by the experiments of the inventors that the thermal conductivity was 1 W / m · k, the specific heat was 750 J / kg · K, and the density was 2.2 g / cm 3). As is well known, by using a heat flow sensor, it is possible to measure a minute heat flow that cannot be measured by a thermocouple.

次に、放熱ブロックについて説明する。基台１０１の熱流センサ１０６ａ，１０６ｂ，１０６ｃが設けられている側面に、これらを挾んで放熱ブロック１０７を配置することで、熱流センサ１０６ａ，１０６ｂ，１０６ｃの表面側と裏面側との温度差を大きく保つことができ、測定の感度を上げることができる。上述したように表面側と裏面側との温度差を大きく保つ観点より、放熱ブロック１０７は、例えば室温の状態を維持するために、可能な範囲で大きな体積とすることが好ましい。また、水冷などによる冷却機構により、冷却することがより好ましい。 Next, the heat dissipation block will be described. By arranging the heat dissipation block 107 on the side surface of the base 101 where the heat flow sensors 106a, 106b, 106c are provided, the temperature difference between the front surface side and the back surface side of the heat flow sensors 106a, 106b, 106c can be determined. It can be kept large and the measurement sensitivity can be increased. As described above, from the viewpoint of keeping the temperature difference between the front surface side and the back surface side large, it is preferable that the heat radiating block 107 has a large volume as much as possible in order to maintain a state of room temperature, for example. Further, it is more preferable to cool by a cooling mechanism such as water cooling.

次に、複数の熱流センサ１０６ａ，１０６ｂ，１０６ｃを用いた、様々な不良判定について説明する。例えば、熱流センサ１０６ａと熱流センサ１０６ｃとの測定結果の違いにより、接合不良を判定することができる。例えば、一方の熱流センサによる測定結果が、他方の熱流センサによる測定結果より低い場合、はんだ溶け不足や異方性導電フィルムの硬化不足などが判定できる。このように、複数の熱流センサを用いることで、より正確な接合良否判定が可能となる。 Next, various defect determinations using the plurality of heat flow sensors 106a, 106b, 106c will be described. For example, a bonding defect can be determined based on the difference in measurement results between the heat flow sensor 106a and the heat flow sensor 106c. For example, when the measurement result by one heat flow sensor is lower than the measurement result by the other heat flow sensor, it can be determined that the solder is insufficiently melted or the anisotropic conductive film is insufficiently cured. In this way, by using a plurality of heat flow sensors, more accurate joint quality determination becomes possible.

また、ヒータチップやヒータツールの平行度偏りに起因する、一端側と他端側との温度バラツキも判定できる。例えば、温度センサ１０４を用いた加熱電極１０２の温度が、図４Ａの（ａ）に示すように変化している場合、上述した平行度偏りがなければ、熱流センサ１０６ａによる測定結果（ｂ）と熱流センサ１０６ｃによる測定結果（ｃ）との間に差はない。これに対し、上述した平行度偏りがある場合、図４Ｂに示すように、熱流センサ１０６ａによる測定結果（ｂ）と熱流センサ１０６ｃによる測定結果（ｃ）との間に差が発生する。このように、異なる箇所に配置した熱流センサの測定結果の差により、ヒータチップやヒータツールの平行度偏りが判定でき、パルスヒートヘッドの稼働状態監視に応用できる。 Further, it is possible to determine the temperature variation between one end side and the other end side due to the parallelism bias of the heater tip and the heater tool. For example, when the temperature of the heating electrode 102 using the temperature sensor 104 changes as shown in FIG. 4A (a), if there is no parallelism bias described above, the measurement result (b) by the heat flow sensor 106a There is no difference from the measurement result (c) by the heat flow sensor 106c. On the other hand, when there is the parallelism bias described above, as shown in FIG. 4B, a difference occurs between the measurement result (b) by the heat flow sensor 106a and the measurement result (c) by the heat flow sensor 106c. In this way, the parallelism bias of the heater tip and the heater tool can be determined from the difference in the measurement results of the heat flow sensors arranged at different locations, and can be applied to the operation state monitoring of the pulse heat head.

また、次に示すように、接合の良否判定を実施することもできる。まず、図５Ａに示すように、基準となる熱流波形（熱流の時間変化）を設定する。この例では、図５Ａの（ａ）に示す、温度センサ１０４で測定される加熱電極１０２の温度の時間変化、熱流センサ１０６ａで測定される熱流の時間変化（ｂ）、熱流センサ１０６ｂで測定される熱流の時間変化（ｃ）、熱流センサ１０６ｃで測定される熱流の時間変化（ｄ）が設定される。また、熱流波形のピーク値における上下限閾値を設定する。 Further, as shown below, it is also possible to carry out a quality determination of joining. First, as shown in FIG. 5A, a reference heat flow waveform (time change of heat flow) is set. In this example, the time change of the temperature of the heating electrode 102 measured by the temperature sensor 104, the time change of the heat flow measured by the heat flow sensor 106a (b), and the time change of the heat flow measured by the heat flow sensor 106b shown in FIG. 5A (a). The time change (c) of the heat flow and the time change (d) of the heat flow measured by the heat flow sensor 106c are set. In addition, the upper and lower thresholds of the peak value of the heat flow waveform are set.

実際の接合処理において、熱流センサ１０６ａ，１０６ｂ，１０６ｃを用いて熱流Ｗ／ｍ2を監視する。この監視において、例えば、図５Ｂに示すように、熱流センサ１０６ａ，１０６ｂ，１０６ｃで測定される熱流ピーク値が、設定されている上下限閾値を超えた場合に、警報を出力する。このようにして警報を出力することで、使用者に、実施中の接合処理について、異常が発生していることを通知できる。なお、基準となる熱流波形に対する測定された熱流波形の乖離量が、設定されている閾値を超えた場合に、警報を出力することもできる。これらの処理は、例えば、計測器１１１に組み込んだ制御プログラムにより実施できる。 In the actual joining process, the heat flow W / m 2 is monitored by using the heat flow sensors 106a, 106b, 106c. In this monitoring, for example, as shown in FIG. 5B, when the heat flow peak value measured by the heat flow sensors 106a, 106b, 106c exceeds the set upper and lower threshold values, an alarm is output. By outputting the alarm in this way, it is possible to notify the user that an abnormality has occurred in the joining process being performed. It is also possible to output an alarm when the amount of deviation of the measured heat flow waveform from the reference heat flow waveform exceeds a set threshold value. These processes can be performed by, for example, a control program incorporated in the measuring instrument 111.

なお、上述した実施の形態における制御部１０５、計測器１１１は、図６に示すように、ＣＰＵ（Central Processing Unit；中央演算処理装置）３０１と主記憶装置３０２と外部記憶装置３０３とネットワーク接続装置３０４となどを備えたコンピュータ機器とし、主記憶装置３０２に展開されたプログラムによりＣＰＵ３０１が動作する（プログラムを実行する）ことで、制御部１０５、計測器１１１における上述した各機能が実現されるようにすることもできる。上記プログラムは、上述した実施の形態で示した制御部１０５、計測器１１１の各機能をコンピュータが実行するためのプログラムである。ネットワーク接続装置３０４は、ネットワーク３０５に接続する。また、各機能は、複数のコンピュータ機器に分散させることもできる。 As shown in FIG. 6, the control unit 105 and the measuring instrument 111 in the above-described embodiment are the CPU (Central Processing Unit) 301, the main storage device 302, the external storage device 303, and the network connection device. As a computer device equipped with 304 and the like, the CPU 301 operates (executes the program) by the program deployed in the main storage device 302, so that the above-mentioned functions of the control unit 105 and the measuring instrument 111 can be realized. It can also be. The above program is a program for a computer to execute each function of the control unit 105 and the measuring instrument 111 shown in the above-described embodiment. The network connection device 304 connects to the network 305. In addition, each function can be distributed to a plurality of computer devices.

また、上述した実施の形態における制御部１０５、計測器１１１は、ＦＰＧＡ（field-programmable gate array）などのプログラマブルロジックデバイス（ＰＬＤ：Programmable Logic Device）により構成することも可能である。 Further, the control unit 105 and the measuring instrument 111 in the above-described embodiment can be configured by a programmable logic device (PLD: Programmable Logic Device) such as an FPGA (field-programmable gate array).

以上に説明したように、本発明によれば、被接合物が第１面に載置される基台の第２面に熱流センサを設けたので、被接合物の接合不良を確実に検出できるようになる。従来は、例えば、ヒータチップやヒータツールの温度を監視することで、被接合物にも所定の加熱がされているものと想定して良否判定をしていた。この場合、加圧が不均等であった場合などの原因により、被接合物に適切な加熱がされず、接合不良が発生していることを見逃す場合があった。これに対し、本発明によれば、被接合物におけける接合不良が確実に検出できる。 As described above, according to the present invention, since the heat flow sensor is provided on the second surface of the base on which the object to be joined is placed on the first surface, it is possible to reliably detect the bonding failure of the object to be joined. Will be. Conventionally, for example, by monitoring the temperature of a heater tip or a heater tool, it is assumed that a predetermined heating is also applied to the object to be joined, and a pass / fail judgment is made. In this case, it may be overlooked that the object to be joined is not properly heated due to reasons such as uneven pressurization, resulting in poor joining. On the other hand, according to the present invention, a joining defect in the object to be joined can be reliably detected.

なお、本発明は以上に説明した実施の形態に限定されるものではなく、本発明の技術的思想内で、当分野において通常の知識を有する者により、多くの変形および組み合わせが実施可能であることは明白である。 The present invention is not limited to the embodiments described above, and many modifications and combinations can be carried out by a person having ordinary knowledge in the art within the technical idea of the present invention. That is clear.

１０１…基台、１０２…加熱電極、１０３…電源、１０４…温度センサ、１０５…制御部、１０６ａ，１０６ｂ，１０６ｃ…熱流センサ、１１１…計測器、１１５…被接合物。 101 ... base, 102 ... heating electrode, 103 ... power supply, 104 ... temperature sensor, 105 ... control unit, 106a, 106b, 106c ... heat flow sensor, 111 ... measuring instrument, 115 ... object to be joined.

Claims (6)

被接合物が第１面に載置される基台と、
前記基台の上方に向かい合って配置され、接合時に前記被接合物と当接する加熱電極と、
前記加熱電極に電流を供給する電源と、
前記第１面に隣接する前記基台の第２面に接して設けられ、前記基台の第２面からの熱流を測定する熱流センサと
を備え、
前記加熱電極は、前記被接合物を、前記基台の側に押さえて加圧するパルスヒート方式の電極であることを特徴とする接合装置。 The base on which the object to be joined is placed on the first surface,
A heating electrode, which is arranged so as to face the upper side of the base and comes into contact with the object to be joined at the time of joining,
A power supply that supplies an electric current to the heating electrode and
A heat flow sensor provided in contact with the second surface of the base adjacent to the first surface and measuring the heat flow from the second surface of the base is provided.
The heating electrode is a bonding device characterized by being a pulse heat type electrode that presses and pressurizes the object to be bonded to the side of the base. 請求項１記載の接合装置において、
前記基台の第２面に、第１面と第２面との境界に沿って、前記熱流センサが複数設けられていることを特徴とする接合装置。 In the joining apparatus according to claim 1,
A joining device characterized in that a plurality of the heat flow sensors are provided on the second surface of the base along the boundary between the first surface and the second surface. 請求項１または２記載の接合装置において、
前記基台は、耐熱ガラスから構成されていることを特徴とする接合装置。 In the joining apparatus according to claim 1 or 2.
The base is a joining device characterized in that it is made of heat-resistant glass. 請求項３記載の接合装置において、
前記基台の前記熱流センサが設けられている第２面に、前記熱流センサを挾んで配置され、前記基台より高い熱伝導性を有する放熱ブロックをさらに備えることを特徴とする接合装置。 In the joining apparatus according to claim 3,
A joining device characterized in that the heat flow sensor is arranged on a second surface of the base on which the heat flow sensor is provided, and a heat radiation block having higher thermal conductivity than the base is further provided. 請求項４記載の接合装置において、
前記放熱ブロックは、溝を備え、前記基台は、前記溝に嵌合していることを特徴とする接合装置。 In the joining apparatus according to claim 4,
A joining device, wherein the heat radiating block is provided with a groove, and the base is fitted in the groove. 請求項４または５記載の接合装置において、
前記放熱ブロックを冷却する冷却機構をさらに備えることを特徴とする接合装置。 In the joining apparatus according to claim 4 or 5,
A joining device further comprising a cooling mechanism for cooling the heat radiation block.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320739A (en) * 1996-06-03 1997-12-12 Nippon Avionics Co Ltd Pulse heat power supply
JP2019005797A (en) * 2017-06-28 2019-01-17 日本アビオニクス株式会社 Ultrasonic welding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320739A (en) * 1996-06-03 1997-12-12 Nippon Avionics Co Ltd Pulse heat power supply
JP2019005797A (en) * 2017-06-28 2019-01-17 日本アビオニクス株式会社 Ultrasonic welding device

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