JP2021057356A - Substrate cleaning device, substrate processing apparatus and recording medium - Google Patents

Abstract

To provide a substrate cleaning device with high cleaning power.SOLUTION: The substrate cleaning device includes a substrate rotation mechanism retaining a substrate for rotation and a nozzle jetting ultrasonic cleaning liquid toward the rotated substrate. The nozzle is rotatable within a plane vertical to the substrate and within a plane parallel to the substrate, respectively.SELECTED DRAWING: Figure 2C

Description

The present invention relates to a substrate cleaning apparatus, a substrate processing apparatus and a recording medium.

Conventionally, an apparatus for cleaning a semiconductor substrate using ultrasonic waves has been known (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2001-53047

The cleaning apparatus of Patent Document 1 has a problem that the area where the cleaning liquid reaches the semiconductor substrate is limited and the cleaning power is not sufficient.

The present invention has been made in view of such problems, and the subject of the present invention is a substrate cleaning apparatus having a high cleaning power, a substrate processing apparatus provided with such a substrate cleaning apparatus, and such a substrate cleaning apparatus. It is an object of the present invention to provide a recording medium on which a program for cleaning a substrate is recorded.

According to one aspect of the present invention, a substrate rotation mechanism for holding and rotating a substrate and a nozzle for injecting an ultrasonic cleaning liquid toward the rotated substrate are provided, and the nozzle is perpendicular to the substrate. Provided is a substrate cleaning device that is rotatable in a plane and is rotatable in a plane parallel to the substrate.

It is desirable that the nozzle sprays an ultrasonic cleaning solution onto the edge and / or bevel of the substrate.

It is desirable that the nozzle can move up and down.

It is desirable that the nozzle can be raised to a position where the ultrasonic cleaning liquid is sprayed on the upper surface of the substrate and can be lowered to a position where the ultrasonic cleaning liquid is sprayed on the lower surface of the substrate.

It is desirable that the nozzle can swivel in a plane perpendicular to the substrate so that the ultrasonic cleaning liquid can be ejected from the inside to the outer periphery of the substrate.

It is desirable that the nozzle injects an ultrasonic cleaning liquid onto the substrate rotation mechanism.

It is desirable to include a cleaning tool that comes into contact with the substrate while rotating to clean the surface of the substrate, and the nozzle sprays the ultrasonic cleaning liquid onto the cleaning tool.

It is desirable that the angle formed by the injection direction of the ultrasonic cleaning liquid from the nozzle and the longitudinal direction of the cleaning tool is larger than 0 degrees and less than 90 degrees.

It is desirable that the nozzle sprays a mist-like ultrasonic cleaning liquid.

It is desirable that the substrate rotation mechanism holds the substrate in a non-horizontal direction.

The substrate rotation mechanism holds and rotates the substrate in the horizontal direction, the nozzle is fixed to a first axis extending in the vertical direction, and the first axis rotates about the axis thereof, thereby causing the substrate rotation mechanism. It is desirable for the nozzle to rotate in a plane horizontal to the substrate.

The substrate rotation mechanism holds and rotates the substrate in the horizontal direction, the nozzle is fixed to a second axis extending in the horizontal direction, and the second axis rotates about its axis, thereby causing the substrate to rotate. It is desirable for the nozzle to swivel in a plane perpendicular to the substrate.

Further, according to another aspect of the present invention, there is provided a substrate processing apparatus including a substrate polishing apparatus for polishing a substrate and the above-mentioned substrate cleaning apparatus for cleaning a polished substrate.

Further, according to another aspect of the present invention, the step of holding the substrate in the substrate rotation mechanism and rotating the substrate, and raising the nozzle communicating with the ultrasonic cleaning liquid source to a position higher than the upper surface of the substrate, and the substrate. The step of moving the nozzle inward in the horizontal direction and turning the nozzle so that the injection port of the nozzle faces in a direction having a sharp incident angle with respect to the edge of the upper surface of the substrate, and the step of turning the nozzle from the nozzle. A step of injecting an ultrasonic cleaning liquid toward the upper surface of the substrate, a step of moving the nozzle to the outside in the horizontal direction of the substrate, a step of lowering the nozzle to a position lower than the lower surface of the substrate, and horizontal of the substrate. A step of moving the nozzle inward in the direction and further turning the nozzle so that the injection port of the nozzle faces in a direction having a sharp incident angle with respect to the edge of the lower surface of the substrate, and a step of turning the nozzle from the nozzle to the substrate. A step of injecting an ultrasonic cleaning liquid toward the lower surface, a step of moving the nozzle to the outside in the horizontal direction of the substrate, a step of making the nozzle substantially the same height as the bevel of the substrate, and aiming at the bevel of the substrate. In order to execute a substrate cleaning method including a step of swirling the nozzle so that the injection port of the nozzle faces, and a step of injecting an ultrasonic cleaning liquid from the nozzle toward the bevel of the substrate. A non-temporary computer-readable recording medium is provided in which a command is given to the device to record a program for causing the computer to perform the operation of the substrate rotation mechanism and the mechanism for moving the nozzle.

Since the nozzle that injects the ultrasonic cleaning liquid can be swiveled, it is possible to clean a wide area of the substrate and the cleaning power is improved.

Schematic top view of the substrate processing apparatus. Enlarged view of the side surface of the substrate W. The perspective view which shows the schematic structure of the substrate cleaning apparatus 4 which concerns on 1st Embodiment. The top view which shows the schematic structure of the substrate cleaning apparatus 4 which concerns on 1st Embodiment. The side view which shows the schematic structure of the substrate cleaning apparatus 4 which concerns on 1st Embodiment. The side view which shows the schematic structure of the substrate cleaning apparatus 4 which concerns on 1st Embodiment. It is a figure which shows the state of injecting an ultrasonic cleaning liquid from a nozzle 435 to the lower surface of a substrate W. It is a figure which shows the state of injecting an ultrasonic cleaning liquid from a nozzle 435 to the upper surface edge of a substrate W. It is a figure which shows the state of injecting an ultrasonic cleaning liquid from a nozzle 435 to the lower surface edge of a substrate W. It is a figure which shows the state of injecting an ultrasonic cleaning liquid from a nozzle 435 to a bevel of a substrate W. The figure which shows the specific configuration example of the ultrasonic cleaning liquid supply device 42. It is a figure which shows the state which sprays an ultrasonic cleaning liquid from the inside of a substrate W toward the outer circumference. The flowchart which shows an example of the processing operation of the substrate cleaning apparatus 4. The perspective view which shows the schematic structure of the substrate cleaning apparatus 4'according to 2nd Embodiment. The top view which shows the schematic structure of the substrate cleaning apparatus 4'according to 2nd Embodiment. The side view which shows the schematic structure of the substrate cleaning apparatus 4'according to 2nd Embodiment. It is a figure which shows the state of injecting an ultrasonic cleaning liquid from a nozzle 435 to the lower surface of a substrate W. The front view which shows the schematic structure of the substrate cleaning apparatus 4 ″ which concerns on 3rd Embodiment. The side view which shows the schematic structure of the substrate cleaning apparatus 4 ″ which concerns on 3rd Embodiment. The front view which shows the schematic structure of the modification of the substrate cleaning apparatus 4 ″. The side view which shows the schematic structure of the modification of the substrate cleaning apparatus 4 ″. The side view which shows the schematic structure of the modification of the substrate cleaning apparatus 4 ″. The figure which shows the state of spraying an ultrasonic cleaning liquid from a nozzle 435. The perspective view which shows the schematic structure of the substrate cleaning apparatus 4 ″.

Hereinafter, embodiments according to the present invention will be specifically described with reference to the drawings.

(First Embodiment)
FIG. 1 is a schematic top view of the substrate processing apparatus according to the embodiment. This substrate processing device is used in the manufacturing process of semiconductor wafers with a diameter of 300 mm or 450 mm, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory). , Various substrates are processed. Further, the shape of the substrate is not limited to a circular shape, and may be a rectangular shape (square shape) or a polygonal shape.

Here, the "edge" and "bevel" of the substrate W will be described. FIG. 1A is an enlarged side view of the substrate W. As shown in the figure, in the present specification, the “edge” of the substrate W refers to a flat portion Wa near the outer periphery of the substrate surface, and more specifically, it is considered to be a flat portion Wa within a predetermined distance from the edge of the substrate W. Can be done. Further, in the present specification, the “bevel” of the substrate W is a curved surface portion Wb (FIG. 2 (b)) or a chamfered portion Wc and a side surface portion Wd (FIG. 2 (a)) having an angle from the substrate surface outside the edge. Refers to.

The substrate processing apparatus of the present embodiment includes a substantially rectangular housing 1, a load port 2 on which a substrate cassette for stocking a large number of substrates is placed, and one or more (four in the embodiment shown in FIG. 1) substrates. It includes a polishing device 3, one or more (two in the embodiment shown in FIG. 1) substrate cleaning device 4, a substrate drying device 5, transfer mechanisms 6a to 6d, and a control unit 7.

The load port 2 is arranged adjacent to the housing 1. An open cassette, a SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the load port 2. The SMIF pod and FOUP are closed containers that can maintain an environment independent of the external space by storing the substrate cassette inside and covering it with a partition wall. Examples of the substrate include semiconductor wafers and the like.

The substrate polishing device 3 for polishing the substrate, the substrate cleaning device 4 for cleaning the polished substrate, and the substrate drying device 5 for drying the cleaned substrate are housed in the housing 1. The substrate polishing apparatus 3 is arranged along the longitudinal direction of the substrate processing apparatus, and the substrate cleaning apparatus 4 and the substrate drying apparatus 5 are also arranged along the longitudinal direction of the substrate processing apparatus.

Further, each of the substrate cleaning device 4 and the substrate drying device 5 is a substantially rectangular housing (not shown), and the substrate to be processed is removed from the opening / closing portion provided in the housing portion so as to be openable / closable by a shutter mechanism. It may be configured to be taken in and out. Alternatively, as a modification example, the substrate cleaning device 4 and the substrate drying device 5 may be integrated, and the substrate cleaning process and the substrate drying process may be continuously performed in one unit.

In the present embodiment, the substrate cleaning device 4 performs contact cleaning using a pen-type cleaning tool and non-contact cleaning using ultrasonic cleaning water. Although details will be described later, contact cleaning using a pen-type cleaning tool means that in the presence of a cleaning liquid, the lower end contact surface of a columnar pen-type cleaning tool extending in the vertical direction is brought into contact with a substrate to rotate the cleaning tool. However, it is moved in one direction to scrub the surface of the substrate.

The substrate drying device 5 is a spin drying unit that ejects IPA steam from a moving injection nozzle toward a horizontally rotating substrate to dry the substrate, and further rotates the substrate at a high speed to dry the substrate by centrifugal force. Can be used.

The transport mechanism 6a is arranged in the area surrounded by the load port 2, the substrate polishing device 3 and the substrate drying device 5 located on the load port 2 side. Further, the transfer mechanism 6b is arranged in parallel with the substrate polishing device 3, the substrate cleaning device 4, and the substrate drying device 5. The transport mechanism 6a receives the substrate before polishing from the load port 2 and delivers it to the transport mechanism 6b, or receives the dried substrate taken out from the substrate drying device 5 from the transport mechanism 6b.

A transport mechanism 6c for transferring the substrate between the two substrate cleaning devices 4 is arranged between the two substrate cleaning devices 4, and the substrate cleaning device 4 and the substrate drying device 5 are located between the substrate cleaning device 4 and the substrate drying device 5. A transport mechanism 6c for transferring the substrate between the devices 5 is arranged.

Further, inside the housing 1, a control unit 7 that controls the movement of each device of the substrate processing device is arranged. In the present embodiment, the mode in which the control unit 7 is arranged inside the housing 1 will be described, but the present invention is not limited to this, and the control unit 7 may be arranged outside the housing 1. For example, the control unit 7 operates the spindle 41 that holds and rotates the substrate, the ejection start and end timing of the nozzle that injects the ultrasonic cleaning liquid toward the substrate, or the nozzle, as in the embodiment described later. It can also be configured to control the vertical movement of the vertical plane and the swirling movement in the horizontal plane of the vertical plane. The control unit may have a memory in which a predetermined program is stored, a CPU (Central Processing Unit) that executes the program of the memory, and a control module realized by the CPU executing the program. The control module and the control unit are configured to be able to communicate with a higher-level controller (not shown) that controls the board processing device and other related devices in an integrated manner, and can exchange data with the database of the higher-level controller. .. Here, the storage medium constituting the memory stores various programs such as various setting data and processing programs. As the storage medium, a known computer-readable memory such as ROM or RAM, or a disc-shaped storage medium such as a hard disk, CD-ROM, DVD-ROM or flexible disk can be used.

2A to 2D are a perspective view, a top view, and a side view showing a schematic configuration of the substrate cleaning device 4 according to the first embodiment, respectively. The substrate cleaning device 4 includes a spindle 41 and an ultrasonic cleaning liquid supply device 42, which are housed in a housing (not shown) having a shutter. Each part in the substrate cleaning device 4 is controlled by the control unit 7 of FIG.

The spindle 41 supports the peripheral edge of the substrate W with its surface facing up, and is rotated in a horizontal plane. More specifically, the peripheral portion of the substrate W is positioned in the gripping groove formed on the outer peripheral side surface of the top 41a provided on the upper part of the spindle 41 and pressed inward to rotate (rotate) the substrate 41a. W rotates. Here, the "top" is paraphrased as a "grip portion" for gripping the substrate. Also, "spindle" can be paraphrased as "roller". The rotation direction and rotation speed of the spindle 41 are controlled by the control unit 7 of FIG. The rotation speed may be constant or variable.

In addition, in order to prevent the ultrasonic cleaning liquid described later from scattering, a cup (not shown) that is outside the spindle 41 and covers the periphery of the substrate W may be provided. The cup may be configured such that the downflow airflow supplied into the unit from the FFU at the top of the cleaning unit (not shown) passes through a hole provided in the cup and escapes downward. With such a configuration, it is possible to more reliably prevent the cleaning liquid and the ultrasonic cleaning liquid from scattering.

Hereinafter, the ultrasonic cleaning liquid supply device 42 will be described in detail with reference to FIGS. 2C and 2D. The ultrasonic cleaning liquid supply device 42 has a support shaft 431, a movable shaft 432, a head 433, a swivel shaft 434, and a nozzle 435.
The support shaft 431 extends in the vertical direction and is fixed.

The movable shaft 432 extends upward from the upper part of the support shaft 431 and can be raised and lowered, and can rotate (rotate around the axis, the same applies hereinafter). When the vertical movement of the nozzle 435 is not required, the support shaft 431 and the movable shaft 432 may be integrated.

The head 433 is fixed to the upper end of the movable shaft 432. Further, a swivel shaft 434 extending in the horizontal direction penetrates the head 433.

The nozzle 435 is attached to the tip of the head 433. It can be said that the nozzle 435 is attached to the movable shaft 432 via the head 433, and it can be said that the nozzle 435 is attached to the swivel shaft 434 via the head 433.

Then, the nozzle 435 injects the cleaning liquid toward the rotated substrate W. The type of cleaning solution is not limited, and may be, for example, pure water or a chemical solution. Further, the temperature of the cleaning liquid is not limited, and the temperature may be adjustable (for example, from 0 ° C to 80 ° C).

In the following, an oscillator (not shown) is provided inside the nozzle 435 or the head 433, and a cleaning liquid to which ultrasonic waves are applied (hereinafter, also referred to as an ultrasonic cleaning liquid) is ejected. The frequency of the ultrasonic wave is also not limited, and may be, for example, a high frequency (about 800 kHz) to an ultra-high frequency (about 5 MHz). Generally, the higher the frequency, the smaller foreign matter (particles) can be removed.

In the present embodiment, the swivel shaft 434 rotates so that the nozzle 435 held by the head 433 can swivel in the vertical plane (in other words, in the plane perpendicular to the substrate W) (broken line in FIG. 2C). Refer to the arrow, hereinafter, this turn is also called a vertical turn). By such vertical rotation around the rotation shaft 434, as shown in FIG. 2B, the ultrasonic cleaning liquid can be sprayed from the side near the nozzle 435 of the substrate W to the side far from the nozzle 435. Specifically, even if the movable shaft 432 is in a fixed position (the height of the nozzle 435 is constant), it is desirable that the ultrasonic cleaning liquid can be sprayed from one end of the substrate W to the other by turning in the vertical direction.

Further, by rotating the movable shaft 432, the nozzle 435 held by the head 433 can rotate in a horizontal plane (in other words, in a plane parallel to the substrate W) (see the broken line in FIG. 2B, hereinafter, This turn is also called a lateral turn). By such lateral rotation around the movable shaft 432, as shown in FIG. 2B, the ultrasonic cleaning liquid can be ejected in an arc shape from the left side to the right side of the rotation shaft 434 on the substrate W.

Since the movable shaft 432 can be raised and lowered with respect to the support shaft 431, as shown in FIG. 2C, the angle within the vertical plane of the nozzle 435 (the angle formed by the injection direction and the movable shaft 432) is kept constant. By changing the height of the nozzle 435, the position where the ultrasonic cleaning liquid is applied can be changed on the surface of the substrate W.
Further, by arbitrarily adjusting the height of the nozzle 435 and the angle of vertical rotation, it becomes possible to supply the ultrasonic cleaning liquid to a desired position according to the injection pressure of various ultrasonic cleaning liquids. Further, the landing position of the ultrasonic cleaning liquid on the substrate may be scanned by changing the height of the nozzle 435 and / or the angle of vertical rotation during cleaning.

Further, by moving the movable shaft 432 up and down, the nozzle 435 held by the head 433 can move from a position higher to a position lower than the upper surface of the substrate W. When the nozzle 435 rises to a position higher than the upper surface of the substrate W, the ultrasonic cleaning liquid is sprayed onto the upper surface of the substrate W (FIG. 2D). That is, as shown in FIG. 2D, the movable shaft 432 can move up and down and can turn in the vertical direction. On the other hand, when the nozzle 435 descends to a position lower than the lower surface of the substrate W, the ultrasonic cleaning liquid is sprayed onto the lower surface of the substrate W (FIG. 3). Similar to the case where the ultrasonic cleaning liquid is sprayed on the upper surface of the substrate W, the injection of the ultrasonic cleaning liquid from one end to the other of the lower surface of the substrate W may be realized only by the vertical rotation of the nozzle 435, and the nozzle 435 may be sprayed. It may be realized only by vertical movement, or it may be realized by combining vertical rotation and vertical movement.

Each member of the ultrasonic cleaning liquid supply device 42 is controlled by a nozzle moving mechanism (not shown), and the nozzle 435 moves. In one embodiment, the nozzle moving mechanism includes, for example, a driving mechanism that generates a driving force such as a cylinder or a motor, and the driving force from the driving mechanism is used to raise, lower, rotate, and rotate the movable shaft 432, and the swivel shaft 434. It can be a mechanism including a conversion mechanism (for example, a link mechanism, a planetary gear mechanism, etc.) that converts the rotation into.

With the above mechanism, the ultrasonic cleaning liquid can be sprayed onto a wide area of the substrate W. For example, as shown in FIGS. 4A to 4C, the edges and bevels of the substrate W can also be cleaned by moving the movable shaft 432 up and down and turning it in the vertical direction. Specifically, by raising the nozzle 435 to a position higher than the upper surface of the substrate W and rotating the nozzle 435 in the vertical direction so that the nozzle 435 faces slightly downward, the ultrasonic cleaning liquid can be sprayed on the edge of the upper surface of the substrate W (FIG. 4A). ). On the contrary, by lowering the nozzle 435 to a position lower than the upper surface of the substrate W and rotating the nozzle 435 in the vertical direction so that the nozzle 435 faces slightly upward, the ultrasonic cleaning liquid can be sprayed on the edge of the lower surface of the substrate W (FIG. 4B). Further, by setting the nozzle 435 at the same height as the substrate W and rotating the nozzle 435 in the vertical direction so that the nozzle 435 is oriented horizontally, the ultrasonic cleaning liquid can be injected onto the bevel of the substrate W (FIG. 4C).

The mechanism for rotating the nozzle 435 in the vertical direction, the horizontal direction, and the vertical movement is not limited to the above.

When cleaning the substrate W, the ultrasonic cleaning liquid is sprayed onto the substrate W while rotating the substrate W and rotating the nozzle 435 in the vertical direction and / or in the horizontal direction. At this time, various controls such as changing the output, the scanning speed, the flow rate, and the amount of dissolved gas may be performed according to the injection position (the position where the ultrasonic cleaning liquid lands on the substrate W).

Further, as shown in FIG. 5A, the support shaft 431 and the movable shaft 432 may be connected by a swivel shaft 436 extending in the horizontal direction. As a result, the movable shaft 432 can swivel in a vertical plane with respect to the support shaft 431 with the swivel shaft 436 as the axis. By combining with the vertical rotation of the nozzle 435, the ultrasonic cleaning liquid can be ejected from the inside (closer to the center) to the outer circumference (closer to the edge) of the substrate W (FIG. 5B).

By injecting the ultrasonic cleaning liquid toward the outer periphery in this way, the ultrasonic cleaning liquid contaminated by cleaning the substrate W can be quickly discharged without going to the inside of the substrate W, and the cleaning power is improved.

The substrate cleaning device 4 described above operates as follows, for example.
FIG. 5C is a flowchart showing an example of the processing operation of the substrate cleaning device 4. The control unit 7 or another computer may instruct the substrate cleaning device 3 (particularly the mechanism for moving the spindle 41 and the nozzle 435) to perform a part or all of this flowchart. The command may be issued by executing a predetermined program.

First, the spindle 41 as the substrate rotation mechanism holds and rotates the substrate W (step S1).

Then, as the support shaft 431 rises, the nozzle 435 communicating with the ultrasonic cleaning liquid source rises to a position higher than the upper surface of the substrate W. Next, the movable shaft 432 swivels in the vertical plane about the swivel shaft 436, so that the nozzle 435 moves to the inside of the substrate W in the horizontal direction. Further, the head 433 swivels in the vertical plane about the swivel shaft 434, so that the nozzle 435 faces outward. As a result, as shown in FIG. 5A, the injection port of the nozzle 435 faces in a direction having an acute angle of incidence with respect to the edge of the upper surface of the substrate W (step S2).

In this state, the ultrasonic cleaning liquid is sprayed from the nozzle 435 toward the edge of the upper surface of the substrate W (step S3). At this time, the incident angle of the ultrasonic cleaning liquid with respect to the substrate W surface becomes an acute angle.

When the injection of the ultrasonic liquid, that is, the cleaning of the edge of the upper surface of the substrate W is completed, the movable shaft 432 swivels in the vertical plane about the swivel shaft 436, so that the nozzle 435 moves to the outside in the horizontal direction of the substrate W ( Step S4).

Then, as the support shaft 431 descends, the nozzle 435 descends to a position lower than the lower surface of the substrate W. Next, the movable shaft 432 swivels in the vertical plane about the swivel shaft 436, so that the nozzle 435 moves to the inside of the substrate W in the horizontal direction. Further, the head 433 swivels in the vertical plane about the swivel shaft 434, so that the nozzle 435 faces outward (step S5). As described above, the injection port of the nozzle 435 faces in a direction having an acute angle of incidence with respect to the edge of the lower surface of the substrate W.

In this state, the ultrasonic cleaning liquid is sprayed from the nozzle 435 toward the edge of the lower surface of the substrate W (step S6). At this time, the incident angle of the ultrasonic cleaning liquid with respect to the back surface of the substrate W becomes an acute angle.

When the injection of the ultrasonic liquid, that is, the cleaning of the edge on the back surface of the substrate W is completed, the movable shaft 432 swivels in the vertical plane around the swivel shaft 436, so that the nozzle 435 moves to the outside in the horizontal direction of the substrate W ( Step S7).

Then, as the support shaft 431 rises, the nozzle 435 rises to the same position as the substrate W. Next, the head 433 swivels in the vertical plane about the swivel shaft 434, so that the nozzle 435 is oriented horizontally and is in the state shown in FIG. 4C (step S8).

In this state, the ultrasonic cleaning liquid is sprayed from the nozzle 435 toward the bevel of the substrate W (step S9). When the injection of the ultrasonic cleaning liquid, that is, the cleaning of the bevel is completed, the substrate W is removed from the spindle 41 (step S10).

As described above, in the first embodiment, the nozzle 435 can be swiveled in the vertical direction and swiveled in the horizontal direction. Therefore, a wide area of the substrate W can be cleaned, and the cleaning power is improved.

The target of injection of the ultrasonic cleaning liquid is not limited to the substrate W. Since the nozzle 435 can be swiveled in the vertical direction and the horizontal direction, it is possible to inject an ultrasonic cleaning liquid onto a part of the substrate cleaning device 4 (for example, a spindle 41 or a cup), and cleaning these can also be performed.

(Second embodiment)
The second embodiment described below relates to a substrate cleaning device 4 including a roll-type cleaning member.

6A to 6C are a perspective view, a top view, and a side view showing a schematic configuration of the substrate cleaning device 4'according to the second embodiment, respectively. Hereinafter, the differences from the first embodiment will be mainly described.

The substrate cleaning device 4'includes a roll-type cleaning tool 451 and a roll-type cleaning tool 452 arranged immediately below the roll-type cleaning tool 451. The roll-type cleaners 451 and 452 are elongated and preferably extend from the edge of the substrate W to the opposite edge and pass through the center of the substrate W. The nozzle 435 swivels in the vertical direction and / or in the horizontal direction while injecting an ultrasonic cleaning liquid onto the substrate W (more specifically, the side closer to the nozzle 435 than the roll-type cleaning tools 451 and 452), while the roll-type cleaning tool 451 and 452 cleans each surface while contacting the upper surface and the lower surface of the substrate W, respectively.

In this case, the injection direction from the nozzle 435 may be parallel to or perpendicular to the longitudinal direction of the roll-type cleaning tools 451 and 452, but as shown in FIG. 6B, the injection direction of the roll-type cleaning tools 451 and 452. It is desirable that the angle between the longitudinal direction and the injection direction is greater than 0 degrees and less than 90 degrees).

Further, as shown in FIG. 6C, the rotation direction of the roll-type cleaning tool 451 and the injection direction from the nozzle 435 may coincide with each other in the vicinity where the roll-type cleaning tool 451 contacts the substrate W. It does not have to be.
However, considering the rapid supply of the ultrasonic cleaning liquid to the contact portion between the roll type cleaning tool 451 and the substrate W and the rapid discharge of the ultrasonic cleaning liquid that has passed through the contact portion, the rotation direction of the roll type cleaning tool 451 and the nozzle. It is desirable that the injection direction from 435 is the same.

Further, as shown in FIG. 7, the nozzle 435 is lowered to a position lower than the lower surface of the substrate W, so that the ultrasonic cleaning liquid is ejected to the lower surface of the substrate W. Even when the ultrasonic cleaning liquid is sprayed onto the lower surface of the substrate W, even if the rotation direction of the roll-type cleaning tool 452 and the injection direction from the nozzle 435 coincide with each other in the vicinity where the roll-type cleaning tool 452 contacts the substrate W. It may or may not match. However, it is desirable that they match the same as the upper surface of the substrate W.

As described above, in the present embodiment, not only the cleaning with the ultrasonic cleaning liquid but also the roll type cleaning tools 451 and 452 are used for cleaning. Therefore, the detergency is improved. Further, since the nozzle 435 can be swiveled in the vertical direction and the horizontal direction, the ultrasonic cleaning liquid can be sprayed onto the roll-type cleaning tools 451 and 452.

(Third Embodiment)
Both the first and second embodiments described above have in mind that the substrate W is held in the horizontal direction. On the other hand, the third embodiment described below holds the substrate W in the non-horizontal direction.

8A and 8B are a front view and a side view showing a schematic configuration of the substrate cleaning device 4 ″ according to the third embodiment, respectively. The substrate cleaning device 4 ″ includes two spindles 41 that hold and rotate the lower side of the substrate W, and two spindles 41 that hold and rotate the upper side. By arranging these spindles 41 in the same vertical plane, the substrate W is held in the vertical direction.

Further, the substrate cleaning device 4 ″ may include four ultrasonic cleaning liquid supply devices 42A to 42D. The ultrasonic cleaning liquid supply device 42A is arranged vertically above the center of the substrate W, and ejects the ultrasonic cleaning liquid downward from its nozzle 435A. The ultrasonic cleaning liquid supply device 42B is arranged below the center of the substrate W in the vertical direction, and ejects the ultrasonic cleaning liquid upward from its nozzle 435B. The ultrasonic cleaning liquid supply device 42C is arranged diagonally above the center of the substrate W, and ejects the ultrasonic cleaning liquid diagonally downward from the nozzle 435C toward the center of the substrate W. The ultrasonic cleaning liquid supply device 42D is arranged diagonally below the center of the substrate W, and ejects the ultrasonic cleaning liquid diagonally upward from the nozzle 435D toward the center of the substrate W.

Although not shown, at least a part of the ultrasonic cleaning liquid supply devices 42A to 42D has the structure described in the first embodiment, and is in the plane perpendicular to the substrate W about the swivel shaft 434. It is desirable to be able to swivel in, swivel in a plane parallel to the substrate W about the movable shaft 432, and / or move up and down.

The substrate cleaning device 4 ″ may be provided with at least one ultrasonic cleaning liquid supply device 42, and the number and arrangement thereof are not particularly limited.

As a modification, roll-type cleaning tools 451 and 452 may be provided as in the second embodiment (FIGS. 9A and 9B). Further, by not arranging the upper spindle 41 and the lower spindle 41 in the same vertical plane, the substrate W may be held in an oblique direction (FIG. 10), and a roll-type washer is provided. May be (not shown).
As described above, the substrate W may be held and rotated in the non-horizontal direction.

(Other embodiments)
As shown in FIG. 11, the ultrasonic cleaning liquid may be sprayed (sprayed) in the form of mist from the nozzle 435. By spraying and supplying the ultrasonic cleaning liquid obtained from the vibration energy, it is possible to remove particles on the surface of the substrate W while suppressing damage to the substrate W. In particular, it is necessary to lower the frequency of ultrasonic waves (for example, several tens of kHz to 500 kHz) in order to remove large particles, and in that case, the substrate W may be damaged, but it is damaged by spraying in a mist form. Can be suppressed.

FIG. 12 is a perspective view showing a schematic configuration of a substrate cleaning device 4 ″ ″ that holds and rotates the substrate W with a chuck claw. The substrate cleaning device 4 ″ is provided with a chuck claw 511 and a rotation drive shaft 512 in place of the spindle 41 shown in FIG. 2A and the like.

The chuck claw 511 is a holding member provided so as to grip the outer peripheral end portion (edge portion) of the substrate W and hold the substrate W. An interval is provided between the adjacent chuck claws 511 so as not to hinder the movement of the robot hand (not shown) that conveys the substrate W. The chuck claws 511 are each connected to the rotation drive shaft 512 so that the surface of the substrate W can be held horizontally.

The rotation drive shaft 512 is configured so that it can rotate around an axis extending perpendicular to the surface of the substrate W, and the substrate W can be rotated in a horizontal plane by rotation around the axis of the rotation drive shaft 512. ing. The rotation direction and rotation speed of the rotation drive shaft 512 are controlled by the control unit 7 of FIG. The rotation speed may be constant or variable. Further, a rotary cup that is outside the chuck claw 511 and covers the periphery of the substrate W and rotates in synchronization with the rotary drive shaft 512 may be provided.

In such a configuration, the ultrasonic cleaning liquid may be sprayed onto the chuck claw 511 or the rotary cup. Here, the flow of gas flowing into the housing from the FFU unit (not shown) provided in the upper part of the housing of the substrate cleaning device 4 or the shutter mechanism for taking in and out the substrate provided in the housing is: It is possible to discharge the substrate from the discharge portion at the lower part of the housing of the substrate cleaning device 4 so that the downflow is formed in the housing. Further, the rotary cup described above may be provided with a drain hole for draining the drainage liquid, and the downflow is discharged from the drainage portion at the lower part of the housing through the drainage hole, and the ultrasonic cleaning liquid is injected into the rotary cup. Then, the washed drainage of the rotary cup is received from the drainage hole below the rotary cup into the liquid receiving container located below the rotary cup along the flow of the downflow airflow, and this is received in the drainage pipe. It is also possible to ensure that it is discharged from. With such a configuration, particles that tend to adhere to the rotating cup and the substrate chuck claw 511 can be reliably removed to prevent recontamination of the substrate, and the outer peripheral edge portion (edge portion) of the substrate is also reliably removed. Can be expected to be washed.

As another configuration example of the substrate cleaning device, instead of rotating the substrate W with the spindle 41 or the chuck claw 511, the substrate W may be supported on the stage from below to rotate the stage. Further, as the cleaning tool, a so-called pencil sponge type cleaning tool may be used instead of the roll type cleaning tool illustrated in FIG. 6A or the like, and cleaning may be performed while swinging on the substrate W. Further, one surface (for example, the upper surface) of the substrate W may be cleaned with a pencil sponge type cleaning tool, and the other surface (for example, the lower surface) may be cleaned with a roll type cleaning tool. Moreover, each aspect described in this specification may be combined appropriately.

The above-described embodiment is described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention belongs to carry out the present invention. For example, in the substrate cleaning apparatus, while the substrate is held by the holding mechanism, the substrate is cleaned with an ultrasonic cleaning liquid in the same manner as the nozzle described in the above embodiment, and then the substrate is continuously rotated as it is. The IPA liquid may be sprayed onto the substrate from the IPA nozzle to dry the substrate. Alternatively, as the substrate processing apparatus of the above embodiment, a chemical mechanical polishing apparatus (CMP apparatus) for the substrate is shown, but the present invention is not limited to this, and for example, a bevel polishing apparatus for polishing the bevel portion of the substrate or a substrate. The above-mentioned substrate cleaning apparatus can also be adopted for a plating apparatus and the like. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments and should be the broadest scope according to the technical ideas defined by the claims.

3 Substrate polishing device 4, 4', 4'', 4'''Substrate cleaning device 41 Spindle 42, 42A to 42D Ultrasonic cleaning liquid supply device 431 Support shaft 432 Movable shaft 433 Head 434 Swivel shaft 435, 435A to 435D Nozzle 436 Swivel shaft 451,452 Roll type cleaning tool 511 Chuck claw 512 Rotation drive shaft

Claims (14)

A board rotation mechanism that holds and rotates the board,
A nozzle for injecting an ultrasonic cleaning liquid toward the rotated substrate is provided.
A substrate cleaning device in which the nozzle is rotatable in a plane perpendicular to the substrate and is rotatable in a plane parallel to the substrate. The substrate cleaning apparatus according to claim 1, wherein the nozzle sprays an ultrasonic cleaning liquid onto the edge and / or bevel of the substrate. The substrate cleaning device according to claim 1 or 2, wherein the nozzle can move up and down. The third aspect of claim 3, wherein the nozzle can be raised to a position where the ultrasonic cleaning liquid is sprayed on the upper surface of the substrate, and can be lowered to a position where the ultrasonic cleaning liquid is sprayed on the lower surface of the substrate. Board cleaning device. The substrate cleaning apparatus according to any one of claims 1 to 4, wherein the nozzle can swivel in a plane perpendicular to the substrate, so that an ultrasonic cleaning liquid can be ejected from the inside to the outer periphery of the substrate. The substrate cleaning apparatus according to any one of claims 1 to 5, wherein the nozzle injects an ultrasonic cleaning liquid onto the substrate rotating mechanism. A cleaning tool that comes into contact with the substrate while rotating to clean the surface of the substrate is provided.
The substrate cleaning device according to claim 6, wherein the nozzle injects an ultrasonic cleaning liquid onto the cleaning tool. The substrate cleaning apparatus according to claim 6 or 7, wherein the angle formed by the injection direction of the ultrasonic cleaning liquid from the nozzle and the longitudinal direction of the cleaning tool is greater than 0 degrees and less than 90 degrees. The substrate cleaning device according to any one of claims 1 to 8, wherein the nozzle ejects a mist-like ultrasonic cleaning liquid. The substrate cleaning device according to any one of claims 1 to 9, wherein the substrate rotation mechanism holds the substrate in a non-horizontal direction. The substrate rotation mechanism holds and rotates the substrate in the horizontal direction.
Claims 1 to 10 wherein the nozzle is fixed to a first axis extending in the vertical direction, and the first axis rotates about its axis so that the nozzle rotates in a plane horizontal to the substrate. The substrate cleaning apparatus according to any one of. The substrate rotation mechanism holds and rotates the substrate in the horizontal direction.
Claims 1 to 11 wherein the nozzle is fixed to a second axis extending in a horizontal direction, and the second axis rotates about an axis thereof so that the nozzle rotates in a plane perpendicular to the substrate. The substrate cleaning device according to any one of. A substrate polishing device that polishes the substrate and
A substrate processing apparatus comprising the substrate cleaning apparatus according to any one of claims 1 to 12, which cleans the polished substrate. The step of holding the board in the board rotation mechanism and rotating it,
The nozzle communicating with the ultrasonic cleaning liquid source is raised to a position higher than the upper surface of the substrate, the nozzle is moved inward in the horizontal direction of the substrate, and an acute angle of incidence is set with respect to the edge of the upper surface of the substrate. A step of turning the nozzle so that the injection port of the nozzle faces the holding direction, and
A step of injecting an ultrasonic cleaning solution from the nozzle toward the upper surface of the substrate,
A step of moving the nozzle to the outside in the horizontal direction of the substrate,
The nozzle is lowered to a position lower than the lower surface of the substrate, the nozzle is moved inward in the horizontal direction of the substrate, and the nozzle is ejected in a direction having an acute angle of incidence with respect to the edge of the lower surface of the substrate. The step of turning the nozzle so that the mouth faces,
A step of injecting an ultrasonic cleaning solution from the nozzle toward the lower surface of the substrate,
A step of moving the nozzle to the outside in the horizontal direction of the substrate,
A step of making the nozzle substantially the same height as the bevel of the substrate and turning the nozzle so that the injection port of the nozzle faces the bevel of the substrate.
To give a command to the substrate cleaning apparatus to move the substrate rotating mechanism and the nozzle in order to execute a substrate cleaning method including a step of injecting an ultrasonic cleaning liquid from the nozzle toward the bevel of the substrate. A non-temporary computer-readable recording medium that records a program that causes a computer to perform the operations of the mechanism.

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