JP2021048375A5 - - Google Patents

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Publication number
JP2021048375A5
JP2021048375A5 JP2019171820A JP2019171820A JP2021048375A5 JP 2021048375 A5 JP2021048375 A5 JP 2021048375A5 JP 2019171820 A JP2019171820 A JP 2019171820A JP 2019171820 A JP2019171820 A JP 2019171820A JP 2021048375 A5 JP2021048375 A5 JP 2021048375A5
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JP
Japan
Prior art keywords
substrate
unit
processing
processing unit
bonding apparatus
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JP2019171820A
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English (en)
Japanese (ja)
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JP2021048375A (ja
JP7328848B2 (ja
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Publication of JP2021048375A5 publication Critical patent/JP2021048375A5/ja
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JP2019171820A 2019-09-20 2019-09-20 ダイボンディング装置および半導体装置の製造方法 Active JP7328848B2 (ja)

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Application Number Priority Date Filing Date Title
JP2019171820A JP7328848B2 (ja) 2019-09-20 2019-09-20 ダイボンディング装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019171820A JP7328848B2 (ja) 2019-09-20 2019-09-20 ダイボンディング装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2021048375A JP2021048375A (ja) 2021-03-25
JP2021048375A5 true JP2021048375A5 (enrdf_load_html_response) 2022-08-08
JP7328848B2 JP7328848B2 (ja) 2023-08-17

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JP2019171820A Active JP7328848B2 (ja) 2019-09-20 2019-09-20 ダイボンディング装置および半導体装置の製造方法

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JP (1) JP7328848B2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102706412B1 (ko) * 2021-11-24 2024-09-11 세메스 주식회사 다이 본딩 장치 및 다이 본딩 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246793A (ja) * 2001-02-16 2002-08-30 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2003142882A (ja) * 2001-11-02 2003-05-16 Matsushita Electric Ind Co Ltd 電子部品実装ラインにおける基板搬送装置および基板搬送方法
JP4682994B2 (ja) * 2007-02-23 2011-05-11 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP5590530B2 (ja) * 2010-08-03 2014-09-17 富士機械製造株式会社 基板印刷システム
JP7065650B2 (ja) * 2018-03-12 2022-05-12 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

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