JP2021044605A - Oscillator, electronic apparatus, and movable body - Google Patents

Abstract

To provide an oscillator that can output an accurate frequency signal, and an electronic apparatus and a movable body including the oscillator.SOLUTION: An oscillator 1 comprises: a first container 2; a second container 5; a vibration piece 6; a temperature sensor 71; an oscillation circuit 72; a first circuit element 7; a frequency control circuit 40; a second circuit element 4; and a heat insulating member 9. The second container 5 is accommodated in the first container 2. The vibration piece 6 and the temperature sensor 71 are accommodated in the second container 5. The oscillation circuit 72 causes the vibration piece 6 to oscillate and generates a temperature-compensated oscillation signal based on a result of detection performed by the temperature sensor 71. The first circuit element 7 is accommodated in the second container 5. The second circuit element 4 is accommodated in the first container 2. The second circuit element 4 is arranged overlapping the second container in plan view. The heat insulating member 9 is located between the second container and the second circuit element and arranged separated from the second circuit element.SELECTED DRAWING: Figure 1

Description

The present invention relates to oscillators, electronic devices and mobiles.

Patent Document 1 describes an outer package, an inner package housed in the outer package, a vibrating piece housed in the inner package, and a circuit element housed in the outer package and arranged on the inner package. And the oscillators with. Further, in the oscillator of Patent Document 1, a temperature sensor is included in the circuit element, and the frequency of the output signal is corrected based on the temperature detected by the temperature sensor.

Japanese Unexamined Patent Publication No. 2017-175202

However, in the oscillator of Patent Document 1, since the circuit element including the temperature sensor is located outside the inner package accommodating the vibrating piece, a temperature difference between the temperature sensor and the vibrating piece is likely to occur, and the output signal is corrected. It becomes difficult to perform with high accuracy. Therefore, the frequency accuracy of the output signal may be lowered.

The oscillator according to the application example of the present invention includes the first container and
The second container housed in the first container and
The vibrating piece housed in the second container and
A first circuit element housed in the second container, including a temperature sensor and an oscillation circuit that oscillates the vibrating piece and generates a temperature-compensated oscillation signal based on the detection result of the temperature sensor. ,
A second circuit element housed in the first container, including a frequency control circuit for controlling the frequency of the oscillation signal, and arranged so as to overlap the second container in a plan view.
It includes a heat insulating member located between the second container and the second circuit element and arranged apart from the second circuit element.

In the oscillator according to the application example of the present invention, the first container is a first base substrate having a first recess and a first lid bonded to the first base substrate so as to close the opening of the first recess. And have
The second container and the second circuit element are arranged in the first recess, and the second container and the second circuit element are arranged.
The second container has a second base substrate having a second recess and a second lid bonded to the second base substrate so as to close the opening of the second recess, and the second lid. Is preferably fixed to the first base substrate in a posture toward the second circuit element side.

In the oscillator according to the application example of the present invention, it is preferable that the heat insulating member has a lower thermal conductivity than the second lid.

In the oscillator according to the application example of the present invention, it is preferable that the heat insulating member covers the surface of the second container on the second circuit element side.

In the oscillator according to the application example of the present invention, the second container is located on the opposite side of the second circuit element and has a mounting surface mounted on the first container.
The heat insulating member preferably covers a surface other than the mounting surface of the second container.

The oscillator according to the application example of the present invention includes a first base substrate and a first lid bonded to the first base substrate, and has a first internal space and a first container.
A second container housed in the first internal space and fixed to the first base substrate,
The vibrating piece housed in the second container and
A first circuit element housed in the second container, including a temperature sensor and an oscillation circuit that oscillates the vibrating piece and generates a temperature-compensated oscillation signal based on the detection result of the temperature sensor. ,
A second circuit element fixed to the first base substrate, including a frequency control circuit for controlling the frequency of the oscillation signal, and arranged side by side with the second container in a plan view.
A heat insulating member located between the second container and the first lid and arranged apart from the first lid is provided.

In the oscillator according to the application example of the present invention, it is preferable that the heat insulating member is located between the second container and the second circuit element and is arranged away from the second circuit element.

In the oscillator according to the application example of the present invention, the second container is located on the opposite side of the first lid and has a mounting surface mounted on the first container.
The heat insulating member preferably covers the entire surface of the second container other than the mounting surface.

In the oscillator according to the application example of the present invention, the first container and
The second container housed in the first container and
The vibrating piece housed in the second container and
The temperature sensor housed in the second container and
A first circuit element housed in the second container, including an oscillating circuit that oscillates the vibrating piece and generates a temperature-compensated oscillating signal based on the detection result of the temperature sensor.
A second circuit element housed in the first container and including a frequency control circuit for controlling the frequency of the oscillation signal, and
A first space located between the second container and the second circuit element in the first container and accommodating the first space for accommodating the second container and the second circuit element in the first container. It is equipped with a partition member that divides it into two spaces.
The second container and the second circuit element are arranged so as to overlap each other in a plan view.
The pressure in the first space is lower than the pressure in the second space.

The electronic device according to the application example of the present invention includes the above-mentioned oscillator and the above-mentioned oscillator.
It is characterized by including a signal processing circuit that performs signal processing based on the output signal of the oscillator.

The mobile body according to the application example of the present invention includes the above-mentioned oscillator and
It is characterized by including a signal processing circuit that performs signal processing based on the output signal of the oscillator.

It is sectional drawing which shows the oscillator of 1st Embodiment. It is a top view which shows the oscillator of FIG. It is a top view which shows the temperature compensation type crystal oscillator which the oscillator of FIG. 1 has. It is a circuit diagram of the 2nd circuit element which the oscillator of FIG. 1 has. It is sectional drawing which shows the modification of the oscillator shown in FIG. It is sectional drawing which shows the oscillator of 2nd Embodiment. It is sectional drawing which shows the oscillator of 3rd Embodiment. It is sectional drawing which shows the oscillator of 4th Embodiment. It is sectional drawing which shows the oscillator of 5th Embodiment. It is a top view which shows the oscillator of FIG. It is a perspective view which shows the personal computer of 6th Embodiment. It is a perspective view which shows the automobile of 7th Embodiment.

Hereinafter, preferred embodiments of the oscillator, electronic device and mobile body of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>
FIG. 1 is a cross-sectional view showing the oscillator of the first embodiment. FIG. 2 is a plan view showing the oscillator of FIG. FIG. 3 is a plan view showing a temperature-compensated crystal oscillator included in the oscillator of FIG. FIG. 4 is a circuit diagram of the second circuit element included in the oscillator of FIG. FIG. 5 is a cross-sectional view showing a modified example of the oscillator shown in FIG. For convenience of explanation, each figure shows an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. Further, in the following, the positive side in the Z-axis direction is also referred to as "upper", and the negative side in the Z-axis direction is also referred to as "lower". Further, the plan view from the Z-axis direction, that is, the thickness direction of the vibrating piece 6 described later is also simply referred to as "plan view".

The oscillator 1 shown in FIG. 1 includes an outer package 2 as a first container, a temperature-compensated crystal oscillator 3 (TCXO) housed in the outer package 2, a second circuit element 4, and discrete components 81 and 82, and temperature. It has a heat insulating member 9 that covers the compensating crystal oscillator 3. Further, the temperature-compensated crystal oscillator 3 has an inner package 5 as a second container, a vibrating piece 6 housed in the inner package 5, and a first circuit element 7.

The outer package 2 is joined to the first base substrate 21 having a recess 211 as a first recess that opens on the upper surface, and to the upper surface of the first base substrate 21 so as to close the opening of the recess 211 via a joining member 23. It has a first lid 22 and the like. An airtight internal space S2 is formed inside the outer package 2 by a recess 211, and the temperature-compensated crystal oscillator 3 and the second circuit element 4 are housed in the internal space S2. Although not particularly limited, the first base substrate 21 can be made of ceramics such as alumina, and the first lid 22 can be made of a metal material such as Kovar. That is, the first lid 22 has a higher thermal conductivity than the first base substrate 21.

Further, the recess 211 is composed of a plurality of recesses, and in the illustrated configuration, a recess 211a that opens on the upper surface of the first base substrate 21 and a recess 211b that opens on the bottom surface of the recess 211a and has an opening smaller than that of the recess 211a. It has a recess 211c that opens to the bottom surface of the recess 211b and has a smaller opening than the recess 211b, and a recess 211d that opens to the bottom of the recess 211c and has a smaller opening than the recess 211c. However, the configuration of the recess 211 is not particularly limited.

Then, the second circuit element 4 is fixed to the bottom surface of the recess 211b so as to cover the opening of the recess 211c, and the temperature-compensated crystal oscillator 3 is fixed to the bottom surface of the recess 211c so as to cover the opening of the recess 211d. ing. Further, two discrete parts 81 and 82, which are single circuit parts, are fixed to the bottom surface of the recess 211d. According to such an arrangement, the second circuit element 4, the temperature-compensated crystal oscillator 3, and the discrete components 81 and 82 are arranged so as to be overlapped in the outer package 2 in the Z-axis direction, that is, in the height direction of the oscillator 1. Can be done. Therefore, the second circuit element 4, the temperature-compensated crystal oscillator 3, and the discrete components 81 and 82 can be compactly housed in the outer package 2, and the oscillator 1 can be miniaturized.

In particular, in the present embodiment, as shown in FIG. 2, in a plan view from the Z-axis direction, the entire area of each of the discrete parts 81 and 82 overlaps with the temperature-compensated crystal oscillator 3, and the temperature-compensated crystal oscillator 3 The entire area of No. 3 overlaps with the second circuit element 4. As a result, the displacement of the discrete components 81 and 82, the temperature-compensated crystal oscillator 3 and the second circuit element 4 in the X-axis and Y-axis directions is suppressed, and the outer package 2 spreads in the X-axis and Y-axis directions. It can be suppressed, and the oscillator 1 can be further miniaturized. However, the present invention is not limited to this, and a part of the discrete parts 81 and 82 may protrude outward from the outer edge of the temperature-compensated crystal oscillator 3 in a plan view from the Z-axis direction, or the temperature-compensated crystal oscillator 3 may be used. A part of the second circuit element 4 may protrude outward from the outer edge of the second circuit element 4.

Further, as shown in FIG. 1, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, and a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211c, and the lower surface of the first base substrate 21 is arranged. A plurality of external terminals 243 are arranged in the. The internal terminals 241 and 242 and the external terminals 243 are electrically connected via wiring (not shown) formed in the first base substrate 21. Further, each of the plurality of internal terminals 241 is electrically connected to the second circuit element 4 via the bonding wire BW1, and each of the plurality of internal terminals 242 is a temperature compensation type via the conductive bonding member B1. It is electrically connected to the crystal oscillator 3.

The atmosphere of the internal space S2 is not particularly limited, but is preferably a reduced pressure state, particularly a vacuum state, in which the internal space S2 is replaced with an inert gas such as nitrogen or argon and decompressed with respect to the atmospheric pressure. As a result, the heat insulating property of the outer package 2 is improved, and the oscillator 1 is less susceptible to the influence of the external temperature. Further, heat exchange between the inner package 5 housed in the outer package 2 and the second circuit element 4, especially heat exchange due to convection, is suppressed. Therefore, it is possible to prevent the temperature sensor 71 and the vibrating piece 6 included in the first circuit element 7 from being unevenly heated by the heat of the second circuit element 4. That is, it is possible to suppress the generation of a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the heat of the second circuit element 4. Therefore, the oscillator 1 with high accuracy can be obtained.

However, the atmosphere of the internal space S2 is not limited to this, and may be, for example, an atmospheric pressure state or a pressurized state. Further, the internal space S2 is not replaced with an inert gas such as nitrogen or argon, and may be filled with air, that is, air. Further, the internal space S2 is not airtight and may communicate with the outside of the outer package 2.

As shown in FIG. 1, the temperature-compensated crystal oscillator 3 includes an inner package 5 mounted on the first base substrate 21, a vibrating piece 6 housed in the inner package 5, and a first circuit element 7. Have. The inner package 5 is joined to the second base substrate 51 having a recess 511 as a second recess opening on the upper surface via a joining member 53 to the upper surface of the second base substrate 51 so as to close the opening of the recess 511. It has a second lid 52 and a second lid 52. An airtight internal space S5 is formed in the inner package 5 by the recess 511, and the vibration piece 6 and the first circuit element 7 are housed in the internal space S5. Although not particularly limited, the second base substrate 51 can be made of ceramics such as alumina, and the second lid 52 can be made of a metal material such as Kovar. That is, the second lid 52 has a higher thermal conductivity than the second base substrate 51.

Further, the recess 511 is composed of a plurality of recesses, and in the illustrated configuration, a recess 511a that opens on the upper surface of the second base substrate 51 and a recess 511b that opens on the bottom surface of the recess 511a and has an opening smaller than that of the recess 511a. It has a recess 511c that opens to the bottom surface of the recess 511b and has a smaller opening than the recess 511b, and a recess 511d that opens to the bottom surface of the recess 511c and has a smaller opening than the recess 511c. However, the configuration of the recess 511 is not particularly limited.

The vibrating piece 6 is fixed to the bottom surface of the recess 511b, and the first circuit element 7 is fixed to the bottom surface of the recess 511d. According to such an arrangement, the vibrating piece 6 and the first circuit element 7 can be arranged so as to be overlapped in the inner package 5 in the Z-axis direction, that is, in the height direction of the oscillator 1. Therefore, these can be compactly housed in the inner package 5, and the temperature-compensated crystal oscillator 3 can be miniaturized, and the oscillator 1 can be miniaturized. The arrangement of the vibrating piece 6 is not limited to this, and may be fixed to the upper surface of the first circuit element 7, for example.

Further, a plurality of internal terminals 541 are arranged on the bottom surface of the recess 511a, a plurality of internal terminals 542 are arranged on the bottom surface of the recess 511c, and a plurality of external terminals 543 are arranged on the lower surface of the second base substrate 51. There is. These internal terminals 541, 542 and external terminals 543 are electrically connected via wiring (not shown) formed in the second base substrate 51. Further, each of the plurality of internal terminals 541 is electrically connected to the vibrating piece 6 via the bonding wire BW2, and each of the plurality of internal terminals 542 is electrically connected to the first circuit element 7 via the bonding wire BW3. It is connected to the. However, the connection method between the vibrating piece 6 and the internal terminal 541 and the connection method between the first circuit element 7 and the internal terminal 542 are not particularly limited.

The atmosphere of the internal space S5 is not particularly limited, but is preferably a reduced pressure state, particularly a vacuum state, in which the internal space S5 is replaced with an inert gas such as nitrogen or argon and decompressed with respect to the atmospheric pressure. As a result, the viscous resistance is reduced, and the vibrating piece 6 can be vibrated efficiently. However, the atmosphere of the internal space S5 is not limited to this, and may be in an atmospheric pressure state or a pressurized state. As a result, heat transfer due to convection is likely to occur in the internal space S5, the temperature difference between the vibrating piece 6 and the temperature sensor 71 described later can be made smaller, and the temperature detection accuracy of the vibrating piece 6 by the temperature sensor 71 can be improved. Increase. Further, the internal space S5 is not replaced with an inert gas such as nitrogen or argon, and may be filled with air, that is, air. Further, the internal space S5 is not airtight and may communicate with the internal space S2.

The vibrating piece 6 is an AT-cut crystal vibrating piece. Since the AT-cut crystal vibrating piece has a third-order frequency temperature characteristic, it is excellent in frequency stability. As shown in FIG. 3, the vibrating piece 6 has a rectangular crystal substrate 60 cut out by AT cut, and an electrode 61 arranged on the surface of the crystal substrate 60. Further, the electrodes 61 are arranged on the first excitation electrode 621 arranged on the upper surface of the crystal substrate 60 and the second excitation electrode 621 arranged on the lower surface of the crystal substrate 60 and facing the first excitation electrode 621 via the crystal substrate 60. It has an excitation electrode 631 and. Further, the electrode 61 is the upper surface of the crystal substrate 60, and the first pad electrode 622 and the second pad electrode 632 arranged side by side on the edge thereof, the first excitation electrode 621 and the first pad electrode 622. It has a first extraction electrode 623 for electrically connecting the second extraction electrode 623 and a second extraction electrode 633 for electrically connecting the second excitation electrode 631 and the second pad electrode 632.

Such a vibrating piece 6 is joined to the bottom surface of the recess 511b via a joining member B2 at one end thereof. Then, the first pad electrode 622 and the second pad electrode 632 are electrically connected to the internal terminal 541 via the bonding wire BW2, respectively. The first pad electrode 622 and the second pad electrode 632 may be electrically connected to the inner package 5 not via a bonding wire but via a conductive adhesive. The joining member B2 is not particularly limited, and may be, for example, a conductive joining member typified by a metal bump, a solder, a brazing material, a metal paste, or a conductive resin adhesive, or an epoxy-based or silicone-based bonding member. It may be an insulating bonding member typified by various resin adhesives such as a system and a polyimide system, but a conductive bonding member is preferable.

Since the conductive joining member contains a metal material, it has a higher thermal conductivity than an insulating joining member that does not contain a metal material typified by a resin adhesive. Therefore, the vibrating piece 6 and the first circuit element 7 are likely to be thermally coupled via the joining member B2 and the second base substrate 51, and the temperature difference between them can be suppressed to be smaller. Therefore, the temperature of the vibrating piece 6 can be accurately detected by the temperature sensor 71.

However, the configuration of the vibrating piece 6 is not particularly limited. For example, the plan view shape of the crystal substrate 60 is not limited to a rectangle. In addition to the AT-cut crystal vibrating piece, the vibrating piece 6 includes an SC-cut crystal vibrating piece, a BT-cut crystal vibrating piece, a sound fork-shaped crystal vibrating piece, an elastic surface wave resonator, other piezoelectric vibrating pieces, and MEMS (Micro). Electro Mechanical Systems) A resonant element or the like can also be used.

Also, instead of the crystal substrate, for example, lithium niobate (LiNbO ₃ ), _{lithium niobate (LiTaO 3} ), lead zirconate titanate (PZT), lithium tetraboate (Li ₂ B ₄ O ₇ ), langasite (La ₃ Ga ₅ SiO ₁₄ ), potassium niobate (KNbO ₃ ), gallium _{niobate (GaPO 4} ), gallium arconate (GaAs), aluminum nitride (AlN), zinc oxide (ZnO, Zn ₂ O ₃ ), titanium acid barium (BaTiO _3), lead titanate (PbPO _3), potassium sodium niobate _{((K, Na) NbO 3} ), bismuth ferrite (BiFeO _3), sodium niobate (NaNbO _3), bismuth titanate _(Bi 4 Ti _{Various piezoelectric substrates such as 3} O ₁₂ ) and sodium niobate titanate (Na _0.5 Bi _0.5 TiO ₃ ) may be used, and for example, a substrate other than the piezoelectric substrate such as a silicon substrate may be used.

As shown in FIGS. 1 and 3, the first circuit element 7 includes a temperature sensor 71 and an oscillation circuit 72. The oscillation circuit 72 has a function of oscillating the vibration piece 6 and generating a temperature-compensated oscillation signal based on the detection result of the temperature sensor 71, particularly the detected temperature. That is, the oscillation circuit 72 is electrically connected to the vibration piece 6, and the oscillation circuit unit 721 that oscillates the vibration piece 6 by amplifying the output signal of the vibration piece 6 and feeding back the amplified signal to the vibration piece 6. It has a temperature compensation circuit unit 722 that compensates the temperature so that the frequency fluctuation of the output signal becomes smaller than the frequency temperature characteristic of the vibration piece 6 itself based on the temperature information output from the temperature sensor 71.

As the oscillation circuit 72, for example, an oscillation circuit such as a Pierce oscillation circuit, an inverter type oscillation circuit, a Colpitts oscillation circuit, or a Hartley oscillation circuit can be used. Further, as the temperature compensation circuit unit 722 of the oscillation circuit 72, for example, even if the oscillation frequency of the oscillation circuit unit 721 is adjusted by adjusting the capacity of the variable capacitance circuit connected to the oscillation circuit unit 721. Alternatively, the frequency of the output signal of the oscillation circuit unit 721 may be adjusted by a PLL circuit or a direct digital synthesizer circuit.

By accommodating both the temperature sensor 71 and the vibrating piece 6 in the inner package 5 in this way, the temperature sensor 71 can be arranged in the same space as the vibrating piece 6 and in the vicinity of the vibrating piece 6. Therefore, the temperature of the vibrating piece 6 can be detected more accurately by the temperature sensor 71, and the temperature compensation by the oscillation circuit 72 becomes more accurate.

In the present embodiment, the temperature sensor 71 is composed of an IC temperature sensor and is built in the first circuit element 7, but the present invention is not limited to this. That is, the temperature sensor 71 may be a discrete component provided separately from the first circuit element 7. In other words, the first circuit element 7 is not limited to one composed of a single element, and may be configured to include, for example, an IC and a discrete component that is a separate body from the IC. Good. In this case, the temperature sensor 71 can be composed of, for example, a thermistor, a thermocouple, a platinum temperature sensor, a thermocouple, a digital temperature sensor, or the like. Further, the arrangement of the temperature sensor 71 is not particularly limited as long as it can detect the temperature of the vibrating piece 6 in the internal space S5, and is, for example, on the upper surface of the second base substrate 51 or the first circuit element 7. Can be placed.

The temperature-compensated crystal oscillator 3 has been described above. The temperature-compensated crystal oscillator 3 has four external terminals 543 described above, one is a terminal 543a for the power supply voltage of the first circuit element 7, and one is with respect to the power supply voltage, as shown in FIG. The ground terminal 543b, one is a terminal 543c for an oscillation signal output from the oscillation circuit 72, and one is a terminal 543d for an output signal of the temperature sensor 71. However, the number and use of the external terminals 543 are not particularly limited.

As shown in FIG. 1, the temperature-compensated crystal oscillator 3 as described above is arranged with the lower surface of the second base substrate 51 facing the lower surface of the recess 211c, and the lower surface of the second base substrate 51 is the joining member B1. It is fixed to the bottom surface of the recess 211c via. That is, the lower surface of the second base board 51 is a mounting surface 50 fixed to the first base board 21. Further, each external terminal 543 is electrically connected to the internal terminal 242 via the joining member B1. The joining member B1 is not particularly limited, and for example, a metal bump, a solder, a brazing material, a metal paste, a conductive resin adhesive, or the like can be used.

As shown in FIG. 1, the second circuit element 4 is housed in the outer package 2 in a state of being mounted on the first base substrate 21. The outer peripheral portion of the lower surface of the second circuit element 4 is joined to the bottom surface of the recess 211b via the joining member B3. The joining member B3 is not particularly limited, and may be, for example, a metal bump, a solder, a brazing material, a metal paste, a conductive resin adhesive or the like having conductivity, or an insulating property such as a resin adhesive or the like. It may have.

As shown in FIG. 4, such a second circuit element 4 controls the frequency of the oscillation signal output from the oscillation circuit 72, and the frequency temperature characteristic remaining in the oscillation signal output by the temperature-compensated crystal oscillator 3. It has a fractional division type PLL circuit 40 (phase-locked loop) as a frequency control circuit for further correcting the above, a storage unit 48 in which the temperature correction table 481 is stored, and an output circuit 49. In the present embodiment, the PLL circuit 40, the storage unit 48, and the output circuit 49 are configured as one-chip circuit elements, but they may be configured by a plurality of chip circuit elements, or some of them are composed of discrete components. It may have been done.

The PLL circuit 40 includes a phase comparator 41, a charge pump 42, a low-pass filter 43, a voltage-controlled oscillator circuit 44, and a frequency divider circuit 45. The phase comparator 41 compares the phase difference between the oscillation signal output by the oscillation circuit 72 and the clock signal output by the frequency divider circuit 45, and outputs the comparison result as a pulse voltage. The charge pump 42 converts the pulse voltage output by the phase comparator 41 into a current, and the low-pass filter 43 smoothes and voltage-converts the current output by the charge pump 42.

The voltage control type oscillation circuit 44 uses the output voltage of the low-pass filter 43 as a control voltage, and outputs a signal whose frequency changes according to the control voltage. The voltage-controlled oscillator circuit 44 of the present embodiment is an LC oscillator circuit configured by using an inductance element such as a coil and a capacitance element such as a capacitor, but the present invention is not limited to this, and for example, a crystal oscillator. It is also possible to use an oscillation circuit using a piezoelectric vibrator such as the above. The frequency dividing circuit 45 outputs a clock signal obtained by dividing the clock signal output by the voltage control type oscillation circuit 44 by a decimal number with a frequency dividing ratio determined from the output signal of the temperature sensor 71 and the temperature correction table 481. The frequency division ratio of the frequency dividing circuit 45 is not limited to the configuration defined by the temperature compensation table 481. For example, it may be determined by a polynomial operation or a neural network operation based on a machine-learned trained model.

The output circuit 49 receives the clock signal output by the PLL circuit 40, and generates an oscillation signal whose amplitude is adjusted to a desired level. The oscillation signal generated by the output circuit 49 is output to the outside of the oscillator 1 via the external terminal 243 of the oscillator 1.

As described above, by further correcting the frequency temperature characteristic remaining in the oscillation signal output by the temperature-compensated crystal oscillator 3 by the PLL circuit 40, the oscillator 1 having a smaller frequency deviation due to temperature can be obtained. The PLL circuit 40 is not particularly limited, and is, for example, an integer division type that divides the oscillation signal output by the oscillation circuit 72 between the oscillation circuit 72 and the phase comparator 41 by an integer division ratio. It may be provided with a PLL circuit. Further, the PLL circuit 40 is not limited to the one that further temperature-compensates the output signal of the temperature-compensated crystal oscillator 3. For example, the PLL circuit 40 may be configured to multiply the output frequency of the temperature-compensated crystal oscillator 3 by a fixed value in order to obtain a desired frequency signal.

As shown in FIG. 1, the second circuit element 4 having the above configuration is located above the inner package 5 and is arranged apart from the inner package 5 in the Z-axis direction. As a result, the heat of the second circuit element 4 is less likely to be transferred to the temperature-compensated crystal oscillator 3 as compared with the case where they are in contact with each other, and the heat of the second circuit element 4 causes the vibrating piece 6 and the temperature sensor 71 to move together. It is possible to effectively suppress the occurrence of a temperature difference between them, and the temperature of the vibrating piece 6 can be detected more accurately by the temperature sensor 71. In particular, in the present embodiment, the second circuit element 4 has a PLL circuit 40, and the PLL circuit 40 consumes a large amount of power and easily generates heat. Therefore, by arranging the second circuit element 4 and the inner package 5 apart from each other, the above-mentioned effect can be exhibited more remarkably. Further, since the second circuit element 4 also operates based on the temperature information signal output by the temperature sensor 71, it is less likely to be affected by its own heat generation as compared with the case where the temperature sensor is provided in the second circuit element 4.

The second circuit element 4 is located above the temperature-compensated crystal oscillator 3 and is located between the temperature-compensated crystal oscillator 3 and the first lid 22. As described above, since the inner package 5 of the temperature-compensated crystal oscillator 3 is fixed to the bottom surface of the recess 211c on the mounting surface 50 which is the lower surface thereof, the second circuit element 4 is the first base of the inner package 5. It can be said that it is located on the side opposite to the side joined to the substrate 21. According to such an arrangement, the heat transfer path between the joint portion between the second circuit element 4 and the first base substrate 21 and the joint portion between the inner package 5 and the first base substrate 21 is sufficiently lengthened. be able to. Therefore, it becomes difficult for the heat of the second circuit element 4 to be transferred to the inner package 5 via the first base substrate 21, and the heat of the second circuit element 4 causes a temperature difference between the vibration piece 6 and the temperature sensor 71. Can be effectively suppressed.

As shown in FIG. 1, a heat insulating member 9 is arranged between the second circuit element 4 and the temperature-compensated crystal oscillator 3, that is, between the second circuit element 4 and the inner package 5. Further, the heat insulating member 9 is arranged apart from the second circuit element 4 and covers the upper surface and the side surface of the inner package 5. In such a heat insulating member 9, a temperature difference occurs between the vibrating piece 6 and the temperature sensor 71 due to radiant heat (radiant heat) from the second circuit element 4, or in the internal space S2 caused by the environmental atmosphere of the oscillator 1. It has a function of suppressing a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the temperature change of the above.

First, only the heat of the second circuit element 4 will be described. As described above, since the internal space S2 is in a decompressed state, heat exchange due to convection between the inner package 5 and the second circuit element 4 is suppressed. However, heat exchange due to radiation between the inner package 5 and the second circuit element 4 is not sufficiently suppressed. Therefore, a heat insulating member 9 is arranged between the inner package 5 and the second circuit element 4, and the heat insulating member 9 blocks at least a part of the radiant heat from the second circuit element 4, that is, the inner package 5. By cutting at least a part of the radiant heat in the foreground, it becomes difficult for the radiant heat from the second circuit element 4 to be transmitted to the inner package 5 as compared with the case where the heat insulating member 9 is not provided. Therefore, a temperature difference between the vibrating piece 6 and the temperature sensor 71 is less likely to occur. In particular, in the present embodiment, the second circuit element 4 has a PLL circuit 40, and the PLL circuit 40 consumes relatively large power and tends to generate heat. Therefore, by arranging the heat insulating member 9, the above-mentioned effect can be exhibited more remarkably.

Next, an example will be described only for the environmental atmosphere. As described above, the first lid 22 is made of a metal such as Kovar and has a relatively high thermal conductivity. Therefore, when wind is generated in the environmental atmosphere of the oscillator 1, the wind cools the first lid 22 (heat exchange between the inside and outside of the outer package 2 is promoted through the first lid 22), and the inside is accompanied by the wind. The temperature in the space S2 also fluctuates, and this fluctuation causes a temperature difference between the vibration piece 6 and the temperature sensor 71. In particular, since the wind is generated irregularly, the temperature change in the internal space S2 caused by the wind is also irregular and steep, and a temperature difference is likely to occur between the vibrating piece 6 and the temperature sensor 71. In particular, since the specific heat of the vibrating piece 6 and the temperature sensor 71 are different or the arrangement is different, the responsiveness to the temperature change in the internal space S2 is different between the vibrating piece 6 and the temperature sensor 71. The above problems are likely to be promoted. Therefore, there is a case where the heat insulating member 9 is not provided by arranging the heat insulating member 9 between the inner package 5 and the second circuit element 4 and suppressing the exposure of the inner package 5 to the internal space S2 by the heat insulating member 9. In comparison, the temperature change in the internal space S2 is less likely to be transmitted to the inner package 5. Therefore, a temperature difference between the vibrating piece 6 and the temperature sensor 71 is less likely to occur.

By arranging the heat insulating member 9 between the second circuit element 4 and the temperature-compensated crystal oscillator 3 in this way, the temperature is generated between the vibrating piece 6 and the temperature sensor 71 due to the radiant heat from the second circuit element 4. It is possible to effectively suppress the occurrence of a difference or the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to a temperature change in the internal space S2 caused by the environmental atmosphere of the oscillator 1.

In particular, in the present embodiment, as described above, the heat insulating member 9 is arranged apart from the second circuit element 4. That is, a gap is formed between the heat insulating member 9 and the second circuit element 4, and the heat insulating member 9 and the second circuit element 4 are not in contact with each other. As a result, the heat of the second circuit element 4 is less likely to be transferred to the temperature-compensated crystal oscillator 3 than in the case where the heat insulating member 9 and the second circuit element 4 are in contact with each other. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71, and the temperature difference between the vibrating piece 6 and the temperature sensor 71 can be made smaller, preferably zero. it can.

In addition, "the heat insulating member 9 and the second circuit element 4 are separated from each other" means that the portion of the heat insulating member 9 facing the second circuit element 4, that is, most of the upper surface 90 is the second circuit element 4. It means that they are separated from each other, and includes the case where a part of the upper surface 90 is in contact with the second circuit element 4. When a part of the upper surface 90 is in contact with the second circuit element 4, the occupancy rate of the contact portion with respect to the upper surface 90 is preferably 10% or less, and more preferably 5% or less.

Further, in the present embodiment, as described above, the heat insulating member 9 covers the upper surface of the inner package 5, that is, the surface on the second circuit element 4 side. Since the upper surface of the inner package 5 is closest to the second circuit element 4 and the first lid 22 of the surface of the inner package 5, it affects the heat of the second circuit element 4 and the temperature of the internal space S2 more than the other parts. Easy to receive. In particular, in the present embodiment, the upper surface of the inner package 5 is made of a metal such as Kovar and is made of a second lid 52 having a relatively high thermal conductivity, and from this point as well, the heat of the second circuit element 4 is increased. It is easily affected by the temperature of the internal space S2. Therefore, by covering the upper surface of the inner package 5 with the heat insulating member 9, the above-mentioned heat insulating effect can be more effectively exhibited. As a result, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71, thereby making the temperature difference between the vibrating piece 6 and the temperature sensor 71 smaller, preferably zero. it can.

In particular, in the present embodiment, the heat insulating member 9 covers the entire surface other than the lower surface of the inner package 5, that is, the mounting surface 50. As a result, almost the entire surface of the inner package 5 facing the internal space S2 can be covered with the heat insulating member 9, and the above-mentioned heat insulating effect can be more effectively exhibited. As a result, more effectively suppressing the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 makes the temperature difference between the vibrating piece 6 and the temperature sensor 71 smaller, preferably zero. Can be done.

However, the configuration of the heat insulating member 9 is not particularly limited as long as it is arranged between the second circuit element 4 and the inner package 5. For example, as shown in FIG. 5, the mounting surface 50 may also be covered with the heat insulating member 9. Further, for example, the heat insulating member 9 may be arranged so as to cover only the upper surface of the inner package 5, or a part of the upper surface of the inner package 5 is not covered with the heat insulating member 9, and the heat insulating member 9 is used. It may be exposed.

The constituent material of the heat insulating member 9 as described above is not particularly limited as long as it can exhibit the above-mentioned heat insulating effect, but is, for example, a material having a lower thermal conductivity than the constituent material of the second lid 52. Is preferable. As a result, the heat insulating member 9 can more reliably exert the above-mentioned heat insulating effect. Examples of the constituent material of the heat insulating member 9 include various resin materials such as epoxy resin, phenol resin, urethane resin (polyurethane), and silicone resin. In this embodiment, the heat insulating member 9 is made of a silicone resin. As a result, the heat insulating member 9 is easy to handle and can exhibit an excellent heat insulating effect.

The gap G between the heat insulating member 9 and the second circuit element 4 is not particularly limited, but is preferably 0.01 mm or more and 0.1 mm or less, and 0.03 mm or more and 0.09 mm or less. It is more preferable to do so. As a result, the above-mentioned heat insulating effect can be sufficiently exhibited while avoiding an excessive increase in size of the oscillator 1. In the present embodiment, since the second circuit element 4 and the inner package 5 are both mounted on the first base board 21, the depth of the recess 211c formed in the first base board 21 can be appropriately determined. The gap G can be a desired value as described above. Further, a spacer (not shown) can be used to adjust the gap G.

As described above, the discrete parts 81 and 82 are housed in the outer package 2 and are joined to the bottom surface of the recess 211d. The discrete components 81 and 82 are bypass capacitors 810 and 820, respectively. Then, as shown in FIG. 4, the bypass capacitor 810 is connected to the terminal 543a between the external terminal 243 provided on the outer package 2 and the power supply voltage terminal 543a provided on the inner package 5. Has been done. As a result, noise can be removed from the power supply voltage supplied via the external terminal 243, and a stable power supply voltage can be supplied to the first circuit element 7.

On the other hand, the bypass capacitor 820 is connected to the terminal 543d between the terminal 543d for the output signal of the temperature sensor 71 and the PLL circuit 40. As a result, noise can be removed from the output signal of the temperature sensor 71, and a more accurate output signal can be supplied to the PLL circuit 40. Therefore, the frequency division ratio by the frequency dividing circuit 45 can be determined more accurately. The discrete components 81 and 82 are not limited to the bypass capacitors 810 and 820, and may be, for example, a thermistor, a resistor, a diode, or the like. Further, at least one of the discrete parts 81 and 82 may be omitted, or other discrete parts may be added. Further, the bypass capacitors 810 and 820 may be built in the second circuit element 4.

The oscillator 1 has been described above. As described above, the oscillator 1 includes an outer package 2 as a first container, an inner package 5 as a second container housed in the outer package 2, and a vibrating piece 6 housed in the inner package 5. A first circuit element 7 including a temperature sensor 71 and an oscillation circuit that oscillates a vibrating piece 6 and generates a temperature-compensated oscillation signal based on the detection result of the temperature sensor 71, and is housed in an inner package 5. A second circuit element 4 housed in the outer package 2 and including a PLL circuit 40 as a frequency control circuit for controlling the frequency of the oscillation signal and arranged so as to overlap the inner package 5 in a plan view, and an inner package 5 It is provided with a heat insulating member 9 which is located between the second circuit element 4 and the second circuit element 4 and is arranged apart from the second circuit element 4.

According to such a configuration, the heat insulating member 9 causes a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to radiant heat (radiant heat) from the second circuit element 4, or is caused by the environmental atmosphere of the oscillator 1. It is possible to suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the temperature change in the internal space S2. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 and the fluctuation of the temperature difference. As a result, the temperature of the vibrating piece 6 can be detected more accurately by the temperature sensor 71, and the temperature compensation by the oscillation circuit 72 becomes more accurate. Further, it is possible to output an oscillation signal having a small frequency deviation from the PLL circuit 40. Therefore, the oscillator 1 can output a highly accurate frequency signal.

Further, as described above, the outer package 2 has a first base substrate 21 having a recess 211 as a first recess, and a first lid 22 joined to the first base substrate 21 so as to close the opening of the recess 211. And, the inner package 5 and the second circuit element 4 are arranged in the recess 211. Further, the inner package 5 has a second base substrate 51 having a recess 511 as a second recess, and a second lid 52 joined to the second base substrate 51 so as to close the opening of the recess 511. , The second lid 52 is fixed to the first base substrate 21 in a posture toward the second circuit element 4 side. By fixing the inner package 5 to the outer package 2 in such an attitude, the electrical connection between the second base substrate 51 and the first base substrate 21 becomes easy.

Further, as described above, the heat insulating member 9 has a lower thermal conductivity than the second lid 52. As a result, the heat insulating member 9 has sufficient heat insulating properties. Therefore, the above-mentioned effect can be exerted more effectively.

Further, as described above, the heat insulating member 9 covers the surface of the inner package 5 on the second circuit element 4 side, that is, the upper surface. Since the upper surface of the inner package 5 is closest to the second circuit element 4 and the first lid 22 of the surface of the inner package 5, it affects the heat of the second circuit element 4 and the temperature of the internal space S2 more than the other parts. Easy to receive. In particular, in the present embodiment, the upper surface of the inner package 5 is composed of a second lid 52 made of a metal such as Kovar, and from this point as well, the heat of the second circuit element 4 and the temperature of the internal space S2 are affected. Susceptible. Therefore, by covering the upper surface of the inner package 5 with the heat insulating member 9, the above-mentioned heat insulating effect can be more effectively exhibited.

Further, as described above, the inner package 5 is located on the opposite side of the second circuit element 4, has a mounting surface 50 mounted on the outer package 2, and the heat insulating member 9 is a mounting surface of the inner package 5. It covers surfaces other than 50. As a result, almost the entire surface of the inner package 5 facing the internal space S2 can be covered with the heat insulating member 9. Thereby, the above-mentioned heat insulating effect can be more effectively exhibited.

<Second Embodiment>
FIG. 6 is a cross-sectional view showing the oscillator of the second embodiment.

The present embodiment is the same as the first embodiment described above, except that the configuration of the heat insulating member 9 is different. In the following description, the present embodiment will be mainly described with respect to the differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 6, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 6, in the oscillator 1 of the present embodiment, the plate-shaped heat insulating member 9 is fixed to the upper surface of the inner package 5. Further, the heat insulating member 9 is larger than the inner package 5 in a plan view and overlaps the entire area of the inner package 5. Even with such a heat insulating member 9, a temperature difference occurs between the vibrating piece 6 and the temperature sensor 71 due to radiant heat (radiant heat) from the second circuit element 4, or the internal space S2 caused by the environmental atmosphere of the oscillator 1. It is possible to suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the temperature change inside. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 and the fluctuation of the temperature difference.

The second embodiment as described above can also exert the same effect as the first embodiment described above.

<Third Embodiment>
FIG. 7 is a cross-sectional view showing the oscillator of the third embodiment.

The present embodiment is the same as the first embodiment described above, except that the configuration of the heat insulating member 9 is different. In the following description, the present embodiment will be mainly described with respect to the differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 7, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 7, in the oscillator 1 of the present embodiment, the recess 211 of the outer package 2 has a recess 211a that opens on the upper surface of the first base substrate 21, a recess 211b that opens on the bottom surface of the recess 211a, and a recess 211b. It has a recess 211c that opens to the bottom surface of the recess 211c, a recess 211d that opens to the bottom of the recess 211c, and a recess 211e that opens to the bottom of the recess 211d. The second circuit element 4 is fixed to the bottom surface of the recess 211b, the temperature-compensated crystal oscillator 3 is fixed to the bottom surface of the recess 211d, and the discrete components 81 and 82 are fixed to the bottom surface of the recess 211e. Further, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, and a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211d.

Further, a plate-shaped heat insulating member 9 is arranged between the second circuit element 4 and the temperature-compensated crystal oscillator 3. Further, the heat insulating member 9 is fixed to the bottom surface of the recess 211c via the joining member B4. Further, the heat insulating member 9 is arranged apart from the second circuit element 4, and is also arranged apart from the temperature-compensated crystal oscillator 3. Further, the heat insulating member 9 is larger than the inner package 5 in a plan view and overlaps the entire area of the inner package 5.

Even with such a heat insulating member 9, a temperature difference occurs between the vibrating piece 6 and the temperature sensor 71 due to radiant heat (radiant heat) from the second circuit element 4, or the internal space S2 caused by the environmental atmosphere of the oscillator 1. It is possible to suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the temperature change inside. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 and the fluctuation of the temperature difference.

The third embodiment as described above can also exert the same effect as the first embodiment described above.

<Fourth Embodiment>
FIG. 8 is a cross-sectional view showing the oscillator of the fourth embodiment.

The present embodiment is the same as the first embodiment described above, except that the configuration for insulating the inner package 5 is different. In the following description, the present embodiment will be mainly described with respect to the differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 8, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 8, in the oscillator 1 of the present embodiment, the recess 211 of the outer package 2 has a recess 211a that opens on the upper surface of the first base substrate 21, a recess 211b that opens on the bottom surface of the recess 211a, and a recess 211b. It has a recess 211c that opens to the bottom surface of the recess 211c, a recess 211d that opens to the bottom of the recess 211c, and a recess 211e that opens to the bottom of the recess 211d. The second circuit element 4 is fixed to the bottom surface of the recess 211b, the temperature-compensated crystal oscillator 3 is fixed to the bottom surface of the recess 211d, and the discrete components 81 and 82 are fixed to the bottom surface of the recess 211e. Further, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, and a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211d.

Further, the oscillator 1 has a partition member 10 located between the temperature-compensated crystal oscillator 3 and the second circuit element 4. The partition member 10 is fixed to the bottom surface of the recess 211c via a joining member B4, and airtightly divides the internal space S2 into upper and lower parts. Specifically, the internal space S2 is located below the partition member 10 by the partition member 10, and is above the first space S21 containing the temperature-compensated crystal oscillator 3 and the partition member 10. It is located and partitioned into a second space S22 that houses the second circuit element 4.

The constituent material of the partition member 10 is not particularly limited as long as the internal space S2 can be airtightly partitioned into the first space S21 and the second space S22. For example, various metal materials, various ceramic materials, various resin materials, and the like. Can be used.

The atmosphere of the second space S22 is replaced with an inert gas such as nitrogen or argon, and is in an atmospheric pressure state substantially equal to the atmospheric pressure. As a result, convection is likely to occur in the second space S22, and the heat of the second circuit element 4 is efficiently released from the first lid 22 to the outside. That is, heat can be efficiently dissipated from the second circuit element 4, and excessive temperature rise of the second circuit element 4 can be suppressed. On the other hand, the atmosphere of the first space S21 is replaced with an inert gas such as nitrogen or argon, and is in a reduced pressure state, particularly a vacuum state, in which the pressure is reduced with respect to the atmospheric pressure. As a result, the heat insulating property of the first space S21 is enhanced, and it becomes difficult for heat to be transferred to the temperature-compensated crystal oscillator 3 housed in the first space S21. Therefore, the heat of the second circuit element 4 causes a temperature difference between the vibrating piece 6 and the temperature sensor 71, and the temperature change in the second space S22 caused by the environmental atmosphere of the oscillator 1 causes the vibrating piece 6 and the temperature sensor. It is possible to effectively suppress the occurrence of a temperature difference with 71.

In the present embodiment, the first space S21 is in a reduced pressure state and the second space S22 is in an atmospheric pressure state, but if the pressure in the first space S21 is lower than the pressure in the second space S22, the first and first spaces S22 are in a reduced pressure state. The pressures of the two spaces S21 and S22 are not particularly limited.

As described above, the oscillator 1 of the present embodiment has the outer package 2 as the first container, the inner package 5 as the second container housed in the outer package 2, and the vibration housed in the inner package 5. Oscillation that oscillates the piece 6 and the temperature sensor 71 housed in the inner package 5 and the vibrating piece 6 housed in the inner package 5 to generate a temperature-compensated oscillation signal based on the detection result of the temperature sensor 71. The first circuit element 7 including the circuit, the second circuit element 4 including the PLL circuit 40 as a frequency control circuit housed in the outer package 2 and controlling the frequency of the oscillation signal, and the inner package 5 in the outer package 2 A partition member 10 located between the second circuit element 4 and partitioning the inside of the outer package 2 into a first space S21 accommodating the inner package 5 and a second space S22 accommodating the second circuit element 4. The inner package 5 and the second circuit element 4 are arranged so as to overlap each other in a plan view, and the pressure in the first space S21 is lower than the pressure in the second space S22.

With such a configuration, convection is likely to occur in the second space S22, and the heat of the second circuit element 4 is efficiently released from the first lid 22 to the outside. That is, heat can be efficiently dissipated from the second circuit element 4, and excessive temperature rise of the second circuit element 4 can be suppressed. On the other hand, the heat insulating property of the first space S21 is improved, and it becomes difficult for heat to be transferred to the temperature-compensated crystal oscillator 3 housed in the first space S21. Therefore, the heat of the second circuit element 4 causes a temperature difference between the vibrating piece 6 and the temperature sensor 71, and the temperature change in the second space S22 caused by the environmental atmosphere of the oscillator 1 causes the vibrating piece 6 and the temperature sensor. It is possible to effectively suppress the occurrence of a temperature difference with 71. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 and the fluctuation of the temperature difference. As a result, the temperature of the vibrating piece 6 can be detected more accurately by the temperature sensor 71, and the temperature compensation by the oscillation circuit 72 becomes more accurate.

The fourth embodiment as described above can also exert the same effect as the first embodiment described above.

<Fifth Embodiment>
FIG. 9 is a cross-sectional view showing the oscillator of the fifth embodiment. FIG. 10 is a plan view showing the oscillator of FIG.

The present embodiment is the same as the first embodiment described above, except that the arrangement of the second circuit element 4 and the temperature-compensated crystal oscillator 3 is different. In the following description, the present embodiment will be mainly described with respect to the differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIGS. 9 and 10, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 9, the recess 211 of the first base substrate 21 is composed of a plurality of recesses, and in the illustrated configuration, the recess 211a that opens on the upper surface of the first base substrate 21 and the recess 211a that opens on the bottom surface of the recess 211a. , A recess 211b and a recess 211c having a smaller opening than the recess 211a. The recesses 211b and 211c are formed side by side in the X-axis direction, and the depth of the recesses 211b is larger than the depth of the recesses 211c. Therefore, the bottom surface of the recess 211b is located below the bottom surface of the recess 211c.

The second circuit element 4 is fixed to the bottom surface of the recess 211c, and the temperature-compensated crystal oscillator 3 is fixed to the bottom surface of the recess 211b. Further, as shown in FIG. 10, two discrete parts 81 and 82, which are single circuit parts, are fixed to the bottom surface of the recess 211b so as not to overlap with the temperature-compensated crystal oscillator 3. According to such an arrangement, the second circuit element 4, the temperature-compensated crystal oscillator 3, and the discrete components 81 and 82 are arranged side by side in the X-axis direction and the Y-axis direction in a plan view without overlapping in the Z-axis direction. can do. Therefore, the height of the outer package 2 can be reduced.

Further, as shown in FIG. 9, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, and a plurality of external terminals 243 are arranged on the lower surface of the first base substrate 21. The internal terminals 241 or the internal terminals 241 and the external terminals 243 are electrically connected to each other via wiring (not shown) formed in the first base substrate 21. Further, some internal terminals 241 are electrically connected to the second circuit element 4 via the bonding wire BW1, and some internal terminals 241 are electrically connected to the temperature-compensated crystal oscillator 3 via the bonding wire BW2. Is connected.

As shown in FIG. 9, the temperature-compensated crystal oscillator 3 is arranged with the second lid 52 facing the bottom surface of the recess 211b, and the second lid 52 is placed on the bottom surface of the recess 211b via the insulating joining member B5. It is fixed to. That is, the second lid 52 is a mounting surface 50 fixed to the first base board 21. By setting the second lid 52 toward the bottom surface side of the recess 211b in this way, for example, on the contrary, when the bottom surface of the second base substrate 51 is oriented toward the bottom surface side of the recess 211b. Compared with this, the heat transfer path from the joint portion between the inner package 5 and the first base substrate 21 to the vibrating piece 6 and the first circuit element 7 becomes longer. Therefore, the heat of the second circuit element 4 is less likely to be transferred to the vibrating piece 6 and the first circuit element 7. As a result, the temperature difference between the vibrating piece 6 and the temperature sensor 71 can be suppressed to be smaller. However, the present invention is not limited to this, and contrary to the present embodiment, the inner package 5 may be fixed to the bottom surface of the recess 211b in a posture in which the bottom surface of the second base substrate 51 faces the bottom surface side of the recess 211b.

Further, as shown in FIG. 10, of the four external terminals 543 of the temperature-compensated crystal oscillator 3, the terminals 543a, 543b, and 543d are electrically connected to the internal terminal 241 via the bonding wire BW2, respectively. ing. On the other hand, the terminal 543c is directly connected to the second circuit element 4 via the bonding wire BW5. As a result, the wiring length between the terminal 543c and the second circuit element 4 can be shortened. Therefore, noise is less likely to be added to the oscillation signal output by the oscillation circuit 72, and an accurate oscillation signal can be output to the second circuit element 4. Further, the terminal 543a is further electrically connected to the second circuit element 4 via the bonding wire BW6. As a result, the power supply voltage can be supplied to the second circuit element 4.

Further, as shown in FIG. 9, a heat insulating member 9 is arranged between the temperature-compensated crystal oscillator 3 and the first lid 22, that is, between the inner package 5 and the first lid 22. Further, the heat insulating member 9 is arranged apart from the first lid 22 and covers the upper surface and the side surface of the inner package 5. Such a heat insulating member 9 mainly includes a vibrating piece 6 and a temperature sensor 71 due to radiant heat (radiant heat) from the second circuit element 4 in a portion 91 located between the inner package 5 and the second circuit element 4. The temperature in the internal space S2 caused by the environmental atmosphere of the oscillator 1 is suppressed mainly in the portion 92 located between the inner package 5 and the first lid 22 by suppressing the temperature difference between the two. It is possible to prevent a temperature difference between the vibration piece 6 and the temperature sensor 71 due to the change.

First, only the heat of the second circuit element 4 will be described. As described above, since the internal space S2 is in a decompressed state, heat exchange due to convection between the inner package 5 and the second circuit element 4 is suppressed. However, heat exchange due to radiation between the inner package 5 and the second circuit element 4 is not sufficiently suppressed. Therefore, by arranging the heat insulating member 9 (part 91) between the inner package 5 and the second circuit element 4, and blocking at least a part of the radiant heat from the second circuit element 4 by the heat insulating member 9, that is, By cutting at least a part of the radiant heat in front of the inner package 5, the radiant heat from the second circuit element 4 is less likely to be transmitted to the inner package 5 as compared with the case where the heat insulating member 9 is not provided. Therefore, a temperature difference between the vibrating piece 6 and the temperature sensor 71 is less likely to occur. In particular, in the present embodiment, the second circuit element 4 has a PLL circuit 40, and the PLL circuit 40 consumes relatively large power and tends to generate heat. Therefore, by arranging the heat insulating member 9, the above-mentioned effect can be exhibited more remarkably.

Next, an example will be described only for the environmental atmosphere. As described above, the first lid 22 is made of a metal such as Kovar and has a relatively high thermal conductivity. Therefore, when wind is generated in the environmental atmosphere of the oscillator 1, the wind cools the first lid 22 (heat exchange between the inside and outside of the outer package 2 is promoted through the first lid 22), and the inside is accompanied by the wind. The temperature in the space S2 also fluctuates, and this fluctuation causes a temperature difference between the vibration piece 6 and the temperature sensor 71. In particular, since the wind is generated irregularly, the temperature change in the internal space S2 caused by the wind is also irregular and steep, and a temperature difference is likely to occur between the vibrating piece 6 and the temperature sensor 71. In particular, since the specific heat of the vibrating piece 6 and the temperature sensor 71 are different or the arrangement is different, the responsiveness to the temperature change in the internal space S2 is different between the vibrating piece 6 and the temperature sensor 71. The above problems are likely to be promoted. Therefore, the heat insulating member 9 (part 92) is arranged between the inner package 5 and the first lid 22, and the heat insulating member 9 suppresses the exposure of the inner package 5 to the internal space S2. It becomes difficult for the temperature change of the internal space S2 to be transmitted to the inner package 5 as compared with the case without it. Therefore, a temperature difference between the vibrating piece 6 and the temperature sensor 71 is less likely to occur.

By arranging the heat insulating member 9 between the second circuit element 4 and the first lid 22 and the inner package 5 in this way, between the vibrating piece 6 and the temperature sensor 71 due to the radiant heat from the second circuit element 4. It is possible to effectively suppress the temperature difference between the vibration piece 6 and the temperature sensor 71 due to the temperature difference in the internal space S2 caused by the environmental atmosphere of the oscillator 1. ..

In particular, in the present embodiment, as described above, the heat insulating member 9 is arranged apart from the first lid 22. That is, a gap is formed between the heat insulating member 9 and the first lid 22, and the heat insulating member 9 and the first lid 22 are not in contact with each other. As a result, the heat of the environmental atmosphere is less likely to be transferred to the inner package 5 as compared with the case where the heat insulating member 9 and the first lid 22 are in contact with each other. Similarly, the heat insulating member 9 is arranged apart from the second circuit element 4. That is, a gap is formed between the heat insulating member 9 and the second circuit element 4, and the heat insulating member 9 and the second circuit element 4 are not in contact with each other. As a result, the heat of the second circuit element 4 is less likely to be transferred to the inner package 5 as compared with the case where the heat insulating member 9 and the second circuit element 4 are in contact with each other.

Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71, and the temperature difference between the vibrating piece 6 and the temperature sensor 71 can be made smaller, preferably zero. it can.

In addition, "the heat insulating member 9 and the first lid 22 are separated from each other" means that the portion of the heat insulating member 9 facing the first lid 22, that is, most of the upper surface 90 is separated from the first lid 22. It means that a part of the upper surface 90 is in contact with the first lid 22. When a part of the upper surface 90 is in contact with the first lid 22, the occupancy rate of the contact portion with respect to the upper surface 90 is preferably 10% or less, and more preferably 5% or less. Similarly, "the heat insulating member 9 and the second circuit element 4 are separated from each other" means that the portion of the heat insulating member 9 facing the second circuit element 4, that is, most of the side surface 93 is the second circuit element 4. It means that it is separated from the second circuit element 4, and includes the case where a part of the side surface 93 is in contact with the second circuit element 4. When a part of the side surface 93 is in contact with the second circuit element 4, the occupancy rate of the contact portion with respect to the side surface 93 is preferably 10% or less, and more preferably 5% or less.

Further, in the present embodiment, as described above, the heat insulating member 9 covers the upper surface of the inner package 5, that is, the surface on the first lid 22 side. Since the upper surface of the inner package 5 is closest to the first lid 22 of the surfaces of the inner package 5, it is easily affected by the environmental atmosphere. Therefore, by covering the upper surface of the inner package 5 with the heat insulating member 9, the above-mentioned heat insulating effect can be more effectively exhibited. As a result, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71, thereby making the temperature difference between the vibrating piece 6 and the temperature sensor 71 smaller, preferably zero. it can.

In particular, in the present embodiment, the heat insulating member 9 covers the entire surface other than the lower surface of the inner package 5, that is, the mounting surface 50. As a result, almost the entire surface of the inner package 5 facing the internal space S2 can be covered with the heat insulating member 9. Thereby, the above-mentioned heat insulating effect can be more effectively exhibited. As a result, more effectively suppressing the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 makes the temperature difference between the vibrating piece 6 and the temperature sensor 71 smaller, preferably zero. Can be done.

However, the configuration of the heat insulating member 9 is not particularly limited as long as it is arranged between the first lid 22 and the inner package 5. For example, the mounting surface 50 may also be covered with the heat insulating member 9. Further, for example, the heat insulating member 9 may be arranged so as to cover only the upper surface of the inner package 5, or a part of the upper surface of the inner package 5 is not covered with the heat insulating member 9, and the heat insulating member 9 is used. It may be exposed.

The constituent material of the heat insulating member 9 as described above is not particularly limited as long as it can exhibit the above-mentioned heat insulating effect, but is, for example, a material having a lower thermal conductivity than the constituent material of the second lid 52. Is preferable. As a result, the heat insulating member 9 can more reliably exert the above-mentioned heat insulating effect. Examples of the constituent material of the heat insulating member 9 include various resin materials such as epoxy resin, phenol resin, urethane resin (polyurethane), and silicone resin. In this embodiment, the heat insulating member 9 is made of a silicone resin. As a result, the heat insulating member 9 is easy to handle and can exhibit an excellent heat insulating effect.

The gap G1 between the heat insulating member 9 and the first lid 22 is not particularly limited, but is preferably 0.01 mm or more and 0.1 mm or less, and 0.03 mm or more and 0.09 mm or less. Is more preferable. As a result, the above-mentioned heat insulating effect can be sufficiently exhibited while avoiding an excessive increase in size of the oscillator 1.

As described above, the oscillator 1 of the present embodiment includes the first base substrate 21 and the first lid 22 bonded to the first base substrate 21, and has the internal space S2 as the first internal space. The outer package 2 as a second container, which is housed in the inner space S2 and fixed to the first base substrate 21, the oscillating piece 6 housed in the inner package 5, and the temperature sensor 71. A first circuit element 7 housed in the inner package 5 and a first circuit element 7 including an oscillation circuit that oscillates the vibration piece 6 and generates an oscillation signal that is temperature-compensated based on the detection result of the temperature sensor 71. 1 A second circuit element 4 fixed to a base board 21 and including a PLL circuit 40 as a frequency control circuit for controlling the frequency of an oscillation signal, arranged side by side with an inner package 5 in a plan view, and an inner package. A heat insulating member 9 located between the 5 and the 1st lid 22 and arranged apart from the 1st lid 22 is provided.

According to such a configuration, the heat insulating member 9 can suppress the temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the temperature change in the internal space S2 caused by the environmental atmosphere of the oscillator 1. it can. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 and the fluctuation of the temperature difference. As a result, the temperature of the vibrating piece 6 can be detected more accurately by the temperature sensor 71, and the temperature compensation by the oscillation circuit 72 becomes more accurate. Further, it is possible to output an oscillation signal having a small frequency deviation from the PLL circuit 40. Therefore, the oscillator 1 can output a highly accurate frequency signal.

Further, as described above, the heat insulating member 9 is located between the inner package 5 and the second circuit element 4, and is arranged away from the second circuit element 4. According to such a configuration, the heat insulating member 9 can suppress the generation of a temperature difference between the vibrating piece 6 and the temperature sensor 71 due to the radiant heat (radiant heat) from the second circuit element 4. Therefore, it is possible to effectively suppress the occurrence of a temperature difference between the vibrating piece 6 and the temperature sensor 71 and the fluctuation of the temperature difference.

Further, as described above, the inner package 5 is located on the opposite side of the first lid 22, has a mounting surface 50 mounted on the outer package 2, and the heat insulating member 9 is a mounting surface 50 of the inner package 5. It covers the entire surface except for. As a result, almost the entire surface of the inner package 5 facing the internal space S2 can be covered with the heat insulating member 9. Thereby, the above-mentioned heat insulating effect can be more effectively exhibited.

The fifth embodiment as described above can also exert the same effect as the first embodiment described above.

<Sixth Embodiment>
FIG. 11 is a perspective view showing the personal computer of the sixth embodiment.

The personal computer 1100 as an electronic device shown in FIG. 11 is composed of a main body 1104 having a keyboard 1102 and a display unit 1106 having a display 1108. The display unit 1106 has a hinge structure with respect to the main body 1104. It is rotatably supported via. An oscillator 1 is built in such a personal computer 1100. Further, the personal computer 1100 includes a signal processing circuit 1110 that performs arithmetic processing related to control of the keyboard 1102, the display unit 1108, and the like. The signal processing circuit 1110 operates based on the oscillation signal output from the oscillator 1.

As described above, the personal computer 1100 as an electronic device includes an oscillator 1 and a signal processing circuit 1110 that performs signal processing based on the output signal (oscillation signal) of the oscillator 1. Therefore, the effect of the oscillator 1 described above can be enjoyed, and high reliability can be exhibited.

In addition to the personal computer 1100 described above, the electronic device provided with the oscillator 1 includes, for example, a digital still camera, a smartphone, a tablet terminal, a clock including a smart watch, an inkjet ejection device, for example, an inkjet printer, and an HMD (head mount display). , Wearable devices such as smart glasses, TVs, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks, electronic dictionaries, electronic translators, calculators, electronic game equipment, training equipment, word processors, workstations, videophones, Security TV monitors, electronic binoculars, POS terminals, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, medical devices such as electronic endoscopes, fish finder, various measuring devices, vehicles, aircraft , Instruments mounted on a ship, a base station for a mobile terminal, a flight simulator, or the like.

<7th Embodiment>
FIG. 12 is a perspective view showing the automobile of the seventh embodiment.

As shown in FIG. 12, the automobile 1500 as a mobile body includes an oscillator 1 and a signal processing circuit 1510 that operates based on an oscillation signal output from the oscillator 1. The oscillator 1 and the signal processing circuit 1510 include, for example, a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), and a tire pressure monitoring system (TPMS). It can be widely applied to electronic control units (ECUs) such as engine control, battery monitors for hybrid vehicles and electric vehicles, and body posture control systems.

As described above, the automobile 1500 as a moving body includes an oscillator 1 and a signal processing circuit 1510 that performs signal processing based on the output signal (oscillation signal) of the oscillator 1. Therefore, the effect of the oscillator 1 described above can be enjoyed, and high reliability can be exhibited.

In addition to the automobile 1500, the moving body provided with the oscillator 1 may be, for example, a robot, a drone, an electric wheelchair, a two-wheeled vehicle, an aircraft, a helicopter, a ship, a train, a monorail, a cargo for carrying cargo, a rocket, a spaceship, or the like. Good.

Although the oscillator, electronic device, and mobile body of the present invention have been described above based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part is an arbitrary configuration having the same function. Can be replaced with one. Further, any other constituents may be added to the present invention. In addition, each of the above-described embodiments may be combined as appropriate.

1 ... oscillator, 2 ... outer package, 21 ... first base board, 211, 211a, 211b, 211c, 211d, 211e ... recess, 22 ... first lid, 23 ... joining member, 241, 242 ... internal terminal, 243 ... External terminal, 3 ... Temperature-compensated crystal oscillator, 4 ... Second circuit element, 40 ... PLL circuit, 41 ... Phase comparator, 42 ... Charge pump, 43 ... Low-pass filter, 44 ... Voltage-controlled oscillator circuit, 45 ... Minutes Circumferential circuit, 48 ... Storage unit, 481 ... Temperature compensation table, 49 ... Output circuit, 5 ... Inner package, 50 ... Mounting surface, 51 ... Second base board, 511, 511a, 511b, 511c, 511d ... Recess, 52 ... 2nd lid, 53 ... Joining member, 541, 542 ... Internal terminal, 543 ... External terminal, 543a, 543b, 543c, 543d ... Terminal, 6 ... Vibration piece, 60 ... Crystal substrate, 61 ... Electrode, 621 ... First excitation Electrodes, 622 ... 1st pad electrode, 623 ... 1st extraction electrode, 631 ... 2nd oscillation electrode, 632 ... 2nd pad electrode, 633 ... 2nd extraction electrode, 7 ... 1st circuit element, 71 ... Temperature sensor, 72 ... Oscillation circuit, 721 ... Oscillation circuit section, 722 ... Temperature compensation circuit section, 81, 82 ... Discrete parts, 810, 820 ... Bypass condenser, 9 ... Insulation member, 90 ... Top surface, 91, 92 ... Part, 93 ... Side surface, 10 ... Partition member, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Main unit, 1106 ... Display unit, 1108 ... Display unit, 1110 ... Signal processing circuit, 1500 ... Automobile, 1510 ... Signal processing circuit, B1, B2, B3 , B4, B5 ... Joining member, BW1, BW2, BW3, BW5, BW6 ... Bonding wire, G, G1 ... Gap, S2 ... Internal space, S21 ... First space, S22 ... Second space, S5 ... Internal space

Claims (11)

The first container and
The second container housed in the first container and
The vibrating piece housed in the second container and
A first circuit element housed in the second container, including a temperature sensor and an oscillation circuit that oscillates the vibrating piece and generates a temperature-compensated oscillation signal based on the detection result of the temperature sensor. ,
A second circuit element housed in the first container, including a frequency control circuit for controlling the frequency of the oscillation signal, and arranged so as to overlap the second container in a plan view.
An oscillator including a heat insulating member located between the second container and the second circuit element and arranged apart from the second circuit element. The first container has a first base substrate having a first recess and a first lid bonded to the first base substrate so as to close the opening of the first recess.
The second container and the second circuit element are arranged in the first recess, and the second container and the second circuit element are arranged.
The second container has a second base substrate having a second recess and a second lid bonded to the second base substrate so as to close the opening of the second recess, and the second lid is provided. The oscillator according to claim 1, wherein the oscillator is fixed to the first base substrate in a posture toward the second circuit element side. The oscillator according to claim 2, wherein the heat insulating member has a thermal conductivity lower than that of the second lid. The oscillator according to any one of claims 1 to 3, wherein the heat insulating member covers the surface of the second container on the second circuit element side. The second container is located on the opposite side of the second circuit element and has a mounting surface mounted on the first container.
The oscillator according to any one of claims 1 to 4, wherein the heat insulating member covers a surface other than the mounting surface of the second container. A first container containing a first base substrate and a first lid bonded to the first base substrate and having a first internal space, and a first container.
A second container housed in the first internal space and fixed to the first base substrate,
The vibrating piece housed in the second container and
A first circuit element housed in the second container, including a temperature sensor and an oscillation circuit that oscillates the vibrating piece and generates a temperature-compensated oscillation signal based on the detection result of the temperature sensor. ,
A second circuit element fixed to the first base substrate, including a frequency control circuit for controlling the frequency of the oscillation signal, and arranged side by side with the second container in a plan view.
An oscillator including a heat insulating member located between the second container and the first lid and arranged apart from the first lid. The oscillator according to claim 6, wherein the heat insulating member is located between the second container and the second circuit element, and is arranged apart from the second circuit element. The second container is located on the opposite side of the first lid and has a mounting surface mounted on the first container.
The oscillator according to claim 6 or 7, wherein the heat insulating member covers the entire surface of the second container other than the mounting surface. The first container and
The second container housed in the first container and
The vibrating piece housed in the second container and
The temperature sensor housed in the second container and
A first circuit element housed in the second container, including an oscillating circuit that oscillates the vibrating piece and generates a temperature-compensated oscillating signal based on the detection result of the temperature sensor.
A second circuit element housed in the first container and including a frequency control circuit for controlling the frequency of the oscillation signal, and
A first space located between the second container and the second circuit element in the first container and accommodating the first space for accommodating the second container and the second circuit element in the first container. It is equipped with a partition member that divides it into two spaces.
The second container and the second circuit element are arranged so as to overlap each other in a plan view.
An oscillator characterized in that the pressure in the first space is lower than the pressure in the second space. The oscillator according to any one of claims 1 to 9,
An electronic device including a signal processing circuit that performs signal processing based on the output signal of the oscillator. The oscillator according to any one of claims 1 to 9,
A mobile body including a signal processing circuit that performs signal processing based on the output signal of the oscillator.

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