JP2021043316A - 表示装置の製造方法、及び表示装置 - Google Patents
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Abstract
Description
発光素子は肉眼では視認が困難なほど微細化され、実装基板の上には多数の発光素子が実装されている。そのため、互いに分離された発光素子を実装基板の上に効率的に実装するためには、発光素子の姿勢及び二次元配列を実装基板の画素配列に適合するように予め、精度よく整列させる技術が必要とされている。
以下、図面を参照して一実施形態に係る表示装置DSPの製造方法について説明する。
図4は、一実施形態に係る表示装置の製造方法を示すフローチャートである。図5は、一実施形態に係る表示装置の製造方法に使用する、発光素子の整列装置を概略的に示す斜視図である。図6は、整列工程を順に示す模式的な部分断面図である。図7は、実装工程を順に示す模式的な部分断面図である。
以下、上述する発光素子10を多結晶サファイア基板の上に集積形成する手順について説明する。まず、絶縁基材層となる単結晶サファイア基板(ウェハ)を用意する。単結晶サファイア基板には、例えば単結晶サファイア基板の上に低温及び高温のバッファ層を形成した後、第2導電型クラッド層、活性層、第1導電型クラッド層を常法により積層させて、発光層を形成する。当該積層によって、ダブルヘテロ構造の発光ダイオードが形成される。次に、常法により、第2導電型クラッド層に電気的に接続するようにn型電極(第1電極)が形成され、第1導電型クラッド層に電気的に接続するようにp型電極(第2電極)が形成される。次に、フォトリソグラフィー等の半導体プロセスによってサファイア基板が露出する位置まで、各発光素子10を分離する分離溝、切り欠き部を形成する。また、フォトリソグラフィーに替えてサファイア基板が露出する位置までダイシングプロセスを用いてもよい。さらにこの分断溝や切り欠き部を形成は、上述のフォトリソグラフィーやダイシングプロセスを組み合わせたものであってもよい。以上の工程によって、発光素子10をサファイア基板(ウェハ)の上を集積形成できる。
図5に示すように、配列ガイド部材21は、基材と、基材に二次元配列され貫通した複数の開口部を有する開口部群OPとを備えている。配列ガイド部材21は、水平に設置して、当該配列ガイド部材21の開口部群OPに複数の発光素子10をそれぞれ嵌め込み、複数の発光素子10を開口部群OPの二次元配列に倣って整列させることができるように構成されている。
本実施形態において、配列ガイド部材21は、水平に配置される整列板22の上に配置されている。整列板22は、平板状であって、配列ガイド部材21の下面に開口部群OPを覆って配置されている。整列板22は、配列ガイド部材21と同じ寸法の矩形状の外形形状を有している。
まず、図6(a)に示すように、水平に設置した配列ガイド部材21及び整列板22の上であって、配列ガイド部材21の上面に互いに分離された複数の発光素子10を載置する。
図7(d)〜(g)を参照して、実装工程を説明する。
まず、図7(d)に示すように、整列板22の上から配列ガイド部材21を取り外して、かつ転写板30を用意する。転写板30は、発光素子10をその整列を保持したまま転写するための仮基板である。転写板30の基材31の表面には、粘着材層32が塗布されている。
この実装工程を、全ての画素(全ての実装基板ARの上の実装領域)について繰り返して行うことによって、実装基板ARの上に発光素子10が二次元配列される表示装置DSPを製造できる。
他の実施形態に係る表示装置の製造方法について説明する。以下、他の実施形態に係る表示装置の製造方法によって製造できる、表示装置について説明する。
まず、用意する互いに分離された発光素子としては、例えば、第1,第2,第3発光素子10a,10b,10cが混在しているものを使用できる(S1´工程)。
次に、第1配列ガイド部材を、整列板の上に水平に配置して固定する(S2´工程)。次に、上記複数の発光素子を第1配列ガイド部材の上に載置し(S3´工程)、第1配列ガイド部材によって、第1発光素子10aを整列板の上に整列させる(第1整列工程(S4´工程))。この際、第1,第2,第3発光素子10a,10b,10cは互いに平面形状が異なり、それと相似形状で僅かに大きい寸法の第1,第2,第3開口部群も互いに平面形状が異なるため、第1発光素子10aのみが選択的に第1配列ガイド部材によって整列させられる。次に、整列板の上の整列した第1発光素子10aを、整列を保持したまま転写板に転写して、実装基板の上の対応する実装領域に実装する(第1実装工程(S5´工程))。
このような構成の表示装置DSP´でも、上記実施形態に係る表示装置DSPの製造方法と同様に製造できる。
Claims (14)
- 実装基板と、前記実装基板の上に二次元配列して実装される複数の発光素子とを備え、複数の前記発光素子は、前記二次元配列の平面に垂直な軸線に対して非回転対称性で、かつ前記二次元配列の平面に平行な軸線に対して非線対称性の平面形状を有する、表示装置の製造方法であって、
複数の前記発光素子を互いに分離して用意する工程;
平板状の基材と、前記基材に二次元配列され、前記発光素子の平面形状と相似形状で僅かに大きい寸法の貫通した複数の開口部を有する開口部群とを備える、配列ガイド部材を用意する工程;及び
前記配列ガイド部材を水平に設置して、当該配列ガイド部材の前記開口部群の前記複数の開口部に複数の前記発光素子をそれぞれ嵌め込み、複数の前記発光素子を前記開口部群の二次元配列に倣って整列させる整列工程;
を含む、表示装置の製造方法。 - 複数の前記発光素子は、それぞれ平板状のマイクロ発光ダイオードである、請求項1に記載の表示装置の製造方法。
- 前記整列工程は、前記配列ガイド部材の上に複数の前記発光素子を載せ、当該配列ガイド部材を揺動及び振動させ、複数の前記発光素子を移動及び回転させることによって、複数の前記発光素子を前記開口部群に嵌め込ませる、請求項1又は2に記載の表示装置の製造方法。
- 前記整列工程では、前記配列ガイド部材の下面に前記開口部群を覆って配置される平板状の整列板を固定して配置し、かつ複数の前記発光素子を前記整列板の上に前記開口部群に倣って整列させる、請求項1〜3のいずれか1項に記載の表示装置の製造方法。
- 前記整列された複数の前記発光素子を、その整列を保持したまま、前記実装基板の上に実装する実装工程を更に含む、請求項1〜4のいずれか1項に記載の表示装置の製造方法。
- 前記実装工程は、前記整列された複数の前記発光素子を、転写板上にその整列を保持したまま転写後、前記転写板から前記実装基板の上に転写され実装される、請求項5に記載の表示装置の製造方法。
- 前記整列工程では、複数の前記発光素子の主発光面側を上に向けて整列させ、
前記実装工程では、前記発光素子の前記主発光面側を前記転写板で保持して、実装基板の上に転写して実装する、
請求項6に記載の表示装置の製造方法。 - 前記用意される複数の前記発光素子は、第1色を呈する第1発光素子と、第2色を呈する第2発光素子と、第3色を呈する第3発光素子と含み、それらは互いに平面形状が異なり、
前記用意する前記配列ガイド部材は、前記第1発光素子の平面形状と相似形状で僅かに大きい寸法の貫通した複数の開口部を有する第1開口部群を備える第1配列ガイド部材と、前記第2発光素子の平面形状と相似形状で僅かに大きい寸法の貫通した複数の開口部を有する第2開口部群を備える第2配列ガイド部材と、前記第3発光素子の平面形状と相似形状で僅かに大きい寸法の貫通した複数の開口部を有する第3開口部群を備える第3配列ガイド部材とを含み、
前記整列工程は、前記第1発光素子を前記第1配列ガイド部材によって前記第1開口部群の二次元配列に倣って整列させる第1整列工程と、前記第2発光素子を前記第2配列ガイド部材によって前記第2開口部群の二次元配列に倣って整列させる第2整列工程と、前記第3発光素子を前記第3配列ガイド部材によって前記第3開口部群の二次元配列に倣って整列させる第3整列工程とを含む、
請求項1〜7のいずれか1項に記載の表示装置の製造方法。 - 複数の前記発光素子は、それぞれ長方形の4つの角部のうち、1つの角部を切り欠いた平面形状を有する、請求項1〜8のいずれか1項に記載の表示装置の製造方法。
- 実装基板と、前記実装基板の上に二次元配列して実装される複数の発光素子とを備え、
複数の前記発光素子は、前記二次元配列の平面に垂直な軸線に対して非回転対称性で、かつ前記二次元配列の平面に平行な軸線に対して非線対称性の平面形状を有し、
複数の前記発光素子は、第1色を呈する第1発光素子と、第2色を呈する第2発光素子と、第3色を呈する第3発光素子と含み、それらは互いに平面形状が異なる、
表示装置。 - 複数の前記発光素子は、それぞれ平板状のマイクロ発光ダイオードである、請求項10に記載の表示装置。
- 前記発光素子は、発光層、第1電極、及び第2電極を備え、
前記第1電極及び前記第2電極は、前記発光層の下側に配置される、
請求項10又は11に記載の表示装置。 - 前記発光素子は、発光層、第1電極、及び第2電極を備え、
前記第1電極及び前記第2電極は、前記発光層を挟んで対向して配置される、
請求項10〜12のいずれか1項に記載の表示装置。 - 前記発光素子は、絶縁基材層を含まない、
請求項10〜13のいずれか1項に記載の表示装置。
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