JP2021033744A - IC module - Google Patents

Abstract

To provide an IC module that makes sufficient transformer coupling with a communication medium in a small size and has sufficient reliability.SOLUTION: An IC module has a closed circuit composed of a first terminal of an IC chip, a first wire, an inner end of bridge wiring, the bridge wiring, an outer end of the bridge wiring, a second wire, an outer terminal portion of a magnetic field connection coil, the magnetic field connection coil, an inner terminal portion of the magnetic field connection coil, a third wire, and a second terminal of the IC chip. A first end of the second wire is connected to the outer end of the bridge wiring exposed on the bottom of a second through hole by ball bonding method. A second end of the second wire is connected to the outer terminal portion of the magnetic field connection coil by wedge bonding method. The first wire, the second wire, and the third wire are protected with a resin sealing portion. Such an IC module is manufactured.SELECTED DRAWING: Figure 4

Description

The present invention relates to an IC module for a dual IC card capable of contact communication and non-contact communication.

An IC module equipped with an IC chip having a contact communication function and a non-contact communication function has been used for various purposes because the communication form can be properly used according to the application of the user. This IC module performs power supply and communication from the card body in a non-contact manner by performing electromagnetic coupling (electromagnetic coupling, transformer coupling, etc.) with the magnetic field connection of the card body that forms the IC card by installing it. You can do things.

In dual IC cards, contact communication is used in applications that require certainty and security, such as a large amount of data exchange such as credit and communication of settlement operations. On the other hand, authentication is the main communication content such as gate management for entering and exiting a room, and non-contact communication is used for applications where the amount of communication data is small.

As in Patent Document 1, by electrically connecting the IC module and the card body by electromagnetic coupling, it is possible to prevent the electrical connection between the IC module and the card body from becoming unstable. .. This is because if the IC module and the card body are directly connected by a conductive connecting member such as solder, the connecting member may be damaged when the dual IC card is bent.

In the IC module for a dual IC card, an external contact terminal for contact communication with a contact type external device is formed on the upper surface, and a magnetic field connection coil for non-contact communication is formed on the lower surface.

An IC chip is mounted on the lower surface of the IC module, and the terminals of the IC chip and the external contact terminals whose electrodes are exposed on the bottom of the through hole are electrically connected by wire bonding. Further, the terminal of the IC chip and the end of the bridge wiring whose end is exposed at the bottom of the through hole located inside the magnetic field connection coil are electrically connected by wire bonding. Further, the terminal of the IC chip and the inner end of the magnetic field connection coil for non-contact communication formed on the lower surface of the IC module are electrically connected by wire bonding.

On the other hand, the outer terminal of the magnetic field connection coil is electrically connected to the end of the bridge wiring whose end is exposed at the bottom of the through hole located outside the magnetic field connection coil by wire bonding, and the bridge wiring is connected. Straddles the magnetic field connection coil and wires from the outside to the inside of the magnetic field connection coil, and exposes the end of the bridge wiring located inside the magnetic field connection coil to the bottom of the other through hole.

Japanese Unexamined Patent Publication No. 2015-007898

Due to recent demands for cost reduction, small size IC modules are required, and in order to make IC modules that satisfy the required functions in a limited space of small size, magnetic field connection coils, bonding pads, and bottoms are used. Restrictions on the formation positions of through holes with exposed electrode surfaces, wire bonding, etc. have become stricter, and there has been a problem of manufacturing an IC module having sufficient functions while satisfying these restrictions.

The present invention solves this problem, and the magnetic field connection coil has a sufficient function of transformer coupling with the coupling coil on the main body side of the communication medium in a limited space of a small size, and has sufficient reliability. The purpose is to obtain an IC module to have.

In order to solve the above problems, the present invention is an IC module installed and used on a communication medium.
It has an external contact terminal and bridge wiring on the upper surface of the board, and has a magnetic field connection coil and an IC chip on the lower surface of the board.
The bridge wiring is wired across the magnetic field connection coil.
The first through hole with the inner end of the bridge wiring exposed to the bottom, the second through hole with the outer end of the bridge wiring exposed to the bottom, and the external contact terminal exposed to the bottom. Has a third through hole
The diameter of the second through hole is formed to be equal to or smaller than the diameter of the first through hole and the third through hole.
The second through hole is formed closer to the central portion side than the edge side of the substrate.
The magnetic field connection coil wired to the center side of the substrate with respect to the second through hole is curved so as to avoid the second through hole, and the outer peripheral portion of the magnetic field connection coil is brought close to the second through hole. Wire around the second through hole.
The first terminal of the IC chip, the first wire, the inner end of the bridge wiring, the bridge wiring, the outer end of the bridge wiring, the second wire, and the magnetic field connection coil. A closed circuit is formed by the outer terminal portion, the magnetic field connection coil, the inner terminal portion of the magnetic field connection coil, the third wire, and the second terminal of the IC chip.
The first end of the second wire is connected to the outer end of the bridge wiring exposed at the bottom of the second through hole by a ball bonding method.
The second end of the second wire is connected to the outer terminal portion of the magnetic field connection coil by a wedge bonding method.
The IC module is characterized in that the first wire, the second wire, and the third wire are protected by a resin sealing portion.

According to this configuration, the present invention can increase the coupling coefficient in which the magnetic field connection coil is transformer-coupled to the coupling coil on the main body side of the communication medium in a limited space of a small size, and enhances the non-contact communication function of the communication medium. It has the effect of being able to do things.

Further, in the above IC module, the outer terminal portion of the magnetic field connection coil is arranged on the edge side of the substrate with respect to the second through hole, and the outer terminal portion of the magnetic field connection coil is the first. The IC module is characterized in that the second end of the wire 2 is connected to the surface of the substrate at an angle of 15 ° or less.

Further, in the present invention, in the above IC module, the width of the wiring of the portion of the magnetic field connecting coil curved so as to avoid the second through hole is larger than the width of the wiring of the other magnetic field connecting coil. It is an IC module characterized by being formed thinly.

Further, the present invention is characterized in that, in the above IC module, the resin sealing portion covering the second wire is a resin sealing portion different from the resin sealing portion covering the other wires. It is an IC module to be used.

Further, in the above IC module, the resin sealing portion covering the second wire is formed to be lower than the height of the resin sealing portion covering the other wires, and the IC module is formed. The IC module is characterized in that it is formed to be equal to or less than the thickness of the adhesive tape for adhering to the communication medium or the coating thickness of the adhesive resin.

The IC module of the present invention includes a first terminal of an IC chip, a first wire, an inner end portion of the bridge wiring, the bridge wiring, an outer end portion of the bridge wiring, and a second wire. An IC module in which a closed circuit is formed by the outer terminal portion of the magnetic field connection coil, the magnetic field connection coil, the inner terminal portion of the magnetic field connection coil, the third wire, and the second terminal of the IC chip. Is. The first end of the second wire is connected to the outer end of the bridge wiring exposed at the bottom of the second through hole by a ball bonding method, and the second end of the second wire is connected. Is connected to the outer terminal portion of the magnetic field connection coil by a wedge bonding method. Then, the first wire, the second wire, and the third wire are protected by the resin sealing portion.

According to this configuration, the present invention can increase the coupling coefficient in which the magnetic field connection coil is transformer-coupled to the coupling coil on the main body side of the communication medium in a limited space of a small size, and enhances the non-contact communication function of the communication medium. It has the effect of being able to do things.

It is sectional drawing which shows typically the communication medium of embodiment of this invention. It is a top view which shows through the card body of the communication medium of embodiment of this invention. (A) It is a schematic plan view of the upper surface of the IC module of the embodiment of this invention. (B) The same is a plan view showing a perspective view of the lower surface of the IC module. It is sectional drawing which shows typically the IC module of embodiment of this invention. It is a schematic plan view of the lower surface which shows the resin sealing part of the IC module of 1st Embodiment of this invention. It is sectional drawing which shows typically the resin sealing part of the IC module of 1st Embodiment of this invention. It is a top view which shows the part of the magnetic field connection coil which was curved avoiding the 2nd through hole of the IC module of 1st Embodiment of this invention. It is a top view which shows the part of the magnetic field connection coil which was curved avoiding the 2nd through hole of the IC module of the 2nd Embodiment of this invention. It is a schematic plan view of the lower surface which shows the resin sealing part of the IC module of the 3rd Embodiment of this invention. It is sectional drawing which shows typically the resin sealing part of the IC module of the 3rd Embodiment of this invention.

<First Embodiment>
Hereinafter, the first embodiment of the IC module of the present invention will be described with reference to FIGS. 1 to 7. FIG. 1 is a sectional view schematically showing an IC card 10 which is one of the communication media in which the dual interface type IC module 20 of the present invention is installed, and FIG. 2 is a plan view thereof. FIG. 3 is a plan view of the IC module 20, and FIG. 4 is a side sectional view. FIG. 6 is a side sectional view showing the resin sealing portion of the IC module 20.

As shown in the cross-sectional view of FIG. 1 and the plan view of FIG. 2, the IC card 10 as one of the communication media on which the IC module 20 of the present invention is installed has a card body composed of a plate-shaped card base material 11. The IC module 20 is embedded in the recess 12 of the card base material 11 to form the IC card 10.

In the plan view of FIG. 2, the contact type external contact terminal 21 exposed on the upper surface of the IC card 10 of the IC module 20 embedded in the IC card 10 and the antenna substrate 13 embedded in the inner layer of the card body of the IC card 10 The formed coupling coil 15, the communication coil 16, and the resonant capacitive element 14 are shown in a perspective view.

The materials used for the card base material 11 and the antenna substrate 13 are polyester-based materials such as amorphous polyester, vinyl chloride-based materials such as PVC (polyvinyl chloride), polycarbonate-based materials, PET (polyethylene terephthalate) and PET-G (polyethylene terephthalate). A material having general insulating properties and durability is used as the card equipment 11 such as polyethylene terephthalate copolymer) and polyethylene naphthalate (PEN), and the antenna substrate 13.

(Communication coil 16 and coupling coil 15)
The communication coil 16 formed on the antenna substrate 13 communicates with a reader / writer of an external device in a non-contact manner, and the coupling coil 15 is transformer-coupled to the magnetic field connection coil 25 of the IC module 20.

(IC module 20)
FIG. 3 is a plan view of the IC module 20 according to the first embodiment of the present invention. FIG. 3A is a diagram showing the shape of the IC module 20 on the substrate contact terminal surface (upper surface) side, and FIG. 3B is a perspective view of the IC module 20 from the upper surface side of the substrate coil. The pattern on the forming surface (lower surface) side is shown. The thickness of the module substrate 20a of the IC module 20 is, for example, 50 to 200 μm.

The external contact terminal 21 on the upper surface side of the IC module 20 is a terminal for contact communication with an external reader. Then, as shown in the plan view of FIG. 3B, a magnetic field connection coil 25, which is a non-contact communication unit, is provided on the lower surface of the module substrate 20a of the IC module 20, and the IC chip 30 is adhered to the surface.

As shown in FIG. 3A, the upper surface (board contact terminal surface) of the module substrate 20a of the IC module 20 includes a plurality of contact terminals (contact terminal portions) 35 that cover almost the entire surface, and a bridge wiring 26. There is.

(Magnetic field connection coil 25)
As shown in FIG. 3B, the magnetic field connection coil 25 formed on the lower surface of the module substrate 20a is formed by spirally winding several times around the IC chip 30 and the through holes 22 and 24. A second through hole 23 is formed near the outer terminal portion 25a.

The magnetic field connection coil 25 is formed by patterning a copper foil or an aluminum foil by etching. The thickness of the magnetic field connection coil 25 is, for example, 5 to 50 μm. The magnetic field connection coil 25 constitutes a non-contact terminal portion by electromagnetic coupling with the coupling coil 18 of the IC card 10.

The inner terminal portion 25b of the magnetic field connection coil 25 is electrically connected to the second terminal 32 of the IC chip 30 by wire bonding of the third wire 43. On the other hand, the outer terminal portion 25a of the magnetic field connection coil 25 is electrically connected to the outer end portion of the bridge wiring 26 whose end is exposed at the bottom of the second through hole 23 by wire bonding of the second wire 42. Connecting.

(Bridge wiring 26)
The bridge wiring 26 formed on the upper surface of the module substrate 20a as shown in FIG. 3A is a magnetic field connection formed on the lower surface of the module substrate 20a shown in a perspective view from the upper surface side of the module substrate 20a in FIG. 3B. It is formed so as to straddle the coil 25.

The bridge wiring 26 having the outer end portion located outside the magnetic field connection coil exposed at the bottom of the second through hole 23 straddles the magnetic field connection coil 25 and is wired from the outside to the inside of the magnetic field connection coil 25. The inner end located inside the magnetic field connection coil of the bridge wiring 26 is exposed to the bottom of the first through hole 22. The inner end of the bridge wiring 26 exposed at the bottom of the first through hole 22 is electrically connected to the first terminal 31 of the IC chip 30 by wire bonding of the first wire 41.

As shown in the plan view of FIG. 3B, the IC chip 30 is adhered to the lower surface of the module substrate 20a of the IC module 20 and protected by the resin sealing portion 50 as shown in FIGS. 5 and 6.

(Blind through hole)
After the copper foil is adhered to the entire lower surface of the module substrate 20a, the IC module 20 has a first through hole 22 inside the magnetic field connection coil 25 and a second through hole outside the magnetic field connection coil 25 by a method such as punching. The hole 23 and the third through hole 24 inside the magnetic field connection coil 25 are formed.

A copper foil is attached to the upper surface of the module substrate 20a to close the through holes 22, 23, and 24 to form a blind through hole. After that, by etching the copper foil, a pattern of the magnetic field connection coil 25 is formed on the lower surface of the module substrate 20a as shown in the plan view of FIG. 3 and the cross-sectional view of FIG. 4, and the upper surface of the module substrate 20a (board contact terminal) is formed. A pattern of the external contact terminal 21 and the bridge wiring 26 is formed on the surface).

As a result, as shown in FIG. 4, the inner end of the bridge wiring 26 is exposed to the bottom of the first through hole 22, and the outer end of the bridge wiring 26 is exposed to the bottom of the second through hole 23. It is formed by exposing the electrode of the external contact terminal 21 to the bottom of the third through hole 24. Here, the outer end portion of the bridge wiring 26 near the outer terminal portion 25a of the magnetic field connection coil 25 is formed with a diameter equal to or smaller than the diameter of the first through hole 22 and the third through hole 24. It is exposed to the bottom of the second through hole 23.

(Position of second through hole 23 and wiring of magnetic field connection coil 25)
The outer end of the bridge wiring 26 is exposed at the bottom of the second through hole 23. The diameter of the second through hole 23 is formed to be equal to or smaller than the diameter of the first through hole 22 and the third through hole 24.

Then, the position of the second through hole 23 on the outside of the magnetic field connection coil 25 is formed closer to the central portion side than the edge side of the module substrate 20a as shown in the plan view of FIG. 7.

Along with this, the magnetic field connection coil 25 to be wired closer to the center of the module substrate 20a than the second through hole 23 is curved so as to avoid the second through hole 23. The outermost peripheral portion of the curved magnetic field connection coil 25 is in contact with the edge of the second through hole 23, or is a distance of 150 μm or less from the edge of the second through hole 23 without using another conductor pattern. The second through hole 23 is surrounded by the wiring.

As such, the diameter of the second through hole 23 is formed to be equal to or smaller than the diameter of the first through hole 22 and the third through hole 24, and the outer peripheral portion of the magnetic field connecting coil 25 is formed into a second through hole 25. Wire as close as possible to the through hole 23 of.

By doing so, the area surrounded by the magnetic field connection coil 25 avoiding the second through hole 23, that is, the wiring area of the magnetic field connection coil 25 can be widened, so that the magnetic field connection coil 25 and the coupling coil 15 of the antenna substrate 13 can be widened. There is an effect that the coupling coefficient for transformer coupling can be increased and the non-contact communication function of the IC card 10 can be enhanced.

(Position of the outer terminal portion 25a of the magnetic field connection coil 25)
The outermost terminal portion 25a arranged on the outermost side of the magnetic field connection coil 25 and the inner terminal part 25b of the magnetic field connection coil 25 arranged on the innermost side form a width wider than the wire.

The position of the outer terminal portion 25a of the magnetic field connection coil 25 is curved and wired closer to the center portion side than the edge side of the module substrate 20a so as to be located near the second through hole 23. It is arranged in the curved portion near the second through hole 23.

The outer terminal portion 25a intersects the edge side of the module substrate 20a of the second through hole 23 perpendicularly from the center of the second through hole 23 to the edge line of the module substrate 20a as shown in the plan view of FIG. Form in the direction of the line segment. As shown in the plan view of FIG. 7, the outer terminal portion 25a is in contact with the edge of the second through hole 23, or is separated from the edge of the second through hole 23 by a distance of 150 μm or less without passing through another conductor pattern. Form at the correct position.

By forming the outer terminal portion 25a on the edge side of the module substrate 20a of the second through hole 23, the portion of the magnetic field connection coil 25 connected to the outer terminal portion 25a is formed on the module substrate 20a rather than the second through hole 23. Can be wired to the veranda. As a result, the area surrounded by the magnetic field connection coil 25 avoiding the second through hole 23, that is, the wiring area of the magnetic field connection coil 25 can be widened, so that the magnetic field connection coil 25 is transformer-coupled to the coupling coil 15 of the antenna substrate 13. There is an effect that the coupling coefficient can be increased and the non-contact communication function of the IC card 10 can be enhanced.

Then, most of the periphery of the edge of the second through hole 23 is formed in a pattern surrounded by the outermost peripheral portion and the outer terminal portion 25a of the magnetic field connection coil 25.

By surrounding most of the periphery of the edge of the second through hole 23 with the outermost peripheral portion of the magnetic field connection coil 25 and the outer terminal portion 25a, the connection portion of the second wire 42 to the outer terminal portion 25a by wire bonding is formed. Can be mechanically strengthened. This has the effect of increasing the resistance of the electrical connection to mechanical stress.

(IC chip 30)
A first terminal 31, a second terminal 32, and a plurality of third terminals 33 are formed on the outer surface of the IC chip 30.

As shown in FIG. 4, a first wire (first conductive wire) 41 is connected to the first terminal 31 of the IC chip 30, and the other end of the first wire (first conductive wire) 41 is connected. , Connects to the inner end of the bridge wiring 26 exposed at the bottom of the first through hole 22. The outer end of the bridge wiring 26 is exposed to the bottom of the second through hole 23, and the second wire 42 is connected to the bottom.

Here, the first terminal 31 of the IC chip 30, the first wire (first conductive wire) 41, the bridge wiring 26, the second wire 42, the outer terminal portion 25a of the magnetic field connection coil 25, and the magnetic field connection coil. 25, the inner terminal portion 25b of the magnetic field connection coil 25, the third wire 43, and the second terminal 32 of the IC chip 30 form a closed circuit.

Here, one end of the third wire 43 is connected to the second terminal 32 of the IC chip 30, and the other end of the third wire 43 is connected to the inner terminal portion 25b of the magnetic field connection coil 25.

Further, one end of the fourth wire 44 is connected to the third terminal 33 of the IC chip 30, and the other end of the fourth wire 44 is an external contact terminal 21 exposed at the bottom of the third through hole 24. Connect to.

The wires 41, 42, 43, 44 are made of gold, copper or aluminum and have an outer diameter of, for example, 10-40 μm.

(Wire connected to IC chip 30)
The first terminal 31 of the IC chip 30 and the inner end of the bridge wiring 26 are connected by punching hole wire bonding using the first wire 41.

(First wire 41)
The first wire 41 is connected to the first terminal 31 of the IC chip 30 by a ball bonding method. That is, a metal ball is formed by using heat such as discharge from the first end of the first wire 41 inserted and mounted on the bonding tool, and the metal ball is formed into the bonding tool. It is connected to the first terminal 31 of the IC chip 30 by a ball bonding method of crimping to a bonding region by any means of thermocompression bonding, thermal ultrasonic bonding, or ultrasonic bonding while suppressing the pressure.

The second end of the first wire 41 is connected to the inner end of the bridge wiring 26 exposed at the bottom of the first through hole 22 by a wedge bonding method. That is, the first is performed by a wedge bonding method in which the second end of the first wire 41 inserted and mounted on the bonding tool is directly suppressed by the bonding tool and heat or ultrasonic waves are applied to crimp the bonding region. It is connected to the inner end of the bridge wiring 26 exposed at the bottom of the through hole 22.

(Third wire 43)
The second terminal 32 of the IC chip 30 and the inner terminal portion 25b of the magnetic field connection coil 25 are connected by wire bonding using the third wire 43. That is, the first end of the third wire 43 is connected to the second terminal 32 of the IC chip 30 by a ball bonding method. The second end of the third wire 43 is connected to the inner terminal portion 25b of the magnetic field connection coil 25 by a wedge bonding method.

(Fourth wire 44)
The third terminal 33 of the IC chip 30 and the external contact terminal 21 are connected by punching hole wire bonding using the fourth wire 44. That is, the first end of the fourth wire 44 is connected to the third terminal 33 of the IC chip 30 by a ball bonding method. The second end of the fourth wire 44 is connected to the external contact terminal 21 exposed at the bottom of the third through hole 24 by a wedge bonding method.

(The bridge wiring 26 and the magnetic field connection coil 25 are connected by the second wire 42)
Further, as shown in FIG. 4B, the bridge wiring 26 exposed at the bottom of the second through hole 23 formed with a diameter equal to or smaller than the diameter of the first through hole 22 and the third through hole 24. The outer end portion of the magnetic field connection coil 25 is connected to the outer terminal portion 25a of the magnetic field connection coil 25 via the second wire 42.

As shown in the plan view of FIG. 7, the outer terminal portion 25a of the magnetic field connection coil 25 is in contact with the edge of the second through hole 23 or from the edge of the second through hole 23 without passing through another conductor pattern. It is formed at a position separated by a distance of 150 μm or less.

That is, the first end of the second wire 42 is connected to the outer end of the bridge wiring 26 exposed at the bottom of the second through hole 23 by a ball bonding method.

Next, as shown in the cross-sectional view of FIG. 4C and the plan view of FIG. 7, the second end of the second wire 42 is connected to the outer terminal portion 25a of the magnetic field connection coil 25 by a wedge bonding method.

The wiring direction of the second wire 42 from the connection portion at the bottom of the second through hole 23 to the connection portion on the outer terminal portion 25a is the bottom of the second through hole 23 as shown in the plan view of FIG. Wiring is performed at an angle of 10 ° or more and 45 ° or less in the horizontal direction from the direction perpendicularly intersecting the edge line of the module substrate 20a from the center of the wiring.

Further, as shown in FIG. 4C, in the wedge bonding method of the second end of the second wire 42, the second end of the second wire 42 inserted and mounted on the bonding tool is bonded to the bonding tool. It is directly suppressed by a wire, and heat or ultrasonic waves are applied to crimp it to the bonding area. By the wedge bonding method, the second wire 42 is connected to the outer terminal portion 25a of the magnetic field connection coil 25 so that the angle formed from the surface of the module substrate 20a is 15 ° or less.

In this way, by connecting the first end of the second wire 42 to the outer end of the bridge wiring 26 exposed at the bottom of the second through hole 23 by a ball bonding method, the second wire 42 is connected to the second end. The diameter of the second through hole 23 provided for connecting the end of 1 can be reduced, and the area avoided by the wiring of the magnetic field connection coil 25 which is wired avoiding the second through hole 23 as shown in FIG. 3 (b). Can be made smaller.

As a result, the wiring area of the magnetic field connection coil 25 can be widened, so that the coupling coefficient at which the magnetic field connection coil 25 is transformer-coupled to the coupling coil 15 of the antenna substrate 13 can be increased, and the non-contact communication function of the IC card 10 can be enhanced. Has the effect of being able to.

Further, the following effects can be obtained by connecting the second end of the second wire 42 to the outer terminal portion 25a of the magnetic field connection coil 25 by the wedge bonding method. That is, by connecting the second wire 42 to the outer terminal portion 25a of the magnetic field connection coil 25 by the wedge bonding method, the height of the second wire 42 at the outer terminal portion 25a of the magnetic field connection coil 25 can be made low. effective.

As a result, the mechanical strength of the portion where the joint portion between the outer terminal portion 25a of the magnetic field connection coil 25 and the second end of the second wire 42 is sealed by the resin sealing portion 50 is strengthened, and the mechanical strength of the portion of the wire 42 is increased. It has the effect of preventing disconnection.

(Resin sealing part 50)
Resin sealing covering the entire IC chip 30, the first wire 41, the second wire 42, the third wire 43, and the fourth wire 44 as shown in the plan view of FIG. 5 and the cross-sectional view of FIG. A unit 50 is provided. The resin sealing portion 50 can be formed of an epoxy resin or the like. By providing the resin sealing portion 50 in the IC module 20, disconnection of the wires 41, 42, 43, 44 is prevented.

The resin sealing portion 50 should be small in size as long as it can cover the IC chip 30 and the wires 41, 42, 43, 44 and has a certain strength. It is not necessary to increase the size of the resin sealing portion 50 until it covers the entire magnetic field connecting coil 25.

Here, as shown in FIG. 5, in order to cover the outer terminal portion 25a of the magnetic field connection coil 25, the second wire 42, and the second through hole 23 with the resin sealing portion 50, the second through hole 23 is covered with an IC chip. Bring it closer to the 30 side. Since the second through hole 23 is outside the magnetic field connection coil 25, it is necessary to bend a part of the magnetic field connection coil 25 toward the IC chip 30 side.

In this way, the resin sealing portion 50 of the resin sealing portion 50 which brings the second through hole 23 closer to the IC chip 30 side and covers the second through hole 23 and the second wire 42 together with the other wires 41, 43, 44. Reduce the volume.

Further, the outer terminal portion 25a is formed on the edge side of the module substrate 20a of the second through hole 23, and the second end of the second wire 42 is attached to the outer terminal portion 25a by a wedge bonding method. Gently connect the angles formed by the surfaces of 15 ° or less. Since the outer terminal portion 25a to which the second end of the second wire 42 is loosely connected at 15 ° or less is formed on the edge side of the module substrate 20a of the second through hole 23, the second wire The height of the end of the resin sealing portion 50 surrounding the 42 can be set low.

By doing so, the volume of the resin sealing portion 50 can be reduced, so that the area of the recess 12 of the IC card 10 in which the resin sealing portion 50 is embedded can be reduced. Therefore, as shown in FIG. 1, the inner diameter of the wiring of the coupling coil 15 of the IC card 10 to be wired while avoiding the recess 12 of the IC card 10 can be reduced according to the inner diameter of the wiring of the magnetic field connection coil 25. , The coupling coefficient for transformer coupling between the coupling coil 15 of the IC card 10 and the magnetic field connection coil 25 of the IC module 20 can be increased, and the non-contact communication function of the IC card 10 can be enhanced.

(Manufacturing method of IC module 20)
Next, a method of manufacturing the IC module 20 for manufacturing the IC module 20 configured as described above will be described.

First, a copper foil is adhered to the entire lower surface of the module substrate 20a, and then the first through hole 22, the second through hole 23, and the third through hole 24 are formed by a method such as punching. Here, the second through hole 23 that exposes the outer end portion of the bridge wiring 26 near the outer terminal portion 25a of the magnetic field connection coil 25 is equal to or equal to that of the first through hole 22 and the third through hole 24. Form with a smaller diameter.

Next, a copper foil is attached to the upper surface of the module substrate 20a to close the through holes 22, 23, and 24 to form a blind through hole. After that, by etching the copper foil, a pattern of a plurality of external contact terminals 21 and a bridge wiring 26 is formed on the upper surface of the module substrate 20a, a pattern of the magnetic field connection coil 25 is formed on the lower surface of the module substrate 20a, and the magnetic field thereof is formed. An outer terminal portion 25a is formed at the outer end of the connection coil 25, and an inner terminal portion 25b is formed at the inner end.

(Modification example 1)
As a modification 1, the external contact terminal 21 and the bridge wiring 26 can also be formed by laminating a copper foil pattern on which a predetermined pattern is formed in advance on the upper surface of the module substrate 20a. At this time, the copper foil pattern is aligned so that the ends of the bridge wiring 26 overlap the first through hole 22 and the second through hole 23.

In this way, the inner end of the bridge wiring 26 is exposed to the bottom of the first through hole 22, and the outer end of the bridge wiring 26 is exposed to the bottom of the second through hole 23.
The electrode of the external contact terminal 21 is exposed and formed on the bottom of the third through hole 24.

Next, as shown in FIG. 4, the IC chip 30 is adhered to the lower surface of the module substrate 20a with an adhesive. Subsequently, as shown in FIG. 4A, the first terminal 31 of the IC chip 30 and the inner end of the bridge wiring 26 exposed at the bottom of the first through hole 22 are connected by the first wire 41. To do.

First, a metal ball is formed on the first terminal 31 of the IC chip 30 by using heat such as discharge from the first end of the first wire 41 inserted and mounted on the bonding tool. This metal ball is connected by a ball bonding method of crimping to a bonding region by any means of thermocompression bonding, thermal ultrasonic bonding, or ultrasonic bonding while holding down with a bonding tool.

Next, the second end of the first wire inserted and mounted on the bonding tool is directly pressed by the bonding tool at the inner end of the bridge wiring 26 exposed to the bottom of the first through hole 22. The connection is made by a wedge bonding method in which heat or ultrasonic waves are applied to crimp the bonding region.

In this wedge bonding, a bonding portion at the second end of the first wire 41 is mounted on the inner end portion of the bridge wiring 26 exposed at the bottom of the first through hole 22, and the first mounted portion thereof is mounted. A wedge bonding tool 11 having a non-slip treatment on the end face is pressed onto the bonding portion at the second end of the wire 41, and at the same time, ultrasonic waves 9 are applied at room temperature to the first wire 41. The bonding portion at the second end is connected to the inner end portion of the bridge wiring 26 exposed at the bottom of the through hole 22.

Further, the second terminal 32 of the IC chip 30 and the inner terminal portion 25b of the magnetic field connection coil 25 are connected by a third wire 43.

First, a metal ball is formed at the tip of a third wire inserted and mounted on a bonding tool at the second terminal 32 of the IC chip 30 by using heat such as discharge, and the metal ball is formed. The wires are connected by a ball bonding method of crimping to a bonding region by any of thermocompression bonding, thermal ultrasonic bonding, and ultrasonic bonding while holding down the wires with a bonding tool.

Next, the second end of the third wire inserted and mounted on the bonding tool is directly suppressed by the bonding tool to the inner terminal portion 25b of the magnetic field connection coil 25, and heat or ultrasonic waves are applied to bond. Connect by a wedge bonding method that crimps the area.

Further, the third terminal 33 of the IC chip 30 and the external contact terminal 21 exposed at the bottom of the third through hole 24 are connected by the fourth wire 44.

First, a metal ball is formed by using heat such as discharge from the first end of a fourth wire 44 that is inserted and mounted on a bonding tool at the third terminal 33 of the IC chip 30. This metal ball is connected by a ball bonding method of crimping to a bonding region by any means of thermocompression bonding, thermal ultrasonic bonding, or ultrasonic bonding while holding down with a bonding tool.

Next, the second end of the fourth wire 44, which is inserted and mounted on the bonding tool, is directly suppressed by the bonding tool to the external contact terminal 21 exposed at the bottom of the third through hole 24, and heat is generated. Alternatively, the connection is made by a wedge bonding method in which ultrasonic waves are applied to crimp the bonding region.

(The second wire 42 connects the outer end of the bridge wiring 26 to the outer terminal 25a of the magnetic field connection coil 25).
The outer end of the bridge wiring 26 exposed at the bottom of the second through hole 23 formed with a diameter equal to or smaller than that of the first through hole 22 and the third through hole 24, and the outer terminal of the magnetic field connection coil 25. The portion 25a is connected by the second wire 42.

First, a metal bob is used at the outer end of the bridge wiring 26 exposed at the bottom of the second through hole 23, and at the end of the second wire 42 inserted and attached to the bonding tool by using heat such as discharge. A wire is formed, and the metal ball is connected by a ball bonding method in which the metal ball is bonded to the bonding region by thermocompression bonding, thermal ultrasonic bonding, or ultrasonic bonding while holding the metal ball with a bonding tool. To do.

Next, as shown in FIG. 4C, the second end of the second wire inserted and mounted on the bonding tool is directly pressed by the bonding tool on the outer terminal portion 25a of the magnetic field connection coil 25. By a wedge bonding method in which heat or ultrasonic waves are applied and crimped to the bonding region, the surface of the outer terminal portion 25a and the second wire 42 are connected at an angle of 15 ° or less.

Then, the IC chip 30, the wires 41, 42, 43, 44 are resin-sealed in the mold, and the resin-sealed portion covering the IC chip 30, the wires 41, 42, 43, 44 as shown in FIGS. 5 and 6. The IC module 20 is manufactured by forming 50.

The IC module 20 manufactured in this way is embedded in the recess 12 of the IC card 10 as shown in FIG. 1, and the IC module 20 is bonded to the recess 12 of the IC card 10 with an adhesive such as a hot melt sheet to provide a dual interface. The IC card 10 is manufactured.

<Second embodiment>
The difference between the second embodiment and the first embodiment is that, as shown in the plan view of FIG. 8, the magnetic field avoiding the second through hole 23 formed closer to the central portion than the edge side of the module substrate 20a. The wiring width of the portion of the connecting coil 25 that is curved so as to surround the second through hole 23 is narrower than the wiring width of the magnetic field connecting coil 25 of the other portion of the magnetic field connecting coil 25.

By doing so, the area surrounded by the magnetic field connection coil 25, that is, the wiring area of the magnetic field connection coil 25 can be widened, so that the coupling coefficient at which the magnetic field connection coil 25 is transformer-coupled to the coupling coil 15 of the antenna substrate 13 can be increased. There is an effect that the non-contact communication function of the IC card 10 can be enhanced.

<Third embodiment>
The third embodiment differs from the above-described embodiment in that the IC chip 30, the first wire 41, the third wire 43, and the fourth wire are as shown in the plan view of FIG. 9 and the cross-sectional view of FIG. The first resin sealing portion 51 that covers the wire 44, the outer terminal portion 25a of the magnetic field connection coil 25, and the second resin sealing portion 52 that covers the second wire 42 are separately provided.

By dividing the resin sealing portion 50 into the first resin sealing portion 51 and the second resin sealing portion 52 in this way, there is an effect that the volume of the entire resin sealing portion 50 can be reduced. As a result, the inner diameter of the wiring of the coupling coil 15 of the IC card 10 to be wired while avoiding the recess 12 of the IC card 10 as shown in FIG. 1 can be reduced to match the inner diameter of the wiring of the magnetic field connection coil 25. As a result, the coupling coefficient for transformer-coupling the coupling coil 15 of the IC card 10 and the magnetic field connection coil 25 of the IC module 20 can be increased, and the non-contact communication function of the IC card 10 can be enhanced.

(Modification 2)
As a modification 2 of the third embodiment, the first resin sealing portion 51 is molded using two types of resins, a dam material and a fill material, and the second resin sealing portion 52 is the previous dam. Molding can be performed using either a material or a fill material, or one type of resin such as another resin.

(Modification example 3)
As a modification 3 of the third embodiment, the height of the second resin sealing portion 52 can be formed lower than the height of the first resin sealing portion 51.

(Modification example 3)
Further, as a modification 4 of the third embodiment, the height of the second resin sealing portion 52 formed to be lower than the height of the first resin sealing portion 51 is set so that the IC module 20 is recessed in the IC card 10. The thickness of the adhesive tape for adhering to 12 or the coating thickness of the adhesive resin should be equal to or less than that. Then, when the IC module 20 is adhered and fixed to the recess 12 of the IC card 10 with an adhesive, the thickness of the adhesive layer is made larger than the thickness of the second resin sealing portion 52.

By doing so, there is an effect that the surface of the IC module 20 after being attached to the recess 12 of the IC card 10 can be finished so as not to have irregularities. In addition, an adhesive can be applied and adhered between the recesses 12 that overlap with the second resin sealing portion 52 to improve the adhesive reliability of the recesses 12 of the IC module 20 and the IC card 10. There is a possible effect.

The present invention is not limited to the dual interface type IC module 20, but can also be applied to an IC module 20 dedicated to non-contact communication that does not have an external contact terminal 21. That is, it can also be applied to an IC module 20 dedicated to non-contact communication having a magnetic field connection coil 25 and transformer-coupling the magnetic field connection coil 25 with the coupling coil 15 of the card body of the IC card 10.

10 ... IC card 11 ... Card base material 12 ... Recess (cavity)
13 ... Antenna board 14 ... Resonant capacitive element 15 ... Coupling coil 16 ... Communication coil 20 ... IC module 20a ... Module board 21 ... External contact terminal 22 ... 1st through hole 23 ... 2nd through hole 24 ... 3rd through hole 25 ... Magnetic field connection coil 25a ... Outer terminal portion of magnetic field connection coil 25b ... Magnetic field connection Coil inner terminal 26 ... Bridge wiring 30 ... IC chip 31 ... IC chip first terminal 32 ... IC chip second terminal 33 ... IC chip third terminal 41 ... 1st wire 42 ... 2nd wire 43 ... 3rd wire 44 ... 4th wire 50 ... Resin sealing portion 51 ... 1st resin sealing Part 52 ... Second resin sealing part

Claims (5)

An IC module installed on a communication medium for use.
It has an external contact terminal and bridge wiring on the upper surface of the board, and has a magnetic field connection coil and an IC chip on the lower surface of the board.
The bridge wiring is wired across the magnetic field connection coil.
The first through hole with the inner end of the bridge wiring exposed to the bottom, the second through hole with the outer end of the bridge wiring exposed to the bottom, and the external contact terminal exposed to the bottom. Has a third through hole
The diameter of the second through hole is formed to be equal to or smaller than the diameter of the first through hole and the third through hole.
The second through hole is formed closer to the central portion side than the edge side of the substrate.
The magnetic field connection coil wired to the center side of the substrate with respect to the second through hole is curved so as to avoid the second through hole, and the outer peripheral portion of the magnetic field connection coil is brought close to the second through hole. Wire around the second through hole.
The first terminal of the IC chip, the first wire, the inner end of the bridge wiring, the bridge wiring, the outer end of the bridge wiring, the second wire, and the magnetic field connection coil. A closed circuit is formed by the outer terminal portion, the magnetic field connection coil, the inner terminal portion of the magnetic field connection coil, the third wire, and the second terminal of the IC chip.
The first end of the second wire is connected to the outer end of the bridge wiring exposed at the bottom of the second through hole by a ball bonding method.
The second end of the second wire is connected to the outer terminal portion of the magnetic field connection coil by a wedge bonding method.
An IC module characterized in that the first wire, the second wire, and the third wire are protected by a resin sealing portion. The IC module according to claim 1, wherein the outer terminal portion of the magnetic field connection coil is arranged on the edge side of the substrate with respect to the second through hole, and the second wire is provided on the outer terminal portion of the magnetic field connection coil. An IC module characterized in that an angle formed by the second end of the substrate from the surface of the substrate is connected at an inclination of 15 ° or less. The width of the wiring of the portion of the IC module according to claim 1 or 2 that is curved so as to avoid the second through hole of the magnetic field connection coil is larger than the width of the wiring of the other magnetic field connection coil. An IC module characterized by being formed thinly. The IC module according to any one of claims 1 to 3, wherein the resin sealing portion covering the second wire is a resin sealing portion different from the resin sealing portion covering the other wires. An IC module characterized by being present. The IC module according to claim 4, wherein the resin sealing portion covering the second wire is formed lower than the height of the resin sealing portion covering the other wire, and the IC module is used as the communication medium. An IC module characterized in that it is formed to be equal to or less than the thickness of the adhesive tape for adhering to the adhesive or the coating thickness of the adhesive resin.

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