JP2021022558A - Hermetic terminal - Google Patents
Hermetic terminal Download PDFInfo
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- JP2021022558A JP2021022558A JP2020106768A JP2020106768A JP2021022558A JP 2021022558 A JP2021022558 A JP 2021022558A JP 2020106768 A JP2020106768 A JP 2020106768A JP 2020106768 A JP2020106768 A JP 2020106768A JP 2021022558 A JP2021022558 A JP 2021022558A
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- outer ring
- glass
- metal outer
- copper
- airtight terminal
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- 239000011521 glass Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000011810 insulating material Substances 0.000 claims abstract description 24
- 238000009792 diffusion process Methods 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 9
- 230000007704 transition Effects 0.000 claims abstract description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 235000014676 Phragmites communis Nutrition 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- MCSXGCZMEPXKIW-UHFFFAOYSA-N 3-hydroxy-4-[(4-methyl-2-nitrophenyl)diazenyl]-N-(3-nitrophenyl)naphthalene-2-carboxamide Chemical compound Cc1ccc(N=Nc2c(O)c(cc3ccccc23)C(=O)Nc2cccc(c2)[N+]([O-])=O)c(c1)[N+]([O-])=O MCSXGCZMEPXKIW-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000010979 ruby Substances 0.000 description 2
- 229910001750 ruby Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
Description
本発明は、金属外環およびリードに銅を用いた気密端子に関する。 The present invention relates to an airtight terminal using copper for the metal outer ring and leads.
気密端子は、金属外環の挿通孔に絶縁材を介してリードを気密に封着したもので、気密容器内に収容された電気機器や素子に電流を供給したり、電気機器や素子から信号を外部に導出したりする場合に用いられる。特に金属外環とリードを絶縁ガラスで封着するＧＴＭＳ（Ｇｌａｓｓ−ｔｏ−Ｍｅｔａｌ−Ｓｅａｌ）タイプの気密端子は、整合封止型と圧縮封止型の２種類に大別される。前述の気密端子において信頼性の高い気密封止を確保するには、外環およびリードの金属材と絶縁ガラスの熱膨張係数を適正に選択することが重要となる。封止用の絶縁ガラスは、金属外環とリードの素材、要求温度プロファイルおよびその熱膨張係数によって決定されている。整合封止の場合、金属材と絶縁ガラスの熱膨張係数が可能な限り一致するように封止素材を選定する。一方、圧縮封止は、金属外環が絶縁ガラスおよびリードを圧縮するように意図的に異なる熱膨張係数の金属材と絶縁ガラスの材料が選択されている。 An airtight terminal is an airtight terminal in which a lead is airtightly sealed in an insertion hole of a metal outer ring via an insulating material, and a current is supplied to an electric device or element housed in the airtight container, or a signal is sent from the electric device or element. Is used when deriving to the outside. In particular, GTMS (Glass-to-Metal-Seal) type airtight terminals that seal the metal outer ring and leads with insulating glass are roughly classified into two types, a matching sealing type and a compression sealing type. In order to ensure highly reliable airtight sealing in the above-mentioned airtight terminals, it is important to properly select the coefficient of thermal expansion of the metal material of the outer ring and the reed and the insulating glass. The insulating glass for sealing is determined by the material of the metal outer ring and lead, the required temperature profile and its coefficient of thermal expansion. In the case of matched sealing, the sealing material is selected so that the coefficients of thermal expansion of the metal material and the insulating glass match as much as possible. On the other hand, for compression sealing, a metal material and an insulating glass material having intentionally different coefficients of thermal expansion are selected so that the metal outer ring compresses the insulating glass and the reed.
従来の気密端子は高い気密信頼性ならびに電気絶縁性を確保するため、整合封止型気密端子においては、金属外環およびリード材に広い温度範囲でガラス材と熱膨張係数が一致しているコバール合金（Ｆｅ５４％、Ｎｉ２８％、Ｃｏ１８％）を使用して、両者をホウケイ酸ガラスからなる絶縁ガラスで封着し、圧縮封止型気密端子においては、使用温度範囲においてガラスに同心円状の圧縮応力が加わるように、炭素鋼またはステンレス鋼などの鋼製の金属外環と、鉄ニッケル合金（Ｆｅ５０％、Ｎｉ５０％）や鉄クロム合金（Ｆｅ７２％、Ｃｒ２８％）などの鉄合金のリード材を使用して、両者をソーダバリウムガラスからなる絶縁ガラスで封着していた。 In order to ensure high airtightness reliability and electrical insulation of conventional airtight terminals, Kovar has the same thermal expansion coefficient as the glass material over a wide temperature range for the metal outer ring and lead material in the matched sealing type airtight terminal. Using an alloy (Fe 54%, Ni 28%, Co 18%), both are sealed with insulating glass made of borosilicate glass, and in the compression-sealed airtight terminal, the compressive stress concentric with the glass in the operating temperature range. Uses a metal outer ring made of steel such as carbon steel or stainless steel, and a lead material of an iron alloy such as an iron-nickel alloy (Fe50%, Ni50%) or an iron-chromium alloy (Fe72%, Cr28%). Then, both were sealed with insulating glass made of sodabarium glass.
昨今、特に車の電動化や電車の高速化が進むにつれて、高出力用途のＳｉＣ素子を使ったパワーデバイスの開発が活発であるが、これまで高放熱、大電流、高気密の全てに対応したパッケージがなく、その特性を生かせない状況にあった。一方、気密端子の電流容量を大きくするために、銅やアルミニウムなどの低抵抗導体からなる比較的大線径のリードを用いることできれば便利である。しかし、これら低抵抗導体は熱膨張率が大きく、これをより熱膨張率の小さいホウ珪酸ガラスやソーダライムガラスの絶縁ガラスで封止すると、低抵抗導体リードの膨張と収縮に伴い半径方向に引張り応力が生じ、その結果シール界面またはリード軸方向にガラス内部を貫通するクラックが発生しリーク不良となり易いという欠点があった。 In recent years, especially as the electrification of cars and the speeding up of trains have progressed, the development of power devices using SiC elements for high output applications has been active, but so far it has been compatible with all of high heat dissipation, large current, and high airtightness. There was no package, and the situation was such that the characteristics could not be utilized. On the other hand, in order to increase the current capacity of the airtight terminal, it is convenient if a lead having a relatively large wire diameter made of a low resistance conductor such as copper or aluminum can be used. However, these low-resistance conductors have a large coefficient of thermal expansion, and when they are sealed with insulating glass of borosilicate glass or soda lime glass, which has a lower coefficient of thermal expansion, they are pulled in the radial direction as the low-resistance conductor leads expand and contract. There is a drawback that stress is generated, and as a result, cracks penetrating the inside of the glass in the direction of the seal interface or the lead axis are generated, and leak defects are likely to occur.
本発明の目的は、高放熱、大電流、高気密の全てに適合した金属外環およびリードに銅などの低抵抗金属を用いた気密端子を提供することにある。 An object of the present invention is to provide an airtight terminal using a low resistance metal such as copper for a metal outer ring and a lead suitable for all of high heat dissipation, large current, and high airtightness.
本発明によれば、少なくとも１個の貫通孔を有した銅または銅合金からなる低抵抗導体の金属外環と、この金属外環の貫通孔に挿通した銅または銅合金からなる低抵抗導体のリードと、金属外環とリードとを封着する高膨張ガラスの絶縁材を備えたことを特徴とした気密端子が提供される。該絶縁材は、低抵抗導体と前記絶縁材とが接した界面の遷移領域のガラス中に低抵抗導体イオンの拡散帯を有する。上記拡散帯は、銅または銅合金の表面に対して高膨張ガラスの密着性を増し界面強度向上させる。 According to the present invention, a metal outer ring of a low resistance conductor made of copper or a copper alloy having at least one through hole and a low resistance conductor made of copper or a copper alloy inserted through the through hole of the metal outer ring. An airtight terminal is provided characterized in that it comprises a lead and a highly expansive glass insulating material that seals the metal outer ring and the lead. The insulating material has a diffusion zone of low resistance conductor ions in the glass at the transition region of the interface where the low resistance conductor and the insulating material are in contact with each other. The diffusion zone increases the adhesion of the highly expanded glass to the surface of copper or a copper alloy and improves the interfacial strength.
本発明の高膨張ガラスは、熱膨張係数１７±６ｐｐｍ／Ｋの範囲のものが利用でき銅の熱膨張係数１７ｐｐｍ／Ｋと整合している。また、銅は鋼材よりも融点が低く、ガラス封着温度が９００℃以上の高温で封着すると結晶粒が肥大化し、いわゆる焼鈍状態となって機械的強度が低下してしまう恐れがあり、できる限り低温封着するのが望ましい。 As the high expansion glass of the present invention, a glass having a coefficient of thermal expansion in the range of 17 ± 6 ppm / K can be used and is consistent with the coefficient of thermal expansion of copper of 17 ppm / K. In addition, copper has a lower melting point than steel, and if it is sealed at a high glass sealing temperature of 900 ° C or higher, the crystal grains may become enlarged, resulting in a so-called annealed state and the mechanical strength may decrease. It is desirable to seal at low temperature as much as possible.
本発明に係る気密端子１０は、図１に示すように、少なくとも１個の貫通孔１１を有した銅または銅合金からなる低抵抗導体の金属外環１２と、この金属外環１２の貫通孔１１に挿通した銅または銅合金からなる低抵抗導体のリード１３と、金属外環１２とリード１３とを封着する高膨張ガラスの絶縁材１４を備えたことを特徴とする。該絶縁材１４は、金属外環１２とリード１３とに接した界面の遷移領域のガラス中に銅イオンの拡散帯１５を有する。上記拡散帯１５は、銅または銅合金の表面に対して高膨張ガラスの密着性を増し界面強度向上させる。
As shown in FIG. 1, the
本発明の高膨張ガラスは、熱膨張係数１７±６ｐｐｍ／Ｋの範囲のものが利用できる。例えば、リン酸系ガラスが銅の熱膨張係数１７ｐｐｍ／Ｋと整合し利用できる。また、銅は鉄または鋼材よりも比較的融点が低く、ガラス封着温度が９００℃以上の高温で封着すると結晶粒が肥大化し、いわゆる焼鈍状態となって機械的強度が低下してしまう恐れがあり、できる限り低温封着するのが望ましい。 As the high expansion glass of the present invention, a glass having a coefficient of thermal expansion in the range of 17 ± 6 ppm / K can be used. For example, phosphoric acid-based glass can be used in harmony with the thermal expansion coefficient of copper of 17 ppm / K. In addition, copper has a relatively lower melting point than iron or steel, and if it is sealed at a high glass sealing temperature of 900 ° C or higher, the crystal grains may enlarge, resulting in a so-called annealed state and a decrease in mechanical strength. It is desirable to seal at a low temperature as much as possible.
本発明に係る実施例１の気密端子は、３個の貫通孔を有した銅の金属外環と、この金属外環の貫通孔に挿通した銅のリードと、金属外環とリードとをリン酸系ガラスからなる熱膨張係数１５．９ｐｐｍ／Ｋの高膨張ガラスの絶縁材とを備えたことを特徴とした整合封止型気密端子が提供される。該絶縁材は、金属外環とリードとに接した界面の遷移領域のガラス中に銅イオンの拡散帯を有する。この拡散帯は、図２の封着断面２０に示すように、拡散帯２５は、ガラス材からなる絶縁材２４中において銅リード２３と絶縁材２４との界面領域に形成されており、薄いピンク色から赤色ないし深赤色（ルビー色）の着色を呈した第一銅イオン由来の拡散物から構成される。銅の金属外環に銅のリードをガラス材で封着する場合、前記拡散帯２５が形成されると界面の機械的強度が向上でき、十分な密着と濡れが得られ気密性の確保が可能となる。 The airtight terminal of Example 1 according to the present invention has a copper metal outer ring having three through holes, a copper lead inserted through the through hole of the metal outer ring, and a metal outer ring and a lead. Provided is a matching sealed airtight terminal characterized by being provided with an insulating material of a highly expanding glass having a coefficient of thermal expansion of 15.9 ppm / K made of an acid-based glass. The insulating material has a diffusion zone of copper ions in the glass at the transition region of the interface in contact with the metal outer ring and the lead. As shown in the sealing cross section 20 of FIG. 2, the diffusion band 25 is formed in the interface region between the copper lead 23 and the insulating material 24 in the insulating material 24 made of a glass material, and is light pink. It is composed of a diffuser derived from cuprous ions, which is colored red to deep red (ruby color). When a copper lead is sealed to a copper metal outer ring with a glass material, the mechanical strength of the interface can be improved when the diffusion zone 25 is formed, and sufficient adhesion and wetting can be obtained to ensure airtightness. It becomes.
本発明に係る実施例１は、封着後さらに金属外環およびリードの露出表面にニッケル、ニッケル燐、ニッケルボロン、金めっきなど所望の仕上げめっきを施したものも利用できる。実施例に記載の絶縁材は、銅の熱膨張係数１７ｐｐｍ／Ｋと整合した高膨張ガラス材であればよく、リン酸系ガラスに替えて他の任意のガラス材を用いてもよい。 In Example 1 according to the present invention, the metal outer ring and the exposed surface of the reed are further subjected to desired finish plating such as nickel, nickel phosphorus, nickel boron, and gold plating after sealing. The insulating material described in the examples may be a high-expansion glass material consistent with a thermal expansion coefficient of copper of 17 ppm / K, and any other glass material may be used instead of the phosphoric acid-based glass.
本発明は、特に高電圧・高電流に耐久し、かつ高い気密性が要求される気密端子に利用できる。 INDUSTRIAL APPLICABILITY The present invention can be applied to an airtight terminal that is particularly durable against high voltage and high current and requires high airtightness.
気密端子１０、貫通孔１１、金属外環１２、リード１３、絶縁材１４、拡散帯１５、気密端子リードの封着断面２０、リード２３、絶縁材２４、拡散帯２５。
Airtight
本発明の高膨張ガラスは、熱膨張係数１７±６ｐｐｍ／Ｋの範囲のものが利用できる。例えば、以下の材料および温度条件のみに限定されないが、リン酸系ガラスが銅の熱膨張係数１７ｐｐｍ／Ｋと整合し利用できる。銅は鉄または鋼材よりも比較的融点が低く、ガラス封着温度が９００℃以上の高温で封着すると結晶粒が肥大化し、いわゆる焼鈍状態となって機械的強度が低下してしまう恐れがあり、できる限り低温封着するのが望ましい。 As the high expansion glass of the present invention, a glass having a coefficient of thermal expansion in the range of 17 ± 6 ppm / K can be used. For example, but not limited to the following materials and temperature conditions, it can be phosphate glasses are matched to the thermal expansion coefficient of 17 ppm / K of the copper used. Copper has a relatively lower melting point than iron or steel, and if it is sealed at a high glass sealing temperature of 900 ° C or higher, the crystal grains may enlarge, resulting in a so-called annealed state and a decrease in mechanical strength. It is desirable to seal at a low temperature as much as possible.
本発明に係る実施例１の気密端子は、３個の貫通孔を有した銅の金属外環と、この金属外環の貫通孔に挿通した銅のリードと、金属外環とリードとをリン酸系ガラスからなる熱膨張係数１５．９ｐｐｍ／Ｋの高膨張ガラスの絶縁材とを備えたことを特徴とした整合封止型気密端子が提供される。前記絶縁材は、金属外環とリードを６００℃で封着したものであって、該絶縁材は、金属外環とリードとに接した界面の遷移領域のガラス中に銅イオンの拡散帯を有する。この拡散帯は、図２の封着断面２０に示すように、拡散帯２５は、ガラス材からなる絶縁材２４中において銅リード２３と絶縁材２４との界面領域に形成されており、薄いピンク色から赤色ないし深赤色（ルビー色）の着色を呈した第一銅イオン由来の拡散物から構成される。銅の金属外環に銅のリードをガラス材で封着する場合、前記拡散帯２５が形成されると界面の機械的強度が向上でき、十分な密着と濡れが得られ気密性の確保が可能となる。 The airtight terminal of Example 1 according to the present invention has a copper metal outer ring having three through holes, a copper lead inserted through the through hole of the metal outer ring, and a metal outer ring and a lead. Provided is a matching sealed airtight terminal characterized by being provided with an insulating material of a highly expanding glass having a coefficient of thermal expansion of 15.9 ppm / K made of an acid-based glass. The insulating material has a metal outer ring and a lead sealed at 600 ° C., and the insulating material has a diffusion zone of copper ions in the glass at the transition region of the interface between the metal outer ring and the lead. Have. As shown in the sealing cross section 20 of FIG. 2, the diffusion band 25 is formed in the interface region between the copper lead 23 and the insulating material 24 in the insulating material 24 made of a glass material, and is light pink. It is composed of a diffuser derived from cuprous ions, which is colored red to deep red (ruby color). When a copper lead is sealed to a copper metal outer ring with a glass material, the mechanical strength of the interface can be improved when the diffusion zone 25 is formed, and sufficient adhesion and wetting can be obtained to ensure airtightness. It becomes.
Claims (8)
前記絶縁材は、前記金属外環と前記リードとに接した界面の遷移領域のガラス中に銅イオンの拡散帯を有する気密端子。 A height for sealing a metal outer ring of copper or a copper alloy having at least one through hole, a lead of a low resistance conductor inserted through the through hole of the metal outer ring, and the metal outer ring and the lead. Equipped with expansion glass insulation,
The insulating material is an airtight terminal having a diffusion band of copper ions in the glass at the transition region of the interface between the metal outer ring and the reed.
The airtight terminal according to claim 7, wherein the plating comprises at least one of nickel, nickel phosphorus, nickel boron, and gold plating.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/027313 WO2021015049A1 (en) | 2019-07-24 | 2020-07-14 | Hermetic terminal |
| CN202080037165.XA CN113853660B (en) | 2019-07-24 | 2020-07-14 | Airtight terminal |
| US17/612,031 US20220230787A1 (en) | 2019-07-24 | 2020-07-14 | Hermetic Terminal |
| DE112020002014.2T DE112020002014B4 (en) | 2019-07-24 | 2020-07-14 | Hermetic connection |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019136209 | 2019-07-24 | ||
| JP2019136209 | 2019-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021022558A true JP2021022558A (en) | 2021-02-18 |
| JP7282059B2 JP7282059B2 (en) | 2023-05-26 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020106724A Withdrawn JP2021022557A (en) | 2019-07-24 | 2020-06-22 | Hermetic terminal |
| JP2020106768A Active JP7282059B2 (en) | 2019-07-24 | 2020-06-22 | airtight terminal |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020106724A Withdrawn JP2021022557A (en) | 2019-07-24 | 2020-06-22 | Hermetic terminal |
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| JP (2) | JP2021022557A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293993A (en) * | 1976-01-29 | 1977-08-08 | Endress Hauser Gmbh Co | Insulating and leadinggin method of leaddin wire |
| JPS5741791B2 (en) * | 1978-07-28 | 1982-09-04 | ||
| US4493378A (en) * | 1981-07-16 | 1985-01-15 | Kyle James C | Terminal assembly |
| JPS6220267A (en) * | 1985-07-18 | 1987-01-28 | 三菱電機株式会社 | Airtight insulated terminal |
| JPS6240182A (en) * | 1985-08-16 | 1987-02-21 | 三菱電機株式会社 | Airtight insulation terminal |
| JP2017084954A (en) * | 2015-10-28 | 2017-05-18 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal |
| JP2017112082A (en) * | 2015-12-15 | 2017-06-22 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal |
| JP2018181721A (en) * | 2017-04-19 | 2018-11-15 | ショット日本株式会社 | Airtight terminal |
-
2020
- 2020-06-22 JP JP2020106724A patent/JP2021022557A/en not_active Withdrawn
- 2020-06-22 JP JP2020106768A patent/JP7282059B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293993A (en) * | 1976-01-29 | 1977-08-08 | Endress Hauser Gmbh Co | Insulating and leadinggin method of leaddin wire |
| JPS5741791B2 (en) * | 1978-07-28 | 1982-09-04 | ||
| US4493378A (en) * | 1981-07-16 | 1985-01-15 | Kyle James C | Terminal assembly |
| JPS6220267A (en) * | 1985-07-18 | 1987-01-28 | 三菱電機株式会社 | Airtight insulated terminal |
| JPS6240182A (en) * | 1985-08-16 | 1987-02-21 | 三菱電機株式会社 | Airtight insulation terminal |
| JP2017084954A (en) * | 2015-10-28 | 2017-05-18 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal |
| JP2017112082A (en) * | 2015-12-15 | 2017-06-22 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal |
| JP2018181721A (en) * | 2017-04-19 | 2018-11-15 | ショット日本株式会社 | Airtight terminal |
Non-Patent Citations (1)
| Title |
|---|
| 池田 豊: "「ガラスと金属の封着の機構」", 窯業協會誌, vol. 72巻, 818号, JPN6022051609, 1 February 1964 (1964-02-01), JP, pages 51 - 59, ISSN: 0004935601 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021022557A (en) | 2021-02-18 |
| JP7282059B2 (en) | 2023-05-26 |
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