JP2021022529A - Socket for sensor element - Google Patents

Abstract

To provide a socket for sensor element which allows for convenient mounting of a sensor element, such as a smell sensor element, on a circuitry, facilitates putting-on and taking-off, and facilitates arrangement change of multiple sensor elements.SOLUTION: A socket 1 is configured to have a palette part 4 and a base part 5, and to arrange and hold multiple sensor elements 3 between them, multiple recesses 4a for positioning the multiple sensor elements 3, respectively, are formed in the palette part 4, multiple presser parts 5a for preventing exfoliation of the multiple sensor elements 3 are formed in the base part 5, multiple openings 4b for exposing the sensor surfaces 3a of the multiple sensor elements 3, positioned in the multiple recesses 4a, are formed in the palette part 4, and a hook 6 for engaging the palette part 4 and the base part 5 in closed state is provided in the palette part 4 or the base part 5.SELECTED DRAWING: Figure 3

Description

The present invention relates to a socket for a sensor element, and more particularly to a socket for a sensor element in which a plurality of sensor elements can be easily attached / detached and rearranged.

In recent years, small elements have been mounted on circuits. At this time, a socket may be used for ease of attachment / detachment of a small element and improvement of manufacturing efficiency in a mounting process. For example, Patent Document 1 discloses a configuration in which a semiconductor element socket 1 is mounted on an inspection circuit for inspection of a semiconductor element 10 so that the semiconductor element 10 can be easily attached to and detached from the semiconductor element socket 1. Has been done.

The semiconductor element 10 has a plurality of terminals, and each terminal is connected to a plurality of terminals of the semiconductor element socket 1. By inserting the semiconductor element 10 into the recess 4 of the semiconductor element socket 1, a circuit equivalent to that in which the semiconductor element 10 is mounted can be configured in the inspection circuit. Further, by removing the semiconductor element 10 from the recess 4 of the socket 1 for the semiconductor element, the semiconductor element 10 can be easily replaced.

JP-A-63-255669

The conventional socket for an element is mainly for mounting a small element in a circuit in a detachable manner by inserting and removing one small element having a plurality of terminals. However, in recent years, further miniaturization of devices has progressed. Then, an application has been proposed in which a large number of the small elements are arranged and used and mounted in a circuit.

For example, a plurality of small odor sensor elements having a size of about 1 to 3 mm square are arranged on the circuit (the odor detection and identification of each odor sensor element are different), and the odor of the test object is scented according to the detected odor pattern. An odor detection method for identifying the above has been proposed. In the realization of such an odor detection method, it is required to efficiently and surely arrange a large number of small sensor elements on a circuit.

Further, in order to arrange the small sensors, the suction surface of the odor sensor element needs to be exposed. It is preferable that the odor sensor element can be easily replaced and the arrangement can be easily changed.

The present invention has been made in view of the above circumstances, and sensor elements such as odor sensor elements can be easily mounted on a circuit, are easily attached and detached, and the arrangement of a plurality of sensor elements can be changed. An exemplary task is to provide a simple socket for a sensor element.

In order to solve the above problems, the socket for a sensor element as an exemplary aspect of the present invention has the following configuration.

A socket for sensor elements that holds an array by sandwiching multiple sensor elements.
The sensor element socket has a first part, a second part that can be opened and closed with respect to the first part, and a second part that can be fixed in a closed state, and the first part. And the second part are fixed, so that the plurality of sensor elements are arranged and held between the first part and the second part.
A plurality of positioning portions for positioning each of the plurality of sensor elements are formed in either one of the first portion and the second portion.
A plurality of holding portions for preventing the plurality of sensor elements from falling off from the plurality of positioning portions are formed on any one of the first portion and the second portion.
In the first portion, a plurality of openings corresponding to each of the plurality of positioning portions are formed in order to expose the sensor surfaces of the plurality of sensor elements positioned in the plurality of positioning portions.
A socket for a sensor element, wherein a fixing portion for fixing the first portion and the second portion in a closed state is provided in the first portion or the second portion.

Further objects or other features of the present invention will be manifested by preferred embodiments described below with reference to the accompanying drawings.

In the sensor element socket according to the present invention, a sensor element such as an odor sensor element can be easily mounted on a circuit, it is easy to attach / detach, and it is easy to change the arrangement of a plurality of sensor elements.

It is a figure explaining the use state of the socket which concerns on Embodiment 1 of this invention. The external view of the sensor element shown in FIG. 1, (a) is a front view, (b) is a side view, and (c) is a rear view. It is a figure which shows the open state of the socket shown in FIG. 1, (a) shows the state which a plurality of sensor elements are not arranged, and (b) shows the state which a plurality of sensor elements are arranged. It is sectional drawing of the vicinity of the sensor element arranged in a socket. It is external perspective view of the socket which concerns on Embodiment 2 of this invention.

[Embodiment 1]
Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating a usage state of a socket (socket for a sensor element) 1 according to the first embodiment of the present invention. In FIG. 1, a socket 1 is attached to a circuit board (board) 2 on which an external circuit (not shown) is mounted, and a plurality of sensor elements 3 are arranged in the socket 1.

<Explanation of sensor elements>
2A and 2B are external views of the sensor element 3, where FIG. 2A is a front view, FIG. 2B is a side view, and FIG. 2C is a rear view. As a whole, the sensor element 3 has, for example, a rectangular shape having a front shape of about 2.5 mm × 3.2 mm and a substantially rectangular parallelepiped shape having a thickness (height) of about 0.4 mm. Of course, the shape of the sensor element 3 is not limited to this, and the dimensions of each part described above are also examples.

A sensor surface 3a is arranged on the front side (front side) of the sensor element 3. For example, the sensor element 3 may be an odor sensor element for detecting an odor in the air. In this case, the sensor surface 3a detects the odor of the air by coming into contact with the outside air. Details of the odor sensor element are described in, for example, International Publication No. 2016-031080, International Publication No. 2017-085939, and JP-A-2019-49247. For example, the sensor surface may be formed of a quartz crystal unit such as QCM as a base material and an adsorption film for adsorbing an odor component in the air on the surface thereof.

For example, since the plurality of sensor elements 3 each have an adsorption film having different odor component adsorption characteristics, each of the plurality of sensor elements 3 may exhibit different odor component adsorption performance. A plurality of sensor elements 3 may be configured to exhibit different odor component adsorption performances by doping each adsorption film with a dopant having different odor component adsorption characteristics.

A plurality of terminals (sensor terminals) 3b are arranged on the back side (opposite side of the sensor surface 3a) of the sensor element 3. By connecting the circuit board 2 to the terminal 3b, the information of the odor component detected on the sensor surface 3a is mounted on the circuit board 2 as an electric signal or signal processing as an external circuit connected to the circuit board 2. It is transmitted to the circuit and the detection result is converted into data.

<Explanation of socket>
Next, the socket 1 will be described. FIG. 3 is a diagram showing an open state of the socket 1 according to the first embodiment. The socket 1 holds a plurality of sensor elements 3 in an array by sandwiching them. The socket 1 holds the circuit board 2, arranges a plurality of sensor elements 3 in the socket 1, and closes the pallet part (first part) 4 and the base part (second part) 5 and (both described later) of the socket 1. By fixing both of them, a plurality of sensor elements 3 are arranged and held in the socket 1, and the terminals 3b of each sensor element 3 and the terminals (circuit terminals) 2a of the circuit board 2 corresponding to each are electrically connected. It is designed to be connected to.

In the first embodiment, the socket 1 has a pallet portion 4 and a base portion 5, and is roughly configured. The socket 1 is preferably made of a material such as a resin that is non-conductor as a whole and has a certain degree of elasticity. The configurations and functions of the pallet unit 4 and the base unit 5 described below are merely examples. Of course, the pallet portion 4 and the base portion 5 may be configured in reverse, and to the extent deemed necessary and to the extent feasible, both the pallet portion 4 and the base portion 5 may be configured as described below. A function may be added.

The pallet unit 4 is a component for placing and arranging a plurality of sensor elements 3. As shown in FIG. 3A, the pallet portion 4 is formed with a plurality of recesses (positioning portions) 4a for dropping the plurality of sensor elements 3 in a row. The outer shape of each of the recesses 4a is substantially the same as the package shape of the sensor element 3, and is a counterbore portion having a predetermined depth. Therefore, the sensor element 3 can be easily positioned by dropping (fitting) the sensor element 3 into the recess 4a. The depth of the recess 4a may be greater than or equal to the thickness (height) of the sensor element 3, or may be shallower than the thickness (height) of the sensor element 3 depending on the design convenience. The element 3 may be partially fitted.

The positioning portion does not necessarily have to be a recess 4a into which the sensor element 3 is fitted. For example, the positioning portion may be a convex portion that abuts on the peripheral edge of the package of the sensor element 3, or a recess for positioning in the sensor element 3. When is formed, it may be a protrusion that fits into the recess on the sensor element 3 side.

A plurality of openings 4b are formed in the pallet portion 4 corresponding to the plurality of recesses 4a. The opening 4b is for exposing the sensor surface 3a of each sensor element 3 arranged in the recess 4a to the outside. That is, the sensor element 3 is fitted into the recess 4a with the sensor surface 3a facing downward (in the direction toward the pallet portion 4 instead of toward the base portion 5) in FIG. The opening shape of the opening 4b is, of course, preferably a shape that matches the shape of the sensor surface 3a, but it is not always necessary. The outside air may be configured to reach the sensor surface 3a through the opening 4b. In the first embodiment, each opening 4b is formed in the vicinity of the center position of each recess 4a. That is, the sensor element 3 is held around the sensor element 3 by the recess 4a in a state where the sensor surface 3a is exposed from the opening 4b.

The base portion 5 is a component for holding a plurality of sensor elements 3 in an array in cooperation with the pallet portion 4. By fitting the sensor element 3 into the recess 4a shown in FIG. 3A and closing the pallet portion 4 and the base portion 5 as shown in FIG. 3B, between the pallet portion 4 and the base portion 5. It is possible to hold the array so as to sandwich the plurality of sensor elements 3 (see FIG. 1).

The pallet portion 4 is provided with a hook 4c for engaging with the base portion 5. By engaging the hook 6 with the base portion 5 with the pallet portion 4 and the base portion 5 closed, the pallet portion 4 and the base portion 5 are fixed, and the pallet portion 4 and the base portion 5 are carelessly connected. Prevents opening. Of course, by releasing the hook 6, the pallet portion 4 and the base portion 5 can be opened again.

The opening and closing of the pallet portion 4 and the base portion 5 is realized by a hinge 7 formed at one end of both. One end of each of the pallet portion 4 and the base portion 5 is configured to be swingable and openable by, for example, elastic deformation, and the swingable open / close portion constitutes a hinge 7. Since the pallet portion 4 and the base portion 5 swing open and close around the hinge 7, it is easy to set or replace the sensor element 3 by opening the two, close the two, and hold the sensor element 3 by engaging with the hook 6. It is possible to do it.

As shown in FIG. 4, the base portion 5 is formed with a plurality of pressing portions 5a corresponding to each of the plurality of recesses 4a. The pressing portion 5a is a protruding portion formed on the surface of the base portion 5, located on the back surface side (opposite side of the sensor surface 3a) of the sensor element 3 fitted in the recess 4a, and is a sensor element from the recess 4a. It has a function of preventing the 3 from falling off. Whether the pressing portion 5a protrudes from the surface of the base portion 5, is at the same height as the surface, or is recessed from the surface is determined by design depending on the thickness of the sensor element 3 and the depth of the recess 4a. Further, if the holding portion 5a is in contact with the back surface side of the sensor element 3 with a predetermined contact pressure in a state where the pallet portion 4 and the base portion 5 are closed and engaged, the pressing portion 5a is a sensor element. Not only the function of preventing the sensor element 3 from falling out from the recess 4a, but also the function of positioning the sensor element 3 in the thickness (height) direction can be exhibited.
In the first embodiment, the base portion 5 is formed with a holding portion 5b for holding the circuit board 2. The structure of the holding portion 5b is not particularly limited, but for example, the holding portion 5b may have a fixing surface for fixing the circuit board 2 by adhesion. Further, the holding portion 5b has an insertion slit for inserting the circuit board 2, and the relationship between the protrusions arranged at the predetermined positions of the holding portion 5b and the through holes formed at the predetermined positions of the circuit board 2 is engaged. The circuit board 2 after insertion may be fixed by the stop.

On the circuit board 2 held and fixed to the holding portion 5b, the terminal 2a is arranged at a position facing the terminal 3b of each sensor element 3 in a state where the pallet portion 4 and the base portion 5 are closed. A plurality of sensors are held by holding the circuit board 2 in the holding portion 5b, arranging the sensor elements 3 in the plurality of recesses 4a, closing the pallet portion 4 and the base portion 5, and engaging the two with the hook 6. Each terminal 3b of the element 3 and a terminal 2a on the circuit board 2 are connected to each other. The plurality of sensor elements 3 and the external circuit on the circuit board 2 can be electrically connected by a simple process of closing the pallet portion 4 and the base portion 5.

It is preferable that the terminal 2a and the terminal 3b are pressed by a predetermined contact pressure while the pallet portion 4 and the base portion 5 are engaged with each other by the hook 6.

[Embodiment 2]
FIG. 4 is an external perspective view of the socket 10 according to the second embodiment of the present invention. In this socket 10, a configuration different from the socket 1 of the first embodiment will be mainly described, and a configuration similar to that of the socket 1 will be designated by the same reference numerals and detailed description thereof will be omitted.

The socket 10 has a pallet portion 4 and a base portion 5. The pallet portion 4 and the base portion 5 can be oscillated and opened and closed by the hinge 7, and the pallet portion 4 and the base portion 5 can be engaged with each other in a closed state by the hook 6 formed on the pallet portion 4.

A plurality of positioning portions 40a for arranging a plurality of sensor elements 3 are formed on the pallet portion 4. For example, in FIG. 4, a total of 25 sensor elements 3 can be arranged in 5 columns and 5 rows. The positioning portion 40a may be a convex portion that protrudes from the pallet portion 4 and holds the peripheral edge of the sensor element 3, or may be a concave portion for fitting the sensor element 3 as in the first embodiment. In the pallet portion 4, openings 4b for exposing the sensor surface 3a corresponding to the positioning portions 40a are formed in 5 rows vertically and 5 rows horizontally.

Terminals (socket terminals) 50a are arranged on the base portion 5 corresponding to the positioning portions 40a. The terminal 50a is arranged at a position where the sensor element 3 is arranged on the pallet portion 4 and comes into contact with the terminal 3b of the sensor element 3 when the pallet portion 4 and the base portion 5 are closed. The socket 10 of the second embodiment is different from the socket 1 of the first embodiment in that the terminal 50a is arranged on the base portion 5 side.

The circuit board 2 (not shown) is held by the holding portion 5b (not shown) on the base portion 5. A contact (not shown) is arranged on both the holding portion 5b and the circuit board 2, and when the circuit board 2 is held by the holding portion 5b, the contact of the circuit board 2 and the contact of the holding portion 5b come into contact with each other. ing. The contacts of the holding portion 5b are connected to the terminals 50a inside the socket 10 based on a predetermined circuit arrangement. Therefore, if the circuit board 2 is held by the holding portion 5b, a plurality of sensor elements 3 are arranged and held in the socket 10, and the pallet portion 4 and the base portion 5 are closed and engaged, each sensor element 3 becomes a circuit. It is electrically connected to an external circuit on the substrate 2.

By using the sockets 1 and 10 described in the first and second embodiments, it is possible to easily replace the plurality of sensor elements 3 one by one and change the arrangement of the sensor elements 3. For example, even if only one of the plurality of sensor elements 3 fails or is damaged, the sensor element 3 related to the damage or the like can be easily replaced with a new sensor element 3.

Further, when different characteristics (for example, different odor component adsorption characteristics) are given to each of the plurality of sensor elements 3, the arrangement of the sensor elements 3 can be different for each socket. For example, in the case where the five sensor elements are the odor sensor elements a, b, c, d, and e each adsorbing the odor substances A, B, C, D, and E, the socket related to a specific production lot may be used. The odor sensor elements are arranged in the order of a, b, c, d, e, and the odor sensor elements are arranged in the order of b, c, d, e, a in the sockets related to other production lots, and the like. It is easily feasible to arrange the odor sensor elements in the order of c, d, e, a, and b in the socket according to the production lot.

By making the arrangement of the odor sensor elements different for each manufacturing lot in this way, the signal arrangement (smell pattern) of a series of detection signals from the socket when the same test object is detected can be made different for each lot. .. Since the odor pattern when the same odor is detected differs from lot to lot, the arrangement information of the odor sensor element can be used like a kind of encryption or password.

When a circuit element or the like is mounted on the circuit board 2, foreign matter such as dust or solder flux generated in a mounting process using a mounting machine or a reflow furnace may affect the mounting of other elements or the like. In particular, in a configuration in which a sensor element such as an odor sensor element is directly mounted on the circuit board 2, the odor sensor element may be adversely affected by these foreign substances.

By using the sockets 1 and 10 according to the present invention, the sensor elements 3 can be arranged in the sockets 1 and 10 after the mounting step of mounting the circuit elements and the like on the circuit board 2 is completed. Alternatively, the mounting step of mounting the circuit element or the like on the circuit board 2 and the arranging step of arranging the sensor elements 3 in the sockets 1 and 10 can be performed at different places. Therefore, the adverse effect on the sensor element 3 due to foreign matter such as dust and solder flux can be greatly reduced.

In the configuration in which the odor sensor element is directly mounted on the circuit board 2, the filming step is performed on the odor sensor element after mounting. In the process of attaching the film to the odor sensor element, high temperature treatment is performed for a long time, but when the odor sensor element is mounted on the circuit board 2, it is exposed to other circuit elements on the circuit board 2 for a long time. This causes an excessive burden on these other circuit elements.

By using the sockets 1 and 10 according to the present invention, it is possible to realize a process of attaching a film to an odor sensor element that does not affect the circuit board 2. Since the other circuit elements mounted on the circuit board 2 are not exposed to high temperature for a long time, the adverse effect on the elements on the circuit board 2 can be greatly reduced.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these, and various modifications and changes can be made within the scope of the gist thereof.

[Modification example]
The opening and closing of the pallet portion 4 and the base portion 5 does not have to be swinging opening and closing by the hinge 7. For example, the pallet portion 4 and the base portion 5 may be configured as separate bodies and can be separated and combined. In that case, for example, the pallet portion 4 may be slidably moved with respect to the base portion 5 so that the two can be separated and combined.

Further, the fixing of the pallet portion 4 and the base portion 5 in the closed state is not limited to the engagement by the hook. For example, both may be fixed by screwing them together. Further, the pallet portion 4 and the base portion 5 may be fixed by a fixture separated from the sockets 1 and 10. It should be noted that various modes can be adopted for the shape and configuration of the positioning portion depending on the design circumstances.

Further, although the odor sensor element has been described as an example as the sensor element 3 used in the socket according to the present invention, the sensor element 3 is not limited to the odor sensor element. If it has a sensor surface and it is necessary to expose the sensor surface to the outside and has a terminal on the opposite side of the sensor surface, it can be the sensor element 3 used in the socket according to the present invention. For example, an optical sensor element, a temperature sensor element, a humidity sensor element, or the like can also be the sensor element 3.

The present invention includes the following gist.

[Purpose 1]
A socket for sensor elements that holds an array by sandwiching multiple sensor elements.
The sensor element socket has a first part, a second part that can be opened and closed with respect to the first part, and a second part that can be fixed in a closed state, and the first part. The structure is such that the plurality of sensor elements are arranged and held between the first part and the second part by engaging with the second part.
A plurality of positioning portions for positioning each of the plurality of sensor elements are formed in either one of the first portion and the second portion.
A plurality of holding portions for preventing the plurality of sensor elements from falling off from the plurality of positioning portions are formed on any one of the first portion and the second portion.
In the first portion, a plurality of openings corresponding to each of the plurality of positioning portions are formed in order to expose the sensor surfaces of the plurality of sensor elements positioned in the plurality of positioning portions.
A socket for a sensor element, wherein a fixing portion for fixing the first portion and the second portion in a closed state is provided in the first portion or the second portion.

[Purpose 2]
In the second part, a plurality of socket terminals for connecting the sensor terminals of the plurality of sensor elements to an external circuit may be arranged corresponding to each of the positioning parts.

[Purpose 3]
The second part has a holding part for holding a substrate on which an external circuit connected to the plurality of sensor elements is mounted.
The holding portion is connected to a sensor terminal each of the plurality of sensor elements and a circuit terminal arranged on the external circuit when the first portion and the second portion are fixed in a closed state. The substrate may be held as described above.

[Purpose 4]
The first part and the second part may be opened and closed by a hinge.

[Purpose 5]
The plurality of positioning portions may be recesses for at least partially fitting each of the plurality of sensor elements.

1, 10: Socket (socket for sensor element)
2: Circuit board (board)
2a: Terminal (circuit terminal)
3: Sensor element 3a: Sensor surface 3b: Terminal (sensor terminal)
4: Palette part (Part 1)
4a: Recess (positioning part)
4b: Opening 5: Base part (Part 2)
5a: Pressing part 5b: Holding part 6: Hook (engaging part)
7: Hinge 40a: Positioning part 50a: Terminal (socket terminal)

Claims (5)

A socket for sensor elements that holds an array by sandwiching multiple sensor elements.
The sensor element socket has a first part, a second part that can be opened and closed with respect to the first part, and a second part that can be fixed in a closed state, and the first part. And the second part are fixed, so that the plurality of sensor elements are arranged and held between the first part and the second part.
A plurality of positioning portions for positioning each of the plurality of sensor elements are formed in either one of the first portion and the second portion.
A plurality of holding portions for preventing the plurality of sensor elements from falling off from the plurality of positioning portions are formed on any one of the first portion and the second portion.
In the first portion, a plurality of openings corresponding to each of the plurality of positioning portions are formed in order to expose the sensor surfaces of the plurality of sensor elements positioned in the plurality of positioning portions.
A socket for a sensor element, wherein a fixing portion for fixing the first portion and the second portion in a closed state is provided in the first portion or the second portion. The first aspect of the invention, wherein a plurality of socket terminals for connecting the sensor terminals of the plurality of sensor elements to an external circuit are arranged corresponding to each of the positioning portions. Socket for sensor elements. The second part has a holding part for holding a substrate on which an external circuit connected to the plurality of sensor elements is mounted.
The holding portion is connected to a sensor terminal each of the plurality of sensor elements and a circuit terminal arranged on the external circuit when the first portion and the second portion are fixed in a closed state. The socket for a sensor element according to claim 1, which holds the substrate as described above. The sensor element socket according to any one of claims 1 to 3, wherein the first part and the second part can be opened and closed by a hinge. The sensor element socket according to any one of claims 1 to 4, wherein the plurality of positioning portions are recesses for fitting each of the plurality of sensor elements at least partially.

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