JP2021011076A - Molded product take-out device, molded product taking-out method, molded product manufacturing method using molded product taking-out device, and attachment parts removing device - Google Patents

Molded product take-out device, molded product taking-out method, molded product manufacturing method using molded product taking-out device, and attachment parts removing device Download PDF

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JP2021011076A
JP2021011076A JP2019126845A JP2019126845A JP2021011076A JP 2021011076 A JP2021011076 A JP 2021011076A JP 2019126845 A JP2019126845 A JP 2019126845A JP 2019126845 A JP2019126845 A JP 2019126845A JP 2021011076 A JP2021011076 A JP 2021011076A
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JP7345298B2 (en
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裕久 石▲崎▼
Hirohisa Ishizaki
裕久 石▲崎▼
明 落合
Akira Ochiai
明 落合
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Somar Corp
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Abstract

To provide a device that properly and reliably removes attachment parts such as a gate, a runner and a sprue from semi-cured molded products.SOLUTION: There is provided a device that comprises: a molded product holding unit 41 for holding a semi-cured molded product molded inside a movable mold 21 and a fixed mold 22; and an air injection unit 53 that blows air to attachment parts of the molded product held by the molded product holding unit 41, and that is configured to blow attachment parts from the molded product by air blowing from the air injection unit 53. In addition, air blowing is preferably performed from the air injection unit 53 to the attachment parts while the molded product is held by the molded product holding unit 41.SELECTED DRAWING: Figure 5

Description

本発明は、熱硬化性樹脂組成物の成形品を成形型から取り出す成形品取出し装置、成形品取出し方法、この成形品取出し装置を用いた成形品の製造方法、および成形品から付属部を除去する付属部除去装置に関する。 The present invention comprises a molded product take-out device for taking out a molded product of a thermosetting resin composition from a molding mold, a molded product taking-out method, a method for manufacturing a molded product using this molded product taking-out device, and removing an accessory from the molded product. Regarding the accessory removal device.

射出成形用の金型装置を用いて成形品を製造する場合、まず金型装置が有する射出成形装置における一対の成形型を分割面で組み合わせることにより内部に形成されるキャビティに、成形材料(熱硬化性樹脂組成物、熱可塑性樹脂組成物)を注入して成形品を射出成形する。続いて、金型装置における成形品押出装置によって該成形品を成形型から離脱させた後、金型装置の付属部除去装置によって成形時において成形品と一体に形成される付属部(ランナー、スプルー、ゲートなど)を除去する。さらに、金型装置の成形品取出し装置を用いて成形品を金型装置から取り出すことにより、成形品を製造するようになっている。 When a molded product is manufactured using a mold device for injection molding, first, a molding material (heat) is formed in a cavity formed inside by combining a pair of molding dies in the injection molding device of the mold device on a divided surface. A curable resin composition, a thermoplastic resin composition) is injected to inject a molded product. Subsequently, after the molded product is separated from the mold by the molded product extruder in the mold apparatus, the accessory portion (runner, sprue) formed integrally with the molded product at the time of molding by the accessory portion removing device of the mold apparatus. , Gate, etc.) are removed. Further, the molded product is manufactured by taking out the molded product from the mold device using the molded product taking-out device of the mold device.

このような成形品から付属部を除去する付属部除去装置としては、切削刃によって所定部分を旋削してゲート部などの付属部を除去したり(特許文献1)、カット機構によってゲートを切断して樹脂製品とランナーとに分離することによりゲートを切断する装置(特許文献2)が提案されている。 As an accessory removing device for removing an accessory from such a molded product, a predetermined portion is turned by a cutting blade to remove the accessory such as a gate (Patent Document 1), or the gate is cut by a cutting mechanism. A device for cutting a gate by separating a resin product and a runner (Patent Document 2) has been proposed.

特開2015−174245号公報Japanese Unexamined Patent Publication No. 2015-174245 特開2018−134769号公報JP-A-2018-134769

ここで、近年、熱硬化性樹脂組成物を連続的に射出成形できるとともに、成形時に成形品の付属部を再利用できる射出成形方法として、キャビティ内において射出成形された熱硬化性樹脂組成物の成形品を半硬化状態で取り出すことが行われている(例えば、国際公開番号WO2016/171099参照)。このような射出成形方法によれば、成形型から取り出した半硬化状態の成形品から付属部を除去した後、製品となる成形品の部分を加熱して熱硬化性樹脂組成物の熱硬化反応を進行させるとともに、除去された付属部は再生原料として用いることができる。 Here, in recent years, as an injection molding method capable of continuously injection molding a thermosetting resin composition and reusing an accessory portion of a molded product at the time of molding, the thermosetting resin composition is injection molded in a cavity. The molded product is taken out in a semi-cured state (see, for example, International Publication No. WO2016 / 171099). According to such an injection molding method, after removing the accessory part from the semi-cured molded product taken out from the molding mold, the part of the molded product to be the product is heated to perform a thermosetting reaction of the thermosetting resin composition. The removed appendages can be used as a recycled raw material.

しかし、成形型から取り出した半硬化状態の成形品から付属部を除去するにあたり、従来のような切削や切断により付属部を除去しようとすると、半硬化成形品は強度が低いために適切に付属部を切削、切断することができず、付属部が成形品に残ってしまったり、さらには半硬化成形品と付属部との境界が変形してしまうなどのおそれがあり、付属部の除去が困難であった。 However, when removing the accessory from the semi-cured molded product taken out from the mold, if the accessory is to be removed by cutting or cutting as in the past, the semi-cured molded product is properly attached because of its low strength. The part cannot be cut or cut, and the accessory part may remain in the molded product, or the boundary between the semi-cured molded product and the accessory part may be deformed. It was difficult.

本発明は、半硬化状態の成形品から適切かつ確実にランナーなどの再利用可能な付属部を除去することができる機能を備えた成形品取出し装置、成形品取出し方法、この成形品取出し装置を用いた成形品の製造方法、および成形品から付属部を除去する付属部除去装置を提供することを目的とする。 The present invention provides a molded article taking-out device, a molded article taking-out method, and this molded article taking-out device having a function of appropriately and surely removing reusable accessories such as a runner from a molded article in a semi-cured state. An object of the present invention is to provide a method for manufacturing a molded product used, and an accessory removing device for removing an accessory from the molded product.

以下では、本発明の理解を容易にするために、本発明の実施形態を示す図面に対応する符号を付して説明するが、これに限定されるものではない。 Hereinafter, in order to facilitate understanding of the present invention, the drawings will be described with reference numerals corresponding to the drawings showing the embodiments of the present invention, but the present invention is not limited thereto.

上記目的を達成するために、第1発明に係る成形品取出し装置の特徴は、
成形型(21、22)の内部において成形された熱硬化性樹脂組成物の成形品を、該成形型(21、22)から取り出す成形品取出し装置(4)であって、
成形型(21、22)の内部において成形された半硬化状態の前記成形品を保持する成形品保持部(41)と、
成形品保持部(41)により保持された成形品の付属部に対してエアを吹きかけるエア噴射部(5)と、を有し、
エア噴射部(5)から吹きかけられるエアによって成形品から付属部を吹き飛ばすように構成した点にある。
In order to achieve the above object, the feature of the molded article taking-out device according to the first invention is
A molded product take-out device (4) for taking out a molded product of a thermosetting resin composition molded inside the molding mold (21, 22) from the molding mold (21, 22).
A molded product holding portion (41) for holding the semi-cured molded product molded inside the molding mold (21, 22), and a molded product holding portion (41).
It has an air injection part (5) that blows air to an accessory part of the molded product held by the molded product holding part (41).
The point is that the accessory part is blown off from the molded product by the air blown from the air injection part (5).

第1発明によれば、成形型(21、22)内部において成形された半硬化状態の成形品を成形品保持部(41)により保持し、成形品の付属部に対してエア噴射部(5)によってエアを吹きかけ成形品から付属部を吹き飛ばすことにより、付属部の残骸が成形品に残ってしまったり、成形品と付属部との境界を変形させてしまうなどの問題を発生させることなく、強度が低い半硬化状態の成形品からランナーなどの付属部を除去することができる。 According to the first invention, the semi-cured molded product molded inside the molding mold (21, 22) is held by the molded product holding portion (41), and the air injection portion (5) is held with respect to the accessory portion of the molded product. ) By blowing air from the molded product to blow off the accessory part, without causing problems such as the debris of the accessory part remaining on the molded product or deforming the boundary between the molded product and the accessory part. It is possible to remove accessories such as runners from a semi-cured molded product having low strength.

第1発明に係る成形品取出し装置(4)において、成形品保持部(41)が装着されたアーム(42)を備え、エア噴射部(5)がアーム(42)に取り付けられており、成形品保持部(41)により成形品が保持された状態でエア噴射部(5)から付属部に対しエアが吹きかけられるように構成してもよい。
このような構成を採用することにより、半硬化成形品を金型から取り出す工程の流れで半硬化状態の成形品から付属部を除去することができ、成形品の製造工程の円滑化を図ることができる。またアーム(42)に取り付けられたエア噴射部(5)からアーム(42)の成形品保持部(41)によって保持された成形品の付属部にエアを吹きかけるので、付属部にエアを吹きかけるためのエア噴射部(5)の向きを容易に調整することができる。
In the molded product taking-out device (4) according to the first invention, the molded product holding portion (41) is attached to the arm (42), and the air injection portion (5) is attached to the arm (42) for molding. Air may be blown from the air injection part (5) to the accessory part while the molded product is held by the product holding part (41).
By adopting such a configuration, it is possible to remove the accessory part from the semi-cured molded product in the flow of the process of taking out the semi-cured molded product from the mold, and to facilitate the manufacturing process of the molded product. Can be done. Further, since air is blown from the air injection portion (5) attached to the arm (42) to the accessory portion of the molded product held by the molded product holding portion (41) of the arm (42), air is blown to the accessory portion. The direction of the air injection part (5) can be easily adjusted.

第1発明に係る成形品取出し装置(4)において、成形品保持部(41)を、吸着によって成形品を保持する吸着手段(41)により構成してもよい。
このような構成を採用することにより、強度が弱く挟持が困難な半硬化状態の成形品や付属部を確実に保持して成形型(21、22)から取り出すことができ、ひいてはしっかりと保持しながら付属部にエアを噴射して半硬化状態の成形品から付属部を除去することができる。
In the molded product taking-out device (4) according to the first invention, the molded product holding portion (41) may be configured by a suction means (41) that holds the molded product by suction.
By adopting such a configuration, it is possible to securely hold the semi-cured molded product and accessories that are weak and difficult to pinch and take them out from the molding molds (21, 22), and by extension, firmly hold them. However, air can be injected into the accessory to remove the accessory from the semi-cured molded product.

第1発明に係る成形品取出し装置(4)において、成形材料を、磁性粒子を含有する熱硬化性樹脂組成物とし、吸着手段(41)として電磁石を用い、電磁石の磁性によって成形品を吸着保持するとよい。
このような構成を採用することにより、材料の種類や半硬化成形品の強度などを考慮して磁力による吸引力を調整することができるので、適切かつ確実に半硬化状態の成形品を保持することができる。
In the molded product taking-out device (4) according to the first invention, the molding material is a thermosetting resin composition containing magnetic particles, an electromagnet is used as the adsorption means (41), and the molded product is attracted and held by the magnetism of the electromagnet. It is good to do.
By adopting such a configuration, the attractive force due to the magnetic force can be adjusted in consideration of the type of material and the strength of the semi-cured molded product, so that the molded product in the semi-cured state can be appropriately and surely held. be able to.

第1発明に係る成形品取出し装置(4)において、成形品を射出成形法により製造したものとするとよい。これにより、射出成形法により成形された半硬化状態の成形品の付属部に対して、エア噴射部手段(5)によってエアを吹きかけ成形品から付属部を吹き飛ばすことにより、付属部の残骸が成形品に残ってしまったり、成形品と付属部との境界を変形させてしまうなどの問題を発生させることなく、強度が低い半硬化状態の成形品からランナーなどの付属部を除去することができる。 In the molded product taking-out device (4) according to the first invention, it is preferable that the molded product is manufactured by an injection molding method. As a result, air is blown to the accessory part of the semi-cured molded product molded by the injection molding method by the air injection part means (5) to blow off the accessory part from the molded product, so that the debris of the accessory part is molded. It is possible to remove accessories such as runners from a semi-cured molded product with low strength without causing problems such as remaining in the product or deforming the boundary between the molded product and the accessory. ..

第2発明に係る成形品取出し方法の特徴は、
成形品取出し装置(4)によって成形型(21、22)から成形品を取り出す成形品取出し方法であって、
成形型(21、22)の内部において成形された半硬化状態の成形品を成形品保持部(41)により保持する工程と、
成形品を成形品保持部(41)にて保持した状態によって、成形品の付属部に対してエアを吹きかけ、成形品から付属部を吹き飛ばすエア噴射工程と、を有する点にある。
The feature of the molded article taking-out method according to the second invention is
This is a method for taking out a molded product from a molding die (21, 22) by a molded product taking-out device (4).
A step of holding the semi-cured molded product molded inside the molding mold (21, 22) by the molded product holding unit (41), and
It has a point of having an air injection step of blowing air to an accessory portion of the molded product and blowing off the accessory portion from the molded product depending on the state in which the molded product is held by the molded product holding portion (41).

第3発明に係る成形品の製造方法の特徴は、
成形品取出し装置(4)を用いて、熱硬化性樹脂組成物の成形品を製造する方法であって、
成形型(21、22)を用いて半硬化状態の成形品を成形する工程と、
成形品を成形品保持部(41)により保持する工程と、
成形品を成形品保持部(41)にて保持した状態で、成形品の付属部にエアを吹きかけ、成形品から付属部を吹き飛ばすエア噴射工程と、を有する点にある。
The feature of the method for manufacturing a molded product according to the third invention is
A method for producing a molded product of a thermosetting resin composition using a molded product extraction device (4).
The process of molding a semi-cured molded product using a molding die (21, 22), and
The process of holding the molded product by the molded product holding unit (41) and
The point is that it has an air injection step of blowing air to an accessory portion of the molded product and blowing off the accessory portion from the molded product while the molded product is held by the molded product holding portion (41).

第2発明および第3発明によれば、成形型(21、22)のうち可動金型(21)から取り出された半硬化状態の成形品の付属部に対して、エアを吹きかけ、成形品から付属部を吹き飛ばすことにより、付属部の残骸が成形品に残ってしまったり、成形品と付属部との境界を変形させてしまうなどの問題を発生させることなく、強度が低い半硬化成形品からランナーなどの付属部を除去することができる。 According to the second invention and the third invention, air is blown to the accessory portion of the semi-cured molded product taken out from the movable mold (21) among the molding dies (21, 22), and the molded product is used. By blowing off the accessory part, the debris of the accessory part does not remain in the molded product, and the boundary between the molded product and the accessory part is not deformed. Attachments such as runners can be removed.

第4発明に係る付属部除去装置(5)の特徴は、
成形時において熱硬化性樹脂組成物の成形品と一体に形成される付属部を、該成形品から除去する付属部除去装置(5)であって、
半硬化状態の成形品の付属部に対してエアを吹きかけるエア噴射部(53)を有し、
エア噴射部(53)から吹きかけられるエアによって成形品から付属部を吹き飛ばす点にある。
The feature of the accessory removing device (5) according to the fourth invention is
An accessory removing device (5) for removing an accessory formed integrally with a molded product of a thermosetting resin composition from the molded product during molding.
It has an air injection part (53) that blows air to the accessory part of the semi-cured molded product.
The point is that the accessory portion is blown off from the molded product by the air blown from the air injection portion (53).

第4発明によれば、半硬化状態の成形品の付属部にエアを吹きかけて成形品から付属部を吹き飛ばすことにより、付属部の残骸が成形品に残ってしまったり、成形品と付属部との境界を変形させてしまうなどの問題を発生させることなく、強度が低い半硬化成形品からランナーなどの付属部を除去することができる。 According to the fourth invention, by blowing air to the accessory part of the semi-cured molded product to blow off the accessory part from the molded product, the debris of the accessory part remains in the molded product, or the molded product and the accessory part It is possible to remove an accessory such as a runner from a semi-cured molded product having low strength without causing a problem such as deforming the boundary between the two.

第1〜4発明に係る成形品取出し装置、成形品の取出し方法、成形品の製造方法、および付属部除去装置によれば、半硬化状態の成形品のランナー、スプルー、ゲートなどの付属部を適切かつ確実に成形品から除去することができる。 According to the molded article taking-out device, the molded article taking-out method, the molded article manufacturing method, and the accessory part removing device according to the first to fourth inventions, accessories such as a runner, a sprue, and a gate of the semi-cured molded article are provided. It can be properly and reliably removed from the article.

本発明の一実施形態に係る成形品取出し装置を備えた金型装置の一状態(型締め状態)を示す断面概略図である。It is sectional drawing which shows one state (mold tightening state) of the mold apparatus provided with the molded article take-out apparatus which concerns on one Embodiment of this invention. 図1に示す金型装置の一状態(型開き状態)を示す断面概略図である。It is sectional drawing which shows one state (mold opening state) of the mold apparatus shown in FIG. 図1に示す金型装置の一状態(押出工程)を示す断面概略図である。It is sectional drawing which shows one state (extrusion process) of the mold apparatus shown in FIG. 図1に示す金型装置の一状態(保持工程)を示す断面概略図である。It is sectional drawing which shows one state (holding process) of the mold apparatus shown in FIG. 図1に示す金型装置の一状態(付属部除去工程)を示す断面概略図である。It is sectional drawing which shows one state (attachment part removal process) of the mold apparatus shown in FIG. 図1に示す金型装置の一状態(成形品の取出工程)を示す断面概略図である。It is sectional drawing which shows one state (the process of taking out a molded product) of the mold apparatus shown in FIG. 図1〜図6に示す金型装置を用いて樹脂組成物からなる成形品を製造する工程を示すフローチャートである。It is a flowchart which shows the process of manufacturing the molded article made from the resin composition using the mold apparatus shown in FIGS. 1 to 6. 図7の取り出し工程を示すフローチャートである。It is a flowchart which shows the taking-out process of FIG.

以下、図1〜図8に基づき、本発明に係る成形品取出し装置および付属部除去装置の一例を説明する。 Hereinafter, an example of the molded product taking-out device and the accessory removing device according to the present invention will be described with reference to FIGS. 1 to 8.

図1〜図6に示すように、本実施形態に係る成形品取出し装置4および付属部除去装置5は、成形品を製造する金型装置1に備えられており、本実施形態における金型装置1は、成形品取出し装置4および付属部除去装置5のほか、成形材料としての、熱硬化性樹脂組成物の成形品を射出成形する射出成形装置2、射出成形された成形品を金型から離脱させる成形品押出装置3を有している。 As shown in FIGS. 1 to 6, the molded product taking-out device 4 and the accessory removing device 5 according to the present embodiment are provided in the mold device 1 for manufacturing the molded product, and the mold device according to the present embodiment. 1 is an injection molding device 2 for injection molding a molded product of a thermosetting resin composition as a molding material, and an injection molded product from a mold, in addition to a molded product taking-out device 4 and an accessory removing device 5. It has a molded product extruder 3 to be separated.

射出成形装置2は、成形品を成形するための成形型21、22として可動金型21および固定金型22を有しており、本実施形態において可動金型21は図示しない金型駆動装置による駆動により、図1に示す固定金型22に圧接された型締め状態の位置と、図2に示す固定金型22から離間する型開き状態との位置を接離移動するようにされている。 The injection molding apparatus 2 has a movable mold 21 and a fixed mold 22 as molding dies 21 and 22 for molding a molded product, and in the present embodiment, the movable mold 21 is based on a mold driving device (not shown). By driving, the position of the mold-tightened state pressed against the fixed mold 22 shown in FIG. 1 and the position of the mold-opened state separated from the fixed mold 22 shown in FIG. 2 are moved in contact with each other.

可動金型21と固定金型22とを分割面で組み合わせることによりできる内部には、固定金型22と可動金型21との型締め状態において成形材料が充填されるキャビティ23が形成されるようになっており、固定金型22には、固定金型22外からキャビティ23に成形材料を射出する注入路24が形成されている。 A cavity 23 filled with a molding material is formed in the inside formed by combining the movable mold 21 and the fixed mold 22 on a split surface so that the fixed mold 22 and the movable mold 21 are in a molded state. The fixed mold 22 is formed with an injection path 24 for injecting a molding material into the cavity 23 from outside the fixed mold 22.

本実施形態で用いる成形材料としての熱硬化性樹脂組成物は、少なくとも、熱硬化性樹脂と、硬化剤を含有する。熱硬化性樹脂としては、例えば、エポキシ樹脂、フェノール樹脂、メラミン樹脂、ポリイミド樹脂、尿素樹脂、不飽和ポリエステル樹脂、ポリウレタン樹脂、シリコーン樹脂などが挙げられる。熱硬化性樹脂は、1種のみを用いてもよく、2種以上を併用してもよい。また、硬化剤としては、特に限定されず、例えば、アミン系化合物、イミダゾール系化合物、イミダゾリン系化合物、尿素系化合物、酸無水物系化合物、アミド系化合物、ヒドラジド系化合物、フェノール系化合物、ポリスルフィド系化合物などが挙げられる。硬化剤を用いる場合、硬化剤の含有量は、熱硬化性樹脂に対して、0.05質量%〜1質量%が好ましく、0.2質量%〜0.5質量%の範囲がより好ましい。硬化剤は、1種のみを用いてもよく、2種以上を併用してもよい。 The thermosetting resin composition as a molding material used in the present embodiment contains at least a thermosetting resin and a curing agent. Examples of the thermosetting resin include epoxy resin, phenol resin, melamine resin, polyimide resin, urea resin, unsaturated polyester resin, polyurethane resin, silicone resin and the like. Only one type of thermosetting resin may be used, or two or more types may be used in combination. The curing agent is not particularly limited, and for example, an amine compound, an imidazole compound, an imidazoline compound, a urea compound, an acid anhydride compound, an amide compound, a hydrazide compound, a phenol compound, and a polysulfide compound. Examples include compounds. When a curing agent is used, the content of the curing agent is preferably 0.05% by mass to 1% by mass, more preferably 0.2% by mass to 0.5% by mass, based on the thermosetting resin. Only one type of curing agent may be used, or two or more types may be used in combination.

本実施形態に用いる成形材料としての熱硬化性樹脂組成物は、さらに上記の成分に加え、本実施形態における効果を損なわない範囲で、必要に応じて他の成分を含んでいてもよい。他の成分としては、例えば、磁性粒子、非磁性粒子、硬化促進剤、離型剤、発泡剤、顔料、充填剤、老化防止剤、加工助剤などが挙げられる。また磁性粒子は、表面の少なくとも一部が分散剤で被覆されていてもよい。磁性粒子としては、例えば、マグネタイト、γ酸化鉄、マンガンフェライト、コバルトフェライト、若しくはこれらと亜鉛、ニッケルとの複合フェライトやバリウムフェライトなどの強磁性酸化物、又は鉄、コバルト、希土類などの強磁性金属、窒化金属などの磁性粒子が挙げられる。分散剤としては、公知の界面活性剤や高分子分散剤などが挙げられる。以降、磁性粒子が含有されている場合を例示して説明する。 The thermosetting resin composition as a molding material used in the present embodiment may further contain other components in addition to the above components as long as the effects in the present embodiment are not impaired. Examples of other components include magnetic particles, non-magnetic particles, curing accelerators, mold release agents, foaming agents, pigments, fillers, antioxidants, processing aids and the like. Further, at least a part of the surface of the magnetic particles may be coated with a dispersant. Examples of the magnetic particles include magnetite, γ-iron oxide, manganese ferrite, cobalt ferrite, ferromagnetic oxides such as composite ferrites of zinc and nickel and barium ferrite, and ferromagnetic metals such as iron, cobalt and rare earths. , Magnetic particles such as metal nitride. Examples of the dispersant include known surfactants and polymer dispersants. Hereinafter, a case where magnetic particles are contained will be described as an example.

そして、射出成形装置2は、磁性粒子を含有する熱硬化性樹脂組成物を、注入路24を介して可動金型21および固定金型22内のキャビティ23に充填させて半硬化状態の成形品を成形するようになっている。 Then, the injection molding apparatus 2 fills the cavity 23 in the movable mold 21 and the fixed mold 22 with the thermosetting resin composition containing the magnetic particles via the injection path 24, and is a molded product in a semi-cured state. Is designed to be molded.

ここで半硬化状態とは、ある種の熱硬化性樹脂の反応において,材料がある種の液体に接触する場合には膨潤しかつ加熱する場合には軟化するが、しかし完全には溶解または溶融しない中間段階を意味し、例えば、全硬化発熱量の20%以上〜60%未満の発熱を終えた状態である。一方、本硬化状態とは、熱硬化性樹脂の硬化の最終状態であり、不溶不融性であり、完全に硬化した熱硬化性樹脂はこの状態にある。例えば、全硬化発熱量の60%以上〜100%の発熱を終えた状態が本硬化状態といえる。 Here, the semi-cured state means that in the reaction of a certain thermosetting resin, the material swells when it comes into contact with a certain liquid and softens when it is heated, but completely melts or melts. It means an intermediate stage in which the heat is not generated, and is, for example, a state in which heat generation of 20% or more and less than 60% of the total curing calorific value is completed. On the other hand, the main cured state is the final state of curing of the thermosetting resin, which is insoluble and insoluble, and the completely cured thermosetting resin is in this state. For example, a state in which heat generation of 60% or more to 100% of the total heat generation amount of curing is completed can be said to be a main curing state.

なお、半硬化状態の前に初期状態がある。初期状態とは、熱硬化性樹脂の生成反応の初期の状態であり、溶剤に完全に溶け、加熱すると溶融する状態である。発熱量がゼロの場合の他、例えば、全硬化発熱量の20%未満の発熱状態の場合も初期状態に含まれる。全硬化発熱量や発熱量は、示差走査熱分析(DSC)を用いて測定される。 There is an initial state before the semi-cured state. The initial state is an initial state of the formation reaction of the thermosetting resin, which is completely dissolved in a solvent and melts when heated. In addition to the case where the calorific value is zero, for example, a heat generation state of less than 20% of the total curing calorific value is also included in the initial state. The total curing calorific value and calorific value are measured using differential scanning calorimetry (DSC).

また、本実施形態に係る金型装置1の成形品押出装置3は、キャビティ23に連通するように可動金型21の内部に形成されたピン挿通用の第1通路31を備えており、第1通路31には、押出ピン32が第1通路31内の収納位置と第1通路31におけるキャビティ23側の第1開口部から突き出される押出位置との間を進退自在に移動可能に挿通されている。押出ピン32の他端部(後端部)は、伝達部材34を介して押出ピン32を駆動するピン駆動装置33に接続されており、押出ピン32は、ピン駆動装置33による駆動により収納位置と押出位置との間を進退移動するようになっている。 Further, the molded product extrusion device 3 of the mold device 1 according to the present embodiment includes a first passage 31 for inserting a pin formed inside the movable mold 21 so as to communicate with the cavity 23. The extrusion pin 32 is inserted into the first passage 31 so as to be movable back and forth between the storage position in the first passage 31 and the extrusion position protruding from the first opening on the cavity 23 side in the first passage 31. ing. The other end (rear end) of the extrusion pin 32 is connected to a pin drive device 33 that drives the extrusion pin 32 via a transmission member 34, and the extrusion pin 32 is driven by the pin drive device 33 to a storage position. It is designed to move forward and backward between the and extrusion positions.

なお、本実施形態においては、固定金型22に成形材料を供給する注入路24が形成され、可動金型21に押出ピン32が挿通される第1通路31が形成されているが、本発明はこれに限定されるものではない。 In the present embodiment, the injection path 24 for supplying the molding material is formed in the fixed mold 22, and the first passage 31 through which the extrusion pin 32 is inserted is formed in the movable mold 21. Is not limited to this.

さらに、本実施形態に係る金型装置1の成形品取出し装置4は、射出成形装置2の固定金型22が固定されている図示しない固定側プラテンの上面に、固定して取り付けられている。 Further, the molded product take-out device 4 of the mold device 1 according to the present embodiment is fixedly attached to the upper surface of a fixed platen (not shown) to which the fixed mold 22 of the injection molding device 2 is fixed.

成形品取出し装置4は、成形品を保持する成形品保持部41として、吸着により成形品を保持する吸着手段41を有している。吸着手段41は、図示しない通電制御装置による通電によって磁力の発生が制御されるようになっており、アーム42の先端に取り付けられている。 The molded product taking-out device 4 has a suction means 41 for holding the molded product by suction as a molded product holding unit 41 for holding the molded product. The suction means 41 is adapted to control the generation of magnetic force by energization by an energization control device (not shown), and is attached to the tip of the arm 42.

アーム42は、例えばフレームに沿って走行する走行体や該走行体を駆動する電動モータなどからなる図示しないアーム駆動装置による駆動により、アーム42の先端に取り付けられた吸着手段41が型開き状態の両金型21、22間に位置するように昇降移動したり、両金型21、22間においてアームの先端が、成形品が押出ピン32により可動金型21から押し出される離脱位置に対して近離する方向に移動したり、さらには射出成形装置2の外部における成形品を取り出す取出し位置に移動するようになっている。そして、成形品取出し装置4は、図4に示すように、アーム42の先端が離脱位置に位置し成形品に近づいた状態で、通電制御装置による通電により吸着体に磁力を発生させると、吸着手段41の磁力による吸引力により成形品が吸着手段41に吸着することとなる。また、図6に示すように、吸着手段41によって成形品を保持した状態で、アーム駆動装置による駆動によりアーム42の先端が取出し位置に移動することにより、成形品が両金型21、22間から取り出されるようになっている。また、成形品取出し装置4は、通電制御装置による通電を解除して吸着手段41の磁力による吸引力をなくすことにより、成形品が所定の位置に収納されるように、吸着手段41から取り外されるようになっている。 The arm 42 is driven by an arm driving device (not shown) including a traveling body traveling along the frame or an electric motor for driving the traveling body, so that the suction means 41 attached to the tip of the arm 42 is in a mold-opened state. It moves up and down so that it is located between the two molds 21 and 22, and the tip of the arm between the two molds 21 and 22 is close to the detached position where the molded product is pushed out from the movable mold 21 by the extrusion pin 32. It moves in the direction of separation, and further moves to the take-out position for taking out the molded product outside the injection molding apparatus 2. Then, as shown in FIG. 4, the molded product taking-out device 4 attracts when a magnetic force is generated in the adsorbent by energization by the energization control device in a state where the tip of the arm 42 is located at the detached position and approaches the molded product. The molded product is attracted to the suction means 41 by the attractive force of the magnetic force of the means 41. Further, as shown in FIG. 6, while the molded product is held by the suction means 41, the tip of the arm 42 is moved to the take-out position by being driven by the arm driving device, so that the molded product is between the molds 21 and 22. It is designed to be taken out from. Further, the molded product taking-out device 4 is removed from the suction means 41 so that the molded product is stored in a predetermined position by releasing the energization by the energization control device and eliminating the attractive force due to the magnetic force of the suction means 41. It has become like.

なお、吸着手段41は上記構成に限定されない。吸着手段41が、例えば、非磁性体からなる伝達体と、電磁石などの磁性体からなる吸着体と、を有し、吸着体が伝達体に対して接離可能に移動するようにして、吸着体と伝達体との距離によって吸着体の磁力による吸引力を調整することにより成形品を吸着手段41に吸着させたり、吸着手段41から取り外すようにしてもよい。 The adsorption means 41 is not limited to the above configuration. The adsorption means 41 has, for example, a transmitter made of a non-magnetic material and an adsorbent made of a magnetic material such as an electromagnet, and the adsorbent moves so as to be removable from the transmitter. By adjusting the attractive force due to the magnetic force of the adsorbent according to the distance between the body and the transmitter, the molded product may be adsorbed on the adsorbing means 41 or removed from the adsorbing means 41.

また、本実施形態の成形材料は、磁性粒子を含有する熱硬化性樹脂組成物であって磁性を有しており、成形品取出し装置4は、磁力による吸引力によって成形品を保持部としての吸着手段41に吸着させることにより両金型21、22間から取り出すようになっているが、本発明はこれに限定されるものではない。例えば、エア吸引や真空吸着により成形品を吸着手段41に吸着させたり、あるいは成形品を、例えば粘着体からなる吸着手段41により吸着手段41に吸着させて、両金型21、22間から取り出すようにしてもよい。 Further, the molding material of the present embodiment is a thermosetting resin composition containing magnetic particles and has magnetism, and the molded product taking-out device 4 uses the molded product as a holding portion by an attractive force due to a magnetic force. By adsorbing it on the adsorbing means 41, it is taken out from between the molds 21 and 22, but the present invention is not limited to this. For example, the molded product is adsorbed on the suction means 41 by air suction or vacuum suction, or the molded product is sucked on the suction means 41 by the suction means 41 made of, for example, an adhesive body, and is taken out from between the molds 21 and 22. You may do so.

ここで、成形品の強度を考慮すると、磁性を有する成形品であれば磁性によって吸着手段41に吸着させることが好ましい。このような成形品取出し装置4によれば、吸着体の接離や通電によって吸着手段41の吸引力を容易に調整することができ、成形品を確実かつ安定して保持し、可動金型21から取り出すことができる。 Here, considering the strength of the molded product, it is preferable that the molded product having magnetism is attracted to the adsorption means 41 by magnetism. According to such a molded product taking-out device 4, the suction force of the suction means 41 can be easily adjusted by the contact / detachment of the adsorbent and the energization, the molded product can be held reliably and stably, and the movable mold 21 can be held. Can be taken out from.

さらにまた、本実施形態に係る成形品取出し装置4は付属部除去装置5を有している。付属部除去装置5は、成形品の付属部に対して圧縮空気を噴射するエア噴射口51が形成されたエアノズル52を備えるエア噴射部53と、エアノズル52に空気を供給する図示しない空気供給部と、エアノズル52および空気供給部を連結するボディと、空気供給部からエアノズル52への圧縮空気の供給を制御する図示しないバルブと、を有している。 Furthermore, the molded article taking-out device 4 according to the present embodiment has an accessory removing device 5. The accessory removing device 5 includes an air injection section 53 having an air nozzle 52 formed with an air injection port 51 for injecting compressed air into the accessory portion of the molded product, and an air supply unit (not shown) that supplies air to the air nozzle 52. It has a body that connects the air nozzle 52 and the air supply unit, and a valve (not shown) that controls the supply of compressed air from the air supply unit to the air nozzle 52.

エア噴射部53は、成形品取出し装置4のアーム42に取り付けられており、吸着手段41によって半硬化状態の成形品を保持している状態のときに、エア噴射口51が成形品の付属部(本実施形態においてはゲートG)に対向するように配置されている。そして、エア噴射部53においては、図5に示すように、成形品取出し装置4の吸着手段41によって保持される成形品の付属部に対してエアが吹きかけられるようになっており、これにより、付属部が成形品の製品本体から吹き飛ばされて成形品から付属部が除去されるようになっている。ここで成形品取出し装置4がアーム42に取り付けられているとは、エア噴射部53がアーム42自体に直接取り付けられる場合に限らず、アーム42の先端に装着されている成型品保持部41に取り付けられることにより、この成形品保持部41を介してアーム42に取り付けられてもよく、さらにアーム42自体に直接および成型品保持部41の双方に取り付けられてもよい。また、図1〜図6において、2つのエア噴射部53が、取り付けられているが、エア噴射部53の数は本実施形態のものに限定されず、射出成形装置2によって成形される成形品および付属部の形状に応じて適宜決定される。 The air injection unit 53 is attached to the arm 42 of the molded product take-out device 4, and the air injection port 51 is an accessory portion of the molded product when the molded product in a semi-cured state is held by the suction means 41. (In this embodiment, it is arranged so as to face the gate G). Then, in the air injection unit 53, as shown in FIG. 5, air is blown to the accessory portion of the molded product held by the suction means 41 of the molded product extraction device 4. The accessory part is blown off from the product body of the molded product so that the accessory part is removed from the molded product. Here, the fact that the molded product taking-out device 4 is attached to the arm 42 is not limited to the case where the air injection portion 53 is directly attached to the arm 42 itself, but also to the molded product holding portion 41 attached to the tip of the arm 42. By being attached, it may be attached to the arm 42 via the molded article holding portion 41, and may be attached directly to the arm 42 itself or to both the molded article holding portion 41. Further, in FIGS. 1 to 6, two air injection parts 53 are attached, but the number of air injection parts 53 is not limited to that of the present embodiment, and the molded product molded by the injection molding apparatus 2 And it is appropriately determined according to the shape of the accessory part.

エアノズル52は、エア噴射口51から噴射されるエアの噴射方向を変更することができるようにボディに対して角度や位置を調整可能に連結されているとよい。これにより、エア噴射部53は、成形品や付属部の形状、位置、大きさに応じて、エア噴射口51を付属部に向けることができるようになっている。エア噴射部53は、付属部のうちゲートGの部分に対してエアを吹き付けることが好ましい。ゲートGの厚みは、スプルーSやランナーRの厚みと比較し薄いため、より低いエア圧で付属部を除去することができるからである。なお、本実施形態においてはエアノズル52をボディに対して角度・位置を調整可能に連結することによって、エアの噴射方向を変更するようになっているが、例えば、エア噴射部53をアーム42に対して角度・位置を調整可能に取り付けることにより、エアの噴射方向を変更するようにしてもよい。 The air nozzle 52 may be connected to the body so that the angle and position can be adjusted so that the injection direction of the air injected from the air injection port 51 can be changed. As a result, the air injection portion 53 can direct the air injection port 51 toward the accessory portion according to the shape, position, and size of the molded product and the accessory portion. It is preferable that the air injection unit 53 blows air onto the gate G portion of the accessory portions. This is because the thickness of the gate G is thinner than that of the sprue S and the runner R, so that the accessory portion can be removed with a lower air pressure. In the present embodiment, the air injection direction is changed by connecting the air nozzle 52 to the body so that the angle and position can be adjusted. For example, the air injection unit 53 is attached to the arm 42. On the other hand, the air injection direction may be changed by mounting the angle and position in an adjustable manner.

エア噴射部53から噴射されるエア圧力は、例えば0.6〜1.0MPaである。エアの圧力や噴射時間は、成形品における付属部の形状や強度に基づき設定される。 The air pressure injected from the air injection unit 53 is, for example, 0.6 to 1.0 MPa. The air pressure and injection time are set based on the shape and strength of the accessory part in the molded product.

続いて、図7に基づき、本実施形態における成形品取出し装置4を備える金型装置1を用いた磁性粒子を含有する熱硬化性樹脂組成物の成形品の製造方法、および図8に基づき成形品取出し装置4を用いた成形品の取出し方法について説明する。 Subsequently, based on FIG. 7, a method for producing a molded product of a thermosetting resin composition containing magnetic particles using a mold device 1 provided with a molded product taking-out device 4 in the present embodiment, and molding based on FIG. A method of taking out a molded product using the product taking-out device 4 will be described.

まず、金型駆動装置による駆動により可動金型21を固定金型22との分割面において接する位置に移動させ、可動金型21と固定金型22とを分割面で組み合わせて型締め状態とすることにより、可動金型21と固定金型22との間にキャビティ23を形成する(STEP1)。 First, the movable mold 21 is moved to a position where it is in contact with the fixed mold 22 on the split surface by being driven by the mold drive device, and the movable mold 21 and the fixed mold 22 are combined on the split surface to be in a mold clamping state. As a result, the cavity 23 is formed between the movable mold 21 and the fixed mold 22 (STEP 1).

続いて、図1に示すように固定金型22の注入路24から磁性粒子を含有する熱硬化性樹脂組成物を供給しキャビティ23に充填させ、成形品を成形する(STEP2)。ここで得られる成形品の硬化の状態は、半硬化状態である。半硬化状態であれば、不要となる付属部を再利用することが可能である。さらに、半硬化状態であれば、本硬化状態である場合と比較して、磁性粒子に付着している界面活性剤などからなる分散剤のガス化による爆発の懸念もなく、可動金型21から容易に成型品を剥離することができるというメリットも期待される。 Subsequently, as shown in FIG. 1, a thermosetting resin composition containing magnetic particles is supplied from the injection path 24 of the fixed mold 22 and filled in the cavity 23 to mold a molded product (STEP 2). The cured state of the molded product obtained here is a semi-cured state. If it is in a semi-cured state, it is possible to reuse unnecessary accessories. Further, in the semi-cured state, there is no concern about explosion due to gasification of the dispersant consisting of the surfactant or the like adhering to the magnetic particles as compared with the case in the main cured state, and the movable mold 21 It is also expected to have the advantage that the molded product can be easily peeled off.

次に、キャビティ23内に充填された熱硬化性樹脂組成物が半硬化状態において、図2に示すように金型駆動装置による駆動により可動金型21を固定金型22から離間する位置に相対移動させ可動金型21と固定金型22とを型開き状態とする(STEP3)。これにより、固定金型22は、可動金型21およびキャビティ23内に成形された半硬化成形品から離間し、半硬化成形品は可動金型21内に残ることとなる。 Next, in a semi-cured state, the thermosetting resin composition filled in the cavity 23 is relative to a position where the movable mold 21 is separated from the fixed mold 22 by being driven by the mold driving device as shown in FIG. The movable mold 21 and the fixed mold 22 are moved to open the mold (STEP 3). As a result, the fixed mold 22 is separated from the semi-cured molded product molded in the movable mold 21 and the cavity 23, and the semi-cured molded product remains in the movable mold 21.

熱硬化性樹脂組成物の温度が硬化温度よりも50℃以上低い温度、好ましくは75〜100℃低い温度になったら、図3に示すように押出ピン32をキャビティ23内に突き出すことにより、押出ピン32の先端を半硬化成形品自体に当接させて半硬化成形品を可動金型21から押し出す。これにより、半硬化成形品を可動金型21から離脱させる(STEP4)。熱硬化性樹脂組成物を前述の温度に冷却させた後に可動金型21から離脱させることにより、熱硬化性樹脂組成物の型離れが良好となる。なお、本実施形態においては押出ピン32を半硬化成形品自体に当接させて可動金型21から押し出すようになっているが、本発明はこれに限定されるものではなく、ランナーRやゲートGに当接させるようにしてもよい。 When the temperature of the thermosetting resin composition becomes 50 ° C. or more lower than the curing temperature, preferably 75 to 100 ° C. lower, the extrusion pin 32 is extruded into the cavity 23 as shown in FIG. The tip of the pin 32 is brought into contact with the semi-cured molded product itself, and the semi-cured molded product is pushed out from the movable mold 21. As a result, the semi-cured molded product is separated from the movable mold 21 (STEP 4). When the thermosetting resin composition is cooled to the above-mentioned temperature and then separated from the movable mold 21, the thermosetting resin composition can be released from the mold well. In the present embodiment, the extrusion pin 32 is brought into contact with the semi-cured molded product itself and extruded from the movable mold 21, but the present invention is not limited to this, and the runner R and the gate are not limited to this. It may be brought into contact with G.

続いて、成形品取出し装置4により、可動金型21から離脱した成形品を、金型装置1から取り出す(STEP5)。 Subsequently, the molded product taken out from the movable mold 21 is taken out from the mold device 1 by the molded product taking-out device 4 (STEP 5).

取り出し工程(STEP5)は、図4に示すようにまずアーム駆動装置による駆動によりアーム42の先端を離脱位置に移動させて吸着手段41を半硬化成形品に近づけるとともに、通電制御装置により吸着手段41に通電して吸着手段41の磁力による吸引力を発生させることにより、半硬化成形品を吸着手段41に吸着させて保持する(STEP51)。 In the take-out step (STEP 5), as shown in FIG. 4, the tip of the arm 42 is first moved to the detached position by driving by the arm driving device to bring the suction means 41 closer to the semi-cured molded product, and the suction means 41 is brought closer to the semi-cured molded product by the energization control device. By generating an attractive force by the magnetic force of the adsorption means 41, the semi-cured molded product is attracted to and held by the adsorption means 41 (STEP 51).

このように吸着手段41によって半硬化成形品を保持した状態において、図5に示すようにエア噴射部53の空気供給部からバルブを介してエアノズル52に圧縮空気を供給し、エア噴射口51からエアを噴射する。ここで、エアノズル52は、予め半硬化成形品や付属部の大きさ、形状などに応じてエア噴射口51が吸着手段41に保持された半硬化成形品の付属部に向くように配置されており、エア噴射口51からエアを噴射して付属部に対して吹きかけることにより付属部を吹き飛ばして、半硬化成形品から付属部を除去する(STEP52)。本実施形態において、成形品の付属部は連続して形成されており、付属部の一部(本実施形態においてはゲートG)にエアを吹きかけることにより、付属部全体(ゲートG、ランナーR、スプルーS)を成形品から除去することができる。 In the state where the semi-cured molded product is held by the suction means 41 in this way, compressed air is supplied from the air supply unit of the air injection unit 53 to the air nozzle 52 via the valve as shown in FIG. 5, and from the air injection port 51. Inject air. Here, the air nozzle 52 is arranged in advance so that the air injection port 51 faces the accessory portion of the semi-cured molded product held by the suction means 41 according to the size and shape of the semi-cured molded product and the accessory portion. By injecting air from the air injection port 51 and spraying it onto the accessory portion, the accessory portion is blown off and the accessory portion is removed from the semi-cured molded product (STEP 52). In the present embodiment, the accessory portion of the molded product is continuously formed, and by blowing air on a part of the accessory portion (gate G in the present embodiment), the entire accessory portion (gate G, runner R, Sprue S) can be removed from the molded product.

その後、吸着手段41によって半硬化成形品を保持した状態で、図6に示すようにアーム駆動装置による駆動によりアーム42の先端を取出し位置に移動させて、半硬化成形品を両金型21、22の間から離間させ(STEP53)、所定の位置において吸着手段41の磁力を弱めて吸着手段41から半硬化成形品を取り外す(STEP54)。 After that, while the semi-cured molded product is held by the suction means 41, the tip of the arm 42 is moved to the take-out position by driving by the arm driving device as shown in FIG. Separated from between 22 (STEP 53), the magnetic force of the suction means 41 is weakened at a predetermined position, and the semi-cured molded product is removed from the suction means 41 (STEP 54).

本実施形態においては、可動金型21から押し出された半硬化成形品を保持して取り出す工程の流れで、成形品取出し装置4の吸着手段41に保持された半硬化成形品の付属部に対し、付属部除去装置5によってエアを噴射するようになっている。このように取出し工程の一連の流れで付属部除去の工程を行うことにより、製造工程を円滑に進めることができる。 In the present embodiment, in the flow of the process of holding and taking out the semi-cured molded product extruded from the movable mold 21, the attached portion of the semi-cured molded product held by the suction means 41 of the molded product taking-out device 4 , Air is injected by the accessory removing device 5. By performing the process of removing the accessory portion in a series of steps of the taking-out process in this way, the manufacturing process can be smoothly advanced.

なお、本発明は本実施形態の工程に限定されるものではなく、例えば、前述の付属部除去工程(STEP52)を、成形品を両金型21、22の間から取り出す離間工程(STEP53)の後であって、吸着手段41から取り外される取り外し工程(STEP54)の前に行うなど、固定金型22から離脱した半硬化成形品の付属部に対してエアを噴射するものであればよい。 The present invention is not limited to the process of the present embodiment. For example, the above-mentioned accessory removal step (STEP 52) is a separation step (STEP 53) of taking out a molded product from between the molds 21 and 22. Air may be injected to the accessory portion of the semi-cured molded product separated from the fixed mold 22, such as after the removal step (STEP 54) of being removed from the suction means 41.

その後、付属部が除去された成形品を加熱して、半硬化状態の成形品を硬化させる(STEP6)。一方、成形品から除去された付属部は、粉砕されて再生原料として射出成形に用いられる(STEP7)。 Then, the molded product from which the accessory portion has been removed is heated to cure the molded product in the semi-cured state (STEP 6). On the other hand, the accessory part removed from the molded product is crushed and used for injection molding as a recycled raw material (STEP 7).

ここで、本実施形態において、成形品を半硬化状態で可動金型21から離脱させ、金型装置1から取り出す理由としては、以下の点が挙げられる。 Here, in the present embodiment, the reason why the molded product is separated from the movable mold 21 in a semi-cured state and taken out from the mold apparatus 1 is as follows.

まず、半硬化状態で成形品から付属部を除去することにより、半硬化状態の成形品を粉砕して再生原料として改めて射出成形に用いることができる。このため、廃棄物を減少させることができるとともに、射出成形による成形品の製造コストの低廉化を図ることができる。 First, by removing the accessory portion from the molded product in the semi-cured state, the molded product in the semi-cured state can be crushed and used again as a recycled raw material for injection molding. Therefore, it is possible to reduce the amount of waste and to reduce the manufacturing cost of the molded product by injection molding.

また、本実施形態のように、成形材料として少なくとも一部が分散剤によって表面が被覆されている磁性粒子が含有された熱硬化性樹脂組成物を用いた場合には、可動金型21、固定金型22の温度を高温に設定すると、磁性粒子の表面を被覆する分散剤が消失して、磁性粒子が凝集を引き起こし、磁気特性が低下してしまう場合があるからである。 Further, when a thermosetting resin composition containing magnetic particles whose surface is coated with a dispersant at least in part as a molding material as in the present embodiment is used, the movable mold 21 is fixed. This is because when the temperature of the mold 22 is set to a high temperature, the dispersant that coats the surface of the magnetic particles disappears, the magnetic particles agglomerate, and the magnetic characteristics may deteriorate.

ここで、樹脂組成物をキャビティ23内において射出温度よりも高い温度であって分散剤が消失しない温度に加熱して本硬化させてしまうと、可動金型21、固定金型22を加熱後、金型装置1を冷却することが必要となるので、作業性が低下するとともに、温度コントロールも困難である。さらに、熱硬化性樹脂組成物を本硬化させる温度に加熱すると、温度の調整によっては磁性粒子の表面を被覆する分散剤由来のガスが大量に発生し、このガスにより成形品がキャビティ23内において歪んでしまったり、さらには40t程度の圧力で型締めされている可動金型21、固定金型22が型開きしてしまい、金型装置1が破損してしまうおそれもある。 Here, when the resin composition is heated in the cavity 23 to a temperature higher than the injection temperature and the dispersant does not disappear and is finally cured, the movable mold 21 and the fixed mold 22 are heated and then subjected to heating. Since it is necessary to cool the mold device 1, workability is lowered and temperature control is difficult. Further, when the thermosetting resin composition is heated to a temperature at which the thermosetting resin composition is finally cured, a large amount of gas derived from the dispersant that coats the surface of the magnetic particles is generated depending on the temperature adjustment, and the molded product is generated in the cavity 23 by this gas. There is a risk that the mold device 1 will be damaged due to distortion or the opening of the movable mold 21 and the fixed mold 22 that are molded with a pressure of about 40 tons.

このような理由により、成形品を半硬化状態で可動金型21から離脱させ、成形品から付属部を除去している。 For this reason, the molded product is separated from the movable mold 21 in a semi-cured state, and the accessory portion is removed from the molded product.

本実施形態に係る金型装置1によれば、可動金型21から取り出された半硬化状態の成形品の付属部に、付属部除去装置5のエア噴射部53によってエアを吹きかけることにより、成形品から付属部を吹き飛ばすことができる。これにより、強度が足りず切削や切断に適しない半硬化成形品から、付属部が成形品に残ってしまったり、さらには半硬化成形品と付属部との境界が変形してしまうなどの問題を発生させることなく、ランナーなどの付属部を適切かつ確実に除去することができる。 According to the mold device 1 according to the present embodiment, the semi-cured molded product taken out from the movable mold 21 is molded by blowing air from the air injection portion 53 of the accessory removing device 5. The accessory can be blown off from the item. As a result, from a semi-cured molded product that is not suitable for cutting or cutting due to insufficient strength, the accessory part remains in the molded product, and the boundary between the semi-cured molded product and the accessory part is deformed. It is possible to properly and surely remove an accessory such as a runner without generating a runner.

また、本実施形態によれば、エア噴射部53を成形品取出し装置4のアーム42に取り付けることにより、取り出し工程の流れで半硬化成形品から付属部を除去することができ、半硬化成形品の製造工程を円滑に行うことができる。また、アーム42に取り付けられたエア噴射部53のエア噴射口51からアーム42の先端部に設けられている吸着手段41によって保持された半硬化成形品の付属部にエアを吹きかけるので、付属部にエアを吹きかけるためのエア噴射口51の向きの角度調整を容易に行うことができる。 Further, according to the present embodiment, by attaching the air injection unit 53 to the arm 42 of the molded product extraction device 4, the accessory portion can be removed from the semi-cured molded product in the flow of the extraction process, and the semi-cured molded product can be removed. The manufacturing process can be carried out smoothly. Further, since air is blown from the air injection port 51 of the air injection portion 53 attached to the arm 42 to the accessory portion of the semi-cured molded product held by the suction means 41 provided at the tip end portion of the arm 42, the accessory portion. The angle of the direction of the air injection port 51 for blowing air on the air can be easily adjusted.

成形品取出し装置4の保持部を、吸着によって半硬化成形品を保持する吸着手段41とすることにより、強度が弱く挟持が困難な半硬化成形品や付属部を確実に保持して可動金型21から取り出すことができ、ひいてはしっかりと保持しながら付属部にエアを噴射して半硬化成形品から付属部を除去することが可能となる。 By using the suction means 41 for holding the semi-cured molded product by suction as the holding portion of the molded product taking-out device 4, the movable mold can reliably hold the semi-cured molded product and accessories that are weak and difficult to pinch. It can be taken out from 21, and by extension, it is possible to remove the accessory part from the semi-cured molded product by injecting air into the accessory part while holding it firmly.

さらに、成形対象として磁性粒子を含有する熱硬化性樹脂組成物を用い、吸着手段41として電磁石を用いて、電磁石の磁性によって成形品を吸着保持することにより、材料の種類や半硬化成形品の強度などを考慮して磁力による吸引力を調整することができるので、適切かつ確実に半硬化成形品を保持することができる。 Further, by using a thermosetting resin composition containing magnetic particles as a molding target, using an electromagnet as an adsorption means 41, and adsorbing and holding the molded product by the magnetism of the electromagnet, the type of material and the semi-cured molded product can be obtained. Since the attractive force due to the magnetic force can be adjusted in consideration of the strength and the like, the semi-cured molded product can be held appropriately and surely.

なお、本発明は前記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、前記実施形態に対し当業者の通常の知識に基づいて適宜変更・改良が加えられたものも本発明範囲に含まれる。 The present invention is not limited to the above-described embodiment, and the above-described embodiment is appropriately modified or improved based on the ordinary knowledge of those skilled in the art without departing from the spirit of the present invention. Is also included in the scope of the present invention.

例えば、成形品取出し装置4や付属部除去装置5に、付属部が除去されていることを確認するためのセンサなどの検知手段や、該検知手段の結果を成形品にマーキングするためのレーザーマーキングユニットなどの印字手段を設けてもよい。 For example, the molded product taking-out device 4 and the accessory removing device 5 have a detection means such as a sensor for confirming that the accessory has been removed, and laser marking for marking the result of the detection means on the molded product. A printing means such as a unit may be provided.

1… 金型装置
2… 射出成形装置
21… 可動金型(成形型)
22… 固定金型(成形型)
23… キャビティ
24… 注入路
3… 成形品押出装置
31… ピン挿通用通路
32… 押出ピン
33… ピン駆動装置
34… 伝達部材
35… スプリング
4… 成形品取出し装置
41… 吸着手段(成形品保持部)
42… アーム
5… 付属部除去装置
51… エア噴射口
52… エアノズル
53… エア噴射部
54… ボディ
1 ... Mold device 2 ... Injection molding device 21 ... Movable mold (molding mold)
22 ... Fixed mold (molding mold)
23 ... Cavity 24 ... Injection path 3 ... Molded product extrusion device 31 ... Pin insertion passage 32 ... Extrusion pin 33 ... Pin drive device 34 ... Transmission member 35 ... Spring 4 ... Molded product extraction device 41 ... Suction means (molded product holding unit) )
42 ... Arm 5 ... Attached part removal device 51 ... Air injection port 52 ... Air nozzle 53 ... Air injection part 54 ... Body

Claims (8)

成形型の内部において成形された熱硬化性樹脂組成物の成形品を、該成形型から取り出す成形品取出し装置であって、
前記成形型の内部において成形された半硬化状態の前記成形品を保持する成形品保持部と、
成形品保持部により保持された成形品の付属部に対してエアを吹きかけるエア噴射部と、を有し、
エア噴射部から吹きかけられるエアによって成形品から付属部を吹き飛ばすように構成した成形品取出し装置。
A molded product take-out device for taking out a molded product of a thermosetting resin composition molded inside a molding mold from the molding mold.
A molded product holding portion that holds the molded product in a semi-cured state molded inside the molding mold,
It has an air injection part that blows air to the accessory part of the molded product held by the molded product holding part.
A molded product take-out device configured to blow off accessories from a molded product by the air blown from the air injection unit.
成形品保持部が装着されたアームを備え、
エア噴射部がアームに取り付けられており、成形品保持部により成形品が保持された状態でエア噴射部から付属部に対しエアが吹きかけられることを特徴とする請求項1に記載の成形品取出し装置。
Equipped with an arm equipped with a molded product holder
The molded product removal according to claim 1, wherein the air injection portion is attached to the arm, and air is blown from the air injection portion to the accessory portion while the molded product is held by the molded product holding portion. apparatus.
成形品保持部が、吸着によって成形品を保持する吸着手段からなることを特徴とする請求項1または請求項2に記載の成形品取出し装置。 The molded product taking-out device according to claim 1 or 2, wherein the molded product holding portion comprises a suction means for holding the molded product by adsorption. 成形材料を、磁性粒子を含有する熱硬化性樹脂組成物とし、
吸着手段として電磁石を用い、電磁石の磁性によって成形品を吸着保持することを特徴とする請求項3に記載の成形品取出し装置。
The molding material is a thermosetting resin composition containing magnetic particles.
The molded product taking-out device according to claim 3, wherein an electromagnet is used as the suction means, and the molded product is attracted and held by the magnetism of the electromagnet.
前記成形品が射出成形法により製造されたものであることを特徴とする請求項1〜請求項4のいずれか1項に記載の成形品取出し装置。 The molded product taking-out device according to any one of claims 1 to 4, wherein the molded product is manufactured by an injection molding method. 請求項1〜請求項5のいずれか1項に記載の成形品取出し装置によって前記成形型から前記成形品を取り出す成形品取出し方法であって、
前記成形型の内部において成形された半硬化状態の成形品を成形品保持部により保持する工程と、
成形品を成形品保持部にて保持した状態によって、成形品の付属部に対してエアを吹きかけ、成形品から付属部を吹き飛ばすエア噴射工程と、
を有する成形品取出し方法。
A method for taking out a molded product from the molding mold by the molded product taking-out device according to any one of claims 1 to 5.
A step of holding a semi-cured molded product molded inside the molding mold by a molded product holding portion, and
An air injection process in which air is blown to the accessory part of the molded product and the accessory part is blown off from the molded product depending on the state in which the molded product is held by the molded product holding portion.
A method for taking out a molded product having.
請求項1〜5のいずれか1項に記載の成形品取出し装置を用いて、熱硬化性樹脂組成物の成形品を製造する方法であって、
成形型を用いて半硬化状態の成形品を成形する工程と、
成形品を成形品保持部により保持する工程と、
前記成形品を成形品保持部にて保持した状態で、成形品の付属部にエアを吹きかけ、成形品から付属部を吹き飛ばすエア噴射工程と、
を有する成形品の製造方法。
A method for producing a molded product of a thermosetting resin composition by using the molded product taking-out device according to any one of claims 1 to 5.
The process of molding a semi-cured molded product using a molding mold,
The process of holding the molded product by the molded product holding unit,
An air injection process in which air is blown to the accessory part of the molded product while the molded product is held by the molded product holding portion to blow off the accessory part from the molded product.
A method for manufacturing a molded product having.
成形時において熱硬化性樹脂組成物の成形品と一体に形成される付属物を、該成形品から除去する付属部除去装置であって、
半硬化状態の成形品の付属部に対してエアを吹きかけるエア噴射部を有し、
エア噴射部から吹きかけられるエアによって成形品から付属部を吹き飛ばすように構成した付属部除去装置。
An accessory removing device for removing an accessory formed integrally with a molded product of a thermosetting resin composition from the molded product during molding.
It has an air injection part that blows air to the accessory part of the semi-cured molded product.
An accessory removal device configured to blow off the accessory from the molded product by the air blown from the air injection part.
JP2019126845A 2019-07-08 2019-07-08 Molded product removal device, molded product removal method, molded product manufacturing method using this molded product removal device, and attached part removal device Active JP7345298B2 (en)

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Citations (9)

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Publication number Priority date Publication date Assignee Title
JPS58194019U (en) * 1982-06-18 1983-12-23 株式会社山城精機製作所 Injection molding machine
JPS60240421A (en) * 1984-05-15 1985-11-29 Matsushita Electric Ind Co Ltd Manufacture of part to be inserted
JPH0737919A (en) * 1993-07-22 1995-02-07 Nec Corp Sealing equipment for semiconductor element with resin
JPH07214607A (en) * 1994-01-29 1995-08-15 Murata Mach Ltd Gate cutter
JP2004001324A (en) * 2002-06-03 2004-01-08 Star Seiki Co Ltd Molding releasing unit
JP2004130730A (en) * 2002-10-11 2004-04-30 Sainekkusu:Kk Apparatus and method for molding semi-cured plate resin
JP2013193453A (en) * 2012-03-23 2013-09-30 Sumitomo Bakelite Co Ltd Method of manufacturing resin molding
WO2016171099A1 (en) * 2015-04-21 2016-10-27 ソマール株式会社 Method for injection-molding thermosetting resin composition
JP2019034444A (en) * 2017-08-10 2019-03-07 Towa株式会社 Conveying mechanism of resin molded product, resin molding apparatus, and manufacturing method of resin molded product

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194019U (en) * 1982-06-18 1983-12-23 株式会社山城精機製作所 Injection molding machine
JPS60240421A (en) * 1984-05-15 1985-11-29 Matsushita Electric Ind Co Ltd Manufacture of part to be inserted
JPH0737919A (en) * 1993-07-22 1995-02-07 Nec Corp Sealing equipment for semiconductor element with resin
JPH07214607A (en) * 1994-01-29 1995-08-15 Murata Mach Ltd Gate cutter
JP2004001324A (en) * 2002-06-03 2004-01-08 Star Seiki Co Ltd Molding releasing unit
JP2004130730A (en) * 2002-10-11 2004-04-30 Sainekkusu:Kk Apparatus and method for molding semi-cured plate resin
JP2013193453A (en) * 2012-03-23 2013-09-30 Sumitomo Bakelite Co Ltd Method of manufacturing resin molding
WO2016171099A1 (en) * 2015-04-21 2016-10-27 ソマール株式会社 Method for injection-molding thermosetting resin composition
JP2019034444A (en) * 2017-08-10 2019-03-07 Towa株式会社 Conveying mechanism of resin molded product, resin molding apparatus, and manufacturing method of resin molded product

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