JP3199835B2 - Mold for manufacturing card base material for IC cards - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to the manufacture die for IC card card substrate used in the manufacture of the IC card card substrate.

[0002]

2. Description of the Related Art A general IC card is manufactured by forming an embedding recess in a card base material and embedding an IC module in the embedding recess. Conventionally, the card base material is formed of a rigid vinyl chloride laminate or the like, and is cut by means such as an end mill to form a recess for embedding in the card base material. In such a conventional molding method, a cutting step is required, and there is a problem that the manufacturing efficiency cannot be made very high. In order to solve this problem, the applicant of the present application has proposed that an IC card base material be manufactured by an injection molding method. In the molding method according to this proposal, FIG.
As shown in FIG. 5, a lower mold 16 for forming the cavity 6 in a clamped state and an upper mold 14 provided with a mold projection 22 for forming the recess 20 for embedding the IC module are used. A resin gate 12 is provided at an end of the cavity 6, and molten resin is injected into the cavity 6 from the gate 12 to perform injection molding. After the molded product has cooled, the mold is opened to take out the molded product having the shape shown in FIG.
The second trace 12a is cut and removed to produce the card base material 18 for an IC card. According to such a method, the IC card base material 18 having the embedded recesses 20 formed therein can be efficiently manufactured.

[0003]

However, in the molding method according to the above-mentioned proposal, the mold is opened and the mold projection 22 is opened.
When the mold is separated from the molded product, the peripheral portion of the embedding recess 20 formed in the molded product is likely to warp with the movement of the upper mold 14, which causes the manufactured IC card base material to Kotogaa deformation occurs Ru. The present invention has been made in view of such circumstances, purpose of that, at the time of molding by injection molding the IC card card substrate burying the recess of the IC module is formed, due to the opening of the mold Ru near providing manufacturing mold for IC card card substrate which can prevent warping of the molded article as much as possible.

[0004]

In order to achieve the above object, a mold for manufacturing a card base material for an IC card according to the present invention comprises:
A first mold, an intermediate mold in which a cavity is formed in combination with the first mold, and the cavity which is movably inserted in a through hole formed in the intermediate mold along an axial direction so as to be movable. The second mold, the tip of which protrudes into the mold, and the mold protrusion for forming the recess for embedding is formed, and the intermediate mold and the second mold are relative to the first mold. Moving means for moving toward and away from each other and the intermediate mold so as to press the intermediate mold in the direction of the first mold at the initial stage of mold opening .
Possess a pressing means provided on second mold, mold opening during odor
Then, the second mold is released from the first mold first,
And the intermediate mold is released from the mold.

[0005]

In the present invention for achieving the pre-Symbol purpose [action], combined first mold and the second mold through the intermediate mold, the split face between the first mold and the intermediate mold, the A cavity for forming a card base is formed, and a second cavity is formed in the cavity.
A mold projection for forming a buried recess formed in the mold is projected through a through hole formed in the intermediate mold. In this state, molten resin is injected and injected into the cavity, and after cooling, the intermediate mold is moved relatively together with the first mold in a direction away from the second mold. Then, in a state where the intermediate mold and the first mold are combined, only the mold projection formed on the second mold is separated from the embedding recess of the molded product in the cavity. At this time, since the intermediate mold and the first mold are combined, the recess for embedding is formed in the card base material as a molded product without warpage or the like. Next, if the first mold is separated from the intermediate mold,
When the mold opening is completed and the molded product is taken out of the mold, an IC card base material with less warpage can be obtained.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 3 are explanatory views including a cross section showing the structure and operation of each step of a first embodiment of a manufacturing die according to the present invention, and FIG. 4 is a molding formed in the first embodiment. FIG. 5 is a plan view showing the structure of a product, FIG. 5 is an explanatory view including a cross section showing the structure and operation of a main part of a second embodiment of a manufacturing die according to the present invention, and FIG. 6 is a second embodiment. FIG. 3 is a plan view showing a configuration of a molded product to be molded. FIG. 1 shows a mold clamping state. In the first embodiment, the molds are a movable mold 31 as a first mold, an intermediate mold 32, and a fixed mold 33 as a second mold. It consists of A mold recess 36 is formed in the movable mold 31, and a cavity 35 is formed in these split surfaces by being combined with the intermediate mold 32. Resin is injected into the cavity 35 from an injection machine 48 through a gate 38 and a spool 37. The spool 37 is a movable mold 3
1, formed through an intermediate mold 32 and a fixed mold 33. A through hole 40 is formed in the intermediate mold 32. A protrusion 41 movably inserted into the through-hole 40 is formed integrally with the fixed mold 33, and the tip of the protrusion 41 projects into the mold recess 36 in a mold-clamped state. A mold projection 42 to be provided is formed. The mold protrusion 42 is a mold for forming an embedding recess for embedding an IC module on the surface of a card base material as a molded product. A recess 43 is provided in the fixed mold 33, and a projection 45 integrally projecting from the intermediate mold 32 is inserted into the recess 43,
The intermediate mold 32 is pressed in the direction of the movable mold 31 by a spring 46 disposed between the projection 45 and the recess 43.

The spool 37 formed on the fixed mold 33
An injection machine 48 is attached to the gate 47. The type of the injection machine 48 is not particularly limited, and examples include an in-line screw type and a plunger type. The illustrated injection machine 48 is a plunger type injection molding machine, and has a supply pipe 50.
, A plunger 52 driven by a hydraulic cylinder 51 is movably inserted therethrough. A heater 53 is mounted on the outer periphery of the supply pipe 50 to keep the temperature of the resin flowing in the supply pipe constant. In the supply pipe 50, for example, a torpedo 54 is disposed.
5, the resin can be supplied. On the other hand, a plunger 57 of a hydraulic cylinder 56 for moving the mold is fixed to the movable mold 31. A guide rod 58 is provided at a fixed portion of the hydraulic cylinder 56, and the movable mold 31 is movably disposed along the guide rod 58. 2 and 3, the injection machine 48, the hydraulic cylinder 56 for moving the mold, and the guide rod 58 are omitted in the drawings.

In order to manufacture an IC card base material using such a die for manufacturing an IC card base material, the mold must be opened from the mold opened state (the state in which there is no molded article 60 in FIG. 3). When the movable hydraulic cylinder 56 is driven to move the movable mold 31 in the direction of the arrow X2, the state shown in FIG. 2 is changed to the state shown in FIG. 1, and the movable mold 31, the intermediate mold 32 and the fixed mold 31 are fixed. A mold clamping state between the molds 33 is obtained. In this state, a resin material composed of, for example, an ABS resin is supplied from the hopper 55 into the supply pipe 50, and the inside of the supply pipe 50 is heated to about 250 ° C. by the heater 53. Activate the plunger 52,
The molten resin is passed through the flow path narrowed by the topeet 54, and injected and injected into the cavity 35 from the gate 47 at high pressure.

When the injected molding material is cooled and solidified, the hydraulic cylinder 56 is driven to move the movable mold 31 as shown in FIGS.
2 moves in the direction of arrow X1. In this state, the spring 4
Since the intermediate mold 32 is pressed against the movable mold 31 by the spring force of No. 6, the intermediate mold 32 moves together with the movable mold 31 and is separated from the fixed mold 33 as shown in FIG. . Therefore, the molded article 60 formed of the molding material
The mold projection 42 formed at the tip of the protruding piece 41 of the fixed mold 33 is separated from the embedding recess 61, and the fixed mold 33 is opened. In this case, since the molded product 60 around the embedding recess 61 is pressed by the intermediate mold 32, the molded product 60 warps around the embedding recess 61 when the fixed mold 33 is opened. Is prevented. Next, the hydraulic cylinder 56 is driven to move the movable mold 31 to the arrow X in FIG.
When the movable mold 31 is further moved in one direction, the spring 46 is extended and the pressing of the intermediate mold 32 against the movable mold 31 is released, and as shown in FIG. 3, the movable mold 31, the intermediate mold 32 and the fixed mold 33 are moved. Are all opened. The molded product 60 taken out from the completely opened mold has the shape shown in FIG. 4 and has a gate corresponding to the position of the mold gate 38 as an unnecessary portion in addition to a portion required as a card base material. Part 3
8a and the spool part 3 located in the mold spool 37.
7a. After the molded product 60 is taken out, if it is cut at the position of the gate portion 38a, the IC card base material as a necessary part is manufactured. Thus, by using the manufacturing die of the first embodiment, it is possible to manufacture a high-quality IC card base material without warping around the embedding recess 61 in which the IC module is embedded. can do.

As shown in FIG. 5, a cutter 65 is incorporated in a movable mold 31 in a second embodiment of the manufacturing mold according to the present invention. When the cutter 65 is driven by a driving device (not shown), the gate portion 38a of the molded product 60 in the mold is cut by the cutter 65. The configuration of the other parts of the second embodiment is not particularly limited, but is substantially the same as, for example, the manufacturing mold of the first embodiment described above. In the second embodiment, injection molding is performed in the same manner as in the first embodiment, and the molded product 60 in the mold is being cooled, immediately before the mold is opened, or interlocked with the movement of the mold opening. Then, the cutter 65 is driven by the driving device. The driving device of the cutter 65 may be configured by a link unit or the like that is linked to the mold opening unit. When the cutter 65 is driven, the molded product 60 is moved into the gate portion 38a in the mold.
Cut at the position. Thereafter, the mold is opened in the same manner as in the first embodiment, and a molded product 60A having a shape as shown in FIG. 6 is taken out from the mold. Since the spool 37a has already been cut and removed from the molded product 60A, even when the molded product 60a is cooled after the mold is opened, kinking of the molded product 60a due to the weight of the spool 37a does not occur. Absent. In addition, since the molded product can be cooled after the mold is opened, the molded product remains in the mold even when a long time is required for cooling, such as when a resin containing PBT mixed with ABS is used. There is no need for cooling, and the molding process can be shortened. Note that the present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention. For example, in the above-described embodiment, the movable mold 31 is
And the fixed mold 33 is moved. However, contrary to the above-described example, the molds 32 and 33 are
It can also be configured to move with respect to. In that case, the spool 37 can be formed on the mold 31.

[0011]

As described above, according to the present invention, when a card substrate having an embedded recess in which an IC module is embedded is molded by injection molding, the card substrate as a molded product is firstly molded. In a state sandwiched between the mold and the intermediate mold, the mold protrusion of the second mold is separated from the embedding recess of the molded product,
Next, since the mold opening is performed so as to separate the first mold and the intermediate mold, when the mold is opened, no warping occurs around the embedded recess, which is a molded product, and high quality without warping is obtained. It is possible to efficiently manufacture the IC card base material. Accordingly, in the subsequent step, printing step easily ing to the surface of the card substrate.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a mold clamping state including a cross section of a first embodiment of a mold for manufacturing a card base material for an IC card according to the present invention.

FIG. 2 is an explanatory view showing a state in which a fixed mold is opened with respect to FIG. 1;

FIG. 3 is an explanatory view showing a mold opening state of a fixed mold and an intermediate mold with respect to FIG.

FIG. 4 is a plan view of a molded product formed in the first embodiment.

FIG. 5 is an explanatory view of a mold for manufacturing a card base material for an IC card according to the present invention in a mold-clamped state including a cross-sectional portion of a second embodiment.

FIG. 6 is a plan view of a molded product formed in a second embodiment.

FIG. 7 is a cross-sectional view illustrating a configuration of a main part of a conventional mold for manufacturing a card base material for an IC card.

FIG. 8 is a plan view of a molded product manufactured by a conventional manufacturing die.

[Explanation of symbols]

31 Movable mold (first mold) 32 Intermediate mold 33 Fixed mold (second mold) 35 Cavity 36 Mold recess 37 Spool 38 Gate 37a Spool section 38a Gate section 40 Through hole 41 Protrusion piece 42 Mold protrusion part 46 I place

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B29C 45/00-45/84 B42D 15/10 G06K 19/077

Claims (1)

(57) [Claims] 1. A manufacturing die for manufacturing an IC card base material having an embedded recess in which an IC module is embedded by an injection molding method, comprising: a first die; and a first die. An intermediate mold in which a cavity is formed by being combined with the intermediate mold; a tip is protruded into the cavity by being movably inserted along a axial direction into a through hole formed in the intermediate mold;
A second mold having a mold projection for forming the embedding recess, and an intermediate mold and a second mold relatively moving toward and away from the first mold. and moving means, the intermediate mold, at the initial time the mold is opened, possess a pressing means provided in the second mold so as to press the first mold direction, at the time of mold opening, the first First mold, second mold
A mold for manufacturing a card base material for an IC card, wherein the mold is released, and then the intermediate mold is released .