JP2021009861A - Light-emitting device - Google Patents

Abstract

To reduce stress applied to a substrate including a resin material when an organic EL element is formed on the substrate.SOLUTION: A substrate 100 includes a resin material. A first laminated film 210 has a structure in which a plurality of layers are laminated, and is formed on a first surface 102 of the substrate 100. A light emitting unit 140 is formed above the first laminated film 210 and includes an organic layer. A second laminated film 220 has a structure in which a plurality of layers are laminated, and covers the light emitting unit 140. A third laminated film 310 has a structure in which a plurality of layers are laminated, and is formed on the second surface 104 of the substrate 100. A fourth laminated film 320 has a structure in which a plurality of layers are laminated, and is formed on the third laminated film 310. The third laminated film 310 is the same laminated film as the first laminated film 210, and the fourth laminated film 320 is the same laminated film as the second laminated film 220.SELECTED DRAWING: Figure 1

Description

The present invention relates to a light emitting device.

In recent years, the development of a light emitting device having an organic EL (Organic Electroluminescence) element in the light emitting unit has been progressing. The organic EL element has a structure in which an organic layer is sandwiched between a first electrode and a second electrode. Since the organic layer is sensitive to moisture and oxygen, the light emitting part needs to be sealed. One of the methods for sealing the light emitting portion is a method using a sealing layer. Examples of the method for forming the sealing layer include a vapor phase deposition method such as an ALD (Atomic Layer Deposition) method, a CVD method, or a sputtering method.

On the other hand, it is being studied to use a resin substrate as a substrate for an organic EL element. By using a resin substrate, the light emitting device can be made flexible. However, the resin material is permeable to moisture. When moisture reaches the organic layer of the organic EL element, the organic layer deteriorates due to this moisture. On the other hand, forming a gas barrier film on a resin substrate has been studied. For example, Patent Document 1 discloses a gas barrier film in which an inorganic film and a stress relaxation film are laminated. The stress relaxation film is formed by the atmospheric pressure plasma method. Further, Patent Document 1 describes that a sealing film for sealing an organic EL element is also formed by the same method as this gas barrier film.

International Publication No. 2006/067952

When the substrate is made of resin, it is necessary to form a gas barrier film as described above. On the other hand, a sealing film for sealing the organic EL element is also formed on the substrate. In this way, a plurality of films are formed on the surface of the substrate on which the organic EL element is formed. In this case, the stress caused by these plurality of films is applied to the substrate, and the substrate may be deformed.

As an example of the problem to be solved by the present invention, when an organic EL element is formed on a substrate containing a resin material, the stress applied to the substrate is reduced.

The invention according to claim 1 includes a substrate containing a resin material and a substrate.
A first laminated film formed on the first surface of the substrate and laminated with a plurality of layers,
A light emitting portion formed on the first laminated film and containing an organic layer,
A second laminated film that covers the light emitting portion and has a plurality of layers laminated,
A third laminated film formed on the second surface of the substrate and laminated with a plurality of layers,
A fourth laminated film formed by being laminated on the third laminated film and having a plurality of layers laminated,
With
The number of layers of the third laminated film is the same as the number of layers of the first laminated film, and when the layers are counted from the substrate side, the plurality of layers constituting the third laminated film Each material is the same as the material of the layer located in the corresponding lamination order in the first laminated film.
The number of layers of the fourth laminated film is the same as the number of layers of the second laminated film, and when the layers are counted from the substrate side, the plurality of layers constituting the fourth laminated film Each material is a light emitting device that is the same as the material of the layer located in the corresponding stacking order of the fourth laminated film.

The above-mentioned objectives and other objectives, features and advantages will be further clarified by the preferred embodiments described below and the accompanying drawings below.

It is sectional drawing which shows the structure of the light emitting device which concerns on embodiment. It is sectional drawing which shows the structure of the 1st laminated film. It is sectional drawing which shows the structure of the 2nd laminated film. It is a figure which shows the 1st modification of the structure of the 1st laminated film. It is a figure which shows the 1st modification of the structure of the 2nd laminated film. It is sectional drawing which shows the 2nd modification of the 1st laminated film. It is sectional drawing which shows the 2nd modification of the 2nd laminated film. It is a top view which shows the structure of the light emitting device which concerns on Example 1. FIG. It is the figure which removed the 2nd electrode and the 2nd laminated film from FIG. It is the figure which removed the organic layer and the insulating layer from FIG. 8 is a cross-sectional view taken along the line AA of FIG. It is a top view of the light emitting device which concerns on Example 2. FIG. FIG. 12 is a diagram in which the partition wall, the second electrode, the organic layer, and the insulating layer are removed from FIG. FIG. 12 is a cross-sectional view taken along the line BB of FIG. 12 is a cross-sectional view taken along the line CC of FIG. FIG. 12 is a sectional view taken along line DD of FIG. It is an equivalent circuit diagram of a light emitting device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by the same reference numerals, and description thereof will be omitted as appropriate.

FIG. 1 is a cross-sectional view showing the configuration of the light emitting device 10 according to the embodiment. The light emitting device 10 according to the embodiment includes a substrate 100, a light emitting unit 140, a first laminated film 210, a second laminated film 220, a third laminated film 310, and a fourth laminated film 320. The substrate 100 contains a resin material. The first laminated film 210 has a structure in which a plurality of layers are laminated, and is formed on the first surface 102 of the substrate 100. The light emitting portion 140 is formed above the first laminated film 210 and includes an organic layer. The second laminated film 220 has a structure in which a plurality of layers are laminated, and covers the light emitting portion 140. The third laminated film 310 has a structure in which a plurality of layers are laminated, and is formed on the second surface 104 of the substrate 100. The fourth laminated film 320 has a structure in which a plurality of layers are laminated, and is formed so as to be superimposed on the third laminated film 310. In other words, the third laminated film 310 and the fourth laminated film 320 are formed on the second surface 104 in this order. The number of layers of the third laminated film 310 is the same as the number of layers of the first laminated film 210, and when the layers are counted from the substrate 100 side, a plurality of layers constituting the third laminated film 310. Each material of the first laminated film 210 is the same as the material of the layer located in the corresponding laminated order. Further, the number of layers of the fourth laminated film 320 is the same as the number of layers of the second laminated film 220, and when the layers are counted from the substrate 100 side, a plurality of layers constituting the fourth laminated film 320. Each material of the second laminated film 220 is the same as the material of the layer located in the corresponding laminated order. The details will be described below.

The substrate 100 contains a resin material and transmits visible light. The substrate 100 is, for example, a resin substrate, and its thickness is, for example, 10 μm or more and 1000 μm or less. The resin used for the substrate 100 is, for example, PEN (polyethylene naphthalate), PES (polyether sulphon), PET (polyethylene terephthalate), or polyimide.

A light emitting portion 140 is formed on the first surface 102 of the substrate 100. The light emitting unit 140 has a configuration in which the first electrode, the organic layer, and the second electrode are laminated in this order.

The first electrode is a transparent electrode having light transmission. The material of the transparent electrode is a material containing a metal, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide) and the like. The thickness of the first electrode is, for example, 10 nm or more and 500 nm or less. The first electrode is formed by using, for example, a sputtering method or a vapor deposition method. The first electrode may be formed by using a conductive organic material such as carbon nanotubes or PEDOT / PSS.

The organic layer has a light emitting layer. The organic layer has, for example, a structure in which a hole injection layer, a light emitting layer, and an electron injection layer are laminated in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. Further, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer may be formed by a vapor deposition method. Further, at least one of the organic layers, for example, a layer in contact with the first electrode may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining organic layer is formed by the vapor deposition method. Further, all the layers of the organic layer may be formed by using a coating method.

The second electrode is, for example, a metal selected from the first group consisting of Al, Au, Ag (which may be Ag ink or Ag nanowire), Pt, Mg, Sn, Zn, and In, or a metal thereof. It contains a metal layer made of an alloy of metals selected from one group. In this case, the second electrode has a light-shielding property. The thickness of the second electrode is, for example, 10 nm or more and 500 nm or less. However, the second electrode may be formed by using the material exemplified as the material of the first electrode. The second electrode is formed using, for example, a sputtering method or a vapor deposition method.

Further, the light emitting portion 140 is sealed by using the second laminated film 220. The second laminated film 220 has a structure in which a plurality of layers are laminated. The layers constituting the second laminated film 220 are all inorganic films, and are formed by using the ALD (Atomic Layer Deposition) method.

A first laminated film 210 is formed on the first surface 102 of the substrate 100, and a third laminated film 310 and a fourth laminated film 320 are formed on the second surface 104 of the substrate 100 in this order. The first laminated film 210, the third laminated film 310, and the fourth laminated film 320 are formed in order to prevent moisture from permeating through the substrate 100, and all have a structure in which a plurality of layers are laminated. ing. Then, each of these layers is formed by using the ALD method. The first laminated film 210, the second laminated film 220, the third laminated film 310, and the fourth laminated film 320 are formed of, for example, an inorganic film.

The third laminated film 310 is formed in the same process as the first laminated film 210. Therefore, the number of layers of the third laminated film 310 is the same as the number of layers of the first laminated film 210, and when counted from the substrate 100 side, each of the plurality of layers constituting the third laminated film 310 The material is the same as the material of the layers of the first laminated film 210 located in the corresponding laminated order. Further, depending on the manufacturing conditions, the third laminated film 310 may have the same structure as the first laminated film 210, including the thickness of each layer.

Further, the fourth laminated film 320 is formed in the same process as the second laminated film 220. Therefore, the number of layers of the fourth laminated film 320 is the same as the number of layers of the second laminated film 220, and when counted from the substrate 100 side, each of the plurality of layers constituting the fourth laminated film 320. The material is the same as the material of the layer of the second laminated film 220 located in the corresponding laminated order. Further, depending on the manufacturing conditions, the fourth laminated film 320 may have the same structure as the second laminated film 220 including the thickness of each layer.

A flattening layer (for example, an organic layer) may be provided between the first surface 102 of the substrate 100 and the first laminated film 210. Further, a flattening layer may be formed between the second surface 104 of the substrate 100 and the third laminated film 310.

FIG. 2 is a cross-sectional view showing the structure of the first laminated film 210. The first laminated film 210 has a first layer 212 and a second layer 214. The first layer 212 and the second layer 214 are, for example, metal oxide films. Specifically, the first layer 212 is formed by using aluminum oxide (Al ₂ O ₃ ), and the second layer 214 is formed by using titanium oxide (TIO ₂ ). The thickness of the first layer 212 and the second layer 214 are both 3 nm or more and 10 nm or less. However, the thickness of each of these layers is not limited to this range. Further, the first laminated film 210 may have a structure in which the first layer 212 and the second layer 214 are repeatedly laminated in this order. Further, the first laminated film 210 may be a laminated film in which three layers having different materials are laminated once or a plurality of times.

As described above, the third laminated film 310 also has the configuration shown in this figure.

FIG. 3 is a cross-sectional view showing the structure of the second laminated film 220. The second laminated film 220 has a structure in which the first layer 222 and the second layer 224 are repeatedly laminated a plurality of times. Therefore, the second laminated film 220 is thicker than the first laminated film 210. By making the second laminated film 220 thicker than the first laminated film 210, the sealing ability of the second laminated film 220 is improved. The first layer 222 is formed by using aluminum oxide (Al ₂ O ₃ ), and the second layer 224 is formed by using titanium oxide (TIO ₂ ). Titanium oxide has insulating properties at room temperature, but when made into a thin film, for example, it has conductivity. The thickness of the first layer 222 and the second layer 224 are both 3 nm or more and 10 nm or less. However, the thickness of each of these layers is not limited to this range.

As described above, the fourth laminated film 320 also has the configuration shown in this figure.

FIG. 4 is a diagram showing a first modification of the configuration of the first laminated film 210. In the example shown in this figure, the first laminated film 210 has a structure in which the first layer 212 and the second layer 214 are repeatedly laminated in this order. Then, any layer of the first laminated film 210 is thicker than the other layers constituting the first laminated film 210. In the example shown in this figure, the uppermost layer of the first laminated film 210 (that is, the layer facing the light emitting portion 140) is thicker than the other layers constituting the first laminated film 210. For example, the thickness of the top first layer 212 is four times or more the thickness of the thickest layer among the other layers. The thickness of the first layer 212 is, for example, 20% or more and 80% or less of the thickness of the first laminated film 210.

When the first laminated film 210 has the structure shown in FIG. 4, the third laminated film 310 also has the structure shown in FIG. In this case, the layer of the third laminated film 310 farthest from the second surface 104 of the substrate 100 is thicker than the other layers of the third laminated film 310.

FIG. 5 is a diagram showing a first modification of the configuration of the second laminated film 220. In the example shown in this figure, the second laminated film 220 has a structure in which the first layer 222 and the second layer 224 are repeatedly laminated in this order. However, since the number of layers of the second laminated film 220 is larger than the number of layers of the first laminated film 210, the second laminated film 220 is thicker than the first laminated film 210. Then, any layer of the second laminated film 220 is thicker than the other layers constituting the second laminated film 220. In the example shown in this figure, the lowermost first layer 222 (that is, the layer facing the light emitting portion 140) is thicker than the other layers constituting the second laminated film 220. For example, the thickness of the first layer 222 at the bottom is four times or more the thickness of the thickest layer among the other layers. The thickness of the first layer 222 is, for example, 20% or more and 80% or less of the thickness of the second laminated film 220.

When the second laminated film 220 has the structure shown in FIG. 5, the fourth laminated film 320 also has the structure shown in FIG. In this case, the layer of the fourth laminated film 320 closest to the substrate 100 is thicker than the other layers of the fourth laminated film 320.

FIG. 6 is a cross-sectional view showing a second modification of the first laminated film 210. The first laminated film 210 according to this modification is thicker than the other layers of the first laminated film 210, except that the second and higher layers counted from the light emitting portion 140 side are thicker. , The same configuration as the first laminated film 210 shown in FIG. When the first laminated film 210 has the structure shown in FIG. 6, the third laminated film 310 also has the structure shown in FIG.

FIG. 7 is a cross-sectional view showing a second modification of the second laminated film 220. The second laminated film 220 according to this modification is thicker than the other layers of the second laminated film 220, except that the layer located at the second or higher layer counting from the substrate 100 side is thicker. It has the same configuration as the second laminated film 220 shown in FIG. When the second laminated film 220 has the structure shown in FIG. 7, the fourth laminated film 320 also has the structure shown in FIG. 7.

The first laminated film 210 shown in FIG. 2 is any of the second laminated film 220 shown in FIG. 3, the second laminated film 220 shown in FIG. 5, and the second laminated film 220 shown in FIG. 7. It may be used in combination. Further, the first laminated film 210 shown in FIG. 4 is any of the second laminated film 220 shown in FIG. 3, the second laminated film 220 shown in FIG. 5, and the second laminated film 220 shown in FIG. It may be used in combination. Further, the first laminated film 210 shown in FIG. 6 is any of the second laminated film 220 shown in FIG. 3, the second laminated film 220 shown in FIG. 5, and the second laminated film 220 shown in FIG. It may be used in combination.

FIG. 17 is an equivalent circuit diagram of the light emitting device 10. In the example shown in this figure, the light emitting device 10 has a first terminal 112 and a second terminal 132. The first terminal 112 is connected to the first electrode of the light emitting unit 140 via the lead wire 114, and the second terminal 132 is connected to the second electrode of the light emitting unit 140 via the lead wire 134.

When the light emitting unit 140 of the light emitting device 10 emits light, a voltage is applied between the first lead-out wiring 114 and the second lead-out wiring 134. Further, the first laminated film 210 is in contact with the first lead-out wiring 114 and the second lead-out wiring 134. Further, the first laminated film 210 has a structure in which a plurality of layers are laminated. Therefore, when viewed in an equivalent circuit, the first laminated film 210 has a configuration in which a capacitance and a resistor are connected in series between the first lead-out wiring 114 and the second lead-out wiring 134. Therefore, a certain amount of current flows through the first laminated film 210, and as a result, electric charges are accumulated in the first laminated film 210 when the light emitting unit 140 emits light. This charge flows to the light emitting unit 140 when no voltage is applied between the first lead-out wiring 114 and the second lead-out wiring 134. As a result, the response speed when the light emitting unit 140 is turned off is reduced. Further, when the light emitting unit 140 is turned on, a part of the current flows through the first laminated film 210. Therefore, the response speed when the light emitting unit 140 is turned on is also reduced.

On the other hand, according to the present embodiment, at least a part of the layers of the first laminated film 210 is thicker than the other layers between the first lead-out wiring 114 and the second lead-out wiring 134. Therefore, the magnitude of the resistance in the equivalent circuit diagram of FIG. 17 becomes large. Therefore, it becomes difficult for the current to flow through the first laminated film 210, and as a result, the response speed of the light emitting unit 140 becomes difficult to decrease. If the layer of the first laminated film 210 closest to the light emitting portion 140 is thicker than the other layers, it becomes difficult for current to flow through the first laminated film 210 in particular.

The same applies to the second laminated film 220.

Next, a method of manufacturing the light emitting device 10 will be described. First, the substrate 100 is prepared. Then, for example, using the ALD method, a plurality of inorganic layers are formed on the first surface 102 of the substrate 100. As a result, the first laminated film 210 is formed on the first surface 102. In the ALD method, the atoms or molecules that form the film also reach the second surface 104 of the substrate 100. In other words, the ALD method has high coverage. Therefore, when the first laminated film 210 is formed by using the ALD method, the third laminated film 310 is formed on the second surface 104 of the substrate 100.

Next, the first electrode, the organic layer, and the second electrode of the light emitting unit 140 are formed on the first laminated film 210 of the substrate 100 in this order. As a result, the light emitting unit 140 is formed. In this step, the terminals of the light emitting unit 140 are also formed.

Then, for example, using the ALD method, a plurality of inorganic layers are formed on the first laminated film 210 of the substrate 100 and on the light emitting portion 140. As a result, a second laminated film 220, which is a sealing film, is formed on the first surface 102 and the light emitting portion 140. Further, as described above, the ALD method has high coverage. Therefore, when the second laminated film 220 is formed by using the ALD method, the fourth laminated film 320 is formed on the second surface 104 of the substrate 100.

As described above, according to the present embodiment, the first laminated film 210 and the second laminated film 220 are formed on the first surface 102 side of the substrate 100, and the third laminated film 210 is formed on the second surface 104 side of the substrate 100. 310 and a fourth laminated film 320 are formed. The number of layers of the first laminated film 210 is the same as the number of layers of the third laminated film 310, and when the layers are counted from the substrate 100 side, each material of the plurality of layers constituting the third laminated film 310 Is the same as the material of the layer of the first laminated film 210 located in the corresponding laminated order. Further, the number of layers of the fourth laminated film 320 is the same as the number of layers of the second laminated film 220, and when the layers are counted from the substrate 100 side, a plurality of layers constituting the fourth laminated film 320. Each material of the second laminated film 220 is the same as the material of the layer located in the corresponding laminated order. Therefore, the stress applied to the substrate 100 due to the first laminated film 210 is canceled by the stress applied to the substrate 100 due to the third laminated film 310. Further, the stress applied to the substrate 100 due to the second laminated film 220 is canceled by the stress applied to the substrate 100 due to the fourth laminated film 320. Therefore, the stress applied to the substrate 100 becomes small.

In particular, in the present embodiment, since the first laminated film 210 and the third laminated film 310 are simultaneously formed by using the ALD method, they have the same structure. Further, since the second laminated film 220 and the fourth laminated film 320 are simultaneously formed by using the ALD method, they have the same structure as each other. Therefore, the stress applied to the substrate 100 is particularly small.

Further, since the fourth laminated film 320 functions as a barrier film of the substrate 100, the possibility that moisture permeates the substrate 100 is further reduced.

(Example 1)
FIG. 8 is a plan view showing the configuration of the light emitting device 10 according to the first embodiment. For illustration purposes, the second laminated film 220 is shown by the dotted line in FIG. FIG. 9 is a diagram in which the second electrode 130 and the second laminated film 220 are removed from FIG. FIG. 10 is a diagram in which the organic layer 120 and the insulating layer 150 are removed from FIG. 11 is a cross-sectional view taken along the line AA of FIG.

In this embodiment, the light emitting device 10 is a lighting device, and includes a substrate 100 and a light emitting unit 140. The light emitting unit 140 has a first electrode 110, an organic layer 120, and a second electrode 130. The configurations of the first electrode 110, the organic layer 120, and the second electrode 130 are as in the embodiment.

The edge of the first electrode 110 is covered with an insulating layer 150. The insulating layer 150 is formed of a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes a light emitting region of the light emitting portion 140. By providing the insulating layer 150, it is possible to prevent the first electrode 110 and the second electrode 130 from being short-circuited at the edge of the first electrode 110. The insulating layer 150 is formed, for example, by applying a resin material to be the insulating layer 150 and then exposing and developing the resin material.

Further, the light emitting device 10 has a first terminal 112 and a second terminal 132. The first terminal 112 is connected to the first electrode 110, and the second terminal 132 is connected to the second electrode 130. The first terminal 112 and the second terminal 132 have, for example, a layer made of the same material as the first electrode 110. An extraction wiring may be provided between the first terminal 112 and the first electrode 110. Further, an extraction wiring may be provided between the second terminal 132 and the second electrode 130.

Further, the light emitting device 10 has a first laminated film 210, a second laminated film 220, a third laminated film 310, and a fourth laminated film 320. The configuration of these laminated films and the configuration of the substrate 100 are as in the embodiment.

Next, a method of manufacturing the light emitting device 10 will be described. First, the first laminated film 210 and the third laminated film 310 are formed on the substrate 100. Next, the first electrode 110 is formed on the first laminated film 210. In this step, the first terminal 112 and the second terminal 132 are also formed. Next, the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order. Next, the second laminated film 220 and the fourth laminated film 320 are formed.

According to this embodiment, the stress applied to the substrate 100 can be reduced in the lighting device using the light emitting unit 140 as in the embodiment.

(Example 2)
FIG. 12 is a plan view of the light emitting device 10 according to the second embodiment. For illustration purposes, the second laminated film 220 is shown by the dotted line in FIG. FIG. 13 is a diagram in which the partition wall 170, the second electrode 130, the organic layer 120, and the insulating layer 150 are removed from FIG. 14 is a sectional view taken along the line BB of FIG. 12, FIG. 15 is a sectional view taken along the line CC of FIG. 12, and FIG. 16 is a sectional view taken along the line DD of FIG.

The light emitting device 10 according to this embodiment is a display, and is a substrate 100, a first electrode 110, a light emitting unit 140, an insulating layer 150, a plurality of openings 152, a plurality of openings 154, a plurality of lead wiring 114, an organic layer 120, and a first. It has two electrodes 130, a plurality of drawer wires 134, and a plurality of partition walls 170.

The first electrode 110 extends in a line in the first direction (Y direction in FIG. 12). The end of the first electrode 110 is connected to the lead wire 114.

The lead-out wiring 114 is a wiring that connects the first electrode 110 to the first terminal 112. In the example shown in this figure, one end side of the lead wire 114 is connected to the first electrode 110, and the other end side of the lead wire 114 is the first terminal 112. In the example shown in this figure, the first electrode 110 and the lead-out wiring 114 are integrated. A conductor layer 160 is formed on the leader wiring 114. The conductor layer 160 is formed by using a material having a resistance lower than that of the first electrode 110, for example, Al. The conductor layer 160 may have a multi-layer structure. A part of the lead wiring 114 is covered with the insulating layer 150.

As shown in FIGS. 12 and 14 to 16, the insulating layer 150 is formed on the plurality of first electrodes 110 and in a region between them. A plurality of openings 152 and a plurality of openings 154 are formed in the insulating layer 150. The plurality of second electrodes 130 extend parallel to each other in a direction intersecting with the first electrode 110 (for example, an orthogonal direction: the X direction in FIG. 12). A partition wall 170, which will be described in detail later, extends between the plurality of second electrodes 130. The opening 152 is located at the intersection of the first electrode 110 and the second electrode 130 in a plan view. Specifically, the plurality of openings 152 are arranged in the direction in which the first electrode 110 extends (Y direction in FIG. 12). Further, the plurality of openings 152 are also arranged in the extending direction (X direction in FIG. 12) of the second electrode 130. Therefore, the plurality of openings 152 are arranged so as to form a matrix.

The opening 154 is located in a region that overlaps one end side of each of the plurality of second electrodes 130 in a plan view. Further, the openings 154 are arranged along one side of the matrix formed by the openings 152. When viewed in a direction along this one side (for example, the Y direction in FIG. 12, that is, the direction along the first electrode 110), the openings 154 are arranged at predetermined intervals. A part of the lead wiring 134 is exposed from the opening 154. The lead-out wiring 134 is connected to the second electrode 130 via the opening 154.

The lead-out wiring 134 is a wiring that connects the second electrode 130 to the second terminal 132, and has a layer made of the same material as the first electrode 110. One end side of the lead wiring 134 is located below the opening 154, and the other end side of the lead wiring 134 is led out to the outside of the insulating layer 150. In the example shown in this figure, the other end side of the lead-out wiring 134 is the second terminal 132. A conductor layer 160 is formed on the leader wiring 134. A part of the lead wiring 134 is covered with the insulating layer 150.

An organic layer 120 is formed in a region overlapping the opening 152. The hole injection layer of the organic layer 120 is in contact with the first electrode 110, and the electron injection layer of the organic layer 120 is in contact with the second electrode 130. Therefore, the light emitting unit 140 is located in each region overlapping the opening 152.

In the examples shown in FIGS. 14 and 15, each layer constituting the organic layer 120 shows a case where each layer protrudes to the outside of the opening 152. Then, as shown in FIG. 12, the organic layer 120 may or may not be continuously formed between the adjacent openings 152 in the direction in which the partition wall 170 extends. Good. However, as shown in FIG. 16, the organic layer 120 is not formed in the opening 154.

As shown in FIGS. 12 and 14 to 16, the second electrode 130 extends in the second direction (X direction in FIG. 12) intersecting the first direction. A partition wall 170 is formed between the adjacent second electrodes 130. The partition wall 170 extends parallel to the second electrode 130, that is, in the second direction. The base of the partition wall 170 is, for example, an insulating layer 150. The partition wall 170 is a photosensitive resin such as a polyimide resin, and is formed into a desired pattern by exposure and development. The partition wall 170 may be made of a resin other than the polyimide resin, for example, an inorganic material such as an epoxy resin, an acrylic resin, or silicon dioxide.

The partition wall 170 has a trapezoidal cross section upside down (inverted trapezoidal shape). That is, the width of the upper surface of the partition wall 170 is larger than the width of the lower surface of the partition wall 170. Therefore, if the partition wall 170 is formed before the second electrode 130, the second electrode 130 is formed on one surface side of the substrate 100 by using a vapor deposition method or a sputtering method, so that the plurality of second electrodes 130 Can be formed collectively. The partition wall 170 also has a function of dividing the organic layer 120.

Further, also in this embodiment, the first laminated film 210 and the second laminated film 220 are formed on the first surface 102 of the substrate 100, and the third laminated film 310 and the fourth laminated film 310 and the fourth laminated film 310 are formed on the second surface 104 of the substrate 100. The laminated film 320 is formed. The second laminated film 220 seals the light emitting portion 140. In this embodiment, the first terminal 112 and the second terminal 132 are arranged along the same side of the substrate 100. Therefore, the opening for exposing the first terminal 112 and the opening for exposing the second terminal 132 of the second laminated film 220 are connected to each other.

Next, a method of manufacturing the light emitting device 10 in this embodiment will be described. First, the first laminated film 210 and the third laminated film 310 are formed on the substrate 100. These forming methods are as shown in the embodiment.

Next, the first electrode 110 and the lead wiring 114 and 134 are formed on the first surface 102 of the substrate 100. Next, the conductor layer 160 is formed on the leader wiring 114 and the drawer wiring 134. Next, the insulating layer 150 is formed, and the partition wall 170 is further formed. Next, the organic layer 120 and the second electrode 130 are formed. These forming methods are the same as in Example 1.

Next, the second laminated film 220 and the fourth laminated film 320 are formed on the substrate 100. These forming methods are as shown in the embodiment.

According to this embodiment, the stress applied to the substrate 100 can be reduced in the display using the light emitting unit 140 as in the embodiment.

Although the embodiments and examples have been described above with reference to the drawings, these are examples of the present invention, and various configurations other than the above can be adopted.

Claims (1)

A substrate containing a resin material and
A first laminated film formed on the first surface of the substrate and laminated with a plurality of layers,
A light emitting portion formed on the first laminated film and containing an organic layer,
A second laminated film that covers the light emitting portion and has a plurality of layers laminated,
A third laminated film formed on the second surface of the substrate and laminated with a plurality of layers,
A fourth laminated film formed by being laminated on the third laminated film and having a plurality of layers laminated,
With
The number of layers of the third laminated film is the same as the number of layers of the first laminated film, and when the layers are counted from the substrate side, the plurality of layers constituting the third laminated film Each material is the same as the material of the layer located in the corresponding lamination order in the first laminated film.
The number of layers of the fourth laminated film is the same as the number of layers of the second laminated film, and when the layers are counted from the substrate side, the plurality of layers constituting the fourth laminated film A light emitting device in which each material is the same as the material of the layer located in the corresponding stacking order of the fourth laminated film.

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