JP2019195001A - Light emission device - Google Patents

Abstract

To provide a light emission device that makes it difficult for a laminate film to function as a capacitance element having resistivity when at least one of a gas barrier film and a sealing film is formed as the laminate film.SOLUTION: A substrate 100 contains resin material. A first lamination film 210 is formed on a first surface 102 of the substrate 100, and has a lamination structure of plural layers. A light emission part 140 is formed on the first lamination film 210, and contains an organic layer. A second lamination film 220 is formed on the first lamination film 210 and the light emission part 140, and has a lamination structure of plural layers. Any layer of the first lamination film 210 is thicker than the other layers of the first lamination film 210.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device.

  In recent years, a light emitting device having an organic EL (Organic Electroluminescence) element in a light emitting portion has been developed. The organic EL element has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. Since the organic layer is vulnerable to moisture and oxygen, the light emitting portion needs to be sealed. One method for sealing the light emitting part is to use a sealing layer. As a method for forming the sealing layer, there is a vapor deposition method such as an ALD (Atomic Layer Deposition) method, a CVD method, or a sputtering method.

  On the other hand, use of a resin substrate as a substrate for an organic EL element has been studied. When a resin substrate is used, the light emitting device can be flexible. However, the resin material transmits moisture. When moisture reaches the organic layer of the organic EL element, the organic layer is deteriorated due to the moisture. On the other hand, forming a gas barrier film on a resin substrate has been studied. For example, Patent Document 1 discloses a gas barrier film in which an inorganic film and a stress relaxation film are stacked. The stress relaxation film is formed by the atmospheric pressure plasma method. Furthermore, Patent Document 1 describes that a sealing film for sealing an organic EL element is also formed by the same method as this gas barrier film.

International Publication No. 2006/067952

  When the substrate is formed of a resin, it is necessary to form a gas barrier film as described above. As a result of investigations by the present inventors, it was found that when at least one of the gas barrier film and the sealing film is a laminated film in which a plurality of thin layers are laminated, the laminated film functions as a capacitive element having resistance. If such a capacitive element exists, the light emission quality of the light emitting device and the inspection of the light emitting device are affected. For example, when a voltage is applied between the first electrode and the second electrode in order to operate the organic EL element, the timing at which the organic EL element emits light is delayed due to accumulation of charges in the stacked film. When no voltage is applied between the first electrode and the second electrode in order to stop the organic EL element, the charge accumulated in the laminated film flows toward the organic EL element, and light emission of the organic EL element stops. Timing is delayed.

  An example of a problem to be solved by the present invention is that when at least one of a gas barrier film and a sealing film is a laminated film, the laminated film is less likely to function as a resistive capacitive element. .

A first invention includes a substrate containing a resin material;
A first laminated film formed on the first surface of the substrate and laminated with a plurality of layers;
A light emitting part formed on the first laminated film and including an organic layer;
A second laminated film formed on the first laminated film and the light emitting part and laminated with a plurality of layers;
With
One of the layers of the first stacked film is a light emitting device that is thicker than the other layers of the first stacked film.

A second invention includes a substrate containing a resin material;
A first laminated film formed on the first surface of the substrate and laminated with a plurality of layers;
A light emitting part formed on the first laminated film and including an organic layer;
A second laminated film formed on the first laminated film and the light emitting part and laminated with a plurality of layers;
With
One of the layers of the second stacked film is a light emitting device that is thicker than the other layers of the second stacked film.

It is sectional drawing which shows the structure of the light-emitting device which concerns on embodiment. It is sectional drawing which shows the structure of a 1st laminated film. It is sectional drawing which shows the structure of a 2nd laminated film. It is a figure which shows the 1st modification of a structure of a 1st laminated film. It is a figure which shows the 1st modification of a structure of a 2nd laminated film. It is sectional drawing which shows the 2nd modification of a 1st laminated film. It is sectional drawing which shows the 2nd modification of a 2nd laminated film. 1 is a plan view illustrating a configuration of a light emitting device according to Example 1. FIG. It is the figure which removed the 2nd electrode and the 2nd laminated film from FIG. It is the figure which removed the organic layer and the insulating layer from FIG. It is AA sectional drawing of FIG. 6 is a plan view of a light emitting device according to Example 2. FIG. It is the figure which removed the partition, the 2nd electrode, the organic layer, and the insulating layer from FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is an equivalent circuit diagram of a light-emitting device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a cross-sectional view illustrating a configuration of a light emitting device 10 according to the embodiment. The light emitting device 10 according to the embodiment includes a substrate 100, a light emitting unit 140, a first stacked film 210, a second stacked film 220, a third stacked film 310, and a fourth stacked film 320. The substrate 100 includes a resin material. The first laminated film 210 has a structure in which a plurality of layers are laminated, and is formed on the first surface 102 of the substrate 100. The light emitting unit 140 is formed above the first laminated film 210 and includes an organic layer. The second stacked film 220 has a structure in which a plurality of layers are stacked, and covers the light emitting unit 140. The third laminated film 310 has a structure in which a plurality of layers are laminated, and is formed on the second surface 104 of the substrate 100. The fourth laminated film 320 has a structure in which a plurality of layers are laminated, and is formed so as to overlap the third laminated film 310. In other words, the third laminated film 310 and the fourth laminated film 320 are formed in this order on the second surface 104. The number of layers of the third laminated film 310 is the same as the number of layers of the first laminated film 210, and when the layers are counted from the substrate 100 side, a plurality of layers constituting the third laminated film 310 are included. These materials are the same as the materials of the layers positioned in the corresponding stacking order in the first stacked film 210. Further, the number of layers of the fourth stacked film 320 is the same as the number of layers of the second stacked film 220, and when the layers are counted from the substrate 100 side, a plurality of layers constituting the fourth stacked film 320 are included. These materials are the same as the materials of the layers positioned in the corresponding stacking order in the second stacked film 220. Details will be described below.

  The substrate 100 includes a resin material and transmits visible light. The substrate 100 is, for example, a resin substrate, and the thickness thereof is, for example, 10 μm or more and 1000 μm or less. The resin used for the substrate 100 is, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide.

  A light emitting unit 140 is formed on the first surface 102 of the substrate 100. The light emitting unit 140 has a configuration in which a first electrode, an organic layer, and a second electrode are stacked in this order.

  The first electrode is a transparent electrode having optical transparency. The material of the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode is, for example, not less than 10 nm and not more than 500 nm. The first electrode is formed using, for example, a sputtering method or a vapor deposition method. The first electrode may be formed using a conductive organic material such as a carbon nanotube or PEDOT / PSS.

  The organic layer has a light emitting layer. The organic layer has, for example, a configuration in which a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer may be formed by a vapor deposition method. In addition, at least one of the organic layers, for example, a layer in contact with the first electrode may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer are formed by vapor deposition. Further, all layers of the organic layer may be formed using a coating method.

  The second electrode is, for example, a metal selected from the first group consisting of Al, Au, Ag (which may be Ag ink or Ag nanowire), Pt, Mg, Sn, Zn, and In, or the first electrode. It includes a metal layer made of a metal alloy selected from a group. In this case, the second electrode has a light shielding property. The thickness of the second electrode is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode may be formed using the material exemplified as the material of the first electrode. The second electrode is formed using, for example, a sputtering method or a vapor deposition method.

  In addition, the light emitting unit 140 is sealed using the second stacked film 220. The second stacked film 220 has a configuration in which a plurality of layers are stacked. The layers constituting the second laminated film 220 are all inorganic films and are formed using an ALD (Atomic Layer Deposition) method.

  Further, a first stacked film 210 is formed on the first surface 102 of the substrate 100, and a third stacked film 310 and a fourth stacked film 320 are formed on the second surface 104 of the substrate 100 in this order. The first laminated film 210, the third laminated film 310, and the fourth laminated film 320 are formed in order to suppress moisture from passing through the substrate 100, and each has a configuration in which a plurality of layers are laminated. ing. And all these layers are formed using the ALD method. The first laminated film 210, the second laminated film 220, the third laminated film 310, and the fourth laminated film 320 are made of, for example, an inorganic film.

  The third laminated film 310 is formed in the same process as the first laminated film 210. For this reason, the number of layers of the third stacked film 310 is the same as the number of layers of the first stacked film 210, and each of the plurality of layers constituting the third stacked film 310 is counted when counted from the substrate 100 side. The material is the same as the material of the layer located in the corresponding lamination order in the first laminated film 210. Furthermore, depending on manufacturing conditions, the third laminated film 310 may have the same structure as the first laminated film 210 including the thickness of each layer.

  The fourth laminated film 320 is formed in the same process as the second laminated film 220. For this reason, the number of layers of the fourth stacked film 320 is the same as the number of layers of the second stacked film 220, and each of the plurality of layers constituting the fourth stacked film 320 is counted when counted from the substrate 100 side. The material is the same as the material of the layer positioned in the corresponding stacking order in the second stacked film 220. Furthermore, depending on the manufacturing conditions, the fourth laminated film 320 may have the same structure as the second laminated film 220 including the thickness of each layer.

  Note that a planarization layer (for example, an organic layer) may be provided between the first surface 102 of the substrate 100 and the first stacked film 210. In addition, a planarization layer may be formed between the second surface 104 of the substrate 100 and the third stacked film 310.

FIG. 2 is a cross-sectional view showing the configuration of the first laminated film 210. The first stacked film 210 has a first layer 212 and a second layer 214. The first layer 212 and the second layer 214 are, for example, metal oxide films. Specifically, the first layer 212 is formed using aluminum oxide (Al ₂ O ₃ ), and the second layer 214 is formed using titanium oxide (TiO ₂ ). The thicknesses of the first layer 212 and the second layer 214 are both 3 nm or more and 10 nm or less. However, the thickness of each of these layers is not limited to this range. In addition, the first laminated film 210 may have a configuration in which the first layer 212 and the second layer 214 are repeatedly laminated in this order. The first laminated film 210 may be a laminated film in which three layers having different materials are laminated once or a plurality of times.

  As described above, the third laminated film 310 also has the configuration shown in this figure.

FIG. 3 is a cross-sectional view showing the configuration of the second stacked film 220. The second stacked film 220 has a configuration in which the first layer 222 and the second layer 224 are repeatedly stacked a plurality of times. For this reason, the second stacked film 220 is thicker than the first stacked film 210. By making the second laminated film 220 thicker than the first laminated film 210, the sealing ability of the second laminated film 220 is improved. Note that the first layer 222 is formed using aluminum oxide (Al ₂ O ₃ ), and the second layer 224 is formed using titanium oxide (TiO ₂ ). Titanium oxide has insulating properties at room temperature, but has conductivity when formed into a thin film, for example. The thicknesses of the first layer 222 and the second layer 224 are both 3 nm or more and 10 nm or less. However, the thickness of each of these layers is not limited to this range.

  As described above, the fourth laminated film 320 also has the configuration shown in this figure.

  FIG. 4 is a diagram illustrating a first modification of the configuration of the first stacked film 210. In the example shown in this figure, the first laminated film 210 has a configuration in which a first layer 212 and a second layer 214 are repeatedly laminated in this order. One of the layers of the first laminated film 210 is thicker than the other layers constituting the first laminated film 210. In the example shown in the drawing, the uppermost layer (that is, the layer facing the light emitting unit 140) of the first stacked film 210 is thicker than the other layers constituting the first stacked film 210. For example, the thickness of the uppermost first layer 212 is four times or more the thickness of the thickest layer among the other layers. Further, the thickness of the first layer 212 is, for example, not less than 20% and not more than 80% of the thickness of the first laminated film 210.

  In addition, when the 1st laminated film 210 has the structure shown in FIG. 4, the 3rd laminated film 310 also has the structure shown in FIG. In this case, the layer farthest from the second surface 104 of the substrate 100 in the third stacked film 310 is thicker than the other layers of the third stacked film 310.

  FIG. 5 is a diagram illustrating a first modification of the configuration of the second stacked film 220. In the example shown in this drawing, the second laminated film 220 has a configuration in which a first layer 222 and a second layer 224 are repeatedly laminated in this order. However, since the number of layers included in the second stacked film 220 is greater than the number of layers included in the first stacked film 210, the second stacked film 220 is thicker than the first stacked film 210. One of the layers of the second stacked film 220 is thicker than the other layers constituting the second stacked film 220. In the example shown in this drawing, the lowermost first layer 222 (that is, the layer facing the light emitting unit 140) is thicker than the other layers constituting the second stacked film 220. For example, the thickness of the lowest first layer 222 is four times or more the thickness of the thickest layer among the other layers. Further, the thickness of the first layer 222 is, for example, 20% or more and 80% or less of the thickness of the second stacked film 220.

  In addition, when the 2nd laminated film 220 has the structure shown in FIG. 5, the 4th laminated film 320 also has the structure shown in FIG. In this case, the layer closest to the substrate 100 in the fourth stacked film 320 is thicker than the other layers of the fourth stacked film 320.

  FIG. 6 is a cross-sectional view showing a second modification of the first laminated film 210. The first laminated film 210 according to the present modified example is different from the first laminated film 210 except that the second and higher layers counted from the light emitting unit 140 side are thicker than the other layers of the first laminated film 210. The configuration is the same as that of the first laminated film 210 shown in FIG. In addition, when the 1st laminated film 210 has the structure shown in FIG. 6, the 3rd laminated film 310 also has the structure shown in FIG.

  FIG. 7 is a cross-sectional view illustrating a second modification of the second stacked film 220. The second laminated film 220 according to this modified example has a layer that is located in the second layer or more counted from the substrate 100 side, except that the second laminated film 220 is thicker than the other layers of the second laminated film 220. The configuration is the same as that of the second laminated film 220 shown in FIG. In addition, when the 2nd laminated film 220 has the structure shown in FIG. 7, the 4th laminated film 320 also has the structure shown in FIG.

  Note that the first stacked film 210 illustrated in FIG. 2 includes any of the second stacked film 220 illustrated in FIG. 3, the second stacked film 220 illustrated in FIG. 5, and the second stacked film 220 illustrated in FIG. 7. They may be used in combination. Further, the first laminated film 210 shown in FIG. 4 includes any of the second laminated film 220 shown in FIG. 3, the second laminated film 220 shown in FIG. 5, and the second laminated film 220 shown in FIG. They may be used in combination. Further, the first laminated film 210 shown in FIG. 6 includes any of the second laminated film 220 shown in FIG. 3, the second laminated film 220 shown in FIG. 5, and the second laminated film 220 shown in FIG. They may be used in combination.

  FIG. 17 is an equivalent circuit diagram of the light emitting device 10. In the example shown in this drawing, the light emitting device 10 has a first terminal 112 and a second terminal 132. The first terminal 112 is connected to the first electrode of the light emitting unit 140 via the lead wire 114, and the second terminal 132 is connected to the second electrode of the light emitting unit 140 via the lead wire 134.

  When the light emitting unit 140 of the light emitting device 10 is caused to emit light, a voltage is applied between the first lead wire 114 and the second lead wire 134. The first laminated film 210 is in contact with the first lead wiring 114 and the second lead wiring 134. The first laminated film 210 has a configuration in which a plurality of layers are laminated. Therefore, when viewed in an equivalent circuit, the first laminated film 210 has a configuration in which a capacitor and a resistor are connected in series between the first lead-out wiring 114 and the second lead-out wiring 134. For this reason, a certain amount of current flows through the first laminated film 210, and as a result, charges are accumulated in the first laminated film 210 when the light emitting unit 140 emits light. This electric charge flows into the light emitting unit 140 when a voltage is no longer applied between the first extraction wiring 114 and the second extraction wiring 134. As a result, the response speed when turning off the light emitting unit 140 decreases. Further, when the light emitting unit 140 is turned on, a part of the current flows through the first laminated film 210. For this reason, the response speed when the light emitting unit 140 is turned on also decreases.

  On the other hand, according to the present embodiment, at least a part of the layer of the first laminated film 210 is thicker than the other layers between the first extraction wiring 114 and the second extraction wiring 134. For this reason, the magnitude of the resistance in the equivalent circuit diagram of FIG. 17 increases. Therefore, it is difficult for current to flow through the first laminated film 210, and as a result, the response speed of the light emitting unit 140 is unlikely to decrease. When the layer closest to the light emitting unit 140 in the first stacked film 210 is thicker than the other layers, current does not easily flow through the first stacked film 210 in particular.

  The same applies to the second stacked film 220.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the substrate 100 is prepared. Next, a plurality of inorganic layers are formed on the first surface 102 of the substrate 100 using, for example, an ALD method. As a result, the first laminated film 210 is formed on the first surface 102. In the ALD method, atoms or molecules to be a film reach the second surface 104 of the substrate 100. In other words, the ALD method has high coverage. Therefore, when forming the first stacked film 210 using the ALD method, the third stacked film 310 is formed on the second surface 104 of the substrate 100.

  Next, the first electrode, the organic layer, and the second electrode of the light emitting unit 140 are formed in this order on the first stacked film 210 of the substrate 100. Thereby, the light emission part 140 is formed. In this step, the terminal of the light emitting unit 140 is also formed.

  Next, a plurality of inorganic layers are formed on the first stacked film 210 and the light emitting unit 140 of the substrate 100 using, for example, an ALD method. As a result, a second stacked film 220 as a sealing film is formed on the first surface 102 and the light emitting unit 140. Further, as described above, the ALD method has high coverage. Therefore, when the second stacked film 220 is formed using the ALD method, the fourth stacked film 320 is formed on the second surface 104 of the substrate 100.

  As described above, according to the present embodiment, the first laminated film 210 and the second laminated film 220 are formed on the first surface 102 side of the substrate 100, and the third laminated film is formed on the second surface 104 side of the substrate 100. 310 and the fourth laminated film 320 are formed. The number of layers of the first stacked film 210 is the same as the number of layers of the third stacked film 310, and when the layers are counted from the substrate 100 side, the respective materials of the plurality of layers constituting the third stacked film 310 Is the same as the material of the layer located in the corresponding lamination order in the first laminated film 210. Further, the number of layers of the fourth stacked film 320 is the same as the number of layers of the second stacked film 220, and when the layers are counted from the substrate 100 side, a plurality of layers constituting the fourth stacked film 320 are included. These materials are the same as the materials of the layers positioned in the corresponding stacking order in the second stacked film 220. For this reason, the stress applied to the substrate 100 due to the first stacked film 210 is canceled by the stress applied to the substrate 100 due to the third stacked film 310. Further, the stress applied to the substrate 100 due to the second stacked film 220 is canceled by the stress applied to the substrate 100 due to the fourth stacked film 320. Accordingly, the stress applied to the substrate 100 is reduced.

  In particular, in the present embodiment, since the first stacked film 210 and the third stacked film 310 are formed simultaneously using the ALD method, they have the same structure. Further, since the second stacked film 220 and the fourth stacked film 320 are simultaneously formed using the ALD method, they have the same structure. Therefore, the stress applied to the substrate 100 is particularly small.

  In addition, since the fourth stacked film 320 functions as a barrier film of the substrate 100, the possibility that moisture permeates the substrate 100 is further reduced.

Example 1
FIG. 8 is a plan view illustrating the configuration of the light emitting device 10 according to the first embodiment. For the sake of explanation, the second laminated film 220 is shown by dotted lines in FIG. FIG. 9 is a view in which the second electrode 130 and the second laminated film 220 are removed from FIG. FIG. 10 is a diagram in which the organic layer 120 and the insulating layer 150 are removed from FIG. 11 is a cross-sectional view taken along the line AA in FIG.

  In this embodiment, the light emitting device 10 is a lighting device, and includes a substrate 100 and a light emitting unit 140. The light emitting unit 140 includes a first electrode 110, an organic layer 120, and a second electrode 130. The configurations of the first electrode 110, the organic layer 120, and the second electrode 130 are the same as in the embodiment.

  The edge of the first electrode 110 is covered with an insulating layer 150. The insulating layer 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes a light emitting region of the light emitting unit 140. By providing the insulating layer 150, it is possible to suppress a short circuit between the first electrode 110 and the second electrode 130 at the edge of the first electrode 110. The insulating layer 150 is formed, for example, by applying a resin material to be the insulating layer 150 and then exposing and developing the resin material.

  In addition, the light emitting device 10 includes a first terminal 112 and a second terminal 132. The first terminal 112 is connected to the first electrode 110, and the second terminal 132 is connected to the second electrode 130. For example, the first terminal 112 and the second terminal 132 include a layer formed of the same material as that of the first electrode 110. A lead wiring may be provided between the first terminal 112 and the first electrode 110. In addition, a lead wiring may be provided between the second terminal 132 and the second electrode 130.

  In addition, the light emitting device 10 includes a first stacked film 210, a second stacked film 220, a third stacked film 310, and a fourth stacked film 320. The configuration of these laminated films and the configuration of the substrate 100 are the same as those in the embodiment.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the first stacked film 210 and the third stacked film 310 are formed on the substrate 100. Next, the first electrode 110 is formed on the first stacked film 210. In this step, the first terminal 112 and the second terminal 132 are also formed. Next, the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order. Next, the second stacked film 220 and the fourth stacked film 320 are formed.

  According to the present example, similarly to the embodiment, in the illumination device using the light emitting unit 140, the stress applied to the substrate 100 can be reduced.

(Example 2)
FIG. 12 is a plan view of the light emitting device 10 according to the second embodiment. For the sake of explanation, the second laminated film 220 is indicated by a dotted line in FIG. FIG. 13 is a view in which the partition 170, the second electrode 130, the organic layer 120, and the insulating layer 150 are removed from FIG. 14 is a cross-sectional view taken along line BB in FIG. 12, FIG. 15 is a cross-sectional view taken along line CC in FIG. 12, and FIG. 16 is a cross-sectional view taken along line DD in FIG.

  The light emitting device 10 according to the present embodiment is a display, and includes a substrate 100, a first electrode 110, a light emitting unit 140, an insulating layer 150, a plurality of openings 152, a plurality of openings 154, a plurality of lead wires 114, an organic layer 120, a first layer. It has two electrodes 130, a plurality of lead wires 134, and a plurality of partition walls 170.

  The first electrode 110 extends in a line shape in the first direction (Y direction in FIG. 12). The end portion of the first electrode 110 is connected to the lead wiring 114.

  The lead wiring 114 is a wiring that connects the first electrode 110 to the first terminal 112. In the example shown in the drawing, one end side of the lead wiring 114 is connected to the first electrode 110, and the other end side of the lead wiring 114 is the first terminal 112. In the example shown in the figure, the first electrode 110 and the lead-out wiring 114 are integrated. A conductor layer 160 is formed on the lead wiring 114. The conductor layer 160 is formed using a material having a resistance lower than that of the first electrode 110, for example, Al. The conductor layer 160 may have a multilayer structure. A part of the lead wiring 114 is covered with an insulating layer 150.

  As shown in FIGS. 12 and 14 to 16, the insulating layer 150 is formed on the plurality of first electrodes 110 and in a region therebetween. A plurality of openings 152 and a plurality of openings 154 are formed in the insulating layer 150. The plurality of second electrodes 130 extend in parallel to each other in a direction intersecting the first electrode 110 (for example, a direction orthogonal to the X direction in FIG. 12). A partition wall 170, which will be described in detail later, extends between the plurality of second electrodes 130. The opening 152 is located at the intersection of the first electrode 110 and the second electrode 130 in plan view. Specifically, the plurality of openings 152 are arranged in the direction in which the first electrode 110 extends (Y direction in FIG. 12). The plurality of openings 152 are also arranged in the extending direction of the second electrode 130 (the X direction in FIG. 12). For this reason, the plurality of openings 152 are arranged to form a matrix.

  The opening 154 is located in a region overlapping with one end side of each of the plurality of second electrodes 130 in plan view. The openings 154 are arranged along one side of the matrix formed by the openings 152. When viewed in a direction along this one side (for example, the Y direction in FIG. 12, that is, the direction along the first electrode 110), the openings 154 are arranged at a predetermined interval. A part of the lead wiring 134 is exposed from the opening 154. The lead wiring 134 is connected to the second electrode 130 through the opening 154.

  The lead wiring 134 is a wiring that connects the second electrode 130 to the second terminal 132, and has a layer made of the same material as the first electrode 110. One end side of the lead wiring 134 is located below the opening 154, and the other end side of the lead wiring 134 is led out of the insulating layer 150. In the example shown in the figure, the other end side of the lead-out wiring 134 is the second terminal 132. A conductor layer 160 is formed on the lead wiring 134. A part of the lead wiring 134 is covered with an insulating layer 150.

  In the region overlapping with the opening 152, the organic layer 120 is formed. The hole injection layer of the organic layer 120 is in contact with the first electrode 110, and the electron injection layer of the organic layer 120 is in contact with the second electrode 130. For this reason, the light emitting part 140 is located in each of the regions overlapping with the opening 152.

  In the example shown in FIGS. 14 and 15, the layers constituting the organic layer 120 are shown to protrude to the outside of the opening 152. And as shown in FIG. 12, the organic layer 120 may be continuously formed between adjacent openings 152 in the direction in which the partition 170 extends, or may not be formed continuously. Good. However, as shown in FIG. 16, the organic layer 120 is not formed in the opening 154.

  As shown in FIGS. 12 and 14 to 16, the second electrode 130 extends in a second direction (X direction in FIG. 12) that intersects the first direction. A partition wall 170 is formed between the adjacent second electrodes 130. The partition wall 170 extends in parallel to the second electrode 130, that is, in the second direction. The base of the partition 170 is, for example, the insulating layer 150. The partition 170 is, for example, a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by being exposed and developed. The partition wall 170 may be made of a resin other than a polyimide resin, for example, an inorganic material such as an epoxy resin, an acrylic resin, or silicon dioxide.

  The partition wall 170 has a trapezoidal cross-sectional shape (reverse trapezoidal shape). That is, the width of the upper surface of the partition wall 170 is larger than the width of the lower surface of the partition wall 170. Therefore, if the partition wall 170 is formed before the second electrode 130, the second electrode 130 is formed on one surface side of the substrate 100 by using an evaporation method or a sputtering method. Can be formed collectively. The partition wall 170 also has a function of dividing the organic layer 120.

  Also in this embodiment, the first laminated film 210 and the second laminated film 220 are formed on the first surface 102 of the substrate 100, and the third laminated film 310 and the fourth laminated film are formed on the second surface 104 of the substrate 100. A stacked film 320 is formed. The second stacked film 220 seals the light emitting unit 140. In the present embodiment, the first terminal 112 and the second terminal 132 are arranged along the same side of the substrate 100. Therefore, the opening for exposing the first terminal 112 and the opening for exposing the second terminal 132 in the second stacked film 220 are connected to each other.

  Next, a method for manufacturing the light emitting device 10 in this embodiment will be described. First, the first stacked film 210 and the third stacked film 310 are formed on the substrate 100. These forming methods are as described in the embodiment.

  Next, the first electrode 110 and the lead wires 114 and 134 are formed on the first surface 102 of the substrate 100. Next, the conductor layer 160 is formed on the lead wiring 114 and the lead wiring 134. Next, the insulating layer 150 is formed, and further the partition 170 is formed. Next, the organic layer 120 and the second electrode 130 are formed. These forming methods are the same as those in Example 1.

  Next, the second stacked film 220 and the fourth stacked film 320 are formed on the substrate 100. These forming methods are as described in the embodiment.

  According to the present example, similarly to the embodiment, in the display using the light emitting unit 140, the stress applied to the substrate 100 can be reduced.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

100 Substrate 102 First surface 104 Second surface 110 First electrode 112 First terminal 114 Lead wire 120 Organic layer 130 Second electrode 132 Second terminal 134 Lead wire 140 Light emitting unit 210 First laminated film 212 First layer 214 Second Layer 220 second laminated film 222 first layer 224 second layer 310 third laminated film 320 fourth laminated film

Claims (1)

A substrate containing a resin material;
A first laminated film formed on the first surface of the substrate and laminated with a plurality of layers;
A light emitting part formed on the first laminated film and including an organic layer;
A second laminated film formed on the first laminated film and the light emitting part and laminated with a plurality of layers;
With
One of the layers of the first laminated film is a light emitting device that is thicker than the other layers of the first laminated film.

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