JP2020521318A - デジタル撮像システムにおける放射線検出のための装置 - Google Patents
デジタル撮像システムにおける放射線検出のための装置 Download PDFInfo
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/241—Electrode arrangements, e.g. continuous or parallel strips or the like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/247—Detector read-out circuitry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of Radiation (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
この出願は、2017年5月9日に出願された米国仮出願第62/503,408号の優先権を主張する。
Claims (16)
- デジタル撮像システムに関する検出器素子であって、
第1電極と、
第2電極と、
前記第1及び第2電極間に配置された半導体層と、
前記第1及び第2電極のうちの1つに隣接する少なくとも1つの伝導性の遮蔽電極と、
を備える検出器素子。 - 少なくとも1つのブロッキング層をさらに備える請求項1に記載の検出器素子。
- 基板層をさらに備える請求項1に記載の検出器素子。
- 前記遮蔽電極は、前記基板層に隣接する請求項3に記載の検出器素子。
- 前記遮蔽電極は、前記基板層から離れる請求項3に記載の検出器素子。
- 前記遮蔽電極は、透明である請求項5に記載の検出器素子。
- 前記遮蔽電極は、前記第1及び第2電極のうちの少なくとも1つの近く又は周りの電解を形作る請求項1に記載の検出器素子。
- 前記遮蔽電極層は、前記第1及び第2電極が水平に間隔を空けられるときに前記第1及び第2電極間の電解を形作る請求項1に記載の検出器素子。
- 前記遮蔽電極は、前記基板層の幅を伸ばす請求項3に記載の検出器素子。
- 前記遮蔽電極は、伝導材料から作成される請求項1に記載の検出器素子。
- 前記伝導材料は、アルミニウム、クロム、モリブデン又は酸化インジウムスズである請求項10に記載の検出器素子。
- 前記半導体層は、アモルファスシリコン、金属酸化物、ポリシリコン、有機半導体材料のうちの少なくとも1つから作成される請求項1に記載の検出器素子。
- 前記ブロッキング層は、ポリイミド、ベンゾシクロブタン(BCB)、パリレン、ポリスチレン又はポリシロキサンのうちの少なくとも1つから作成される請求項12に記載の検出器素子。
- 前記検出器素子は、金属−絶縁体−半導体−絶縁体−金属(MISIM)検出器素子である請求項1に記載の検出器素子。
- 反射防止層をさらに備える請求項2に記載の検出器素子。
- 前記ブロッキング層は、絶縁ブロッキング層、オーミックブロッキング層、ショットキーブロッキング層である請求項2に記載の検出器素子。
Priority Applications (1)
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JP2023043856A JP2023083279A (ja) | 2017-05-09 | 2023-03-20 | デジタル撮像システムにおける放射線検出のための装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762503408P | 2017-05-09 | 2017-05-09 | |
US62/503,408 | 2017-05-09 | ||
PCT/CA2018/050554 WO2018205028A1 (en) | 2017-05-09 | 2018-05-09 | Apparatus for radiation detection in a digital imaging system |
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JP2023043856A Division JP2023083279A (ja) | 2017-05-09 | 2023-03-20 | デジタル撮像システムにおける放射線検出のための装置 |
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JP2020521318A true JP2020521318A (ja) | 2020-07-16 |
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JP2019562322A Pending JP2020521318A (ja) | 2017-05-09 | 2018-05-09 | デジタル撮像システムにおける放射線検出のための装置 |
JP2023043856A Pending JP2023083279A (ja) | 2017-05-09 | 2023-03-20 | デジタル撮像システムにおける放射線検出のための装置 |
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Country | Link |
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US (1) | US10514471B2 (ja) |
EP (1) | EP3635791A4 (ja) |
JP (2) | JP2020521318A (ja) |
CN (1) | CN110945658A (ja) |
CA (1) | CA3062873A1 (ja) |
WO (1) | WO2018205028A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US11504079B2 (en) | 2016-11-30 | 2022-11-22 | The Research Foundation For The State University Of New York | Hybrid active matrix flat panel detector system and method |
CN109659385A (zh) * | 2017-10-10 | 2019-04-19 | 群创光电股份有限公司 | 感测装置 |
KR102552845B1 (ko) * | 2017-12-19 | 2023-07-06 | 엘지디스플레이 주식회사 | 엑스레이 영상감지소자 |
JP7286778B2 (ja) * | 2019-02-26 | 2023-06-05 | エーエスエムエル ネザーランズ ビー.ブイ. | 利得要素を備えた荷電粒子検出器およびその製造方法 |
JP2022167161A (ja) * | 2021-04-22 | 2022-11-04 | シャープディスプレイテクノロジー株式会社 | X線撮像パネル及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002528889A (ja) * | 1998-10-22 | 2002-09-03 | ディレクト レディオグラフィ コーポレーション | 遮蔽電極付き直接放射線線撮影イメージングパネル |
WO2010121386A1 (en) * | 2009-04-23 | 2010-10-28 | Karim Karim S | Method and apparatus for a lateral radiation detector |
US20150323679A1 (en) * | 2014-05-12 | 2015-11-12 | Industrial Technology Research Institute | Electrical radiography imaging system and method thereof |
WO2017008166A1 (en) * | 2015-07-14 | 2017-01-19 | Dose Smart Imaging | Apparatus for radiation detection in a digital imaging system |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6046454A (en) * | 1995-10-13 | 2000-04-04 | Digirad Corporation | Semiconductor radiation detector with enhanced charge collection |
CA2438581C (en) * | 2001-02-16 | 2005-11-29 | Ignis Innovation Inc. | Organic light emitting diode display having shield electrodes |
JP4323827B2 (ja) * | 2003-02-14 | 2009-09-02 | キヤノン株式会社 | 固体撮像装置及び放射線撮像装置 |
JP2007528116A (ja) * | 2003-05-09 | 2007-10-04 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | フラットパネルx線検出器 |
JP5207583B2 (ja) * | 2005-07-25 | 2013-06-12 | キヤノン株式会社 | 放射線検出装置および放射線検出システム |
CA2541256A1 (en) * | 2006-02-22 | 2007-08-22 | Redlen Technologies Inc. | Shielding electrode for monolithic radiation detector |
WO2008012723A2 (en) * | 2006-07-20 | 2008-01-31 | Philips Intellectual Property & Standards Gmbh | A detector for and a method of detecting electromagnetic radiation |
JP5008026B2 (ja) * | 2007-01-30 | 2012-08-22 | ソニーモバイルディスプレイ株式会社 | 入力機能付表示装置 |
JP5375142B2 (ja) * | 2009-02-05 | 2013-12-25 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法、及び電子機器 |
KR101776955B1 (ko) * | 2009-02-10 | 2017-09-08 | 소니 주식회사 | 고체 촬상 장치와 그 제조 방법, 및 전자 기기 |
KR101906974B1 (ko) * | 2011-04-25 | 2018-10-12 | 삼성전자주식회사 | 광센싱 장치 및 그 구동 방법 |
US9335423B2 (en) * | 2011-07-01 | 2016-05-10 | Brookhaven Science Associates, Llc | Radiation detector device for rejecting and excluding incomplete charge collection events |
JP2013088324A (ja) * | 2011-10-19 | 2013-05-13 | Fujifilm Corp | 放射線画像撮影装置 |
KR102018740B1 (ko) * | 2013-01-02 | 2019-09-06 | 삼성디스플레이 주식회사 | 터치 감지 기능을 구비한 표시 장치 |
US9753152B2 (en) * | 2013-06-28 | 2017-09-05 | Koninklijke Philips N.V. | Semiconductor scintillation detector |
US10468450B2 (en) * | 2014-04-04 | 2019-11-05 | Dose Smart Imaging | Apparatus for radiation detection in a radiography imaging system |
WO2016163347A1 (ja) * | 2015-04-10 | 2016-10-13 | シャープ株式会社 | フォトセンサ基板 |
-
2018
- 2018-05-09 US US15/975,366 patent/US10514471B2/en active Active
- 2018-05-09 EP EP18799337.3A patent/EP3635791A4/en active Pending
- 2018-05-09 JP JP2019562322A patent/JP2020521318A/ja active Pending
- 2018-05-09 CA CA3062873A patent/CA3062873A1/en active Pending
- 2018-05-09 CN CN201880042887.7A patent/CN110945658A/zh active Pending
- 2018-05-09 WO PCT/CA2018/050554 patent/WO2018205028A1/en unknown
-
2023
- 2023-03-20 JP JP2023043856A patent/JP2023083279A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002528889A (ja) * | 1998-10-22 | 2002-09-03 | ディレクト レディオグラフィ コーポレーション | 遮蔽電極付き直接放射線線撮影イメージングパネル |
WO2010121386A1 (en) * | 2009-04-23 | 2010-10-28 | Karim Karim S | Method and apparatus for a lateral radiation detector |
US20150323679A1 (en) * | 2014-05-12 | 2015-11-12 | Industrial Technology Research Institute | Electrical radiography imaging system and method thereof |
WO2017008166A1 (en) * | 2015-07-14 | 2017-01-19 | Dose Smart Imaging | Apparatus for radiation detection in a digital imaging system |
Also Published As
Publication number | Publication date |
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EP3635791A4 (en) | 2021-01-13 |
JP2023083279A (ja) | 2023-06-15 |
CN110945658A (zh) | 2020-03-31 |
CA3062873A1 (en) | 2018-11-15 |
US20180329084A1 (en) | 2018-11-15 |
US10514471B2 (en) | 2019-12-24 |
EP3635791A1 (en) | 2020-04-15 |
WO2018205028A1 (en) | 2018-11-15 |
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