JP2020515077A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020515077A5 JP2020515077A5 JP2019552277A JP2019552277A JP2020515077A5 JP 2020515077 A5 JP2020515077 A5 JP 2020515077A5 JP 2019552277 A JP2019552277 A JP 2019552277A JP 2019552277 A JP2019552277 A JP 2019552277A JP 2020515077 A5 JP2020515077 A5 JP 2020515077A5
- Authority
- JP
- Japan
- Prior art keywords
- protected areas
- pattern
- stochastic
- protected
- candidate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 28
- 238000005303 weighing Methods 0.000 claims 20
- 238000000034 method Methods 0.000 claims 13
- 230000001629 suppression Effects 0.000 claims 10
- 238000012360 testing method Methods 0.000 claims 10
- 238000005286 illumination Methods 0.000 claims 8
- 238000001459 lithography Methods 0.000 claims 8
- 229920002120 photoresistant polymer Polymers 0.000 claims 8
- 230000003252 repetitive effect Effects 0.000 claims 8
- 230000035945 sensitivity Effects 0.000 claims 8
- 238000012545 processing Methods 0.000 claims 7
- 238000010521 absorption reaction Methods 0.000 claims 6
- 238000012937 correction Methods 0.000 claims 4
- 238000009826 distribution Methods 0.000 claims 4
- 230000000694 effects Effects 0.000 claims 4
- 238000005070 sampling Methods 0.000 claims 4
- 230000007547 defect Effects 0.000 claims 2
- 238000003754 machining Methods 0.000 claims 2
- 238000005259 measurement Methods 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 238000013528 artificial neural network Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000013135 deep learning Methods 0.000 claims 1
- 230000002401 inhibitory effect Effects 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762475072P | 2017-03-22 | 2017-03-22 | |
| US62/475,072 | 2017-03-22 | ||
| US15/612,279 US10474042B2 (en) | 2017-03-22 | 2017-06-02 | Stochastically-aware metrology and fabrication |
| US15/612,279 | 2017-06-02 | ||
| PCT/US2018/022769 WO2018175213A1 (en) | 2017-03-22 | 2018-03-16 | Stochastically-aware metrology and fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020515077A JP2020515077A (ja) | 2020-05-21 |
| JP2020515077A5 true JP2020515077A5 (https=) | 2021-04-22 |
| JP7003150B2 JP7003150B2 (ja) | 2022-01-20 |
Family
ID=63582526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019552277A Active JP7003150B2 (ja) | 2017-03-22 | 2018-03-16 | 確率性を仮定した計量および加工 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10474042B2 (https=) |
| JP (1) | JP7003150B2 (https=) |
| KR (1) | KR102327900B1 (https=) |
| TW (1) | TWI751305B (https=) |
| WO (1) | WO2018175213A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10437951B2 (en) * | 2017-08-23 | 2019-10-08 | International Business Machines Corporation | Care area generation by detection optimized methodology |
| US11088039B2 (en) * | 2017-10-23 | 2021-08-10 | Applied Materials, Inc. | Data management and mining to correlate wafer alignment, design, defect, process, tool, and metrology data |
| WO2019162346A1 (en) * | 2018-02-23 | 2019-08-29 | Asml Netherlands B.V. | Methods for training machine learning model for computation lithography |
| US11775714B2 (en) * | 2018-03-09 | 2023-10-03 | Pdf Solutions, Inc. | Rational decision-making tool for semiconductor processes |
| US10592635B2 (en) * | 2018-05-31 | 2020-03-17 | International Business Machines Corporation | Generating synthetic layout patterns by feedforward neural network based variational autoencoders |
| US10606975B2 (en) * | 2018-05-31 | 2020-03-31 | International Business Machines Corporation | Coordinates-based generative adversarial networks for generating synthetic physical design layout patterns |
| US10706200B2 (en) | 2018-06-05 | 2020-07-07 | International Business Machines Corporation | Generative adversarial networks for generating physical design layout patterns of integrated multi-layers |
| KR102666072B1 (ko) * | 2018-06-05 | 2024-05-17 | 삼성전자주식회사 | 기계 학습 장치 및 기계 학습 장치의 학습 방법 |
| US10699055B2 (en) | 2018-06-12 | 2020-06-30 | International Business Machines Corporation | Generative adversarial networks for generating physical design layout patterns |
| US10818001B2 (en) * | 2018-09-07 | 2020-10-27 | Kla-Tencor Corporation | Using stochastic failure metrics in semiconductor manufacturing |
| KR102563023B1 (ko) * | 2018-11-12 | 2023-08-03 | 주식회사 히타치하이테크 | 결함의 발생을 추정하는 시스템, 및 컴퓨터 가독 매체 |
| JP7579267B2 (ja) * | 2019-02-25 | 2024-11-07 | アプライド マテリアルズ イスラエル リミテッド | 希少確率欠陥を検出するシステムおよび方法 |
| US10990019B2 (en) * | 2019-04-09 | 2021-04-27 | Kla Corporation | Stochastic reticle defect dispositioning |
| EP3994526A1 (en) * | 2019-07-03 | 2022-05-11 | ASML Netherlands B.V. | Method for applying a deposition model in a semiconductor manufacturing process |
| IL324560A (en) * | 2019-09-05 | 2026-01-01 | Asml Netherlands Bv | Method for determining defectiveness of pattern based on after development image |
| US12332573B2 (en) | 2019-09-05 | 2025-06-17 | Asml Netherlands B.V. | Method for determining defectiveness of pattern based on after development image |
| CN114514473B (zh) * | 2019-09-25 | 2025-09-23 | 美商新思科技有限公司 | 基于缺陷概率分布和关键尺寸变化的光刻改进 |
| KR102748784B1 (ko) * | 2019-10-16 | 2024-12-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 패턴들을 형성하는 방법 및 리소그래피 시스템 |
| KR102850033B1 (ko) * | 2019-12-19 | 2025-08-22 | 삼성전자주식회사 | 광학 근접 보상 검증 방법 및 이를 포함하는 반도체 제조 방법 |
| CN115023798A (zh) * | 2020-01-27 | 2022-09-06 | 朗姆研究公司 | 半导体制造工艺的性能预测器 |
| KR20230052877A (ko) * | 2020-08-17 | 2023-04-20 | 도쿄엘렉트론가부시키가이샤 | 반도체 제조를 위해 절대 참조물을 통해 오버레이 결과물을 제조하기 위한 방법 |
| EP4200671B1 (en) * | 2020-08-19 | 2025-09-03 | ASML Netherlands B.V. | Systems and methods for image-based pattern selection |
| US11810284B2 (en) * | 2020-08-21 | 2023-11-07 | Kla Corporation | Unsupervised learning for repeater-defect detection |
| US11270054B1 (en) * | 2020-08-31 | 2022-03-08 | Siemens Industry Software Inc. | Method and system for calculating printed area metric indicative of stochastic variations of the lithographic process |
| KR102946615B1 (ko) | 2020-12-28 | 2026-04-01 | 삼성전자주식회사 | 반도체 집적회로 레이아웃의 확률적 취약점 검출 방법 및 이를 수행하는 컴퓨터 시스템 |
| US11613114B2 (en) * | 2021-04-29 | 2023-03-28 | Lead Technologies, Inc. | Method, apparatus, and non-transitory computer-readable storage medium for altering a digital image for a printing job |
| US20230051330A1 (en) * | 2021-08-16 | 2023-02-16 | Applied Materials Inc. | Using defect models to estimate defect risk and optimize process recipes |
| US12306531B2 (en) * | 2021-08-20 | 2025-05-20 | Samsung Electronics Co., Ltd. | Lithography and method of fabricating semiconductor device using the same |
| US20230092729A1 (en) * | 2021-09-20 | 2023-03-23 | Kla Corporation | Semiconductor Profile Measurement Based On A Scanning Conditional Model |
| CN114861474B (zh) * | 2022-07-08 | 2022-10-04 | 西南交通大学 | 一种智能泵阀系统性能仿真处理方法及云计算服务系统 |
| US11966156B2 (en) * | 2022-08-16 | 2024-04-23 | Kla Corporation | Lithography mask repair by simulation of photoresist thickness evolution |
| US12561790B2 (en) * | 2023-09-26 | 2026-02-24 | Kla Corporation | Method to calibrate, predict, and control stochastic defects in EUV lithography |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608526A (en) | 1995-01-19 | 1997-03-04 | Tencor Instruments | Focused beam spectroscopic ellipsometry method and system |
| US5859424A (en) | 1997-04-08 | 1999-01-12 | Kla-Tencor Corporation | Apodizing filter system useful for reducing spot size in optical measurements and other applications |
| US6429943B1 (en) | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
| JP4351522B2 (ja) | 2003-11-28 | 2009-10-28 | 株式会社日立ハイテクノロジーズ | パターン欠陥検査装置およびパターン欠陥検査方法 |
| US7478019B2 (en) | 2005-01-26 | 2009-01-13 | Kla-Tencor Corporation | Multiple tool and structure analysis |
| JP5175577B2 (ja) * | 2008-02-18 | 2013-04-03 | 株式会社日立ハイテクノロジーズ | 集積回路パターンの欠陥検査方法、及びその装置 |
| US8589827B2 (en) | 2009-11-12 | 2013-11-19 | Kla-Tencor Corporation | Photoresist simulation |
| US8781781B2 (en) | 2010-07-30 | 2014-07-15 | Kla-Tencor Corp. | Dynamic care areas |
| US8555210B2 (en) * | 2011-04-29 | 2013-10-08 | Micron Technology, Inc. | Systems and methods for stochastic models of mask process variability |
| US8504949B2 (en) * | 2011-07-26 | 2013-08-06 | Mentor Graphics Corporation | Hybrid hotspot detection |
| US8755045B2 (en) * | 2012-01-06 | 2014-06-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Detecting method for forming semiconductor device |
| US20130252350A1 (en) | 2012-03-26 | 2013-09-26 | Globalfoundries Singapore Pte. Ltd. | System and method for generating care areas for defect inspection |
| US10769320B2 (en) * | 2012-12-18 | 2020-09-08 | Kla-Tencor Corporation | Integrated use of model-based metrology and a process model |
| US10101670B2 (en) * | 2013-03-27 | 2018-10-16 | Kla-Tencor Corporation | Statistical model-based metrology |
| US9098891B2 (en) | 2013-04-08 | 2015-08-04 | Kla-Tencor Corp. | Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology |
| US9875946B2 (en) * | 2013-04-19 | 2018-01-23 | Kla-Tencor Corporation | On-device metrology |
| US9383661B2 (en) * | 2013-08-10 | 2016-07-05 | Kla-Tencor Corporation | Methods and apparatus for determining focus |
| US10935893B2 (en) * | 2013-08-11 | 2021-03-02 | Kla-Tencor Corporation | Differential methods and apparatus for metrology of semiconductor targets |
| US9494853B2 (en) * | 2013-12-18 | 2016-11-15 | Cypress Semiconductor Corporation | Increasing lithographic depth of focus window using wafer topography |
| KR102053152B1 (ko) * | 2014-02-11 | 2019-12-06 | 에이에스엠엘 네델란즈 비.브이. | 임의 패턴의 확률적 변동을 계산하는 모델 |
| US10747830B2 (en) * | 2014-11-21 | 2020-08-18 | Mesh Labs Inc. | Method and system for displaying electronic information |
| TWI620980B (zh) * | 2015-02-13 | 2018-04-11 | Ａｓｍｌ荷蘭公司 | 影像對數斜率（ｉｌｓ）最佳化 |
| US10018571B2 (en) | 2015-05-28 | 2018-07-10 | Kla-Tencor Corporation | System and method for dynamic care area generation on an inspection tool |
| US10163733B2 (en) * | 2016-05-31 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of extracting defects |
-
2017
- 2017-06-02 US US15/612,279 patent/US10474042B2/en active Active
-
2018
- 2018-03-16 JP JP2019552277A patent/JP7003150B2/ja active Active
- 2018-03-16 WO PCT/US2018/022769 patent/WO2018175213A1/en not_active Ceased
- 2018-03-16 KR KR1020197030905A patent/KR102327900B1/ko active Active
- 2018-03-21 TW TW107109574A patent/TWI751305B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2020515077A5 (https=) | ||
| TWI751305B (zh) | 隨機察覺度量衡及製造 | |
| JP7440580B2 (ja) | レチクルを検査する装置および方法 | |
| KR102735948B1 (ko) | 웨이퍼-레벨 결함 인쇄성을 예측하기 위한 장치 및 방법들 | |
| CN104620097B (zh) | 检验晶片及/或预测形成于晶片上的装置的一或多个特性 | |
| US7853920B2 (en) | Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing | |
| KR102245695B1 (ko) | 모델-기반 계측 및 프로세스 모델의 통합 사용 | |
| JP4954211B2 (ja) | 個別マスクエラーモデルを使用するマスク検証を行うシステムおよび方法 | |
| US10395361B2 (en) | Apparatus and methods for inspecting reticles | |
| US9547892B2 (en) | Apparatus and methods for predicting wafer-level defect printability | |
| TW201514617A (zh) | 於微影製程中使圖案合格 | |
| CN111386500A (zh) | 鉴定微光刻的掩模的方法 | |
| US12353967B2 (en) | Method and apparatus for determining feature contribution to performance | |
| TW201804547A (zh) | 電腦輔助弱圖案偵測及量化系統 | |
| EP3767392A1 (en) | Method and apparatus for determining feature contribution to performance | |
| Pan et al. | SpotMe effective co-optimization of design and defect inspection for fast yield ramp | |
| US20260003293A1 (en) | Method and system of correcting optical proximity correction (opc) model for manufacturing semiconductor device | |
| Maeng et al. | The sub-ppm level of stochastic failure model for random logic design | |
| Wu et al. | Lithography process calibration with applications in defect printability analysis | |
| KR100649003B1 (ko) | 마스크 검사방법 | |
| Tsuchiya et al. | Practical mask inspection system with printability and pattern priority verification | |
| Torres et al. | Lithography yield enhancement through optical rule checking | |
| Gallagher et al. | SMO photomask inspection in the lithographic plane | |
| Spence et al. | Use of layout automation and design-based metrology for defect test mask design and verification |