JP2020510753A - 3次元の加工物を形成するために使用される照射システムを較正する装置及び方法 - Google Patents
3次元の加工物を形成するために使用される照射システムを較正する装置及び方法 Download PDFInfo
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Abstract
Description
構築室の外部の較正構造を照射するステップであって、照射は照射システムによって行われ、かつ構築室内で原料粉末層を選択的に硬化させることによって加工物を形成可能であるステップと、
較正構造の照射を検出するステップと、
検出された較正構造の照射に基づいて照射システムを較正するステップと、
を有する。
3次元の加工物を形成するための付加(積層)方法において、そして特に付加層構築方法において、最初は形状のない、又は形状中立(ニュートラル)な成形材料(たとえば原料粉末)を位置特定の照射によって固めて、それによって所望の形状にすることが知られている。照射は、たとえばレーザ放射の形式の、電磁放射によって行うことができる。初期状態において成形材料は、まず細粒として、粉末として又は液状の成形材料として存在することができ、照射の結果として選択的に、又は言い換えると、特定位置で固められる。成形材料は、たとえばセラミック材料、金属材料又はプラスチック材料、そして又それらの材料混合物を含むことができる。付加層構築方法の一変形例は、いわゆる粉末床溶融に関するものであり、それにおいて特に金属及び/又はセラミックの原料粉末材料が3次元の加工物を形成するために固められる。
構築室の外部の較正構造を照射するステップであって、照射は照射システムによって行われ、かつ構築室内で原料粉末層を選択的に硬化させることによって加工物を形成可能であるステップと、
較正構造の照射を検出するステップと、
検出された較正構造の照射に基づいて照射システムを較正するステップと、
を有する。
Claims (15)
- 3次元の加工物を層状に形成する装置(10)であって、
構築室(30)であって、該構築室(30)の中で原料粉末層を選択的に硬化させることによって加工物を形成することができる、構築室(30)と、
該構築室(30)内の原料粉末層を少なくとも1つの加工ビームの送出によって選択的に硬化させるように構成されている、照射システム(20)と、
少なくとも1つの較正構造(36)と、
前記照射システム(20)によって送出された放射の前記較正構造(36)におけるバック反射を検出するように構成されている、センサ機器(25)と、
該センサ機器の検出情報に基づいて前記照射システム(20)を較正するように構成されている、制御ユニット(26)と、を有し、
前記較正構造(36)が前記構築室(30)の外部に配置されている、3次元の加工物を層状に形成する装置。 - 前記較正構造(36)は装置(10)のプロセスチャンバ(12)の内部に、特にそれは少なくとも部分的にプロセスチャンバ(12)の内壁領域と前記構築室(30)の間に延びるように配置されている、請求項1に記載の装置(10)。
- 前記構築室(30)が構築面(28)を有し、前記較正構造(36)が前記構築面(28)の少なくとも1つの側(40、42)に沿って延びている、請求項1又は2に記載の装置(10)。
- 前記較正構造(36)は少なくとも2つの較正セクション(37)を有し、該較正セクションは前記構築面(28)の異なる側(40、42)に沿って延びており、特に前記構築面(28)の異なる側(40、42)が互いに対して角度をもって延びている、請求項3に記載の装置(10)。
- 装置(10)はさらに底領域(34)を有し、該底領域は前記構築面(28)を少なくとも部分的に包囲し、かつ前記較正構造(36)は前記底領域(34)内に、又は前記底領域(34)に対して平行に配置されている、請求項3又は4に記載の装置(10)。
- 前記較正構造(36)は少なくとも部分的に、プロセスチャンバ(12)の側壁領域内に、又はそれに対して平行に配置されている、請求項2〜5の何れか一項に記載の装置(10)。
- 前記較正構造(36)は少なくとも部分的に1つの材料を有し、前記照射システム(20)の照射に関する前記材料の吸収挙動は、前記較正構造(3)の周囲における吸収挙動とは異なる、請求項1〜6の何れか一項に記載の装置(10)。
- 前記較正構造(36)は、少なくとも1つの凹部及び/又は隆起部を有し、前記照射システム(20)は、較正プロセスの過程において前記凹部及び/又は前記隆起部の領域内で前記較正構造(36)に照射するように構成されている、請求項1〜7の何れか一項に記載の装置(10)。
- 吸収挙動を調節するための前記材料は、前記凹部及び/又は前記隆起部と前記較正構造(36)の周囲との間の移行領域近傍に、又はその中に配置されている、請求項7と8に記載の装置(10)。
- 前記凹部は、好ましくは上方の端縁に、及び/又は前記較正構造(36)への移行領域内に少なくとも1つのエッジ(45)を有している、請求項8又は9に記載の装置(10)。
- 前記凹部及び/又は前記隆起部がメインセクション(38)を有し、該メインセクションが実質的に前記構築面(28)に沿って延びており、かつ前記凹部及び/又は前記隆起部が少なくとも1つのサブセクション(44)を有し、該サブセクションが前記メインセクション(38)に対して角度をもって延びている、請求項3及び8〜10の何れか一項に記載の装置(10)。
- 複数のサブセクション(44)が設けられており、それらが前記メインセクション(38)に沿って好ましくは規則的な間隔で配置されている、請求項11に記載の装置(10)。
- 前記センサ機器(25)は、加工ビームの前記凹部への進入もしくはそこからの離脱を検出するように構成されており、及び/又は前記センサ機器(25)は、前記隆起部への到達及び/又はそこからの離脱を検出するように構成されている、請求項8に記載の装置(10)。
- 前記照射システム(20)は、少なくとも較正プロセスの間、硬化に有効でない出力を有する加工ビームを送出するように構成されている、請求項1〜13の何れか一項に記載の装置(10)。
- 3次元の加工物を層状に形成するための装置(10)の照射システム(20)を較正するシステムであって、
前記装置(10)が特に請求項1〜14の何れか一項に従って構成されており、
構築室(30)の外部の較正構造(36)を照射するステップであって、照射が前記照射システム(20)によって行われ、かつ前記構築室内で原料粉末層の選択的な硬化によって加工物が形成可能である、ステップと、
前記照射システム(20)によって送出された放射の、前記較正構造(36)におけるバック反射を検出するステップと、
前記照射システム(20)によって送出された放射の、前記較正構造(36)において検出されたバック反射に基づいて前記照射システム(20)を較正するステップと、
有する方法。
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