JP2020501005A - Substrate processing apparatus and method of using the same - Google Patents

Abstract

In this specification, a processing chamber (10) for providing a processing environment isolated from the outside, and a distance between a mask (350) and a substrate (S) installed in the processing chamber (10) in a non-contact manner. At least one distance measurement unit (500) for measuring the distance between the substrate (S) and the mask (350) while the distance measurement unit (500) measures the distance between the substrate (S) and the mask (350). By doing so, a substrate processing apparatus including a pressing mechanism for bringing them into close contact is disclosed. The substrate processing apparatus can much more easily and reliably align the substrate (S) with the mask (350) and bring them into close contact, thereby improving the yield of substrate processing. [Selection diagram] FIG. 3B

Description

  [0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same.

  [0002] A substrate processing apparatus performs a deposition process, an etching process, and the like to produce a wafer for assembling a semiconductor, a substrate for assembling an LCD, a substrate for assembling an OLED, and the like. The substrate processing apparatus has various configurations according to types and conditions of substrate processing and the like.

  [0003] Examples of such a substrate processing apparatus include a deposition apparatus. The deposition apparatus forms a thin film on the surface of the substrate by performing CVD, PVD, evaporative deposition, or the like.

  [0004] In order to produce a substrate for assembling an OLED, it is common to form a thin film on the surface of the substrate using a process that evaporates deposited materials such as organic materials, inorganic materials, and metals. is there.

  [0005] A deposition apparatus for forming a thin film by evaporating a deposition material includes a deposition chamber in which a substrate to be deposited is mounted, and an interior of the deposition chamber in which the deposition material is heated and evaporated toward the substrate. Including a source located at As the deposited material evaporates, a thin film forms on the surface of the substrate.

  [0006] The sources used in the deposition apparatus for OLEDs are mounted inside a deposition chamber to heat the deposition material and evaporate it toward the substrate. Such a source may have various configurations, such as the configurations disclosed in Korean Patent Publication Nos. 10-2009-0015324 and 10-2004-0110718.

  [0007] As shown in FIG. 1, in a deposition apparatus for an OLED, a predetermined pattern of an anode, a cathode, an organic layer and the like are formed using a substrate S combined with a mask 350.

  [0008] It is therefore important to align the substrate S with the mask 350 before the deposition process. In the prior art, the substrate S is aligned with the mask 350 outside the processing chamber 10 and then transferred into the processing chamber 10 to perform a deposition process.

  [0009] Unfortunately, the substrate S and the mask 350 may be offset from each other after being aligned with each other outside the processing chamber 10, thereby causing a deposition defect.

  [0010] In particular, when the substrate is exposed to a deposition process as it is transported and vertically aligned, the substrate S and the mask 350 may move slightly relative to each other. As a result, there is a problem that a defect occurs in the deposition process, and that the deposition process may fail.

  [0011] In order to prevent such defects in the deposition process, it is necessary to adhere the substrate S to the mask 350 or attach the substrate S to the mask 350 in the processing chamber 10. However, at present, there is no means for detecting whether the substrate S is in close contact with the mask 350. Therefore, when the substrate processing is performed while the substrate S is not in close contact with the mask 350, a problem may occur such that the deposition material is deposited on the bottom surface of the substrate.

  [0012] In view of the above, it is an object of the present disclosure to provide a substrate processing apparatus capable of performing excellent substrate processing by accurately measuring a gap between a substrate and a mask.

  [0013] According to an aspect of the present disclosure, a substrate processing apparatus is provided. The substrate processing apparatus includes a processing chamber for providing a processing environment isolated from the outside, and at least one distance for measuring a distance between a mask S and a substrate S installed in the processing chamber 10 in a non-contact manner. While the measurement unit 500 and the distance measurement unit 500 are measuring the distance between the substrate S and the mask 350, they are moved relative to each other to press them together or press them together. Including mechanism.

  [0014] The substrate S may be attracted and fixed by the electrostatic chuck 340, and may be disposed between the mask 350 and the distance measurement unit 500.

  [0015] The distance measurement unit 500 may include an optical sensor for measuring distance using light.

  [0016] The through holes 342 may be formed through the electrostatic chuck 340 so that light emitted from the optical sensor reaches the mask 350.

  [0017] The substrate S may cover at least a portion of the through hole 342.

  [0018] The optical sensor is a light emitting unit that irradiates the bottom surface of the exposed substrate S with light through the through hole 342, and a light receiving unit that receives light reflected from the substrate S and the mask 350 after passing through the through hole 342. May be included.

  [0019] The optical sensor may be a confocal sensor.

  [0020] The optical sensor may be a laser displacement sensor for emitting short-wavelength laser light.

  [0021] The distance measuring unit 500 may include a first distance measuring unit for measuring a relative distance to the mask 350 and a second distance measuring unit for measuring a relative distance to the substrate S.

  [0022] The first distance measurement unit may measure the relative distance to the mask 350 by irradiating the bottom surface of the mask sheet 351 of the mask 350 or the bottom surface of the mask frame 352 to which the mask sheet 351 is fixed with laser light.

  [0023] The through hole 342 may be formed through the electrostatic chuck 340 such that the laser light emitted from the first distance measuring unit reaches the mask 350.

  [0024] The substrate S may cover at least a part of the through hole 342, and the second distance measuring unit irradiates the exposed bottom surface of the substrate S with the laser beam through the through hole 342, The relative distance to the substrate S can be measured.

  [0025] A protrusion may be formed in the through hole 342 of the electrostatic chuck 340, and the protrusion 344 protrudes inside the through hole along the inner peripheral edge of the through hole to form the step 345. Alternatively, the second distance measuring unit may irradiate the step portion 345 formed by the protrusion 344 with laser light to measure the relative distance to the substrate S.

  [0026] A blocking member 346 may be installed in the through hole 342 of the electrostatic chuck 340, the blocking member 346 may block a part of the through hole 342, and the second distance measuring unit may By irradiating the member 346 with laser light, the relative distance to the substrate S can be measured.

  [0027] A plurality of through holes 342 may be formed along an edge of the electrostatic chuck 340.

  [0028] The substrate processing apparatus may include a controller for controlling the adhesion driving unit based on the gap between the substrate S and the mask 350 measured by the distance measuring unit 500.

  [0029] The substrate processing apparatus is a mask clamper 100 installed in the processing chamber 10 for fixing the mask 350 and a substrate clamper 200 installed in the processing chamber 10 for fixing the substrate carrier 320. Then, the substrate S is attracted and fixed to the substrate carrier by the electrostatic chuck 340, and the substrate clamper 200 and a mask for moving the substrate and the mask relative to each other so that the substrate S is brought into close contact with the mask 350. It may further include an adhesive driving unit installed on the clamper 110 and / or the substrate clamper 200.

  [0030] The substrate processing apparatus moves the substrate carrier 320 with respect to the mask 350 fixed by the mask clamper 110, and aligns the substrate S fixed by the substrate clamper 200 with the mask 350 fixed by the mask clamper 100. May further include an aligner 400.

  [0031] According to another aspect of the present disclosure, there is provided a substrate processing method using a substrate processing apparatus. The method includes moving the substrate relative to the mask such that they are in close contact with each other while the distance between the substrate S and the mask 350 is being measured by the distance measuring unit 500.

  [0032] The substrate processing method may include aligning the substrate S with the mask 350 before the substrate S is brought into close contact with the mask 350.

  [0033] In the substrate processing method, when the distance between the substrate S and the mask 350 measured by the distance measuring unit 500 after the alignment is determined to be equal to or smaller than the predetermined distance, When performing the substrate processing and determining that the distance between the substrate S and the mask 350 is larger than a predetermined distance, the method may include bringing the substrate S and the mask 350 into close contact with each other.

  [0034] According to an exemplary embodiment of the present disclosure, the substrate processing apparatus non-contactly measures the distance between the substrate S and the mask 350 when the substrate S and the mask 350 are in close contact with each other. Includes a distance measuring unit 500. Thereby, the process of aligning the substrate S with the mask 350 and bringing them into close contact with each other is performed much more easily and reliably, and the yield of substrate processing is greatly improved.

  [0035] Specifically, when the substrate S and the mask 350 are brought into contact as they are vertically oriented, the state of contact between the substrate S and the mask 350 can vary from position to position. Therefore, the distance between the substrate S and the mask 350 can be accurately determined at various positions by arranging the distance measurement unit 500 at a position where accurate measurement of the contact state is required (such as a position corresponding to the top of a rectangular substrate). It becomes possible to measure at once.

  [0036] Further, in the prior art, the contact state between the substrate S and the mask 350 is sensed by a camera, but sensing the contact state is not easy. In contrast, according to an exemplary embodiment of the present disclosure, an optical sensor, particularly a confocal sensor or a laser sensor, may contactlessly measure the distance between the substrate S and the mask 350. Used, and therefore, the contact state between the substrate S and the mask 350 can be measured accurately and reliably.

  [0037] Further, in accordance with an exemplary embodiment of the present disclosure, as the substrate S and the mask 350 are vertically oriented, an alignment structure for fixing and aligning the substrates S and the mask 350 comprises: Allows for excellent substrate processing when the mask 350 is vertically oriented.

It is sectional drawing which shows the Example of the existing OLED deposition apparatus. 1 is a cross-sectional view illustrating an alignment structure of a substrate processing apparatus according to an exemplary embodiment of the present disclosure, particularly illustrating a process of aligning a substrate and a mask and bringing them into close contact with each other. It is a top view which shows the through-hole of the electrostatic chuck in the alignment structure of FIG. 2C. FIG. 2C is a cross-sectional view illustrating the distance measuring unit according to the first exemplary embodiment in the alignment structure of FIG. 2C. FIG. 2C is a cross-sectional view illustrating the distance measurement unit according to the second exemplary embodiment in the alignment structure of FIG. 2C. FIG. 2C is a cross-sectional view illustrating a distance measuring unit according to a third exemplary embodiment in the alignment structure of FIG. FIG. 4C is a cross-sectional view illustrating a distance measuring unit according to a fourth exemplary embodiment in the alignment structure of FIG. 2C. It is sectional drawing which shows the structure and operation | movement of a mask clamper. It is sectional drawing which shows the structure and operation | movement of a board | substrate clamper. FIG. 2B is a side view showing an aligner in the alignment structure of FIGS. 2A to 2C. FIG. 4 is a plan view showing a process for aligning a substrate with a substrate carrier.

  [0049] In the following, exemplary embodiments of the present disclosure are described with reference to the accompanying drawings. 2A to 2C are cross-sectional views illustrating an alignment structure of a substrate processing apparatus according to an exemplary embodiment of the present disclosure, in particular, a process of aligning a substrate and a mask and bringing them into close contact with each other. Show. FIG. 3A is a plan view showing a through hole of the electrostatic chuck according to the first exemplary embodiment in the alignment structure of FIG. 2C. FIG. 3B is a cross-sectional view illustrating the distance measuring unit according to the first exemplary embodiment in the alignment structure of FIG. 2C. FIG. 4 is a sectional view showing a distance measuring unit according to the second exemplary embodiment in the alignment structure of FIG. 2C. FIG. 5 is a cross-sectional view illustrating a distance measuring unit according to a third exemplary embodiment in the alignment structure of FIG. 2C. FIG. 6 is a sectional view showing a distance measuring unit according to a fourth exemplary embodiment of the alignment structure of FIG. 2C. 7A and 7B are cross-sectional views showing the structure and operation of the mask clamper. 8A and 8B are cross-sectional views showing the structure and operation of the substrate clamper. FIG. 9 is a side view showing an aligner in the alignment structure of FIGS. 2A to 2C. FIG. 10 is a plan view showing a process for aligning a substrate with a substrate carrier.

  [0050] In a substrate processing apparatus according to an exemplary embodiment of the present disclosure, to perform substrate processing, the substrate S and the mask 350 are separately transferred into the processing chamber 10 and then the substrate S and the mask 350 may be adhered to each other or adhered to each other. The substrate processing apparatus may be any type of apparatus that performs substrate processing by using the mask 350 and aligning the substrate S with the mask 350 (eg, a deposition apparatus that evaporates a deposition material for deposition, an atomic layer deposition process). (A deposition apparatus for performing the above).

  [0051] A substrate processing apparatus according to an exemplary embodiment of the present disclosure includes a processing chamber 10 for providing a processing environment that is isolated from the outside, a substrate S and a mask 350 that are installed in the processing chamber 10 in a non-contact manner. At least one distance measuring unit 500 for measuring the distance between the substrate S and the mask 350 while the distance measuring unit 500 is measuring the distance between the substrate S and the mask 350 by moving them relative to each other. And an adhesion drive unit for bringing them into close contact with each other.

  [0052] According to the substrate processing apparatus, the substrate S and the mask 350 are separately transferred into the processing chamber 10, and the transferred substrate S and the mask 350 are fixed in the processing chamber 10, and the fixed substrate is fixed. The S and the mask 350 are aligned with each other by moving with respect to each other, and the aligned substrate S and the mask 350 are brought into close contact with each other. Next, the substrate processing apparatus performs the substrate processing.

  [0053] The substrate S and the mask 350, when oriented perpendicular to the ground, may be transferred into the processing chamber 10 and fixed therein.

  [0054] In contrast, the substrate S and the mask 350, when oriented horizontally relative to the ground, can be transferred into the processing chamber 10 and fixed therein.

  [0055] Preferably, the substrate S is transported as it is secured to the substrate carrier 320.

  [0056] The substrate carrier 320 is an element that moves the substrate S fixed thereto, and may have various structures depending on the mechanism for fixing the substrate S to the substrate carrier.

  [0057] According to an exemplary embodiment of the present disclosure, the substrate carrier 320 includes an electrostatic chuck 340 for attracting and securing the substrate by electrostatic forces, such that an upper surface of the electrostatic chuck 340 is exposed upward. , A frame 360 coupled to the electrostatic chuck 340, and a DC power source (not shown) installed in the frame 360 for supplying DC power to the electrostatic chuck 340 and controlling the supply.

  [0058] While the substrate carrier 320 is transferring the substrate S by electromagnetic force, the electrostatic chuck 340 attracts and fixes the substrate S. The electrostatic chuck 340 generates an electromagnetic force by receiving power from a DC power supply installed in the substrate carrier 320 or an external DC power supply.

  [0059] The DC power supply unit is installed in the frame 360, supplies DC power to the electrostatic chuck 340, and controls the supply of DC power. The DC power supply may have various configurations depending on the power supply system and the installation structure.

  [0060] Since the substrate carrier 320 is installed in the substrate processing system including the processing chamber 10 so as to move the substrate S by attracting and fixing the substrate S, the DC power supply is required to perform the processing. Power must be supplied to the electrostatic chuck 340 for a sufficient time. Preferably, the DC power supply is wirelessly controlled.

  [0061] To this end, the DC power supply includes a rechargeable battery (not shown) for supplying power to the electrostatic chuck 340, and a wireless control unit for wireless communication and control by an external controller. May be.

  [0062] The rechargeable battery is charged with DC power to supply DC power to the electrostatic chuck 340.

  [0063] The wireless communication unit controls the supply of DC power to the electrostatic chuck 340 and performs other controls on the substrate carrier 100 and the like based on wireless communication by an external controller.

  [0064] The DC power source is at least partially removably mounted on the substrate carrier 320.

  [0065] In addition, rechargeable batteries operate at very low pressure, ie, atmospheric pressure, which is above processing pressure. Therefore, the environment surrounding the rechargeable battery must be isolated from the outside.

  [0066] Accordingly, it is desirable that the DC power supply include a containment structure that provides a sealed interior space for installing the rechargeable battery so as to isolate the rechargeable battery from the processing environment.

  [0067] The frame 360 is coupled to an edge of the electrostatic chuck 340 to expose an upper surface of the electrostatic chuck 340 and may have various configurations.

  [0068] The substrate carrier 320 may be moved by rollers, magnetic levitation, or the like. This mechanism is not particularly limited here, as long as the substrate carrier 320 can enter and exit the processing chamber 10.

  [0069] To this end, the processing chamber 10 includes an element for transferring the substrate carrier 320 according to a mechanism for moving the substrate carrier 320.

  [0070] The substrate carrier 320 may be guided into and out of the processing chamber 10 by a substrate directing member 610 located within the processing chamber 10.

  [0071] The mask 350 may also be transferred into the processing chamber 10 in various ways.

  [0072] According to an exemplary embodiment of the present disclosure, mask 350 may be transported by rollers, magnetic levitation, or the like. This mechanism is not particularly limited here, as long as the mask 350 can enter and exit the processing chamber 10.

  [0073] To this end, the processing chamber 10 includes an element for transferring the mask 350 depending on the mechanism for moving the mask 350.

  [0074] The mask 350 is contacted with the substrate S to perform a substrate processing such as a patterned deposition.

  [0075] According to an exemplary embodiment of the present disclosure, mask 350 may be comprised of a mask sheet 351 having patterned openings 354, and a mask frame 352 to which mask sheet 351 is secured.

  [0076] The mask 350 may be connected to a mask carrier 370, and the mask carrier 370 transports a mask sheet 351 and a mask frame 352 fixed to the mask 350.

  [0077] The mask carrier 370 is an element for moving the mask frame 352 and the mask sheet 351 fixed to the mask carrier 370, and may have various structures depending on the mechanism for fixing the mask 350 to the mask carrier.

  [0078] The mask carrier 370 may be guided into and out of the processing chamber 10 by a mask guide member 620 located within the processing chamber 10.

  [0079] Additional elements required for substrate processing may be located within the processing chamber 10. For example, when the substrate processing is an atomic layer deposition processing, a structure for injecting a gas such as a source gas and a reaction gas in addition to the source 30 may be provided in the processing chamber 10.

  [0080] The processing chamber 10 is not particularly limited herein, as long as it can provide a processing environment for performing an evaporative deposition process.

  [0081] The processing chamber 10 may be formed from a container having an internal space with a gate through which the substrate S can pass.

  [0082] The container may have exhaust means for maintaining a predetermined pressure in the interior space.

  [0083] At least one source 30 is located within the processing chamber 10. The source 30 is not particularly limited here, as long as it can heat the deposited material to evaporate toward the substrate S.

  [0084] The source 30 evaporates a deposited material that includes at least one of an organic material, an inorganic material, and a metal material. The source may include, for example, a container containing the deposition material, and a heater for heating the container.

  [0085] In order to perform such a substrate processing, the processing chamber 10 has a positioning structure in which the substrate S is fixed to the mask 350 for positioning, and the substrates S are brought into close contact with each other.

  [0086] The alignment structure may be moved by moving the mask 350 while the substrate S is fixed, or by moving the substrate S while the mask 350 is fixed, or by moving the substrate S and the mask 350 The substrate S and the mask 350 can be aligned by moving both of them, or by a similar method.

  [0087] In the following, an embodiment of an alignment structure in which the substrate S is fixedly positioned on the mask 350 and they are brought into close contact will be described.

  [0088] The alignment structure includes a mask clamper (mask fixing device) 100 installed in the processing chamber 10 and a substrate carrier to which the substrate S is attracted and fixed by the electrostatic chuck 340, for fixing the mask 350. In order to move the substrate clamper (substrate fixing device) 200 for fixing and the substrate carrier 320 with respect to the mask 350 fixed by the mask clamper 110, and align the substrate S fixed by the substrate clamper 200 with the mask 350. And the above-described adhesion driving unit for bringing the substrate S and the mask 350 aligned by the aligner 400 into close contact with each other.

  [0089] The mask clamper 100 is installed in the processing chamber 10 and fixes the mask 350. The mask clamper 100 can have various configurations according to a mechanism for fixing the mask 350.

  [0090] According to an exemplary embodiment of the present disclosure, mask clamper 100 may secure mask 350 by magnetic force, screwing, fitting, or the like.

  [0091] Specifically, the mask 350 is connected to the mask clamper 100 so as to move and connect in a direction perpendicular to the surface of the mask transferred into the processing chamber 10.

  [0092] More specifically, the mask clamper 100 includes an insertion portion 110 into which the projection 310 protruding from the bottom surface of the mask 350 is inserted, and a projection 310 after the projection 310 is inserted into the insertion portion 110. May include a retaining portion 120 that retains the connection between the and the insertion portion 110.

  [0093] The protrusion 310 protruding from the bottom surface of the mask 350 is inserted into the insertion portion 110, and may have various configurations depending on the coupling mechanism.

  [0094] Alternatively, a groove may be formed instead of the protrusion 310 so that the insertion portion 110 is inserted into the bottom surface of the mask 350.

  [0095] The insert 110 may be connected to a protrusion 310 that protrudes from the bottom surface of the mask 350 and may have a groove 111.

  [0096] As shown in FIGS. 7A and 7B, the insertion section 110 is oriented in a direction perpendicular to the surface of the mask 350 transferred to the processing chamber 10 so that the projection section 310 is inserted into the insertion section 110. Go to

  [0097] After the protrusion 310 is inserted into the insertion portion 110, the holding portion 120 maintains the connection between the protrusion 310 and the insertion portion 110. The holding unit 120 can have various configurations.

  [0098] According to an exemplary embodiment of the present disclosure, the retaining portion 120 includes a spherical member 121 fitted into two or more holes 311 formed along the outer peripheral surface of the projection 310, and the projection. It may include a pressing member 123 that presses the spherical member 121 into the hole 311 when the 310 is inserted into the concave groove 111 of the insertion portion 110.

  [0099] The pressing member 123 is installed movably in the longitudinal direction (x-axis direction) within the housing forming the insertion portion 110, and can move so as to press the spherical member 121 into the hole 311.

  [00100] According to the exemplary embodiment of the present disclosure, the pressing member 123 can move in the longitudinal direction (x-axis direction) of the protrusion 310 so as to press the spherical member 121 into the hole 311. May have an inclined surface that comes into contact with the spherical member 121.

  [00101] Further, the pressing member 123 is moved in the longitudinal direction (x-axis direction) within the housing forming the insertion portion 110 by a hydraulic device (not shown) or the like.

  [00102] When the pressing member 123 presses the spherical member 121 into the hole 311 to maintain the pressing state, it is necessary to fix the pressing member 123 in the housing forming the insertion portion 110.

  [00103] For this purpose, the pressing member 123 can be fixed by a fixing member 125 installed around the housing forming the insertion part 110.

  [00104] The fixing member 125 is installed around the housing forming the insertion portion 110, and fixes the pressing member 123. In particular, the fixing member 125 may be formed as a ring-shaped tube, and may expand by an internal hydraulic pressure or air pressure to directly or indirectly press and fix the pressing member 123.

  [00105] With the above-described configuration, the holding unit 120 can maintain the connection between the protrusion 310 and the insertion unit 110 by pressing the spherical member 121 into the hole 311. The position can be accurately corrected. Thus, the aligner 400 can quickly and accurately align the mask 350 with the substrate S.

  [00106] The substrate clamper 200 is installed in the processing chamber 10, and fixes the substrate carrier 320 to which the substrate S is attracted and fixed by the electrostatic chuck 340. The substrate clamper 200 can have various configurations according to a mechanism for fixing the substrate S.

  [00107] According to an exemplary embodiment of the present disclosure, substrate clamper 200 may secure substrate carrier 320 by magnetic force, screwing, fitting, or the like.

  [00108] Specifically, the substrate carrier 320 is connected to the substrate clamper 200 so as to move and connect in a direction perpendicular to the surface of the substrate carrier 320 transferred into the processing chamber 10.

  [00109] More specifically, the substrate clamper 200 includes the insertion portion 110 into which the protrusion 321 protruding from the bottom surface of the substrate carrier 320 is inserted, and the protrusion 321 after the protrusion 321 is inserted into the insertion portion 210. A holding part 220 that holds a connection between the insertion part 321 and the insertion part 210 may be included.

  [00110] The protruding portion 321 protruding from the bottom surface of the substrate carrier 320 is inserted into the insertion portion 210, and may have various configurations depending on the coupling mechanism.

  [00111] Alternatively, a groove may be formed instead of the protrusion 321 so that the insertion portion 210 is inserted into the bottom surface of the substrate carrier 320.

  [00112] The insert 210 may be coupled to a protrusion 321 that protrudes from the bottom surface of the substrate carrier 320 and may have a concave groove 211.

  [00113] As shown in FIGS. 8A and 8B, the insertion section 210 is perpendicular to the surface of the substrate carrier 320 transferred to the processing chamber 10 so that the projection 321 is inserted into the insertion section 210. Move in the direction.

  [00114] After the protrusion 321 is inserted into the insertion portion 210, the holding portion 220 maintains the connection between the protrusion 321 and the insertion portion 210. The holding section 220 can have various configurations.

  [00115] According to an exemplary embodiment of the present disclosure, the retaining portion 220 includes a spherical member 221 fitted in two or more holes 322 formed along the outer peripheral surface of the projection 321, and the projection. A pressing member 223 that presses the spherical member 221 into the hole 322 when the 321 is inserted into the concave groove 211 of the insertion portion 210 may be included.

  [00116] The pressing member 223 is installed movably in the longitudinal direction (x-axis direction) within the housing forming the insertion portion 210, and can move so as to press the spherical member 221 into the hole 322.

  [00117] According to the exemplary embodiment of the present disclosure, the pressing member 223 can move in the longitudinal direction (x-axis direction) of the protrusion 321 so as to press the spherical member 221 into the hole 322. May have an inclined surface that comes into contact with the spherical member 221.

  [00118] Further, the pressing member 223 is moved in the longitudinal direction (x-axis direction) within the housing forming the insertion portion 210 by a hydraulic device (not shown) or the like.

  [00119] When the pressing member 223 presses the spherical member 221 into the hole 322 to maintain the pressing state, it is necessary to fix the pressing member 223 in the housing forming the insertion portion 210.

  [00120] For this purpose, the pressing member 223 may be fixed by a fixing member 225 installed around the housing forming the insert 210.

  [00121] The fixing member 225 is installed around the housing forming the insertion portion 210, and fixes the pressing member 223. In particular, the fixing member 225 may be formed as a ring-shaped tube, and may be expanded by an internal hydraulic pressure or air pressure to press or fix the pressing member 223 directly or indirectly.

  [00122] With the above-described configuration, the holding portion 220 can maintain the connection between the protrusion 321 and the insertion portion 210 by pressing the spherical member 221 into the hole 321. The position can be accurately corrected. Thus, the aligner 400 can quickly and accurately align the mask 350 with the substrate S.

  [00123] The aligner 400 moves the substrate carrier 320 with respect to the mask 350 fixed by the mask clamper 110, and aligns the substrate S fixed by the substrate clamper 200 with the mask 350. The alignment device can have various configurations depending on the alignment mode.

  [00124] According to an exemplary embodiment of the present disclosure, as shown in FIG. 9, the aligner 400 moves the mask 350 or the substrate S in a direction parallel to the substrate S. The moving unit 410, the second linear moving unit 420, and the third linear moving unit 440 may be included.

  [00125] The first linear moving section 410, the second linear moving section 420, and the third linear moving section 440 may be perpendicular to each other, and may move the mask 350 or the substrate S parallel to the substrate S. In any direction. These may have various configurations depending on the mechanism (eg, screw jack system, belt system, and piezoelectric system) that moves the substrate S or the mask 350 linearly.

  [00126] The first linear moving unit 410, the second linear moving unit 420, and the third linear moving unit 440 move linearly in a direction parallel to respective sides of the rectangular substrate S. And conforms to the shape of the rectangular substrate S.

  [00127] Since the mask 350 and the substrate S are fixed and aligned with respect to each other as they are vertically aligned, misalignment can occur due to, for example, backlash in the mechanical linear drive of the screw jack.

  [00128] In order to prevent misalignment due to backlash, the linear movement directions of the first linear movement unit 410, the second linear movement unit 420, and the third linear movement unit 430 are shown in FIG. , May be at right angles to each other and may be inclined with respect to the vertical.

  [00129] The first linear moving part 410, the second linear moving part 420, and the third linear moving part 430 are inclined with respect to the vertical direction, and the first linear moving part 410, the second linear moving part The weight of the portion 430 and all of the third linearly moving portion 430 acts vertically to prevent misalignment due to backlash.

  [00130] Aligner 400 may be located within substrate clamper 200 and / or mask clamper 110.

  [00131] In particular, more than one substrate clamper 200 and more than one mask clamper 110 may be installed at multiple points, respectively, with respect to substrate S and mask 350. Aligner 400 may be configured to align substrate clamper 200 or mask clamper 100 together.

  [00132] As another example, more than one substrate clamper 200 and more than one mask clamper 110 may be installed at a plurality of points relative to substrate S and mask 350, respectively. Aligner 400 may be configured to separately align substrate clamper 200 or mask clamper 100.

  [00133] As described above, if the substrate S and the mask 350 are not accurately aligned with each other, an error may occur in forming a pattern on the substrate S, and the yield will be reduced. Therefore, it is very important to align the substrate S with the mask 350 before performing the deposition process.

  [00134] Incidentally, for substrate processing, the substrate S is transferred alone or is fixed to and transferred to the substrate carrier 320, the latter being more general.

  [00135] If the substrate S is not accurately fixed on the substrate carrier 320, a subsequent process of aligning the substrate S with the mask 350 may be delayed, or a problem may occur in performing the substrate process.

  [00136] In particular, in some processes, the substrate S may be turned upside down (ie, flipped over or vertically oriented) when secured to the substrate carrier 320, such that the substrate S The connection and alignment with the substrate carrier 320 is very important.

  [00137] Therefore, when the substrate S is mounted on the substrate carrier 320, it is desirable to perform an alignment between the substrate carrier 320 and the substrate S.

  [00138] FIG. 10 is a plan view showing a process for aligning the substrate S with the substrate carrier 320.

  [00139] In particular, the first mark M1 on the substrate S and the substrate when the substrate S and the substrate carrier 320 are vertically oriented while being separated from each other before the substrate S is mounted on the substrate carrier 320. By using the second mark M2 on the carrier 320, the substrate S is aligned with the substrate carrier 320.

  [00140] The process of aligning the substrate S with the substrate carrier 320 is substantially the same as or similar to the alignment process between the mask 350 and the substrate S described above, and is therefore described in detail. Omitted.

  [00141] The adhesion drive unit brings the substrate 350 and the mask 350 that have been aligned by the aligner 400 into close contact with each other. The adhesive driving unit may include a linear driving unit installed in the substrate clamper 200 and / or the mask clamper 110 to bring the mask 350 into close contact with the substrate S.

  [00142] By the way, when the substrate S and the mask 350 are not in close contact with each other, a space may be formed between the substrate S and the mask 350, and particles such as a deposition material or a by-product may be formed in the space. May be introduced. As a result, substrate processing may fail.

  [00143] In particular, when the substrate S and the mask 350 are introduced into the processing chamber 10 as they are vertically oriented, the substrate S and the mask 350 are in close contact because the mask 350 is not pressed by its own weight. It is important to check whether.

  [00144] In view of the above, according to the exemplary embodiment of the present disclosure, the substrate processing apparatus determines whether the substrate S and the mask 350 are in close contact with each other when the substrate S and the mask 350 are brought into contact with each other by the adhesive driving unit. To this end, a distance measuring unit 500 for non-contactly measuring the distance between the substrate S and the mask 350 is included.

  [00145] The distance measurement unit 500 measures the distance between the substrate S and the mask 350 in a non-contact manner. The distance measurement unit 500 can have various configurations.

  [00146] Various non-contact distance sensors may be used as long as the distance between the substrate S and the mask 350 can be measured in a non-contact manner.

  [00147] For example, the distance measurement unit 500 may include an optical sensor that measures distance using light including monochromatic light, such as a laser or light in the visible range.

  [00148] The distance measurement unit 500 may be disposed on one side of the electrostatic chuck 340 such that the substrate S is positioned between the distance measurement unit 500 and the mask 350.

  [00149] That is, the substrate S can be disposed between the mask 250 and the distance measurement unit 500 when attracted and fixed by the electrostatic chuck 340.

  [00150] For example, the distance measurement unit 500 may be installed outside the processing chamber 10 with respect to one side surface of the processing chamber 10 located between the distance measurement unit 500 and the electrostatic chuck 340.

  [00151] A window glass may be installed on a side of the processing chamber 10 located between the distance measuring unit 500 and the electrostatic chuck 340, so that light emitted from the distance measuring unit 500 is transmitted through the window glass. can do.

  [00152] Hereinafter, the distance measuring unit 500 according to the first exemplary embodiment of the present disclosure will be described with reference to FIG. 3B.

  [00153] According to the first exemplary embodiment, a through hole 342 may be formed in the electrostatic chuck 340 such that light emitted from the optical sensor of the distance measuring unit 500 reaches the mask 350.

  [00154] As shown in FIG. 3A, more than one through hole 342 may be formed in the electrostatic chuck 340 along the outer periphery of the electrostatic chuck 340.

  [00155] When the substrate S and the mask 350 are brought into close contact as they are vertically oriented, the contact state between the substrate S and the mask 350 may be different between the upper side and the lower side. Therefore, it is preferable that the through hole 342 is formed at a position corresponding to the vertex of the rectangular substrate S where accurate sensing of the contact state is required.

  [00156] If more than one through hole 342 is formed, more than one distance measuring unit 500 may be installed.

  [00157] The substrate S may cover some or all of the through holes 342.

  [00158] According to the first exemplary embodiment, the optical sensor of the distance measuring unit 500 includes a light emitting unit that irradiates light to the exposed bottom surface of the substrate S through the through hole 342, and the through hole 342. It may include a light receiving unit that receives light reflected from the substrate S and the mask 350 after passing therethrough.

  [00159] The optical sensor may be various optical sensors (such as a confocal sensor or a laser displacement sensor) for irradiating short-wavelength laser light.

  [00160] When the confocal sensor is used as an optical sensor, light emitted from the light emitting unit passes through the through hole 342, passes through the substrate S made of a transparent material such as glass, and then passes through the substrate S , The top surface of the substrate S, and the bottom surface of the mask 350 (the mask sheet 351 of the mask 350 or the bottom surface of the mask frame 352 to which the mask sheet 351 is fixed).

  [00161] The light receiving unit receives light reflected from the bottom surface of the substrate S, the top surface of the substrate S, and the bottom surface of the mask 350, and based on the intensity of various wavelengths of the received light, the bottom surface of the substrate S, The distances to the top surface and the bottom surface of the mask 350 are measured at the same time.

  [00162] In this manner, the distance between substrate S and mask 350 can be measured.

  [00163] Particularly, when the confocal sensor is used as an optical sensor, the bottom surface of the substrate S, the substrate, The distance to the top surface of S and the bottom surface of the mask 350 can be measured simultaneously.

  [00164] Further, so that the mask 350 and the substrate S can be accurately aligned and brought into close contact with each other, the confocal sensor is provided between the substrate S and the mask 350 (the mask sheet 351 or the mask frame 352). Distance can be measured with high accuracy.

  [00165] Furthermore, as described above, since the confocal sensor can accurately measure the distance, less is required to measure the distance between the substrate S and the mask 350 than other distance measurement units. A number of sensors may be provided.

  [00166] When another optical sensor is used, a number of through holes 342 are formed at various positions along the edge of the substrate S, and a plurality of optical sensors are respectively installed in the through holes 342 for distance measurement. You. In contrast, by using a confocal sensor as an optical sensor, the optical sensor can accurately measure the distance, so that the sensor can be positioned at one or two positions, and the substrate S and the mask can be measured. The distance to 350 can be measured.

  [00167] The distances at various positions where the distance measurement unit 500 using the confocal sensor is not installed can be corrected through a warm-up operation, an experiment, or the like.

  [00168] Hereinafter, the distance measuring unit 500 according to the second exemplary embodiment of the present disclosure will be described in detail with reference to FIG. 4, and will focus on differences from the first exemplary embodiment. Hit.

  [00169] According to the second exemplary embodiment, the distance measuring unit 500 includes a first distance measuring unit installed in the processing chamber 10 and a substrate S for measuring a relative distance to the mask 350. May include a second distance measurement unit installed in the processing chamber 10 for measuring a relative distance with respect to.

  [00170] Unlike the first exemplary embodiment in which a single distance measuring unit 500 measures the distance between the substrate S and the mask 350, the distance measuring unit according to the second exemplary embodiment is different from the first exemplary embodiment. , A first distance measuring unit and a second distance measuring unit.

  [00171] The distance measuring unit 500 determines the distance between the substrate S based on the relative distance L1 between the first distance measuring unit and the mask 350 and the relative distance L2 between the second distance measuring unit and the substrate S. The distance to the mask 350 can be measured.

  [00172] Preferably, the first distance measurement unit and the second distance measurement unit are installed on the same virtual measurement reference line R perpendicular to the relative distances L1 and L2 in order to accurately measure the distance. You.

  [00173] The first distance measuring unit may measure the relative distance L1 to the mask 350 by irradiating the bottom surface of the mask sheet 351 of the mask 350 or the bottom surface of the mask frame 352 to which the mask sheet 351 is fixed with laser light. .

  [00174] The first distance measurement unit may irradiate the laser light to the exposed bottom surface of the mask 350 through a through hole 342 formed in the electrostatic chuck 340, or The bottom surface of the mask 350 extending beyond the outer periphery and not covered by the electrostatic chuck 340 (in particular, the bottom surface of the mask frame 342) may be irradiated with laser light.

  [00175] The second distance measuring unit irradiates the exposed bottom surface of the substrate S or the bottom surface of the electrostatic chuck 340 with the laser beam through the through hole 342 to measure the relative distance L2 to the substrate S. obtain.

[00176] Therefore, the distance D between the substrate S and the mask 350 is a relative distance L1 from the first distance measurement unit to the mask 350, and a second distance, as represented by the following equation 1. It can be obtained from the relative distance L2 from the measurement unit to the substrate S.
[Equation 1]
D = L1-L2-T
Here, T represents the thickness of the substrate S.

  [00180] Hereinafter, the distance measurement unit 500 according to the third exemplary embodiment of the present disclosure will be described in detail with reference to FIG. 5, and will focus on differences from the first and second embodiments. Hit.

  [00181] According to a third exemplary embodiment, as shown in FIG. 5, a protrusion 344 may be formed in the through hole 342 of the electrostatic chuck 340 and penetrate to form a step 345. It protrudes inward along the inner circumference of the hole 342.

  [00182] The second distance measuring unit can measure the relative distance to the substrate S by irradiating the step portion 345 formed by the protrusion 344 with laser light.

[00183] Therefore, the distance D between the substrate S and the mask 350 is a relative distance L1 from the first distance measurement unit to the mask 350, and a second distance, as represented by the following equation 2. It can be obtained from the relative distance L2 from the measurement unit to the substrate S.
[Equation 2]
D = L1-L2-Tt
Here, T represents the thickness of the substrate S, and t represents the thickness of the protrusion 344.

  [00187] Hereinafter, the distance measuring unit 500 according to the fourth exemplary embodiment of the present disclosure will be described in detail with reference to FIG. 6, and will focus on differences from the first to third embodiments. Hit.

  [00188] According to the fourth exemplary embodiment, a blocking member 346 that shields a part of the through hole 342 of the electrostatic chuck 340 can be installed in the through hole 342 as shown in FIG.

  [00189] The second distance measuring unit can measure the relative distance to the substrate S by irradiating the blocking member 346 with laser light.

[00190] Therefore, the distance D between the substrate S and the mask 350 is a relative distance L1 from the first distance measurement unit to the mask 350, and a second distance, as represented by the following Equation 3. It can be obtained from the relative distance L2 from the measurement unit to the substrate S.
[Equation 3]
D = L1-L2-TS
Here, T represents the thickness of the substrate S, and S represents the thickness of the blocking member 346.

  [00194] The blocking member 346 to which the laser light from the second distance measuring unit is irradiated is a target for measuring the distance. The blocking member 346 can be made from glass or quartz, but is not limited thereto.

  [00195] The blocking member 346 may be installed in the through hole 342 in various shapes and various modes as long as it can block a part of the through hole 342.

  [00196] For example, the blocking member 346 may be a ring-shaped member provided on the inner periphery or edge of the through hole 342.

  [00197] The blocking member 346 is preferably installed at the side edge of the through hole 342 through which the substrate S is drawn for accurate distance measurement. However, it should be understood that this is merely illustrative.

  [00198] The distance measuring unit 500 measures the distance between the substrate S and the mask 350 in order to detect the contact state between the substrate S and the mask 350. The distance information can be used to control the electrostatic chuck 340, the bonding drive, and the like.

  [00199] Therefore, the substrate processing apparatus according to the exemplary embodiment of the present disclosure is configured to control the adhesion driving unit based on the distance between the substrate S and the mask 350 measured by the distance measuring unit 500. A controller may be included.

  [00200] For this purpose, it is necessary to transmit the distance information sensed by each distance measuring unit 500 to a controller (not shown) of the substrate processing apparatus.

  [00201] The distance measurement unit 500 installed in the processing chamber 10 is a wireless communication unit for transmitting distance information measured by the distance measurement unit 500 to a controller installed outside the processing chamber 10, or a wireless communication unit. A communication unit (not shown) for performing communication may be included.

  [00202] The communication unit transmits the distance information measured by the distance measurement unit 500 to a controller installed outside the processing chamber 10 in a wired mode or a wireless mode. The communication unit can have various configurations.

  [00203] The configuration of the distance measuring unit 500 described above may be equally applied to a substrate processing apparatus for processing the substrate S in either the vertical alignment or the horizontal alignment.

  [00204] A substrate processing method using the substrate processing apparatus having the above-described configuration will be described below. According to the substrate processing method, while the distance between the substrate S and the mask 350 is being measured by the distance measuring unit 500, the substrate S and the mask 350 can be moved and brought into close contact with each other.

  [00205] The distance between the substrate S and the mask 350 is determined by a first distance measuring unit for measuring a relative distance to the mask 350 and a second distance measuring unit for measuring a relative distance to the substrate S. Can be measured.

  [00206] The first distance measurement processing and the second distance measurement processing are performed by the above-described distance measurement unit 500, and a detailed description thereof will be omitted.

  [00207] In particular, the substrate processing method includes the steps of: introducing the substrate S and the mask 350 into the processing chamber 10; and setting the distance measuring unit 500 before aligning the substrate S and the mask 350 using the aligner 400. Measuring the position of the substrate S (distance to the substrate S) and the position of the mask 350 (distance to the mask 350), while measuring the distance between the substrate S and the substrate 350; After the substrate S and the mask 350 are moved relative to each other to a predetermined gap G therebetween, a step of aligning the substrate S with the mask 350, and a step of bringing the substrate S into close contact with the mask 350 after the alignment. May be included.

  [00208] In the substrate processing method, after the substrate S and the mask 350 are brought into close contact with each other, the distance measuring unit 500 determines the distance (gap) between the substrate S and the mask 350. The method may include performing the substrate processing only when it is determined that the distance is equal to or smaller than the predetermined distance.

  [00209] Preferably, the gap G ranges from 50 to 500 μm, and the reference distance ranges from 0 to 100 μm.

  [00210] After measuring the distance between the substrate S and the mask 350, a deposition process for evaporating a deposition material, a deposition process for performing an atomic layer deposition process, or the like can be performed.

[00211] When the distance between the substrate S and the mask 350 measured by the distance measuring unit 500 is larger than a predetermined distance, the above-described substrate processing method may be executed again.

Claims (15)

A substrate processing apparatus,
A processing chamber for providing a processing environment isolated from the outside;
At least one distance measurement unit for measuring a distance between the substrate and the mask transferred in a non-contact manner into the processing chamber; and the distance becomes equal to or smaller than a preset reference distance. As described above, a substrate processing apparatus including an adhesion drive unit for adhering the substrate and the mask to each other. The distance measurement unit includes an optical sensor,
The substrate processing apparatus according to claim 1, wherein the substrate is disposed between the mask and the light sensor. The substrate is attracted and fixed by an electrostatic chuck,
The substrate processing apparatus according to claim 2, wherein the electrostatic chuck is provided with a through-hole penetrating the electrostatic chuck so that light emitted from the optical sensor reaches the mask.   The substrate processing apparatus according to claim 3, wherein the substrate covers at least a part of the through hole. The substrate is made of a light transmissive material;
The substrate processing apparatus according to claim 2, wherein the optical sensor is a confocal sensor.   The substrate processing apparatus according to claim 2, wherein the optical sensor is a laser displacement sensor that emits a short-wavelength laser beam. The distance measurement unit,
A first distance measuring unit that irradiates a laser beam to one surface of the mask exposed through the through hole and measures a relative distance to the mask; and one surface of the substrate or the electrostatic chuck exposed through the through hole 4. The substrate processing apparatus according to claim 3, further comprising a second distance measurement unit that irradiates one surface of the substrate with a laser beam and measures a relative distance to the substrate. 5.   8. The first distance measurement unit measures a relative distance to the mask by irradiating a laser beam to a bottom surface of the mask sheet of the mask or one surface of a mask frame to which the mask sheet is fixed. 9. 3. The substrate processing apparatus according to claim 1. The through-hole is provided with a protruding portion that protrudes inside the through-hole along an inner peripheral edge of the through-hole to form a step,
The substrate processing apparatus according to claim 7, wherein the second distance measurement unit irradiates a laser beam to the step formed by the projection to measure a relative distance to the substrate. The through hole of the electrostatic chuck is provided with a blocking member that covers a part of the through hole,
The substrate processing apparatus according to claim 7, wherein the second distance measuring unit irradiates the blocking member with laser light to measure a relative distance to the substrate.   The substrate processing apparatus according to claim 3, wherein a plurality of the through holes are formed along an edge of the electrostatic chuck. A mask clamper installed in the processing chamber for fixing the mask,
A substrate clamper installed in the processing chamber for fixing a substrate carrier on which the substrate is adsorbed and fixed by the electrostatic chuck; and a gap between the fixed mask and the fixed substrate carrier. 2. The apparatus according to claim 1, further comprising: an aligner that aligns the substrate and the mask by relative movement, wherein the adhesive driving unit is installed on at least one of the mask clamper and the substrate clamper. 3. 12. The substrate processing apparatus according to claim 11. A substrate processing apparatus,
A processing chamber for providing a processing environment isolated from the outside;
At least one distance measuring unit for measuring a distance between a substrate and a mask which are respectively vertically transferred and installed in the processing chamber in a non-contact manner;
An aligner that aligns the substrate and the mask by a relative movement between the substrate and the mask, and a distance between the aligned substrate and the mask, a predetermined reference distance and A substrate processing apparatus, comprising: a bonding drive unit that bonds the substrate and the mask to each other so as to be equal or smaller. A substrate processing method,
Transporting the substrate and the mask vertically, respectively, introducing the substrate and the mask into a processing chamber;
Aligning the substrate and the mask by relative motion between the substrate and the mask;
Bonding the substrate and the mask together such that a distance between the substrate and the mask measured in a non-contact manner is equal to or less than a preset reference distance. , Substrate processing method.   The method of claim 14, further comprising: adhering the substrate and the mask to each other up to the preset interval before the substrate and the mask are aligned.

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