JP2020204063A - Plating device - Google Patents

Abstract

To provide a plating device that can control a component of plating solution in an electroless plating tank from changing as compared to when a tube body is immersed into the plating solution and the whole outer peripheral surface of the tube body comes into contact with the plating solution.SOLUTION: A bottomed cylindrical body covers an outer peripheral surface of an end part of a tube body from a radial direction of the tube body, has a bottom and includes a contact part that brings part alienated from an end of the end part of the tube body into contact with an inner peripheral surface of the bottomed cylindrical body across the whole circumference.SELECTED DRAWING: Figure 1

Description

The present invention relates to a plating apparatus.

Patent Document 1 describes a fixing belt provided with a metal layer having a substantially constant thickness that generates heat by electromagnetic induction on the surface of a heat-resistant resin seamless belt having a surface roughness of 5 μm or more, and a release layer on the outermost peripheral surface. Is described.

Japanese Unexamined Patent Publication No. 2002-351238

When a metal layer is formed on the outer peripheral surface of a resin tube by electroless plating, the tube held by the jig is immersed in a plating solution. Conventionally, when the tube body is held by a jig, the entire outer peripheral surface including both ends of the tube body is exposed to the outside, and the entire outer peripheral surface of the tube body comes into contact with the plating solution. Therefore, a metal layer is formed on the entire outer peripheral surface of the tubular body.

Here, as a pretreatment for forming a metal layer on the outer peripheral surface of the resin tube by electroless plating, a blast treatment for making the outer peripheral surface of the tube uneven may be performed. However, this blasting treatment may not be applied to both ends of the outer peripheral surface of the tubular body. In such a case, if a metal layer is formed on the entire outer peripheral surface of the tubular body, the metal layers at both ends of the outer peripheral surface of the tubular body are peeled off in the electroless plating tank, which is a component of the plating solution. Will change.

An object of the present invention is that when the tube body is immersed in the plating solution, the composition of the plating solution in the electroless plating tank changes as compared with the case where the entire outer peripheral surface of the tube body comes into contact with the plating solution. It is to suppress.

The plating apparatus of the first aspect includes a bottomed cylindrical body that covers the outer peripheral surface of the end portion of the tube body from the radial direction of the tube body, a portion of the end portion of the tube body that is separated from the end, and the bottomed cylindrical body. It is characterized by including a contact portion that contacts the inner peripheral surface on the entire circumference and a electroless plating tank containing a plating solution in which the tube body is immersed.

The plating apparatus of the second aspect includes a support portion for supporting the tube body from the inside in the plating apparatus according to the first aspect, and the contact portion is arranged in an annular shape between the tube body and the support portion. The end portion of the tube body separated from the end is pressed from the inside of the tube body against the inner peripheral surface of the bottomed cylindrical body.

The plating apparatus according to the third aspect is the plating apparatus according to the second aspect, wherein the support portion is a stepped cylinder having a small diameter portion whose end portion is reduced in diameter, and the contact portion has a cross section in a free state. A state in which the bottomed cylinder is formed in a circular shape and is arranged in the small diameter portion of the support portion, the bottomed cylinder is detachable from the support portion, and the bottomed cylinder is attached to the support portion. A protruding member that is arranged between the bottom of the bottomed cylinder and the contact portion and applies a pressing force to the contact portion from the axial direction of the tubular body to project the contact portion in the radial direction. It is characterized by being prepared.

The plating apparatus of the fourth aspect is the plating apparatus according to any one of the first to third aspects, wherein the bottomed cylindrical body is formed of a conductive material, and a voltage is applied to the bottomed cylindrical body. A power supply device to be used, a connection portion for electrically connecting the power supply device and the bottomed cylindrical body, and another plating solution in which the tube body immersed in the plating solution of the electroless plating tank is immersed. It is characterized by being provided with a provided electrolytic plating tank.

The plating apparatus according to the fifth aspect is the plating apparatus according to the fourth aspect, which is formed of a conductive material, one end of which is attached to the bottomed cylinder, and the other end of which is in contact with the outer peripheral surface of the tube. It is characterized by having a conductive portion.

According to the plating apparatus of the first aspect, when the tube body is immersed in the plating solution, the components of the plating solution in the electroless plating tank are different from those in which the entire outer peripheral surface of the tube body comes into contact with the plating solution. It can be suppressed from changing.

According to the plating apparatus of the second aspect, the tubular body can be easily pressed against the inner peripheral surface of the bottomed cylinder as compared with the case where the inner peripheral surface of the bottomed cylinder is pressed against the tubular body from the outside in the radial direction of the tubular body. Can be pressed against.

According to the plating apparatus of the third aspect, the tube body can be easily attached to the support portion to which the contact portion is attached, as compared with the case where the contact portion always protrudes in the radial direction.

According to the plating apparatus of the fourth aspect, the man-hours can be reduced as compared with the case where a dedicated part having only an electrode function is attached and detached.

According to the plating apparatus of the fifth aspect, the current flowing from the tube body to the bottomed cylinder can be stabilized as compared with the case where the conductive portion is not provided.

(A) (B) is an enlarged cross-sectional view and an enlarged side view showing a cap, an O-ring, and the like provided in the plating apparatus according to the embodiment of the present invention. (A) (B) (C) (D) (E) It is an enlarged process drawing which showed the process of attaching the cap, the O-ring, etc. provided in the plating apparatus which concerns on embodiment of this invention to a support part. (A) (B) (C) (D) (E) It is a process drawing which showed the process of attaching the cap, the O-ring, etc. provided in the plating apparatus which concerns on embodiment of this invention to a support part. It is an exploded perspective view which showed the cap, the O-ring and the like provided in the plating apparatus which concerns on embodiment of this invention. It is a state diagram which showed the state which the belt is immersed in the electroless plating tank by using the plating apparatus which concerns on embodiment of this invention. It is a state diagram which showed the state which the belt is immersed in the electrolytic plating tank by using the plating apparatus which concerns on embodiment of this invention. It is a side view which showed the whole of the plating apparatus which concerns on embodiment of this invention. It is a perspective view which showed the whole of the plating apparatus which concerns on embodiment of this invention. It is an enlarged side view which showed the cap, the O-ring and the like provided in the plating apparatus which concerns on the comparative embodiment with respect to the Embodiment of this invention.

An example of the plating apparatus according to the embodiment of the present invention will be described with reference to FIGS. 1 to 9. The arrow H shown in each figure indicates the device vertical direction, the arrow W indicates the device width direction, and the arrow D indicates the device depth direction. The plating apparatus 10 of the present embodiment forms a metal layer on the surface of the belt 100, and the belt 100 on which the metal layer is formed is used as an example for the fixing belt of the image forming apparatus.

The belt 100 is a tubular body formed of polyimide, which is a resin material. In this embodiment, as an example, the belt 100 has a thickness of 0.07 [mm], an inner diameter of 30 [mm], and an axial length of 400 [ mm]. The belt 100 is an example of a tubular body.

(overall structure)
As shown in FIG. 8, the plating apparatus 10 includes an electroless nickel tank 12 containing a plating solution for electroless nickel plating (hereinafter referred to as “electroless nickel plating solution”) and a plating solution for electrolytic copper plating (hereinafter referred to as “electroless nickel plating solution”). It is provided with an electrolytic copper tank 16 containing an "electroless copper plating solution"). Further, the plating apparatus 10 includes an electrolytic nickel tank 22 containing a plating solution for electrolytic nickel plating (hereinafter referred to as “electrolytic nickel plating solution”). The electroless nickel tank 12, the electrolytic copper tank 16, and the electrolytic nickel tank 22 are arranged from one end side in the device width direction (left side in the figure) to the other end side in the device width direction (right side in the figure). The electroless nickel tank 12 is an example of an electroless plating tank, and the electrolytic copper tank 16 and the electrolytic nickel tank 22 are examples of an electrolytic plating tank.

Further, the plating apparatus 10 includes a plurality of (for example, 10) jigs 50 for holding a plurality of (for example, 10) belts 100, a hanger 26 for suspending the 10 jigs 50, and a hanger 26. Is provided with a first moving unit 40 for moving the device in the width direction of the device. Further, the plating apparatus 10 includes a second moving portion 44 for moving the hanger 26 in the vertical direction of the apparatus.

[Electroless nickel tank 12, electrolytic copper tank 16, electrolytic nickel tank 22]
As shown in FIG. 8, the electroless nickel tank 12 has a box shape with an open upper part, and contains an electroless nickel plating solution containing nickel inside. The depth of the electroless nickel plating solution placed in the electroless nickel tank 12 is such that the belt 100 and the jig 50 holding the belt 100 are all immersed.

The electrolytic copper tank 16 has a box shape with an open upper part, and contains an electrolytic copper plating solution containing copper ions. Further, the depth of the electrolytic copper plating solution put in the electrolytic copper tank 16 is such that the belt 100 and the jig 50 holding the belt 100 are all immersed.

The electrolytic nickel tank 22 has a box shape with an open upper part, and contains an electrolytic nickel plating solution containing nickel ions. The depth of the electrolytic nickel plating solution contained in the electrolytic nickel tank 22 is such that the belt 100 and the jig 50 holding the belt 100 are all immersed.

[Jig 50]
As shown in FIG. 4, the jig 50 includes a columnar support portion 52 that supports the belt 100 from the inside, and caps 56 that are attached to both ends of the support portion 52, respectively. The cap 56 is an example of a bottomed cylinder. The details of the jig 50 will be described later.

[Hanger 26]
As shown in FIGS. 7 and 8, the hanger 26 includes a mounting rod 26a extending in the vertical direction and having a cap 56 attached to the lower end, a main body 26b to which the upper end of the mounting rod 26a is attached, and a main body. A mounting portion 26c for mounting the portion 26b on the first moving portion 40 is provided.

Five mounting rods 26a are arranged at intervals in the device depth direction, and two rows in which five mounting rods 26a are arranged are provided in the device width direction. A mounting tool (not shown) to which the cap 56 is mounted is provided at the lower end of the mounting rod 26a.

The main body 26b has a rectangular frame shape extending in the depth direction of the device when viewed from above, and the upper end of the mounting rod 26a is attached to the long side of the main body 26b.

The mounting portion 26c has a U-shape with an opening at the bottom when viewed from the width direction of the device, and both ends of the mounting portion 26c are attached to the short sides of the main body portion 26b, respectively.

[First moving unit 40, second moving unit 44]
The first moving portion 40 is configured by combining known mechanical elements, and as shown in FIGS. 7 and 8, a guide portion to which the mounting portion 26c of the hanger 26 is mounted and extends in the width direction of the device is mounted. It has 40a.

The second moving portion 44 is configured by combining known mechanical elements, and has a pair of guide portions 44a that are attached to both ends of the guide portion 40a of the first moving portion 40 and extend in the vertical direction of the device. ing.

In this configuration, as shown in FIG. 7, the first moving portion 40 moves the hanger 26 on which the jig 50 holding the belt 100 is suspended in the device width direction along the guide portion 40a. Further, the second moving portion 44 moves the hanger 26 on which the jig 50 holding the belt 100 is suspended in the vertical direction of the device along the guide portion 44a. As a result, the belt 100 is immersed in the electroless nickel plating solution of the electroless nickel tank 12, immersed in the electrolytic copper plating solution of the electrolytic copper tank 16, and further immersed in the electrolytic nickel plating solution of the electrolytic nickel tank 22. .. In this way, the belt 100 is immersed in the plating solution of each plating tank.

(Other)
As shown in FIG. 6, the plating apparatus 10 includes an electrode 32 immersed in the electrolytic copper plating solution in the electrolytic copper tank 16 and an electrode 34 immersed in the electrolytic nickel plating solution in the electrolytic nickel tank 22. Is equipped with. Further, the plating apparatus 10 includes power supply devices 30 and 31 for applying a voltage between the electrodes 32 and 34 and the belt 100 immersed in the plating solution (electrolytic copper plating solution or electrolytic nickel plating solution). Further, the plating apparatus 10 includes a connecting portion 38 for electrically connecting the power supply devices 30 and 31 and the pair of caps 56, respectively. Here, an electric wire can be mentioned as an example of the connecting portion 38. The connection portion 38 is connected to the power supply device 30 during electrolytic copper plating, and is connected to the power supply device 31 during electrolytic nickel plating. Specifically, in the power supply device 30 of the electrolytic copper tank 16, its anode is electrically connected to the electrode 32 via an electric wire (not shown), and its cathode is electrically connected to the pair of caps 56 via the connecting portion 38. Connected to. The connection between the cathode of the power supply device 30 and the pair of caps 56 via the connecting portion 38 is electrically connected when the belt 100 is immersed in the electrolytic copper plating solution of the electrolytic copper tank 16, and is connected to the belt 100. It is desirable to be electrically cut off when the electrolytic copper plating is completed. Further, in the power supply device 31 of the electrolytic nickel tank 22, its anode is electrically connected to the electrode 34 via an electric wire (not shown), and its cathode is electrically connected to the pair of caps 56 via the connecting portion 38. To. The connection between the cathode of the power supply device 31 and the pair of caps 56 via the connection portion 38 is electrically connected when the belt 100 is immersed in the electrolytic nickel plating solution of the electrolytic nickel tank 22, and is connected to the belt 100. It is desirable to be electrically cut off when the electrolytic nickel plating of the above is finished. The electrode 32 is a conductive basket (basket) extending in the vertical direction of the device longer than the belt 100, is connected to the basket (basket) immersed in the electrolytic copper plating solution, and is copper (for example, copper (for example). It is desirable that multiple copper balls) be housed in the basket. By connecting the electrode 32 to the basket containing copper in this way, the reduced copper ions adhering to the belt 100 are replenished in the electrolytic copper plating solution. Similarly, the electrode 34 is a conductive basket (basket) extending in the vertical direction of the device longer than the belt 100, is connected to the basket (basket) immersed in the electrolytic nickel plating solution, and is nickel (for example,). , Multiple nickel chips) should be housed in the basket. By connecting the electrode 34 to the basket containing nickel in this way, the nickel ions that have adhered to the belt 100 and are reduced are replenished in the electrolytic nickel plating solution. Further, it is desirable that a plurality of baskets are arranged so as to have a one-to-one correspondence with the belt 100.

(Main part composition)
Next, the jig 50 will be described. As shown in FIG. 4, the jig 50 is attached to a cylindrical support portion 52, an annular O-ring 58 mounted on both end sides of the support portion 52, and both end sides of the support portion 52. Each is provided with a cylindrical spacer 62 to be mounted. Further, the jig 50 includes a cap 56 attached to both ends of the support portion 52, a bolt 70 for attaching the cap 56 to the support portion 52, and a conductive portion 66 attached to the cap 56. .. Since the configuration of each member mounted on one end side of the support portion 52 and the configuration of each member mounted on the other end side are the same, they are mounted on one end side (upper side in the drawing) of the support portion 52. The configuration of each member will be described.

[Support portion 52]
The support portion 52 is made of a resin material, and as shown in FIG. 4, has a columnar shape extending in the vertical direction of the device. 52a is formed. Further, the support portion 52 is formed with a stepped surface 52c arranged at the boundary between the small diameter portion 52a and the general portion 52b.

The axial length of the support portion 52 is longer than the length of the belt 100. Further, the outer diameter of the general portion 52b of the support portion 52 is, for example, 100 [%] or more and 110 [%] or less of the inner diameter of the belt 100.

Further, end faces 52d facing the outside of the support portion 52 in the axial direction (the side opposite to the central portion in the axial direction of the support portion 52) are formed at both ends of the support portion 52. Further, a concave female screw portion 52e extending in the axial direction of the support portion 52 is formed on the end surface 52d.

In this configuration, the support portion 52 is inserted inside the belt 100 to support the belt 100 from the inside.

[O-ring 58]
The O-rings 58 are made of a rubber material, and as shown in FIG. 4, two O-rings 58 are provided on one side of the support portion 52. The O-ring 58 is an example of a contact portion.

The O-ring 58 is an annular body (doughnut-shaped seal) having a circular cross section in a free state (no load state), and the inner diameter of the O-ring 58 is the outer diameter of the small diameter portion 52a of the support portion 52 in the free state. On the other hand, for example, it is 90 [%] or more and 100 [%] or less.

As shown in FIGS. 2B and 3B, the O-rings 58 are mounted on the stepped surface 52c side of the small diameter portion 52a, and two O-rings 58 are arranged in the axial direction of the support portion 52. Then, in a state where only the O-ring 58 is attached to the small diameter portion 52a, the outer diameter of the O-ring 58 is the same as or smaller than the outer diameter of the general portion 52b of the support portion 52. In other words, in the radial direction of the support portion 52, the O-ring 58 does not protrude from the general portion 52b of the support portion 52.

In the present embodiment, the "diametrical direction of the support portion 52" is the same direction as the radial direction of the belt 100 supported by the support portion 52.

[Spacer 62]
The spacer 62 is made of a resin material and has a cylindrical shape as shown in FIG. The spacer 62 is an example of a protruding member.

The inner diameter of the spacer 62 is slightly larger than the outer diameter of the small diameter portion 52a of the support portion 52, and the outer diameter of the spacer 62 is the same as the outer diameter of the general portion 52b of the support portion 52. As a result, the spacer 62 mounted on the support portion 52 can move (slide) in the axial direction of the support portion 52.

As shown in FIGS. 2 (C) and 3 (C), the spacer 62 is attached to the small diameter portion 52a and sandwiches two O-rings 58 with the stepped surface 52c of the support portion 52. I'm out. Then, in a state where the spacer 62 does not press the O-ring 58 against the stepped surface 52c, the portion of the spacer 62 opposite to the O-ring 58 protrudes outward from the support portion 52 in the axial direction of the support portion 52. .. In other words, in a state where the spacer 62 is in contact with the O-ring 58 having a circular cross section, the portion of the spacer 62 opposite to the O-ring 58 is the support portion 52 (end surface 52d of the support portion 52). It protrudes outward from the support portion 52 in the axial direction.

[Cap 56, bolt 70]
The cap 56 is made of a metal material (for example, stainless steel) which is an example of a conductive material, and has a cylindrical cylindrical portion 72 and a bottom of the cylindrical portion 72 as shown in FIGS. 1 (A) and 4 (A). It has a bottom portion 74 and a protrusion 76 protruding from the bottom portion 74. The cylindrical portion 72, the bottom portion 74, and the protrusion 76 are arranged in this order from the inner side in the axial direction of the support portion 52 (the central portion side in the axial direction of the support portion 52) to the outer side. The cap 56 is an example of a bottomed cylinder having a bottom, and the bottom 74 is an example of a bottom.

The cylindrical portion 72 has a cylindrical shape that covers the small diameter portion 52a of the support portion 52 from the radial direction of the support portion 52, and the cylindrical portion 72 is formed with an inner peripheral surface 72a. Further, the inner diameter of the cylindrical portion 72 is made larger than the outer diameter of the general portion 52b of the support portion 52. As a result, the cylindrical portion 72 covers the outer peripheral surface 100a of the end portion of the belt 100 supported by the support portion 52 from the radial direction of the belt 100.

Further, the bottom portion 74 is a columnar shape having an outer diameter similar to the outer diameter of the cylindrical portion 72, and constitutes the bottom of the cylindrical portion 72. Further, the bottom portion 74 is formed with a bottom surface 74a facing the end surface 52d side of the support portion 52.

Further, the protrusion 76 is a columnar shape protruding outward in the axial direction of the support portion 52 from the opposite side of the cylindrical portion 72 at the bottom portion 74, and the outer diameter of the protrusion 76 is smaller than the outer diameter of the bottom portion 74. There is. Further, the cap 56 is formed with a through hole 56a through which the bottom portion 74 and the protrusion 76 are penetrated in the axial direction of the support portion 52 and the bolt 70 is passed through.

In this configuration, when the cap 56 is attached to the support portion 52 while the O-ring 58 and the spacer 62 are attached to the small diameter portion 52a, as shown in FIGS. 2D and 2E, the cap is attached. The bolt 70 is passed through the through hole 56a of 56. Then, the tip portion of the bolt 70 is screwed into the female screw portion 52e formed on the support portion 52. As a result, the bottom surface 74a of the cap 56 and the end surface 52d of the support portion 52 come into contact with each other, and the cap 56 is attached to the support portion 52.

Here, as described above, in the state where the spacer 62 does not press the O-ring 58 against the stepped surface 52c, the portion of the spacer 62 opposite to the O-ring 58 protrudes from the support portion 52. Therefore, by attaching the cap 56 to the support portion 52, the cap 56 has the spacer 62 on the bottom surface 74a on the O-ring 58 side [the inside in the axial direction of the support portion 52 (the central portion side in the axial direction of the support portion 52]]. Press against.

As a result, the O-ring 58 sandwiched between the spacer 62 and the stepped surface 52c of the support portion 52 in the axial direction of the support portion 52 projects with respect to the support portion 52 in the radial direction of the support portion 52. As described above, the spacer 62 also functions as a pressing means for pressing the O-ring 58 against the stepped surface 52c in the axial direction of the support portion 52.

[Conductive portion 66]
The conductive portions 66 are made of a metal material (for example, stainless steel) which is an example of the conductive material, and a plurality (for example, four) are attached to the cap 56 as shown in FIG.

The four conductive portions 66 are arranged at similar intervals in the circumferential direction of the cap 56. Further, the conductive portion 66 has a plate shape, and the plate thickness direction of the conductive portion 66 is the radial direction of the support portion 52. Further, the conductive portion 66 has a rectangular shape extending in the axial direction of the support portion 52 when viewed from the radial direction of the support portion 52. One end of the conductive portion 66 is electrically connected (electrically connected) to the outer peripheral surface of the cap 56, and the other end of the conductive portion 66 projects from the cap 56 inward in the axial direction of the support portion 52. ..

In this configuration, when the cap 56 is attached to the support portion 52 that supports the belt 100, the other end of the conductive portion 66 comes into contact with the outer peripheral surface 100a of the belt 100, as shown in FIG. 2 (E). ..

(Action)
Next, the operation of the plating apparatus 10 will be described. First, the specifications of the belt 100 held by the jig 50 of the plating apparatus 10 and the procedure for holding the belt 100 by the jig 50 will be described.

[Specifications of belt 100]
As described above, the belt 100 is formed by using polyimide, which is a resin material. Further, a rough surface is formed on the outer peripheral surface 100a of the belt 100 by blasting in order to prevent the nickel layer formed on the outer peripheral surface 100a from being peeled off by electroless plating. In other words, a rough surface is formed on the outer peripheral surface 100a of the belt 100 by blasting in order to improve the adhesion with the nickel layer formed on the outer peripheral surface 100a by electroless plating. The "rough surface" is an arithmetic average roughness Ra (JIS B 0031) of 0.4 [μm] or more and 0.9 [μm] or less. The nickel layer is an example of a metal layer.

Here, when the belt 100 is blasted, a columnar core is inserted into the belt 100 so that both ends of the core protrude from both ends of the belt 100, and both ends and the center of the belt 100 are inserted. The belt 100 is attached to the core by wrapping the tape in the circumferential direction so as to straddle the child. Since the blasting process is performed in this state, rough surfaces are not formed on both ends of the belt 100 around which the tape is wound. When the blasting process is completed on the belt 100, the tapes wrapped around both ends of the belt 100 are peeled off, and the core inserted inside is removed. That is, as shown in FIG. 4, both ends of the belt 100 to be plated in the present embodiment are defined as a smooth surface region K (hereinafter referred to as “sliding surface region K”) on which a rough surface is not formed, and both ends. The portion sandwiched between the sliding surface regions K of the portion is referred to as a rough surface region S (hereinafter, “rough surface region S”).

[Procedure for holding the belt 100 on the jig 50]
When the belt 100 is held by the jig 50, as shown in FIGS. 2A and 2B, the O-ring 58 is moved from the outside of the support portion 52 in the axial direction to the small diameter portion 52a of the support portion 52. Mounting. Specifically, two O-rings 58 are mounted on the stepped surface 52c side of the small diameter portion 52a.

Next, as shown in FIGS. 2B and 2C, the spacer 62 is attached to the small diameter portion 52a of the support portion 52 from the outside in the axial direction of the support portion 52. Specifically, the spacer 62 is attached to the small diameter portion 52a so that the spacer 62 sandwiches the two O-rings 58 with the stepped surface 52c. In this state, the portion of the spacer 62 opposite to the O-ring 58 protrudes outward from the support portion 52 (end surface 52d of the support portion 52) in the axial direction of the support portion 52.

Next, as shown in FIGS. 2C and 2D, the support portion 52 is inserted into the belt 100, and the support portion 52 supports the belt 100 from the inside. In this state, the end of the support portion 52 protrudes from the end of the belt 100 in the axial direction of the support portion 52. Then, a part of the spacer 62 projects outward from the end of the belt 100 in the axial direction of the support portion 52.

Next, as shown in FIGS. 2D and 2E, the cap 56 is attached to the support portion 52 from the outside in the axial direction of the support portion 52. Specifically, the bolt 70 is passed through the through hole 56a of the cap 56. Then, the tip portion of the bolt 70 is screwed into the female screw portion 52e formed on the support portion 52. As a result, the bottom surface 74a of the cap 56 is brought into contact with the end surface 52d of the support portion 52, and the cap 56 is attached to the support portion 52.

Further, by attaching the cap 56 to the support portion 52, the cap 56 presses the spacer 62 toward the O-ring 58 side at the bottom surface 74a. In other words, the spacer 62 applies a pressing force to the O-ring 58.

As a result, the O-ring 58 sandwiched between the spacer 62 and the stepped surface 52c of the support portion 52 in the axial direction of the support portion 52 changes from a circular cross section to an elliptical cross section, and in the radial direction of the support portion 52, the general portion 52b It protrudes all around. The O-ring 58 projects in the radial direction of the support portion 52 with respect to the general portion 52b on the entire circumference, so that the protruding O-ring 58 is the end portion of the belt 100 as shown in FIG. 1 (A). The portion separated from the end of the cap 56 and the inner peripheral surface 72a of the cylindrical portion 72 of the cap 56 are brought into contact with each other on the entire circumference. Specifically, the O-ring 58 brings the portion of the end of the belt 100 separated from the end and the axially inner portion of the support portion 52 on the inner peripheral surface 72a of the cylindrical portion 72 into contact with each other on the entire circumference. As described above, the O-ring 58 functions as a sandwiching means for sandwiching the belt 100 with the inner peripheral surface 72a of the cylindrical portion 72.

Here, the sliding surface region K of the belt 100 is located outside the support portion 52 in the axial direction with respect to the position where the belt 100 and the inner peripheral surface 72a of the cylindrical portion 72 of the cap 56 come into contact with each other. That is, the O-ring 58 has an inner peripheral surface 72a of a portion of the end of the belt 100 that is separated from the end (the end of the rough surface region S) and the end of the cylindrical portion 72 (the portion opposite to the bottom 74). And are in contact with each other all around. The sliding surface region K of the belt 100 is covered by the inner peripheral surface 72a of the cylindrical portion 72 from the radial direction of the support portion 52. Further, as shown in FIG. 1B, the other end of the conductive portion 66 is in contact with the outer peripheral surface 100a of the belt 100. The O-ring 58 may be pressed at least at the end of the rough surface region S of the belt 100 from the inside in the radial direction of the support portion 52 toward the inner peripheral surface 72a of the cylindrical portion 72 all around. In the present embodiment, two O-rings 58 are mounted in the axial direction of the support portion 52 (a total of four on both sides). Therefore, the rough surface region S of the belt 100 is pressed by one O-ring 58 (O-ring 58 located inside the support portion 52 in the axial direction) toward the inner peripheral surface 72a of the cylindrical portion 72, and the belt is belted. The sliding surface region K of 100 may be pressed against the inner peripheral surface 72a of the cylindrical portion 72 by another O-ring 58 (O-ring 58 located outside the support portion 52 in the axial direction). In this case, the plating region on the rough surface region S can be increased as compared with the case where the two O-rings 58 described above are located at the end of the rough surface region S.

[Action of plating device 10]
First, the plating apparatus 210 according to the comparative form will be described, and then a step of plating the belt 100 using the plating apparatus 10 and 210 will be described.

The plating apparatus 210 will mainly be described as being different from the plating apparatus 10. As shown in FIG. 9, the jig 250 provided in the plating apparatus 210 includes a columnar support portion 252, an annular O-ring 58 mounted on both ends of the support portion 252, and a support portion 52. A cap 256 to be attached to both ends and a bolt 70 for attaching the cap 256 to the support portion 252 are provided.

The support portion 252 is a columnar shape extending in the vertical direction of the device, and small diameter portions 252a having a smaller outer diameter are formed at both ends of the support portion 252. Then, one O-ring 58 is attached to the small diameter portion 252a.

Further, the cap 256 has a stepped columnar shape, and has a columnar columnar portion 274 that contacts the end surface of the support portion 252 at the end surface, and a protrusion 276 that protrudes outward from the columnar portion 274 in the axial direction of the support portion 252. doing. The outer diameter of the columnar portion 274 is the same as the outer diameter of the belt 100 supported by the support portion 252.

As described above, the sliding surface region K of the belt 100 is not covered in the radial direction of the support portion 252 and is exposed to the outside.

In the plating step of applying the metal layer to the belt 100 using the plating devices 10 and 210, as shown in FIG. 8, ten jigs 50 and 250 for holding the belt 100 are hung on the hanger 26. Then, as shown in FIG. 7, the first moving portion 40 moves the hanger 26 on which the jigs 50 and 250 holding the belt 100 are suspended in the device width direction. Further, the second moving portion 44 moves the hanger 26 on which the jigs 50 and 250 holding the belt 100 are suspended in the vertical direction of the device. As a result, the belt 100 is first immersed in the electroless nickel plating solution of the electroless nickel tank 12, then immersed in the electrolytic copper plating solution of the electrolytic copper tank 16, and further, the electrolytic nickel plating of the electrolytic nickel tank 22. Immerse in liquid. That is, the electroless nickel plating step, the electrolytic copper plating step, and the electrolytic nickel plating step are executed in this order.

-Electroless nickel plating process-
In the electroless nickel plating step, as shown in FIG. 5, the entire belt 100 is immersed in the electroless nickel plating solution of the electroless nickel tank 12.

By immersing the belt 100 in the electroless nickel plating solution, a nickel layer is formed on the outer peripheral surface 100a of the belt 100 due to a chemical reaction (electrons released by oxidation of the reducing agent contained in the electroless nickel plating solution). It is formed. In the electroless nickel plating step, the reducing agent of the electroless nickel plating solution is consumed by continuously performing the electroless nickel plating of the belt 100. Therefore, the reducing agent is replenished in the electroless nickel plating solution at predetermined intervals. The concentration of the reducing agent in the electroless nickel plating solution is measured by titration at predetermined intervals. Here, titration is a quantitative analysis method for measuring the amount of a chemical substance using a chemical reaction. Specifically, a titrant, which is a standard substance having a known concentration, is added to the electroless nickel plating solution collected from the electroless nickel tank 12 to proceed the reaction. The time point (equivalence point) when all of the collected electroless nickel plating solution has reacted can be determined by the colorimetric method using a colorimetric indicator. Therefore, the amount (concentration) of the reducing agent in the electroless nickel plating solution collected from the electroless nickel tank 12 is determined by obtaining the volume of the titrator required to reach the equivalence point and performing stoichiometric calculation. it can. That is, the amount of the reducing agent in the electroless nickel plating solution in the electroless nickel tank 12 can be determined by titration to determine whether or not it is within a predetermined range suitable for electroless nickel plating on the belt 100.

In the plating apparatus 210 according to the comparative embodiment, as shown in FIG. 9, the sliding surface region K of the belt 100 is not covered in the radial direction of the support portion 252 and is exposed to the outside. That is, the entire outer peripheral surface 100a of the belt 100 comes into contact with the electroless nickel plating solution. Therefore, a nickel layer is formed on the entire outer peripheral surface 100a of the belt 100. Here, the adhesion of the nickel layer formed in the sliding surface region K to the belt 100 is weak.

Therefore, a part of the nickel layer formed in the sliding surface region K may be peeled off in the tank. When a part of the nickel layer is peeled off, the above-mentioned chemical reaction proceeds in the peeled nickel layer, and the components of the electroless nickel plating solution change. In other words, since the nickel layer continues to be formed on the surface of the peeled nickel layer, the reducing agent continues to be wasted. As a result, the reducing agent in the electroless nickel tank 12 is consumed more than expected, and replenishment at the predetermined intervals described above is not enough. Therefore, the quality of the nickel layer formed on the outer peripheral surface 100a of the belt 100 by electroless nickel plating deteriorates.

On the other hand, in the plating apparatus 10 according to the embodiment, as shown in FIG. 1A, the O-ring 58 is separated from the end of the belt 100 and the inner peripheral surface of the cylindrical portion 72. It is in contact with 72a all around. The sliding surface region K of the belt 100 is outside the axial direction of the support portion 52 with respect to the position where the belt 100 and the inner peripheral surface 72a of the cylindrical portion 72 of the support portion 52 come into contact with each other. Further, the cap 56 has a bottom portion 74 that constitutes the bottom of the cylindrical portion 72.

Therefore, even if the entire belt 100 is immersed in the electroless nickel plating solution, the contact between the sliding surface region K of the belt 100 and the electroless nickel plating solution is suppressed, and a nickel layer is formed in the sliding surface region K. Is suppressed. Therefore, a part of the nickel layer formed in the sliding surface region K is suppressed from being peeled off in the tank, and the nickel layer is formed in the rough surface region S of the belt 100.

Further, in the plating apparatus 10 according to the embodiment, the O-ring 58 is located in the end portion of the rough surface region S separated from the end portion of the belt 100 and the end portion of the cylindrical portion 72 opposite to the bottom portion 74. The peripheral surface 72a is brought into contact with the entire circumference. Therefore, at the end of the nickel layer, as shown in the enlarged view of FIG. 1A, the nickel layer straddles the cylindrical portion 72 of the cap 56 and the outer peripheral surface (rough surface region S) of the belt 100. Is formed.

-Electrolytic copper plating process-
In the electrolytic copper plating step, as shown in FIG. 6, the entire belt 100 is immersed in the electrolytic copper plating solution of the electrolytic copper tank 16.

Then, the electrode 32, the electrolytic copper plating solution, the portion where the nickel layer is formed in the belt 100, the conductive portion 66, and each cap 56 are connected to the electrode 32 by the power supply device 30 so that the current flows in this order. , A voltage is applied between the caps 56 and the caps 56. As a result, a copper layer is formed on the portion of the belt 100 where the nickel layer is formed. In other words, a copper layer is formed on the outside (outer peripheral surface) of the nickel layer of the belt 100. The anode of the power supply device 30 is electrically connected to the electrode 32 via an electric wire (not shown), and the cathode of the power supply device 30 is electrically connected to each cap 56 via a connection portion 38.

Here, the current flowing from the portion where the nickel layer of the belt 100 is formed to the cap 56 is nickel formed so as to straddle not only the conductive portion 66 but also the cylindrical portion 72 of the cap 56 and the outer peripheral surface of the belt 100. The layer (see enlarged view of FIG. 1 (A)) also passes through.

-Electrolytic nickel plating process-
In the electrolytic nickel plating step, as shown in FIG. 6, the entire belt 100 is immersed in the electrolytic nickel plating solution of the electrolytic nickel tank 22.

Then, the electrode 34, the electrolytic nickel plating solution, the portion where the copper layer is formed in the belt 100, the conductive portion 66, and each cap 56 are connected to the electrode 34 by the power supply device 31 so that the current flows in this order. , A voltage is applied between the caps 56 and the caps 56. As a result, another nickel layer (a nickel layer different from the nickel layer formed by the electroless nickel layer) is formed in the portion of the belt 100 where the copper layer is formed. In other words, another nickel layer is formed on the outside (outer peripheral surface) of the copper layer of the belt 100. The anode of the power supply device 31 is electrically connected to the electrode 34 via an electric wire (not shown), and the cathode of the power supply device 31 is electrically connected to each cap 56 via the connection portion 38. ..

(Summary)
As described above, in the plating apparatus 10, the sliding surface of the belt 100 is compared with the case of using the plating apparatus 210 according to the comparative mode in which the belt 100 is held so that both ends of the belt 100 are exposed to the outside. The formation of a nickel layer in the region K in the electroless nickel plating step is suppressed. As a result, in the electroless nickel plating step, as compared with the case where the plating apparatus 210 according to the comparative form is used, a part of the nickel layer is suppressed from being peeled off in the tank, so that the electroless nickel tank 12 Changes in the components of the electroless nickel plating solution are suppressed.

Further, in the plating apparatus 10, the O-ring 58 presses a portion of the end portion of the belt 100 separated from the end against the inner peripheral surface 72a of the cylindrical portion 72 of the cap 56 from the inside of the belt 100. Therefore, the belt 100 is more easily pressed against the inner peripheral surface 72a of the cylindrical portion 72 than when the inner peripheral surface 72a of the cylindrical portion 72 is pressed against the belt 100 from the outer side in the radial direction of the belt 100.

Further, in the plating apparatus 10, when the cap 56 is attached to the support portion 52, the spacer 62 applies a pressing force to the O-ring 58 to support the O-ring 58 in the radial direction of the support portion 52. Protrude against. Then, the O-ring 58 presses the belt 100 from the inside of the belt 100 against the inner peripheral surface 72a of the cylindrical portion 72 of the cap 56. As a result, the belt 100 is easily attached to the support portion 52 to which the O-ring 58 is attached, as compared with the case where the O-ring 58 always protrudes in the radial direction.

Further, in the plating apparatus 10, the cap 56 is formed of a metal material which is an example of a conductive material, and is used as an electrode in an electrolytic copper plating step and an electrolytic nickel plating step. Therefore, the man-hours are reduced as compared with the case of attaching and detaching a dedicated part having only the function of the electrode.

Further, the plating apparatus 10 is provided with a conductive portion 66 having one end attached to the cap 56 and the other end contacting the outer peripheral surface 100a of the belt 100. Therefore, the current flowing from the belt 100 to the cap 56 is stable as compared with the case where the conductive portion is not provided.

Although the present invention has been described in detail with respect to specific embodiments, the present invention is not limited to such embodiments, and various other embodiments can be taken within the scope of the present invention. That is clear to those skilled in the art. For example, in the above embodiment, the belt 100 is pressed against the inner peripheral surface 72a of the cylindrical portion 72 of the cap 56 by projecting the O-ring 58, but for example, by partially increasing the outer diameter of the support portion. , The belt 100 may be pressed against the inner peripheral surface 72a of the cylindrical portion 72 of the cap 56.

Further, in the above embodiment, the cap 56 is provided with the conductive portion 66, but the cap 56 may not be provided with the conductive portion 66. In this case, a current flows from the portion of the belt 100 on which the metal layer is formed to each cap 56. In other words, the electric current flows from the metal layer formed in the rough surface region S of the belt 100 through the metal layer formed so as to straddle the end portion of the metal layer and the cylindrical portion 72 of the cap 56 [FIG. 1]. (See enlarged view of (A)], current flows through each cap 56. In this case, the structure of the cap 56 can be simplified, and the maintenance of the cap 56 can be facilitated. Specifically, since the outer peripheral surface of the cap 56 is not uneven due to the conductive portion 66, the metal layer adhering to the outer peripheral surface of the cap 56 can be easily peeled off. However, in this case, the effect of providing the conductive portion 66 does not play.

Further, in the above embodiment, the cap 56 and the conductive portion 66 are formed of a metal material which is an example of a conductive material, but may be a conductive material, for example, a resin material containing a conductive filler. May be done. When the cap 56 is not used as an electrode, it may be made of a non-conductive material.

Further, in the above embodiment, caps 56, O-rings 58, and the like are provided on both ends of the support portion 52, but when the sliding surface region K of the belt 100 is formed on only one of the belts 100, , The cap 56, the O-ring 58, and the like may be provided only on one end side of the support portion 52. Further, although the support portion 52 of the above-described embodiment is shown to be cylindrical, it may be cylindrical.

Further, although not particularly described in the above embodiment, a cleaning step for cleaning the plating solution or the like adhering to the belt 100 may be appropriately provided. That is, a cleaning tank for cleaning the electroless nickel liquid adhering to the belt 100 may be provided between the electroless nickel tank 12 and the electrolytic copper tank 16 shown in FIGS. 7 and 8. Further, a cleaning tank for cleaning the electrolytic copper liquid adhering to the belt 100 may be provided between the electrolytic copper tank 16 and the electrolytic nickel tank 22. Further, a cleaning tank for cleaning the electrolytic nickel solution may be provided next to the electrolytic nickel tank 22. Needless to say, the belt 100 is immersed in the cleaning liquid (for example, water) of these cleaning tanks by using the first moving portion 40 and the second moving portion 44.

Further, although not particularly described in the above embodiment, a part of the inner peripheral surface 72a of the cylindrical portion 72 is projected from the outside in the radial direction of the belt 100 over the entire circumference, and this protruding portion is projected from the outer peripheral surface of the belt 100. It may be pressed against 100a. In this case, needless to say, the sliding surface region K of the belt 100 is positioned on the outside (end side) of the cylindrical portion 72 with respect to the protruding portion.

10 Plating equipment 12 Electroless nickel tank (electroless plating tank)
16 Electrolytic copper tank (electroplating tank)
22 Electrolytic nickel tank (electroplating tank)
30 Power supply device 38 Connection part 52 Support part 52a Small diameter part 56 Cap (Example of bottomed cylinder)
58 O-ring (example of contact part)
62 Spacer (an example of protruding member)
66 Conductive part 72 Cylindrical part 72a Inner peripheral surface 74 Bottom part (example of bottom)
100 belt (an example of a tube)
100a outer peripheral surface

Claims (5)

A bottomed cylinder that covers the outer peripheral surface of the end of the tube from the radial direction of the tube,
A contact portion in which a portion of the end portion of the tubular body separated from the end and the inner peripheral surface of the bottomed cylinder are brought into contact with each other on the entire circumference.
An electroless plating tank containing a plating solution in which the tube body is immersed, and
A plating device equipped with. A support portion for supporting the pipe body from the inside is provided.
The contact portion is annularly arranged between the tubular body and the support portion, and a portion of the tubular body separated from the end at the end portion is formed from the inside of the tubular body to the inside of the bottomed cylindrical body. The plating apparatus according to claim 1, which is pressed against a peripheral surface. The support portion is a stepped columnar shape having a small diameter portion whose end is reduced in diameter.
The contact portion has a circular cross section in a free state, and is arranged in the small diameter portion of the support portion.
The bottomed cylinder is removable from the support portion.
With the bottomed cylinder mounted on the support portion, it is arranged between the bottom of the bottomed cylinder and the contact portion, and a pressing force is applied to the contact portion from the axial direction of the tube body. The plating apparatus according to claim 2, further comprising a protruding member that projects the contact portion in the radial direction. The bottomed cylinder is made of a conductive material.
A power supply device that applies a voltage to the bottomed cylinder and
A connection portion that electrically connects the power supply device and the bottomed cylinder,
The plating apparatus according to any one of claims 1 to 3, further comprising an electrolytic plating tank containing another plating solution in which the tube body immersed in the plating solution of the electroless plating tank is immersed. The plating apparatus according to claim 4, further comprising a conductive portion formed of a conductive material, one end of which is attached to the bottomed cylindrical body and the other end of which is in contact with the outer peripheral surface of the tubular body.