KR101818643B1 - Method of manufacturing clad-type rack pin using precision plating process and clad-type rack pin manufactured thereby - Google Patents

Abstract

The present invention relates to a method for manufacturing a rack pin in which an object to be plated of components of a rack used for plating the rack is caught and, more specifically, provides a method for manufacturing a clad-type rack pin using a precision plating process, which comprises the following steps of: preparing a shell made of a stainless steel material; and forming a metal core on the internal surface of the shell through an electroplating process.

Description

[0001] The present invention relates to a method of manufacturing a clad-type rack pin using a precision plating process and a clad-type rack pin manufactured by the method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rack pin and a rack pin manufactured by the method, and more particularly, to a method of manufacturing a rack pin in which a member to be plated is engaged among elements of a rack used for rack plating.

Generally, rack plating is a type of electroplating, in which a rack in which a substrate to be plated is placed is put into a plating solution, and power is applied to the substrate through the rack, thereby plating the substrate. The rack plating is carried out through a step of placing the plated body on the rack, an immersion degreasing step, an etching step, an electrolytic degreasing step, a plating step, a post-processing step, and a step of lowering the plated body from the rack.

In most of the steps of the rack plating, the plated body is caught in the rack. The rack not only supports the object to be plated so that the object to be plated does not fall out of the rack during the rack plating, but also serves to effectively deliver the current supplied by the rectifier to the object to be plated. Regarding the above rack, a registered utility model No. 20-0408179 (titled invention: rack mechanism for electroplating, Patent Document 1) is disclosed.

Fig. 1 is a schematic view showing a general plating rack 1. Fig. 1, the plating rack 1 is constituted by a rack hanger 2, a rack frame 3, and a rack pin 4. The rack hanger 2 is a portion of the rack hanger (not shown). A plating object (not shown) is attached to the rack pin 4. The rack frame (3) supports the rack (2) and the rack pins (4). A power source is supplied to the rack frame (3) from the rack hanger (2). Then, the power is supplied from the rack frame (3) to the rack pin (4) and the plated body.

The rack hanger 2 is composed of a power supply connecting portion 21, a hanger body 22 and a hanger coating layer 23 formed on the surface of the hanger body 22. The rack frame 3 is composed of a frame body 31 and a frame coating layer 32 formed on the surface of the frame body 31. The rack pin 4 includes a pin body 41, a pin coating layer 42 formed on the surface of the pin body 41, and a plated body contact portion 43. The power connection portion 21, the hook body 22, and the frame body 31 are integrally formed. The hook coating layer 23, the frame coating layer 32, and the pin coating layer 42 are integrally formed. The pin body 41 and the to-be-plated body contact portion 43 are integrally formed.

The power connection unit 21, the hook body 22, and the frame body 31 are made of copper (Cu) for power transmission. The hook coating layer 23, the frame coating layer 32, and the pin coating layer 42 are made of an insulating material. The power connection part 21 is not coated with the insulating material because the power source is directly applied. In addition, the to-be-plated-body contact portion 43 is also not coated with the insulating material since the power source is supplied to the plated body in contact with the plated body. However, the hook body 22, the frame body 31, and the pin body 41 are coated with the insulating material to prevent the power source from spreading unnecessarily, and the coating layers are formed on the surface of the hook body 22, the frame body 31, .

Meanwhile, the pin body 41 and the to-be-plated body contact portion 43 are made of stainless steel. This is because in the plating process, the pin body 41 and the to-be-plated body contact portion 43 are easily corroded by contacting the plating liquid.

In other words, the rack pin 4 includes the stainless steel for securing corrosion resistance. However, the electrical conductivity of the stainless steel is about 3% of the electrical conductivity of the copper contained in the rack hanger 2 and the rack frame 3. Therefore, the rack pin 4 has an excellent corrosion resistance but an inferior electrical conductivity.

Registration Utility Model No. 20-0408179 (registered on 02.02.2006)

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a rack pin having excellent electrical conductivity and durability using a precision plating process. More specifically, it is an object of the present invention to provide a method for manufacturing a clad-type rack pin having excellent electrical conductivity and including a stainless steel shell including a core made of metal and having excellent corrosion resistance through an electroless or electrolytic plating process .

However, the problems to be solved by the present invention are not limited to the above-described problems, and other problems that are not described can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention is constructed as follows.

There is provided a method of manufacturing a clad type rack pin using a precision plating process comprising the steps of preparing a stainless steel shell and forming a metal core on the inner surface of the shell through an electroless plating process.

The stainless steel may be an austenitic stainless steel or a duplex stainless steel.

The metal may include at least one selected from the group consisting of copper, nickel, aluminum, gold, silver, zinc, iron, molybdenum, chromium, tin, cobalt and alloys thereof.

The forming of the core may include passing a plating solution containing a metal ion and a reducing agent into the shell, and the core may be formed by reducing the metal ion by the reducing agent.

Wherein the plating solution includes a plating solution tank for containing the plating solution, a metering pump for pumping the plating solution contained in the plating solution tank, an inflow line connecting the metering pump and the shell, the shell, May be circulated along a path including an exhaust line connecting the baths.

There is provided a clad type rack pin manufactured through the electroless plating process.

A method of manufacturing a clad type rack pin through an electrolytic plating process and a clad type rack pin manufactured by the method are provided.

According to the present invention having the above-described structure, a clad type rack pin having excellent electrical conductivity and corrosion resistance can be manufactured through an electroless or electrolytic plating process.

Further, according to the present invention, the plating solution can be circulated along a predetermined path so that a core of uniform thickness can be manufactured on the inner surface of the shell.

Further, when plating is performed with a plating rack to which the clad type rack pin of the present invention is applied, the plating quality can be improved as compared with the prior art.

In addition, when the clad type rack pin of the present invention is applied to a rack for plating, the lifetime of the plating rack becomes longer than that according to the prior art, and the cost of the plating product can be reduced.

1 is a schematic view showing a plating rack according to the prior art.
2 (a) to 2 (c) are perspective views showing a clad type rack pin according to an embodiment of the present invention.
3 is a schematic view showing a plating solution circulating apparatus and a shell according to an embodiment of the present invention.
4 is a perspective view showing a shell separated from the inflow and outflow lines of Fig. 3;
5 is a schematic view showing a plating solution circulating apparatus and a shell according to an embodiment of the present invention.
6 is a perspective view showing a shell separated from the inflow and outflow lines of Fig. 5;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

For clarity of explanation of the embodiments of the present invention, parts that are not related to the description in the accompanying drawings are omitted. Like parts throughout the specification are labeled with like reference numerals.

The terminology used herein is for the purpose of describing various embodiments and is not intended to be limiting of the present invention. When the first component is said to be "connected (connected, contacted)" to a second component, this means that the first component is "directly connected" to the second component, Quot; indirectly "through < / RTI > The singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms " comprises "or" having ", when used in this specification, mean that there are features, numbers, steps, But does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

2 (a) to 2 (c) are perspective views showing a clad type rack pin 5 according to an embodiment of the present invention. Referring to Figs. 2 (a) to 2 (c), the clad type rack pin 5 includes a shell 52 and a core 51 positioned on the inner surface of the shell 52. The clad type rack pin 5 corresponds to the pin body 41 and the to-be-plated body contact portion 43 shown in Fig. After the clad type rack pin 5 is manufactured, a coating layer such as the pin coating layer 42 of FIG. 1 may be formed on a part of the surface of the clad type rack pin 5.

The clad type rack pin 5 is manufactured through a precision plating process. When the inside of the shell 52 is plated with metal, the core 51 is formed on the inner surface of the shell 52.

The clad type rack pins 5 are manufactured through an electroless plating process or an electroplating process. When the core 51 is formed on the inner surface of the shell 52 through the electroless plating process, the clad type rack pin 5 of FIG. 2 (a) or FIG. 2 (b) is manufactured. On the other hand, when the core 51 is formed on the inner surface of the shell 52 through the electrolytic plating process, the clad type rack pin 5 shown in Fig. 2 (c) is manufactured.

2 (a) and 2 (b), when the clad type rack pin 5 is manufactured through the electroless plating process, the inside of the shell 52 has a central hole (FIG. 2 (a)), or may be completely filled with the core 51 (FIG. 2 (b)). The clad type rack pin 5 shown in Fig. 2 (a) or Fig. 2 (b) is produced according to the conditions of the electroless plating process (for example, the processing time and the composition of the plating solution).

2 (c), when the clad type rack pin 5 is manufactured through the electroplating process, the inside of the shell 52 may be filled with the core 51 (Fig. 2 (c)). This is because the insoluble anode is inserted into the inner center of the shell 52 in the electrolytic plating process. However, since FIG. 2 (c) shows an embodiment, the clad type rack pin 5 shown in FIG. 2 (a) may be manufactured through the electrolytic plating process. In addition, when the soluble anode that is not the insoluble anode is inserted in the electrolytic plating process, the clad type rack pin 5 shown in FIG. 2 (b) may be produced through the electrolytic plating process.

The material of the shell 52 is stainless steel. The material of the core 51 is metal. Since the clad type rack pin 5 includes the stainless steel, it has excellent corrosion resistance and has excellent electrical conductivity since it contains the metal.

The stainless steel is preferably an austenitic stainless steel or duplex stainless steel having excellent corrosion resistance. Specifically, the austenitic stainless steel may be SUS304, SUS310, SUS316 or SUS321, but is not limited thereto.

The metal may include at least one selected from the group consisting of copper, nickel, aluminum, gold, silver, zinc, iron, molybdenum, chromium, tin, cobalt and alloys thereof. It is not. Preferably, the metal is copper which is particularly excellent in electrical conductivity.

A method of manufacturing the clad type rack pin 5 through the electroless plating process is as follows, for example. First, the shell 52 is prepared. Next, the core 51 is formed on the inner surface of the shell 52 through the electroless plating process.

The core 51 is formed as follows. A plating solution containing a metal ion and a reducing agent passes through the inside of the shell 52. While the plating solution passes through the inside of the shell 52, the metal ions are reduced by the reducing agent, and the core 51 is formed on the inner surface of the shell 52. In other words, metal is deposited on the inner surface of the shell 52 to form the core 51.

Before the core 51 is formed after the shell 52 is prepared, there may be a nucleation step. The catalyst nucleation step is as follows. An adsorption solution containing catalyst ions passes through the inside of the shell 52. Catalytic nuclei are created on the inner surface of the shell 52 while the adsorbent solution passes through the interior of the shell 52. When the plating solution passes through the shell 52 after the catalyst nuclei are formed, the catalyst nuclei help the metal ions to be reduced by the reducing agent. In other words, the catalyst nuclei serve as a catalyst in the reduction of the metal ion.

The catalyst ion, the substance contained in the adsorption solution, the reducing agent, and the substance contained in the plating solution are changed depending on the kind of the metal ion (that is, depending on the kind of the metal forming the core 51) . A person skilled in the art of plating can appropriately select materials necessary for the electroless plating process using known information on plating.

A method of manufacturing the clad type rack pin 5 through the electrolytic plating process is as follows, for example. First, the shell 52 is prepared. Next, the core 51 is formed on the inner surface of the shell 52 through the electrolytic plating process.

The core 51 is formed through the following process. The cathode of the rectifier 67 is connected to the shell 52 and the anode of the rectifier 67 is inserted and fixed to the center of the shell 52.

Next, a plating solution containing metal ions is passed through the inside of the shell 52. The anode is an insoluble anode or a soluble anode. The insoluble anode is insoluble in the plating solution, and the soluble anode is soluble in the plating solution.

Next, the rectifier (67) applies a current to the plating solution through the cathode and the anode. While the plating solution passes through the inside of the shell 52, electrons are concentrated in the shell 52 by the rectifier 67. Accordingly, the metal ions included in the plating solution are reduced by receiving the electrons, and the core 51 is formed on the inner surface of the shell 52. In other words, metal is deposited on the inner surface of the shell 52 to form the core 51. When the anode is a soluble anode made of the metal material, the soluble anode dissolves to generate the metal ions in the plating solution. The metal ions produced by dissolution of the soluble anode are also reduced on the inner surface of the shell 52. Thus, in this case, the soluble anode assists in forming the core 51.

A person skilled in the art of plating can appropriately determine the composition of the plating solution by using known information about plating. Hereinafter, a method of manufacturing the clad type rack pin 5 by plating the interior of the stainless steel shell 52 with copper will be described in detail.

[Example 1 - electroless plating with copper]

A method of manufacturing a clad type rack pin using a precision plating process according to an embodiment of the present invention includes a plating solution circulating device preparing step, a shell preparing step, a catalyst nucleating step, and a core forming step.

In the plating solution circulating apparatus preparing step, the plating solution circulating apparatus 6 is prepared. Fig. 3 shows the plating solution circulating apparatus 6. Fig. 3, the plating solution circulating apparatus 6 includes a plating solution tank 66, a metering pump 61, an inflow line 62, an inflow valve 63, a discharge valve 64, 65). The inflow line 62 connects the metering pump 61 and the shell 52 and the discharge line 65 connects the shell 52 and the plating solution tank 66.

In the shell preparation step, an appropriately sized shell 52 is selected and then the shell 52 is inserted between the inflow line 62 and the discharge line 65 of the plating solution circulating device 6 Reference). If the diameter ratio between the outer circumferential surface and the inner circumferential surface of the shell 52 is too large, the clad type rack pin 5 having excellent corrosion resistance and inferior electrical conductivity can be manufactured. Conversely, if the diameter ratio of the outer circumferential surface and the inner circumferential surface of the shell 52 is too small, the clad type rack pin 5 having excellent electrical conductivity and inferior corrosion resistance can be manufactured. Therefore, when the diameter ratio of the outer circumferential surface and the inner circumferential surface of the shell 52 is appropriately selected, the clad type rack pin 5 having excellent electrical conductivity and corrosion resistance can be manufactured.

On the other hand, when the shell 52 is inserted between the inflow line 62 and the discharge line 65, the size of the shell 52 is smaller than the size of the inflow line 62 and the discharge line 65 May be the same or different. In any case the inlet valve 63 can connect the inlet line 62 and the shell 52 and the outlet valve 64 can connect the shell 52 and the outlet line 65 have. This is because the inflow valve 63 and the discharge valve 64 are made of a stretchable silicone material so that the two objects can be closely contacted to two different sized objects.

In the catalyst nucleation step, the adsorption solution is circulated to form the catalyst nuclei on the inner surface of the shell 52. The adsorption solution is a solution comprising PdCl ₂ or PdSO ₄ and the catalyst nuclei are palladium catalyst nuclei. When the adsorption solution is received in the plating solution tank 66, the dosing pump 61 pumps the adsorption solution. The pumped adsorption solution flows into the shell 52 through the inflow line 62. The introduced adsorption solution is discharged from the shell 52 into the discharge line 65 and returned to the plating solution tank 66. In other words, the adsorption solution is circulated along a path including the plating solution tank 66, the metering pump 61, the inflow line 62, the shell 52, and the discharge line 65 . FIG. 3 shows this circulation process as an arrow. In this process, the catalyst nuclei are generated on the inner surface of the shell 52.

When the catalyst nuclei are generated, the shell 52 with the catalyst nuclei formed is separated from the inflow line 62 and the discharge line 65. Figure 4 shows the inflow line 62 and the shell 52 separated from the discharge line. The separated shell 52 is washed and the residual adsorption solution in the shell 52 is removed.

In the core forming step, the plating solution is circulated to form the core 51 on the inner surface of the shell 52. The plating solution includes copper ion as a metal ion, formaldehyde as a reducing agent, and sodium hydroxide as an alkali. The core 51 is made of copper. When the plating solution is received in the plating solution tank 66, the metering pump 61 pumps the plating solution. The pumped plating solution flows into the shell 52 through the inflow line 62. The introduced plating solution is discharged from the shell 52 into the discharge line 65 and returned to the plating solution tank 66. In other words, the plating solution is circulated along a path including the plating solution tank 66, the metering pump 61, the inflow line 62, the shell 52, and the discharge line 65 . FIG. 3 shows this circulation process as an arrow. In this process, the copper ion is reduced by the formaldehyde and the sodium hydroxide. The reaction in which the copper ion is reduced is shown in the following reaction formula (1).

[Reaction Scheme 1]

Cu ²⁺ + 2HCHO + 4OH ^- ? Cu + 2HCOO ^- + 2H ₂ O + H ₂

The reaction in which the copper ions are reduced is catalyzed by the palladium catalyst nuclei. During the circulation of the plating solution, copper is precipitated on the inner surface of the shell 52 to form the core 51.

The shell 52 in which the core 51 is formed is separated from the inflow line 62 and the discharge line 65. Figure 4 shows the inflow line 62 and the shell 52 separated from the discharge line. The inlet valve 63 and the discharge valve 64 connected to the shell 52 are also separated from the shell 52. Thereafter, the remaining plating solution in the shell 52 in which the core 51 is formed is removed by washing.

The clad-type rack pin 5 manufactured through the above processes may be the one shown in Fig. 2 (a) or the one shown in Fig. 2 (b). The fact that the core 51 is formed in a uniform thickness through the circulation process in any form is apparent to those of ordinary skill in the plating arts.

[Example 2 - Electroplating with copper]

A method of manufacturing a clad type rack pin using a precision plating process according to an embodiment of the present invention includes a plating solution circulating device preparing step, a shell preparing step, and a core forming step.

In the plating solution circulating apparatus preparing step, the plating solution circulating apparatus 6 is prepared. Fig. 5 shows the plating solution circulating apparatus 6. Fig. 5, the plating solution circulating apparatus 6 includes a plating solution tank 66, a metering pump 61, an inflow line 62, an inflow valve 63, a discharge valve 64, a discharge line 65 ), And a rectifier (67). The inflow line 62 connects the metering pump 61 and the shell 52 and the discharge line 65 connects the shell 52 and the plating solution tank 66.

In the shell preparation step, a shell 52 of an appropriate size is selected and then the shell 52 is inserted between the inflow line 62 and the discharge line 65 of the plating solution circulation apparatus 6 Reference). If the diameter ratio between the outer circumferential surface and the inner circumferential surface of the shell 52 is too large, the clad type rack pin 5 having excellent corrosion resistance and inferior electrical conductivity can be manufactured. Conversely, if the diameter ratio of the outer circumferential surface and the inner circumferential surface of the shell 52 is too small, the clad type rack pin 5 having excellent electrical conductivity and inferior corrosion resistance can be manufactured. Therefore, when the diameter ratio of the outer circumferential surface and the inner circumferential surface of the shell 52 is appropriately selected, the clad type rack pin 5 having excellent electrical conductivity and corrosion resistance can be manufactured.

On the other hand, when the shell 52 is inserted between the inflow line 62 and the discharge line 65, the size of the shell 52 is smaller than the size of the inflow line 62 and the discharge line 65 May be the same or different. In any case the inlet valve 63 can connect the inlet line 62 and the shell 52 and the outlet valve 64 can connect the shell 52 and the outlet line 65 have. This is because the inflow valve 63 and the discharge valve 64 are made of a stretchable silicone material so that the two objects can be closely contacted to two different sized objects.

In the core forming step, the plating solution is circulated to form the core 51 on the inner surface of the shell 52. The plating solution contains copper ions, which are metal ions, and the core 51 is made of copper.

The anode of the rectifier 67 is connected to the shell 52 and the insoluble anode of the rectifier 67 is inserted and fixed to the center of the shell 52 before the plating solution is circulated.

Next, the plating solution is circulated. When the plating solution is received in the plating solution tank 66, the metering pump 61 pumps the plating solution. The pumped plating solution flows into the shell 52 through the inflow line 62. The introduced plating solution is discharged from the shell 52 into the discharge line 65 and returned to the plating solution tank 66. In other words, the plating solution is circulated along a path including the plating solution tank 66, the metering pump 61, the inflow line 62, the shell 52, and the discharge line 65 . FIG. 5 shows this circulation process as an arrow.

While the plating solution is circulating, the rectifier 67 applies current to the plating solution through the negative electrode and the insoluble positive electrode. Accordingly, the copper ions receive the electrons concentrated in the shell 52 and are reduced. In other words, copper is precipitated on the inner surface of the shell 52 to form the core 51. The fact that the core 51 is formed in a uniform thickness through the circulation process is obvious to a person skilled in the art of plating.

The shell 52 in which the core 51 is formed is separated from the inflow line 62 and the discharge line 65. Figure 6 shows the inflow line 62 and the shell 52 separated from the discharge line. The inlet valve 63 and the discharge valve 64 connected to the shell 52 are also separated from the shell 52. The inserted insoluble anode (also shown in FIG. 6) is also separated from the shell 52. Thereafter, the remaining plating solution in the shell 52 in which the core 51 is formed is removed by washing.

The clad type rack pin 5 manufactured through the above processes has the form shown in Fig. 2 (c). In FIG. 2 (c), a hole in the center of the clad-type rack pin 5 is a space in which the insoluble anode is located.

Although the insoluble anode is used in this embodiment, it is preferable to use a soluble anode made of copper instead of the insoluble anode if the operator desires to greatly grow the core 51 at the initial stage of electrolytic plating.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. will be. Therefore, the true scope of the present invention should be defined by the appended claims.

1: Plating rack
2: Rack Hanger 3: Rack Frame
21: power connection part 31: frame body
22: Hook body 32: Frame coating layer
23: Hook coating layer
4: Rack pin 5: Clad type rack pin
41: pin body 51: core
42: pin coating layer 52: shell
43: Plated member contact portion
6: Plating solution circulator
61: metering pump
62: inflow line
63: Inflow valve
64: discharge valve
65: discharge line
66: plating solution tank
67: rectifier

Claims (6)

Preparing a stainless steel shell; and
And forming a metal core on the inner surface of the shell through an electrolytic plating process.
The method according to claim 1,
Wherein the stainless steel is an austenitic stainless steel or a duplex stainless steel.
The method according to claim 1,
Wherein the metal comprises at least one selected from the group consisting of copper, nickel, aluminum, gold, silver, zinc, iron, molybdenum, chromium, tin, cobalt and alloys thereof. Type rack pin.
The method according to claim 1,
Wherein forming the core comprises:
Connecting a negative electrode to the shell and inserting a positive electrode in the center of the shell;
Passing a plating solution containing metal ions into the shell; And
And applying a current to the plating solution through the cathode and the anode to reduce the metal ions at the inner surface of the shell.
5. The method of claim 4,
Wherein the plating solution includes a plating solution tank for containing the plating solution, a metering pump for pumping the plating solution contained in the plating solution tank, an inflow line connecting the metering pump and the shell, the shell, And a discharge line connecting the first and second tanks to the second tundish.
A clad type rack pin manufactured by forming a metallic core on the inner surface of a stainless steel shell through an electrolytic plating process.

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