JP2020194854A - Manufacturing method for wiring to solid-state image sensor - Google Patents
Manufacturing method for wiring to solid-state image sensor Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000003384 imaging method Methods 0.000 claims abstract description 22
- 239000007787 solid Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 17
- 239000002184 metal Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Solid State Image Pick-Up Elements (AREA)
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Abstract
Description
本発明は、固体撮像装置の製造方法に関し、特に固体撮像装置の裏に配線する製造方法に関する。 The present invention relates to a method for manufacturing a solid-state image sensor, and more particularly to a method for manufacturing a wiring behind a solid-state image sensor.
従来の固体撮像装置への配線方法としては、固体撮像装置の配線としてはワイヤーボンディング（以下、ＷＢ）、およびボールグリッドアレイ（以下、ＢＧＡ）が提案されている。 As a wiring method to a conventional solid-state image sensor, wire bonding (hereinafter, WB) and ball grid array (hereinafter, BGA) have been proposed as wiring of the solid-state image sensor.
図１は、従来の固体撮像装置におけるＷＢを用いた配線の断面図の例、図２は、従来の固体撮像装置におけるＢＧＡを用いた配線の断面図の例である。 FIG. 1 is an example of a cross-sectional view of wiring using WB in a conventional solid-state image sensor, and FIG. 2 is an example of a cross-sectional view of wiring using BGA in a conventional solid-state image sensor.
図１のように、固体撮像装置１を回路基板２に実装する場合には、撮像部３の外側に設けられたセンサ端子４と基板上に設けられた基板端子５とをワイヤー６で配線するＷＢを用いた配線が一般的であった。 As shown in FIG. 1, when the solid-state image sensor 1 is mounted on the circuit board 2, the sensor terminal 4 provided on the outside of the image pickup unit 3 and the board terminal 5 provided on the board are wired by a wire 6. Wiring using WB was common.
図２は、固体撮像装置のセンサ端子４が増えて高密度化した場合の配線方法として近年よく用いられるＢＧＡを用いた配線構造の断面図である。図１のセンサ端子４が増えた場合にはＷＢ配線では、一つのＷＢ配線をする場合に隣接する配線に接触するために、ＷＢによる配線密度に限界があった。図1でのＢＧＡを用いた配線を行うために、前記センサ端子４が基板裏面側まで貫通する貫通電極端子７となっている。前記貫通電極端子７の裏面側には、低温の熱で溶けやすい半田などの金属ボール８が形成されており、加熱により前記貫通電極端子７と前記基板端子５を容易に接続できる構成になっている。前記基板端子５には回路配線９が接続されて、周辺回路へ接続する構成となっている。
図３は、従来の固体撮像装置の裏面のＢＧＡを示す図の例である。固体撮像装置の裏面には、前記金属ボール８が縦横に５行５列のグリッドアレイ状態に並べられているため、この構造はボールグリッドアレイ（ＢＧＡ）と呼ばれている。
FIG. 2 is a cross-sectional view of a wiring structure using BGA, which is often used in recent years as a wiring method when the number of sensor terminals 4 of a solid-state image sensor increases and the density increases. When the number of sensor terminals 4 in FIG. 1 is increased, the WB wiring has a limit in the wiring density by the WB because it comes into contact with the adjacent wiring when one WB wiring is performed. In order to perform wiring using the BGA in FIG. 1, the sensor terminal 4 is a through electrode terminal 7 penetrating to the back surface side of the substrate. A metal ball 8 such as solder, which is easily melted by low-temperature heat, is formed on the back surface side of the through electrode terminal 7, and the through electrode terminal 7 and the substrate terminal 5 can be easily connected by heating. There is. A circuit wiring 9 is connected to the board terminal 5 to connect to a peripheral circuit.
FIG. 3 is an example of a diagram showing the BGA on the back surface of the conventional solid-state image sensor. This structure is called a ball grid array (BGA) because the metal balls 8 are arranged vertically and horizontally in a grid array state of 5 rows and 5 columns on the back surface of the solid-state image sensor.
固体撮像装置にＢＧＡで配線する構成のものは、例えば特開２００７−３６４８１で報告されている。ＢＧＡを利用することで、固体撮像装置の裏面と回路基板とが、平行して接続されている。特開２０１５−５０８２９９の場合も、ＢＧＡを利用することで、光学式センサ装置の裏面と多芯電気導線とが、平行して接続されている。 For example, Japanese Patent Application Laid-Open No. 2007-36481 reports a configuration in which a solid-state image sensor is wired by BGA. By using BGA, the back surface of the solid-state image sensor and the circuit board are connected in parallel. Also in the case of Japanese Patent Application Laid-Open No. 2015-508299, the back surface of the optical sensor device and the multi-core electric lead wire are connected in parallel by using BGA.
上述のように、ＢＧＡを利用することで、回路基板または多芯電気導線と、固体撮像装置の裏面とが、平行して接続する場合は、
固体撮像装置の上面から見た場合に、回路基板や多芯電気導線が固体撮像装置から、はみ出して大きくなった構造となってしまう。
そのため、回路基板または多芯電気導線が付いた固体撮像装置を内蔵する内視鏡を作る場合には、回路基板または多芯電気導線の大きさによって内視鏡の直径が制限されることとなる。
As described above, when the circuit board or multi-core electric lead wire and the back surface of the solid-state image sensor are connected in parallel by using BGA,
When viewed from the upper surface of the solid-state image sensor, the circuit board and the multi-core electric lead wire protrude from the solid-state image sensor and become large.
Therefore, when making an endoscope having a built-in solid-state image sensor with a circuit board or a multi-core electric wire, the diameter of the endoscope is limited by the size of the circuit board or the multi-core electric wire. ..
このように、内視鏡の直径が大きくならないためには、回路基板または多芯電気導線を、固体撮像装置と平行して置かないことが望ましい。 As described above, in order to prevent the diameter of the endoscope from becoming large, it is desirable that the circuit board or the multi-core electric lead wire is not placed in parallel with the solid-state image sensor.
上述したことを鑑み、本発明は、回路基板を取り除き、内視鏡を小型化する固体撮像装置を提供することである。 In view of the above, the present invention provides a solid-state image sensor in which the circuit board is removed and the endoscope is miniaturized.
上記目的を達成するために、撮像部を有する側を表面とした場合に、裏面側に配線端子を有する固体撮像装置において、前記配線端子に接続する配線を前記固体撮像装置の裏面に対して交わる角度を持って配線する製造方法および製造装置であって、
前記製造方法を行う製造装置は、前記配線端子に接続するための配線を固定する配線固定部と、前記固体撮像装置を固定する固体撮像装置固定部とを有し、前記配線固定部と前記固体撮像装置固定部が平行に配置され、前期配線は前記配線固定部に対して交わる角度を持って固定され、前記固体撮像装置の裏面は前記固体撮像装置固定部と平行に固定され、
前期配線は前記固体撮像装置の裏面に対して交わる方向に前記配線固定部に固定された後に、前記配線固定部を前記固体撮像装置の裏面に対して平行を保った状態で近づけることで、前記固体撮像装置の裏面の前期配線端子と前期配線とを接続することを特徴とする製造することを特徴とする。
In order to achieve the above object, when the side having the imaging unit is the front surface, in the solid-state imaging device having the wiring terminal on the back surface side, the wiring connected to the wiring terminal intersects the back surface of the solid-state imaging device. A manufacturing method and equipment for wiring at an angle.
The manufacturing apparatus that performs the manufacturing method has a wiring fixing portion for fixing the wiring for connecting to the wiring terminal and a solid-state image sensor fixing portion for fixing the solid-state image sensor, and the wiring fixing portion and the solid are provided. The image sensor fixing portion is arranged in parallel, the wiring in the previous period is fixed at an angle intersecting the wiring fixing portion, and the back surface of the solid-state imaging device is fixed in parallel with the solid-state imaging device fixing portion.
The wiring in the previous period is fixed to the wiring fixing portion in a direction intersecting the back surface of the solid-state image sensor, and then the wiring fixing portion is brought close to the back surface of the solid-state image sensor while being parallel to the wiring fixing portion. It is characterized in that it is manufactured by connecting the early wiring terminal on the back surface of the solid-state image sensor and the early wiring.
本発明の固体撮像装置の配線製造方法を用いれば、固体撮像装置の上面から見た場合に、固体撮像装置の領域から、裏面側の配線端子に接続する配線が、はみ出さない配線を製造する方法を実現することができ、固体撮像装置を使ったカメラの小型化を実現できる。 By using the wiring manufacturing method of the solid-state image sensor of the present invention, when viewed from the upper surface of the solid-state image sensor, the wiring connected to the wiring terminal on the back surface side does not protrude from the area of the solid-state image sensor. The method can be realized, and the size of the camera using the solid-state image sensor can be realized.
以下、本発明の実施形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図４は、本発明の配線接続方法により完成した図である。配線１３は、先端配線部１０、金属むき出し配線部１１、配線カバー部１２から構成されている。
金属むき出し配線部１１の先端に、半田を付けた前記先端配線部１０が配置され、前記金属ボール８に接続されている。固体撮像装置へ配線される配線の大部分は、配線カバー部１２となっており、他の配線との接触を回避する構造となっている。配線１４は、配線１３と同様の構造となっている。
FIG. 4 is a diagram completed by the wiring connection method of the present invention. The wiring 13 is composed of a tip wiring portion 10, a bare metal wiring portion 11, and a wiring cover portion 12.
The soldered tip wiring portion 10 is arranged at the tip of the bare metal wiring portion 11 and is connected to the metal ball 8. Most of the wiring wired to the solid-state image sensor is a wiring cover portion 12, and has a structure for avoiding contact with other wiring. The wiring 14 has the same structure as the wiring 13.
前記固体撮像装置１の裏面に前記配線１３を接続する方法として容易に考えられる方法としては、前記金属ボール８に対して、前記先端配線部１０を掴んで単純にＷＢ装置で配線する方法が考えられる。
しかしながら、図１で説明したように、前記固体撮像装置１の横方向寸法１５が小さくなった時に、前記配線１３と前記配線１４が接近するため、通常、前記撮像部３の表面の側に行われるＷＢによる配線接続方法が使えない。一般的には、通常のＷＢ装置は、前記先端配線部１０を掴んで金属ボール８に配線する。もしも前記横方向寸法１５が小さい場合には、最初に前記配線１３を前記金属ボール８にＷＢした後に、前記配線１４を前記金属ボール８にＷＢする時には、前記配線１４を掴んだＷＢ装置の部分が、前記配線１３または前記配線１３の前記金属ボール８に接触する可能性が高まり、前記配線１３の接続部を破壊することとなる。
As a method that can be easily considered as a method of connecting the wiring 13 to the back surface of the solid-state image sensor 1, a method of simply grasping the tip wiring portion 10 and simply wiring the metal ball 8 with the WB device can be considered. Be done.
However, as described with reference to FIG. 1, when the lateral dimension 15 of the solid-state image sensor 1 becomes smaller, the wiring 13 and the wiring 14 come close to each other, so that the wiring 13 and the wiring 14 usually approach the surface side of the image pickup unit 3. The wiring connection method by WB cannot be used. Generally, in a normal WB device, the tip wiring portion 10 is grasped and wired to the metal ball 8. If the lateral dimension 15 is small, the portion of the WB device that grips the wiring 14 when the wiring 13 is first WB to the metal ball 8 and then the wiring 14 is WB to the metal ball 8. However, the possibility of contacting the wiring 13 or the metal ball 8 of the wiring 13 increases, and the connection portion of the wiring 13 is destroyed.
図５は、本発明の配線接続方法を実現する配線接続装置１６の図である。前記配線接続装置１６は、前記配線１３と前記配線１４を固定する配線固定部１７と、固体撮像装置を固定する固体撮像装置固定部１７から構成されている。 FIG. 5 is a diagram of a wiring connection device 16 that realizes the wiring connection method of the present invention. The wiring connection device 16 is composed of a wiring fixing portion 17 for fixing the wiring 13 and the wiring 14, and a solid-state image pickup device fixing portion 17 for fixing the solid-state image pickup device.
前記配線固定部１７によって、前記配線１３と前記配線１４は、前記固体撮像装置１の裏面に対して、ほぼ垂直になるように固定されている。また前記固体撮像装置１は、前記固体撮像装置固定部１８で、前記配線接続装置１６に対して垂直に固定されている。
次に前記配線固定部１７を前記固体撮像装置１の裏面に対して平行を保ったままで配線固定部の移動方向１９に沿って徐々に移動する。同時に、前記配線１３と前記配線１４との、それぞれの前記先端配線部１０は、前記固体撮像装置１の裏面に対して垂直を保ったまま配線の移動方向２０へ移動する。最終的に、前記先端配線部１０は、それぞれの前記金属ボール８に接触することとなる。このように接触した後に、前記先端配線部１０と前記金属ボール８の領域を高温の雰囲気に置くことで、半田のような低温で溶解する前記金属ボール８は、前記先端配線部１０と結合して、配線が完了する。
The wiring 13 and the wiring 14 are fixed by the wiring fixing portion 17 so as to be substantially perpendicular to the back surface of the solid-state image sensor 1. Further, the solid-state image sensor 1 is fixed perpendicularly to the wiring connection device 16 by the solid-state image sensor fixing unit 18.
Next, the wiring fixing portion 17 is gradually moved along the moving direction 19 of the wiring fixing portion while being kept parallel to the back surface of the solid-state image sensor 1. At the same time, each of the tip wiring portions 10 of the wiring 13 and the wiring 14 moves in the moving direction 20 of the wiring while maintaining perpendicularity to the back surface of the solid-state image sensor 1. Finally, the tip wiring portion 10 comes into contact with the respective metal balls 8. After contacting in this way, by placing the region of the tip wiring portion 10 and the metal ball 8 in a high temperature atmosphere, the metal ball 8 that melts at a low temperature such as solder is bonded to the tip wiring portion 10. And the wiring is completed.
図６は、本発明の実施形態の配線接続方法における配線許容範囲を示す図である。
前記配線１３および前記配線１４は、前記固体撮像装置１の裏面に対して、できる限り垂直に保ちたいが、軟性内視鏡などに使う場合は、前記金属むき出し配線部１１が柔らかい場合がある。そのため、前記金属むき出し配線部１１および前記配線カバー部１２が垂直を保てなくて、９０度より傾いてしまう。もしも前記金属むき出し配線部１１および前記配線カバー部１２が傾いた場合には、前記金属ボール８と前記先端配線部１０が適切に接続できず、接触不良を起こしてしまう場合がある。
FIG. 6 is a diagram showing a wiring allowable range in the wiring connection method according to the embodiment of the present invention.
The wiring 13 and the wiring 14 are desired to be kept as perpendicular as possible to the back surface of the solid-state image sensor 1, but when used for a flexible endoscope or the like, the bare metal wiring portion 11 may be soft. Therefore, the bare metal wiring portion 11 and the wiring cover portion 12 cannot be kept vertical and are tilted more than 90 degrees. If the bare metal wiring portion 11 and the wiring cover portion 12 are tilted, the metal ball 8 and the tip wiring portion 10 may not be properly connected, resulting in poor contact.
このように傾きの限界値は、前記金属ボール８の横幅２１と、前記先端配線部１０と前記金属むき出し配線部１１とを足した配線長２２と、の関係によって決まってくる。もしも前記配線２１の傾き角度が大きい場合には、前記先端配線部１０と前記金属ボール８が離れてしまい配線が不可能となる。 As described above, the limit value of the inclination is determined by the relationship between the width 21 of the metal ball 8 and the wiring length 22 which is the sum of the tip wiring portion 10 and the bare metal wiring portion 11. If the inclination angle of the wiring 21 is large, the tip wiring portion 10 and the metal ball 8 are separated from each other, making wiring impossible.
図７は、傾きの許容範囲を求めた図である。たとえば、前記金属ボール８の横幅２１が３０ｕｍで、前記先端配線部１０と前記金属むき出し配線部１１との合計の配線長２２が６０ｕｍの場合に、傾き角度２３は、およそ３０度となる。したがって、垂直から３０度以上傾くと前記金属ボール８と前記先端配線部１０が接触し難くなることがわかる。 FIG. 7 is a diagram showing an allowable range of inclination. For example, when the width 21 of the metal ball 8 is 30 um and the total wiring length 22 of the tip wiring portion 10 and the bare metal wiring portion 11 is 60 um, the inclination angle 23 is about 30 degrees. Therefore, it can be seen that when the metal ball 8 is tilted by 30 degrees or more from the vertical, it becomes difficult for the metal ball 8 and the tip wiring portion 10 to come into contact with each other.
したがって、なるべく前記傾き角度２３を少なくして、前記配線１３および前記配線１４が、前記固体撮像装置の裏面に対して、できる限り垂直に保つことが必要である。
一般的に、前記配線長２２は、前記金属ボール８の前記横幅２１の２倍以上取ることが好ましいため、傾き角度は３０度未満にすることにより、安定した配線接続を実現することができる。
Therefore, it is necessary to reduce the tilt angle 23 as much as possible so that the wiring 13 and the wiring 14 are kept as perpendicular as possible to the back surface of the solid-state image sensor.
Generally, the wiring length 22 is preferably twice or more the width 21 of the metal ball 8, so that a stable wiring connection can be realized by setting the inclination angle to less than 30 degrees.
以上説明したように、本発明によれば、固体撮像装置の上面から見た場合に、固体撮像装置の裏面側の配線端子に接続する配線が、固体撮像装置の側面から、はみ出さない配線の製造方法を実現することができ、固体撮像装置を使ったカメラの小型化を実現できる。 As described above, according to the present invention, when viewed from the upper surface of the solid-state image sensor, the wiring connected to the wiring terminal on the back surface side of the solid-state image sensor does not protrude from the side surface of the solid-state image sensor. The manufacturing method can be realized, and the size of the camera using the solid-state image sensor can be realized.
本発明の固体撮像装置へ配線する製造方法は有用であり、固体撮像装置を使ったカメラの小型化を実現できるため、内視鏡や、狭い領域内を観察する産業用カメラを実現する製造方法としても有用である。また、この製造装置を利用することで、小型の撮像装置への裏面配線の自動化を実現でき、製造コストを大幅に低減して、内視鏡や産業カメラの市場拡大に大きく貢献することができる。また、内視鏡の低価格化が実現することで、使い捨てカメラ（ディスポーザルカメラ）の新規市場を拡大することができ、大変有用な装置となる。 The manufacturing method of wiring to the solid-state image sensor of the present invention is useful, and since the camera using the solid-state image sensor can be miniaturized, a manufacturing method for realizing an endoscope or an industrial camera for observing a narrow area. It is also useful as. In addition, by using this manufacturing equipment, it is possible to realize automation of backside wiring to a small imaging device, significantly reduce manufacturing costs, and greatly contribute to the expansion of the market for endoscopes and industrial cameras. .. In addition, by reducing the price of endoscopes, it is possible to expand the new market for disposable cameras (disposable cameras), which is a very useful device.
１ 固体撮像装置
２ 回路基板
３ 撮像部
４ センサ端子
５ 基板端子
６ ワイヤー
７ 貫通電極端子
８ 金属ボール
９ 回路配線
１０ 先端配線部
１１ 金属むき出し配線部
１２ 配線カバー部
１３ 配線
１４ 配線
１５ 横方向寸法
１６ 配線接続装置
１７ 配線固定部
１８ 固体撮像装置固定部
１９ 配線固定部の移動方向
２０ 配線の移動方向
２１ 金属ボールの横幅
２２ 配線長
２３ 傾き角度
1 Solid-state imaging device 2 Circuit board 3 Imaging unit 4 Sensor terminal 5 Board terminal 6 Wire 7 Through electrode terminal 8 Metal ball 9 Circuit wiring 10 Tip wiring unit 11 Metal exposed wiring unit 12 Wiring cover unit 13 Wiring 14 Wiring 15 Horizontal dimension 16 Wiring connection device 17 Wiring fixing part 18 Solid image pickup device fixing part 19 Moving direction of wiring fixing part 20 Moving direction of wiring 21 Width of metal ball 22 Wiring length 23 Tilt angle
Claims (3)
前記製造方法を行う製造装置は、前記配線端子に接続するための配線を固定する配線固定部と、前記固体撮像装置を固定する固体撮像装置固定部とを有し、前記配線固定部と前記固体撮像装置固定部が平行に配置され、前期配線は前記配線固定部に対して交わる角度を持って固定され、前記固体撮像装置の裏面は前記固体撮像装置固定部と平行に固定され、
前期配線は前記固体撮像装置の裏面に対して交わる方向に前記配線固定部に固定された後に、前記配線固定部を前記固体撮像装置の裏面に対して平行を保った状態で近づけることで、前記固体撮像装置の裏面の前期配線端子と前期配線とを接続することを特徴とする製造方法および製造装置。 A manufacturing method in which, in a solid-state image sensor having a wiring terminal on the back surface side, when the side having the image pickup unit is the front surface, the wiring connected to the wiring terminal is wired at an angle intersecting the back surface of the solid-state image sensor. And manufacturing equipment
The manufacturing apparatus that performs the manufacturing method has a wiring fixing portion for fixing the wiring for connecting to the wiring terminal and a solid-state image sensor fixing portion for fixing the solid-state image sensor, and the wiring fixing portion and the solid are provided. The image sensor fixing portion is arranged in parallel, the wiring in the previous period is fixed at an angle intersecting the wiring fixing portion, and the back surface of the solid-state imaging device is fixed in parallel with the solid-state imaging device fixing portion.
The wiring in the previous period is fixed to the wiring fixing portion in a direction intersecting the back surface of the solid-state image sensor, and then the wiring fixing portion is brought close to the back surface of the solid-state image sensor while being parallel to the wiring fixing portion. A manufacturing method and a manufacturing apparatus characterized in that the early wiring terminal on the back surface of the solid-state image sensor and the early wiring are connected.
前記製造方法を行う製造装置は、前記配線端子に接続するための配線を固定する配線固定部と、前記固体撮像装置を固定する固体撮像装置固定部とを有し、前記配線固定部と前記固体撮像装置固定部が平行に配置され、前期配線は前記配線固定部に対して垂直を持って固定され、前記固体撮像装置の裏面は前記固体撮像装置固定部と平行に固定され、
前期配線は前記固体撮像装置の裏面に対して垂直に前記配線固定部に固定された後に、前記配線固定部を前記固体撮像装置の裏面に対して平行を保った状態で近づけることで、前記固体撮像装置の裏面の前期配線端子と前期配線とを接続することを特徴とする製造方法および製造装置。 In a solid-state image sensor having a wiring terminal on the back side when the side having the image pickup unit is the front surface, a manufacturing method in which the wiring connected to the wiring terminal is wired perpendicular to the back surface of the solid-state image sensor. It ’s a manufacturing device,
The manufacturing apparatus that performs the manufacturing method has a wiring fixing portion for fixing the wiring for connecting to the wiring terminal and a solid-state image sensor fixing portion for fixing the solid-state image sensor, and the wiring fixing portion and the solid are provided. The image sensor fixing portion is arranged in parallel, the wiring in the previous period is fixed perpendicularly to the wiring fixing portion, and the back surface of the solid-state imaging device is fixed in parallel with the solid-state imaging device fixing portion.
The wiring in the previous period is fixed to the wiring fixing portion perpendicularly to the back surface of the solid-state image sensor, and then the wiring fixing portion is brought close to the back surface of the solid-state image sensor while being parallel to the solid. A manufacturing method and a manufacturing apparatus characterized in that the early wiring terminal on the back surface of the image sensor and the early wiring are connected.
前記製造方法を行う製造装置は、前記配線端子に接続するための配線を固定する配線固定部と、前記固体撮像装置を固定する固体撮像装置固定部とを有し、前記配線固定部と前記固体撮像装置固定部が平行に配置され、前期配線は前記配線固定部に対して垂直な角度から３０度未満で傾いて固定され、前記固体撮像装置の裏面は前記固体撮像装置固定部と平行に固定され、
前期配線は前記固体撮像装置の裏面に対して垂直な角度から３０度未満で傾いて前記配線固定部に固定された後に、前記配線固定部を前記固体撮像装置の裏面に対して平行を保った状態で近づけることで、前記固体撮像装置の裏面の前期配線端子と前期配線とを接続することを特徴とする製造方法および製造装置。 When the side having the image pickup unit is the front surface, in the solid-state image sensor having the wiring terminal on the back surface side, the wiring connected to the wiring terminal is tilted at an angle less than 30 degrees perpendicular to the back surface of the solid-state image sensor. It is a manufacturing method and manufacturing equipment to be wired
The manufacturing apparatus that performs the manufacturing method has a wiring fixing portion for fixing the wiring for connecting to the wiring terminal and a solid-state imaging device fixing portion for fixing the solid-state image sensor, and the wiring fixing portion and the solid-state. The image sensor fixing portion is arranged in parallel, the wiring in the previous period is fixed at an angle of less than 30 degrees perpendicular to the wiring fixing portion, and the back surface of the solid-state imaging device is fixed in parallel with the solid-state imaging device fixing portion. Being done
The wiring in the previous period was tilted from an angle perpendicular to the back surface of the solid-state image sensor by less than 30 degrees and fixed to the wiring fixing portion, and then the wiring fixing portion was kept parallel to the back surface of the solid-state image sensor. A manufacturing method and a manufacturing apparatus, characterized in that the early wiring terminal on the back surface of the solid-state image sensor and the early wiring are connected by bringing them closer to each other in a state.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013118337A (en) * | 2011-12-05 | 2013-06-13 | Olympus Corp | Imaging module and imaging unit |
| WO2016194074A1 (en) * | 2015-05-29 | 2016-12-08 | オリンパス株式会社 | Imaging device, endoscope system, and method for manufacturing imaging device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013118337A (en) * | 2011-12-05 | 2013-06-13 | Olympus Corp | Imaging module and imaging unit |
| WO2016194074A1 (en) * | 2015-05-29 | 2016-12-08 | オリンパス株式会社 | Imaging device, endoscope system, and method for manufacturing imaging device |
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