JP2010016013A - Method for mounting semiconductor device, semiconductor element module, and electronic information apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device, capable of easily mounting a semiconductor device while keeping a substrate surface and an image pickup element in a horizontal state and preventing defective image quality while maintaining bonding strength of solder and heat dissipation performance. <P>SOLUTION: A sensor device 4 having a solid-state imaging element 3 mounted on a center portion of a front surface is placed on pearl balls 5 of four points so as to position each of metal junction terminals 4a on the rear surface of the sensor device 4 and each of paste-like solder materials 6a. An ambient temperature is set at 230°C, and each of the metal junction terminals 4a of the rear surface side of the sensor device 4 and each terminal portion (land portion) of the center portion side of a wiring pattern 2a are each joined as a solder junction portion 6 by each of the paste-like solder materials 6a. As described above, the pearl balls 5 for holding a distance are intervened between the mount substrate 2 and the sensor device 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention includes a semiconductor device mounting method for mounting a semiconductor device having a semiconductor element on a substrate, and a plurality of light receiving units that are mounted by the semiconductor device mounting method and that photoelectrically convert image light from a subject to image it. A semiconductor element module in which an imaging element as a semiconductor element or a light emitting element as a semiconductor element for generating emitted light and a light receiving element as a semiconductor element for receiving incident light are modularized, and as this semiconductor element module Information on digital cameras such as digital video cameras and digital still cameras, image input cameras, scanner devices, facsimile devices, camera-equipped mobile phone devices, and semiconductor element modules that use solid-state imaging modules as image input devices in the imaging unit Pickup used in the recording / playback unit Apparatus and an electronic information device, such as a.

  Solid-state imaging modules as conventional semiconductor element modules of this type are mainly used as camera modules in mobile phone devices with cameras, personal digital assistants (PDAs), card cameras, etc., and ceramic and glass-filled epoxy resins A solid-state imaging chip as a semiconductor device having a solid-state imaging element as a semiconductor element having a plurality of light-receiving portions that photoelectrically convert image light from the subject and image the subject on a mounting substrate, and the like, and imaging incident light And a holder member to which a condenser lens for imaging on the element is fixed. In this case, each terminal of the solid-state imaging chip is disposed on the wiring pattern of the mount substrate, soldered, and electrically connected to each other. In addition, it is important to obtain a clear image by accurately fixing the imaging distance between these condenser lenses and the image sensor in parallel and forming the incident light on the image sensor with high accuracy. .

  A case where a sensor device as a semiconductor device is mounted on the mount substrate will be described with reference to FIGS.

  12 (a) to 12 (d) are perspective views schematically showing respective steps for explaining a mounting method of a sensor device having a conventional solid-state imaging device. FIG. 13A to FIG. 13D are longitudinal sectional views of respective steps corresponding to FIG. 12A to FIG. 12D, respectively.

  In the conventional sensor device mounting method, as shown in FIGS. 12A and 13A, first, the mounting substrate 150 having the wiring pattern 150a formed on the front surface side is set at a predetermined position of the mounting apparatus.

  Next, a resin or metal thin plate mask (not shown) having holes patterned at land positions corresponding to the soldered portions of the wiring 150a is placed on the mount substrate 150 and placed on the mask. Apply paste-like solder material. Thereafter, when the mask is removed from the mount substrate 150, as shown in FIGS. 12B and 13B, the paste-like solder material 151 is disposed at the land position corresponding to the soldered portion of the wiring pattern 150a. Is done. Here, each of the paste-like solder materials 151 is arranged at six locations on the central end of the three wirings 150a on the left and right. The plate thickness of the mask is about 0.5 mm.

  Further, as shown in FIG. 12C and FIG. 13C, the sensor device 153 having the solid-state imaging device 152 mounted on the center portion on the front surface side is connected to each terminal 153 a on the back surface side of the sensor device 153 by the robot arm. And each paste-like solder material 151 are respectively aligned and placed on the mount substrate 150. When the sensor device 153 is placed on the paste-like solder material 151, the paste-like solder material 151 has a paste shape, and therefore sinks to some extent due to the weight of the sensor device 153.

  Thereafter, a temperature of 230 degrees Celsius is applied to the mounting substrate 150, each paste-like solder material 151, and the sensor device 153 on which the solid-state imaging device 152 is mounted, as shown in FIGS. 12 (d) and 13 (d). Each paste-like solder material 151 is melted, and each metal terminal 153a on the back surface side of the sensor device 153 and each land portion on the center side of the wiring pattern 150a are electrically connected to each other by a solder joint 151b made of each paste-like solder material 151. Jointly.

  Next, as an example of another conventional solid-state imaging module, a fine filler smaller than a rectangular pixel having a side of 2 to 8 μm (0.002 to 0.008 mm), for example, is used as an adhesive filler. Is disclosed in Patent Document 1.

  FIG. 14 is a longitudinal sectional view showing an example of the configuration of the main part of a conventional imaging device disclosed in Patent Document 1. As shown in FIG.

  In FIG. 14, a conventional imaging device 100 disclosed in Patent Document 1 includes an aspheric lens 103, an optical filter 104, and a semiconductor imaging element 105 arranged along the optical axis L, and a three-dimensional substrate 102 that holds them. And a printed circuit board (FPC) 110 connected to the three-dimensional board 102. The portion 108 surrounding the opening of the three-dimensional substrate 102 is made of glass reinforced PPA (polyphthalamide resin) or the like, and is black to prevent light transmission.

  The three-dimensional substrate 102 has a role of fixing the semiconductor imaging element 105 and also serves as a holding member that holds the optical filter 104. The three-dimensional substrate 102 includes a cylindrical lens barrel portion 102a and a bottom portion 102b continuous with one end face of the lens barrel portion 102a.

  The optical filter 104 has an IR (InfraRed) cut coat on one side of a base material made of lead glass, and an antireflection AR (Anti Reflection) coat on the other side.

The adhesive 106 for bonding the optical filter 104 to the three-dimensional substrate 102 will be described. A glass-reinforced PPA (polyphthalamide resin) is used for the three-dimensional substrate 102, and its linear expansion coefficient is about 40 × 10 ⁻⁶ mm / ° C. On the other hand, the linear expansion coefficient of the optical filter 104 is approximately ¹⁰ × 10 -6 mm / ℃. In order to fix both of them appropriately, the adhesive 106 has a filler (not shown) so that the linear expansion coefficient of the adhesive 106 is a value between the linear expansion coefficient of the three-dimensional substrate 102 and the linear expansion coefficient of the optical filter 104. It is included. The filler is made of silicon dioxide (SiO ₂ ) so as to be suitable for optical use. Furthermore, it is preferable to use a spherical filler so as not to have anisotropy after the adhesive 106 is cured.

  The size of the filler is smaller than the pixel size of the semiconductor image sensor 5 and is ½ or more of the pixel size. Hereinafter, the reason why the adhesive 106 including the filler of this size is used will be described.

  Prior to the description of the diameter of the filler, problems caused by the adhesive 106 containing the filler will be described. When the adhesive 106 is cured, the filler contained in the adhesive 106 may be scattered, or part of the filler may be exposed particularly at the end face portion. Further, after the optical filter 104 is attached to the three-dimensional substrate 102, the imaging element 105 and the optical system lens 103 are attached, or the FPC 110 is mounted, and a focus adjustment process is performed as necessary. The filler at the end face part may fall off due to impact or the like. The analysis of the imaging apparatus 100 revealed that the scattered / dropped filler adheres to the surface of the imaging element 105 and causes a decrease in the signal output from the pixel. Particularly recently, as the imaging device 100 has been downsized, it has become difficult to ensure the dimensions of the parts necessary for device disassembly, and many devices cannot be disassembled. In such an imaging apparatus 100, when the scattered / dropped filler adheres to the surface of the imaging element 105, there is a situation in which the imaging apparatus 100 has to be discarded.

  In this imaging apparatus 100, since the optical filter 104 is bonded using the adhesive 106 whose filler diameter is equal to or smaller than the pixel size, even if the scattered / dropped filler adheres to the surface of the semiconductor imaging element 105, the filler is corrected by scratch correction. It is possible to obtain the same image as in the absence.

  In this way, it is possible to correct black spots or the like of images that can be caused by fillers using a function that corrects defects due to CCD defects (scratch correction function), so changes in processes, construction methods, equipment, etc. There is no need to do. That is, it is possible to reduce image quality deterioration due to the filler without reducing the workability of assembling the imaging device.

  Patent Document 2 discloses a filler having an average particle diameter of 10 to 80 μm (0.01 to 0.08 mm) larger than that of Patent Document 1 as an adhesive filler.

  In the conventional die bonding paste disclosed in Patent Document 2, an epoxy resin, a curing agent for the epoxy resin, a filler having an average particle size smaller than that of the spherical thermoplastic organic filler, and an average particle size of 10 to 80 μm (0.01 And a spherical thermoplastic organic filler having a particle size distribution of ± 5 μm or less as an essential component. In the die bonding paste, the thermoplastic organic filler is contained in a proportion of 0.1 to 10% by weight with respect to the total amount of the components.

  Further, as another example of the conventional solid-state imaging module, Patent Documents 3 and 4 each disclose a granular round bump as an adhesive filler.

  FIG. 15 is a longitudinal sectional view showing an example of the configuration of the main part of a conventional imaging device disclosed in Patent Document 3. As shown in FIG.

  In FIG. 15, a conventional imaging device 200 disclosed in Patent Document 3 includes a base 201 having a frame-like planar shape in which an opening 202 is formed in an inner region, and made of an insulating material. A plurality of wires 204 extending from the region on the opening 202 side toward the outer peripheral edge of the base 201 and the surface of the base 201 attached to one surface of the base 201 are received by the opening 202. An image sensor 205 mounted so that the region 205a faces, and each end of the base 201 on the opening 201 side and the outer peripheral end side of each wiring forms an internal terminal portion 204a and an external terminal portion 204b, respectively. The electrodes of the image sensor and the internal terminal portions of the wiring are electrically connected. The wiring is formed by a thin metal plate lead, and the base 201 is constituted by a resin molded body in which the thin metal plate lead is embedded, and at least a part of the end surface of the thin metal plate lead is embedded in the base 201. The translucent plate 206 is provided so as to cover the opening 201 of the base 201.

  An electrode pad (not shown) connected to the circuit of the light receiving region 205a is disposed on the same surface as the light receiving region 205a of the image sensor 205, and a bump 208 made of Au is provided on the electrode pad. An end portion of each wiring 204 adjacent to the opening 202 forms an internal terminal portion 204 a, and the internal terminal portion 204 a is electrically connected to an electrode pad of the image sensor 205 via a bump 208. A portion of each wiring 204 arranged on the lower surface of the outer peripheral end portion (the outer portion of the recess 203) of the base 201 forms an external terminal portion 204b and is used to connect to an electrode on the circuit board.

  FIG. 16 is a longitudinal sectional view showing an example of the configuration of the main part of a conventional imaging device disclosed in Patent Document 4. As shown in FIG.

  In FIG. 16, a base 301 of a conventional imaging device 300 disclosed in Patent Document 4 is made of an insulating material, for example, a plastic resin such as an epoxy resin, and has a rectangular opening 302 at the center in a planar shape. It has a rectangular frame shape. The cross-sectional shape of the base 301 is a flat plate having a substantially uniform thickness as a whole. On the lower surface of the base 301, a plurality of wirings 303 made of metal foil leads are arranged from the periphery of the opening 302 to the outer peripheral end of the base 301. As the metal foil lead, for example, a Cu alloy, 42 alloy (Fe—Ni 42 alloy) or the like similar to the material used for a normal lead frame is used, and the thickness is approximately 2 to 3 μm.

  An imaging element 304 such as a CCD formed on the Si substrate is fixed to the surface of the base 301 on which the wiring 303 is formed, and its electrode is connected to the wiring 303. An end portion of each wiring 303 adjacent to the opening 302 forms an internal terminal portion 303 a, and the internal terminal portion 303 a is electrically connected to an electrode pad of the image sensor 304 via a bump 307. A portion of each wiring 303 arranged on the lower surface of the outer peripheral end portion of the base 301 forms an external terminal portion 303b and is used to connect to an electrode on the circuit board. A light receiving region 304a is provided in the central portion on the surface side of the image pickup device 304, and a bump 307 is provided between the peripheral portion on the surface side of the image pickup device 304 and the internal terminal portion 303a. The imaging element 304 and the internal terminal portion 303a are bonded by a sealing resin 306. The translucent plate 305 is provided so as to cover the opening 302 of the base 301.

  FIG. 17 is a plan view showing a configuration example of a main part of a conventional semiconductor device disclosed in Patent Document 5, and FIG. 18 is a longitudinal sectional view taken along line AB of FIG.

  17 and 18, a conventional semiconductor device 400 disclosed in Patent Document 4 is disposed between a resin substrate 401, a semiconductor chip 404, and between the resin substrate 401 and the semiconductor chip 404 and has a uniform particle shape. In addition, a particle 402 having an average particle diameter of 0.01 to 0.08 mm and a die bond paste 403 for bonding the resin substrate 401 and the semiconductor chip 404 are formed.

  A groove 405 is formed in the outer edge portion of the mounting region of the semiconductor chip 404 on the resin substrate 401, and the inside of the groove 405 is filled with particles 402. Since the semiconductor chip 404 is rectangular when viewed in plan, the four grooves 405 are formed in the resin substrate 401. As an effect, the uniform height of the chip can be controlled by inserting particles 402 having a uniform particle shape.

  The depth of the groove 405 dug into the resin substrate 401 is shallower than the size of the particle 402, and the width of the groove 405 is set wider than the diameter of the particle 402. For this reason, when the particle 402 is put in the groove 405, a part of the particle 402 protrudes from the surface of the resin substrate 401. A die bond paste 403 is applied so as to cover the particles 402 on the resin substrate 401, and the semiconductor chip 404 is arranged to be pressed thereon.

At this time, the particles 402 are held by the grooves 405, and a gap having a uniform height is formed between the semiconductor chip 404 and the resin substrate 401 by substantially the same amount as the difference between the size of the particles 402 and the depth of the grooves 405. Will be.
JP 2004-327914 A JP 2002-309065 A JP 2004-327916 A JP 2004-356226 A JP 2006-165313 A

  In the above-described conventional configuration, when the sensor device 153 provided with the solid-state imaging element 152 that images the subject is mounted on the mount substrate 150, the sensor device 153 is located at the solder position of the wiring pattern 150a printed on the mount substrate 150. These terminals are aligned, the sensor device 153 is mounted, and the solder is reflowed by heat treatment. However, when the sensor device 153 is mounted in close contact with the mount substrate 150, the heat dissipation effect is reduced and a dark current defect occurs. Therefore, the sensor device 153 is mounted floating on the mount substrate 150. On the other hand, the amount of solder varies depending on the printing variation of the wiring pattern 150a and the wiring pattern 150a, and as shown in FIG. 19, a difference occurs in the height of the solder joint 151b during heat treatment. This difference in the height of the solder joint portion 151b causes the surface of the sensor device 153 to be tilted (turned) with respect to the surface of the mount substrate 150, so that the lens focal length of the camera module body is solid-state imaging of the sensor device 153. An image quality defect (partially out of focus) due to the difference in the position of the light receiving surface (the center portion and its peripheral portion) in the element 152 occurs.

  As in Patent Documents 1 and 2, the fine filler as the adhesive filler is not suitable for controlling the height of the sensor device because the filler is too fine, and the sensor device is closely attached to the mounting substrate. As a result, the heat dissipation effect as well as the adhesive strength of the solder is reduced, and a dark current defect may occur.

  In Patent Documents 3 and 4, since the bumps are not uniform spheres and have different sizes, it is difficult to use them as a height control material for the mounting substrate of the sensor device. In Patent Documents 3 and 4, it is considered that the height is controlled by pressing in parallel in a separate process using a soft material. However, since the bump size is different, the parallelism on the surface of the sensor device It is difficult to put out the sensor device and the sensor device may be tilted.

  In Patent Document 5, a semiconductor chip 404 is arranged on a resin substrate 401 with a large number of particles 402 interposed, and a large number of particles 402 are placed in a groove 405 along the inside of four sides of the semiconductor chip 404 having a rectangular shape in plan view. However, if the processing depth of the groove 405 formed in the resin substrate 401 varies, not only the diameter of the particle 402 varies but also the height of the semiconductor chip 404 is controlled. There is a possibility that the surface of the semiconductor chip 404 is inclined due to an error in the control. When the groove 405 is processed with a laser beam whose depth is likely to vary and the processing accuracy is high, it is necessary to separately prepare a high-cost laser processing machine. In addition, a large number of particles 402 are put in the groove 405, and if the particles 402 are put one by one in the groove 405, man-hours increase, and the resin substrate 401 is tilted to collectively put the particles 402 into the groove 405. In the case of putting the particles 402, the number of steps is reduced, but the particles 402 that cannot fit into the grooves 405 fall due to the inclination and are excluded from the surface of the resin substrate 401, but the particles 402 remain on the surface of the resin substrate 401. In this case, the height control is different by the depth of the groove 405, and the surface of the semiconductor chip 404 on the resin substrate 401 is inclined. In addition, the gap between the resin substrate 401 and the semiconductor chip 404 in this case is extremely small, and the semiconductor chip 404 is mounted in close contact with the resin substrate 401, thereby reducing the heat dissipation effect as well as the adhesive strength of the solder. In addition, there is a risk of dark current failure.

  The present invention solves the above-described conventional problems, and can easily and reliably mount the substrate surface and the image sensor while maintaining the heat radiation effect as well as the adhesive strength of the solder, thereby preventing image quality defects. Semiconductor device mounting method that can be used, semiconductor element module using this semiconductor device, mobile phone device with camera using this semiconductor element module as an image input device in an imaging unit, and using this semiconductor element module for an information recording / reproducing unit An object of the present invention is to provide an electronic information device such as a pickup device.

  The semiconductor device mounting method of the present invention is a semiconductor device mounting method in which a semiconductor device having a semiconductor element is mounted on a substrate. A ball for holding a target interval is interposed between the substrate and the semiconductor device. In this state, the semiconductor device mounting step of bonding the land portion of the wiring pattern of the substrate and each terminal of the semiconductor device by the bonding portion, thereby achieving the above object.

  Preferably, the semiconductor device mounting step in the semiconductor device mounting method of the present invention includes a solder material placement step of placing each paste-like solder material on each land portion of the wiring pattern, and each paste-like shape. A ball placing step for placing the ball on part or all of the solder material, and the semiconductor device, each terminal of the semiconductor device and each land portion of the wiring pattern are aligned, A semiconductor device mounting step of mounting on the ball, and a semiconductor device bonding step of melting each paste-like solder material and bonding each terminal of the semiconductor device and each land portion of the wiring pattern, respectively. Have.

  Further preferably, in the semiconductor device mounting step of the semiconductor device mounting method of the present invention, the paste-like heat in which one or a plurality of paste-like thermosetting resin materials are arranged at predetermined positions for mounting the semiconductor device on the substrate. Positioning the cured resin material placement step, the ball placement step of placing the ball on the paste-like thermosetting resin material, and the terminals of the semiconductor device and the land portions of the wiring pattern of the substrate, respectively A semiconductor device placement step of placing the semiconductor device on the ball, thermosetting the paste-like thermosetting resin material, and each terminal of the semiconductor device and each land portion of the wiring pattern. And a semiconductor device bonding step in which each is bonded by solder.

  Further preferably, the predetermined position for mounting the semiconductor device in the semiconductor device mounting method of the present invention is a position other than each land portion of the wiring pattern.

  More preferably, the ball in the semiconductor device mounting method of the present invention is at least one of a resin sphere, a sphere having a metal plating applied to the surface of the resin sphere, and a metal sphere.

  Further preferably, when the ball in the semiconductor device mounting method of the present invention is a sphere or metal sphere in which the surface of the resin sphere is subjected to metal plating, the metal material of the metal plating or the metal of the metal sphere The material is the same material as that of the solder.

  Further preferably, the ball in the semiconductor device mounting method of the present invention supports the semiconductor device at positions of four or more land portions having the largest support area among the plurality of land portions of the wiring pattern. Yes.

  Further preferably, the solder material in the semiconductor device mounting method of the present invention is a paste-like solder material.

  Preferably, the method further includes a filling resin injection step of injecting a filling resin into the gap between the substrate and the semiconductor device after the semiconductor device mounting step in the semiconductor device mounting method of the present invention.

  Further preferably, the diameter of the ball in the semiconductor device mounting method of the present invention is set to be larger than the thickness of the solder material or the paste-like thermosetting resin material.

  Further, preferably, the diameter of the ball in the semiconductor device mounting method of the present invention is 0.2 to 0.8 mm.

  Further preferably, in the semiconductor device mounting method of the present invention, the target interval is such that the joint portion that joins the land portion of the wiring pattern of the substrate and each terminal of the semiconductor device causes poor bonding due to a predetermined concentrated thermal stress condition. This is an interval that does not become necessary.

  The semiconductor element module of the present invention includes a substrate having one or more wiring patterns formed on the front surface side, a semiconductor device having a semiconductor element mounted on the front surface side, and interposed between the substrate and the semiconductor device. , A ball for arranging the surface of the semiconductor device and the surface of the substrate in parallel and maintaining a target distance, and a junction for electrically joining a predetermined land portion of the wiring pattern and each terminal of the semiconductor device The above object is achieved by this.

  Preferably, the ball in the semiconductor element module of the present invention is placed on a predetermined land portion of the wiring pattern or placed on the substrate other than the land portion of the wiring pattern.

  Further preferably, the ball in the semiconductor element module of the present invention is at least one of a resin sphere, a sphere having a metal plating applied to the surface of the resin sphere, and a metal sphere.

  Further preferably, when the ball in the semiconductor element module of the present invention is a sphere or metal sphere in which the surface of the resin sphere is subjected to metal plating, and the joint is a solder joint, the metal plating The metal material or the metal material of the metal sphere is made of the same material as that of the solder joint.

  Further, preferably, the ball in the semiconductor element module of the present invention supports the semiconductor device at positions of four or more land portions having the largest support area among the plurality of land portions of the wiring pattern.

  Further preferably, the solder material of the joint in the semiconductor element module of the present invention is a paste-like solder material.

  Further preferably, in the semiconductor element module of the present invention, a filling resin is disposed in a gap between the substrate and the semiconductor device.

  Further preferably, the diameter of the ball in the semiconductor element module of the present invention is set larger than the thickness of the solder material of the joint.

  Further preferably, when the ball in the semiconductor element module of the present invention is placed on a predetermined land portion of the wiring pattern, the ball is disposed in a paste-like solder material, and the ball is connected to the wiring When placed on the substrate other than the land portion of the pattern, the ball is disposed in the pasty thermosetting resin material.

  Further preferably, the diameter of the ball in the semiconductor element module of the present invention is set to be larger than the thickness of the pasty thermosetting resin material.

  Further, preferably, the diameter of the ball in the semiconductor element module of the present invention is 0.2 to 0.8 mm.

  Further, preferably, the target interval in the semiconductor element module of the present invention is such that the bonding portion where the land portion of the wiring pattern of the substrate and each terminal of the semiconductor device are bonded does not cause poor bonding due to a predetermined concentrated thermal stress condition. Is the interval.

  Still preferably, in a semiconductor element module according to the present invention, the semiconductor element is an imaging element having a plurality of light receiving units that perform image conversion by photoelectrically converting image light from a subject.

  Further preferably, the semiconductor element in the semiconductor element module of the present invention is a light emitting element for generating outgoing light and a light receiving element for receiving incident light.

  Further preferably, in the semiconductor element module of the present invention, a holder member in which a condensing lens for imaging incident light on the imaging element is fixed at a predetermined position on the substrate of the semiconductor element module of the present invention. Is provided.

  Further preferably, in the semiconductor element module according to the present invention, one or a plurality of optical functional elements for directing the emitted light or bending the incident light in a predetermined direction on the substrate of the semiconductor element module according to the present invention are provided. A fixed holder member is provided.

  An electronic information device of the present invention uses the semiconductor element module of the present invention as an image input device in an imaging unit, and thereby achieves the above object.

  An electronic information device according to the present invention uses the semiconductor element module according to the present invention for an information recording / reproducing unit, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, since the spacing ball is interposed between the substrate surface and the semiconductor device, the substrate surface and the semiconductor device are positioned in parallel by the ball. As a result, the light receiving surface of the semiconductor element of the semiconductor element module is parallel to the substrate surface, so that the lens focal length is constant at any location such as the central portion and the peripheral portion of the light receiving surface, and due to the focus difference in the light receiving surface. Image quality defects are prevented.

  Also, since balls of the same diameter are embedded in the solder for joining the wiring pattern joints on the board surface and the respective terminals of the semiconductor device, the board surface is simultaneously controlled with the height of the semiconductor device on the board surface. It becomes possible to electrically join the joint portion (land portion) of the wiring pattern and each terminal of the semiconductor device with solder.

  Furthermore, a desired clearance can be provided between the substrate surface and the semiconductor device in accordance with the diameter of the ball. When each terminal of a semiconductor device is connected to the land portion of each wiring pattern of the substrate by soldering, the desired clearance is a gap where the difference in thermal expansion between the semiconductor device and the substrate does not affect the solder (fillet). is there. Depending on the volume of the solder (fillet), a desired clearance capable of relaxing the thermal stress between the semiconductor device and the substrate is required. Therefore, the size of the particles of Patent Documents 1 to 5 results in a fine clearance that cannot completely relieve the heat concentration stress between the semiconductor device and the substrate.

  In order to relieve the heat concentration stress between the semiconductor device and the substrate, an epoxy-based filling resin may be interposed in the clearance. In this case, since the semiconductor device and the substrate are joined by the filling resin, the concentrated thermal stress at the solder joint portion between the semiconductor device and the substrate is greatly reduced, and the solder joint portion between the semiconductor device and the substrate is destroyed. Is prevented.

  There is no need for groove processing as in Patent Document 5, and the height control with respect to the substrate surface of the semiconductor device becomes easier and more accurate. If a nozzle for mounting a small chip is shared, there is no need to prepare a nozzle separately. The ball can be easily and accurately placed on the solder or the adhesive.

  As described above, according to the present invention, before mounting the semiconductor device having the imaging element on the surface side on the substrate surface, the same diameter is provided on the solder portion or the adhesive on the substrate surface capable of supporting the semiconductor device. Since the ball for holding the gap is interposed between the substrate surface and the semiconductor device, the tilt of the image pickup device of the semiconductor device relative to the substrate surface is controlled by a jig or mounted. The image sensor of the semiconductor device can be aligned at a desired uniform target height with respect to the substrate surface without any subsequent correction. As a result, while maintaining the heat dissipation effect as well as the adhesive strength of the solder, it is possible to easily and reliably mount the substrate surface and the image pickup device horizontally and prevent image quality defects.

  Embodiments 1 and 2 of an image sensor module when a semiconductor device mounting method of the present invention, and a semiconductor element module on which a semiconductor device is mounted by the semiconductor device mounting method, are applied to an image sensor module. An image sensor module according to a third embodiment in which an optical member is further modularized in the first and second embodiments of the image sensor module, and an electronic information device using any one of the first to third embodiments of the image sensor module as an imaging unit The fourth embodiment will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view schematically illustrating a configuration example of an imaging element module according to Embodiment 1 of the present invention. FIG. 2 is a longitudinal sectional view of a main part of the image sensor module of FIG. FIG. 3 is an enlarged vertical cross-sectional view of a main part of the image sensor module of FIG.

  In FIG. 1 to FIG. 3, in the image sensor module 1 according to the first embodiment, the wiring pattern 2 a having a wiring width of 0.2 to 1 mm (here, 0.5 mm) is formed in three rows on the left and right sides with a central portion therebetween. Between the mount substrate 2, the sensor device 4 as a semiconductor device in which the solid-state imaging device 3 that photoelectrically converts incident light to generate a signal charge is mounted in the center portion on the surface side, and between the mount substrate 2 and the sensor device 4 A pearl ball 5 as a ball for disposing the sensor device 4 in parallel with the mount substrate 2 and the pearl ball 5 included therein, and the wiring pattern 2a of the mount substrate 2 and each connection terminal of the sensor device 4 And a solder joint portion 6 that electrically joins 4a.

  The pearl ball 5 may be made of a resin and spherical, or may be a resin sphere whose surface is metal-plated, or may be a metal sphere. Here, the surface of the resin sphere Further, as the metal plating material, the same alloy plating of tin (Sn) and silver (Ag) as the paste solder material of the solder joint portion 6 is performed. In short, in the case where the pearl ball 5 is a sphere or metal sphere in which the surface of the resin sphere is subjected to metal plating, the metal plating material or the metal material of the metal sphere is made of the same material as the solder material. The solder material and the metal material have affinity with each other, are resistant to thermal stress, have high bonding strength, and are difficult to peel off from each other.

  In addition, the pearl ball 5 supports the sensor device 4 at the four outermost positions of the wiring pattern 2a having the largest support area. However, the pearl ball 5 has a plurality of three or five or more places where the support area can be maximized. The sensor device 4 may be supported by a place. If the pearl ball 5 is supported only at three locations, the possibility of the sensor device 4 falling and tilting cannot be discarded, and the sensor device 4 is supported by a plurality of locations of four or more locations that can take the widest support area. stable. When the pearl ball 5 is placed on the paste-like solder material that becomes the solder joint portion 6, the pearl ball 5 sinks in the paste-like solder material due to the load of the robot arm (mounting machine) and the weight of the pearl ball 5. The pearl ball 5 is difficult to drop off from the paste-like solder material.

  The pearl ball 5 provides a desired clearance between the mount substrate 2 and the sensor device 4. An epoxy-based filling resin may be interposed in the clearance. In this case, the sensor device 4 and the mount substrate 2 are joined together by the epoxy-based filling resin, so that the sensor device 4 and the mount substrate 2 are joined together. The concentrated thermal stress of the solder joint 6 is greatly relieved, and the solder joint 6 between the sensor device 4 and the mount substrate 2 is prevented from being broken. The smaller the clearance is, the more the filling resin is required between the sensor device 4 and the mount substrate 2, and the larger the clearance is, the less the filling resin is necessary. When an epoxy filling resin having good fluidity is injected between the sensor device 4 and the mount substrate 2 from the tip of a thin nozzle, it easily flows into the clearance by capillary action.

  Hereinafter, a method of mounting the sensor device 4 as a semiconductor device on the mount substrate 2 with the above configuration will be described.

  FIG. 5A to FIG. 5E are perspective views schematically showing respective steps for explaining a method of mounting the sensor device 4 of FIG. 1 on the mount substrate 2. FIG. 6A to FIG. 6E are longitudinal sectional views of respective steps corresponding to FIG. 5A to FIG. 5E, respectively.

  As shown in FIGS. 5 (a) and 6 (a), the sensor device 4 of FIG. 1 is mounted on the mount substrate 2 by first wiring with a wiring width of 0.2 to 1 mm (here, 0.5 mm). The mount substrate 2 on which the pattern 2a is formed is set at a predetermined position on the table of the mounting apparatus.

  Next, a resin or metal thin plate mask (not shown) having holes patterned at the land positions corresponding to the soldered portions of the wiring pattern 2a is placed on the mount substrate 2 and the mask A paste-like solder material to be the solder joint portion 6 is applied from above. Thereafter, when the mask is removed from the mount substrate 2, as shown in FIGS. 5B and 6B, the paste-like solder material 6a is disposed at the land position corresponding to the soldered portion of the wiring pattern 2a. The Here, each paste-like solder material 6a is thick on the center end (land portion or foot pattern; bonding portion for melting and electrically bonding solder) of the left and right three wiring patterns 2a. Six places are arranged at a height of 0.1 to 0.3 mm (here, 0.25 mm). The thickness of the mask is about 0.3 mm here.

  Further, as shown in FIGS. 5 (c) and 6 (c), the four paste pastes on the outer side of the three paste-like solder materials 6a on the left and right sides are provided by the nozzle provided at the tip of the robot arm. Each spherical pearl ball 5 having a diameter of 0.2 to 0.8 mm (here 0.3 mm) is sucked and moved on each solder material 6a, and then exhausted and sequentially placed. The pearl ball 5 sinks into the paste solder material due to the load of the robot arm (mounting machine) and the weight of the pearl ball 5. The pearl ball 5 having a diameter of 0.3 mm is larger than the thickness 0.25 mm of the paste-like solder material 6a. Even if the pearl ball 5 sinks under its own weight in the paste-like solder material 6a, the pearl ball 5 The dimensional relationship is such that the upper surface portion of each is exposed.

  Further, as shown in FIGS. 5D and 6D, a sensor device 4 in which the solid-state imaging device 3 is mounted at the center portion on the surface side is replaced with a sensor device by a nozzle provided at the tip of the robot arm. 4, the respective metal joint terminals 4 a on the back surface side and the respective paste-like solder materials 6 a are aligned and placed on the four pearl balls 5. When the sensor device 4 is placed on the pearl ball 5 on the paste-like solder material 6a, the paste-like solder material 6a is in a paste shape. Therefore, the sensor device 4 is partially or completely pasted together with the pearl ball 5 by its own weight. Sinks into the solder material 6a.

  Thereafter, the mount substrate 2, each paste-like solder material 6a, and the sensor device 4 on which the solid-state imaging device 3 is mounted are placed in a reflow furnace, and the ambient temperature is set to 230 degrees Celsius. Thereby, as shown in FIGS. 5 (e) and 6 (e), each paste-like solder material 6a is melted, and each metal joint terminal 4a on the back surface side of the sensor device 4 and each central part side of the wiring pattern 2a are respectively melted. The end portions (land portions) are electrically joined as solder joint portions 6 by the respective paste-like solder materials 6a.

  As described above, according to the first embodiment, since the pearl ball 5 for maintaining the gap is interposed between the mount substrate 2 and the sensor device 4, the mount substrate 2 and the sensor device 4 are targeted by the pearl ball 5. They can be positioned in parallel at intervals. As a result, the light receiving surface of the solid-state image pickup device 3 of the image pickup device module 1 as a semiconductor device module is parallel to the surface of the mount substrate 2, so that the lens focal length can be increased at any location such as the center of the light receiving surface and its peripheral portion. It becomes constant, and image quality defects due to a focus difference in the light receiving surface can be prevented.

  Further, since the pearl ball 5 having the same diameter is embedded in the solder for joining the joint portion of the wiring pattern 2 a on the surface of the mount substrate 2 and each terminal of the sensor device 4, Simultaneously with the height control, the joint portion (land portion) of the wiring pattern 2a on the surface of the mount substrate 2 and each terminal of the sensor device 4 can be electrically joined with solder.

  Furthermore, a desired clearance (gap) can be provided between the substrate surface of the mount substrate 2 and the sensor device 4 according to the diameter of the pearl ball 5. When each terminal of the sensor device 4 and the land portion of each wiring pattern 2a of the mount substrate 2 are connected by solder, the desired clearance is the difference in thermal expansion between the sensor device 4 and the mount substrate 2 (solder ( It is a gap that does not affect the fillet.

In order to relieve the heat concentration stress between the sensor device 4 and the mount substrate 2, an epoxy-based filling resin may be interposed in the clearance. In this case, since the sensor device 4 and the mount substrate 2 are joined by the filling resin, the concentrated thermal stress of the solder joint portion 6 between the sensor device 4 and the mount substrate 2 is greatly relieved, and the sensor device 4 Breakage of the solder joint portion of the mount substrate 2 is prevented. The smaller this clearance is, the more resin is needed, and the larger the clearance is, the less resin is needed. When an epoxy filling resin having good fluidity is injected from the tip of a thin nozzle, it easily flows into the clearance by capillary action.
(Embodiment 2)
In the first embodiment, the paste-like solder material 6a is placed on each wiring pattern 2a of the mount substrate 2, the pearl ball 5 is placed on the paste-like solder material 6a, and each wiring pattern 2a of the mount substrate 2 is placed. At the same time, the distance between the mount substrate 2 and the sensor device 4 is controlled to a fixed target distance by the pearl ball 5, while the metal joint terminals 4a of the sensor device 4 are joined by soldering. In addition to the wiring patterns 2a on the mount substrate 2, 4 thermosetting paste adhesives 7 as thermosetting paste-like resin materials, which will be described later, are provided at the center between the left and right wiring patterns 2a on the mount substrate 2. The pearl ball 5 is placed on the place, the sensor device 4 is placed thereon, and each wiring pattern 2a of the mount substrate 2 and the sensor device are placed thereon. The electrical connection between the metal connecting terminals 4a of separately, will be described a case of performing the soldering.

  FIG. 7A to FIG. 7E are perspective views schematically showing respective steps for explaining a method of mounting the sensor device 4 on the mount substrate 2 of the image sensor module according to the second embodiment of the present invention. It is. FIG. 8A to FIG. 8E are longitudinal sectional views of respective steps corresponding to FIG. 7A to FIG. 7E, respectively. In addition, the same code | symbol number is attached | subjected and demonstrated to the member which show | plays the effect similar to the said FIG.

  As shown in FIGS. 7A and 8A, the mounting method of the image sensor module 1A of Embodiment 2 on the sensor device 4 to the mount substrate 2 is as follows. First, the wiring width is 0.2 to 1 mm (here In this case, the mount substrate 2 on which the wiring pattern 2a of 0.5 mm is formed is set at a predetermined position on the table of the mounting apparatus.

  Next, as shown in FIGS. 7B and 8B, a pin transfer method (or a dispensing method using a syringe or the like: a pin transfer method is used when the amount is small, and a dispense method is used when the amount is larger than that. The thermosetting paste-like adhesive 7 is scooped off at the tip of the pin by the use of the two according to the amount, and the thermosetting paste-like adhesive 7 is applied to the inner central region of the soldered portion of the wiring pattern 2a. Are sequentially applied. As a result, the four thermosetting pasty adhesives 7 are arranged in the inner central region of the wiring pattern 2a, and further, at one of these central positions, the sensor device 4 is fixed higher than these. A thermosetting pasty adhesive 7a is disposed. Here, each thermosetting type paste-like adhesive 7 has a thickness of 0.1 to 0.3 mm (here, 0.25 mm) on the inner central portion (central region) of the left and right three wiring patterns 2a. Four places are arranged at a height.

  Further, as shown in FIGS. 7 (c) and 8 (c), the nozzle provided at the tip of the robot arm has a diameter of 0 on each of the left and right thermosetting pasty adhesives 7 respectively. A spherical pearl ball 5 having a diameter of 2 to 0.8 mm (here 0.3 mm) is sucked and moved, and then exhausted and sequentially placed. The pearl ball 5 sinks into the paste adhesive 7 due to the load of the robot arm (mounting machine) and the weight of the pearl ball 5. The diameter 0.3 mm of the pearl ball 5 is larger than the thickness 0.25 mm of the thermosetting pasty adhesive 7, and the pearl ball 5 is contained in the thermosetting pasty adhesive 7. Even if the robot arm sinks due to the load of the robot arm and the weight of the pearl ball 5, the dimensional relationship is such that the upper surface portion of the pearl ball 5 is exposed. In addition, the thickness of one thermosetting paste adhesive 7a in the center portion is a thickness dimension (thermosetting type) that is approximately equal to or higher than the height position (diameter dimension) of the pearl ball 5 at this time. The thickness of the paste adhesive 7a is set to a thickness dimension that always adheres to the bottom surface of the sensor device 4.

  Further, as shown in FIGS. 7 (d) and 8 (d), the sensor device 4 having the solid-state imaging device 3 mounted in the center portion on the surface side is replaced with a sensor device by a nozzle provided at the tip of the robot arm. 4, each metal bonding terminal 4a on the back surface side and the wiring pattern 2a of the mounting substrate 2 are aligned and placed on the four pearl balls 5 in the central portion inside them, and the sensor device It is placed on a thermosetting paste adhesive 7a for fixing. When the sensor device 4 is placed on the pearl ball 5 on the thermosetting pasty adhesive 7 and is placed on the thermosetting pasty adhesive 7a, the thermosetting pasty adhesive 7 is placed. Since it is in a paste shape, it completely sinks into the thermosetting pasty adhesive 7 together with the pearl ball 5 due to the load of the robot arm (mounting machine), the weight of the pearl ball 5 and the sensor device 4.

  Thereafter, the mounting substrate 2, each thermosetting paste adhesive 7 and the sensor device 4 on which the solid-state imaging device 3 is mounted are placed in a reflow furnace (high temperature furnace), and the ambient temperature is 120 degrees Celsius with a relatively low temperature. To. As a result, as shown in FIGS. 7E and 8E, the thermosetting pasty adhesive 7 is coined to fix the pearl ball 5 on the mount substrate 2.

  Subsequently, each paste-like solder material is positioned on each metal joint terminal 4a on the back surface side of the sensor device 4 and each end portion (land portion) on the center side of the wiring pattern 2a, and spotted by laser light. Then, heat is applied to the molten metal and electrically joined to form a solder joint 6.

As described above, according to the second embodiment, the ambient temperature is set to 120 degrees Celsius, which is a relatively low temperature, and each thermosetting paste adhesive 7 is coined to fix the pearl ball 5 on the mount substrate 2. Therefore, since the solid-state image sensor 3 of the sensor device 4 is not subjected to the high temperature of 230 degrees Celsius as in the first embodiment, the deterioration of the solid-state image sensor 3 due to heat is suppressed.
(Embodiment 3)
FIG. 9 is a vertical cross-sectional view schematically illustrating an exemplary configuration of a main part of an image sensor module according to Embodiment 3 of the present invention. The same member number is attached | subjected and demonstrated to the member which show | plays the effect similar to FIG.

In FIG. 9, the solid-state imaging module 10 of Embodiment 3 performs photoelectric conversion on the mount substrate 2 such as ceramics or glass-filled epoxy resin and image light from the subject on the mount substrate 2 as a camera module. A sensor device 4 having a solid-state image sensor 3 as a semiconductor element having a plurality of light receiving portions for imaging a subject in a package, a pearl ball 5 interposed between the mount substrate 2 and the sensor device 4, and incident light A holder member 12 to which a condenser lens 11 for forming an image on an image sensor is fixed, and a glass substrate provided between the condenser lens 11 in the holder member 12 and the sensor device 4 and having a surface coated with an infrared cut filter 13.
(Embodiment 4)
FIG. 10 is a block diagram illustrating a schematic configuration example of an electronic information device using, as an imaging unit, a solid-state imaging device including the solid-state imaging module 1, 1 </ b> A, or 10 according to Embodiments 1 to 3 of the present invention as Embodiment 4 of the present invention. FIG.

  In FIG. 10, an electronic information device 90 according to the fourth embodiment includes a solid-state imaging device 91 that obtains a color image signal by performing various signal processing on the imaging signals from the solid-state imaging module 1 or 1A or 10 according to the first to third embodiments. The color image signal from the solid-state image pickup device 91 is subjected to predetermined signal processing for recording, and then a memory unit 92 such as a recording medium capable of recording data, and the color image signal from the solid-state image pickup device 91 is predetermined for display. The display means 93 such as a liquid crystal display device which can be displayed on a display screen such as a liquid crystal display screen after the signal processing is performed, and the color image signal from the solid-state imaging device 91 is subjected to predetermined signal processing for communication and then communicated Processing is possible after a predetermined signal processing for printing the color image signal from the solid-state imaging device 91 and the communication means 94 such as a transmission / reception device which can be processed. And an image output unit 95 to. The electronic information device 90 is not limited to this, but in addition to the solid-state imaging device 91, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As described above, the electronic information device 90 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear surveillance camera, and a video phone camera. An electronic device having an image input device such as an image input camera, a scanner device, a facsimile device, a camera-equipped mobile phone device, and a portable terminal device (PDA) is conceivable.

  Therefore, according to the fourth embodiment, on the basis of the color image signal from the solid-state imaging device 91, it is displayed on the display screen, or is printed out by the image output means 95 on the paper. (Printing), communicating this as communication data in a wired or wireless manner, performing a predetermined data compression process in the memory unit 92 and storing it in a good manner, or performing various data processings satisfactorily Can do.

  In addition to the electronic information device 90 of the fourth embodiment, as shown in FIG. 11, an electronic information device 90A such as a pickup device 91A using the electronic element module 20 of the present invention for an information recording / reproducing unit may be used. Good. The optical element of the pickup device 91A in this case is an optical functional element (for example, a hologram optical element) that causes the outgoing light to go straight and to be emitted, and bends the incident light to enter in a predetermined direction. Further, the electronic elements of the pickup device 91A include a light emitting element (for example, a semiconductor laser element or a laser chip) for generating emitted light and a light receiving element (for example, a photo IC) for receiving incident light. Therefore, the semiconductor element module as the electronic element module 20 includes an optical functional element (for example, a hologram optical element), and a light emitting element and a light receiving element provided therebelow.

  Similarly, in this case, the electronic information device 90A includes a pickup device 91A using the electronic element module 20 of the present invention as an information recording / reproducing unit, and predetermined signal processing for recording the color image signal from the pickup device 91A. And a memory unit 92 such as a recording medium that can record data after the liquid crystal display, and a liquid crystal display that can display the color image signal from the pickup device 91A on a display screen such as a liquid crystal display screen after performing predetermined signal processing for display. Display means 93 such as a device, communication means 94 such as a transmission / reception device that enables communication processing after color signal signals from the pickup device 91A are subjected to predetermined signal processing for communication, and color images from the pickup device 91A Image output means 95 that enables a signal to be printed after predetermined signal processing for printing. That. The electronic information device 90A is not limited to this, but in addition to the pickup device 91A, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-4 of this invention, this invention should not be limited and limited to this Embodiment 1-4. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of specific preferred embodiments 1 to 4 of the present invention based on the description of the present invention and the common general technical knowledge. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention includes a semiconductor device mounting method for mounting a semiconductor device having a semiconductor element on a substrate, and a plurality of light receiving units that are mounted by the semiconductor device mounting method and that photoelectrically convert image light from a subject to image it. A semiconductor element module in which an imaging element as a semiconductor element or a light emitting element as a semiconductor element for generating emitted light and a light receiving element as a semiconductor element for receiving incident light are modularized, and as this semiconductor element module Information on digital cameras such as digital video cameras and digital still cameras, image input cameras, scanner devices, facsimile devices, camera-equipped mobile phone devices, and semiconductor element modules that use solid-state imaging modules as image input devices in the imaging unit Pickup used in the recording / playback unit In the field of electronic information equipment such as devices, before mounting a semiconductor device having an imaging element on the surface side on the substrate surface, the same on the solder part or the adhesive on the substrate surface that can support the semiconductor device In order to mount a ball of a diameter and interpose a spacing ball between the substrate surface and the semiconductor device, the tilt of the image sensor of the semiconductor device relative to the substrate surface is controlled by a jig, It is possible to align the image pickup element of the semiconductor device with a desired uniform target height with respect to the substrate surface without performing correction or the like after mounting. As a result, while maintaining the heat dissipation effect as well as the adhesive strength of the solder, it is possible to easily and reliably mount the substrate surface and the image pickup device horizontally and prevent image quality defects.

It is a perspective view showing typically an example of composition of an image sensor module concerning Embodiment 1 of the present invention. It is a principal part longitudinal cross-sectional view of the image pick-up element module of FIG. FIG. 2 is an enlarged longitudinal sectional view of a main part of the image sensor module in FIG. 1. (A) is a perspective view which shows typically the surface side of the sensor device of FIG. 1, (b) is a top view which shows typically the back surface side of the sensor device of FIG. (A)-(e) is a perspective view which shows typically each process for demonstrating the mounting method to the mount board | substrate 2 of the sensor device 4 of FIG. (A)-(e) is a longitudinal section of each process corresponding to Drawing 5 (a)-Drawing 5 (e), respectively. (A)-(e) is a perspective view which shows typically each process for demonstrating the mounting method to the mount board | substrate 2 of the sensor device 4 of the image pick-up element module which concerns on Embodiment 2 of this invention. (A)-(e) is a longitudinal section of each process corresponding to Drawing 7 (a)-Drawing 7 (e), respectively. It is a longitudinal cross-sectional view which shows typically the principal part structural example of the image pick-up element module which concerns on Embodiment 3 of this invention. It is a block diagram which shows the schematic structural example of the electronic information apparatus which used the solid-state imaging device containing the solid-state imaging module 1 or 1A or 10 of Embodiments 1-3 of this invention as Embodiment 4 of this invention for an imaging part. FIG. 10 is a block diagram illustrating a schematic configuration example of an electronic information device using a pickup device including the electronic element module of the present invention as an information recording / reproducing unit as a modification of the fourth embodiment of the present invention. (A)-(d) is a perspective view which shows typically each process for demonstrating the mounting method of the conventional solid-state image sensor. (A)-(d) is a longitudinal section of each process corresponding to Drawing 12 (a)-Drawing 12 (d), respectively. FIG. 10 is a longitudinal sectional view illustrating an exemplary configuration of a main part of a conventional imaging device disclosed in Patent Document 1. FIG. 10 is a longitudinal sectional view illustrating an exemplary configuration of a main part of a conventional imaging device disclosed in Patent Document 3. FIG. 10 is a longitudinal sectional view illustrating an exemplary configuration of a main part of a conventional imaging device disclosed in Patent Document 4. FIG. 6 is a plan view showing a configuration example of a main part of a conventional semiconductor device disclosed in Patent Document 5; It is a longitudinal cross-sectional view of the AB line | wire of FIG. FIG. 13 is a main part longitudinal cross-sectional view for explaining a case where a difference occurs in the height of a solder joint in the conventional solid-state imaging device mounting method of FIG. 12.

Explanation of symbols

1, 1A, 10 Solid-state imaging module 2 Mount substrate (substrate)
2a Wiring pattern 3 Solid-state imaging device 4 Sensor device 4a Connection terminal (terminal)
5 Pearl ball (ball)
6 Solder joint 6a Paste-like solder material 7 Thermosetting paste-like adhesive (thermosetting paste-like resin material)
DESCRIPTION OF SYMBOLS 11 Condensing lens 12 Holder member 13 Glass substrate 90, 90A Electronic information equipment 91 Solid-state imaging device 91A Pickup device 20 Electronic element module (semiconductor element module)
92 Memory unit 93 Display means 94 Communication means 95 Image output means

Claims (30)

In a semiconductor device mounting method for mounting a semiconductor device having a semiconductor element on a substrate,
A semiconductor device mounting step of joining a land portion of a wiring pattern of the substrate and each terminal of the semiconductor device by a joint portion with a ball for holding a target interval interposed between the substrate and the semiconductor device. A method for mounting a semiconductor device comprising: The semiconductor device mounting step includes
Solder material placement step of placing each paste-like solder material on each land portion of the wiring pattern,
A ball placing step of placing the ball on part or all of the paste-like solder material;
A semiconductor device placement step of placing the semiconductor device on the ball by aligning each terminal of the semiconductor device and each land portion of the wiring pattern;
The semiconductor device mounting method according to claim 1, further comprising: a semiconductor device bonding step of melting each paste-like solder material and bonding each terminal of the semiconductor device and each land portion of the wiring pattern. The semiconductor device mounting step includes
A paste-like thermosetting resin material arrangement step of arranging one or a plurality of paste-like thermosetting resin materials at a predetermined position for mounting a semiconductor device on the substrate;
A ball placing step of placing the ball on the pasty thermosetting resin material,
A semiconductor device placement step of aligning each terminal of the semiconductor device and each land portion of the wiring pattern of the substrate, and placing the semiconductor device on the ball,
The semiconductor device bonding step according to claim 1, further comprising a step of thermosetting the paste-like thermosetting resin material and bonding each terminal of the semiconductor device and each land portion of the wiring pattern by soldering. Implementation method.   The semiconductor device mounting method according to claim 3, wherein the predetermined position for mounting the semiconductor device is a position other than each land portion of the wiring pattern.   The method for mounting a semiconductor device according to claim 1, wherein the ball is at least one of a resin sphere, a sphere whose surface is metal-plated, and a metal sphere. .   The metal material of the metal plating or the metal material of the metal sphere is the same material as the material of the solder when the ball is a sphere or a metal sphere in which the surface of the resin sphere is subjected to metal plating. 4. A method for mounting a semiconductor device according to 2 or 3.   The said ball | bowl is supporting the said semiconductor device in the position of the land part of four or more places which can take the widest support area among the several land parts of the said wiring pattern. How to implement the device.   4. The semiconductor device mounting method according to claim 2, wherein the solder material is a paste-like solder material.   The semiconductor device mounting method according to claim 1, further comprising a filling resin injection step of injecting a filling resin into a gap between the substrate and the semiconductor device after the semiconductor device mounting step.   4. The semiconductor device mounting method according to claim 2, wherein a diameter of the ball is set larger than a thickness of the solder material or the pasty thermosetting resin material.   The diameter of the said ball | bowl is 0.2-0.8 mm, The mounting method of the semiconductor device in any one of Claims 1-3.   4. The target interval is an interval such that a bonding portion for bonding a land portion of the wiring pattern of the substrate and each terminal of the semiconductor device does not cause a bonding failure due to a predetermined concentrated thermal stress condition. A method for mounting a semiconductor device according to claim 1.   A substrate having one or more wiring patterns formed on the front surface side, a semiconductor device having a semiconductor element mounted on the front surface side, and a surface of the semiconductor device interposed between the substrate and the semiconductor device; A semiconductor element module comprising: a ball for arranging a surface of a substrate in parallel and maintaining a target interval; a predetermined land portion of the wiring pattern; and a joint portion for electrically joining each terminal of the semiconductor device.   The semiconductor element module according to claim 13, wherein the ball is placed on a predetermined land portion of the wiring pattern or is placed on the substrate other than the land portion of the wiring pattern.   The semiconductor element module according to claim 13, wherein the ball is at least one of a resin sphere, a sphere whose surface is metal-plated, and a metal sphere.   In the case where the ball is a sphere or metal sphere in which the surface of the resin sphere is subjected to metal plating, and the joint is a solder joint, the metal material of the metal plating or the metal material of the metal sphere is The semiconductor element module according to claim 15, wherein the semiconductor element module is made of the same material as that of the solder joint portion.   The semiconductor element module according to claim 13, wherein the ball supports the semiconductor device at positions of four or more land portions having a largest support area among a plurality of land portions of the wiring pattern.   The semiconductor element module according to claim 13, wherein the solder material of the joint is a paste-like solder material.   The semiconductor element module according to claim 13, wherein a filling resin is disposed in a gap between the substrate and the semiconductor device.   The semiconductor element module according to claim 13, wherein a diameter of the ball is set larger than a thickness of a solder material of the joint portion.   When the ball is placed on a predetermined land portion of the wiring pattern, the ball is disposed in a paste-like solder material, and the ball is placed on the substrate other than the land portion of the wiring pattern. The semiconductor element module according to claim 14, wherein when placed, the ball is disposed in a paste-like thermosetting resin material.   The diameter of the said ball | bowl is a semiconductor element module of Claim 21 set larger than the thickness of the said paste-like thermosetting resin material.   The semiconductor element module according to claim 13, wherein the ball has a diameter of 0.2 to 0.8 mm.   The semiconductor device according to claim 13, wherein the target interval is an interval that does not cause bonding failure at a bonding portion that bonds a land portion of the wiring pattern of the substrate and each terminal of the semiconductor device under a predetermined concentrated thermal stress condition. Element module.   The semiconductor element module according to claim 13, wherein the semiconductor element is an image pickup element having a plurality of light receiving portions that perform image conversion by photoelectrically converting image light from a subject.   The semiconductor element module according to claim 13, wherein the semiconductor element is a light emitting element for generating outgoing light and a light receiving element for receiving incident light.   26. A semiconductor element module, wherein a holder member is provided at a predetermined position on a substrate of the semiconductor element module according to claim 25, wherein a holder member for fixing a condensing lens for imaging incident light on the imaging element is provided.   27. A semiconductor element in which one or a plurality of optical functional elements for directing outgoing light or bending incident light in a predetermined direction are fixed on a substrate of the semiconductor element module according to claim 26. module.   An electronic information device using the semiconductor element module according to claim 27 as an image input device in an imaging unit.   An electronic information device using the semiconductor element module according to claim 28 in an information recording / reproducing unit.

Images