JP2012079984A - Mounting method of semiconductor device, semiconductor module, and electronic information device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor module which enables a solid state imaging module to be mounted easily and securely with a mounting surface of a mounting substrate and the solid state imaging module maintained in a horizontal state and prevents image defects while maintaining bonding strengh of solder between wiring of the mounting substrate and a terminal of a solid state imaging device and heat radiation effect in the solid imaging module in which the solid image device is mounted on the mounting substrate.SOLUTION: A mounting substrate 102 has recessed parts 107, each of which is formed so as to position a pearl ball (spacer member) 105 on its surface. A semiconductor device 104 is disposed on the mounting substrate 102 so that a bottom surface of the semiconductor device 104 contacts with the pearl balls 105 which are respectively disposed in the recessed parts 107 of the mounting substrate 102.

Description

  The present invention relates to a semiconductor device mounting method, a semiconductor module, and an electronic information device, and more particularly, a method of mounting a semiconductor device by floating a predetermined distance on a mounting substrate, and thus mounting the semiconductor device on the mounting substrate. The present invention relates to a semiconductor module and an electronic information device in which the semiconductor module is mounted.

  2. Description of the Related Art Conventionally, as a semiconductor module in which a semiconductor device is mounted on a mounting substrate while being floated at a predetermined interval, for example, there is a solid-state imaging module. Such a solid-state imaging module is mainly used as a camera module and a mobile phone with a camera. It is used in devices, portable terminal devices (PDAs), and in-vehicle cameras.

  As an example of such a semiconductor module, Patent Document 1 discloses a solid-state imaging module.

  FIG. 9 is a schematic cross-sectional view illustrating a conventional solid-state imaging module disclosed in Patent Document 1. In FIG. FIG. 10 is a perspective view for explaining the mounting substrate and the solid-state imaging device that constitute the solid-state imaging module, and shows a state in which the solid-state imaging device 4 is mounted on the mounting substrate 2. FIG. 11 is a diagram for explaining the solid-state imaging device 4, and is a perspective view showing the appearance of the solid-state imaging device 4 (FIG. 11A) and a plan view showing the back surface of the solid-state imaging device 4 (FIG. 11B). ).

  The solid-state imaging module 10 mounts the solid-state imaging device 4, which is a semiconductor device, on the mounting substrate (mounting substrate) 2 while being floated at a predetermined interval, and guides light from the subject to the solid-state imaging device 4 on the mounting substrate. These optical parts are mounted. Here, the mounting board 2 is specifically a printed board such as ceramic or glass-filled epoxy resin.

  The solid-state imaging device 4 includes a solid-state imaging chip (semiconductor element) 3 that images a subject in a package 4a. The solid-state imaging chip 3 receives a plurality of light-receiving elements that photoelectrically convert light from the subject. And a signal processing circuit for taking out an image signal obtained by photoelectric conversion from each light receiving unit to the outside. A terminal 4b connected to the chip electrode of the solid-state imaging chip 3 accommodated in the package 4a is formed on the lower surface side portion of the package 4a of the solid-state imaging device 4, and the terminal 4b is formed on the printed circuit board 2. The end portion (land portion) of the formed wiring 2a is electrically connected by solder.

  Further, on the printed circuit board 2, a condensing lens 11 that condenses light from a subject onto the solid-state imaging chip 4 of the solid-state imaging device, a lens holder 12 that holds the condensing lens 11, and the solid-state imaging It has the glass plate 13 attached to this lens holder 12 so that it may be located between the device 4 and the condensing lens 11, and the infrared cut filter was coated on the surface.

  Further, in such a solid-state imaging module 10, the optical axis of the condensing lens 11 and the optical axis of the solid-state imaging chip 3 coincide with each other, and the light-receiving surface of the solid-state imaging chip 3 is positioned on the image formation plane by the condensing lens 11 In order to obtain a clear image, it is important to position them accurately.

  Further, mounting the solid-state imaging module 4 on the mounting board 2 with a certain distance from the mounting surface of the mounting board 2 causes a difference in thermal expansion coefficient between the mounting board 2 and the package 4 a of the solid-state imaging module 4. This is important for relieving the thermal stress caused and ensuring the soldering strength between the wiring (land portion) of the mounting substrate 2 and the terminals of the solid-state imaging module 4 and the heat dissipation of the solid-state imaging module.

  For this reason, in the solid-state imaging module 10, for example, a resin ball member 5 is disposed as a spacer member between the back surface of the solid-state imaging module 4 and the mounting surface of the mounting substrate 2, and the package of the solid-state imaging module 4. A certain distance between 4a and the mounting substrate 2 is secured.

  In such a conventional semiconductor device 10 mounting method, with a ball member for holding a target interval interposed between the mounting substrate and the semiconductor device, the end portion of the wiring of the mounting substrate, that is, the land portion, Each terminal of the semiconductor device is joined.

  Hereinafter, a conventional semiconductor device mounting method disclosed in Patent Document 1 will be described.

  The semiconductor device mounting method includes a solder material placement step of placing each paste-like solder material on each land portion of the wiring, and a part or all of the paste-like solder material on each of the balls. And a semiconductor device placement step of placing the semiconductor device on the ball by aligning each terminal of the semiconductor device and each land portion of the wiring, respectively, A semiconductor device bonding step of melting each paste-like solder material and bonding each terminal of the semiconductor device and each land portion of the wiring;

  The balls are not placed on the paste-like solder material on the land portion of the wiring as described above, but instead are placed on the thermosetting resin material applied at a position other than the wiring region in the vicinity of the land portion. May be.

  Hereinafter, a conventional method for mounting a semiconductor device will be described more specifically.

  12 and 13 are diagrams for explaining the semiconductor device mounting method, and FIGS. 12A to 12E are perspective views for explaining the respective steps in the semiconductor device mounting method. 13 (a) to 13 (e) are cross-sectional views corresponding to FIGS. 12 (a) to 12 (e).

  First, the mounting substrate 2 on which the wiring 2a having a predetermined pattern is formed is mounted on a substrate mounting table (not shown) of the mounting apparatus (FIGS. 12A and 13A).

  Next, a paste-like solder material 6a is selectively applied to the end portion (land portion) of the wiring 2a of the mounting substrate 2, that is, the end portion located on the side where the solid-state imaging device is mounted (FIG. 12B). ), FIG. 13 (b)).

  Further, the ball members 5 are sequentially placed on the outer four paste-like solder materials 6a of the applied paste-like solder material 6a by the robot arm having the ball suction nozzle of the mounting apparatus. At this time, the ball member 5 sinks into the paste-like solder material due to its own weight (FIGS. 12C and 13C). Here, the diameter of the ball member 5 is larger than the thickness 0.25 mm of the paste-like solder material 6a, and the diameter of the ball member 5 and the thickness 6a of the paste-like solder material are within the ball-like solder material 6a. The size of the ball member 5 is such that the upper surface portion of the ball member 5 is exposed even if the ball 5 sinks under its own weight.

  Further, the solid-state imaging device 4 is aligned with each paste-like solder material 6a by using the mounting apparatus and the terminals 4a on the back side of the solid-state imaging device 4 are placed on the ball members 5 at four locations. It mounts so that it may be supported (FIG.12 (d), FIG.13 (d)).

  Thereafter, the mounting substrate 2 on which the solid-state imaging device 4 is mounted is heated in, for example, a reflow furnace, whereby the paste-like solder material 6a is melted, and then the mounting substrate 2 is cooled, whereby the back surface of the solid-state imaging device 4 is obtained. The terminal 4a and the end portion (land portion) of the wiring 2a are joined by the solder 6 (FIGS. 12E and 13E).

  In the above conventional mounting method, the ball member is mounted on a paste-like solder material applied to the land portion of the wiring on the mounting board. However, the ball member is formed on the wiring land on the mounting board. The thermosetting resin may be applied to a region where the ball member is arranged, and the ball member may be placed on the applied thermosetting resin.

JP 2010-016013 A

  As described above, in the above conventional semiconductor device mounting method, a ball member for maintaining a target interval, i.e., a ball member as a spacer for placing the semiconductor device on the mounting substrate by being floated by a predetermined interval, When mounted on the mounting substrate, the ball is placed on the paste-like solder material on the wiring land portion or on the thermosetting resin material applied in the vicinity of the wiring land portion and outside the wiring region. A member will be mounted.

  However, in a paste-like solder material or heat-effect resin material applied to a region where the ball member is placed, the application amount, viscosity, shape, position, etc. may vary. The height of the top position varies and the distance between the semiconductor device and the mounting board varies, or the semiconductor device is mounted on the mounting board with the semiconductor device tilted with respect to the surface of the mounting board. It becomes. Further, the semiconductor device may be displaced with the ball member when the paste-like solder material is melted or before the thermosetting resin material is cured.

  As a result, in a semiconductor module such as a camera module equipped with a solid-state imaging device, the focal length of the lens varies depending on the position of the light-receiving surface of the solid-state imaging device in the solid-state imaging device. The distance to the lens along the axis will be different, resulting in problems such as poor focus, poor optical axis, or poor peripheral resolution.

  The present invention has been made in order to solve the above-described conventional problems. A semiconductor module can be floated on a mounting substrate by a predetermined interval with high accuracy, and the mounting substrate, the semiconductor device on the mounting substrate, Semiconductor device mounting method capable of avoiding variation in the spacing of the semiconductor device or the inclination of the semiconductor device with respect to the mounting substrate, the semiconductor module in which the semiconductor device is accurately mounted on the mounting substrate, and the semiconductor The purpose is to obtain an electronic information device equipped with a module.

  A method for mounting a semiconductor module according to the present invention is a method for mounting a semiconductor device including a semiconductor element on a mounting substrate via a spacer member, and the spacer member is positioned on the surface of the mounting substrate. Using the mounting substrate in which the recess portion is formed, placing a spacer member in the recess portion of the mounting substrate, and placing the semiconductor device on the mounting substrate so that the bottom surface of the semiconductor device is in contact with the spacer member And a step of bonding a terminal formed on the semiconductor device with a wiring formed on the surface of the mounting substrate and a bonding member, thereby achieving the above object.

  In the method for mounting a semiconductor device according to the present invention, the step of disposing a spacer member in the recess of the mounting substrate includes the step of disposing a thermosetting resin material in the recess of the mounting substrate, and the step of disposing the recess in the mounting substrate. And placing the spacer member on the thermosetting resin material.

  In the semiconductor device mounting method according to the present invention, it is preferable that the thermosetting resin material has a low viscosity enough to sink a spacer member placed on the thermosetting resin material.

  In the semiconductor device mounting method according to the present invention, it is preferable that the thermosetting resin material supplied in the recess of the mounting substrate is cured before the semiconductor device is placed on the mounting substrate.

  In the semiconductor device mounting method according to the present invention, it is preferable that the thermosetting resin material supplied in the recess portion of the mounting substrate is cured after the semiconductor device is placed on the mounting substrate.

  According to the present invention, in the semiconductor device mounting method, the recess of the mounting substrate has a planar shape of a square shape or a circular shape, and a cross-sectional shape of a concave shape, a V shape, or a mortar shape. Is preferred.

  In the semiconductor device mounting method according to the present invention, it is preferable that the spacer member has a spherical shape, a cubic shape, or a rugby ball shape.

  According to the present invention, in the semiconductor device mounting method, one semiconductor device in which one semiconductor element is housed in a package is mounted on the mounting substrate as the semiconductor device, and the semiconductor device on the mounting substrate is A plurality of depressions having the same depth are formed in the area to be mounted, and the back surface of the semiconductor device is parallel to the mounting surface of the mounting board in the spacer member disposed in the plurality of depressions. It is preferable to use spacer members having the same height.

  According to the present invention, in the semiconductor device mounting method, two solid-state imaging devices each including a solid-state imaging device that captures an image of a subject in a package are mounted on the mounting substrate as the semiconductor device. In the region where each of the two solid-state imaging devices is mounted, a plurality of recesses having the same depth are formed, and the spacer member disposed in the plurality of recesses has the two solids. It is preferable to use spacer members having different heights so that the light receiving surface of each solid-state imaging element of the imaging device is inclined by a predetermined angle with respect to the mounting surface of the mounting substrate.

  A semiconductor module according to the present invention is a semiconductor module in which a semiconductor device including a semiconductor element is mounted on a mounting substrate via a spacer member, and the spacer member is positioned on the surface of the mounting substrate. The semiconductor device is mounted on the mounting substrate so that the bottom surface of the semiconductor device is in contact with a spacer member disposed in the recess of the mounting substrate. Is achieved.

  According to the present invention, in the semiconductor module described above, it is preferable that the terminals formed in the semiconductor device are bonded to the wiring formed on the surface of the mounting substrate by a bonding portion.

  According to the present invention, in the semiconductor module, a thermosetting resin material is provided in the recess on the mounting substrate, and the spacer member is included in the thermosetting resin material provided in the recess of the mounting substrate. It is preferable that it arrange | positions so that it may sink.

  In the semiconductor module according to the aspect of the invention, it is preferable that the recess portion of the mounting substrate has a square shape or a circular shape as a planar shape, and a concave shape, a V shape, or a mortar shape as a cross-sectional shape.

  According to the present invention, in the semiconductor module, the spacer member preferably has a spherical shape, a cubic shape, or a rugby ball shape.

  According to the present invention, in the semiconductor module described above, one semiconductor device in which one semiconductor element is housed in a package is mounted on the mounting substrate as the semiconductor device, and the semiconductor device on the mounting substrate is mounted. A plurality of recesses having the same depth are formed in the region to be formed, and the spacer member disposed in the plurality of recesses has a back surface of the semiconductor device parallel to the mounting surface of the mounting substrate. It is preferable that spacer members having the same height are used.

  According to the present invention, in the semiconductor module, the mounting substrate includes two solid-state imaging devices each having a solid-state imaging element that captures an image of a subject contained in a package as the semiconductor device. A plurality of depressions having the same depth are formed in the area where each of the two solid-state imaging devices is mounted, and the two solid-state imaging elements are disposed on the spacer member disposed in the plurality of depressions. It is preferable that spacer members having different heights are used so that the light receiving surface of each solid-state imaging device of the device is inclined by a predetermined angle with respect to the mounting surface of the mounting substrate.

  An electronic information device according to the present invention is an electronic information device provided with a semiconductor module, and the semiconductor module is the semiconductor module according to the present invention described above, whereby the above-described object is achieved.

  The operation of the present invention will be described below.

  In the present invention, since the spacer member fixed by the recess of the mounting substrate is interposed between the mounting substrate and the semiconductor module, the mounting substrate and the semiconductor device are parallel to each other at a target interval by the spacer member. In addition, in the imaging device module as a semiconductor device module, the light receiving surface is parallel to the mounting surface of the mounting substrate, thereby preventing the spacer member from moving. The focal length of the lens is constant at any place such as a portion and its peripheral portion, and image quality failure due to a focus difference in the light receiving surface can be prevented.

  Further, in the present invention, since it is a solid-state imaging module using a solid-state imaging device, for example, it is used as an image input device in an imaging unit of a camera-equipped mobile phone device and used as a light receiving element of a pickup device used in an information recording / reproducing unit It is done.

  In addition, when mounting a semiconductor device accommodated in a package so that the solid-state imaging device is located on the front surface side by being floated by a predetermined interval on the mounting substrate surface, a ball member disposed in a recess portion of the mounting substrate is used as a spacer. Therefore, the inclination of the imaging device of the semiconductor device with respect to the substrate surface can be set with high accuracy without performing auxiliary control using a jig or correction after mounting.

  As a result, while maintaining the heat dissipation effect as well as the adhesive strength of the solder, the mounting surface of the mounting substrate and the solid-state imaging module can be easily and surely mounted, and image quality defects can be prevented.

  As described above, according to the present invention, when a semiconductor device is mounted on the mounting substrate while being floated at a predetermined interval, the spacer member that holds the interval between the substrate surface of the mounting substrate and the semiconductor device is mounted on the mounting substrate. The spacer member is fixed without moving after the spacer member is arranged on the mounting substrate, so that the semiconductor devices can be aligned at a desired uniform target height on the mounting substrate. . As a result, a semiconductor module such as a solid-state imaging module can be easily and surely mounted on the mounting substrate while being level with the mounting surface, and a focus defect, an optical axis shift, a peripheral resolution defect, and the like can be prevented.

FIG. 1 is a perspective view showing a main configuration of a solid-state imaging module which is a semiconductor module according to Embodiment 1 of the present invention. FIG. 2 is a diagram showing a cross-sectional structure of the semiconductor module (solid-state imaging module) of the first embodiment shown in FIG. FIG. 3 is a diagram for explaining the semiconductor device mounting method of the first embodiment shown in FIG. 2, and is a cross-sectional view for explaining each step (FIGS. 3A to 3D) in the semiconductor device mounting method. It is. FIG. 4 is a diagram for explaining the semiconductor device mounting method of the first embodiment shown in FIG. 2, and is a perspective view for explaining each step (FIGS. 4A to 4D) in the semiconductor device mounting method. It is. FIG. 5 is an enlarged cross-sectional view showing the main part of the solid-state imaging module of the first embodiment shown in FIG. FIG. 6 is a diagram illustrating a modified example (FIGS. (A) and (b)) of the solid-state imaging module according to the first embodiment, and shows an enlarged main part. FIG. 7 is a cross-sectional view illustrating a semiconductor module according to Embodiment 2 of the present invention. FIG. 8 is a block diagram illustrating a schematic configuration example of an electronic information device using the solid-state imaging module according to Embodiment 1 or 2 as an imaging unit as Embodiment 3 of the present invention. FIG. 9 is a schematic cross-sectional view illustrating a conventional solid-state imaging module (semiconductor module) disclosed in Patent Document 1. FIG. 10 is a perspective view for explaining a mounting substrate and a solid-state imaging device constituting the conventional solid-state imaging module shown in FIG. 9, and shows a state in which the solid-state imaging device is mounted on the mounting substrate. FIG. 11 is a diagram for explaining the solid-state imaging device, and is a perspective view (FIG. (A)) showing an appearance of the solid-state imaging device and a plan view (FIG. (B)) showing the back surface of the solid-state imaging device. . 12 is a diagram for explaining a mounting method of the solid-state imaging device shown in FIG. 11, and is a perspective view for explaining each step (FIGS. 12A to 12E) in this mounting method. 13 is a diagram for explaining a mounting method of the solid-state imaging device shown in FIG. 11, and is a cross-sectional view for explaining each step (FIGS. 13A to 13E) in this mounting method. FIGS. 13A to 13D correspond to FIGS. 12A to 12E.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view showing a configuration of a main part of a semiconductor module according to Embodiment 1 of the present invention, and FIG. 2 is a view showing a cross-sectional structure of the semiconductor module shown in FIG.

  The semiconductor module 100 according to the first embodiment is a semiconductor module in which a semiconductor device 104 that is a package containing a semiconductor element 103 is mounted on a mounting substrate 102 via a spacer member 105. Here, the mounting substrate 102 has a recess 107 formed on the surface so that the spacer member 105 is positioned, and the bottom surface of the semiconductor device 104 is in the recess 107 of the mounting substrate 102. It is placed on the mounting substrate 102 so as to come into contact with the spacer member 105 arranged. Here, the semiconductor device 104 is a sensor device (solid-state imaging device) 104 in which a solid-state imaging element 103 that photoelectrically converts incident light to generate signal charges is housed in a package as the semiconductor element 103.

  Further, the terminal 104 b formed on the semiconductor device 104 is bonded to a land portion (connection portion of the wiring end portion) of the wiring 102 a formed on the surface of the mounting substrate 102 by a solder bonding portion 106.

  Here, three wirings 102a are provided on each side of the mounting substrate 102 on the region where the semiconductor device 104 is disposed, and extend from the region where the semiconductor device is disposed toward the end of the mounting substrate. Note that the number of the wirings 102a is not limited to the case where three wirings 102a are provided on both sides of the arrangement region of the semiconductor device 104. For example, five wirings 102a are provided on both sides of the arrangement region of the semiconductor device 104 on the mounting substrate. It may be provided one by one or more. The wiring width is about 0.2 mm to 1 mm, typically about 0.5 mm.

  Further, a thermosetting resin material 107a is provided in the recess 107 on the mounting substrate 102, and the spacer member 105 is provided in the thermosetting resin material 107a provided in the recess 107 of the mounting substrate. It is arranged to sink in.

  Here, as shown in FIGS. 4A and 5, the recess 107 of the mounting board has a square shape in a plan view and a concave shape in a cross-sectional shape.

  However, the recess 107 is not limited to that shown in FIG. 5. For example, the recess 117 of the mounting substrate may have a V-shaped cross section as shown in FIG. In addition, it is preferable to provide the thermosetting resin material 107a also in this hollow part 117. FIG.

  Moreover, as shown in FIG.6 (b), the hollow part 127 of the said mounting board | substrate may be what made the cross-sectional shape mortar shape. In addition, it is preferable to provide the thermosetting resin material 127a also in this hollow part 127. FIG. Moreover, the planar shape of the hollow parts 117 and 127 shown in FIGS. 6A and 6B may be rectangular or circular.

  Here, the spacer member 105 is a spherical ball member (pearl ball) having a diameter of 0.3 mm. The pearl ball 105 is plated with an alloy of tin and silver, which is the same as the paste solder material of the solder joint 106, as a metal plating material on the surface of the resin sphere. Further, the pearl ball 105 is positioned in the land portion proximity portion of the outermost four wirings 102a, and supports the sensor device 104 at four locations. However, the shape of the spacer member 105 is not limited to a spherical shape, and may be a cubic shape or a rugby ball shape, and further a disc shape in which the size of the sphere is reduced along an arbitrary central axis. But you can.

  The depths of the plurality of depressions 107 are the same, and the back surface of the semiconductor device is parallel to the mounting surface of the mounting substrate in the spacer member 105 disposed in the plurality of depressions 107. Thus, spacer members having the same height are used.

  Next, a semiconductor device mounting method will be described.

  3 and 4 are diagrams for explaining a semiconductor device mounting method according to the present embodiment, and FIGS. 3A to 3D are perspective views for explaining respective steps in the semiconductor device mounting method. 4 (a) to 4 (d) are cross-sectional views corresponding to FIGS. 3 (a) to 3 (d).

  First, the mounting substrate 102 on which the wiring 2a having a predetermined pattern is formed and the recess 107 is formed is mounted on a substrate mounting table (not shown) of the mounting apparatus (FIG. 3A). ), FIG. 4 (a)).

  Next, a spherical pearl ball 105 having a diameter of 0.3 mm is sucked and moved by a nozzle (not shown) provided at the tip of the robot arm, and then exhausted to form the four depressions. It mounts sequentially on 107 (FIG.3 (b) and FIG.4 (b)).

  At this time, a thermosetting resin 107a is applied to the depression 107, but the clay of the resin is low enough that the pearl ball 105 is not lifted by the resin.

  Further, the nozzle provided at the tip of the robot arm is used to align the sensor device 104 with each metal joint terminal 104b on the back surface side of the sensor device 104 and each land portion of the wiring 102a. It is mounted on the pearl ball 105 (FIG. 3 (c), FIG. 4 (c)).

  Thereafter, each terminal portion (land portion) inside the wiring 2a of the mount substrate 102 and each metal joint terminal 104b on the back surface side of the sensor device 104 on which the solid-state imaging device 103 is mounted are soldered with a solder material, respectively. The solder joint 106 is electrically joined.

  This soldering is performed by supplying wire-like solder between the land portion of the wiring 2a and the terminal 104b of the package 104a, and melting the solder with laser light or the like. However, the soldering is not limited to this. For example, the paste-like solder formed on the land portion by heating the mounting substrate 102 on which the solid-state imaging device 104 is mounted in, for example, a reflow furnace. By melting the material and then cooling the mounting substrate 102, the terminal 104a on the back surface of the solid-state imaging device 104 and the end portion (land portion) of the wiring 2a are joined by the solder member 6 (FIG. 3D). FIG. 4 (d)).

  As described above, according to the first embodiment, the pearl ball 5 for maintaining the distance fixed by the recess 107 on the substrate is interposed between the mount substrate 102 and the sensor device 104, and the recess 107 Since the thermosetting resin provided in is set to clay so low that the pearl ball 105 disposed in the depression 107 does not float up, the target distance between the mount substrate 102 and the sensor device 104 by the pearl ball 105 is set. Can be positioned in parallel. As a result, the light receiving surface of the solid-state image sensor 103 of the image sensor module 100 as a semiconductor element module is parallel to the surface of the mount substrate 102, so that the lens focal length can be increased at any location such as the central portion and the peripheral portion of the light receiving surface. It becomes constant, and image quality defects due to a focus difference in the light receiving surface can be prevented.

  In addition, since the semiconductor module according to the first embodiment is a solid-state imaging module using a solid-state imaging device, it is used as an image input device for an imaging unit of a mobile phone device with a camera, for example, and used for an information recording / reproducing unit. It is used as a light receiving element of a conventional pickup device.

  In addition, when mounting a semiconductor device accommodated in a package so that the solid-state imaging device is located on the front surface side by being floated by a predetermined interval on the mounting substrate surface, a ball member disposed in a recess portion of the mounting substrate is used as a spacer. Therefore, the inclination of the imaging device of the semiconductor device with respect to the substrate surface can be set with high accuracy without performing auxiliary control using a jig or correction after mounting. Accordingly, it is possible to easily and reliably mount the mounting surface of the mounting substrate and the solid-state imaging module horizontally while maintaining the heat dissipation effect together with the adhesive strength of the solder, and to prevent image quality defects.

  In the above embodiment, the connection between the wiring of the mounting substrate and the terminal of the sensor device is joined using the solder wire, but the joining method is not limited to this.

For example, the sensor device 104 is aligned on each of the metal joint terminals 104a on the back surface side of the sensor device 104 and a paste-like solder material formed on the land portion of the wiring of the mounting substrate, and the four pearl balls 105 are aligned. After that, the ambient temperature is set to 230 degrees Celsius, and each metal joint terminal 104a on the back surface side of the sensor device 104 and the land portion of the wiring 102a are joined as solder joints by each paste-like solder material. May be. The thickness of the paste-like solder material is about 0.1 to 0.3 mm (typically 0.25 mm). Also in this case, since the spacing pearl ball 105 is interposed between the mounting substrate 102 and the sensor device 104, the spacing between them is accurately maintained.
(Embodiment 2)
FIG. 7 is a cross-sectional view illustrating a semiconductor module according to Embodiment 2 of the present invention. In the figure, the same reference numerals as those in FIGS. 1 to 5 denote the same parts as those in the first embodiment.

  In the semiconductor module 110 of the second embodiment, two solid-state imaging modules 104 are arranged on the mounting substrate 102 so that they are adjacent to each other and both the solid-state imaging modules 104 face each other with respect to the mounting substrate. It is implemented by.

  That is, the pearl ball as a spacer member for floating each solid-state imaging module 104 with respect to the mounting substrate 102 is the one on the center side of the mounting substrate (pearl ball 105a) and the one on the peripheral side of the mounting substrate (pearl ball). The structure is larger than that of 105b).

  Other configurations are the same as those in the solid-state imaging module 100 of the first embodiment.

  In this way, by mounting the two solid-state imaging modules 104 on the mounting substrate 102 obliquely such that their light receiving surfaces face each other with respect to the mounting substrate 102, a solid-state imaging module such as a 3D camera. Can be used as

Further, although not specifically described in the first and second embodiments, a digital camera such as a digital video camera or a digital still camera using at least one of the solid-state imaging modules of the first and second embodiments as an imaging unit. An electronic information device having an image input device, such as an image input camera, a scanner, a facsimile machine, or a camera-equipped mobile phone, will be briefly described below.
(Embodiment 3)
FIG. 8 is a block diagram illustrating a schematic configuration example of an electronic information device using the solid-state imaging module according to Embodiment 1 or 2 as an imaging unit as Embodiment 3 of the present invention.

  An electronic information device 90 according to Embodiment 3 of the present invention shown in FIG. 8 includes at least one of the solid-state imaging modules according to Embodiments 1 and 2 of the present invention as an imaging unit 91 that captures a subject. A memory unit 92 such as a recording medium for recording data after high-definition image data obtained by photographing by such an image pickup unit is subjected to predetermined signal processing for recording, and predetermined signal processing for displaying the image data A display unit 93 such as a liquid crystal display device that displays on a display screen such as a liquid crystal display screen, and a communication unit 94 such as a transmission / reception device that performs communication processing after performing predetermined signal processing on the image data for communication. And an image output unit 95 that prints (prints) image data and outputs (prints out) the image data.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  In the field of a semiconductor device mounting method, a semiconductor module, and an electronic information device, the present invention can precisely mount a semiconductor module on a mounting board by a predetermined interval, and mount the mounting board and the semiconductor device on the mounting board. Semiconductor device mounting method capable of avoiding variation in the spacing of the semiconductor device and the inclination of the semiconductor device relative to the mounting substrate, a semiconductor module in which the semiconductor device is accurately mounted on the mounting substrate, and this An electronic information device equipped with a semiconductor module can be provided.

DESCRIPTION OF SYMBOLS 90 Electronic information equipment 91 Imaging part 92 Memory part 93 Display means 94 Communication means 95 Image output means 100 Solid-state imaging module (semiconductor module)
102 Mounting board (mounting board)
102a Wiring 103 Solid-state imaging device (semiconductor device)
104 Sensor device (semiconductor device)
104a Package 104b Connection terminal (terminal)
105 Pearl ball (ball)
106 Solder joint 107 Depression 107a Thermosetting resin

Claims (17)

A method of mounting a semiconductor device including a semiconductor element on a mounting substrate via a spacer member,
Using the mounting substrate in which a recess is formed so that the spacer member is positioned on the surface of the mounting substrate, and arranging the spacer member in the recess of the mounting substrate;
Placing the semiconductor device on the mounting substrate such that the bottom surface thereof is in contact with the spacer member;
A method of mounting a semiconductor device, comprising: bonding a terminal formed on the semiconductor device to a wiring formed on a surface of the mounting substrate with a bonding member. In the mounting method of the semiconductor device according to claim 1,
The step of arranging the spacer member in the recess of the mounting substrate includes:
Placing a thermosetting resin material in the recess of the mounting substrate;
Mounting the spacer member in the recess of the mounting substrate so as to be positioned on the thermosetting resin material. In the mounting method of the semiconductor device according to claim 2,
A method for mounting a semiconductor device, wherein the thermosetting resin material has a low viscosity enough to sink a spacer member placed on the thermosetting resin material. In the mounting method of the semiconductor device according to claim 3,
A method for mounting a semiconductor device, comprising: curing a thermosetting resin material supplied in a recess of the mounting substrate before placing the semiconductor device on the mounting substrate. In the mounting method of the semiconductor device according to claim 3,
A method for mounting a semiconductor device, comprising: curing a thermosetting resin material supplied in a recess of the mounting substrate after placing the semiconductor device on the mounting substrate. In the mounting method of the semiconductor device according to claim 1,
The mounting method of a semiconductor device, wherein the recess portion of the mounting substrate has a planar shape of a square shape or a circular shape and a cross-sectional shape of a concave shape, a V shape, or a mortar shape. In the mounting method of the semiconductor device according to claim 6,
The semiconductor device mounting method, wherein the spacer member has a spherical shape, a cubic shape, or a rugby ball shape. In the mounting method of the semiconductor device according to claim 1,
On the mounting substrate, as the semiconductor device, one semiconductor device formed by housing one semiconductor element in a package is mounted,
A plurality of depressions of the same depth are formed in the area where the semiconductor device of the mounting substrate is mounted,
A method for mounting a semiconductor device, wherein spacer members disposed in the plurality of recesses are provided with the same height so that the back surface of the semiconductor device is parallel to the mounting surface of the mounting substrate. In the mounting method of the semiconductor device according to claim 1,
On the mounting substrate, two solid-state imaging devices each containing a solid-state imaging device for imaging a subject in a package are mounted as the semiconductor device,
A plurality of depressions having the same depth are formed in an area where each of the two solid-state imaging devices is mounted on the mounting substrate.
The spacer members disposed in the plurality of depressions have different heights so that the light receiving surfaces of the solid-state imaging elements of the two solid-state imaging devices are inclined by a predetermined angle with respect to the mounting surface of the mounting board. A semiconductor device mounting method using a spacer member. A semiconductor module in which a semiconductor device including a semiconductor element is mounted on a mounting substrate via a spacer member,
The mounting substrate has a recess formed on the surface so that the spacer member is positioned;
The semiconductor device is placed on the mounting substrate such that a bottom surface thereof is in contact with a spacer member disposed in a recess of the mounting substrate.
Semiconductor module. The semiconductor module according to claim 10,
The terminal formed in the said semiconductor device is a semiconductor device joined by the wiring currently formed in the surface of the said mounting substrate, and a junction part. The semiconductor module according to claim 10,
In the recess on the mounting substrate, a thermosetting resin material is provided,
The said spacer member is a semiconductor element module arrange | positioned so that it may sink in in this thermosetting resin material provided in the hollow part of this mounting board | substrate. The semiconductor module according to claim 10,
The recess portion of the mounting substrate is a semiconductor module in which a planar shape is a square shape or a circular shape, and a cross-sectional shape is a concave shape, a V shape, or a mortar shape. The semiconductor module according to claim 10,
The spacer member is a semiconductor module having a spherical shape, a cubic shape, or a rugby ball shape. The semiconductor module according to claim 10,
On the mounting substrate, as the semiconductor device, one semiconductor device formed by housing one semiconductor element in a package is mounted,
A plurality of depressions of the same depth are formed in the area where the semiconductor device of the mounting substrate is mounted,
A semiconductor module in which spacer members having the same height are used for the spacer members arranged in the plurality of depressions so that the back surface of the semiconductor device is parallel to the mounting surface of the mounting substrate. The semiconductor module according to claim 10,
On the mounting substrate, two solid-state imaging devices each containing a solid-state imaging device for imaging a subject in a package are mounted as the semiconductor device,
A plurality of depressions having the same depth are formed in an area where each of the two solid-state imaging devices is mounted on the mounting substrate.
The spacer members disposed in the plurality of depressions have different heights so that the light receiving surfaces of the solid-state imaging elements of the two solid-state imaging devices are inclined by a predetermined angle with respect to the mounting surface of the mounting board. A method for mounting a semiconductor device, wherein a spacer member is used. An electronic information device provided with a semiconductor module,
The electronic information device is a semiconductor module according to claim 10.

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