JP2020194738A - Luminaire - Google Patents

Abstract

To suppress a central part becoming dark.SOLUTION: A luminaire 1 includes: a luminaire body 10; and a light emitting module 20 mounted on the luminaire body 10. The light emitting module 20 includes: a substrate 21 having a main surface 21a which includes an inner peripheral region 25 and an annular outer peripheral region 26 surrounding the inner peripheral region 25, and having a substantially rectangular shape in a plan view; a plurality of circuit components 23 arranged in the inner peripheral region 25; and a plurality of light emitting elements 22 arranged side by side in an annular manner in the outer peripheral region 26 so as to surround the inner peripheral region 25. The luminaire 1 also includes a circuit cover 30 for covering the inner peripheral region 25. The circuit cover 30 includes: a first portion 30a opposing to a side 21b of the substrate 21; and a second portion 30b which is a portion opposing to a corner 21c of the substrate 21, and in which a distance from the center of the inner peripheral region 25 is equal to that of the first portion 30a in a plan view. The first portion 30a is closer to the main surface 21a than the second portion 30b.SELECTED DRAWING: Figure 6

Description

The present invention relates to a lighting device.

Conventionally, for example, a ceiling light which is a lighting fixture arranged on a ceiling is known. For example, Patent Document 1 discloses a ceiling light including an instrument body and a light source substrate and a circuit board supported by the instrument body. A plurality of LEDs (Light Emitting Diodes) are annularly mounted on the light source substrate. The circuit board is located inside a plurality of annular LEDs. A plurality of circuit components constituting a lighting circuit for lighting each of the plurality of LEDs are mounted on the circuit board. A plurality of circuit components are covered with a lighting circuit cover.

Japanese Unexamined Patent Publication No. 2012-146666

In the above-mentioned conventional ceiling light, since the lighting circuit cover is provided inside the plurality of LEDs, there is a problem that the light emitted from the LEDs is blocked by the lighting circuit cover and the central portion becomes dark.

Therefore, an object of the present invention is to provide a lighting device capable of suppressing darkening of the central portion.

In order to achieve the above object, the lighting device according to one aspect of the present invention is a lighting device including an instrument main body and a light emitting module attached to the instrument main body, and the light emitting module includes a first region and the said light emitting module. A substrate having a main surface including an annular second region surrounding the first region and having a substantially rectangular shape in a plan view, a plurality of circuit components arranged in the first region, and surrounding the first region. The illuminating device further includes a cover member covering the first region, the cover member facing the side of the substrate, including a plurality of light emitting elements arranged in an annular shape and arranged in the second region. It has a first portion to be formed and a second portion facing the corner of the substrate and having a distance from the center of the first region equal to the first portion in a plan view. Is closer to the main surface than the second portion.

According to the lighting device according to the present invention, it is possible to suppress darkening of the central portion.

FIG. 1 is an exploded perspective view of the lighting device according to the embodiment. FIG. 2 is a cross-sectional view of the lighting device according to the embodiment. FIG. 3 is a plan view of the light emitting module according to the embodiment. FIG. 4 is a plan view showing a side region and a corner region of the inner peripheral region of the substrate according to the embodiment. FIG. 5 is a plan view of the circuit cover and the light emitting module according to the embodiment. FIG. 6 is a cross-sectional view of the circuit cover and the light emitting module according to the embodiment in the VI-VI line of FIG. FIG. 7 is a cross-sectional view of the circuit cover and the light emitting module according to the embodiment in the line VII-VII of FIG. FIG. 8 is a plan view of the circuit cover and the light emitting module according to the first modification of the embodiment. FIG. 9 is a cross-sectional view of the circuit cover and the light emitting module according to the second modification of the embodiment. FIG. 10 is a cross-sectional view of the circuit cover and the light emitting module according to the third modification of the embodiment.

Hereinafter, the lighting device according to the embodiment of the present invention will be described in detail with reference to the drawings. In addition, all the embodiments described below show a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection forms of the components, steps, the order of steps, etc. shown in the following embodiments are examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, the components not described in the independent claims will be described as arbitrary components.

Further, each figure is a schematic view and is not necessarily exactly illustrated. Therefore, for example, the scales and the like do not always match in each figure. Further, in each figure, substantially the same configuration is designated by the same reference numerals, and duplicate description will be omitted or simplified.

Further, in the present specification, terms indicating relationships between elements such as parallel or orthogonal, terms indicating the shape of elements such as rectangles and circles, and numerical ranges are not expressions expressing only strict meanings. , Is an expression meaning that a substantially equivalent range, for example, a difference of about several percent is included.

(Embodiment)
Hereinafter, the lighting device according to the embodiment will be described.

[Overview]
First, the outline of the lighting device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is an exploded perspective view of the lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the lighting device 1 according to the present embodiment. Specifically, FIG. 2 shows a cross section parallel to the Z axis (more specifically, a cross section represented by the line II-II in FIG. 5) including the central axis J of the lighting device 1.

In FIGS. 1 and 2, the X-axis, Y-axis, and Z-axis represent the three axes of the three-dimensional Cartesian coordinate system. The negative side of the Z-axis represents the ceiling side when the lighting device 1 which is a ceiling light is properly installed, and the positive side of the Z-axis represents the floor surface side. Further, in the following description, "planar view" means a case of being viewed from the positive side of the Z axis. In FIGS. 1, 2, 6, 7, and 9, the postures shown in the vertical direction are reversed from those in normal use.

The lighting device 1 according to the present embodiment is, for example, a ceiling light for illuminating a room, and is attached to the ceiling 2 of the room so that the translucent cover 60 shown in FIG. 1 faces downward. The ceiling 2 is an example of an installation surface on which the lighting device 1 is installed. The lighting device 1 may be installed on a wall surface or a floor surface depending on the usage mode. That is, the lighting device 1 does not have to be a ceiling light, but may be a wall light or a floor light.

As shown in FIG. 1, the illuminating device 1 includes an instrument main body 10, a light emitting module 20, a circuit cover 30, a resin cover 40, a light source cover 50, and a translucent cover 60. Hereinafter, details of each component included in the lighting device 1 will be described.

[Instrument body]
As shown in FIG. 1, the instrument main body 10 is formed in a disk shape, and is a member manufactured by using a sheet metal such as an aluminum plate or a steel plate. For example, a white paint having high light reflectance is applied or a reflective metal material is vapor-deposited on the surface of the fixture body 10 on the side where the light emitting module 20 is arranged (the positive side of the Z axis).

Specifically, the instrument main body 10 has a mounting surface portion 11, an outer peripheral portion 12, and an inner peripheral portion 13. Further, as shown in FIG. 2, a circular opening 14 is formed in the center of the instrument main body 10.

The mounting surface portion 11 is an annular portion surrounding the inner peripheral portion 13. As shown in FIG. 2, the mounting surface portion 11 is located on the positive side of the Z axis with respect to the outer peripheral portion 12 and the inner peripheral portion 13. The light emitting module 20 is attached to the attachment surface portion 11. Specifically, the substrate 21 of the light emitting module 20 is placed on the main surface of the mounting surface portion 11 (the main surface on the positive side of the Z axis), and the substrate 21 is fixed by screws (not shown) or the like.

The outer peripheral portion 12 is an annular portion surrounding the mounting surface portion 11. A plurality of mounting members (not shown) for mounting the translucent cover 60 are fixed to the surface of the outer peripheral portion 12 on the positive side of the Z axis. The plurality of mounting members hold the light-transmitting cover 60 by holding the end portion of the light-transmitting cover 60. A plurality of cushion members 94 are fixed to the surface of the outer peripheral portion 12 on the negative side (ceiling 2 side) of the Z axis. The plurality of cushion members 94 are arranged at intervals along the circumferential direction of the outer peripheral portion 12. When the lighting device 1 is installed on the ceiling 2, the plurality of cushion members 94 are sandwiched between the fixture main body 10 and the ceiling 2, so that the wobbling of the fixture main body 10 is suppressed. The plurality of cushion members 94 are formed by using a material having elasticity (cushioning property) such as urethane.

The inner peripheral portion 13 is an annular portion located at the center of the instrument main body 10. The inner peripheral portion 13 forms a space for accommodating a circuit component, a part of the circuit component (for example, a lead) or solder provided on the back surface (main surface on the negative side of the Z axis) of the substrate 21 of the light emitting module 20. ing. Further, an opening 14 is formed in the center of the inner peripheral portion 13.

A cylindrical holder 91 extending from the peripheral edge of the opening 14 to the positive side of the Z axis and a cylindrical protective cover 92 are attached to the inner peripheral portion 13. The holder 91 is a member for attaching the instrument main body 10 to the adapter 90. The holder 91 is a member formed of, for example, a resin material, and has a structure that can be fitted with the adapter 90. As shown in FIG. 2, the holder 91 is fixed to the inner peripheral portion 13 by a screw 93.

The protective cover 92 is a cover member that protects the holder 91. The protective cover 92 is formed by using, for example, a resin material. The holder 91 is arranged inside the cylindrical protective cover 92.

The adapter 90 is a member for detachably attaching the appliance main body 10 to the hook ceiling body 3 fixed in advance to the installation surface such as the ceiling 2. By fixing the adapter 90 to the holder 91, the instrument body 10 is attached to the hook sealing body 3 via the adapter 90. As a result, the lighting device 1 is installed on the ceiling 2.

[Light emitting module]
The light emitting module 20 is a module in which a lighting circuit and a light source are integrated. The light emitting module 20 is attached to the instrument body 10.

FIG. 3 is a plan view of the light emitting module 20 according to the present embodiment. As shown in FIGS. 1 and 3, the light emitting module 20 includes a substrate 21, a plurality of light emitting elements 22, and a plurality of circuit components 23.

The substrate 21 is a substrate having a main surface 21a and having a substantially rectangular shape in a plan view. The plan view means when viewed from the thickness direction of the substrate 21, specifically, when viewed from the positive side of the Z axis. As shown in FIG. 3, the substantially rectangular shape may be, for example, a rounded quadrangle having rounded corners and chamfered corners. Further, it may be a quadrangle whose corners are chamfered at an angle, that is, an octagon. Also, at least one of the four corners may not be chamfered. The substrate 21 may be a rectangle or a square with any of the four corners of 90 °. The substrate 21 has a size of, for example, less than 250 mm × 250 mm, and, for example, a size of 200 mm × 200 mm.

Specifically, the contour (outer shape) of the substrate 21 in a plan view has four sides 21b and four corners 21c. The side 21b is a straight line portion of the contour of the substrate 21. The four sides 21b have the same length as each other, but at least one side 21b may be different from the other side 21b. The corner 21c is a curved portion of the contour of the substrate 21. The four corners 21c are of the same length as each other, but at least one corner 21c may be different from the other corners 21c. When the plan view shape of the substrate 21 is an octagon, the corner 21c is a straight line. At this time, the angle 21c is a portion shorter than the side 21b.

In the present embodiment, a substantially circular through hole 24 is provided in the center of the substrate 21. That is, the plan-view shape of the substrate 21 is an annular shape having a substantially rectangular outer circumference and a substantially circular inner circumference. As shown in FIG. 2, the protective cover 92 and the holder 91 are inserted into the through hole 24.

The substrate 21 is, for example, a printed circuit board provided with a conductive pattern (metal wiring) on the main surface 21a and the main surface on the opposite side thereof. As the substrate 21, for example, a glass composite substrate such as a CEM3 (Composite Epoxy Material-3) substrate, a resin substrate, a metal base substrate, a ceramic substrate, a glass substrate, or the like can be used. The substrate 21 is not limited to the rigid substrate, and may be a flexible substrate.

The main surface 21a of the substrate 21 is the main surface on the positive side (light emitting side) of the Z axis. The main surface 21a is a mounting surface for a plurality of light emitting elements 22 and a plurality of circuit components 23. As shown in FIGS. 3 and 4, the main surface 21a includes an inner peripheral region 25 and an outer peripheral region 26 surrounding the inner peripheral region 25. Here, FIG. 4 is a plan view showing a side region 25a and a corner region 25b of the inner peripheral region 25 according to the present embodiment.

The inner peripheral region 25 is an example of the first region, and is an region in which a plurality of circuit components 23 are arranged. The inner peripheral region 25 is an region covered by the circuit cover 30 and the resin cover 40. Specifically, the inner peripheral region 25 is an annular region inside the circle shown by the broken line in FIG. 3 (that is, a region shaded with dots in FIG. 4). The light emitting element 22 is not mounted on the inner peripheral region 25. The nightlight light emitting element 27, which will be described later, is provided in the inner peripheral region 25.

As shown in FIG. 4, the inner peripheral region 25 has a side region 25a facing the side 21b of the substrate 21 and a corner region 25b facing the corner 21c of the substrate 21. The region (or portion) facing the side 21b (or the corner 21c) is a region (or a portion) near the side 21b (or the corner 21c) and along the side 21b (or the corner 21c) in a plan view. Part) means.

The side region 25a is an example of a third region of the inner peripheral region 25 facing the side 21b of the substrate 21. Specifically, the side region 25a is a region sandwiched between two virtual lines (indicated by a broken line in FIG. 4) connecting the central axis J and both ends of the side 21b in a plan view. In FIG. 4, the side region 25a is represented by shading thin dots.

The corner region 25b is an example of a fourth region of the inner peripheral region 25 facing the corner 21c of the substrate 21. Specifically, the angular region 25b is a region sandwiched between two virtual lines (indicated by a broken line in FIG. 4) connecting the central axis J and each of both ends of the angle 21c in a plan view. In FIG. 4, the corner region 25b is represented by shading dark dots.

The square region 25b may be a region having a predetermined width (for example, 50 mm) centered on a virtual line connecting a part of the corner 21c of the substrate 21 and the central axis J. For example, when the plan view shape of the substrate 21 is rectangular, the angular region 25b is a region having a predetermined width centered on a virtual line connecting a right-angled angle 21c (vertex) and a central axis J. The side region 25a is an region of the inner peripheral region 25 excluding the corner region 25b.

The outer peripheral region 26 is an example of the second region, and is a region in which a plurality of light emitting elements 22 are arranged. The outer peripheral region 26 is an annular region having a substantially rectangular outer circumference and a circular inner circumference. Since the outer shape of the substrate 21 is substantially rectangular, the width of the outer peripheral region 26 is not constant. Specifically, the outer peripheral region 26 is narrow between the side 21b and the side region 25a of the substrate 21, and wide between the corner 21c and the corner region 25b of the substrate 21.

Each of the plurality of light emitting elements 22 is a light emitting diode (LED). For example, each of the plurality of light emitting elements 22 is a packaged surface mount device (SMD) type white LED element. Specifically, each of the plurality of light emitting elements 22 is a package (container) made of white resin having a recess, an LED chip mounted on the bottom surface of the recess of the package, and a seal sealed in the recess of the package. It has a member. The LED chip is, for example, a blue LED chip that emits blue light. The sealing member contains a yellow phosphor such as YAG (yttrium aluminum garnet) that is excited by blue light from a blue LED chip and emits yellow fluorescence. The sealing member may contain a green phosphor, a red phosphor, and the like in addition to the yellow phosphor.

The plurality of light emitting elements 22 may include light emitting elements that emit light having different color temperatures. For example, the plurality of light emitting elements 22 include one or more first light emitting elements that emit light having a first color temperature (for example, daylight color or daylight white light) and light having a second color temperature lower than the first color temperature (for example, light). , Light bulb-colored light) may be included with one or more second light emitting elements. The mixed light of the light from the first light emitting element and the light from the second light emitting element is emitted as illumination light. At this time, the amount of light emitted from each of the first light emitting element and the second light emitting element may be adjusted. As a result, the color of the illumination light can be adjusted.

In the present embodiment, the plurality of light emitting elements 22 are arranged in an annular shape in the outer peripheral region 26 of the main surface 21a of the substrate 21. That is, the plurality of light emitting elements 22 are arranged in a ring shape so as to surround the inner peripheral region 25. Specifically, as shown in FIG. 3, the plurality of light emitting elements 22 are arranged side by side along the contour of the substrate 21 (specifically, the sides 21b and the corners 21c). For example, in the portion along the side 21b, the arrangement direction of the plurality of light emitting elements 22 coincides with the linear direction parallel to the side 21b. In the portion along the angle 21c, the arrangement direction of the plurality of light emitting elements 22 coincides with the extending direction of the angle 21c. The plurality of light emitting elements 22 may be provided in a plurality of rows in a ring shape.

For example, the plurality of light emitting elements 22 are arranged in an annular shape along the contour so that the distance from the contour of the substrate 21 is constant. Therefore, the distance from the light emitting element 22 arranged along the side 21b to the inner peripheral region 25 is shorter than the distance from the light emitting element 22 arranged along the angle 21c to the inner peripheral region 25. That is, the distance from the light emitting element 22 arranged along the side 21b to the circuit cover 30 is shorter than the distance from the light emitting element 22 arranged along the angle 21c to the circuit cover 30. The light from the light emitting element 22 arranged along the side 21b is easily blocked by the circuit cover 30. In the present embodiment, the details will be described later, but by providing the concave surface 33 on the circuit cover 30, the amount of light blocked can be reduced.

Each of the plurality of light emitting elements 22 is electrically connected to a conductive pattern (metal wiring) provided on the main surface 21a by solder. The plurality of light emitting elements 22 are connected in series with each other, for example. Specifically, all the light emitting elements 22 provided on the main surface 21a are connected in series. The plurality of light emitting elements 22 may be connected in parallel. The electrical connection of the plurality of light emitting elements 22 may include both a parallel connection and a series connection.

The plurality of circuit components 23 are components that form at least a part of a lighting circuit that lights the plurality of light emitting elements 22. The lighting circuit converts the AC power supplied via the adapter 90 into DC power and supplies it to the plurality of light emitting elements 22. Each of the plurality of circuit components 23 is electrically connected to, for example, a conductive pattern (metal wiring) provided on the substrate 21 by solder. The conductive pattern is provided on, for example, the main surface on the opposite side of the main surface 21a (specifically, the opposite side of the main surface 21a to the inner peripheral region 25).

Each of the plurality of circuit components 23 is, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, or a semiconductor element such as a diode or an integrated circuit element. is there.

A part of the circuit component 23 constituting the lighting circuit may be provided on the surface (back surface) of the substrate 21 opposite to the main surface 21a. That is, one or more of all the circuit components mounted on the board 21 may not be provided on the main surface 21a.

In the present embodiment, as shown in FIGS. 1 and 3, the light emitting module 20 further includes a light emitting element 27 for a nightlight and a light receiving element 28. The nightlight light emitting element 27 and the light receiving element 28 are arranged in the inner peripheral region 25. The light emitting element 27 and the light receiving element 28 for the nightlight are exposed in the opening 43 provided in the resin cover 40.

The light emitting element 27 for a nightlight is a light emitting diode. For example, the nightlight light emitting element 27 is an SMD type white LED element having the same configuration as the light emitting element 22 and the like. The color temperature of the light emitted by the light emitting element 27 for a nightlight is, for example, a light bulb color, but may be a daylight color. Further, the light emitting element 27 for the nightlight may be a bullet-shaped LED.

The light emitted from the light emitting element 27 for the nightlight passes through the opening 43 and then enters the diffusion cover portion 52 of the light source cover 50. The light emitted from the light emitting element 27 for the nightlight is diffused by the diffusion cover portion 52 and emitted to the outside from the translucent cover 60.

The light receiving element 28 is a photoelectric conversion element such as a photodiode or a phototransistor. For example, the light receiving element 28 receives infrared rays output from a terminal device (for example, a remote controller) that controls lighting, extinguishing, dimming, toning, and the like of the lighting device 1. The light receiving element 28 outputs an electric signal corresponding to the intensity of the received infrared rays to the lighting circuit. The infrared rays output from the terminal device pass through the translucent cover 60, the diffusion cover portion 52 of the light source cover 50, and the opening 43 of the resin cover 40, and are received by the light receiving element 28.

The light emitting module 20 is manufactured by using, for example, a soldering method called a reflow method. Specifically, paste-like solder (cream solder) is applied to a plurality of mounting positions (positions where the light emitting element 22, the circuit component 23, the light emitting element 27 for the night light, and the light receiving element 28 should be arranged) on the main surface 21a of the substrate 21. The light emitting element 22, the circuit component 23, the light emitting element 27 for the night light, and the light receiving element 28 are arranged so as to be coated and in contact with the solder. After that, by heating, each of the light emitting element 22, the circuit component 23, the nightlight light emitting element 27, and the light receiving element 28 is electrically connected to the metal wiring provided on the main surface 21a.

[Circuit cover]
The circuit cover 30 is an example of a cover member that covers the inner peripheral region 25 of the light emitting module 20. That is, the circuit cover 30 covers the lighting circuit arranged in the inner peripheral region 25 of the substrate 21. The circuit cover 30 is formed of, for example, a metal material such as iron or aluminum, and has light-shielding property and nonflammability.

The outer surface of the circuit cover 30 (the surface on the translucent cover 60 side) functions as a reflecting surface that reflects the light emitted from the light emitting module 20. An insulating sheet made of resin may be provided on the inner surface of the circuit cover 30. As a result, the inner surface of the circuit cover 30 can be brought closer to the circuit component 23, so that the circuit cover 30 can be made thinner and smaller. Further, the circuit cover 30 may be formed by using a flame-retardant resin material.

As shown in FIG. 1, the circuit cover 30 includes a main body portion 31 and a collar portion 32. The main body 31 is formed in a dome shape with a flat top surface, and a through hole 34 is provided in the center of the top surface. As shown in FIGS. 1 and 5, the main body 31 is provided with three concave surfaces 33 and one notch-shaped opening 35. Here, FIG. 5 is a plan view of the circuit cover 30 and the light emitting module 20 according to the present embodiment.

The three concave surfaces 33 are examples of curved surfaces recessed toward the substrate 21. The three concave surfaces 33 do not include straight edges. As shown in FIG. 5, each of the three concave surfaces 33 is provided on a portion of the substrate 21 facing the three sides 21b. The three concave surfaces 33 are provided on the portions corresponding to the three sides 21b other than the portions where the nightlight light emitting element 27 and the light receiving element 28 are provided.

The opening 35 is provided to expose the light emitting element 27 for the nightlight and the light receiving element 28. The opening 35 has a shape cut out from the radial outer end of the circuit cover 30 toward the center. As shown in FIG. 5, a resin cover 40 is provided so as to close the opening 35.

The collar portion 32 is a portion extending from the radial outer end portion of the main body portion 31 toward the outer side in the radial direction. The collar portion 32 is placed on the substrate 21 of the light emitting module 20. The flange portion 32 is provided with a screw hole, and the circuit cover 30 and the substrate 21 (light emitting module 20) are fixed to the instrument main body 10 by inserting a screw (not shown) into the screw hole. ..

The circuit cover 30 covers the upper end (the end on the positive side of the Z axis) of the protective cover 92 with the edge of the through hole 34. By fixing the circuit cover 30 to the instrument main body 10 with screws, the movement of the protective cover 92 in the Z-axis direction is restricted, so that the protective cover 92 is suppressed from being detached.

[Resin cover]
The resin cover 40 is an insulating cover member that closes the opening 35 of the circuit cover 30. In the present embodiment, the circuit cover 30 and the resin cover 40 cover the inner peripheral region 25 of the main surface 21a of the substrate 21. The resin cover 40 is formed by using a flame-retardant resin material.

As shown in FIG. 1, the resin cover 40 has a base portion 41 and a wall portion 42. The upper surface (the surface on the positive side of the Z axis) of the base portion 41 is a flat surface parallel to the main surface 21a of the substrate 21, and the diffusion cover portion 52 of the light source cover 50 is placed on the upper surface. The base portion 41 is provided with an opening 43 for exposing the light emitting element 27 for nightlight and the light receiving element 28. The opening 43 has, for example, a substantially rectangular shape in a plan view, but is not limited to this.

The wall portion 42 is erected from the base portion 41 in the positive direction of the Z axis. The edge of the wall 42 is curved along the edge of the opening 35 of the circuit cover 30. By covering the edge of the wall portion 42 with the edge of the opening 35 of the circuit cover 30, the movement of the resin cover 40 in the positive direction of the Z axis is restricted. As a result, the removal of the resin cover 40 is suppressed.

The base portion 41 has one or more protrusions (not shown) protruding from the lower surface side toward the substrate 21. The one or more protrusions are inserted into through holes provided in the substrate 21. As a result, the movement of the resin cover 40 in the plane direction is restricted.

The resin cover 40 may be formed by using a material having translucency. As a result, the light from the light emitting element 22 arranged near the resin cover 40 is not blocked, so that it is possible to prevent the central portion of the lighting device 1 from becoming dark.

[Light source cover]
The light source cover 50 is an annular member that covers a plurality of light emitting elements 22 of the light emitting module 20. The light source cover 50 is formed by using a translucent resin material. The light source cover 50 is an optical member for controlling the light distribution of light from the light emitting module 20. The light source cover 50 may have, for example, a lens function that collects or diffuses (diverges) light. The light source cover 50 is formed by using a translucent resin material such as a transparent acrylic resin.

As shown in FIG. 1, the light source cover 50 is formed in an annular shape having an opening 53 in the center in a plan view. The light source cover 50 is fixed to the substrate 21 so as to cover the plurality of light emitting elements 22. Specifically, the light source cover 50 is provided with a screw hole 51. By inserting screws (not shown) in the order of the screw hole 51, the screw hole of the flange portion 32 of the circuit cover 30, the screw hole of the substrate 21, and the screw hole of the instrument body, the light source cover 50 is inserted into the substrate 21 and the substrate 21. It is fixed to the instrument body 10.

As shown in FIG. 1, the light source cover 50 includes a diffusion cover portion 52. The diffusion cover portion 52 diffuses the light for the nightlight. For example, a light scattering structure that scatters transmitted light is formed on the surface of the diffusion cover portion 52. The light scattering structure is, for example, fine unevenness and is formed by embossing or the like. Light scattering particles may be dispersed inside the diffusion cover portion 52.

The diffusion cover portion 52 is a tongue piece-shaped portion extending from the annular main body portion toward the central axis J. Specifically, the diffusion cover portion 52 has an obliquely inclined light emitting surface, and is placed on the base portion 41 of the resin cover 40. The diffusion cover portion 52 covers the opening 43 provided in the base portion 41. As a result, the light emitted from the light emitting element 27 for the nightlight and passing through the opening 43 is diffused when passing through the diffusion cover portion 52.

[Transparent cover]
The translucent cover 60 is a member (glove) that covers the side of the fixture body 10 to which the light emitting module 20 is attached. The translucent cover 60 is formed by using a translucent resin material. The light-transmitting cover 60 has a light diffusing (scattering) property. For example, the translucent cover 60 is formed by using a milky white resin material, and diffuses (scatters) the light from the light emitting module 20 and emits it to the outside. The surface of the light-transmitting cover 60 may be provided with a fine uneven structure having light scattering properties.

The translucent cover 60 is detachably attached to an attachment member (not shown) fixed to the instrument body 10.

[Characteristic configuration]
Subsequently, a characteristic configuration of the lighting device 1 according to the present embodiment will be described.

First, the arrangement of the plurality of circuit components 23 in the light emitting module 20 will be described with reference to FIG.

In the present embodiment, as shown in FIG. 3, the plurality of circuit components 23 include a first circuit component 23a that is shorter than the predetermined value and a second circuit component 23b that is taller than the predetermined value. Includes. The height of the circuit component 23 is the height of the circuit component 23 from the main surface 21a of the substrate 21, and is the distance between the main surface 21a and the portion farthest from the main surface 21a of the circuit component 23. is there. The predetermined value is, for example, half the height of the circuit cover 30 from the main surface 21a. Alternatively, the predetermined value may be the average value of the heights of all the circuit components 23 mounted on the main surface 21a. For example, the height of the circuit cover 30 is about 38 mm, and the predetermined value is 19 mm. The height of the second circuit component 23b is, for example, in the range of 20 mm or more and 30 mm or less.

In FIG. 3, the tall second circuit component 23b is shaded with dots. In the present embodiment, as shown in FIG. 3, the plurality of circuit components 23 include a plurality of first circuit components 23a and a plurality of second circuit components 23b.

As shown in FIG. 3, at least one of the plurality of first circuit components 23a is arranged in the side region 25a shown in FIG. The first circuit component 23a provided in the side region 25a is, for example, the shortest circuit component among all the circuit components 23. One or more of the plurality of first circuit components 23a may be arranged in the corner region 25b shown in FIG. The plurality of first circuit components 23a are resistance elements, diodes, integrated circuit elements, and the like.

The second circuit component 23b is arranged in the corner region 25b. For example, all of the plurality of second circuit components 23b are arranged in the corner region 25b. Although the details will be described later, the space in the circuit cover 30 is wider in the corner region 25b than in the side region 25a. The tall second circuit component 23b can be effectively arranged by utilizing this wide space. For example, the plurality of second circuit components 23b are an electrolytic capacitor, a choke coil, and the like.

In the present embodiment, in a plan view, more than half of the second circuit component 23b is arranged in the angular region 25b. For example, the second circuit component 23b may be arranged at the boundary between the side region 25a and the corner region 25b in a plan view. That is, a part of the second circuit component 23b (less than half in the plan view) may protrude into the side region 25a.

Subsequently, the cross-sectional shape of the circuit cover 30 according to the present embodiment will be described with reference to FIGS. 6 and 7.

6 and 7 are cross-sectional views of the circuit cover 30 and the light emitting module 20 according to the present embodiment, respectively. FIG. 6 shows a cross section on the VI-VI line of FIG. FIG. 7 shows a cross section taken along line VII-VII of FIG. The VII-VII line is inclined by 45 ° with respect to the VI-VI line. The central axis J is located at the intersection of the VI-VI line and the VII-VII line. The VI-VI line is orthogonal to the side 21b.

The circuit cover 30 according to the present embodiment has a first portion 30a and a second portion 30b, as shown in FIGS. 6 and 7. The first portion 30a is a position overlapping the side region 25a in a plan view. The second portion 30b is a position that overlaps the angular region 25b in a plan view.

As shown in FIG. 6, the circuit cover 30 has a first portion 30a. The first portion 30a is a portion facing the side 21b of the substrate 21. Specifically, the first portion 30a is a part of the surface of the circuit cover 30 (the surface on the positive side of the Z axis), and is a portion located at a distance L from the central axis J in a plan view.

As shown in FIG. 7, the circuit cover 30 has a second portion 30b. The second portion 30b is a portion facing the corner 21c of the substrate 21. Specifically, the second portion 30b is a part of the surface of the circuit cover 30 and is a portion at a distance L from the central axis J in a plan view. That is, the second portion 30b is a portion whose distance from the central axis J is equal to that of the first portion 30a. In other words, in a plan view, the first portion 30a and the second portion 30b are located on the circumference of a radius L centered on the central axis J.

Here, as shown in FIG. 6, the height of the first portion 30a from the main surface 21a of the substrate 21 is defined as h. As shown in FIG. 7, the height of the second portion 30b from the main surface 21a of the substrate 21 is H. At this time, h is shorter than H. That is, the first portion 30a is closer to the main surface 21a than the second portion 30b.

In the present embodiment, the first portion 30a is included in the concave surface 33. Specifically, each of the three concave surfaces 33 shown in FIG. 5 includes a first portion 30a. That is, the circuit cover 30 has three first portions 30a, and the three first portions 30a face each of the three sides 21b of the four sides 21b of the substrate 21.

Since the concave surface 33 is provided, the first portion 30a of the circuit cover 30 is closer to the main surface 21a of the substrate 21 than the second portion 30b. In the cross section shown in FIG. 6, the concave surface 33 is recessed on the main surface 21a side with respect to the line connecting the intersection of the translucent cover 60 and the central axis J and the light emitting element 22, for example. As a result, the light from the light emitting element 22 can reach the central portion of the translucent cover 60 without being blocked by the circuit cover 30. As an example, in the cross section shown in FIG. 6, the angle formed by the concave surface 33 and the main surface 21a is less than 45 °.

In the present embodiment, the direction directly below the second portion 30b (negative direction of the Z axis) is more than the direction directly below the first portion 30a (specifically, the direction directly below the three concave surfaces 33) of the substrate 21. A wide space is formed between the surface 21a and the surface 21a. Therefore, the tall second circuit component 23b is arranged in the corner region 25b of the main surface 21a in the direction directly below the second portion 30b. The tall second circuit component 23b is not arranged in the side region 25a of the main surface 21a in the direction directly below the first portion 30a, but the short first circuit component 23a is arranged.

[Effects, etc.]
As described above, the lighting device 1 according to the present embodiment includes the fixture main body 10 and the light emitting module 20 attached to the fixture main body 10. The light emitting module 20 has a main surface 21a including an inner peripheral region 25 and an annular outer peripheral region 26 surrounding the inner peripheral region 25, and is arranged in a substrate 21 having a substantially rectangular shape in a plan view and an inner peripheral region 25. A plurality of circuit components 23 and a plurality of light emitting elements 22 arranged in an annular shape so as to surround the inner peripheral region 25 and arranged in the outer peripheral region 26 are included. The lighting device 1 further includes a circuit cover 30 that covers the inner peripheral region 25. The circuit cover 30 is a portion facing the first portion 30a facing the side 21b of the substrate 21 and the corner 21c of the substrate 21, and is the center of the inner peripheral region 25 (specifically, the central axis) in a plan view. It has a second part 30b whose distance from J) is equal to that of the first part 30a. The first portion 30a is closer to the main surface 21a than the second portion 30b.

As described above, since the plan view shape of the substrate 21 is rectangular, the number of substrates 21 to be taken can be increased when a plurality of substrates 21 are taken out from one large substrate. That is, since one side of the rectangular substrate 21 can be shared with other substrates 21, the number of substrates 21 taken from a substrate of a predetermined size can be increased as compared with a circular substrate. .. Therefore, the substrate cost can be reduced.

In the present embodiment, the circuit cover 30 is provided so as to cover the central portion (inner peripheral region 25) of the substrate 21. Therefore, the circuit cover 30 may block the light and darken the central portion. In particular, as the size of the substrate 21 becomes smaller, the light emitting element 22 and the circuit cover 30 come closer to each other, so that the amount of light blocked from the light emitting element 22 (the amount of eclipse) increases. For example, when a plurality of light emitting elements 22 are provided along the circumference of the substrate 21, the distance from the light emitting element 22 provided along the side 21b of the substrate 21 to the circuit cover 30 is along the corner 21c of the substrate 21. It is shorter than the distance from the light emitting element 22 provided to the circuit cover 30. In this case, the light from the light emitting element 22 provided along the side 21b is more easily blocked by the circuit cover 30 than the light from the light emitting element 22 provided along the angle 21c.

On the other hand, in the lighting device 1 according to the present embodiment, in the circuit cover 30, the first portion 30a facing the side 21b of the substrate 21 is more main than the second portion 30b facing the corner 21c of the substrate 21. It is configured to be close to the surface 21a. Therefore, the light from the light emitting element 22 provided along the side 21b is less likely to be blocked by the circuit cover 30, so that it is possible to prevent the central portion from becoming dark.

Further, for example, the circuit cover 30 has a concave surface 33 which is a curved surface recessed toward the substrate 21 provided on a portion of the substrate 21 facing the side 21b. The first portion 30a is included in the concave surface 33.

As a result, light is easily diffused by the concave surface 33 which is a curved surface. Further, since the concave surface 33 of the circuit cover 30 does not include a long linear edge, it becomes difficult for a linear shadow to be formed on the translucent cover 60. As described above, according to the lighting device 1, it is possible to suppress darkening of the central portion.

Further, for example, the circuit cover 30 has three first portions 30a. The three first portions 30a face each of the three sides 21b of the four sides 21b of the substrate 21.

As a result, the light from the three directions is less likely to be blocked, so that it is possible to further suppress the darkening of the central portion.

Further, for example, the plurality of circuit components 23 include a first circuit component 23a and a second circuit component 23b having a height higher than that of the first circuit component 23a from the main surface 21a. The first circuit component 23a is arranged in the side region 25a of the inner peripheral region 25 facing the side 21b of the substrate 21. The second circuit component 23b is arranged in the corner region 25b of the inner peripheral region 25 facing the corner 21c of the substrate 21.

As a result, the tall second circuit component 23b can be arranged by effectively utilizing the space of the corner region 25b having a margin in the height of the circuit cover 30. Therefore, since the short first circuit component 23a can be arranged in the side region 25a, the portion of the circuit cover 30 that covers the side region 25a can be further brought closer to the main surface 21a of the substrate 21. Therefore, the amount of light blocking (the amount of eclipse) can be further reduced, and the darkening of the central portion can be further suppressed.

Further, for example, the light emitting module 20 further includes a light emitting element 27 for a nightlight arranged in the side region 25a. The circuit cover 30 is provided with an opening 35 for exposing the light emitting element 27 for a nightlight.

As a result, the nightlight light emitting element 27 and the other light emitting element 22 can be arranged apart from each other, so that it is possible to suppress the influence of heat generated by the other light emitting element 22 on the nightlight light emitting element 27. it can.

Further, for example, the light emitting module 20 further includes a light receiving element 28 arranged in the side region 25a. The light receiving element 28 is exposed in the opening 35.

As a result, light such as infrared rays can be passed through the opening 35 through which the light of the nightlight is passed, and the light receiving element 28 can receive light. As a result, it is not necessary to provide a plurality of openings 35, so that the protection performance of the lighting circuit by the circuit cover 30 can be improved.

(Modification example)
Hereinafter, a modified example of the embodiment will be described with reference to the drawings.

For example, in the above embodiment, the example in which the circuit cover 30 has three concave surfaces 33 is shown, but the number of concave surfaces 33 included in the circuit cover 30 may be only two.

FIG. 8 is a plan view of the circuit cover 130 and the light emitting module 20 according to the first modification of the embodiment. The circuit cover 130 has two concave surfaces 33, as shown in FIG. The two concave surfaces 33 are provided at positions facing each other with the central axis J in between in a plan view. In other words, in the circuit cover 130, the concave surface 33 is not provided in the portion facing the opening 35 with the central axis J in between. That is, in this modified example, specifically, the first portion 30a is included in each of the two concave surfaces 33 shown in FIG. That is, the circuit cover 130 has two first portions 30a, and the two first portions 30a face each of the two opposite sides 21b of the four sides 21b of the substrate 21.

As described above, in the lighting device according to the present modification, for example, the circuit cover 130 has two first portions 30a. The two first portions 30a face each of the two opposing sides 21b of the four sides 21b of the substrate 21.

As a result, it becomes difficult for light from two directions to be blocked, so that it is possible to suppress darkening of the central portion. Further, since the internal space covered by the circuit cover 130 can be increased as compared with the case where the three concave surfaces 33 are provided, more tall second circuit components 23b can be arranged.

Further, for example, in the above embodiment, the circuit cover 30 has a concave surface 33 which is a curved surface, but the circuit cover 30 does not have to have the concave surface 33.

FIG. 9 is a cross-sectional view of the circuit cover 230 and the light emitting module 20 according to the second modification of the embodiment. Specifically, FIG. 9 shows a cross section corresponding to the VI-VI line of FIG. 5, similar to FIG.

As shown in FIG. 9, the circuit cover 230 has a flat surface 233 instead of the concave surface 33. Similar to the concave surface 33, the flat surface 233 is provided at a position overlapping the side region 25a in a plan view. The first portion 30a is included in the plane 233.

As described above, in the lighting device according to the present modification, the circuit cover 230 has a flat surface 233 inclined with respect to the substrate 21 provided at a portion facing the side 21b of the substrate 21. The first portion 30a is included in the plane 233.

As a result, it is possible to suppress darkening of the central portion as compared with the case where the flat surface 233 is not provided. Further, for example, by smoothing the outer circumference of the flat surface 233, it is possible to suppress the edge from being formed as a shadow on the translucent cover 60.

Further, for example, the circuit cover 30 may have a convex surface which is a curved surface. FIG. 10 is a cross-sectional view of the circuit cover 330 and the light emitting module 20 according to the third modification of the embodiment. Specifically, FIG. 10 shows a cross section corresponding to the VI-VI line of FIG. 5, similar to FIG.

As shown in FIG. 10, the circuit cover 330 has a convex surface 333, which is a curved surface that is convex toward the side opposite to the direction toward the substrate 21, instead of the concave surface 33. That is, the convex surface 333 projects in a direction away from the main surface 21a. The first portion 30a is included in the convex surface 333. The amount of protrusion of the convex surface 333 is smaller than the amount of protrusion of the portion including the second portion 30b. That is, the circuit cover 330 has a protrusion amount of the portion facing the side 21b (convex surface 333) smaller than the protrusion amount of the portion facing the angle 21c.

As described above, in the lighting device according to the present modification, the circuit cover 330 has a convex surface 333 that is provided on a portion of the substrate 21 facing the side 21b and is convex toward the side opposite to the direction toward the substrate 21. Have. The first portion 30a is included in the convex surface 333.

As a result, it is possible to suppress darkening of the central portion as compared with the case where the convex surface 333 is not provided.

(Other)
The lighting device according to the present invention has been described above based on the above-described embodiment and its modification, but the present invention is not limited to the above-described embodiment.

For example, in the above embodiment, the circuit cover 30 or 130 may have only one concave surface 33. Further, the circuit cover 230 may have only one or only two planes 233.

Further, for example, the lighting device 1 may not include the nightlight light emitting element 27 or the light receiving element 28.

Further, for example, the shape and size of each constituent member shown in the above embodiment, the fixing method between the constituent members, and the like are merely examples, and are not particularly limited. For example, the instrument body 10 or the translucent cover 60 may be a square instrument body or a translucent cover having a square, rectangular, or octagonal shape in a plan view.

Further, for example, in the above embodiment, an example in which the light emitting element 22 is an SMD type LED element has been described, but the present invention is not limited to this. For example, the light emitting element 22 may have a COB (Chip On Board) structure in which the LED chip is directly mounted on the substrate 21. In this case, a plurality of LED chips mounted on the substrate 21 may be collectively sealed by the sealing member, or one or a plurality of LED chips may be individually sealed. Further, the sealing member may contain a wavelength conversion material such as a yellow phosphor.

Further, the light emitting element 22 does not have to be an LED. For example, the light emitting element 22 may be a semiconductor light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence) element, or another solid light emitting element such as an inorganic EL element.

In addition, it is realized by arbitrarily combining the components and functions in each embodiment within the range obtained by applying various modifications to each embodiment and the gist of the present invention. Forms are also included in the present invention.

1 Lighting device 10 Instrument body 20 Light emitting module 21 Board 21a Main surface 21b Side 21c Square 22 Light emitting element 23 Circuit component 23a First circuit component 23b Second circuit component 25 Inner peripheral region (first region)
25a side area (third area)
25b square area (4th area)
26 Outer circumference area (second area)
27 Light emitting element for nightlight 28 Light receiving element 30, 130, 230 Circuit cover 30a First part 30b Second part 35 Opening 233 Plane

Claims (9)

A lighting device including a fixture body and a light emitting module attached to the fixture body.
The light emitting module
A substrate having a main surface including a first region and an annular second region surrounding the first region, and having a substantially rectangular shape in a plan view.
A plurality of circuit components arranged in the first region and
It includes a plurality of light emitting elements arranged in a ring shape so as to surround the first region and arranged in the second region.
The lighting device further includes a cover member that covers the first region.
The cover member is
The first part facing the side of the substrate and
It has a second portion that faces the corner of the substrate and has a distance from the center of the first region equal to the first portion in a plan view.
The first portion is a lighting device closer to the main surface than the second portion. The cover member has a curved surface recessed toward the substrate, which is provided on a portion facing the side of the substrate.
The lighting device according to claim 1, wherein the first portion is included in the curved surface. The cover member has a flat surface inclined with respect to the substrate, which is provided on a portion facing the side of the substrate.
The lighting device according to claim 1, wherein the first portion is included in the plane. The cover member has a curved surface that is provided on a portion facing the side of the substrate and is convex toward the side opposite to the direction toward the substrate.
The lighting device according to claim 1, wherein the first portion is included in the curved surface. The cover member has two said first portions.
The lighting device according to any one of claims 1 to 4, wherein the two first portions face each other of two opposing sides of the four sides of the substrate. The cover member has three said first portions.
The lighting device according to any one of claims 1 to 4, wherein the three first portions face each of three of the four sides of the substrate. The plurality of circuit components
1st circuit parts and
Including a second circuit component whose height from the main surface is higher than that of the first circuit component.
The first circuit component is arranged in a third region of the first region facing the side of the substrate.
The lighting device according to any one of claims 1 to 6, wherein the second circuit component is arranged in a fourth region of the first region facing the corner of the substrate. The light emitting module further includes a light emitting element for a nightlight arranged in the third region.
The lighting device according to claim 7, wherein the cover member is provided with an opening for exposing the light emitting element for a nightlight. The light emitting module further includes a light receiving element arranged in the third region.
The lighting device according to claim 8, wherein the light receiving element is exposed to the opening.

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