JP2020191414A - substrate - Google Patents

Abstract

To provide a substrate that, even when an electronic component to be the source of heat generation is mounted on the substrate, and a fire spreads to the substrate due to the heat generated in the electronic component, can stop the spread of the fire to the substrate before the fire reaches a resin product.SOLUTION: A substrate comprises: a pair of patterns that extend along a first direction and are respectively arranged at an interval in a second direction intersecting with the first direction, and are electrically connected to a power supply source at one ends in the first direction; a first mounting part on which a resin product can be mounted while connected to each of the pair of patterns; a second mounting part that is arranged farther from the one ends in the first direction than the first mounting part in the first direction, and on which an electronic component can be mounted while connected to each of the pair of patterns; and a hole for stopping fire spread that is arranged between the first mounting part and the second mounting part in the first direction and between the pair of patterns in the second direction, and penetrates in a plate thickness direction.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to substrates.

Patent Document 1 discloses a printed circuit board in which a slit is provided between different poles of an AC power supply source connector.

Jikkenhei 5-53259 Gazette

In the printed circuit board of Patent Document 1, prevention of ignition due to water droplets limited to the different poles of the AC power connector is taken into consideration, but the fire spread of the printed circuit board due to heat generation of electronic components in which slits cannot be provided between the different poles. No consideration is given to prevention.

The present disclosure provides a substrate in which an electronic component serving as a heat source is mounted on a substrate, and even if the substrate spreads due to heat generated by the electronic component, the spread of the substrate can be stopped before reaching the resin product. The purpose is.

The substrate of the example of the present disclosure is
A pair of patterns extending along the first direction and spaced apart from each other in the second direction intersecting the first direction, with one end of the first direction electrically connected to the power supply source.
A first mounting unit capable of mounting a resin product while being connected to each of the pair of patterns,
A second mounting unit that is arranged farther than the first mounting portion in the first direction and can mount an electronic component in a state of being connected to each of the pair of patterns.
It is provided between the first mounting portion and the second mounting portion in the first direction and between the pair of patterns in the second direction, and has a hole for stopping fire spread that penetrates in the plate thickness direction.

According to the substrate, it is arranged between the first mounting portion on which a resin product can be mounted and the second mounting portion on which electronic components can be mounted and between a pair of patterns, and the fire spreads through the substrate in the plate thickness direction. It has a stop hole. The second mounting unit is arranged closer to one end of a pair of patterns electrically connected to the power supply source than the first mounting unit. With such a configuration, even if the substrate spreads due to heat generated by the electronic components, it is possible to realize a substrate capable of stopping the spread of fire before reaching the resin product that causes ignition.

The plan view which shows the substrate of one Embodiment of this disclosure. The plan view which shows the 1st modification of the substrate of FIG. The plan view which shows the 2nd modification of the substrate of FIG. The plan view which shows the 3rd modification of the substrate of FIG. The plan view which shows the 4th modification of the substrate of FIG. The plan view which shows the 5th modification of the substrate of FIG. The plan view which shows the 6th modification of the substrate of FIG.

Hereinafter, an example of the present disclosure will be described with reference to the accompanying drawings. In the following description, terms indicating a specific direction or position (for example, terms including "top", "bottom", "right", and "left") are used as necessary, but the use of these terms is used. Is for facilitating the understanding of the present disclosure with reference to the drawings, and the meaning of those terms does not limit the technical scope of the present disclosure. In addition, the following description is merely an example and is not intended to limit the present disclosure, its application, or its use. Furthermore, the drawings are schematic, and the ratio of each dimension does not always match the actual one.

The substrate 1 of the embodiment of the present disclosure is composed of, for example, a composite base material, and as shown in FIG. 1, a pair of patterns 10 and 20 arranged electrically independently of each other and a resin product 100 are included. It includes a first mounting unit 30 to be mounted and a second mounting unit 40 on which the electronic component 200 is mounted. The resin product 100 is, for example, a resin case, a resin terminal block, and a resin connector. Further, the electronic component 200 is, for example, a chip multilayer ceramic capacitor, a chip semiconductor, a chip resistor, and a discrete component. The electronic component 200 is mounted on the surface of the substrate 1 by, for example, cream solder printing.

Each of the patterns 10 and 20 has conductivity and is formed on the surface of the substrate 1. The patterns 10 and 20 are arranged at intervals in the second direction Y extending along the first direction X and intersecting (for example, orthogonal to each other) the first direction X. In each of the patterns 10 and 20, one ends 11 and 21 of the first direction X are electrically connected to the power supply source 2, respectively.

As an example, the first mounting unit 30 is arranged at one end of the first direction X of the substrate 1. Further, the second mounting portion 40 is arranged at the other end of the first direction X of the substrate 1 as an example. That is, the first mounting unit 30 is arranged at one ends 11 and 21 of the first direction X of the patterns 10 and 20 connected to the power supply source 2 rather than the second mounting unit 40 in the first direction X. .. In other words, the resin product 100 mounted on the first mounting unit 30 is arranged between the electronic component 200 mounted on the second mounting unit 40 and the power supply source 2 in the first direction X. The first mounting portion 30 and the second mounting portion 40 may be arranged on the same plate surface of the substrate 1, or the first mounting portion 30 may be arranged on one of the pair of plate surfaces in the plate thickness direction. The second mounting portion 40 may be arranged on the other side of the pair of plate surfaces in the thickness direction.

Further, the substrate 1 further includes a fire spread stop hole 50 that penetrates the substrate 1 in the plate thickness direction (that is, the paper surface penetration direction of FIG. 1). As an example, the fire spread stop hole 50 has a substantially circular shape with a diameter of about 1 mm, is between the first mounting portion 30 and the second mounting portion 40 in the first direction X, and is in the second direction Y. It is arranged between a pair of patterns 10 and 20.

By the way, when the board 1 is not provided with the hole 50 for stopping the spread of fire, when the electronic component 200 mounted on the board 1 generates heat due to a short circuit failure or an overload, the second mounting portion 40 on which the electronic component 200 is mounted is mounted. Is heated and graphitization proceeds. As this graphitization progresses, a carbonized conductive path is formed between the electrodes of the electronic component 200, and it becomes red hot due to an electric current. After that, the substrate 1 spreads fire along the patterns 10 and 20 in the direction approaching the power supply source 2 while repeating graphitization and red heat. When the fire spread of the substrate 1 reaches the resin product 100, a carbonized conductive path is also formed in the resin product 100, and a flammable gas is generated from the resin product 100. By igniting the generated flammable gas, the product on which the substrate 1 is mounted may ignite.

In this way, in general, the risk of ignition of a product on which a substrate is mounted (in other words, the phenomenon of ignition from a product that can cause burning to other than the product) increases at once in the resin case, resin terminal block, and resin. A resin product such as a connector ignites. Even if a carbonized conductive path is formed in the vicinity of an electronic component, it is possible to reduce the risk of product ignition if the fire spread of the substrate can be stopped before it reaches the resin product.

As a means for preventing the carbonized conductive path from being formed on the substrate, for example, as in the invention of Patent Document 1, it is conceivable to provide a slit between the electrodes on which the carbonized conductive path can be formed. However, depending on the shape and size of electronic components (that is, chip multilayer ceramic capacitors, chip semiconductors, chip resistors, etc.) that can form carbonized conductive paths, slitting between electrodes is not possible, preventing the formation of carbonized conductive paths. It may not be possible.

In the substrate 1, the substrate 1 is arranged between the first mounting portion 30 on which the resin product 100 can be mounted and the second mounting portion 40 on which the electronic component 200 can be mounted and between the pairs of patterns 10 and 20. It is provided with a hole 50 for stopping fire spread that penetrates in the plate thickness direction. The first mounting unit 30 is arranged closer to the ends 11 and 21 of the pair of patterns 10 and 20 electrically connected to the power supply source 2 than the second mounting unit 40. With such a configuration, even if the substrate 1 spreads due to the heat generated by the electronic component 200, the progress of the fire spread is stagnant until the substrate 1 burns out in the fire spread stop hole 50, and the carbonized conductive path is formed toward the power supply source 2. It can be prevented from being newly formed. As a result, it is possible to realize the substrate 1 capable of stopping the spread of fire before reaching the resin product 100 that causes ignition.

The fire spread stop hole 50 may be arranged between the first mounting portion 30 and the second mounting portion 40 and between the pair of patterns 10 and 20, and is not limited to the configuration of the embodiment.

For example, as shown in FIG. 2, the fire spread stop hole 50 is centered between the first mounting portion 30 and the second mounting portion 40 in the first direction X (in other words, the first mounting portion 30 and the second mounting portion 30). It may be arranged closer to the second mounting portion 40 than the center line CL) that passes between the mounting portion 40 and extends in the second direction Y. With such a configuration, it is possible to prevent burning to other circuits, so that the spread of fire on the substrate 1 can be stopped more reliably.

For example, the fire spread stop hole 50 is not limited to a substantially circular round hole, but may be an elongated elongated hole extending in the first direction X as shown in FIG. 2, or a first elongated hole as shown in FIG. It may be an elongated hole extending in two directions Y, or as shown in FIG. 4, it may be a round hole having a diameter larger than that of the substrate 1 of FIG. Further, as shown in FIG. 5, the fire spread stop hole 50 may be a slit extending along the first direction X from the end of the substrate 1 on the first mounting portion 30 side of the first direction X. By adopting the shape of the fire spread stop hole 50 in which the space formed by the fire spread stop hole 50 becomes large, the fire spread of the substrate 1 can be stopped more reliably.

For example, the number of holes 50 for stopping the spread of fire is not limited to one, and as shown in FIG. 6, a plurality of holes 50 may be provided. The substrate 1 of FIG. 6 is provided with three holes 50 for stopping the spread of fire. Each of the fire spread stop holes 50 is arranged closer to the second mounting portion 40 than the center line CL in the first direction X, and as an example, each is arranged so as to be located at the apex of the isosceles triangle. That is, one fire spread stop hole 50 is arranged at a position closest to the second mounting portion 40 in the first direction X, and two fire spread stop holes 50 are arranged along the center line CL at intervals in the second direction Y. Has been done. With this configuration, even if the progress of the fire spread cannot be stopped until the substrate 1 is burned out in the fire spread stop hole 50 closest to the second mounting portion 40 in the first direction X, along the center line CL. The two holes 50 for stopping the spread of fire can more reliably stall the progress of the spread of fire on the substrate 1. That is, the spread of fire on the substrate 1 can be stopped more reliably.

As shown in FIG. 7, in addition to the fire spread stop hole 50, the substrate 1 is located between the first mounting portion 30 and the second mounting portion 40 in the first direction X in any one of the pair of patterns 10 and 20. The auxiliary fire spread stop hole 60 provided in the above can be further provided. In the substrate 1 of FIG. 7, the auxiliary fire spread stop hole 60 is provided between the first mounting portion 30 and the second mounting portion 40 of the upper pattern 10 as an example. The auxiliary fire spread stop hole 60 is an elongated elongated hole that penetrates the substrate 1 in the plate thickness direction and extends along the second direction Y, and the first pattern 101 and the second pattern 10 and the second pattern 10 are independent of each other in the first direction X. It is divided into patterns 102. The first pattern 101 and the second pattern 102 are connected by a jumper member 70 arranged so as to cross the auxiliary fire spread stop hole 60 in the first direction X. With this configuration, the spread of fire on the substrate 1 can be stopped more reliably. The jumper member 70 is composed of, for example, a zero ohm jumper resistor, and has a substantially rectangular shape long in the first direction X in a plan view along the plate thickness direction of the substrate 1.

The auxiliary fire spread stop hole 60 is configured such that the length of the second direction Y is larger than the length of the jumper member 70 in the first direction X. For example, when the dimension of the jumper member 70 in the longitudinal direction (that is, the first direction X) is 3.2 mm, the auxiliary fire spread stop hole 60 has a length D in the second direction Y larger than 3.2 mm. have. With such a configuration, it is possible to prevent the carbonized conductive path from wrapping around the auxiliary fire spread stop hole 60 and heading toward the power supply source 2. The auxiliary fire spread stop hole 60 has a width of about 1 mm (that is, a length of the first direction X) as an example.

The pair of patterns 10 and 20 may extend along the first direction X and are arranged at intervals in the second direction Y, and one end of the first direction X may be electrically connected to the power supply source. , The configuration is not limited to the above embodiment.

The various embodiments of the present disclosure have been described in detail with reference to the drawings, and finally, various aspects of the present disclosure will be described. In the following description, a reference reference numeral is also provided as an example.

The substrate 1 of the first aspect of the present disclosure is
A pair that extends along the first direction X and is spaced apart from each other in the second direction Y that intersects the first direction X, and one end of the first direction X is electrically connected to the power supply source 2. Patterns 10 and 20 and
A first mounting unit 30 capable of mounting the resin product 100 in a state of being connected to each of the pair of patterns 10 and 20 and
A second mounting that is arranged farther from the ends 11 and 21 than the first mounting portion 30 in the first direction X and can mount the electronic component 200 in a state of being connected to each of the pair of patterns 10 and 20. Part 40 and
A fire spread stop that is arranged between the first mounting portion 30 and the second mounting portion 40 in the first direction X and between the pair of patterns 10 and 20 in the second direction Y and penetrates in the plate thickness direction. It is provided with a hole 50.

According to the substrate 1 of the first aspect, even if the substrate 1 spreads due to the heat generated by the electronic component 200, the progress of the fire spread is stagnated until the substrate 1 is burned out in the fire spread stop hole 50 to prevent the extension of the carbonized conductive path. be able to. As a result, it is possible to realize the substrate 1 capable of stopping the spread of fire before reaching the resin product 100 that causes ignition.

The substrate 1 of the second aspect of the present disclosure is
The fire spread stop hole 50 is arranged closer to the second mounting portion 40 than the center between the first mounting portion 30 and the second mounting portion 40 in the first direction.

According to the substrate 1 of the second aspect, it is possible to prevent burning to other circuits, so that the spread of fire of the substrate 1 can be stopped more reliably.

The substrate 1 of the third aspect of the present disclosure is
A plurality of fire spread stop holes 50 are provided at intervals along the first direction X.

According to the substrate 1 of the third aspect, the spread of fire of the substrate 1 can be stopped more reliably.

The substrate 1 of the fourth aspect of the present disclosure is
The fire spread stop hole 50 is composed of an elongated elongated hole extending along the first direction X.

According to the substrate 1 of the fourth aspect, for example, by increasing the space formed by the fire spread stop hole 50, the fire spread of the substrate 1 can be stopped more reliably.

The substrate 1 of the fifth aspect of the present disclosure is
The fire spread stop hole 50 is composed of an elongated elongated hole extending along the second direction Y.

According to the substrate 1 of the fifth aspect, for example, by increasing the space formed by the fire spread stop hole 50, the fire spread of the substrate 1 can be stopped more reliably.

The substrate 1 of the sixth aspect of the present disclosure is
It is composed of slits extending along the first direction X from the end of the first direction X on the side of the first mounting portion 30.

According to the substrate 1 of the sixth aspect, for example, by increasing the space formed by the fire spread stop hole 50, the fire spread of the substrate 1 can be stopped more reliably.

The substrate 1 of the seventh aspect of the present disclosure is
The pair is provided between the first mounting portion 30 and the second mounting portion 40 in the first direction X in any one of the pair of patterns 10 and 20 and penetrates in the plate thickness direction. An auxiliary fire spread stop hole 60 that divides one of the patterns 10 and 20 into the first pattern 101 and the second pattern 102 that are independent of each other in the first direction X, and
A jumper member 70 that crosses the auxiliary fire spread stop hole 60 in the first direction X and connects the first pattern 101 and the second pattern 102 is further provided.

According to the substrate 1 of the seventh aspect, the spread of fire of the substrate 1 can be stopped more reliably.

In addition, by appropriately combining any of the various embodiments or modifications, the effects of each can be achieved. In addition, combinations of embodiments or examples or combinations of embodiments and examples are possible, and features in different embodiments or examples are also possible.

The present disclosure can be applied to a substrate made of a composite substrate such as CEM3, for example.

1 Board 2 Power supply source 10, 20 Pattern 101 1st pattern 102 2nd pattern 11, 21 One end 30 1st mounting part 40 2nd mounting part 50 Fire spread stop hole 60 Auxiliary fire spread stop hole 70 Jumper member 100 Resin product 200 Electronic components

Claims (7)

A pair of patterns extending along the first direction and spaced apart from each other in the second direction intersecting the first direction, with one end of the first direction electrically connected to the power supply source.
A first mounting unit capable of mounting a resin product while being connected to each of the pair of patterns,
A second mounting unit that is arranged farther than the first mounting portion in the first direction and can mount an electronic component in a state of being connected to each of the pair of patterns.
A substrate provided between the first mounting portion and the second mounting portion in the first direction and between the pair of patterns in the second direction and provided with a fire spread stop hole penetrating in the plate thickness direction. .. The substrate according to claim 1, wherein the fire spread stop hole is arranged closer to the second mounting portion than the center between the first mounting portion and the second mounting portion in the first direction. The substrate according to claim 1 or 2, further comprising the plurality of holes for stopping the spread of fire, which are arranged at intervals along the first direction. The substrate according to any one of claims 1 to 3, wherein the fire spread stop hole is formed of an elongated elongated hole extending along the first direction. The substrate according to any one of claims 1 to 3, wherein the fire spread stop hole is formed of an elongated elongated hole extending along the second direction. The substrate according to any one of claims 1 to 3, wherein the fire spread stop hole is formed of a slit extending along the first direction from the end of the first mounting portion in the first direction. One of the pair of patterns is provided between the first mounting portion and the second mounting portion in the first direction in any one of the pair of patterns and penetrates in the plate thickness direction to form one of the pair of patterns. Auxiliary fire spread stop holes that divide into the first pattern and the second pattern that are independent of each other in the first direction,
The substrate according to any one of claims 1 to 6, further comprising a jumper member for connecting the first pattern and the second pattern across the auxiliary fire spread stop hole in the first direction.

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