JP2020188232A - Flexible board assembly method and assembly device - Google Patents

Abstract

To stably perform work of inserting and assembling a flexible substrate into an insertion slot of a connector component.SOLUTION: In an assembling method of a flexible substrate 6, the flexible substrate includes a hard portion that can be sucked and conveyed by a suction nozzle at least on the tip side in the insertion direction with respect to a connector component 4, and a flexible portion that can be flexed and deformed on the rear side of the hard portion, and the flexible substrate is lowered with the tip side tilted downward until the tip touches the front side of the connector component on the plate surface of a circuit substrate 2, and the flexible substrate is slid and moved in the insertion direction to insert the tip into an insertion slot while bending the flexible portion with the tip in contact with the plate surface.SELECTED DRAWING: Figure 6

Description

The present invention relates to a flexible board assembling method and an assembling device for connecting a flexible board connected to an electronic component to a circuit board.

For example, when assembling an in-vehicle image sensor, a step of inserting and connecting a flexible substrate derived from the sensor body to a connector component mounted on the upper surface of the circuit board is performed. In this case, the flexible substrate is configured by providing wiring made of copper foil on one side of a thin plastic film such as PET, and has flexibility. On the other hand, the connector component has a horizontally long insertion port, and the height dimension of the insertion port has a slight clearance with respect to the thickness dimension of the flexible substrate. Therefore, conventionally, the flexible substrate has been manually inserted and assembled by an operator into the insertion port of the connector component.

Japanese Unexamined Patent Publication No. 9-134939

It is desired to automate the work of inserting and assembling the flexible board as described above into the insertion port of the connector component. However, while there are circumstances in which it is difficult to hold the flexible substrate stably due to the flexibility of the flexible substrate, the clearance between the insertion slot and the flexible substrate is extremely small, for example 0.03 mm. Furthermore, there are dimensional errors due to product variations. Therefore, there is a high degree of difficulty in automating the work of inserting the flexible substrate into the insertion slot of the connector component.

The present invention has been made in view of the above circumstances, and an object of the present invention is a method for assembling a flexible substrate capable of stably performing an operation of inserting and assembling a flexible substrate into an insertion port of a connector component. And to provide an assembly device.

In order to achieve the above object, the method of assembling the flexible substrate of the present invention is to mount a connector component (4) having a slit-shaped insertion port (4a) extending parallel to the plate surface on a circuit board (2). On the other hand, it is a method for inserting the tip end portion of the flexible substrate (6) from the insertion port and automatically assembling it to the connector component, and the flexible substrate is at least on the tip end side in the insertion direction with respect to the connector component. The flexible substrate is provided with a hard portion (8) that can be sucked and conveyed by a suction nozzle (18) and a flexible portion (9) that can be flexed and deformed on the rear side of the hard portion. With the tip side tilted downward, the tip portion is lowered until it comes into contact with the front side of the connector component on the plate surface of the circuit board, and the flexible portion is in contact with the plate surface. The flexible substrate is slid and moved in the insertion direction while the portion is bent, and the tip portion is inserted into the insertion port.

Further, the flexible substrate assembling device of the present invention has a flexible substrate (6) with respect to a circuit board (2) on which a connector component (4) having a slit-shaped insertion port (4a) extending parallel to the plate surface is mounted. ) Is a device (11) for inserting from the insertion port and automatically assembling to the connector component, and the flexible substrate has a suction nozzle at least on the tip side in the insertion direction with respect to the connector component. It has a hard portion (8) that can be attracted and conveyed in (18), and has a flexible portion (9) that can be flexed and deformed on the rear side of the hard portion, so that the circuit board is in a positioned state. An assembly hand (17) having a base (12) to be set, a suction nozzle capable of sucking a hard portion of the flexible substrate, a transfer mechanism (16) for freely moving the assembly hand, and the assembly. A control device (15) for controlling the attached hand and the transfer mechanism to automatically execute the assembling work is provided, and the control device is in a state where the hard portion on the tip side of the flexible substrate is sucked by the suction nozzle. The flexible substrate is moved by the transfer mechanism, and in a state where the tip side of the flexible substrate is tilted downward, the tip portion is lowered until it comes into contact with the front side of the connector component on the plate surface of the circuit board. In a state where the tip portion is in contact with the plate surface, the flexible substrate is slid and moved in the insertion direction by the transfer mechanism while releasing the suction by the suction nozzle and bending the flexible portion. Is inserted into the insertion slot.

In the above configuration, even if the flexible substrate has flexibility, the hard portion can be sucked by the suction nozzle by providing the hard portion on the tip side. As a result, the handleability of the flexible substrate is improved, and the transfer can be automated. Then, when inserting the tip of the flexible board into the insertion port of the connector component, the flexible board is brought into contact with the front side of the connector component on the board surface while being tilted downward with respect to the board surface of the circuit board. The flexible substrate is slid and moved in the insertion direction while bending the flexible portion in a state where the tip portion is in contact with the plate surface. At this time, the deflection of the flexible portion makes it possible to insert the tip portion into the insertion port while absorbing variations in the height direction of the slit-shaped insertion port, that is, in the plate thickness direction of the circuit board.

Therefore, even if the flexible substrate is flexible and the clearance between the flexible substrate and the insertion slot is small, the insertion process that has been manually performed in the past can be automatically performed. .. As a result, it is possible to stably perform the work of inserting and assembling the flexible substrate into the insertion port of the connector component, which is an excellent effect.

A front view showing an embodiment and schematically showing an overall configuration of an assembly device. Top view of the circuit board after assembling the sensor unit Top view of the sensor unit showing the holding state by the assembled hand Plan view of flexible substrate Front view of the assembled hand Perspective view of the visual recognition device part A plan view showing the alignment of the flexible substrate in the plane direction. The figure which shows the procedure of the assembly process which a control device performs. Side view showing the state during insertion work (Part 1) Side view showing the state during insertion work (Part 2)

Hereinafter, an embodiment in which the present invention is applied to, for example, assembling an in-vehicle image sensor mounted on an automobile will be described with reference to the drawings. As shown in FIG. 2, the vehicle-mounted image sensor 1 as an electronic component is configured by connecting a sensor body 3 as an electronic component body to a circuit board 2. First, the circuit board 2 and the sensor main body 3 will be briefly described with reference to FIGS. 2 to 4. Here, as shown in FIG. 2, the left-right direction of the circuit board 2 is defined as the X direction, the front-rear direction is defined as the Y direction, and the vertical direction of the equipment is defined as the Z direction (see FIG. 1).

That is, as shown in FIG. 2, the circuit board 2 has a substantially quadrangular shape, and a plurality of electronic components are mounted on a plate surface, that is, an upper surface thereof to form a control circuit or the like. At this time, as shown in FIGS. 6 and 7, the connector component for connecting to the sensor main body 3 is located slightly inside the front side of the left edge portion in the drawing on the plate surface of the circuit board 2. 4 is implemented. The connector component 4 is elongated in the front-rear direction as shown in FIG. 2 and the like, and is composed of, for example, a so-called lock lever type connector having a lock lever 5 on the upper portion. As shown in FIGS. 9 and 10, the connector component 4 has a horizontally long slit-shaped insertion port 4a parallel to the plate surface on the left surface in the drawing.

In the connector component 4, the flexible substrate 6 is electrically connected by the rotational displacement of the upper lever 5 while the tip portion of the flexible substrate 6 described later is inserted into the insertion port 4a. It is designed to be locked to. Incidentally, the height dimension of the insertion port 4a, that is, the width dimension of the slit is, for example, 0.37 mm. On the other hand, the thickness dimension of the tip portion of the flexible substrate 6 is, for example, 0.34 mm, and the clearance is extremely small.

The sensor body 3 is configured by incorporating a lens, an image sensor element, or the like in the case 3a, and is mounted on a rectangular sensor substrate 7 as shown in FIGS. 2, 7, and the like. A connector 7a is provided on the right side of FIG. 2 of the sensor board 7, and the base end of the flexible board 6 is connected to the connector 7a. As shown in FIG. 4, the flexible substrate 6 has a slightly long sheet shape in the left-right direction, and the tip side extends to the right in the figure. The tip end portion, which is the right end portion in the figure of the flexible substrate 6, is inserted into and connected to the connector component 4.

Although not shown in detail, the flexible substrate 6 is basically configured by providing a conductor pattern made of a copper foil (not shown) on one side of a thin base film having flexibility, in this case, a lower surface. For the base film, for example, a polyester film such as PET is adopted. Then, in the present embodiment, as shown in FIG. 4 and the like, the flexible substrate 6 has a hard portion 8 that can be sucked and conveyed by a suction nozzle described later at least on the tip end side in the insertion direction with respect to the connector component 4. Have. At the same time, the flexible substrate 6 has a flexible portion 9 that can be flexed and deformed on the rear side of the hard portion 8.

More specifically, the hard portion 8 includes all the tip portions of the flexible substrate 6 to be inserted into the connector component 4, and is provided in a wider range than the tip portion. Further, the base end portion of the flexible substrate 6, that is, the portion connected to the connector 7a of the sensor substrate 7, is also designated as the second hard portion 10. Therefore, the flexible portion 9 is provided in an intermediate portion sandwiched between the hard portion 8 and the second hard portion 10. In FIG. 4, for convenience, the hard portion 8 and the second hard portion 10 are shown with hatching.

At this time, in the present embodiment, the hard portion 8 and the second hard portion 10 are formed by attaching a reinforcing film to the upper surface of the base film constituting the flexible substrate 6, that is, the surface opposite to the conductor pattern. It is configured. The portion to which the reinforcing film is not attached is referred to as the flexible portion 9. Specifically, as the reinforcing film, for example, a polyimide (PI) film can be adopted, and for example, it is bonded to the surface of the base film of the flexible substrate 6 by thermocompression bonding.

Here, the assembling device 11 according to the present embodiment in which the flexible board 6 is automatically assembled to the connector component 4 of the circuit board 2 will be described below. FIG. 1 schematically shows the overall configuration of the assembling device 11. The assembling device 11 is a loading / unloading mechanism (a loading / unloading mechanism) in which the circuit board 2 is carried into the base 12 in which the circuit board 2 is set in the positioning state, and the circuit board 2 is carried into the base 12 and carried out after the sensor main body 3 is assembled. (Not shown), a supply mechanism (not shown) that supplies the sensor bodies 3 to which the flexible substrate 6 is attached one by one to a predetermined take-out position, a robot 13, a visual recognition device 14, a control device 15 that controls them, and the like. It is composed of.

The robot 13 comprises a general-purpose vertical articulated robot having, for example, a 6-axis arm 16 as a transfer mechanism. An assembly hand 17 that grips and conveys the flexible substrate 6 to perform assembly work is attached to the attachment flange at the tip of the arm 16. Since the arm 16 has a well-known configuration, detailed description thereof will be omitted, but the assembled hand 17 can be freely moved in the X, Y, and Z directions at an arbitrary angle. In the present embodiment, the assembling hand 17 includes a suction nozzle 18 capable of sucking the hard portion 8 of the flexible substrate 6 and a chuck portion 19 for gripping the case of the sensor body 3.

Specifically, as shown in FIG. 5, the assembling hand 17 has a mounting base 17a to be mounted on the mounting flange. The chuck portion 19 is located on the left side in the figure of the fixed claw portion 19a fixedly provided on the mounting base 17a and the fixed claw portion 19a, and moves in the opening / closing direction with respect to the fixed claw portion 19a to form a component. It is provided with a movable claw portion 19b that grips and releases the grip. Along with this, for example, an air cylinder or the like that serves as a drive source for opening and closing the movable claw portion 19b is provided. For example, in FIG. 5, two suction nozzles 18 are attached to the front and rear of the fixed claw portion 19a downward on the right side of the fixed claw portion 19a. Although not shown, these suction nozzles 18 are connected to a decompression source such as a vacuum pump via an air tube or the like.

As shown in FIG. 3, the assembled hand 17 grips the case of the sensor body 3 from the left and right by the chuck portion 19 and the hard portion 8 on the upper surface of the flexible substrate 6 by the suction nozzle 18. The sensor body 3 and the flexible substrate 6 are held by adsorbing the front and rear two locations in the figure of FIG. At this time, the flexible substrate 6 can be held so as to be continuously substantially flush with the upper surface of the sensor substrate 7. Then, in the holding state, the sensor main body 3 to which the flexible board 6 is attached is freely transferred by the movement of the arm 16, and the work of assembling the circuit board 2 to the connector component 4 is performed as described later.

As shown in FIGS. 1 and 6, the visual recognition device 14 includes a camera 20 located above the base 12 and provided downward, and an image processing device for processing an image captured by the camera 20. Consists of. The visual recognition device 14 is used for aligning the flexible substrate 6 in the plane direction when the flexible substrate 6 is inserted into the connector component 4, and is based on an image taken by the camera 20 before the insertion into the connector component 4. The position shift in the plane direction, particularly the position shift in the Y direction, and the position shift in the rotation direction around the Z axis (θ direction in FIG. 7) are detected. Further, based on the camera 20 taking a picture of the periphery of the connector component 4 after the assembly process by the visual recognition device 14, the work of confirming whether the flexible substrate 6 is correctly inserted into the connector component 4, that is, the assembly is performed is performed. It is said.

Then, the control device 15 is configured to include a computer, controls the entire assembling device 11, and automatically executes the assembling method of the flexible substrate 6 of the present embodiment. Automatically repeat execution. That is, the control device 15 controls the carry-in / carry-out mechanism, the supply mechanism, the arm 16 of the robot 13, the assembling hand 17, and the visual recognition device 14, and is flexible with respect to the connector component 4 of the circuit board 2 by the assembling hand 17. The assembling work of the board 6, that is, the inserting work is automatically and repeatedly executed.

Specifically, as will be described later in the process description, the control device 15 executes an acquisition step of acquiring the sensor main body 3 to which the flexible substrate 6 is connected by the assembly hand 17 at the supply position. Further, in parallel with the acquisition process, the control device 15 carries out the assembled circuit board 2 on the base 12 and carries in the new circuit board 2 before assembling onto the base 12. Perform the process. Next, the control device 15 executes a transfer step of transferring the flexible substrate 6 and the sensor main body 3 to the vicinity of the base 12.

Next, the control device 15 executes an alignment step based on the image taken by the camera 20 of the visual recognition device 14. After the alignment step, the control device 15 executes an assembly step of inserting the tip end portion of the flexible substrate 6 into the insertion port 4a of the connector component 4. As will be described later, in this assembling step, the flexible substrate 6 is lowered until the tip of the flexible substrate 6 is tilted downward until the tip of the flexible substrate 6 comes into contact with the front side, that is, the left side of the connector component 2 on the plate surface of the circuit board 2. The flexible substrate 6 is slid and moved in the insertion direction to insert the tip portion into the insertion port 4a while bending the flexible portion 9 in a state where the tip portion is in contact with the plate surface. ..

Next, the steps of assembling the flexible substrate 6 executed by the assembling device 11 having the above configuration will be described in order with reference to FIGS. 8 to 10. FIG. 8 shows the processing steps executed by the control device 15 in order. That is, first, in step S1, the acquisition step is executed. In this acquisition step, the control device 15 moves the assembly hand 17 to the supply position by the arm 16 of the robot 13, and acquires the sensor main body 3 supplied by the supply mechanism by the assembly hand 17. At this time, as shown in FIGS. 3 and 5, the assembling hand 17 grips the case of the sensor main body 3 by the chuck portion 19, and the hard portion 8 on the upper surface of the flexible substrate 6 is gripped by the two suction nozzles 18. Grip in the adsorbed state. Although not shown, the loading / unloading step of the circuit board 2 with respect to the base 12 is executed in parallel with the acquisition step.

In the next step S2, the transfer step of transferring the sensor body 3 and the flexible substrate 6 to the vicinity of the base 12 by the arm 16 of the robot 13 is executed in a state of being acquired by the assembling hand 17. In this transfer step, as shown in FIGS. 6 and 7, the flexible substrate 6 connected to the sensor main body 3 is moved to a position where it comes to the left side of the insertion port 4a of the connector component 4 of the circuit board 2. In step S3, the visual recognition device 20 detects the misalignment, and in step S4, the alignment step is executed.

Among them, in the step of detecting the misalignment in step S3, as shown in FIGS. 6 and 7, the camera 20 of the visual recognition device 14 is used to plan the connector component 4 on the circuit board 2 and the tip portion of the flexible board 6. The image of the above is taken, and the positional deviation in the Y direction and the rotation direction is detected. The alignment step of step S4 is performed by driving the arm 16 of the robot 13 and moving the flexible substrate 6 and the sensor body 3 so as to correct the detected misalignment.

Then, in step S5, an assembly step of inserting the tip of the flexible substrate 6 into the insertion port 4a of the connector component 4 from the left is executed. In this assembling step, as shown in FIG. 9, the tip end side of the flexible substrate 6 is tilted downward until the tip end portion comes into contact with the front side portion of the connector component 4 on the plate surface of the circuit board 2. Lower. Subsequently, as shown in FIG. 10, in a state where the tip of the flexible substrate 6 is in contact with the plate surface, the suction nozzle 18 releases the suction of the tip, and the flexible substrate 6 is assembled while bending the flexible portion 9. The attached hand 17 moves the sensor body 3 to the right in the figure, slides the flexible substrate 6 in the insertion direction, and inserts the tip end portion into the insertion port 4a.

When the insertion of the flexible substrate 6 into the connector component 4 is completed, the control device 15 releases the grip of the sensor main body 3 by the assembly hand 17 and moves the assembly hand 17 to the supply position again. Then, in step S6, the confirmation step by the visual recognition device 20 is executed. In this confirmation step, the visual recognition device 20 again takes an image of the periphery of the connector component 4 on the circuit board 2 in the plane direction, and confirms whether or not the assembly is performed correctly. When it is confirmed that the assembly is performed correctly, the circuit board 2 to which the sensor body 3 is assembled is carried out from the base 12 for the next process, and the next circuit board 2 is placed on the base 12. Will be delivered to. If the assembly is not performed correctly, an error notification will be sent.

According to such an embodiment, the following actions and effects can be obtained. That is, in the present embodiment, by providing the hard portion 8 on the tip side of the flexible substrate 6, even if the flexible substrate 6 itself has flexibility, the hard portion 8 is adsorbed by the suction nozzle 18. Can be done. As a result, the handleability of the flexible substrate 6 is improved, and the transfer can be automated.

Then, when the tip portion of the flexible substrate 6 is inserted into the insertion port 4a of the connector component 4, the tip portion of the flexible substrate 6 is tilted downward with respect to the plate surface of the circuit board 2, and the tip portion is the connector component 4 on the plate surface. The flexible substrate 6 was slid and moved in the insertion direction while the flexible portion 9 was flexed in a state where the tip portion was in contact with the plate surface. At this time, due to the deflection of the flexible portion 9, the tip portion can be inserted into the insertion port 4a while absorbing the variation in dimensions in the height direction of the slit-shaped insertion port 4a, that is, in the plate thickness direction of the circuit board 2. It became.

Therefore, even if the flexible substrate 6 is flexible and the clearance between the flexible substrate 6 and the insertion port 4a is small, the insertion process that has been manually performed in the past can be automatically performed. It will be possible. Along with this, it becomes possible to automate the post-process. As a result, according to the method of assembling the flexible substrate 6 and the assembling device 11 of the present embodiment, the work of inserting and assembling the flexible substrate 6 into the insertion port 4a of the connector component 4 is stably performed. It has an excellent effect that it is possible.

In the assembling method of the present embodiment, the hard portion 8 of the flexible substrate 6 is formed by attaching a reinforcing film to the surface of the base film of the flexible substrate 6, and the portion to which the reinforcing film is not attached is referred to as the flexible portion 9. It was configured to be. As a result, the hard portion 8 can be provided at low cost with a simple structure. It goes without saying that the flexible portion 9 can secure the functions originally required for the flexible substrate 6, for example, the function of electrically connecting the substrate 2 and the sensor main body 3 in a U-shaped bent state.

Further, in the present embodiment, the base end portion of the flexible substrate 6 is assembled in a state of being connected to the sensor main body 3, and the assembling hand 17 of the assembling device 11 attracts the hard portion 8 of the flexible substrate 6. It is configured to have a suction nozzle 18 and a chuck portion 19 for gripping the sensor main body 3. As a result, the sensor main body 3 and the flexible substrate 6 connected to the sensor main body 3 can be integrally transferred by the assembling hand 17, and even when the sensor main body 3 is connected, the transfer work and insertion can be performed. Can be easily performed.

Further, in the assembling device 11 of the present embodiment, the plane direction when the flexible board 6 is inserted into the connector component 4 based on the camera 20 taking an image of the circuit board 2 in the plane direction from above the base 12. The configuration is provided with a visual recognition device 14 for aligning the above. As a result, when the flexible substrate 6 is inserted into the connector component 4, the alignment in the plane direction can be easily and surely performed, and high quality, efficient and smooth work becomes possible.

In the above-described embodiment, the hard portion 8 of the flexible substrate 6 is configured by attaching a hard reinforcing film on a soft base film, but the hard portion and the flexible portion are made of different materials. It is possible to make a flexible substrate from the film of. The second hard portion 10 of the flexible substrate 6 does not necessarily have to be provided, and the flexible portion can be provided at a plurality of locations. Further, the transfer mechanism is not limited to the 6-axis type vertical articulated robot, and various configurations can be adopted. Various changes can be made to the specific configuration of the assembled hand.

Further, in the above embodiment, assembling an in-vehicle image sensor has been given as a specific example, but it can be applied to all of those in which a flexible substrate is attached to a connector component of a circuit board. In addition, the overall configuration and arrangement of the assembling device 11 can be changed in various ways. Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and modifications within an equal range. In addition, various combinations and forms, as well as other combinations and forms that include only one element, more, or less, are also within the scope of the present disclosure.

In the drawing, 1 is an in-vehicle image sensor (electronic component), 2 is a circuit board, 3 is a sensor body (electronic component body), 4 is a connector component, 4a is an insertion port, 6 is a flexible board, 8 is a hard part, and 9 Is a flexible part, 11 is an assembly device, 12 is a base, 13 is a robot, 14 is a visual recognition device, 15 is a control device, 16 is an arm (transfer mechanism), 17 is an assembly hand, 18 is a suction nozzle, and 19 Indicates a chuck portion, and 20 indicates a camera.

Claims (5)

The tip of the flexible board (6) is inserted through the insertion port into the circuit board (2) on which the connector component (4) having the slit-shaped insertion port (4a) extending parallel to the plate surface is mounted. A method for assembling a flexible substrate for automatically assembling to the connector component.
The flexible substrate has a hard portion (8) that can be sucked and conveyed by a suction nozzle (18) at least on the tip side in the insertion direction with respect to the connector component, and can be flexed and deformed on the rear side of the hard portion. Has a flexible part (9)
A state in which the flexible substrate is lowered with the tip side tilted downward until the tip portion comes into contact with the front side of the connector component on the plate surface of the circuit board, and the tip portion is in contact with the plate surface. A method of assembling a flexible substrate in which the flexible substrate is slid and moved in the insertion direction to insert the tip portion into the insertion port while bending the flexible portion. The method for assembling a flexible substrate according to claim 1, wherein the hard portion of the flexible substrate is formed by attaching a reinforcing film to the surface, and the portion to which the reinforcing film is not attached is the flexible portion. The tip of the flexible board (6) is inserted through the insertion port into the circuit board (2) on which the connector component (4) having the slit-shaped insertion port (4a) extending parallel to the plate surface is mounted. A flexible substrate assembling device (11) for automatically assembling to the connector component.
The flexible substrate has a hard portion (8) that can be sucked and conveyed by a suction nozzle (18) at least on the tip side in the insertion direction with respect to the connector component, and can be flexed and deformed on the rear side of the hard portion. Has a flexible part (9)
The base (12) on which the circuit board is set in the positioning state and
An assembly hand (17) having a suction nozzle capable of sucking a hard portion of the flexible substrate, and an assembly hand (17).
A transfer mechanism (16) that freely moves the assembled hand,
It is provided with a control device (15) that controls the assembly hand and the transfer mechanism to automatically execute the assembly work.
In the control device, the flexible substrate is moved by the transfer mechanism in a state where the hard portion on the tip end side of the flexible substrate is sucked by the suction nozzle, and the tip end side of the flexible substrate is tilted downward. The tip portion is lowered until it comes into contact with the front side of the connector component on the plate surface of the circuit board, and in a state where the tip portion is in contact with the plate surface, suction by the suction nozzle is released and the flexible portion is removed. A flexible substrate assembling device that slides and moves the flexible substrate in the insertion direction by the transfer mechanism and inserts the tip portion into the insertion port while bending the flexible substrate. The base end of the flexible substrate is connected to the electronic component body (3).
The flexible substrate assembling device according to claim 3, wherein the assembling hand includes a suction nozzle for sucking the flexible substrate and a chuck portion (19) for gripping the electronic component main body. A visual recognition device (14) for aligning the flexible substrate in the plane direction when inserting the flexible substrate into the connector component is provided based on taking an image of the circuit board in the plane direction from above the base. The flexible substrate assembling device according to claim 3 or 4.

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