JP2020167394A5 - Electronic modules and electronic devices - Google Patents
Electronic modules and electronic devices Download PDFInfo
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- JP2020167394A5 JP2020167394A5 JP2020032327A JP2020032327A JP2020167394A5 JP 2020167394 A5 JP2020167394 A5 JP 2020167394A5 JP 2020032327 A JP2020032327 A JP 2020032327A JP 2020032327 A JP2020032327 A JP 2020032327A JP 2020167394 A5 JP2020167394 A5 JP 2020167394A5
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- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000004088 simulation Methods 0.000 description 2
Description
本発明は、長手方向の端部に第１電極と第２電極をそれぞれ備え、長手方向の長さがＬ２、短手方向の長さがＷである第１チップ部品及び第２チップ部品と、絶縁基板と、前記絶縁基板の上に設けられた開口を有するソルダーレジスト膜と、前記開口で露出された前記第１電極及び前記第２電極とはんだを介してそれぞれ接合された第１ランド及び第２ランドと、を備えたプリント配線板と、を備えた電子モジュールであって、前記第１チップ部品および第２チップ部品は、互いの前記長手方向が一致するように、前記長手方向に沿って隣接して配置されたインダクタ又はキャパシタであり、前記長手方向における前記第１チップ部品と前記第２チップ部品の距離Ｒｘは前記Ｗ以下であり、前記長手方向における開口の長さをＬ１としたとき、前記Ｌ１と前記Ｌ２は、０．８９４≦Ｌ２／Ｌ１≦１．１２０を満たし、前記長手方向における第１ランドの長さをＬｉＡ、第２ランドの長さをＬｉＢ、前記第１電極の側端面におけるはんだの厚みをＬＯＡ、前記第２電極の側端面におけるはんだの厚みをＬＯＢとしたときに、０．１８３≦ＬＯＡ／ＬｉＡ≦０．３０９、および０．１８３≦ＬＯＢ／ＬｉＢ≦０．３０９を満たす、ことを特徴とする電子モジュールである。 The present invention includes a first chip component and a second chip component, each of which is provided with a first electrode and a second electrode at the end in the longitudinal direction, and has a length in the longitudinal direction of L2 and a length in the lateral direction of W. The insulating substrate, the solder resist film having an opening provided on the insulating substrate, and the first land and the second electrode exposed at the opening are bonded to the first land and the second electrode, respectively, via solder. An electronic module comprising a printed wiring board comprising 2 lands, wherein the first chip component and the second chip component are along the longitudinal direction so that the longitudinal directions of the first chip component and the second chip component coincide with each other. When the inductors or capacitors arranged adjacent to each other, the distance Rx between the first chip component and the second chip component in the longitudinal direction is W or less, and the opening length in the longitudinal direction is L1. L1 and L2 satisfy 0.894≤L2 / L1≤1.120, the length of the first land in the longitudinal direction is LiA , the length of the second land is LiB , and the first electrode. When the thickness of the solder on the side end surface of the second electrode is LOA and the thickness of the solder on the side end surface of the second electrode is LOB, 0.183 ≤ L OA / L iA ≤ 0.309 and 0.183 ≤ L. It is an electronic module characterized by satisfying OB / LiB ≤ 0.309.
また、本発明は、長手方向の端部に第１電極と第２電極をそれぞれ備え、長手方向の長さがＬ２、短手方向の長さがＷである第１チップ部品及び第２チップ部品と、絶縁基板と、前記絶縁基板の上に設けられた開口を有するソルダーレジスト膜と、前記開口で露出された前記第１電極及び前記第２電極とはんだを介してそれぞれ接合された第１ランド及び第２ランドと、を備えたプリント配線板と、を備えた電子モジュールであって、前記第１チップ部品および第２チップ部品は、互いの前記長手方向が一致するように、前記長手方向に沿って隣接して配置された抵抗器であり、前記長手方向における前記第１チップ部品と前記第２チップ部品の距離Ｒｘは前記Ｗ以下であり、前記長手方向における開口の長さをＬ１としたとき、前記Ｌ１と前記Ｌ２は、０．８９４≦Ｌ２／Ｌ１≦１．１２０を満たし、前記長手方向における第１ランドの長さをＬｉＡ、第２ランドの長さをＬｉＢ、前記第１電極の側端面におけるはんだの厚みをＬＯＡ、前記第２電極の側端面におけるはんだの厚みをＬＯＢとしたときに、０．１７７≦ＬＯＡ／ＬｉＡ≦０．３０９、および０．１７７≦ＬＯＢ／ＬｉＢ≦０．３０９を満たす、ことを特徴とする電子モジュールである。 Further, the present invention includes a first electrode and a second electrode at the end in the longitudinal direction, respectively, and the length in the longitudinal direction is L2 and the length in the lateral direction is W, the first chip component and the second chip component. A first land bonded to the insulating substrate, a solder resist film having an opening provided on the insulating substrate, and the first electrode and the second electrode exposed at the opening via solder, respectively. An electronic module comprising a second land and a printed wiring board, wherein the first chip component and the second chip component are oriented in the longitudinal direction so that their longitudinal directions coincide with each other. It is a resistor arranged adjacently along the same direction, the distance Rx between the first chip component and the second chip component in the longitudinal direction is W or less, and the length of the opening in the longitudinal direction is L1. When, the L1 and the L2 satisfy 0.894 ≦ L2 / L1 ≦ 1.120, the length of the first land in the longitudinal direction is LiA , the length of the second land is LiB, and the first land is the first. When the thickness of the solder on the side end surface of the electrode is L OA and the thickness of the solder on the side end surface of the second electrode is L OB , 0.177 ≤ L OA / L iA ≤ 0.309 and 0.177 ≤ It is an electronic module characterized by satisfying L OB / LiB ≦ 0.309.
図８は、第３実施形態に係るシミュレーション結果のグラフである。図８には、第１実施形態及び第３実施形態のそれぞれの接合構造について、側端面１１からのはんだの張り出し長のシミュレーション結果を図示している。図８には、第１実施形態及び第３実施形態のいずれも、ＳＬＡ／ＳＤＡ＝０．６６の場合のはんだの張り出し長を図示している。図８に示すように、第１実施形態では、はんだの張り出し長が４１．５μｍであり、第３実施形態では、はんだの張り出し長が３３．５μｍであった。 FIG. 8 is a graph of simulation results according to the third embodiment. FIG. 8 shows the simulation results of the overhang length of the solder from the side end surface 11 for each of the joining structures of the first embodiment and the third embodiment. FIG. 8 illustrates the overhang length of the solder in the case of S LA / S DA = 0.6 6 in both the first embodiment and the third embodiment. As shown in FIG. 8, in the first embodiment, the overhang length of the solder was 41.5 μm, and in the third embodiment, the overhang length of the solder was 33.5 μm.
Claims (15)
絶縁基板と、前記絶縁基板の上に設けられた開口を有するソルダーレジスト膜と、前記開口で露出された前記第１電極及び前記第２電極とはんだを介してそれぞれ接合された第１ランド及び第２ランドと、を備えたプリント配線板と、
を備えた電子モジュールであって、
前記第１チップ部品および第２チップ部品は、互いの前記長手方向が一致するように、前記長手方向に沿って隣接して配置されたインダクタ又はキャパシタであり、
前記長手方向における前記第１チップ部品と前記第２チップ部品の距離Ｒｘは前記Ｗ以下であり、
前記長手方向における開口の長さをＬ１としたとき、前記Ｌ１と前記Ｌ２は、
０．８９４≦Ｌ２／Ｌ１≦１．１２０を満たし、
前記長手方向における第１ランドの長さをＬｉＡ、第２ランドの長さをＬｉＢ、前記第１電極の側端面におけるはんだの厚みをＬＯＡ、前記第２電極の側端面におけるはんだの厚みをＬＯＢとしたときに、
０．１８３≦ＬＯＡ／ＬｉＡ≦０．３０９、および０．１８３≦ＬＯＢ／ＬｉＢ≦０．３０９を満たす、
ことを特徴とする電子モジュール。 A first chip component and a second chip component having a first electrode and a second electrode at the end in the longitudinal direction, each having a length of L2 in the longitudinal direction and a length of W in the lateral direction.
The insulating substrate, the solder resist film having an opening provided on the insulating substrate, and the first land and the second electrode exposed at the opening are bonded to the first land and the second electrode, respectively, via solder. A printed wiring board with 2 lands and
It is an electronic module equipped with
The first chip component and the second chip component are inductors or capacitors arranged adjacent to each other along the longitudinal direction so that the longitudinal directions of the first chip component and the second chip component coincide with each other.
The distance Rx between the first chip component and the second chip component in the longitudinal direction is W or less.
When the length of the opening in the longitudinal direction is L1, the L1 and the L2 are
Satisfy 0.894 ≤ L2 / L1 ≤ 1.120,
The length of the first land in the longitudinal direction is LiA , the length of the second land is LiB , the thickness of the solder on the side end surface of the first electrode is LOA , and the thickness of the solder on the side end surface of the second electrode. When is LOB ,
Satisfy 0.183 ≤ L OA / L iA ≤ 0.309 and 0.183 ≤ L OB / L iB ≤ 0.309.
An electronic module characterized by that.
０．６６≦ＳＬＡ／ＳＤＡ≦０．８８、および０．６６≦ＳＬＢ／ＳＤＢ≦０．８８の関係を満たす、
ことを特徴とする請求項１に記載の電子モジュール。 When the area of the side end surface of the first electrode is S DA , the area of the side end surface of the second electrode is S DB , the area of the first land is S LA , and the area of the second land is S LB.
Satisfy the relationship of 0.66 ≤ S LA / S DA ≤ 0.88 and 0.66 ≤ S LB / S DB ≤ 0.88.
The electronic module according to claim 1.
絶縁基板と、前記絶縁基板の上に設けられた開口を有するソルダーレジスト膜と、前記開口で露出された前記第１電極及び前記第２電極とはんだを介してそれぞれ接合された第１ランド及び第２ランドと、を備えたプリント配線板と、
を備えた電子モジュールであって、
前記第１チップ部品および第２チップ部品は、互いの前記長手方向が一致するように、前記長手方向に沿って隣接して配置された抵抗器であり、
前記長手方向における前記第１チップ部品と前記第２チップ部品の距離Ｒｘは前記Ｗ以下であり、
前記長手方向における開口の長さをＬ１としたとき、前記Ｌ１と前記Ｌ２は、
０．８９４≦Ｌ２／Ｌ１≦１．１２０を満たし、
前記長手方向における第１ランドの長さをＬｉＡ、第２ランドの長さをＬｉＢ、前記第１電極の側端面におけるはんだの厚みをＬＯＡ、前記第２電極の側端面におけるはんだの厚みをＬＯＢとしたときに、
０．１７７≦ＬＯＡ／ＬｉＡ≦０．３０９、および０．１７７≦ＬＯＢ／ＬｉＢ≦０．３０９を満たす、
ことを特徴とする電子モジュール。 A first chip component and a second chip component having a first electrode and a second electrode at the end in the longitudinal direction, each having a length of L2 in the longitudinal direction and a length of W in the lateral direction.
The insulating substrate, the solder resist film having an opening provided on the insulating substrate, and the first land and the second electrode exposed at the opening are bonded to the first land and the second electrode, respectively, via solder. A printed wiring board with 2 lands and
It is an electronic module equipped with
The first chip component and the second chip component are resistors arranged adjacent to each other along the longitudinal direction so that the longitudinal directions of the first chip component and the second chip component coincide with each other.
The distance Rx between the first chip component and the second chip component in the longitudinal direction is W or less.
When the length of the opening in the longitudinal direction is L1, the L1 and the L2 are
Satisfy 0.894 ≤ L2 / L1 ≤ 1.120,
The length of the first land in the longitudinal direction is LiA , the length of the second land is LiB , the thickness of the solder on the side end surface of the first electrode is LOA , and the thickness of the solder on the side end surface of the second electrode. When is LOB ,
Satisfy 0.177 ≤ L OA / L iA ≤ 0.309 and 0.177 ≤ L OB / L iB ≤ 0.309.
An electronic module characterized by that.
１．０２≦ＳＬＡ／ＳＤＡ≦１．３５、および１．０２≦ＳＬＢ／ＳＤＢ≦１．３５を満たす、
ことを特徴とする請求項３に記載の電子モジュール。 When the area of the side end surface of the first electrode is S DA , the area of the side end surface of the second electrode is S DB , the area of the first land is S LA , and the area of the second land is S LB.
Satisfy 1.02 ≤ S LA / S DA ≤ 1.35 and 1.02 ≤ S LB / S DB ≤ 1.35.
The electronic module according to claim 3.
ことを特徴とする請求項１乃至４のいずれか１項に記載の電子モジュール。 The distance Rx between the first chip component and the second chip component is 0.15 mm or less.
The electronic module according to any one of claims 1 to 4.
ことを特徴とする請求項１乃至５のいずれか１項に記載の電子モジュール。 The area of each of the side end surface of the first electrode and the side end surface of the second electrode is less than 0.05 mm 2 .
The electronic module according to any one of claims 1 to 5.
ことを特徴とする請求項６に記載の電子モジュール。 The first chip component and the second chip component are chip components having a size of 0402 or less.
The electronic module according to claim 6.
ことを特徴とする請求項１乃至７のいずれか１項に記載の電子モジュール。 When the printed wiring board is viewed in a plan view, the area of each of the first land and the second land is 40% or less of the area of the opening.
The electronic module according to any one of claims 1 to 7.
ことを特徴とする請求項１乃至８のいずれか１項に記載の電子モジュール。 The longitudinal length L2 of the first chip component and the second chip component is longer than the longitudinal length L1 of the opening.
The electronic module according to any one of claims 1 to 8.
ことを特徴とする請求項１乃至９のいずれか１項に記載の電子モジュール。 When the printed wiring board is viewed in a plan view, the entire opening overlaps with each of the first chip component and the second chip component.
The electronic module according to any one of claims 1 to 9.
前記電子モジュールが通信モジュールである、ことを特徴とする請求項１乃至１０のいずれか１項に記載の電子モジュール。 The electronic module according to any one of claims 1 to 10, wherein the electronic module is a communication module.
前記筐体の内に設けられた請求項１乃至１２のいずれか１項に記載の電子モジュールと、を備える電子機器。 With the housing
An electronic device comprising the electronic module according to any one of claims 1 to 12 provided in the housing.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/821,550 US11412616B2 (en) | 2019-03-26 | 2020-03-17 | Printed circuit board and electronic device |
| JP2022101740A JP2022126814A (en) | 2019-03-26 | 2022-06-24 | Printed circuit board and electronic apparatus |
| US17/810,917 US11792936B2 (en) | 2019-03-26 | 2022-07-06 | Printed circuit board and electronic device |
| US18/455,234 US20230403796A1 (en) | 2019-03-26 | 2023-08-24 | Printed circuit board and electronic device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019059246 | 2019-03-26 | ||
| JP2019059246 | 2019-03-26 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022101740A Division JP2022126814A (en) | 2019-03-26 | 2022-06-24 | Printed circuit board and electronic apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020167394A JP2020167394A (en) | 2020-10-08 |
| JP2020167394A5 true JP2020167394A5 (en) | 2022-05-13 |
| JP7098670B2 JP7098670B2 (en) | 2022-07-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020032327A Active JP7098670B2 (en) | 2019-03-26 | 2020-02-27 | Electronic modules and electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7098670B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2708355B1 (en) | 2011-05-13 | 2020-12-02 | Nippon Electric Glass Co., Ltd. | Laminate and manufacturing method therefor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438892A (en) * | 1990-06-01 | 1992-02-10 | Mitsubishi Electric Corp | Chip parts mounting method and printed wiring board |
| JPH0794858A (en) * | 1993-09-20 | 1995-04-07 | Toshiba Corp | Electronic circuit parts |
| JP2002223062A (en) | 2001-01-26 | 2002-08-09 | Toyo Commun Equip Co Ltd | Pad shape of printed wiring board |
| JP2004303797A (en) | 2003-03-28 | 2004-10-28 | Matsushita Electric Ind Co Ltd | Packaging method of electronic component |
| JP2005203616A (en) | 2004-01-16 | 2005-07-28 | Murata Mfg Co Ltd | Chip component mounting structure and method therefor |
| JP4533248B2 (en) | 2005-06-03 | 2010-09-01 | 新光電気工業株式会社 | Electronic equipment |
| JP5751245B2 (en) | 2012-11-30 | 2015-07-22 | Tdk株式会社 | Chip component mounting structure and module product using the same |
| JP6237296B2 (en) | 2014-02-07 | 2017-11-29 | 株式会社村田製作所 | Electronic component mounting structure and method of manufacturing the same |
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2020
- 2020-02-27 JP JP2020032327A patent/JP7098670B2/en active Active
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