JP2020161778A - 検査装置及び検査方法 - Google Patents
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Abstract
Description
l(i,j)=l´(i,j)(1−4a)+a(l(i−1,j)+l(i+1,j)+l(i,j−1)+l(i,j+1))・・・(1)
なお、本来であれば、a(l(i−1,j)+l(i+1,j)+l(i,j−1)+l(i,j+1))のlもl´としなければならないが、当該式においては平均化が行われているため、大きな差異はないと考え、計測値であるlを用いている。
l(i,j)=l´(i,j)(1−a−b−c−d)+a(l(i−1,j))+b(l(i+1,j))+c(l(i,j−1))+d(l(i,j+1))・・・(2)
L=Pm×Qn・・・(3)
Claims (10)
- 第1の発光素子及び該第1の発光素子の周辺に配置された第2の発光素子を含む複数の発光素子が形成された対象物を検査する検査装置であって、
前記対象物に照射される励起光を生成する励起光源と、
前記対象物からの蛍光を撮像する撮像部と、
前記撮像部によって撮像された前記第1の発光素子からの蛍光及び前記第2の発光素子からの蛍光に基づいて、前記第1の発光素子からの蛍光の相対輝度を算出し、前記第1の発光素子からの蛍光の絶対輝度及び相対輝度に基づく算出値と所定の閾値とを比較することにより、前記第1の発光素子の良否判定を行う判定部と、を備える検査装置。 - 前記判定部は、前記第1の発光素子からの蛍光の絶対輝度及び相対輝度の積を前記算出値として算出し、該算出値が前記閾値よりも小さい場合に、前記第1の発光素子を不良品と判定する、請求項1記載の検査装置。
- 前記判定部は、前記第1の発光素子からの蛍光の絶対輝度のm乗(mは正の数)及び相対輝度のn乗(nは正の数)の積を前記算出値として算出し、該算出値が前記閾値よりも小さい場合に、前記第1の発光素子を不良品と判定する、請求項1記載の検査装置。
- 前記第1の発光素子からの蛍光について、前記第1の発光素子の周辺に配置された発光素子からの蛍光の影響を考慮した補正を行う補正部を更に備える、請求項1〜3のいずれか一項記載の検査装置。
- 前記判定部は、前記撮像部が撮像した前記対象物の領域のうち、発光素子の縁部を除いた領域から、発光素子からの蛍光を取得する、請求項1〜4のいずれか一項記載の検査装置。
- 第1の発光素子及び該第1の発光素子の周辺に配置された第2の発光素子を含む複数の発光素子が形成された対象物の検査方法であって、
前記対象物に励起光を照射する照射ステップと、
前記対象物からの蛍光を撮像する撮像ステップと、
前記撮像ステップにおいて撮像された前記第1の発光素子からの蛍光及び前記第2の発光素子からの蛍光に基づいて、前記第1の発光素子からの蛍光の相対輝度を算出する相対輝度算出ステップと、
前記第1の発光素子からの蛍光の絶対輝度及び相対輝度に基づく算出値と所定の閾値とを比較することにより、前記第1の発光素子の良否判定を行う判定ステップと、を含む検査方法。 - 前記判定ステップでは、前記第1の発光素子からの蛍光の絶対輝度及び相対輝度の積を前記算出値として算出し、該算出値が前記閾値よりも小さい場合に、前記第1の発光素子を不良品と判定する、請求項6記載の検査方法。
- 前記判定ステップでは、前記第1の発光素子からの蛍光の絶対輝度のm乗(mは正の数)及び相対輝度のn乗(nは正の数)の積を前記算出値として算出し、該算出値が前記閾値よりも小さい場合に、前記第1の発光素子を不良品と判定する、請求項6記載の検査方法。
- 前記撮像ステップの後、且つ、前記相対輝度算出ステップの前において、前記第1の発光素子からの蛍光について、前記第1の発光素子の周辺に配置された発光素子からの蛍光の影響を考慮した補正を行う補正ステップを更に含む、請求項6〜8のいずれか一項記載の検査方法。
- 前記相対輝度算出ステップでは、前記撮像ステップにおいて撮像された前記対象物の領域のうち、発光素子の縁部を除いた領域から、発光素子からの蛍光を取得する、請求項6〜9のいずれか一項記載の検査装置。
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JP2019062983A JP6746744B1 (ja) | 2019-03-28 | 2019-03-28 | 検査装置及び検査方法 |
EP20776717.9A EP3951843A4 (en) | 2019-03-28 | 2020-01-29 | INSPECTION DEVICE AND PROCEDURE |
CN202080025039.2A CN113646878B (zh) | 2019-03-28 | 2020-01-29 | 检查装置及检查方法 |
KR1020217028888A KR20210144682A (ko) | 2019-03-28 | 2020-01-29 | 검사 장치 및 검사 방법 |
US17/441,712 US20220196551A1 (en) | 2019-03-28 | 2020-01-29 | Inspection apparatus and inspection method |
PCT/JP2020/003249 WO2020195137A1 (ja) | 2019-03-28 | 2020-01-29 | 検査装置及び検査方法 |
TW109108723A TWI834843B (zh) | 2019-03-28 | 2020-03-17 | 檢查裝置及檢查方法 |
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WO2022209266A1 (ja) * | 2021-04-01 | 2022-10-06 | 浜松ホトニクス株式会社 | 製造方法、検査方法、及び検査装置 |
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US9638741B2 (en) * | 2011-06-24 | 2017-05-02 | Kla-Tencor Corporation | Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging |
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JP6758197B2 (ja) * | 2015-01-28 | 2020-09-23 | 東レエンジニアリング株式会社 | ワイドギャップ半導体基板の欠陥検査方法及び欠陥検査装置 |
JP2019023801A (ja) * | 2017-07-24 | 2019-02-14 | 日本電信電話株式会社 | 画像認識装置、画像認識方法、及び画像認識プログラム |
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TW202040121A (zh) | 2020-11-01 |
WO2020195137A1 (ja) | 2020-10-01 |
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JP6746744B1 (ja) | 2020-08-26 |
CN113646878B (zh) | 2024-05-17 |
EP3951843A4 (en) | 2022-12-28 |
US20220196551A1 (en) | 2022-06-23 |
KR20210144682A (ko) | 2021-11-30 |
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