JP2020158795A - Cathode plate for metal electro-deposition - Google Patents

Abstract

To provide a cathode plate for metal electro-deposition, which is a cathode plate used for the manufacture of a small lump-shaped electric nickel and can be used repeatedly, in which a non-conductive film on the metal plate does not easily come off.SOLUTION: There is provided a cathode plate 1 for metal electro-deposition, having a metal plate 2 in which a plurality of disc-shaped protrusions 2a are arranged on at least one surface, and a non-conductive film 3 laminated on a portion other than the protrusion 2a on the surface of the metal plate 2. A ring-shaped groove 2d is formed around the circumference of the protrusion 2a on the surface of the metal plate 2.SELECTED DRAWING: Figure 2

Description

The present invention relates to a cathode plate for wearing a metal electric electrode.

Conventionally, electric nickel provided as a nickel-plated anode raw material is put in a titanium basket serving as an anode holder and hung in a nickel-plated tank for use. At this time, as the electrolytic nickel as the anode raw material, a plate-shaped electric nickel electrodeposited on the cathode plate was cut into small pieces.

However, it was difficult to handle the small pieces of electronickel when it was put into the titanium basket because the corners were sharp. In addition, the small pieces of electric nickel are put into the titanium basket, and the corners are caught in the mesh of the titanium basket, causing so-called shelf suspension, and the filling state in the titanium basket changes, which causes uneven plating. It sometimes became.

Therefore, it has been proposed to use nickel in the form of small lumps (buttons) with rounded corners. For small-lump nickel, for example, using a cathode plate in which a plurality of circular conductive portions are arranged at equal intervals, nickel is deposited on the conductive portions by electrolysis, and then nickel electrodeposited from the conductive portions. Can be manufactured by peeling off. According to such a method, a plurality of small-lump nickels can be efficiently produced from one cathode plate.

FIG. 4 is a diagram showing an example of a conventional cathode plate used for producing small-lump nickel electroplating. The cathode plate 11 is masked with a non-conductive portion 13 on a flat metal plate 12 leaving a portion to be a conductive portion 12a. In this cathode plate 11, the conductive portion 12a becomes a recess and is non-conductive. The film 13 is a convex portion. By using such a cathode plate 11, nickel having an appropriate size is electrodeposited on the conductive portion 12a to produce small-lump nickel electroplating.

As a method of forming the non-conductive layer 13 on the metal plate 12 like the cathode plate 11, for example, as shown in FIG. 5A, thermosetting an epoxy resin or the like is performed on the flat metal plate 12. There is a method of forming a non-conductive film 13 having a desired pattern by applying a non-conductive resin of a property by a screen printing method and heating it (see Patent Documents 1 and 2). Note that FIG. 5B shows a state in which nickel (electric nickel) 14 is electrodeposited and deposited on the conductive portion 12a using the cathode plate 11 on which the non-conductive film 13 is formed. In the cathode plate 11, nickel 14 begins to be electrodeposited and deposited from the conductive portion 12a, grows not only in the thickness (longitudinal) direction but also in the planar (horizontal) direction, and rises above the non-conductive film 13. Become.

Further, for example, as shown in FIG. 6A, a photosensitive non-conductive resin is applied onto the metal plate 22, and the non-conductive resin at a portion corresponding to the conductive portion 22a is removed by exposure and development. , A method of forming the non-conductive 23 having a desired pattern has also been proposed. Note that FIG. 6B shows a state in which nickel (electric nickel) 24 is electrodeposited and deposited on the conductive portion 22a using the cathode plate 21 on which the non-conductive film 23 is formed. Also in the cathode plate 21, the nickel 24 begins to be electrodeposited and deposited from the conductive portion 22a, and grows not only in the thickness direction but also in the plane direction.

Further, the cathode plate constituting the non-conductive portion is formed by solidifying the periphery of the metal structure in which a plurality of studs serving as the conductive portions are arranged at equal intervals with an insulating resin by an injection molding method. A manufacturing method has also been proposed (see Patent Document 3).

Special Publication No. 51-036693 Japanese Unexamined Patent Publication No. 52-152832 Special Publication No. 56-029960

When small-lump nickel electroplating is produced using the cathode plate as described above, the life of the non-conductive portion (non-conductive portion) formed on the cathode plate is long, and the non-conductive portion is missing (deteriorated). However, it is required that it can be easily maintained.

As shown in FIG. 5A, when the non-conductive resin is applied to the metal plate 12 by screen printing to form the non-conductive film 13, the film thickness of the non-conductive portion 13 approaches the conductive portion 12a. Therefore, it gradually becomes thinner. Such changes in the film thickness of the non-conductive resin 13 include the amount of the non-conductive resin applied, the viscosity of the non-conductive resin, the temperature characteristics of the viscosity, the curing temperature of the non-conductive resin, and the surface roughness of the metal surface. It depends on surface free energy and so on. Therefore, the film thickness of the non-conductive portion 13 becomes extremely thin at the boundary with the conductive portion 12a.

As described above, when the small-lump nickel is produced by using the conventional cathode plate 11 as shown in FIGS. 4 and 5, the nickel 14 begins to be electrodeposited and deposited from the conductive portion 12a, and the nickel 14 starts to be electrodeposited and deposited not only in the vertical direction but also in the horizontal direction. It also grows in the direction. Therefore, the nickel 14 is gradually raised on the non-conductive film 13. Therefore, in the portion near the boundary between the non-conductive portion 13 and the conductive portion 12a where the non-conductive portion 13 is thin, the adhesion between the non-conductive film 13 and the metal plate 12 tends to decrease due to the permeation of the electrolytic solution, and the nickel 14's electricity is reduced. The non-conductive film 13 is likely to be chipped due to stress at the time of landing, impact at the time of peeling off the electric nickel, and the like. Further, once the non-conductive film 13 is missing, the non-conductive film 13 around the non-conductive film 13 rises from the surface of the metal plate 12, and the electrolytic solution is more likely to enter the gap. As a result, when the nickel is continuously electrodeposited, the electrolytic solution slips into the gap of the non-conductive film 13 raised from the surface of the metal plate 12, and the nickel 14 is electrodeposited. Then, when the nickel 14 that has slipped into the gap and is electrodeposited is to be peeled off, the non-conductive film 13 in which the nickel 14 is bitten is further missing.

As described above, in the conventional cathode plate 11, the non-conductive portion 13 is missing in a chained manner, and as the missing portion expands, the nickels 14 grown from the adjacent conductive portions 12a are easily connected to each other, which is desired. It is not possible to obtain electric nickel in the shape of, and it becomes a defective product. Therefore, before the non-conductive film 13 is missing, it is necessary to peel off all the non-conductive film 13 and form the non-conductive film 3 again to maintain the cathode plate 11. However, in reality, it becomes necessary to maintain the cathode plate 11 at the stage where nickel electrodeposition treatment is performed several times to less than 10 times at most, which not only reduces the productivity but also the maintenance cost. Increase.

On the other hand, as shown in FIG. 6A, in the cathode plate 21 in which the non-conductive film 23 is formed by exposure and development using a photosensitive non-conductive resin, the non-conductive film 23 is formed in a uniform film thickness. can do. However, when the nickel 24 is peeled off after electrodeposition, the nickel 24 is caught in the step of the non-conductive film 23 forming the convex portion, and a large impact is likely to be applied to the non-conductive film 23. Will be missing.

In the method of forming the non-conductive portion by injection molding as in Patent Document 3, although the life of the formed non-conductive portion is extended, the manufacturing cost of the cathode plate itself is high and the non-conductive portion is deteriorated. It is difficult to maintain the cathode plate in the case.

In view of such conventional circumstances, it is an object of the present invention to provide a cathode plate in which a non-conductive film on a metal plate is less likely to be chipped and which can be used repeatedly.

The present inventors have made extensive studies to solve the above-mentioned problems. As a result, a disk-shaped protrusion is provided on the metal plate to form a conductive portion, a non-conductive film is provided on the metal surface other than the protrusion, and a ring-shaped groove is formed around the protrusion, thereby making the metal plate non-conductive. We have found that the film is less likely to come off, and have completed the present invention.

(1) It has a metal plate in which a plurality of disk-shaped protrusions are arranged on at least one surface, and a non-conductive electrode laminated on a portion of the surface of the metal plate other than the protrusions. A metal electrode wearing cathode plate in which a ring-shaped groove is formed around the protrusion on the surface of the metal plate.

(2) The cathode plate for wearing a metal electric electrode according to (1), wherein the height of the protrusion is 50 μm or more and 1000 μm or less.

(3) The cathode plate for metal electrode wear according to (1) or (2), wherein the width of the ring-shaped groove is 200 μm or more and 3000 μm or less, and the depth is 200 μm or more and 1000 μm or less.

(4) The cathode plate for wearing a metal electric electrode according to any one of (1) to (3), wherein the metal plate is made of titanium or stainless steel.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a cathode plate for metal electrode wear that is hard to lose a non-conductive film and can be used repeatedly, and a method for manufacturing the same.

It is a top view which shows the structure of the cathode plate of the metal electric wear of this invention. It is an enlarged sectional view of the main part which shows the structure of the cathode plate of metal electrodeposition of this invention, (a) is the enlarged sectional view of the main part explaining the state of the cathode plate before nickel electrodeposition, and (b) is nickel. It is an enlarged sectional view of the main part explaining the state of the cathode plate after electrodeposition. FIG. 2 is an enlarged cross-sectional view of a main part in which the part A in FIG. 2 is enlarged, and is an enlarged cross-sectional view of the main part for explaining the side shape of the protrusion and the ring-shaped groove of the metal plate. It is an enlarged sectional view of the main part explaining the manufacturing method of the cathode plate of the metal electric wear of this invention, (a) is the enlarged sectional view of the main part explaining the 1st step, (b) explains the 2nd step. It is an enlarged sectional view of a main part. It is a top view which shows the structure of the cathode plate of the conventional metal electric wear. It is an enlarged sectional view of the main part which shows the structure of the cathode plate of the conventional metal electrodeposition, (a) is the enlarged sectional view of the main part which explains the state of the cathode plate before nickel electrodeposition, and (b) is the nickel electrode. It is an enlarged cross-sectional view of the main part explaining the state of the cathode plate after wearing. It is an enlarged sectional view of the main part which shows the other structure of the cathode plate of the conventional metal electrodeposition, (a) is the enlarged sectional view of the main part explaining the state of the cathode plate before nickel electrodeposition, and (b) is It is an enlarged sectional view of the main part explaining the state of the cathode plate after nickel electrodeposition.

Hereinafter, an embodiment in which the cathode plate for metal electroplating of the present invention is applied to the cathode plate for metal electroplating used in the production of electrolytic nickel will be described in detail. The present invention is not limited to the following embodiments, and can be appropriately modified without changing the gist of the present invention.

<Cathode plate for metal electric wear>
[overall structure]
As shown in FIG. 1, the cathode plate 1 that can be manufactured by the manufacturing method of the present invention includes a metal plate 2 in which a plurality of disc-shaped protrusions 2a are arranged, and a protrusion 2a on the surface of the metal plate 2. It has a non-conductive portion 3 formed in a portion other than the above. As will be described later, the cathode plate 1 is used by being suspended by a hanging member 5 in an electrolytic cell containing, for example, an electrolytic solution containing nickel or an anode, and nickel having a desired shape is electrodeposited on the surface thereof. Let me.

[Metal plate]
As shown in FIGS. 1 and 2 (a), the metal plate 2 is a flat metal plate, and has a plurality of disk-shaped protrusions 2a and a ring-shaped groove 2d.

Here, a portion of the surface of the metal plate 2 other than the protrusion 2a and the ring-shaped groove 2d is referred to as a "flat portion 2b" with respect to the protrusion 2a and the ring-shaped groove 2d. Further, the height X of the disk-shaped protrusion is the height of protrusion from the surface of the flat portion 2b of the metal plate 2 (see FIG. 3). Further, the "depth Y of the ring-shaped groove portion" is the depth from the surface of the flat portion 2b of the metal plate 2. (See Fig. 3)

Although FIG. 2 shows an example in which the protrusion 2a is provided on one surface of the metal plate 2, the protrusion 2a may be provided on both surfaces.

The size of the metal plate 2 is not particularly limited, and may be appropriately set according to a desired size and number of nickel electroplating to be produced. For example, it can be a rectangular size having a side of 100 mm or more and 2000 mm or less. Further, the thickness of the metal plate 2 is preferably about 1.5 mm or more and 5 mm or less when the protrusion 2a is provided on one surface, and when the protrusion 2a is provided on both surfaces. Is preferably, for example, about 3 mm or more and 10 mm or less. If the thickness of the metal plate 2 is too small, the protrusion 2a and the flat portion 2b tend to warp easily. On the other hand, if the thickness of the metal plate 2 is excessive, the weight of the metal plate 2 increases and handling becomes difficult.

The material of the metal plate 2 is not particularly limited as long as it is a metal that is less corroded by the electrolytic solution used and forms only loose adhesion with an electrodeposited material such as nickel, but titanium and stainless steel are preferable.

In the metal plate 2, the surface of the plurality of disc-shaped protrusions 2a is exposed from the non-conductive portion 3 described later to function as a conductive portion, and the non-conductive portion 3 is formed with a predetermined thickness. Therefore, a concave step is formed by the adjacent protrusions 2a. Hereinafter, the surface of the protruding portion 2a exposed from the non-conductive portion 3 may be referred to as a “conductive portion 2c”. In the conductive portion 2c, nickel 4 is electrodeposited and deposited by electrolytic treatment.

The size of the disk-shaped protrusion 2a may be appropriately set according to the desired size of the nickel electroplating, and the diameter thereof can be, for example, 5 mm or more and 30 mm or less. The height X of the protrusion 2a is preferably 50 μm or more and 1000 μm or less, and more preferably 200 μm or more and 800 μm or less. If the height X of the protrusion 2a is too small, the film thickness of the non-conductive film 3 formed on the flat portion 2b of the metal plate 2 becomes insufficient, and the stress at the time of electrodeposition of nickel 4 and the electrolytic nickel thereof become insufficient. It is easy to come off due to the impact at the time of peeling.

On the other hand, if the height X of the protrusion 2a is excessive, for example, when forming a non-conductive film by screen printing, the number of coatings increases and the productivity decreases. Further, when the protrusion 2a and the ring-shaped groove 2d are processed, the metal plate 2 is likely to be distorted, and the metal plate 2 is likely to warp, which makes it difficult to form the non-conductive film 3. It is possible to increase the thickness of the metal plate 2 in order to reduce the influence of the distortion of the metal plate 2, but the weight of the metal plate 2 increases and handling becomes difficult.

By forming a ring-shaped groove 2d around the protrusion 2a of the metal plate 2 constituting the cathode plate 1, the contact area between the non-conductive film 3 and the metal plate 2 is increased, and the shape effect as an anchor is exhibited. However, the adhesion between the two is improved. The width W of the ring-shaped groove portion 2d is preferably 200 μm or more and 3000 μm or less, and more preferably 300 μm or more and 2000 μm or less. When this width W is smaller than 200 μm, when the resin for the non-conductive film is applied, air does not escape and it becomes difficult to fill the groove with the resin. On the other hand, even if it is made larger than 3000 μm, further improvement in the shape effect as an anchor cannot be expected. The depth Y of the ring-shaped groove is preferably 200 μm or more and 1000 μm or less. If the depth Y of the ring-shaped groove 2d is too small, the effect of improving the adhesion is reduced. Further, if the depth is 1000 μm at the maximum, the effect of improving the adhesion is sufficient, and if it is excessive, it becomes difficult to fill the resin when applying the resin that becomes the non-conductive film, and the non-conductive film is formed. When removing the resin as it deteriorates, the removal work becomes difficult, and a problem that a part of the deteriorated resin remains tends to occur.

Further, the surface of the metal plate 2, that is, the surface of the disk-shaped protrusion 2a on the metal plate 2 may be provided with fine irregularities by sandblasting or etching. As a result, the nickel 4 electrodeposited on the protrusion 2a can be peeled off with an appropriate impact without falling off during the electrolytic treatment. In this case, the film thickness of the non-conductive film 3 described later is preferably twice or more the maximum surface roughness Rz of the metal plate 2. If the film thickness of the non-conductive film 3 is smaller than twice the maximum surface roughness Rz of the metal plate 2, there is a concern that pinholes and defective insulation portions of the non-conductive film 3 may occur.

[Non-conductive]
As shown in FIG. 2, the non-conductive film 3 is formed on the surface of the metal plate 2 in such a manner that the flat portion 2b and the ring-shaped groove portion 2d, which are portions other than the protrusion 2a, are covered and laminated. As a result, the surface of the plurality of protrusions 2a arranged on the metal plate 2, that is, the conductive portion 2c is exposed. Then, the nickel 4 is electrodeposited and deposited on the conductive portion 2c of the metal plate 2, so that the nickel 4 is individually divided into small lumps and formed.

Here, in the cathode plate 1, since the non-conductive film 3 is formed on the flat portion 2b having the concave step formed by the adjacent protrusions 2a, it is formed with a predetermined thickness. Become.

The non-conductive film 3 is formed on a flat portion 2b having a concave step formed by adjacent protrusions 2a. Therefore, unlike the conventional non-conductive film 13 shown in FIG. 5, the non-conductive film 3 is unlikely to have a thin film thickness at the end, and the stress at the time of electrodeposition of nickel 4 and the impact at the time of peeling after electrodeposition are applied. It also becomes difficult to drop. Further, unlike the conventional non-conductive film 23 shown in FIG. 6, the non-conductive film 3 does not protrude in a convex shape, and its end portion is protected by a concave step. Therefore, even when the nickel 4 is peeled off from the cathode plate 1, the impact of the nickel 4 on the end portion of the non-conductive film 3 is small, and the non-conductive film 3 is unlikely to be removed. As described above, in the cathode plate 1, since the non-conductive film 3 is unlikely to be missing, it can be used for repeated electrodeposition without replacing the non-conductive film 3, reducing maintenance costs and productivity. It is possible to improve.

When the non-conductive portion 3 is formed on the flat portion 2b and the ring-shaped groove portion 2d on the metal plate 2 by the screen printing method, the material of the non-conductive portion 3 is also applied to the surface of the protrusion 2a to form the conductive portion. The surface area of 2c may decrease and the initial current density may increase, but there is no problem as long as the characteristics of the electrodeposited nickel 4 do not deteriorate. Further, the non-conductive film 3 adhering to the surface of the protrusion 2a is easily chipped because the film thickness is very thin, but the non-conductive film 3 formed on the flat portion 2b has a large film thickness and the chipping is suppressed. There is no problem because it is done.

The non-conductive material forming the non-conductive material 3 is not particularly limited as long as it is made of a material that is less corroded by the electrolytic solution used. For example, from the viewpoint of easy film formation, it is preferably composed of a thermosetting resin or a photocurable (ultraviolet curable or the like) resin. Specific examples thereof include insulating resins such as epoxy resins, phenol resins, polyamide resins, and polyimide resins.

[Manufacturing of nickel electroplating using a cathode plate worn by metal electric appliances]
In the cathode plate 1 having the above-described configuration, as shown in FIG. 2B, the surface of the protrusion 2a exposed from the non-conductive film 3 becomes the conductive portion 2c, and nickel 4 is electrodeposited and deposited. In the cathode plate 1, the nickel 4 grows not only in the thickness direction but also in the plane direction, so that the nickel 4 is in a raised state on the upper part of the non-conductive film 3. For this reason, it is preferable to end electrodeposition before the nickels 4 grown from the conductive portions 2c on the surface of the adjacent protrusions 2a come into contact with each other.

Then, after the electrodeposition of nickel is completed, the nickel 4 is peeled off from the cathode plate 1, so that a plurality of small lumps of electric nickel can be obtained from one cathode plate 1. As described above, since the non-conductive film 3 is unlikely to be removed from the cathode plate 1, it can be used repeatedly without replacing the non-conductive film 3, reducing maintenance costs and improving productivity. Can be done.

The cathode plate 1 is electrodeposited with nickel 4, but is not limited to nickel, and silver, gold, zinc, tin, chromium, cobalt, or alloys thereof may be electrodeposited.

<Manufacturing method of cathode plate for metal electric wear>
As shown in FIG. 4, the method for manufacturing a cathode plate for wearing a metal electric electrode of the present invention is a first step of forming a plurality of disk-shaped protrusions 2a and ring-shaped grooves 2d on at least one surface of the metal plate 2. FIG. 4A) and a second step (FIG. 4B) of forming the non-conductive film 3 on a portion of the surface of the metal plate 2 other than the protrusion 2a.

[First step]
In the first step, a plurality of disk-shaped protrusions 2a and ring-shaped groove 2d are formed on the surface of the metal plate 2. For example, with respect to the flat metal plate 2, the portion other than the protrusion 2a is shaved to leave the protrusion 2a having a height X, and a flat portion 2b and a ring-shaped groove 2d having a depth Y are formed. .. The processing method is not particularly limited, and for example, wet etching processing, end mill processing, laser processing, or the like, or a combination of each of these processing methods can be used.

For example, when a flat plate-shaped stainless steel plate is processed by wet etching, a photosensitive etching resist is applied to the surface of the stainless steel plate, and then exposed through a film or glass on which a desired pattern is drawn and etched. Etching resist is removed by development treatment. Then, the developed stainless steel sheet is soaked in an etching solution (for example, ferric chloride solution), a part of the stainless steel sheet from which the etching resist has been removed is removed, and finally the etching resist is peeled off to obtain a desired effect. A plurality of protrusions 2a corresponding to the pattern can be formed.

Then, after the protrusion 2a is formed, a ring-shaped groove can be formed on the flat portion 2b by end milling or laser processing. Further, a disk-shaped protrusion 2a, a flat portion 2b, and a ring-shaped groove portion 2d can be formed only by end milling, but if the vertical and horizontal dimensions of the stainless steel sheet become excessive with respect to the thickness, stainless steel due to processing strain. The steel plate may warp. In such a case, it is preferable to combine wet etching processing and end mill processing.

The protrusion 2a and the ring-shaped groove 2d may be formed on only one surface of the metal plate 2, or may be formed on both surfaces of the metal plate 2.

[Second step]
In the second step, the non-conductive film 3 is formed by covering the flat portion 2b and the ring-shaped groove portion 2d, which are portions other than the protrusion 2a on the surface of the metal plate 2. The method for forming the non-conductive film 3 is not particularly limited. For example, it can be performed by known screen printing. When the material of the non-conductive film 3 is a thermosetting resin or a photocurable resin, the non-conductive material 3 may be thermoset or photocured as necessary.

According to the above manufacturing method, the cathode plate 1 that can be used repeatedly can be obtained by the simple method described above because the non-conductive film on the metal plate is less likely to be lost.

Hereinafter, examples of the present invention will be shown and more specifically described. However, the present invention is not limited to these examples. For convenience, the members having the same functions as the members shown in FIGS. 1 to 6 will be described with the same reference numerals. In the following Examples and Comparative Examples, the method for producing the cathode plate was different, and nickel was produced under the same conditions except for the method for producing each cathode plate, and evaluated by the same method.

<Making a cathode plate for metal electric wear>
[Example 1]
The cathode plate 1 as shown in FIGS. 1 and 2 was produced. Specifically, first, a metal plate 2 made of stainless steel of 200 mm × 100 mm × 4 mm is subjected to wet etching to form disk-shaped protrusions 2a (18 pieces), and 1 is formed around each protrusion by an end mill. The ring-shaped groove 2d was formed. At this time, the size of the disk-shaped protrusion 2a was 14 mm in diameter and X500 μm in height, the width W of the ring-shaped groove was 1000 μm, and the depth Y was 300 μm.

Next, a thermosetting resin (curing start temperature 115 ° C. to 120 ° C.) using an epoxy resin as a base resin is applied onto the flat portion 2b and the ring-shaped groove portion 2d on the surface of the metal plate 2, and the temperature is 150 ° C. for 60 minutes. The non-conductive film 3 was formed by curing by heating.

[Example 2]
The cathode plate 1 was produced under the same conditions as in Example 1 except that the height X of the protrusion 2a of the metal plate 2 was 1000 μm and the width of the ring-shaped groove 2d was 3000 μm.

[Comparative Example 1]
In Comparative Example 1, a conventional cathode plate 11 as shown in FIGS. 5 and 6 was produced. Specifically, it was used in Example 1 by a screen printing method, leaving conductive portions 12a (18 pieces) having a diameter of 14 mm on a flat metal plate 12 made of stainless steel having a diameter of 200 mm × 100 mm × 4 mm. The same type of epoxy resin as above was applied and cured by heating at 150 ° C. for 60 minutes to form a non-conductive film 13 to prepare a cathode plate 11. In the cathode plate 11 of Comparative Example 1, the film thickness of the non-conductive film 13 was measured at arbitrary 10 locations by a laser displacement meter and found to be in the range of 90 to 110 μm.

[Comparative Example 2]
The cathode plate 1 was produced under the same conditions as in Example 1 except that the ring-shaped groove 2d was not formed on the metal plate 2.

<Manufacturing of nickel electroplating>
Nickel electroplating was produced by electrolytic treatment using each cathode plate having different production conditions, which was produced in each Example and Comparative Example. Specifically, a cathode plate and an anode plate made of electric nickel having a size of 200 mm × 100 mm × 10 mm were immersed in an electrolytic cell containing a nickel chloride electrolytic solution so as to face each other. Then, nickel was electrodeposited on the surface of the cathode plate under the conditions of an initial current density of 710 A / m ² and an electrolysis time of 3 days. After electrolysis, the electronickel deposited on the cathode plate was stripped off to obtain a small lump of nickel for plating.

<Evaluation>
The number of times the cathode plate used for the electrolytic treatment can be used repeatedly as it is was evaluated. If the lack of the non-conductive film spreads, nickel electrodeposited at adjacent protrusions and conductive portions may be connected to each other, and an electronickel having a desired shape may not be obtained. Therefore, when the non-conductive film was missing over 1 mm or more in the flat portion direction from the boundary with the disk-shaped protrusion, the use was stopped and the number of repetitions up to that point was evaluated. Further, even when the non-conductive film was missing and the diameter of the conductive portion was expanded by 1 mm or more, the use was stopped and the number of repetitions up to this point was evaluated. Table 1 below shows the evaluation results together with the configuration of the cathode plate.

As shown in Table 1, in Examples 1 and 2 in which the ring-shaped groove was formed around the protrusion, the loss of the non-conductive film 3 was sufficiently suppressed, and there was a clear advantage in the number of repeatable uses. It was confirmed that sex was expressed.

From the above, it was confirmed that the cathode plate for wearing a metal electric electrode of the present invention has an advantageous effect on the conventional cathode plate.

1 Cathode plate 2 Metal plate 2a Projection part 2b Flat part 2c Conductive part 2d Ring-shaped groove part 3 Non-conductive part 4 Nickel

Claims (4)

A metal plate in which a plurality of disc-shaped protrusions are arranged on at least one surface, and
It has a non-conductive film laminated on a portion other than the protrusion on the surface of the metal plate.
A ring-shaped groove is formed around the protrusion on the surface of the metal plate.
Cathode plate for metal electric wear. The height of the protrusion is 50 μm or more and 1000 μm or less.
The cathode plate for wearing a metal electric appliance according to claim 1. The width of the ring-shaped groove is 200 μm or more and 3000 μm or less, and the depth is 200 μm or more and 1000 μm or less.
The cathode plate for wearing a metal electric electrode according to claim 1 or 2. The metal plate is made of titanium or stainless steel.
The cathode plate for wearing a metal electric electrode according to any one of claims 1 to 3.

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