JP2020158793A - Method for manufacturing cathode plate for metal electro-deposition - Google Patents

Abstract

To provide a cathode plate for metal electro-deposition in which a non-conductive film on the metal plate does not easily come off, and that can be used repeatedly.SOLUTION: There is provided a method for manufacturing a cathode plate for metal electro-deposition, including the steps of forming a plurality of disc-shaped protrusions 2a on at least one surface of the metal plate 2, and forming a non-conductive film 3 on a portion of the surface of the metal plate 2 other than the protrusion 2a. The non-conductive resin 3 is a thermosetting resin, and, in the step of forming the non-conductive film 3, the thermosetting resin is applied by a dispenser 5.SELECTED DRAWING: Figure 3

Description

The present invention relates to a method for manufacturing a cathode plate for wearing a metal electric electrode.

Conventionally, electric nickel provided as a nickel-plated anode raw material is put in a titanium basket serving as an anode holder and hung in a nickel-plated tank for use. At this time, as the electrolytic nickel as the anode raw material, a plate-shaped electric nickel electrodeposited on the cathode plate was cut into small pieces.

However, it was difficult to handle the small pieces of electronickel when it was put into the titanium basket because the corners were sharp. In addition, the small pieces of electric nickel are put into the titanium basket, and the corners are caught in the mesh of the titanium basket, causing so-called shelf suspension, and the filling state in the titanium basket changes, which causes uneven plating. It sometimes became.

Therefore, it has been proposed to use nickel in the form of small lumps (buttons) with rounded corners. For small-lump nickel, for example, using a cathode plate in which a plurality of circular conductive portions are arranged at equal intervals, nickel is deposited on the conductive portions by electrolysis, and then nickel electrodeposited from the conductive portions. Can be manufactured by peeling off. According to such a method, a plurality of small-lump nickels can be efficiently produced from one cathode plate.

FIG. 4 is a diagram showing an example of a conventional cathode plate used for producing small-lump nickel electroplating. The cathode plate 11 is masked with a non-conductive portion 13 on a flat metal plate 12 leaving a portion to be a conductive portion 12a. In this cathode plate 11, the conductive portion 12a becomes a recess and is non-conductive. The film 13 is a convex portion. By using such a cathode plate 11, nickel having an appropriate size is electrodeposited on the conductive portion 12a to produce small-lump nickel electroplating.

As a method of forming the non-conductive layer 13 on the metal plate 12 like the cathode plate 11, for example, as shown in FIG. 5A, thermosetting an epoxy resin or the like is performed on the flat metal plate 12. There is a method of forming a non-conductive film 13 having a desired pattern by applying a non-conductive resin of a property by a screen printing method and heating it (see Patent Documents 1 and 2). Note that FIG. 5B shows a state in which nickel (electric nickel) 14 is electrodeposited and deposited on the conductive portion 12a using the cathode plate 11 on which the non-conductive film 13 is formed. In the cathode plate 11, nickel 14 begins to be electrodeposited and deposited from the conductive portion 12a, grows not only in the thickness (longitudinal) direction but also in the planar (horizontal) direction, and rises above the non-conductive film 13. Become.

Further, for example, as shown in FIG. 6A, a photosensitive non-conductive resin is applied onto the metal plate 22, and the non-conductive resin at a portion corresponding to the conductive portion 22a is removed by exposure and development. , A method of forming the non-conductive 23 having a desired pattern has also been proposed. Note that FIG. 6B shows a state in which nickel (electric nickel) 24 is electrodeposited and deposited on the conductive portion 22a using the cathode plate 21 on which the non-conductive film 23 is formed. Also in the cathode plate 21, the nickel 24 begins to be electrodeposited and deposited from the conductive portion 22a, and grows not only in the thickness direction but also in the plane direction.

Further, the cathode plate constituting the non-conductive portion is formed by solidifying the periphery of the metal structure in which a plurality of studs serving as the conductive portions are arranged at equal intervals with an insulating resin by an injection molding method. A manufacturing method has also been proposed (see Patent Document 3).

Special Publication No. 51-036693 Japanese Unexamined Patent Publication No. 52-152832 Special Publication No. 56-029960

When small-lump nickel electroplating is produced using the cathode plate as described above, the life of the non-conductive portion (non-conductive portion) formed on the cathode plate is long, and the non-conductive portion is missing (deteriorated). However, it is required that it can be easily maintained.

As shown in FIG. 5A, when the non-conductive resin is applied to the metal plate 12 by screen printing to form the non-conductive film 13, the film thickness of the non-conductive portion 13 approaches the conductive portion 12a. Therefore, it gradually becomes thinner. Such changes in the film thickness of the non-conductive resin 13 include the amount of the non-conductive resin applied, the viscosity of the non-conductive resin, the temperature characteristics of the viscosity, the curing temperature of the non-conductive resin, and the surface roughness of the metal surface. It depends on surface free energy and so on. Therefore, the film thickness of the non-conductive portion 13 becomes extremely thin at the boundary with the conductive portion 12a.

As described above, when the small-lump nickel is produced by using the conventional cathode plate 11 as shown in FIGS. 4 and 5, the nickel 14 begins to be electrodeposited and deposited from the conductive portion 12a, and the nickel 14 starts to be electrodeposited and deposited not only in the vertical direction but also in the horizontal direction. It also grows in the direction. Therefore, the nickel 14 is gradually raised on the non-conductive film 13. Therefore, in the portion near the boundary between the non-conductive portion 13 and the conductive portion 12a where the non-conductive portion 13 is thin, the adhesion between the non-conductive film 13 and the metal plate 12 tends to decrease due to the permeation of the electrolytic solution, and the nickel 14's electricity is reduced. The non-conductive film 13 is likely to be chipped due to stress at the time of landing, impact at the time of peeling off the electric nickel, and the like. Further, once the non-conductive film 13 is missing, the non-conductive film 13 around the non-conductive film 13 rises from the surface of the metal plate 12, and the electrolytic solution is more likely to enter the gap. As a result, when the nickel is continuously electrodeposited, the electrolytic solution slips into the gap of the non-conductive film 13 raised from the surface of the metal plate 12, and the nickel 14 is electrodeposited. Then, when the nickel 14 that has slipped into the gap and is electrodeposited is to be peeled off, the non-conductive film 13 in which the nickel 14 is bitten is further missing.

As described above, in the conventional cathode plate 11, the non-conductive portion 13 is missing in a chained manner, and as the missing portion expands, the nickels 14 grown from the adjacent conductive portions 12a are easily connected to each other, which is desired. It is not possible to obtain electric nickel in the shape of, and it becomes a defective product. Therefore, before the non-conductive film 13 is missing, it is necessary to peel off all the non-conductive film 13 and form the non-conductive film 3 again to maintain the cathode plate 11. However, in reality, it becomes necessary to maintain the cathode plate 11 at the stage where nickel electrodeposition treatment is performed several times to less than 10 times at most, which not only reduces the productivity but also the maintenance cost. Increase.

On the other hand, as shown in FIG. 6A, in the cathode plate 21 in which the non-conductive film 23 is formed by exposure and development using a photosensitive non-conductive resin, the non-conductive film 23 is formed in a uniform film thickness. can do. However, when the nickel 24 is peeled off after electrodeposition, the nickel 24 is caught in the step of the non-conductive film 23 forming the convex portion, and a large impact is likely to be applied to the non-conductive film 23. Will be missing.

In the method of forming the non-conductive portion by injection molding as in Patent Document 3, although the life of the formed non-conductive portion is extended, the manufacturing cost of the cathode plate itself is high and the non-conductive portion is deteriorated. It is difficult to maintain the cathode plate in the case.

In view of such conventional circumstances, it is an object of the present invention to provide a cathode plate in which a non-conductive film on a metal plate is less likely to be chipped and which can be used repeatedly.

The present inventors have made extensive studies to solve the above-mentioned problems. As a result, the non-conductive portion is formed by providing a protrusion on the metal plate to form a conductive portion and forming a non-conductive portion by a manufacturing method in which a thermosetting resin is applied to a portion other than the protrusion on the surface of the metal plate with a dispenser. We have found that it is possible to manufacture a cathode plate worn with a metal electric wire that is hard to be chipped, and have completed the present invention.

(1) A method for manufacturing a cathode plate for wearing a metal electric wire, in which a step of forming a plurality of disk-shaped protrusions on at least one surface of the metal plate and a portion other than the protrusions on the surface of the metal plate. It has a step of forming a non-conductive film, and the non-conductive resin is a thermosetting resin, and in the step of forming the non-conductive resin, the thermosetting resin is applied by a dispenser. A method for manufacturing a characteristic metal electrode wearing cathode plate.

(2) The thermosetting resin is applied to the metal plate in a state where the metal plate is heated to a temperature range of 30 ° C. or higher and 20 ° C. or higher lower than the curing temperature of the thermosetting resin. The method for manufacturing a cathode plate for wearing a metal electric electrode according to 1).

(3) The method for manufacturing a cathode plate for wearing a metal electric electrode according to (1) or (2), wherein the metal plate is made of titanium or stainless steel.

According to the present invention, it is possible to provide a cathode plate in which a non-conductive film is not easily removed and can be used repeatedly.

It is a top view which shows the structure of the cathode plate of metal electric wear which concerns on this invention. It is an enlarged sectional view of the main part which shows the structure of the cathode plate of metal electrodeposition which concerns on this invention, (a) is the enlarged sectional view of the main part which explains the state of the cathode plate before nickel electrodeposition, and (b) is It is an enlarged sectional view of the main part explaining the state of the cathode plate after nickel electrodeposition. It is an enlarged sectional view of the main part explaining the manufacturing method of the cathode plate of the metal electric wear of this invention, (a) is the enlarged sectional view of the main part explaining the 1st step, (b) explains the 2nd step. It is an enlarged sectional view of a main part. It is a top view which shows the structure of the cathode plate of the conventional metal electric wear. It is an enlarged sectional view of the main part which shows the structure of the cathode plate of the conventional metal electrodeposition, (a) is the enlarged sectional view of the main part which explains the state of the cathode plate before nickel electrodeposition, and (b) is the nickel electrode. It is an enlarged cross-sectional view of the main part explaining the state of the cathode plate after wearing. It is an enlarged cross-sectional view of the main part which shows the structure of the cathode plate and the like of the conventional metal electrodeposition, (a) is the enlarged sectional view of the main part explaining the state of the cathode plate before nickel electrodeposition, and (b) is nickel. It is an enlarged sectional view of the main part explaining the state of the cathode plate after electrodeposition.

Hereinafter, the method for manufacturing the cathode plate for wearing a metal electric electrode of the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be appropriately modified without changing the gist of the present invention.

<Cathode plate for metal electric wear>
[overall structure]
As shown in FIG. 1, the cathode plate 1 that can be manufactured by the manufacturing method of the present invention includes a metal plate 2 in which a plurality of disc-shaped protrusions 2a are arranged, and a protrusion 2a on the surface of the metal plate 2. It has a non-conductive portion 3 formed in a portion other than the above. As will be described later, the cathode plate 1 is used by being suspended by a hanging member 5 in an electrolytic cell containing, for example, an electrolytic solution containing nickel or an anode, and nickel having a desired shape is electrodeposited on the surface thereof. Let me.

[Metal plate]
As shown in FIGS. 1 and 2A, the metal plate 2 is a flat metal plate and has a plurality of disc-shaped protrusions 2a. Here, the portion of the surface of the metal plate 2 other than the protrusion 2a is referred to as a "flat portion 2b" with respect to the protrusion 2a. Further, the height X of the disk-shaped protrusion is the height of protrusion from the surface of the flat portion 2b of the metal plate 2. Further, the height X of the disk-shaped protrusion is the height of protrusion from the surface of the flat portion 2b of the metal plate 2.

Although FIG. 2 shows an example in which the protrusion 2a is provided on one surface of the metal plate 2, the protrusion 2a may be provided on both surfaces.

The size of the metal plate 2 is not particularly limited, and may be appropriately set according to a desired size and number of nickel electroplating to be produced. For example, it can be a rectangular size having a side of 100 mm or more and 2000 mm or less. Further, the thickness of the metal plate 2 is preferably about 1.5 mm or more and 5 mm or less when the protrusion 2a is provided on one surface, and when the protrusion 2a is provided on both surfaces. Is preferably, for example, about 3 mm or more and 10 mm or less. If the thickness of the metal plate 2 is too small, the protrusion 2a and the flat portion 2b tend to warp easily. On the other hand, if the thickness of the metal plate 2 is excessive, the weight of the metal plate 2 increases and handling becomes difficult.

The material of the metal plate 2 is not particularly limited as long as it is a metal that is less corroded by the electrolytic solution used and forms only loose adhesion with an electrodeposited material such as nickel, but titanium and stainless steel are preferable.

In the metal plate 2, the surface of the plurality of disc-shaped protrusions 2a is exposed from the non-conductive portion 3 described later to function as a conductive portion, and the non-conductive portion 3 is formed with a predetermined thickness. Therefore, a concave step is formed by the adjacent protrusions 2a. Hereinafter, the surface of the protruding portion 2a exposed from the non-conductive portion 3 may be referred to as a “conductive portion 2c”. In the conductive portion 2c, nickel 4 is electrodeposited and deposited by electrolytic treatment.

The size of the disk-shaped protrusion 2a may be appropriately set according to the desired size of the nickel electroplating, and the diameter thereof can be, for example, 5 mm or more and 30 mm or less. The height X of the protrusion 2a is preferably 50 μm or more and 1000 μm or less, and more preferably 200 μm or more and 800 μm or less. If the height X of the protrusion 2a is too small, the film thickness of the non-conductive film 3 formed on the flat portion 2b of the metal plate 2 becomes insufficient, and the stress at the time of electrodeposition of nickel 4 and the electrolytic nickel thereof become insufficient. It is easy to come off due to the impact at the time of peeling.

On the other hand, if the height X of the protrusion 2a is excessive, the metal plate 2 is likely to be distorted during processing of the protrusion 2a, and the metal plate 2 is likely to warp, which makes it difficult to form the non-conductive film 3. .. It is possible to increase the thickness of the metal plate 2 in order to reduce the influence of the distortion of the metal plate 2, but the weight of the metal plate 2 increases and handling becomes difficult.

Further, the surface of the metal plate 2, that is, the surface of the disk-shaped protrusion 2a on the metal plate 2 may be provided with fine irregularities by sandblasting or etching. As a result, the nickel 4 electrodeposited on the protrusion 2a can be peeled off with an appropriate impact without falling off during the electrolytic treatment. In this case, the film thickness of the non-conductive film 3 described later is preferably twice or more the maximum surface roughness Rz of the metal plate 2. If the film thickness of the non-conductive film 3 is smaller than twice the maximum surface roughness Rz of the metal plate 2, there is a concern that pinholes and defective insulation portions of the non-conductive film 3 may occur.

[Non-conductive]
As shown in FIG. 2, the non-conductive film 3 is formed on the flat portion 2b, which is a portion other than the protrusion 2a, on the surface of the metal plate 2. As a result, the surface of the plurality of protrusions 2a arranged on the metal plate 2, that is, the conductive portion 2c is exposed. Then, the nickel 4 is electrodeposited and deposited on the conductive portion 2c of the metal plate 2, so that the nickel 4 is individually divided into small lumps and formed.

Here, in the cathode plate 1, since the non-conductive film 3 is formed on the flat portion 2b having the concave step formed by the adjacent protrusions 2a, it is formed with a predetermined thickness. Become.

The non-conductive film 3 is formed on a flat portion 2b having a concave step formed by adjacent protrusions 2a. Therefore, unlike the conventional non-conductive film 13 shown in FIG. 5, the non-conductive film 3 is unlikely to have a thin film thickness at the end, and the stress at the time of electrodeposition of nickel 4 and the impact at the time of peeling after electrodeposition are applied. It also becomes difficult to drop. Further, unlike the conventional non-conductive film 23 shown in FIG. 6, the non-conductive film 3 does not protrude in a convex shape, and its end portion is protected by a concave step. Therefore, even when the nickel 4 is peeled off from the cathode plate 1, the impact of the nickel 4 on the end portion of the non-conductive film 3 is small, and the non-conductive film 3 is unlikely to be removed. As described above, in the cathode plate 1, since the non-conductive film 3 is unlikely to be missing, it can be used for repeated electrodeposition without replacing the non-conductive film 3, reducing maintenance costs and productivity. It is possible to improve.

The non-conductive material forming the non-conductive material 3 is preferably a thermosetting resin. Specific examples thereof include insulating resins such as epoxy resins, phenol resins, polyamide resins, and polyimide resins.

[Manufacturing of nickel electroplating using a cathode plate worn by metal electric appliances]
In the cathode plate 1 having the above-described configuration, as shown in FIG. 2B, the surface of the protrusion 2a exposed from the non-conductive film 3 becomes the conductive portion 2c, and nickel 4 is electrodeposited and deposited. In the cathode plate 1, the nickel 4 grows not only in the thickness direction but also in the plane direction, so that the nickel 4 is in a raised state on the upper part of the non-conductive film 3. For this reason, it is preferable to end electrodeposition before the nickels 4 grown from the conductive portions 2c on the surface of the adjacent protrusions 2a come into contact with each other.

Then, after the electrodeposition of nickel is completed, the nickel 4 is peeled off from the cathode plate 1, so that a plurality of small lumps of electric nickel can be obtained from one cathode plate 1. As described above, since the non-conductive film 3 is unlikely to be removed from the cathode plate 1, it can be used repeatedly without replacing the non-conductive film 3, reducing maintenance costs and improving productivity. Can be done.

The cathode plate 1 is electrodeposited with nickel 4, but is not limited to nickel, and silver, gold, zinc, tin, chromium, cobalt, or alloys thereof may be electrodeposited.

<Manufacturing method of cathode plate for metal electric wear>
As shown in FIG. 3, the method for manufacturing a metal electrode-worn cathode plate of the present invention is a first step of forming a plurality of disk-shaped protrusions 2a on at least one surface of the metal plate 2 (FIG. 3A). ), And a second step (FIG. 3B) of forming the non-conductive film 3 on a portion of the surface of the metal plate 2 other than the protrusion 2a.

[First step]
In the first step, a plurality of disc-shaped protrusions 2a are formed on the surface of the metal plate 2. For example, the flat portion 2b is formed by scraping a portion other than the protrusion 2a on the flat metal plate 2 to leave the protrusion 2a having a height X. The processing method is not particularly limited, and for example, wet etching processing, end mill processing, laser processing, or the like, or a combination of each of these processing methods can be used.

For example, when a flat plate-shaped stainless steel plate is processed by wet etching, a photosensitive etching resist is applied to the surface of the stainless steel plate, and then exposed through a film or glass on which a desired pattern is drawn and etched. Etching resist is removed by development treatment. Then, the developed stainless steel sheet is soaked in an etching solution (for example, ferric chloride solution), a part of the stainless steel sheet from which the etching resist has been removed is removed, and finally the etching resist is peeled off to obtain a desired effect. A plurality of disc-shaped protrusions 2a corresponding to the pattern can be formed.

The protrusion 2a may be formed on only one surface of the metal plate 2, or may be formed on both surfaces of the metal plate 2.

[Second step]
In the second step, the non-conductive film 3 is formed on the flat portion 2b that is a portion other than the disk-shaped protrusion 2a on the surface of the metal plate 2. The non-conductive film 3 is formed by a method of applying a thermosetting resin by a dispenser 5 (see FIG. 3B). In the present invention, various known dispensers capable of quantitatively supplying a liquid material can be appropriately selected and used.

When applying the thermosetting resin by the dispenser 5, the application amount is controlled by the temperature, the air pressure for protrusion, the nozzle diameter, the moving speed of the syringe, the number of times of application, and the like.

Regarding the application of this thermosetting resin, after applying a predetermined amount of resin, the temperature of the thermosetting resin is maintained in an appropriate temperature range of 30 ° C. or higher and 20 ° C. or higher lower than the curing temperature. It is preferable to go through a temporary heat retention procedure. Specifically, the thermosetting resin may be applied while the metal plate 2 is heated to a temperature within the above range.

By undergoing the above-mentioned temporary heat retention procedure by heating the metal plate 2 to a temperature within the above range, the viscosity of the thermosetting resin is lowered, and the resin is applied to the outer edge portion of the disk-shaped protrusion 2a. Even if the coating cannot be completely applied, the resin can be completely poured over the entire non-conductive film forming region. Further, by forming the non-conductive film 3 through such a procedure, it is not always necessary to accurately apply the non-conductive film 3 to the portion of the disc-shaped protrusion 2a, but the thickness is not uniform in every corner. The conductive film 3 can be formed.

If the resin has a low viscosity even at room temperature, the thermosetting resin can be poured even if the temperature of the metal plate 2 is less than 30 ° C., but it is easier to manage if the temperature is 30 ° C. or higher.

Further, when the thermosetting resin approaches the curing temperature, curing may start even if the temperature under the curing conditions is not completely reached. When the curing starts, the viscosity increases and the resin cannot be poured into the gap. It is desirable to appropriately set the holding temperature and holding time depending on the thermosetting resin used. Further, the same effect can be obtained by reducing the temperature rise rate to delay the temperature rise. In this case, the temperature rise time in a certain temperature range may be considered as the holding time.

According to the method for manufacturing a cathode plate of the present invention, the cathode plate 1 that can be used repeatedly can be obtained by the simple method described above because the non-conductive film on the metal plate is less likely to be missing.

Hereinafter, examples of the present invention will be shown and more specifically described. However, the present invention is not limited to these examples. For convenience, the members having the same functions as the members shown in FIGS. 1 to 6 will be described with the same reference numerals. In the following Examples and Comparative Examples, the method for producing the cathode plate was different, and nickel was produced under the same conditions except for the method for producing each cathode plate, and evaluated by the same method.

<Making a cathode plate for metal electric wear>
[Example 1]
The cathode plate 1 as shown in FIGS. 1 and 2 was produced. Specifically, first, a metal plate 2 made of stainless steel having a size of 200 mm × 100 mm × 4 mm was subjected to wet etching to form disk-shaped protrusions 2a (18 pieces). At this time, the size of the disk-shaped protrusion 2a was 14 mm in diameter and 300 μm in height X.

Next, the metal plate 2 was heated to 80 ° C., and a thermosetting resin (curing start temperature 115 ° C. to 120 ° C.) using an epoxy resin as a base resin was applied onto the flat portion 2b of the metal plate 2 by a dispenser. .. Then, it was cured by heating at 150 ° C. for 60 minutes to form the non-conductive film 3.

[Example 2]
The cathode plate 1 was produced under the same conditions as in Example 1 except that the height X of the disk-shaped protrusion 2a of the metal plate 2 was 1000 μm.

[Example 3]
Except for the fact that the metal plate 2 was heated to 80 ° C. before applying the same type of thermosetting resin as that used in Example 1 to the metal plate 2, the heating temperature and time after that were included in Example 1 and The cathode plate 1 was manufactured under the same conditions.

[Example 4]
Same conditions as in Example 1 except that the same type of thermosetting resin used in Example 1 was applied to the metal plate 2 at room temperature (25 ° C.) without heating by a dispenser. The cathode plate 1 was manufactured in 1.

[Comparative Example 1]
In Comparative Example 1, a conventional cathode plate 11 as shown in FIGS. 5 and 6 was produced. Specifically, it was used in Example 1 by a screen printing method, leaving conductive portions 12a (18 pieces) having a diameter of 14 mm on a flat metal plate 12 made of stainless steel having a diameter of 200 mm × 100 mm × 4 mm. The same type of epoxy resin as above was applied and cured by heating at 150 ° C. for 60 minutes to form a non-conductive film 13 to prepare a cathode plate 11. In the cathode plate 11 of Comparative Example 1, the film thickness of the non-conductive film 13 was measured at arbitrary 10 locations by a laser displacement meter and found to be in the range of 90 to 110 μm.

<Manufacturing of nickel electroplating>
Nickel electroplating was produced by electrolytic treatment using each cathode plate having different production conditions, which was produced in each Example and Comparative Example. Specifically, a cathode plate and an anode plate made of electric nickel having a size of 200 mm × 100 mm × 10 mm were immersed in an electrolytic cell containing a nickel chloride electrolytic solution so as to face each other. Then, nickel was electrodeposited on the surface of the cathode plate under the conditions of an initial current density of 710 A / m ² and an electrolysis time of 3 days. After electrolysis, the electronickel deposited on the cathode plate was stripped off to obtain a small lump of nickel for plating.

<Evaluation>
The number of times the cathode plate used for the electrolytic treatment can be used repeatedly as it is was evaluated. If the lack of the non-conductive film spreads, nickel electrodeposited at adjacent protrusions and conductive portions may be connected to each other, and an electronickel having a desired shape may not be obtained. Therefore, when the non-conductive film was missing over 1 mm or more in the flat portion direction from the boundary with the disk-shaped protrusion, the use was stopped and the number of repetitions up to that point was evaluated. Further, even when the non-conductive film was missing and the diameter of the conductive portion was expanded by 1 mm or more, the use was stopped and the number of repetitions up to this point was evaluated. Table 1 below shows the evaluation results together with the configuration of the cathode plate.

As shown in Table 1, in Examples 1 to 4 in which the thermosetting resin was applied by a dispenser, the lack of the non-conductive film 3 was sufficiently suppressed, and the resin was applied by screen printing in Comparative Example 1. On the other hand, it was confirmed that a clear superiority was exhibited in the number of times of repeated use.

As shown in the remarks column of Table 1, the treatment of heating the metal plate "in a temperature range of 30 ° C. or higher and 20 ° C. or higher lower than the curing temperature of the thermosetting resin" before applying the thermosetting resin is performed. In Example 4, which was not performed, it was confirmed that the masking was defective due to the resin not spreading completely in a part of the cathode plate.

Based on the above, the method for producing a cathode plate of the present invention in which a thermosetting resin is applied with a dispenser can exert an advantage over the conventional manufacturing method, and in the present invention, after application of the thermosetting resin. It was confirmed that an excellent cathode plate can be further obtained by undergoing a process of holding at a predetermined temperature before thermosetting.

1 Cathode plate 2 Metal plate 2a Protrusion 2b Flat part 2c Conductive part 3 Non-conductive part 4 Nickel 5 Dispenser

Claims (3)

It is a method of manufacturing a cathode plate for metal electric wear.
A process of forming a plurality of disk-shaped protrusions on at least one surface of a metal plate, and
A step of forming a non-conductive film on a portion of the surface of the metal plate other than the protrusions,
The non-conductive resin is a thermosetting resin.
A method for producing a cathode plate worn with a metal electric electrode, which comprises applying the thermosetting resin with a dispenser in the step of forming the non-conductive film. The thermosetting resin is applied to the metal plate in a state where the metal plate is heated to a temperature range of 30 ° C. or higher and 20 ° C. or higher lower than the curing temperature of the thermosetting resin.
The method for manufacturing a cathode plate for wearing a metal electric electrode according to claim 1. The metal plate is made of titanium or stainless steel.
The method for manufacturing a cathode plate for wearing a metal electric electrode according to claim 1 or 2.

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