JP2020157476A - Gas barrier laminate and electronic device - Google Patents

Abstract

To provide a gas barrier laminate capable of preventing deterioration of an electronic device due to moisture, and an electronic device using the gas barrier laminate.SOLUTION: The problem is solved by a gas barrier laminate which has a support, an inorganic layer and an organic layer alternately laminated on the support and has one or more inorganic layers and one or more organic layers, and in which of the inorganic layers and the organic layers alternately laminated, the organic layer is most separated from the support, and the organic layer most separated from the support has a smaller area than the inorganic layer most separated from the support.SELECTED DRAWING: Figure 1

Description

The present invention relates to a gas barrier laminate and an electronic device using the gas barrier laminate.

Organic EL devices that use organic electroluminescence materials (organic EL (Electro Luminescence) materials) and electronic devices such as solar cell devices are used for various purposes.

An electronic device such as an organic EL device uses a glass plate, a metal plate, or the like as a base material. However, in recent years, electronic devices are also required to be flexible.
On the other hand, electronic devices are generally vulnerable to moisture. In particular, organic EL devices and solar cell devices, especially organic EL devices, are extremely sensitive to moisture.
Therefore, in electronic devices that require flexibility, modularization is performed using a gas barrier film.

For example, Patent Document 1 includes a substrate, an organic electroluminescent element, and a gas barrier film in this order, and the organic electroluminescent element is sealed by adhering the substrate and the gas barrier film with a sealing layer. An organic electroluminescent device is described.
The gas barrier film described in this organic electroluminescent device has a support (base film) and a barrier layer including at least one inorganic layer, and the barrier layer is on the organic electroluminescent element side with respect to the support. In addition, it has a barrier protective layer between the sealing layer and the barrier layer.

Japanese Unexamined Patent Publication No. 2015-179604

By modularizing the organic electroluminescent device using a gas barrier film as in the organic electroluminescent device described in Patent Document 1, deterioration of the organic EL element or the like due to moisture can be prevented.
However, even if the electronic device is modularized using a gas barrier film, deterioration of the organic EL element or the like due to moisture cannot be sufficiently prevented depending on the configuration of the electronic device, the usage environment, the configuration of the gas barrier film, and the like. There are also many.

An object of the present invention is to solve such a problem, and a gas barrier laminate capable of suitably preventing deterioration of the electronic device due to moisture by using it in an electronic device, and an electronic device using this gas barrier laminate. Is to provide.

The present invention solves the problem by the following configuration.
[1] It has a support and inorganic layers and organic layers alternately laminated on one surface side of the support.
Of the inorganic layers and organic layers having one or more inorganic layers and one or more organic layers and being alternately laminated, the organic layer is the most separated from the support.
The organic layer most distant from the support is a gas barrier laminate having a smaller area than the inorganic layer most distant from the support.
[2] The gas barrier laminate according to [1], wherein the organic layer most distant from the support is included in the inorganic layer most distant from the support when viewed from a direction orthogonal to the main surface of the support. ..
[3] The gas barrier laminate according to [1] or [2], which has one or more sets of an inorganic layer and an organic layer as a base of the inorganic layer.
[4] The gas barrier laminate according to any one of [1] to [3], which has two or more inorganic layers.
[5] The gas barrier laminate according to any one of [1] to [4], wherein the support is a resin film.
[6] Any of [1] to [5], wherein the distance between the end face of the organic layer most distant from the support and the end face of the inorganic layer most distant from the support is 1 to 10 mm at least in part. The gas barrier laminate described in Crab.
[7] The gas barrier laminate according to any one of [1] to [6] and
An electronic device formed on an organic layer that is most distant from the support of the gas barrier laminate,
A sealing base material that seals electronic devices,
An electronic device comprising: a sealing layer for adhering a sealing base material and a gas barrier laminate.
[8] The electronic device according to [7], wherein the height of the sealing layer is 1 to 500 μm.
[9] The electronic device according to [7] or [8], wherein the sealing base material is the gas barrier laminate according to any one of [1] to [6].
[10] The electronic device according to any one of [7] to [9], which is an organic electroluminescence device or a solar cell device.
[11] The electronic device according to [10], which is an organic electroluminescence lighting device.

According to the present invention, by using it for an electronic device, it is possible to obtain a gas barrier laminate capable of suitably preventing deterioration of the electronic device due to moisture and an electronic device capable of preventing deterioration due to moisture.

It is a figure which conceptually shows an example of the gas barrier laminated body of this invention. It is a top view which conceptually shows the gas barrier laminated body shown in FIG. It is a figure which shows an example of the electronic device of this invention conceptually. It is a top view of another example of the gas barrier laminated body of this invention. It is a figure which conceptually shows another example of the electronic device of this invention. It is a figure which conceptually shows an example of the conventional electronic device. It is a top view which conceptually shows the conventional gas barrier laminated body.

Hereinafter, embodiments of the gas barrier laminate and the electronic device of the present invention will be described with reference to the drawings.

(Gas barrier laminate)
1 and 2 show conceptually an example of the gas barrier laminate of the present invention.
FIG. 1 is a conceptual diagram of the gas barrier laminate (gas barrier film) of the present invention viewed from the surface direction of the main surface. FIG. 2 is a plan view of the gas barrier laminate of the present invention. The plan view is a view of the gas barrier laminated body of the present invention viewed from a direction orthogonal to the main surface of the support 12.
The main surface is the maximum surface of a sheet-like object (film, plate-like object). Further, in the present invention, unless otherwise specified, the area is the area of the main surface.

The gas barrier laminate 10 shown in FIG. 1 is formed on the surface of the support 12, the first organic layer 14 formed on one surface (main surface) of the support 12, and the first organic layer 14. The first inorganic layer 16 to be formed, the second organic layer 14 formed on the surface of the first inorganic layer 16, and the second organic layer 14 formed on the surface of the second organic layer 14. It has an inorganic layer 16 and a protective organic layer 18 formed on the surface of the second inorganic layer 16 which is an organic layer most distant from the support 12.
The gas barrier laminate of the present invention has inorganic layers and organic layers alternately, and among the organic layers and inorganic layers that are alternately laminated, the organic layer is the most separated from the support. In the illustrated example, among the organic layers and the inorganic layers that are alternately laminated, the organic layer that is most distant from the support 12 is the protective organic layer 18.
Further, the organic layer most separated from the support has a smaller area than the inorganic layer most separated from the support among the inorganic layers. In the illustrated example, the protective organic layer 18, which is the organic layer most distant from the support 12, becomes the formation surface (lower layer) of the second inorganic layer 16, that is, the protective organic layer 18, which is the most distant from the support 12. The area is smaller than that of the inorganic layer 16 of the layer.
In the gas barrier laminate of the present invention, the support 12 side is also referred to as "lower" and the protective organic layer 18 side is also referred to as "upper".

As a preferred embodiment, the gas barrier laminate 10 of the illustrated example is an organic-inorganic laminate type having one or more combinations of an inorganic layer 16 exhibiting gas barrier properties and an organic layer 14 as a base of the inorganic layer 16. It is a gas barrier laminate.
The gas barrier laminate 10 of the illustrated example has two sets of a combination of the inorganic layer 16 and the organic layer 14 as a base, and has the protective organic layer 18 on the combination. There is no limitation.

That is, the gas barrier laminate of the present invention has a support 12, an organic layer 14, and an inorganic layer 16 having one set of a combination of the inorganic layer 16 and the underlying organic layer 14 and the protective organic layer 18 on the combination. -It may have a layer structure of the protective organic layer 18.
Alternatively, the gas barrier laminate of the present invention has a support 12, an organic layer 14, and an inorganic layer 16 having three combinations of an inorganic layer 16 and an organic layer 14 as a base, and a protective organic layer 18 on the combination. It may have a layer structure of an organic layer 14, an inorganic layer 16, an organic layer 14, an inorganic layer 16, and a protective organic layer 18. Further, the gas barrier laminate of the present invention may have four or more combinations of the inorganic layer 16 and the underlying organic layer 14, and may have the protective organic layer 18 on the combination.
The larger the number of combinations of the underlying organic layer 14 and the inorganic layer 16, the higher the gas barrier property can be obtained, and the number of combinations of the underlying organic layer 14 and the inorganic layer 16 is two or more. Is more preferable.

Further, the gas barrier laminate of the present invention does not have to have the organic layer 14 between the support 12 and the first inorganic layer 16 closest to the support 12. In the illustrated example, the first organic layer 14 as a base may not be provided under the first inorganic layer 16.
That is, for example, the gas barrier laminate of the present invention may have a layer structure of a support 12, an inorganic layer 16, and a protective organic layer 18, or a support 12, an inorganic layer 16, an organic layer 14, and an inorganic layer 16. -It may have a layer structure of the protective organic layer 18.

That is, the gas barrier laminate of the present invention has inorganic layers and organic layers alternately on at least one surface side of the support, and is the most supported of the inorganic layers and organic layers formed alternately. Various layer configurations are available as long as the organic layer is separated from the body.

Hereinafter, the details of each component of the gas barrier laminate 10 of the present invention will be described.
<Support>
As the support 12, a known resin sheet-like material (film, plate-like material) used as a support in various gas barrier films, various laminated functional films, and the like can be used.

The material of the support 12 is not limited, and various resin materials can be used as long as the organic layer 14, the inorganic layer 16 and the protective organic layer 18 can be formed.
Examples of the material of the support 12 include polyethylene (PE), polyethylene naphthalate (PEN), polyamide (PA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyvinyl alcohol (PVA), and polyacrytonitrile (polyacrylic). PAN), Polyethylene (PI), Transparent Polyethylene, Polymethylmethacrylate Resin (PMMA), Polycarbonate (PC), Polyacrylate, Polymethacrylate, Polypropylene (PP), Polystyrene (PS), Acrylonitrile-butadiene-styrene copolymer ( ABS), cyclic olefin copolymer (COC), cycloolefin polymer (COP), triacetyl cellulose (TAC) and the like.

The thickness of the support 12 can be appropriately set according to the application, the material, and the like.
The thickness of the support 12 is determined from the viewpoint of sufficiently ensuring the mechanical strength of the gas barrier laminate 10 and the viewpoint of ensuring the flexibility of the gas barrier laminate 10 and reducing the weight and thickness. Therefore, 5 to 150 μm is preferable, and 10 to 100 μm is more preferable.

The support 12 may have a functional layer on its surface. Examples of the functional layer include a protective layer, a sealing layer, a light reflecting layer, an antireflection layer, a light shielding layer, a flattening layer, a buffer layer, and a stress relaxation layer.

<Organic layer and protective organic layer>
The organic layer 14 and the protected organic layer 18 are layers made of, for example, an organic compound obtained by polymerizing (crosslinking, curing) a monomer, a dimer, an oligomer, or the like.

The organic layer 14 that is the lower layer of the inorganic layer 16 is an organic layer 14 that is a base for properly forming the inorganic layer 16. For example, the first organic layer 14 formed on the surface of the support 12 embeds irregularities on the surface of the support 12, foreign matter adhering to the surface, and the like, and forms the surface of the first inorganic layer 16. Allows the formation of the first inorganic layer 16 properly. The second organic layer, which is the lower layer of the second inorganic layer 16, also exhibits the same action. By having such an organic layer 14 as a base, it becomes possible to appropriately form an inorganic layer 16 that mainly exhibits gas barrier properties.

Further, in the alternately formed organic layer and the inorganic layer, the protective organic layer 18 which is the organic layer most separated from the support 12 mainly protects the second inorganic layer 16 which is the most separated from the support 12. It is an organic layer for That is, the protective organic layer 18 is an organic layer for protecting the lower inorganic layer 16. By having such a protective organic layer 18, the gas barrier laminate 10 of the present invention can prevent damage to the inorganic layer 16 and maintain the desired gas barrier property.
In the gas barrier laminate 10 of the present invention, the protective organic layer 18 is an inorganic layer 16 that is most distant from the support 12 among the organic layers and the inorganic layers that are alternately formed, that is, its own forming surface. The area is smaller than that of the second inorganic layer 16 of the lower layer. This point will be described in detail later.

In the gas barrier laminate 10 of the present invention, the organic layer 14 serving as the base of the inorganic layer 16 and the protective organic layer 18 are basically the same. Therefore, unless it is necessary to make a distinction, the following description will be given with the organic layer 14 as a representative example.

The organic layer 14 is formed by curing, for example, a composition for forming an organic layer containing an organic compound (monomer, dimer, trimmer, oligomer, polymer, etc.). The composition for forming an organic layer may contain only one type of organic compound, or may contain two or more types of organic compounds.
The organic layer 14 contains, for example, a thermoplastic resin, an organosilicon compound, and the like. The thermoplastic resin is, for example, polyester, (meth) acrylic resin, methacrylate-maleic acid copolymer, polystyrene, transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamideimide, polyetherimide, cellulose acylate, polyurethane. , Polyether ether ketone, polycarbonate, alicyclic polyolefin, polyarylate, polyethersulfone, polysulfone, fluorene ring-modified polycarbonate, alicyclic-modified polycarbonate, fluorene ring-modified polyester, acrylic compound and the like. Examples of the organosilicon compound include polysiloxane.

The organic layer 14 preferably contains a polymer of a radical curable compound and / or a cationic curable compound having an ether group from the viewpoint of excellent strength and the glass transition temperature.
From the viewpoint of lowering the refractive index of the organic layer 14, the organic layer 14 preferably contains a (meth) acrylic resin containing a polymer such as a (meth) acrylate monomer or an oligomer as a main component. By lowering the refractive index of the organic layer 14, the transparency is increased and the light transmittance is improved.

The organic layer 14 is more preferably bifunctional or more, such as dipropylene glycol di (meth) acrylate (DPGDA), trimerol propanetri (meth) acrylate (TMPTA), and dipentaerythritol hexa (meth) acrylate (DPHA). Contains a (meth) acrylic resin containing a polymer such as a (meth) acrylate monomer, dimer and oligomer as a main component, and more preferably a polymer such as a trifunctional or higher functional (meth) acrylate monomer, dimer and oligomer. Contains (meth) acrylic resin containing. Moreover, you may use a plurality of these (meth) acrylic resins. The main component means the component having the largest content mass ratio among the contained components.

The composition for forming an organic layer preferably contains an organic solvent, a surfactant, a silane coupling agent and the like in addition to the organic compound.

When a plurality of organic layers 14 are provided, that is, when a plurality of combinations of the organic layer 14 and the inorganic layer 16 are provided, the materials of the organic layers 14 may be the same or different.
The materials of the organic layer 14 and the protective organic layer 18 may be the same or different.

The thickness of the organic layer 14 is not limited and can be appropriately set according to the components contained in the composition for forming the organic layer, the support 12 used, and the like.
The thickness of the organic layer 14 is preferably 0.5 to 5 μm, more preferably 1 to 3 μm. By setting the thickness of the organic layer 14 to 0.5 μm or more, it is preferable in that the surface unevenness of the support 12 and foreign matter adhering to the surface can be embedded to flatten the surface of the organic layer 14. .. By making the thickness of the organic layer 14 5 μm or less, cracks in the organic layer 14 can be prevented, the flexibility of the gas barrier laminate 10 can be increased, and the gas barrier laminate 10 can be made thinner and lighter. Is preferable.

When a plurality of organic layers 14 are provided, that is, when a plurality of combinations of the organic layer 14 and the inorganic layer 16 are provided, the thickness of each organic layer 14 may be the same or different.
The organic layer 14 and the protective organic layer 18 may also have the same or different thicknesses.

The organic layer 14 can be formed by a known method depending on the material.
For example, the organic layer 14 can be formed by a coating method in which the above-mentioned composition for forming an organic layer is applied and the composition for forming an organic layer is dried. In the formation of the organic layer 14 by the coating method, if necessary, the dried organic layer forming composition is further irradiated with ultraviolet rays to polymerize (crosslink) the organic compounds in the organic layer forming composition. ..

The organic layer 14 can be formed by so-called roll-to-roll. Hereinafter, "roll to roll" is also referred to as "RtoR".
RtoR is a roll formed by winding a long sheet-like material, sending out the sheet-like material, performing film formation while transporting the sheet to be formed in the longitudinal direction, and rolling the film-formed sheet-like material. It is a manufacturing method that winds around. High productivity and production efficiency can be obtained by using RtoR.

<Inorganic layer>
The inorganic layer 16 is a thin film containing an inorganic compound and is provided on the surface of the organic layer 14. In the gas barrier laminate 10, the inorganic layer 16 mainly exhibits gas barrier properties.
The inorganic layer 16 is appropriately formed by being provided on the surface of the organic layer 14. For example, on the surface of the support 12, there are regions where it is difficult for the inorganic compound to form a film, such as irregularities and shadows of foreign substances. By providing the organic layer 14 on the support 12, the region where the inorganic compound is difficult to form is covered. Therefore, the inorganic layer 16 can be formed on the entire surface of the support 12 without any gaps. In this respect, the same applies to the second and subsequent inorganic layers 16.

The material of the inorganic layer 16 is not limited, and various kinds of known inorganic compounds used for the gas barrier layer, which are composed of inorganic compounds exhibiting gas barrier properties, can be used.
Examples of the material of the inorganic layer 16 include metal oxides such as aluminum oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide and indium tin oxide (ITO); metal nitrides such as aluminum nitride; and metals such as aluminum carbide. Carbides; Silicon oxides such as silicon oxide, silicon oxide, acid carbide, silicon nitride carbide; silicon nitrides such as silicon nitride and silicon nitride; silicon carbides such as silicon carbide; these hydrides; these two types Examples thereof include inorganic compounds such as the above mixtures; and these hydrogen-containing substances. Mixtures of two or more of these are also available.
In particular, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and a mixture of two or more of these are preferably used because they have high transparency and can exhibit excellent gas barrier properties. Among them, silicon nitride is preferably used because it can exhibit excellent gas barrier properties.

The thickness of the inorganic layer 16 is not limited, and the thickness capable of exhibiting the desired gas barrier property can be appropriately set according to the material.
The thickness of the inorganic layer 16 is preferably 10 to 150 nm, more preferably 12 to 100 nm, and even more preferably 15 to 75 nm.
By setting the thickness of the inorganic layer 16 to 10 nm or more, it is preferable in that the inorganic layer 16 that stably exhibits sufficient gas barrier performance can be formed. Further, the inorganic layer 16 is generally brittle, and if it is too thick, cracks, cracks, peeling, etc. may occur, but cracks occur when the thickness of the inorganic layer 16 is 150 nm or less. Can be prevented.

When a plurality of inorganic layers 16 are provided as in the gas barrier laminate 10 of the illustrated example, the thickness of each inorganic layer 16 may be the same or different.

The inorganic layer 16 can be formed by a known method depending on the material.
For example, plasma CVD such as CCP (Capacitively Coupled Plasma) -CVD (Chemical Vapor Deposition) and ICP (Inductively Coupled Plasm) -CVD, atomic layer deposition (ALD (Atomic Layer Deposition)), magnetron sputtering, reactive sputtering and the like. Various vapor deposition methods such as sputtering and vacuum vapor deposition are preferably used.
The inorganic layer 16 is also preferably formed by RtoR.

(Electronic device (organic electroluminescence lighting device))
Such a gas barrier laminate 10 of the present invention is preferably preferably used as a base material for forming an electronic device.
FIG. 3 conceptually shows an example of the electronic device of the present invention using the gas barrier laminate 10 of the present invention. FIG. 3 shows, as an example, an example in which the electronic device of the present invention is used in an organic electroluminescence illuminator (organic EL (Electro Luminescence) illuminator).

The electronic device of the present invention is not limited to the organic EL lighting device 24.
For example, the electronic device of the present invention may be a solar cell (solar cell device) having a solar cell element instead of the organic EL lighting element 26. In addition, the electronic device of the present invention can be used for various known electronic devices such as organic EL devices other than organic EL lighting devices such as organic EL displays, electronic paper, and quantum dot devices using quantum dots. It is available.
Above all, the electronic device of the present invention is suitably used for an organic EL lighting device and a solar cell.

The organic EL lighting device 24 shown in FIG. 3 has an organic EL lighting element 26 formed on the surface of the protective organic layer 18 using the gas barrier laminate 10 as a base material, and has a rectangular frame shape so as to surround the protective organic layer 18. The organic EL lighting element 26 is sealed with the sealing base material 30 by providing the sealing layer 28 of the above and adhering the sealing base material 30 to the sealing layer 28.
In addition to the members shown in the figure, the organic EL lighting device 24 may include various members of a known organic EL lighting device (organic EL device), such as a passivation film and a desiccant, if necessary. ..
Further, in the organic EL lighting device 24 (the electronic device of the present invention), the sealing base material 30 side is also referred to as "upper" and the support 12 side is also referred to as "lower".

As described above, in the gas barrier laminate 10 of the present invention, the protective organic layer 18 which is the organic layer most separated from the support 12 is the second inorganic layer 16 which is the inorganic layer most separated from the support 12 ( The area is smaller than that of the inorganic layer 16) below the protective organic layer 18. In the illustrated example, as a preferred embodiment, as shown in FIG. 2, the protective organic layer 18 is included in the lower inorganic layer 16 in the plan view (when viewed from a direction orthogonal to the main surface of the support 12). Orthogonal.
The organic EL lighting device 24 forms an organic EL lighting element 26 on the protective organic layer 18. Further, the sealing layer 28 is a frame body surrounding the protective organic layer 18 and the organic EL lighting element 26, and the sealing base material 30 for sealing the organic EL lighting element 26 is placed on the sealing layer 28. Be glued.
Therefore, in the organic EL lighting device 24 of the illustrated example, the protective organic layer 18 is not exposed to the outside including all the end faces.
The gas barrier laminate 10 (organic EL lighting device 24) of the present invention preferably has such a configuration to prevent deterioration of the organic EL lighting element 26 due to moisture.

As described above, the protective organic layer protects the lower inorganic layer (the uppermost inorganic layer in the inorganic layer) so that the gas barrier laminate exhibits and maintains a predetermined gas barrier property. It is provided.
Therefore, normally, the protective organic layer 18A is formed so as to cover the entire surface of the lower inorganic layer 16 as in the gas barrier laminate 10A shown in FIGS. 6 and 7.
Therefore, as shown in FIG. 6, in the conventional organic EL lighting device 24A based on the gas barrier laminate, a frame-shaped sealing layer 28 is formed on the protective organic layer 18A, and the sealing layer 28 is formed. By adhering the sealing base material 30, the organic EL lighting element 26 is sealed by the sealing base material 30.
Therefore, in the conventional organic EL lighting device 24A, the end face 18e of the protective organic layer 18A is exposed to the outside.

As described above, the protective organic layer 18A is for protecting the lower inorganic layer 16. The inorganic layer 16 is, for example, a thin and hard film having a thickness of about 10 to 150 nm. In order to sufficiently prevent such cracking and peeling of the inorganic layer 16, the protective organic layer 18A needs to have a certain degree of hardness.
However, in general, an organic layer (layer made of an organic material) having a hardness capable of sufficiently protecting a thin and hard inorganic layer 16 does not have sufficient gas barrier properties.
Therefore, in the conventional gas barrier laminate 10A in which the end face 18e of the protective organic layer 18A is exposed to the outside, moisture invades from the end face 18e of the protective organic layer 18A and reaches the organic EL lighting element 26, and this moisture As a result, the organic EL lighting element 26 deteriorates. In particular, in a solar cell and an organic EL device using an organic EL material that is sensitive to moisture, particularly in an organic EL device, deterioration of the element due to moisture invading from the end face 18e of the protective organic layer 18A becomes a problem.

Without the protective organic layer 18A, deterioration of the organic EL lighting element 26 due to moisture entering from the end face of the protective organic layer 18A can be prevented.
However, without the protective organic layer 18A, the inorganic layer 16 is exposed on the outermost surface. Therefore, for example, when it is wound into a roll, when it is cut into a predetermined shape, and when it is handled, the inorganic layer on the outermost surface is inorganic. The layer 16 is damaged, and the gas barrier laminate does not exhibit a predetermined gas barrier property.

On the other hand, in the gas barrier laminate 10 of the present invention, the area of the protective organic layer 18 is smaller than that of the lower inorganic layer 16. Preferably, as shown in FIGS. 1 and 2, the protective organic layer 18 is included in the lower inorganic layer 16 in the plan view. Further, as the adhesive to be the sealing layer 28, various adhesives having sufficient gas barrier properties can be selected.
Therefore, according to the gas barrier laminate 10 of the present invention, as shown in FIG. 3, the end face of the protective organic layer 18 is placed inside the sealing layer 28, and preferably the protective organic layer 18 is placed on the lower inorganic layer 16. , Can be encapsulated by the sealing layer 28 and the sealing substrate 30.
Therefore, according to the gas barrier laminated body 10 of the present invention and the organic EL lighting device 24 of the present invention using the gas barrier laminated body 10 of the present invention, the organic EL lighting element 26 due to moisture entering from the end face of the protective organic layer 18 ( It is possible to prevent deterioration of the electronic element) and extend the life of the organic EL lighting device (electronic device).

In the gas barrier laminate 10 of the illustrated example, as a preferred embodiment, the protective organic layer 18 is included in the lower inorganic layer 16 in the plan view. However, the present invention is not limited to this, and the protective organic layer 18 is smaller than the lower inorganic layer 16, and a part of the end face of the protective organic layer 18 is in the plane direction with respect to the end face of the lower inorganic layer 16. It may be located inside.
That is, in the gas barrier laminate 10 of the present invention, for example, as in the protective organic layer 18B shown on the left side of FIG. 4, only one end face may be located inside the end face of the lower inorganic layer 16. Alternatively, as in the protective organic layer 18C shown on the right side of FIG. 4, only the end faces of the two sides may be located inside the end faces of the lower inorganic layer 16.
Even with these configurations, the deterioration of the organic EL lighting element 26 due to the moisture entering from the end face of the protective organic layer is better than that of the conventional gas barrier laminate 10A as shown in FIGS. 6 and 7. Can be prevented.

However, in terms of the effect of preventing deterioration of the organic EL lighting element 26 due to moisture, it is preferable that the end face of the protective organic layer exposed to the outside is small.
Therefore, in the gas barrier laminate of the present invention, as in the rectangular protective organic layer 18C shown on the right side of FIG. 4, at least two end faces (50% or more of all end faces) of the protected organic layer are the lower inorganic layer 16 It is preferably located inside the end face of the protective organic layer 18, and as shown in FIGS. 1 and 2, the protective organic layer 18 is included in the lower inorganic layer 16 in the plan view, that is, all the end faces of the protective organic layer 18. Is more preferably located inside the end face of the lower inorganic layer 16.
Further, in the electronic device of the present invention, it is preferable to provide a sealing layer so that at least two end faces (50% or more of all end faces) of the protective organic layer are inside in the surface direction, and the organic EL lighting device 24 As described above, it is more preferable that the sealing layer 28 is provided so as to surround the protective organic layer 18 in the plane direction, and the protective organic layer 18 is sealed with the sealing base material 30.

In the gas barrier laminate 10, if the area of the protective organic layer 18 is smaller than that of the lower inorganic layer 16, the distance d between the end face of the protective organic layer 18 and the end face of the lower inorganic layer 16 (see FIGS. 1 and 2). Has no restrictions.
Here, from the viewpoint of preventing deterioration of the organic EL lighting element 26 due to moisture entering from the end surface of the protective organic layer 18, the thickness (size in the plane direction) of the sealing layer 28 up to the protective organic layer 18 can be increased. In terms of points, the distance d between the end face of the protective organic layer 18 and the end face of the lower inorganic layer 16 is preferably long. On the other hand, if the distance d between the end face of the protective organic layer 18 and the end face of the lower inorganic layer 16 is long, the area of the inorganic layer 16 that is not covered by the protective organic layer 18 increases, and the inorganic layer is handled during handling or the like. 16 is easily damaged.
Considering the above points, the distance d between the end face of the protective organic layer 18 and the end face of the lower inorganic layer 16 in at least a part of the end face, preferably in a region of 50% or more in the plane direction, particularly in the entire end face. Is preferably 1 to 10 mm, more preferably 1 to 8 mm, and even more preferably 1 to 7 mm.

Hereinafter, the details of each component of the organic EL lighting device 24 of the present invention will be described.
<Encapsulation layer>
In the organic EL lighting device 24, the sealing layer 28 is for adhering the sealing base material 30 and sealing the organic EL lighting element 26 by the sealing base material 30. Specifically, in the organic EL lighting device 24, the organic EL lighting element 26 is sealed by the sealing base material 30, the sealing layer 28, and the gas barrier laminate 10.

As the sealing layer 28, various known sealing layers, sealing layers, adhesive layers and the like used for attaching the sealing base material can be used in known organic EL devices.
Specifically, the material of the sealing layer 28 is preferably an ultraviolet curable resin, and more specifically, an ultraviolet curable epoxy resin, an ultraviolet curable acrylate resin, and the like are exemplified. A commercially available adhesive can also be preferably used as the sealing layer 28, and examples thereof include XNR5516 manufactured by Nagase ChemteX Corporation.
Further, as the sealing layer 28, an adhesive sheet or an adhesive tape may be used. As the adhesive sheet and adhesive tape, those known as OCA (Optical Clear Adhesive), including commercially available products, are widely available.

In the illustrated example, the sealing layer 28 is provided in a frame shape surrounding the protective organic layer 18 (organic EL lighting element 26), and the region where the organic EL lighting element 26 exists is a space. The invention is not limited to this.
That is, in the organic EL lighting device (electronic device) of the present invention, the organic EL lighting element 26, the protective organic layer 18, and the inorganic layer 16 under the protective organic layer 18 are sealed between the sealing base material 30. It may be configured to be filled with layers.
However, in terms of the optical characteristics of the organic EL lighting device 24 and the flexibility of the organic EL lighting device 24, the sealing layer 28 forms a frame shape surrounding the protective organic layer 18, and the region where the organic EL lighting element 26 exists is a space. The configuration shown in FIG. 3 is more advantageous.
When the sealing layer 28 has a frame shape surrounding the protective organic layer 18, the distance d between the end face of the protective organic layer 18 and the end face of the lower inorganic layer 16 and the thickness of the sealing layer 28 ( Depending on the size in the plane direction), the sealing layer 28 may cover the end portion of the protective organic layer 18 in the plane direction.

The sealing layer 28 preferably has a high gas barrier property in terms of preventing deterioration of the organic EL lighting element 26 due to moisture.
Specifically, the material of the sealing layer 28 has a water vapor permeability per 500 μm (water vapor permeability coefficient per 500 μm) of 1 × 10 ^-1 to 1 × 10 ^-3 g / (m ² · day). Is preferable, and 1 × 10 ⁻² to 1 × 10 ^-3 g / (m ² · day) is more preferable.
Further, the sealing layer 28 preferably has a water vapor permeability of 1 × 10 ^-1 to 1 × 10 ^-3 g / (m ² · day), and is preferably 1 × 10 ⁻² to 1 × 10 ^-3 g /. It is more preferably (m ² · day).
When the sealing layer 28 covers the end portion of the protective organic layer 18 in the surface direction, the water vapor transmittance of the sealing layer 28 referred to here is protected from the outer end surface of the sealing layer 28. It is the water vapor transmittance of the sealing layer 28 at the thickness up to the end face of the organic layer 18. In other words, when the sealing layer 28 covers the end portion of the protective organic layer 18 in the surface direction, the water vapor transmittance of the sealing layer 28 here means the thickness of the sealing layer 28. It is the water vapor transmittance of the sealing layer 28 when it is considered from the outer end face of the stop layer 28 to the end face of the protective organic layer 18.

The sealing layer 28 has a lower gas barrier property than the sealing base material 30 and the inorganic layer 16. Therefore, in terms of preventing deterioration of the organic EL lighting element 26 due to moisture, it is advantageous that the height of the sealing layer 28 (the size in the vertical direction, that is, the size in the direction orthogonal to the plane direction) is low. On the other hand, in order to uniformly apply the sealing layer 28 and precisely seal the organic EL lighting element 26, the sealing layer 28 preferably has a constant height.
Specifically, the height of the sealing layer 28 is preferably 1 to 500 μm, more preferably 50 to 400 μm, and even more preferably 100 to 300 μm.

<Organic EL lighting element>
The organic EL lighting element 26 is a known organic EL lighting element used in an organic EL lighting device (organic EL lighting device).
As an example, the organic EL lighting element 26 includes an anode, a hole injection layer (hole injection layer), a hole transport layer (hole transport layer), a light emitting layer, a hole block layer (hole blocking layer), an electron transport layer, and the like. It is a known organic EL lighting element (organic EL element, organic EL light emitting element) that constitutes an organic EL lighting device having an electron injection layer, a cathode, and the like.

<Encapsulating base material>
The sealing base material 30 is also a known sealing base material used in a known organic EL lighting device.
Specifically, a sheet-like material made of yttria-stabilized zirconia (YSZ), glass (non-alkali glass, soda lime glass, etc.) and the like is exemplified.
Further, as the sealing base material 30, a gas barrier film in which a gas barrier layer made of an inorganic compound is formed on a resin film can also be preferably used. Examples of the gas barrier layer include a silicon nitride layer, a silicon oxide layer, a silicon nitride layer, and an aluminum oxide layer. When a gas barrier film is used as the sealing base material 30, the sealing base material 30 is used to seal the gas barrier layer side toward the organic EL lighting element 26.

Further, the sealing base material 30 has one or more sets of an inorganic layer exhibiting gas barrier properties similar to the gas barrier laminate 10 shown in FIG. 1 and an organic layer serving as a base for the inorganic layer. , An organic-inorganic laminated gas barrier film can also be preferably used. The organic-inorganic laminated type gas barrier film usually has a protective organic layer for protecting the inorganic layer by completely covering the uppermost inorganic layer as a layer most distant from the support.
Further, as the sealing base material, the gas barrier laminate 10 of the present invention can be more preferably used as conceptually shown by exemplifying the gas barrier laminate 10 in FIG.
Here, as shown in FIG. 3 and the like, the sealing layer 28 is provided in a frame shape surrounding the protective organic layer 18, and the region where the organic EL lighting element 26 exists is an organic EL lighting device. In this case, when the sealing base material 30 having a laminated structure in which organic layers and inorganic layers are alternately laminated is used, instead of the usual organic-inorganic laminated type gas barrier film having a protective organic layer, the present invention It is preferable to use a gas barrier laminate or an organic-inorganic laminated gas barrier film having no protective organic layer.

(Manufacturing of gas barrier laminate and organic EL lighting device)
First, a support 12 such as a PET film is prepared, and the first organic layer 14 is formed on one surface of the support 12 by a coating method using the composition for forming an organic layer as described above. For the application of the composition for forming an organic layer, known methods such as a bar coating method, a gravure coating method, and a die coating method can be used. Next, the first inorganic layer 16 is formed on the surface of the first organic layer 14 by plasma CVD such as CCP-CVD. When preparing a gas barrier laminate having a set of a combination of the organic layer 14 and the inorganic layer 16 as a base, after forming the first inorganic layer 16, the protective organic layer 18 is formed in the same manner as described below. Form.
Then, in the same manner, the second organic layer 14 and the second inorganic layer 16 are formed. In the case of producing a gas barrier laminate having three or more combinations of the organic layer 14 and the inorganic layer 16 as a base, the same formation of the organic layer 14 and the inorganic layer 16 may be repeated.
Then, the composition for forming the protective organic layer 18 (composition for forming the protective organic layer) is applied to the entire surface of the inorganic layer 16 of the second layer (top layer), and the organic layer is formed in the same manner and laminated. The body.
As described above, it is preferable to utilize RtoR for the formation of each of these layers.

Next, after cutting the laminated body produced as needed into a predetermined shape, the peripheral portion of the organic layer formed on the inorganic layer 16 of the second layer of the laminated body is removed, and the inorganic layer of the lower layer in the plan view is removed. The protective organic layer 18 included in the layer 16 is formed to form the gas barrier laminate 10 of the present invention.
As a method for removing the organic layer, a known method can be used, but etching is preferably used. Both dry etching and wet etching can be used for etching, but dry etching is preferably used in that the adhesion between the inorganic layer 16 and the sealing layer 28 can be improved.

Dry etching is a method of etching a material with a reactive gas, ions, radicals, or the like.
As the dry etching, known methods such as plasma etching, ion etching, and focused ion beam etching can be used.
Ion etching is a method of etching a solid surface with an inert gas containing helium (He), argon (Ar), neon (Ne), and a combination thereof. Reactive ion etching (RIE (Reactive Ion Etching)) is preferably used because vertical etching with high anisotropy is possible and recesses with a well-etched shape can be formed, and argon ion etching using argon gas is used. It is more preferably used.

In the production of the gas barrier laminate 10, the composition for forming an organic layer is applied to the entire surface of the inorganic layer 16 and the peripheral portion is removed by etching to form the protective organic layer 18 instead of forming a flat surface. In the figure, the composition for forming an organic layer may be applied so as to be encapsulated in the inorganic layer 16 to form the protective organic layer 18.

After the gas barrier laminate 10 is formed in this way, the anode, the hole injection layer, the hole transport layer, the light emitting layer, the hole blocking layer, the electron transport layer, the electron injection layer, the cathode and the like are formed on the protective organic layer 18. To form the organic EL illumination element 26.
After forming the organic EL lighting element 26, for example, an adhesive to be a sealing layer 28 is applied in a frame shape to a peripheral portion exposed in the inorganic layer 16 under the protective organic layer 18. After that, the sealing base material 30 is laminated on the adhesive, and then the adhesive is cured by, for example, irradiating with ultraviolet rays, and the sealing layer 28 forms the inorganic layer 16 (gas barrier laminate 10) and the sealing base material. The organic EL lighting device 24 is manufactured by adhering with 30.

Although the gas barrier laminate and the electronic device of the present invention have been described in detail above, the present invention is not limited to the above aspects, and various improvements and changes may be made without departing from the gist of the present invention. ..

The present invention will be specifically described below with reference to examples. The present invention is not limited to the specific examples shown below.

[Example 1]
<Preparation of gas barrier laminate>
As a support, a PET film having a thickness of 100 μm (manufactured by Toyobo Co., Ltd., A4300) was prepared.

28.5 g of TMPTA (manufactured by Daicel Ornex), 1.5 g of an ultraviolet polymerization initiator (manufactured by Lamberti, ESACURE KTO46), and 170 g of 2-butanone (manufactured by Wako Pure Chemical Industries, Ltd.) were mixed. A composition for forming an organic layer for forming an organic layer was prepared. The solid content concentration of the composition for forming an organic layer was 15% by mass.
The prepared organic layer forming composition was applied to the surface of the prepared support. The coating was carried out using a die coater so that the film thickness of the machine layer was 1 μm. After application, it was dried in an oven at 80 ° C. for 3 minutes. Next, the composition for forming an organic layer is cured by irradiating ultraviolet rays of a high-pressure mercury lamp (integrated irradiation amount of about 600 mJ / cm ² ) in a chamber having an oxygen concentration of 0.1% by a nitrogen substitution method, and organically. A layer was formed.

A silicon nitride film having a film thickness of 40 nm was formed as an inorganic layer on the formed organic layer.
The formation of the inorganic layer was performed using a CCP-CVD apparatus (manufactured by SAMCO Corporation). As the raw material gas, silane gas (flow rate 160 sccm: 0 ° C., 1 atmospheric pressure standard state, the same applies hereinafter), ammonia gas (flow rate 370 sccm), hydrogen gas (flow rate 590 sccm), and nitrogen gas (flow rate 240 sccm) were used. The film forming pressure was 40 Pa. A high-frequency power source having a frequency of 13.56 MHz was used as the power source, and the plasma excitation power was set to 2.5 kW.
Hereinafter, the organic layer between the support and the inorganic layer (first inorganic layer) is also referred to as an underlying organic layer.

21.5 g of TMPTA (manufactured by Daicel Ornex), 5.5 g of KBM-5103 (manufactured by Shinetsu Chemical Industries, Ltd.), 1.0 g of KAYAMER PM-21 (manufactured by Nippon Kayaku Co., Ltd.), UV polymerization initiator (run) A composition for forming a protective organic layer for forming a protective organic layer is prepared by mixing 1.5 g of ESACURE KTO46 (manufactured by Berti) and 170 g of 2-butanone (manufactured by Wako Pure Chemical Industries, Ltd.). did. The solid content concentration of the composition for forming an organic layer was 15% by mass.
On the inorganic layer, the prepared composition for forming a protected organic layer was used to form an organic layer to be a protected organic layer having a thickness of 1.5 μm in the same manner as the previously formed organic layer.
As a result, a laminate in which an organic layer, an inorganic layer, and an organic layer serving as a protective organic layer were formed on the surface of the support was produced.

The laminate was cut to 50 x 50 mm.
Then, the entire peripheral portion (all four sides) of the organic layer to be the protective organic layer was removed by etching 1 mm in the plane direction to form the protective organic layer. As a result, in a plan view as shown in FIG. 2, a gas barrier laminate in which the protective organic layer is encapsulated in the lower inorganic layer was produced (distance d = 1 mm in FIGS. 1 and 2). That is, this gas barrier laminate has a layer structure of a support, an organic layer (underlying organic layer), an inorganic layer, and a protective organic layer.
Two of the same gas barrier laminates were prepared.
The water vapor permeability of the produced gas barrier laminate was measured by a calcium corrosion method (method described in JP-A-2005-283651). As a result, the water vapor transmittance of the laminate was 1 × 10 ^-6 g / (m ² · day).

A polyethylene dioxythiophene-polystyrene sulfonic acid (PEDOT-PSS) electrode (anode) was formed at 80 nm on the surface of one protective organic layer of the produced gas barrier laminate.
A molybdenum oxide (MoO ₃ ) layer of 2 nm was formed as a hole injection layer on the surface of the formed anode by a vacuum vapor deposition apparatus, and further, a hole transport layer (α-NPD: Bis [α-NPD: Bis] was formed on the surface of the molybdenum oxide layer in order. N- (1-naphthyl) -N-phenyl] benzidine) at 200 nm, CBP (4,4'-Bis (carbazol-9-yl) biphenyl) as the host material, 5% Ir (ppy) 3 (Tris (2) A light emitting layer doped with -phenylpyridinato) iridium) is 20 nm, and a BAlq (Bis- (2-methyl-8-quinolinolato) -4- (phenyl-phenolate) -aluminium (III)) layer is 10 nm as a hole blocking layer. , Alq3 (Tris (8-hydroxy-quinolinato) aluminum) layer was vapor-deposited at 20 nm as an electron transport layer to form an organic electroluminescent layer.
Subsequently, lithium fluoride (LiF) of 0.5 nm, aluminum of 1.5 nm, and silver of 15 nm were deposited on the surface of the obtained organic electroluminescent layer in this order to form a transparent electrode (cathode). , An organic EL lighting element was formed.

An adhesive (manufactured by Nagase ChemteX Corporation, XNR5516) was applied in a frame shape to the peripheral portion of the upper surface (surface on the protective organic layer side) of the gas barrier laminate on which the organic EL lighting element was formed. When this adhesive is cured, the water vapor permeability per 500 μm is 1 × 10 ^-1 g / (m ² · day).
Next, another gas barrier laminate was used as a sealing base material, and the upper surface side was directed toward the organic EL lighting element side, and the ends were laminated so as to coincide with each other.
Further, by irradiating ultraviolet rays of a high-pressure mercury lamp (integrated irradiation amount of about 6 J / cm ² ), the adhesive is cured to form a sealing layer, and the gas barrier laminate on which the organic EL lighting element is formed is sealed. An organic EL lighting device as shown in FIG. 3 was produced in which a base material (similar gas barrier laminate) was adhered with a sealing layer to seal an organic EL lighting element.
The height of the formed sealing layer (size in the vertical direction) was 500 μm, and the thickness of the sealing layer (size in the surface direction) was 5 mm. Therefore, in this example, a 4 mm sealing layer covers the end of the protective organic layer.

[Example 2 and Example 3]
In the production of one gas barrier laminate, etching of the peripheral portion of the organic layer to be the protective organic layer is performed on two adjacent sides (see the right side of Example 2 and FIG. 4) and one side (Examples 3 and 4). A gas barrier laminate was produced in the same manner as in Example 1 except that (see left side).
An organic EL lighting device was produced in the same manner as in Example 1 except that the organic EL lighting element was formed on the gas barrier laminate. The gas barrier laminate used as the sealing base material is the same as in Example 1. In this respect, the same applies to all the examples in which the configuration of the gas barrier laminate forming the organic EL lighting element is changed.
Therefore, in the protective organic layer of the gas barrier laminate on which the organic EL lighting element is formed, the end faces of the two sides are exposed to the outside in Example 2, and the end faces of the three sides are exposed to the outside in Example 3. It has become.

[Examples 4 to 8]
In the production of one gas barrier laminate, the etching width of the peripheral part of the organic layer to be the protective organic layer was changed to 0.5 mm, 7 mm, 8 mm, 10 mm, and 11 mm, and the end face and the lower layer of the protective organic layer were changed. The distance from the end face of the inorganic layer (distance d in FIGS. 1 and 2) is 0.5 mm (Example 4), 7 mm (Example 5), 8 mm (Example 6), 10 mm (Example 7). A gas barrier laminate was produced in the same manner as in Example 1 except that the thickness was changed to 11 mm (Example 8).
An organic EL lighting device was produced in the same manner as in Example 1 except that the organic EL lighting element was formed on the gas barrier laminate.

[Example 9]
A gas barrier laminate was prepared in the same manner as in Example 1 except that an organic layer (underlying organic layer) was not formed between the support and the inorganic layer in the preparation of one gas barrier laminate. That is, this gas barrier laminate has a layer structure of a support, an inorganic layer, and a protective organic layer.
An organic EL lighting device was produced in the same manner as in Example 1 except that the organic EL lighting element was formed on the gas barrier laminate.
[Example 10]
In the production of one gas barrier laminate, after forming the second organic layer, a second inorganic layer is formed on the surface of the second organic layer in the same manner as the first inorganic layer. Same as Example 1 except that a third organic layer is formed on the surface of the second inorganic layer in the same manner as the second organic layer, and the third organic layer is used as a protective organic layer. A gas barrier laminate was prepared in. That is, this gas barrier laminate has a layer structure of a support, an organic layer, an inorganic layer, an organic layer, an inorganic layer, and a protective organic layer.
An organic EL lighting device was produced in the same manner as in Example 1 except that an organic EL lighting element was formed on the gas barrier laminate and the height of the sealing layer was set to 300 μm.

[Examples 11 to 16]
The height of the sealing layer is 0.5 μm (Example 11), 600 μm (Example 12), 50 μm (Example 13), 400 μm (Example 14), 100 μm (Example 15), and 300 μm (Example). A gas barrier laminate was produced in the same manner as in Example 1 except that it was changed to Example 16).
An organic EL lighting device was produced in the same manner as in Example 1 except that this gas barrier laminate was used.

[Comparative Example 1]
In the preparation of one gas barrier laminate, the gas barrier laminate was prepared in the same manner as in Example 1 except that the peripheral portion of the organic layer to be the protective organic layer was not etched.
An organic EL lighting device was produced in the same manner as in Example 1 except that the organic EL lighting element was formed on the gas barrier laminate.
Therefore, in the protective organic layer of the gas barrier laminate on which the organic EL lighting element is formed, all four side ends are exposed to the outside.

[Evaluation (high temperature and high humidity durability)]
The produced organic EL lighting device was evaluated as follows.
The produced organic EL lighting device is left in an environment of a temperature of 60 ° C. and a relative humidity of 90% RH for 100 hours, and the total area [%] of dark spots with respect to the total area of light emission (area of the organic EL lighting element) is shown in the table below. Shown in.

The smaller the area of the dark spot, the higher the high temperature and high humidity durability, that is, the better the gas barrier property of the gas barrier laminate.
As shown in Table 1, in the plan view, the gas barrier laminate of the present invention in which the protective organic layer is smaller than the lower inorganic layer and at least one end face is inside the sealing layer in the plane direction. According to the organic EL lighting device, it has higher high temperature and high humidity durability than Comparative Example 1 in which all four side end faces of the protective organic layer are exposed to the outside, that is, the gas barrier of the gas barrier laminate. Excellent in sex.
As shown in Examples 1 and 5-7, by setting the distance between the end face of the protective organic layer and the end face of the lower organic layer in the range of 1 to 10 mm, better high temperature and high humidity durability, that is, The gas barrier property of the gas barrier laminate can be obtained. In Example 8, the distance between the end face of the protective organic layer and the end face of the lower organic layer is 11 mm, which is slightly longer than that of Example 7, so that the inorganic layer is slightly longer during handling before sealing. It is considered that there were many dark spots as compared with Example 7.
From the comparison between Example 9 and Example 1, by providing an organic layer (underlying organic layer) between the support and the first inorganic layer, good high temperature and high humidity durability, that is, a gas barrier of a gas barrier laminate You can get sex.
Further, as shown in Examples 13 to 16, the height of the sealing layer is set in the range of 50 to 400 μm, particularly in the range of 100 to 300 μm, so that the high temperature and high humidity durability is improved. The gas barrier property of the gas barrier laminate can be obtained.
In addition, as shown in Example 10, the height of the sealing layer is in the range of 100 to 300 μm, and the combination of the organic layer and the inorganic layer as the base is two sets (two layers of inorganic layers). As a result, extremely excellent high temperature and high humidity durability, that is, gas barrier properties of the gas barrier laminate can be obtained.
From the above results, the effect of the present invention is clear.

It can be suitably used for organic EL lighting devices, solar cells, and the like.

10, 10A Gas barrier laminate 12 Support 14 Organic layer 16 Inorganic layer 18, 18A, 18B, 18C Protective organic layer 18e End face 24, 24A Organic EL lighting device 26 Organic EL lighting element 28 Sealing layer 30 Sealing base material

Claims (11)

It has a support and inorganic layers and organic layers alternately laminated on one surface side of the support.
Among the inorganic layers and the organic layers which have one or more layers of the inorganic layer and one or more layers of the organic layer and are alternately laminated, the organic layer is the most separated from the support. ,
A gas barrier laminate characterized in that the organic layer most distant from the support has a smaller area than the inorganic layer most distant from the support. The gas barrier according to claim 1, wherein the organic layer most distant from the support is included in the inorganic layer most distant from the support when viewed from a direction orthogonal to the main surface of the support. Laminated body. The gas barrier laminate according to claim 1 or 2, further comprising one or more sets of a combination of the inorganic layer and the organic layer serving as a base for the inorganic layer. The gas barrier laminate according to any one of claims 1 to 3, which has two or more inorganic layers. The gas barrier laminate according to any one of claims 1 to 4, wherein the support is a resin film. Any of claims 1 to 5, wherein in at least a part, the distance between the end face of the organic layer most distant from the support and the end face of the inorganic layer most distant from the support is 1 to 10 mm. The gas barrier laminate according to item 1. The gas barrier laminate according to any one of claims 1 to 6 and
An electronic element formed on the organic layer most distant from the support of the gas barrier laminate, and
A sealing base material for sealing the electronic element and
An electronic device comprising: a sealing base material and a sealing layer for adhering the gas barrier laminate. The electronic device according to claim 7, wherein the sealing layer has a height of 1 to 500 μm. The electronic device according to claim 7 or 8, wherein the sealing base material is the gas barrier laminate according to any one of claims 1 to 6. The electronic device according to any one of claims 7 to 9, which is an organic electroluminescence device or a solar cell device. The electronic device according to claim 10, which is an organic electroluminescence lighting device.